Assembly method

Abstract

To facilitate an electric connection between a connector and a substrate.SOLUTION: An assembling method of an assembly contains: a mounting step of mounting an inner metal fitting (8) contacted to a center electrode (5d) and an outer metal fitting (9) contacted to a side electrode (5e) to a mounting surface (41a) of a substrate (41); and an assembling step of assembling a mounting substrate (4) to a chassis (3) to which a receptacle (5) is attached. In the assembling step, an elastic deformation part (84) is elastically deformed by dropping the mounting substrate (4) from an upper direction of the chassis (3) so as to pass the center electrode (5d) to a position where the center electrode (5d) is nipped from a lower end of the elastic deformation part (84) of the inner metal fitting (8), and an elastic deformation part (94) is elastically deformed so as to pass the side part electrode (5e) to the position where the side part electrode (5e) is nipped from the lower end of the elastic deformation part (94).SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electrical connection between a connector and a board. [Background technology]

[0002] A connector (plug) is provided at the end of a cable having a signal line and a ground line. This plug is connected to a connector (receptacle) on the device side. The receptacle is attached to the housing or chassis of the device and has contact electrodes that are connected to the board. The contact electrodes include a signal electrode provided at the center of the receptacle to which the signal line is connected, and a ground electrode provided around the signal electrode to which the ground line is connected.

[0003] Patent Document 1 discloses a connection structure that connects a center electrode (signal electrode) of a connector provided in a housing to a substrate. In this connection structure, when the elastic electrode of the connection fitting is pressed against the center electrode, it elastically deforms to receive the center electrode, and then the elastic restoring force presses against the center electrode to maintain an electrical connection. In the conventional technology described above, the center electrode and the substrate are connected via the connection fitting, eliminating the need for soldering to connect the center electrode and the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-206025 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned conventional technology, the connection between the ground electrode and the board is not made via a connecting metal fitting, and soldering is required. This makes it time-consuming to connect the ground electrode and the board. This causes a problem that the efficiency of the work of connecting the connector and the board is low.

[0006] An object of one aspect of the present invention is to easily establish electrical connection between a connector and a board. [Means for solving the problem]

[0007] In order to solve the above problems, an assembly method according to one embodiment of the present invention includes a mounting step of producing a mounting board by mounting a first contact fitting that contacts a first electrode provided at the center of a connector and a second contact fitting that contacts a second electrode of the connector provided on both sides of the first electrode at a distance from the first electrode on a mounting surface of a board, and an assembling step of assembling the mounting board to a support member to which the connector is attached and which supports the mounting board, wherein the first contact fittings are disposed above the mounting surface and protrude toward the mounting board in a direction along the mounting surface, and are disposed on both sides of the first electrode. The second contact fitting has a first elastic deformation portion that clamps the second electrode from the side, the second contact fitting is located above the mounting surface and has a second elastic deformation portion that clamps the second electrode, which protrudes toward the mounting board in a direction along the mounting surface, from the outer surface side of the second electrode, and in the assembly process, by lowering the mounting board from above the support member, the first elastic deformation portion is elastically deformed so as to pass the first electrode from the lower end of the first elastic deformation portion to a position where it clamps the first electrode, and the second elastic deformation portion is elastically deformed so as to pass the second electrode from the lower end of the second elastic deformation portion to a position where it clamps the second electrode.

[0008] In addition, in order to solve the above-mentioned problems, an assembly according to one embodiment of the present invention comprises a mounting board on whose mounting surface a first contact fitting contacts a first electrode provided at the center of the connector, and a second contact fitting contacts a second electrode of the connector provided on both sides of the first electrode at a distance from the first electrode, and a support member to which the connector is attached and on which the mounting board is supported, wherein the first contact fitting is located above the mounting surface and has a first elastic deformation portion that clamps the first electrode from both sides thereof, the first electrode protruding toward the mounting board in a direction along the mounting surface, and the second contact fitting is located above the mounting surface and has a second elastic deformation portion that clamps the second electrode from the outer surface side of the second electrode, the second electrode protruding toward the mounting board in a direction along the mounting surface. Effect of the Invention

[0009] According to one aspect of the present invention, electrical connection between a connector and a board can be easily achieved. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view showing a configuration of a wireless device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view of an assembly of the radio device. [Diagram 3] 10 is a plan view showing a configuration of an inner metal fitting mounted on a mounting board of the assembly. FIG. [Figure 4] FIG. 4 is a front view showing a configuration of the inner fitting. [Diagram 5] FIG. 4 is a side view showing a configuration of the inner fitting. [Figure 6] 4 is a plan view showing a configuration of an outer metal fitting mounted on the mounting board. FIG. [Figure 7] FIG. 4 is a front view showing a configuration of the outer metal fitting. [Figure 8] FIG. 4 is a side view showing a configuration of the outer metal fitting. [Figure 9] 1 is a diagram showing the configuration of the periphery of a receptacle as viewed from the bottom side of the mounting board. FIG. [Figure 10]FIG. 4 is an enlarged perspective view showing a portion of the assembly in a state where the inner metal fitting is in contact with a center electrode of the receptacle. [Figure 11] FIG. 2 is an enlarged perspective view of a portion of the assembly with the outer fitting in contact with a side electrode of the receptacle; [Figure 12] FIG. 12 is a cross-sectional perspective view taken along line AA in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [Embodiment] Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS.

[0012] Radio Configuration Fig. 1 is a perspective view showing the configuration of a wireless device 1 according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of an assembly 10 in the wireless device 1.

[0013] As shown in Figures 1 and 2, a wireless device 1 (electronic device) comprises a housing 2, a chassis 3 (support member), a mounting board 4, a receptacle 5 (connector), a screw 6, a nut 7, an inner fitting 8 (first contact fitting), and an outer fitting 9 (second contact fitting).

[0014] The housing 2 is formed in a box shape from metal, resin, etc. The chassis 3 and the mounting board 4 are built into the housing 2.

[0015] The chassis 3 is formed by a molding method such as bending a metal plate, die casting, or resin molding, and has a support portion 3a and a rising portion 3b. The support portion 3a is formed in a flat plate shape so as to support the mounting board 4. The rising portion 3b is formed in a long and narrow rectangle so as to rise vertically from the support portion 3a, and is disposed along one side surface of the housing 2. A receptacle 5 is attached near one end of the rising portion 3b. A plurality of screw holes 3c are formed in the support portion 3a.

[0016] The mounting board 4 is formed by mounting various electronic components (not shown), including an inner metal fitting 8 and an outer metal fitting 9, on a mounting surface 41a of a board 41. The inner metal fitting 8 and the outer metal fitting 9 are disposed on an end of the board 41 close to the position of the receptacle 5.

[0017] The board 41 has various wiring patterns, such as a signal pattern, a ground pattern, and a power supply pattern, formed on a mounting surface 41a. The board 41 has a plurality of screw holes 41b. The screw holes 41b are formed at positions corresponding to the screw holes 3c of the chassis 3 so as to penetrate from the mounting surface 41a to the opposite surface. The mounting board 4 is attached to the chassis 3 by fastening the screws 11 passed through the screw holes 41b into the screw holes 3c of the support portion 3a.

[0018] An insulating spacer (not shown) is provided around the screw hole 3c between the rear surface of the mounting board 4 and the front surface of the support portion 3a. This provides a certain distance between the mounting board 4 and the chassis 3, ensuring electrical insulation between the mounting board 4 and the chassis 3.

[0019] The receptacle 5 is provided to connect a cable connected to an antenna to the wireless device 1. The receptacle 5 has a flange 5a, an inner contact 5b, an outer contact 5c, a center electrode 5d (first electrode), and a pair of side electrodes 5e (second electrodes). Connectors that can be used as the receptacle 5 include a BNC (Bayonet Neill Concelman) connector, an F-type connector, and an RCA connector.

[0020] The inner contact 5b and the outer contact 5c are provided on one side of the flange 5a. The center electrode 5d and the side electrode 5e are provided on the other side of the flange 5a. The flange 5a, together with the inner contact 5b and the outer contact 5c, is disposed on the surface of the rising portion 3b facing the housing 2. The flange 5a is fixed to the rising portion 3b by two sets of screws 6 and nuts 7.

[0021] The inner contact 5b is a female contact for signal transmission into which a pin of a plug provided at the end of the cable is inserted. The outer contact 5c is a grounding contact formed in an annular shape so that the outer ring of the plug can be fitted. The inner contact 5b and a part of the outer contact 5c are exposed from the housing 2 so as to be connectable to the plug.

[0022] The portion of receptacle 5 that is placed on mounting board 4 has circular portion 5f that forms a circle. Receptacle 5 is placed so that circular portion 5f appears on the mounting board 4 side through a through hole (not shown) provided in rising portion 3b.

[0023] The center electrode 5d is disposed at the center of the circular portion 5f. The center electrode 5d is located above the mounting surface 41a of the substrate 41 and is provided so as to protrude toward the mounting substrate 4 in the direction along the mounting surface 41a (see FIG. 10). The center electrode 5d is cylindrical from the base to the middle, but is semi-cylindrical in shape with only the upper side cut out from the middle to the tip. The center electrode 5d is electrically connected to the inner contact 5b inside the receptacle 5.

[0024] The shape of the center electrode 5d is not limited to the above-mentioned shape. For example, the center electrode 5d may be formed in a pin shape.

[0025] The side electrodes 5e are disposed on both sides of the center electrode 5d, one on each side of the outer periphery of the circular portion 5f spaced from the center electrode 5d. The side electrodes 5e are located above the mounting surface 41a of the substrate 41, and are provided so as to protrude toward the mounting substrate 4 in the direction along the mounting surface 41a, shorter than the center electrode 5d (see FIG. 10). The side electrodes 5e are formed in a shape that is divided into two from the middle to the tip. The outer surface of the side electrodes 5e is formed to be continuous with the outer periphery of the circular portion 5f. The side electrodes 5e are electrically connected to the outer contacts 5c inside the receptacle 5.

[0026] The shape of the side electrodes 5e is not limited to the above-mentioned shape. As long as the side electrodes 5e are disposed at least on both sides of the center electrode 5d with a gap therebetween, the side electrodes 5e may be formed over a larger area, or may be formed as a single continuous annular structure.

[0027] <Configuration of inner and outer electrodes> Fig. 3 is a plan view showing the configuration of the inner fitting 8. Fig. 4 is a front view showing the configuration of the inner fitting 8. Fig. 5 is a side view showing the configuration of the inner fitting 8. Fig. 6 is a plan view showing the configuration of the outer fitting 9. Fig. 7 is a front view showing the configuration of the outer fitting 9. Fig. 8 is a side view showing the configuration of the outer fitting 9.

[0028] 3 to 5, the inner metal fitting 8 has a main body portion 81, a pair of mounting portions 82, a pair of insertion portions 83, a pair of elastic deformation portions 84 (first elastic deformation portions), and a pair of movable portions 85. The inner metal fitting 8 is formed by bending a metal sheet made of a conductive metallic material.

[0029] The main body 81 has an upper surface 81a and a pair of side surfaces 81b. The upper surface 81a is located at the topmost position of the inner metal fitting 8, and has a long and narrow rectangular shape. The side surfaces 81b hang down from both ends of the longer sides by about one third of the height of the upper surface 81a, and are formed so as to hang down from one end to almost the center, further to the lower end (mounting surface 41a) (full hanging portion).

[0030] The mounting portion 82 is a plate piece provided to be soldered to the mounting surface 41a. The mounting portion 82 is provided at the end of the upper surface portion 81a in the longitudinal direction at the lower end of the entire hanging portion of the side surface portion 81b. The mounting portions 82 are formed so as to be perpendicular to the surface of the side surface portion 81b and extend in directions away from each other. The pair of mounting portions 82 are formed so as to have bottom surfaces that are included in the same plane. This allows the mounting portions 82 to face parallel to the mounting surface 41a.

[0031] The plug-in portion 83 is a portion used for positioning on the board 41, and is soldered to the mounting surface 41a in the same manner as the mounting portion 82. The plug-in portion 83 is provided at a position spaced apart from the mounting portion 82 at the lower end of the entire hanging portion of the side portion 81b. The plug-in portion 83 is also an insertion terminal that is inserted into the board 41. For this reason, the plug-in portion 83 is formed so as to extend further downward than the lower end of the side portion 81b.

[0032] The elastic deformation portion 84 is provided at the end of the side surface portion 81b opposite to the end where the mounting portion 82 is provided. The elastic deformation portion 84 is formed so as to bulge from the lower end of the side surface portion 81b toward the outer surface side of the side surface portion 81b. Specifically, as shown in FIG. 4, the pair of elastic deformation portions 84 are formed so that the shape of the inner surface as seen from the end side of the upper surface portion 81a forms an arc of the same circle. The diameter D1 of the circle is slightly smaller than the diameter D2 of the outer circumferential surface of the cylindrical portion (cylindrical portion) of the center electrode 5d. As a result, the pair of elastic deformation portions 84 apply a pressing force toward the center to the center electrode 5d by elastically deforming, and sandwich the center electrode 5d (cylindrical portion) from both sides of the center electrode 5d.

[0033] The movable part 85 is provided at the lower end of the elastic deformation part 84. The movable part 85 is provided so as to extend in the same direction as the mounting part 82 when the center electrode 5d is not sandwiched between the elastic deformation part 84. As described later, in an assembly process for assembling the mounting board 4 to the chassis 3, when the center electrode 5d moves inside the inner metal fitting 8, the movable part 85 moves so as to be pushed out by the center electrode 5d. The boundary between the elastic deformation part 84 and the movable part 85 is formed in a curved shape. The movable part 85 also has the function of holding the inner metal fitting 8 so that it is mounted horizontally and stably on the board 41 in a mounting process described later.

[0034] 6 to 8, the outer metal fitting 9 has a main body portion 91, a pair of mounting portions 92, a pair of insertion portions 93, and a pair of elastic deformation portions 94 (second elastic deformation portions). The outer metal fitting 9 is formed by bending a metal sheet made of a conductive metallic material.

[0035] The main body 91 has an upper surface 91a, a pair of side surfaces 91b, and a facing portion 91c. The upper surface 91a is located at the top of the outer metal fitting 9 and has a rectangular portion having a substantially square shape and protruding portions that are wider than the rectangular portion and protrude from both sides of the rectangular portion. The side surfaces 91b are formed so as to hang down from both ends of the rectangular portion to the lower end (mounting surface 41a) of the outer metal fitting 9. The facing portion 91c is formed so as to hang down from the side end of the rectangular portion that faces the protruding portions to the lower end of the outer metal fitting 9. The facing portion 91c is provided so as to face the receptacle 5.

[0036] The body 91 has a rectangular top surface 91a, a pair of side surfaces 91b, and a facing portion 91c that define a box-shaped covering portion 91d. The covering portion 91d is sized to cover the inner metal fitting 8.

[0037] The mounting portion 92 is a plate piece provided to be soldered to the mounting surface 41a. The mounting portion 92 is provided at both ends at the lower end of the facing portion 91c. The mounting portion 92 is formed so as to be perpendicular to the surface of the facing portion 91c and extend in a direction away from the protruding portion of the upper surface portion 91a. The pair of mounting portions 92 are formed so as to have bottom surfaces that are included in the same plane. This allows the mounting portions 92 to face parallel to the mounting surface 41a.

[0038] The plug-in portion 93 is a portion used for positioning on the board 41, and is soldered to the mounting surface 41a, like the mounting portion 92. The plug-in portion 93 is provided at the end of the lower end of the side surface portion 91b on the protruding portion side of the upper surface portion 91a. The plug-in portion 93 is an insertion terminal that is inserted into the board 41. For this reason, the plug-in portion 93 is formed so as to extend further downward than the lower end of the side surface portion 91b.

[0039] The elastic deformation parts 94 are formed in a bent shape such that the ends face inward as they move downward from the ends of the overhanging parts of the upper surface part 91a, and then face outward. When the elastic deformation parts 94 are elastically deformed in a direction in which the width of the pair of elastic deformation parts 94 increases, the elastic deformation parts 94 generate an elastic restoring force in the opposite direction. A distance D3 between the portions where the pair of elastic deformation parts 94 sandwich the pair of side electrodes 5e is shorter than a distance D4 between the outer surfaces of the pair of side electrodes 5e. As a result, the pair of elastic deformation parts 94 apply a pressing force toward the center to the pair of side electrodes 5e by elastically deforming, thereby sandwiching the side electrodes 5e from the outer surfaces of the side electrodes 5e.

[0040] <Assembly of the assembly> The assembly (assembly method) of the assembly 10 will be described. Fig. 9 is a diagram showing the configuration around the receptacle 5 as viewed from the bottom side of the mounting board 4. Fig. 10 is an enlarged perspective view of a portion of the assembly 10 in a state where the inner metal fitting 8 is in contact with the center electrode 5d of the receptacle 5. Fig. 11 is an enlarged perspective view of a portion of the assembly 10 in a state where the outer metal fitting 9 is in contact with the side electrode 5e of the receptacle 5. Fig. 12 is a cross-sectional perspective view taken along line AA in Fig. 11. For convenience, the outer metal fitting 9 is not shown in Fig. 10.

[0041] First, the inner metal fitting 8 and the outer metal fitting 9 are mounted on the board 41 (mounting process). In the mounting process, the inner metal fitting 8, the outer metal fitting 9, and other electronic components are placed on the mounting surface 41a of the board 41 by a mounter (mounting machine).

[0042] Next, the board 41 on which the inner metal fitting 8, the outer metal fitting 9, etc. are arranged is heated in a reflow furnace to melt the cream solder pre-printed on the board 41, thereby soldering the inner metal fitting 8, the outer metal fitting 9, etc. to the board 41. In this manner, the mounting board 4 is produced.

[0043] The inner metal fitting 8 and the outer metal fitting 9 may be mounted by manual soldering instead of using a reflow furnace.

[0044] Next, the mounting board 4 is assembled to the chassis 3 (assembly process). In the assembly process, the mounting board 4 is attached to an assembly device, and the mounting board 4 is lowered from above toward the chassis 3 installed below, as shown in FIG.

[0045] As described above, the center electrode 5d and the side electrode 5e of the receptacle 5 protrude toward the mounting board 4 in the direction along the mounting surface 41a. In contrast, as shown in Fig. 9, the substrate 41 of the mounting board 4 has a notch 41c in an area near the center electrode 5d and a notch 41d in an area near the side electrode 5e. When the mounting board 4 is lowered, the center electrode 5d and the side electrode 5e pass through the notches 41c and 41d, respectively.

[0046] As the mounting board 4 descends, the inner metal fitting 8 eventually comes into contact with the center electrode 5d as shown in Fig. 4, and the outer metal fitting 9 reaches a position where it comes into contact with the side electrode 5e as shown in Fig. 7. As the mounting board 4 descends further from this state, the center electrode 5d pushes apart the boundary between the elastic deformation portion 84 and the movable portion 85, while the side electrode 5e pushes apart the lower end of the elastic deformation portion 94. Then, when the mounting board 4 descends to a predetermined mounting position on the chassis 3, the center electrode 5d passes over the boundary between the elastic deformation portion 84 and the movable portion 85 and fits between the elastic deformation portion 94, while the side electrode 5e is sandwiched at a position slightly above the bent portion of the elastic deformation portion 94.

[0047] Thus, in the assembly process, as the mounting board 4 descends, the elastic deformation portion 84 is elastically deformed so that the center electrode 5d passes from the lower end of the elastic deformation portion 84 to a position where the center electrode 5d is sandwiched between the elastic deformation portion 84 and the movable portion 85. During this process, as shown in Fig. 4, the center electrode 5d pushes open the boundary portion between the elastic deformation portion 84 and the movable portion 85 at the lower end of the elastic deformation portion 84, and when it reaches the elastic deformation portion 84, it is sandwiched between the elastic deformation portion 84 by the elastic restoring force.

[0048] 10 and 12, when the mounting board 4 is lowered to a predetermined position on the chassis 3, the center electrode 5d is held in a state where it is sandwiched between the elastic deformation portion 84 of the inner metal fitting 8. In this way, electrical contact is obtained between the center electrode 5d and the inner metal fitting 8.

[0049] In the assembly process, the elastically deforming portion 94 is elastically deformed so that the side electrodes 5e pass from the lower ends of the elastically deforming portion 94 to a position where the pair of side electrodes 5e are sandwiched therebetween as the mounting substrate 4 descends. During this process, as shown in Fig. 7, the pair of side electrodes 5e come into contact with the widened lower ends of the elastically deforming portion 94, pushing the pair of elastically deforming portions 94 apart, and when they overcome the bent portions of the elastically deforming portion 94, they are sandwiched between the elastically deforming portions 94 by the elastic restoring force.

[0050] 11 and 12, when the mounting board 4 is lowered to a predetermined position on the chassis 3, the side electrode 5e is held in a state where it is sandwiched between the elastic deformation portion 94 of the outer metal fitting 9. In this way, electrical contact is obtained between the side electrode 5e and the outer metal fitting 9.

[0051] Then, the mounting board 4 is fixed to the chassis 3 with screws 11. This completes the assembly of the assembly 10.

[0052] <Effects of assembly method> Thus, according to the above assembly method, in the assembly step, the mounting board 4 is lowered to simultaneously sandwich the center electrode 5d between the elastic deformation portions 84 of the inner metal fitting 8 and sandwich the side electrode 5e between the elastic deformation portions 94 of the outer metal fitting 9. This allows electrical connection between the center electrode 5d and the mounting board 4 via the inner metal fitting 8 and electrical connection between the side electrode 5e and the mounting board 4 via the outer metal fitting 9 to be achieved with a simple operation. Therefore, the assembly step can be easily automated by the use of a robot or the like.

[0053] Furthermore, the central electrode 5d and the side electrodes 5e are not electrically connected to the mounting board 4 by soldering. This allows the mounting board 4 to be easily removed from the chassis 3.

[0054] 4, the lower ends of the elastically deforming portions 84 of the inner metal fitting 8 (the boundary between the elastically deforming portions 84 and the movable portion 85) are formed into a curved surface. This allows the width between the lower ends of the pair of elastically deforming portions 84 to be wider than the width of the pair of side surface portions 81b. Also, as shown in FIG. 7, the lower ends of the elastically deforming portions 84 of the outer metal fitting 9 are formed to spread outward.

[0055] As a result, while the mounting board 4 is descending, the mounting board 4 is guided to a specified position after the inner metal fitting 8 abuts against the center electrode 5d and the outer metal fitting 9 abuts against the side electrode 5e, and before they each reach their respective predetermined contact positions. As a result, even if the position of the mounting board 4 relative to the chassis 3 is slightly misaligned, this misalignment can be absorbed. Therefore, it is not necessary to accurately position the mounting board 4 relative to the chassis 3.

[0056] In addition, in the mounting process, the inner metal fitting 8 and the outer metal fitting 9 are mounted on the mounting surface 41a by reflow soldering. This eliminates the need for manual soldering when mounting the inner metal fitting 8 and the outer metal fitting 9 on the board 41. Therefore, the mounting process can be easily automated.

[0057] In the assembly process, when the mounting board 4 is lowered, the center electrode 5d and the side electrode 5e pass through the cutouts 41c and 41d, respectively. This makes it possible to prevent the lowering mounting board 4 from coming into contact with the center electrode 5d and the side electrode 5e.

[0058] As described above, if the assembly of the assembly 10 can be easily automated, it becomes possible to omit the assembly work by humans. This can promote sustainable industrialization. Therefore, the assembly method according to the present embodiment can contribute to the achievement of the Sustainable Development Goals (SDGs).

[0059] Effect of the assembly An inner metal fitting 8 and an outer metal fitting 9 are mounted on the mounting board 4 that constitutes the assembly 10. The inner metal fitting 8 is located above the mounting surface 41a of the board 41, and has elastic deformation portions 84 that sandwich the center electrode 5d, which protrudes toward the mounting board 4 in the direction along the mounting surface 41a, from both sides of the center electrode 5d. The outer metal fitting 9 is located above the mounting surface 41a, and has elastic deformation portions 94 that sandwich the side electrode 5e, which protrudes toward the mounting board 4 in the direction along the mounting surface 41a, from the outer surface sides of the side electrode 5e.

[0060] This provides a structure in which, when the mounting board 4 is attached to the chassis 3, the mounting board 4 is lowered so that the center electrode 5d is sandwiched between the elastic deformation portions 84 and the side electrode 5e is sandwiched between the elastic deformation portions 94. Therefore, the electrical connection between the center electrode 5d and the mounting board 4 via the inner metal fitting 8 and the electrical connection between the side electrode 5e and the mounting board 4 via the outer metal fitting 9 can be achieved with a simple operation.

[0061] Furthermore, the outer metal fitting 9 has a covering portion 91d that covers the inner metal fitting 8. This makes it possible to shield the center electrode 5d, thereby reducing degradation of signal quality due to external noise and the like.

[0062] Furthermore, elastic deformation portion 84 of inner metal fitting 8 is disposed on the receptacle 5 side. Inner metal fitting 8 is provided at a position farther away from receptacle 5 than elastic deformation portion 84 is, and has top surface portion 81a, side surface portions 81b hanging down from both side ends of top surface portion 81a to mounting surface 41a, and mounting portion 82 mounted on mounting surface 41a at a position farthest from receptacle 5.

[0063] When the mounting board 4 is attached to the chassis 3, as the center electrode 5d passes from the lower end of the elastically deforming portion 84 to the position where the center electrode 5d is sandwiched, an upward stress acts on the elastically deforming portion 84 that contacts the center electrode 5d while elastically deforming. In response to this, the upper surface portion 81a and the side surface portion 81b of the inner metal fitting 8 form a highly rigid box-shaped structure. This highly rigid structure can prevent the inner metal fitting 8 from warping upward due to the above-mentioned stress.

[0064] In this embodiment, the wireless device 1 has been described as an electronic device. However, the electronic device according to the present invention is not limited to the wireless device 1 as long as it includes the above-described assembly 10. Examples of such electronic devices include AV devices and analyzers.

[0065] 〔summary〕 An assembly method according to a first aspect of the present invention includes a mounting step of preparing a mounting board by mounting a first contact fitting, which contacts a first electrode provided at the center of the connector, and a second contact fitting, which contacts a second electrode of the connector, provided on both sides of the first electrode and spaced from the first electrode, on a mounting surface of a board, and an assembly step of assembling the mounting board to a support member to which the connector is attached and which supports the mounting board, wherein the first contact fittings are positioned above the mounting surface and clamp the first electrode, which protrudes towards the mounting board in a direction along the mounting surface, from both sides of the first electrode. the second contact fitting has a first elastic deformation portion located above the mounting surface and sandwiching the second electrode, the second electrode protruding toward the mounting board in a direction along the mounting surface, from an outer surface side of the second electrode, and in the assembling process, by lowering the mounting board from above the support member, the first elastic deformation portion is elastically deformed so as to pass the first electrode from a lower end of the first elastic deformation portion to a position where it sandwiches the first electrode, and the second elastic deformation portion is elastically deformed so as to pass the second electrode from a lower end of the second elastic deformation portion to a position where it sandwiches the second electrode.

[0066] According to the above configuration, in the assembly process, the mounting board is lowered so that the first electrode is sandwiched between the first elastic deformation portion and the second electrode is sandwiched between the second elastic deformation portion, thereby making it possible to electrically connect the first electrode and the mounting board via the first contact fitting and electrically connect the second electrode and the mounting board via the second contact fitting with a simple operation.

[0067] In the assembly method according to aspect 2 of the present invention, in the assembling step of aspect 1, when the mounting board is lowered, the first electrode and the second electrode may be passed through a notch provided in the board.

[0068] According to the above configuration, the mounting board can be lowered to a position below the first electrode and the second electrode without the mounting board coming into contact with the first electrode and the second electrode.

[0069] In the assembly method according to a third aspect of the present invention, in the mounting step of the first or second aspect, the first contact fitting and the second contact fitting may be mounted on the mounting surface by reflow soldering.

[0070] With the above configuration, there is no need to perform manual soldering when mounting the first contact fittings and the second contact fittings on the board, which makes it easier to automate the assembly method.

[0071] An assembly according to a fourth aspect of the present invention comprises a mounting board on whose mounting surface a first contact fitting contacts a first electrode provided at the center of the connector, and a second contact fitting contacts a second electrode of the connector provided on both sides of the first electrode at a distance from the first electrode, and a support member to which the connector is attached and on which the mounting board is supported, wherein the first contact fitting is located above the mounting surface and has a first elastic deformation portion that clamps the first electrode from both sides thereof, the first electrode protruding toward the mounting board in a direction along the mounting surface, and the second contact fitting is located above the mounting surface and has a second elastic deformation portion that clamps the second electrode from the outer surface side of the second electrode, the second electrode protruding toward the mounting board in a direction along the mounting surface.

[0072] The above configuration provides a structure in which, when the mounting board is attached to the support member, the mounting board is lowered so that the first electrode is sandwiched between the first elastic deformation portion and the second electrode is sandwiched between the second elastic deformation portion. This makes it possible to electrically connect the first electrode and the mounting board via the first contact fitting and electrically connect the second electrode and the mounting board via the second contact fitting with a simple operation.

[0073] A fifth aspect of the present invention relates to an assembly in accordance with the fourth aspect, wherein the second contact fitting may have a covering portion that covers the first contact fitting.

[0074] According to the above configuration, the first electrode can be shielded, thereby reducing degradation of signal quality caused by external noise and the like.

[0075] The assembly of aspect 6 of the present invention may be, in aspect 4 or 5, such that the first elastic deformation portion is arranged on the connector side, the first contact fitting is provided at a position farther from the connector than the first elastic deformation portion, and has a top surface portion, side surfaces hanging down from both side ends of the top surface portion to the mounting surface, and a mounting portion mounted on the mounting surface at a position farthest from the connector.

[0076] In assembling the mounting board to the support member, when the first electrode passes from the lower end of the first elastic deformation portion to the position where the first electrode is sandwiched, an upward stress acts on the first elastic deformation portion that contacts the first electrode while elastically deforming. In contrast, with the above configuration, the first contact fitting has a highly rigid box-shaped structure formed by the top surface and the side surface. This highly rigid structure can prevent the first contact fitting from warping upward due to the above stress.

[0077] An electronic device according to a seventh aspect of the present invention includes the assembly according to any one of the fourth to sixth aspects.

[0078] According to the above configuration, the electronic device includes an assembly that can be assembled efficiently, and thus it is possible to provide electronic devices at lower manufacturing costs and at lower prices.

[0079] [Additional Notes] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. In addition, the present invention also includes embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. [Explanation of symbols]

[0080] 1 Radio equipment (electronic equipment) 3 Chassis (support member) 4 Mounting board 5 Receptacle (connector) 8 Inner metal fitting (first contact metal fitting) 9 Outer metal fitting (second contact metal fitting) 10 assembly 41 Substrate 41a Mounting surface 41c,41d Notch 51d Center electrode (1st electrode) 51e Side electrode (second electrode) 81a Top part 81b Side part 82 Mounting section 84 Elastic deformation portion (first elastic deformation portion) 91d Covering part 94 Elastic deformation portion (second elastic deformation portion)

Claims

1. a mounting process for manufacturing a mounting board by mounting a first contact metal fitting, which contacts a first electrode provided at the center of the connector, and a second contact metal fitting, which contacts a second electrode of the connector provided on both sides of the first electrode and spaced from the first electrode, on a mounting surface of a board; an assembling step of assembling the mounting board to a support member to which the connector is attached and which supports the mounting board, the first contact metal fitting is located above the mounting surface and has a first elastic deformation portion that sandwiches the first electrode from both sides thereof, the first electrode protruding toward the mounting board in a direction along the mounting surface; the second contact metal fitting is located above the mounting surface and has a second elastic deformation portion that sandwiches the second electrode, the second electrode protruding toward the mounting board in a direction along the mounting surface, from an outer surface side of the second electrode; In the assembling step, the mounting board is lowered from above the support member, the first elastic deformation portion is elastically deformed so as to pass the first electrode from a lower end of the first elastic deformation portion to a position where the first electrode is sandwiched; An assembly method, comprising: elastically deforming the second elastic deformation portion so as to pass the second electrode from a lower end of the second elastic deformation portion to a position where the second electrode is sandwiched.

2. 2. The method according to claim 1, wherein in the assembling step, when the mounting substrate is lowered, the first electrode and the second electrode are caused to pass through a notch provided in the substrate.

3. 3. The assembly method according to claim 1, wherein in the mounting step, the first contact metal fitting and the second contact metal fitting are mounted on the mounting surface by reflow soldering.

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