Energy-sensitive composition, cured product, and method for forming patterned cured product

Abstract

To provide an energy-sensitive composition which gives a patterned cured product having high hardness, a cured product of the energy-sensitive composition, and a method for forming a patterned cured product.SOLUTION: The energy-sensitive composition is used which contains a polysilane, a base generator and a solvent, the base generator containing a compound represented by formula (b1) and a photobase generator. (In the formula (b1), Rb1-Rb3 each represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group or an organic group; Rb4 and Rb5 each represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group or an aliphatic group; and Rb6 represents a hydrogen atom, an alkyl group or an alkoxy group.)SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an energy-sensitive composition, a cured product, and a method for forming a patterned cured product. [Background technology]

[0002] Polysilanes having silicon-silicon bonds are used in applications such as ceramic precursors, optoelectronic materials (for example, photoresists, optoelectronic photographic materials such as organic photoreceptors, optical transmission materials such as optical waveguides, optical recording materials such as optical memories, and materials for electroluminescence devices), interlayer insulating films and protective films in various devices, sealing materials for light-emitting devices such as LED devices and organic EL devices, coating films for diffusing impurities into semiconductor substrates, and gap fill materials for semiconductor processes.

[0003] Various compositions containing polysilane have been developed. For example, an energy-sensitive composition containing polysilane and a base generator has been developed (see Patent Document 1, etc.). In such an energy-sensitive composition, the polysilane is polymerized by the action of the base generated from the base generator, and a cured product is obtained. The cured product can be used as the above-mentioned material. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-194692 A Summary of the Invention [Problem to be solved by the invention]

[0005] When such an energy-sensitive composition is used to obtain a patterned cured product, a photobase generator is used as a base generator, and a coating film of the energy-sensitive composition is subjected to site-selective exposure and development. However, when a photobase generator is used, there is a problem that the hardness of the patterned cured product obtained is low.

[0006] In view of the above-mentioned problems in the conventional technology, the present invention aims to provide an energy-sensitive composition that gives a patterned cured product with high hardness, a cured product of the energy-sensitive composition, and a method for forming a patterned cured product. [Means for solving the problem]

[0007] The present inventors have found that the above problems can be solved by an energy-sensitive composition containing a polysilane (A) and a base generator (B), in which the base generator (B) contains a compound represented by the following formula (b1) and a photobase generator, and have completed the present invention. Specifically, the present invention provides the following:

[0008] A first aspect of the present invention includes a polysilane (A), a base generator (B), and a solvent (S), The base generator (B) is an energy-sensitive composition containing a compound represented by the following formula (b1) and a photobase generator. [ka] (In formula (b1), R b1 ~R b3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group; R b4 and R b5 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group, R b6 represents a hydrogen atom, an alkyl group, or an alkoxy group.

[0009] A second aspect of the present invention is a cured product of the energy-sensitive composition according to the first aspect.

[0010] A third aspect of the present invention is a method for producing a coating film by applying the energy-sensitive composition according to the first aspect onto a substrate; A step of position-selectively exposing the coating film; developing the coating film after exposure; and heating the coating film after development. Effect of the Invention

[0011] According to the present invention, it is possible to provide an energy-sensitive composition that gives a patterned cured product with high hardness. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The following describes in detail the embodiments of the present invention. However, the present invention is not limited to the following embodiments and can be implemented with appropriate modifications within the scope of the object of the present invention. In addition, in this specification, "~" means from above to below unless otherwise specified.

[0013] <Energy-sensitive composition> The energy-sensitive composition contains a polysilane (A) and a base generator (B). The base generator (B) contains a compound represented by the following formula (b1) and a photobase generator. The essential components and optional components contained in the energy-sensitive composition, as well as the production method and uses of the energy-sensitive composition, will be described below.

[0014] <Polysilane (A)> The structure of the polysilane (A) contained in the energy-sensitive composition is not particularly limited. The polysilane (A) may be linear, branched, network, or cyclic, but is preferably linear or branched. The polysilane (A) may contain a silanol group or an alkoxy group. Suitable examples of the polysilane (A) include polysilanes that essentially contain at least one of the units represented by the following formulae (a1) and (a2) and may contain at least one unit selected from the units represented by the following formulae (a3) ​​to (a5). Such polysilanes may contain silanol groups or alkoxy groups bonded to silicon atoms.

[0015] [ka] (In formulas (a1) to (a5), R a1 and R a2 R represents a hydrogen atom, an organic group, or a silyl group. a3 represents a hydrogen atom or an alkyl group.

[0016] R a3 When is an alkyl group, it is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group.

[0017] R a1 and R a2 Regarding the above, examples of the organic group include hydrocarbon groups such as an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an aralkyl group, as well as an alkoxy group, an alkenyloxy group, a cycloalkoxy group, a cycloalkenyloxy group, an aryloxy group, and an aralkyloxy group. Of these groups, alkyl groups, aryl groups, and aralkyl groups are preferred. The alkyl group is preferably a linear or branched alkyl group having 1 to 20 carbon atoms, and more preferably a linear or branched alkyl group having 1 to 4 carbon atoms. Suitable examples of the aryl group include the following groups. [ka]

[0018] In the above formula, R a4is a hydrogen atom; a hydroxyl group; an alkoxy group such as a methoxy group, an ethoxy group, a butoxy group, or a propoxy group; or a hydrocarbon group such as a methyl group, an ethyl group, a butyl group, or a propyl group. a5 is an alkylene group such as a methylene group, an ethylene group, a propylene group, or a butylene group.

[0019] Specific preferred examples of the aryl group or aralkyl group include a benzyl group, a phenethyl group, a phenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a biphenylyl group, a fluorenyl group, and a pyrenyl group.

[0020] R a1 and R a2 When is a silyl group, the silyl group is a Si group such as a silyl group, a disilanyl group, or a trisilanyl group. 1-10 Silanyl group (Si 1-6 Silanyl groups, etc. The polysilane preferably contains any one of the following units (a6) to (a9). [ka] (In formulas (a6) to (a9), R a1 and R a2 R in formulas (a1), (a3), and (a4) a1 and R a2 a, b, and c are each an integer between 2 and 1000. Each of a, b, and c is preferably from 3 to 500, and more preferably from 5 to 100. Each of the structural units may be contained randomly or in a blocked state.

[0021] Among the polysilanes described above, polysilanes containing a combination of an alkyl group and an aryl group or an aralkyl group, each of which is bonded to a silicon atom, or polysilanes in which only the alkyl group is bonded to a silicon atom are preferred. More specifically, polysilanes containing a combination of a methyl group and a benzyl group, each of which is bonded to a silicon atom, polysilanes containing a combination of a methyl group and a phenyl group, each of which is bonded to a silicon atom, or polysilanes in which only the methyl group is bonded to a silicon atom are preferably used.

[0022] The mass average molecular weight of the polysilane, calculated as polystyrene, is preferably from 300 to 100000, more preferably from 500 to 70000, and even more preferably from 800 to 30000. Two or more polysilanes having different mass average molecular weights may be mixed.

[0023] The content of polysilane (A) in the energy-sensitive composition is not particularly limited and may be set according to the desired film thickness. From the viewpoint of film-forming property, the content of polysilane (A) in the energy-sensitive composition is preferably 1% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 40% by mass or less, and particularly preferably 10% by mass or more and 35% by mass or less.

[0024] <Base generator (B)> The energy-sensitive composition contains a compound represented by the following formula (b1) as the base generator (B) and a photobase generator. The compound represented by the following formula (b1) is a compound that generates a base when heated, that is, the compound represented by the following formula (b1) is a thermal base generator. The photobase generator is a compound that generates a base by light. The photobase generator may be a compound that can generate a base by heating as long as it generates a base by light. In this specification, a compound that generates a base by light and also generates a base by heating is referred to as a photobase generator. The base generated by the photobase generator when exposed to light, and the base generated by the compound represented by the following formula (b1) when heated, promote the polymerization of the polysilane (A) to form a cured product.

[0025] In a method including a step of forming a coating film by coating, a step of exposing the coating film selectively at a position, a step of developing the coating film after exposure, and a step of heating the coating film after development, by using such an energy-sensitive composition as a material for forming a coating film, it is possible to form a patterned cured product having high hardness, as shown in the examples described later. The pencil hardness of the patterned cured product is, for example, 3H or more, and preferably 4H or more. Since a photobase generator is used, the composition is cured and patterned by exposure and development, and since the compound represented by formula (b1) is used, the composition is further cured by subsequent heating. The compound represented by formula (b1) has a maximum absorption wavelength (λ max ) is 280 nm or less, the curing by the photobase generator is not easily inhibited, and the composition can be cured by heating after exposure. Therefore, it is presumed that the use of the above-mentioned energy-sensitive composition makes it possible to form a patterned cured product with high hardness. On the other hand, when the energy-sensitive composition does not contain the compound represented by formula (b1), the hardness of the patterned cured product formed is low.

[0026] [Compound represented by formula (b1)] The energy-sensitive composition includes a compound represented by the following formula (b1): The compound represented by the formula (b1) can be decomposed by heat to generate an imidazole compound represented by the following formula (i), which is a base. [ka] (In formula (b1), R b1 ~R b3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group; R b4 and R b5 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group, R b6 represents a hydrogen atom, an alkyl group, or an alkoxy group. [ka] (In formula (i), R b1 ~R b3 is R in formula (b1). b1 ~R b3 is equivalent to

[0027] R b1 ~R b3 The organic group in the above may be an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, an aralkyl group, or the like. The organic group may contain a bond or a substituent other than the hydrocarbon group, such as a heteroatom, in the organic group. The organic group may be linear, branched, or cyclic. The organic group is usually monovalent, but may be a divalent or higher organic group when it forms a cyclic structure, or the like.

[0028] R b1 ~R b3 The bond contained in the organic group is not particularly limited as long as the effects of the present invention are not impaired, and the organic group may contain a bond containing a heteroatom such as an oxygen atom, a nitrogen atom, a silicon atom, etc. Specific examples of bonds containing a heteroatom include an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, an imino bond (-N=C(-R)-, -C(=NR)-: R represents a hydrogen atom or an organic group), a carbonate bond, a sulfonyl bond, a sulfinyl bond, an azo bond, etc.

[0029] R b1 ~R b3From the viewpoint of the heat resistance of the imidazole compound, the bond containing a hetero atom that the organic group may have is preferably an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, an imino bond (-N=C(-R)-, -C(=NR)-: R represents a hydrogen atom or a monovalent organic group), a carbonate bond, a sulfonyl bond, or a sulfinyl bond.

[0030] R b1 ~R b3 When the organic group in R is a substituent other than a hydrocarbon group, b1 ~R b3 There is no particular limitation as long as the effect of the present invention is not impaired. b1 ~R b3 Specific examples of the substituent include a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a cyano group, an isocyano group, a cyanato group, an isocyanato group, a thiocyanato group, an isothiocyanato group, a silyl group, a silanol group, an alkoxy group, an alkoxycarbonyl group, a carbamoyl group, a thiocarbamoyl group, a nitro group, a nitroso group, a carboxylate group, an acyl group, an acyloxy group, a sulfino group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, an alkyl ether group, an alkenyl ether group, an alkyl thioether group, an alkenyl thioether group, an aryl ether group, and an aryl thioether group. The hydrogen atom contained in the above substituent may be substituted with a hydrocarbon group. The hydrocarbon group contained in the above substituent may be linear, branched, or cyclic.

[0031] R b1 ~R b3 As the alkyl group, a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, and a halogen atom are preferable, and a hydrogen atom is more preferable.

[0032] In formula (b1), R b4 and R b5each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group.

[0033] R b4 and R b5 Examples of the aliphatic group in include an alkyl group, an alkenyl group, a cycloalkyl group, and a cycloalkenyl group. The aliphatic group may contain a heteroatom such as an oxygen atom, a nitrogen atom, or a silicon atom. The organic group may be linear, branched, or cyclic.

[0034] Among the above, R b4 and R b5 are each preferably independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 13 carbon atoms, or a cycloalkenyl group having 4 to 13 carbon atoms. More preferably, R b4 and R b5 are both hydrogen atoms, or R b4 is a methyl group, and R b5 is a hydrogen atom.

[0035] In formula (b1), R b6 R represents a hydrogen atom, an alkyl group, or an alkoxy group. b6 R does not have an aromatic group. b6 is preferably a hydrogen atom, an alkyl group having from 1 to 10 carbon atoms, or an alkoxy group having from 1 to 10 carbon atoms, more preferably a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a methoxy group, an ethoxy group, a propoxy group, or a butoxy group.

[0036] Among the compounds represented by the above formula (b1), the compound represented by the following formula (b1-1) is preferred. [ka] (In formula (b1-1), Rb1 ~R b3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group; R b4 represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group, R b7 represents an alkyl group having 2 to 4 carbon atoms.

[0037] The compound represented by formula (b1-1) is a compound represented by the following substituent: -OR b7 Since the compound represented by formula (b1-1) has excellent solubility in organic solvents, the compound represented by formula (b1-1) is a novel compound.

[0038] R in formula (b1-1) b1 ~R b4 is R in formula (b1). b1 ~R b4 is the same as:

[0039] Specific examples of the compound represented by formula (b1) are shown below. [ka]

[0040] The compound represented by formula (b1) can be produced by reacting a chloride represented by the following formula (ii) with an imidazole compound represented by the following formula (iii). [ka]

[0041] The energy-sensitive composition may contain one or more compounds represented by formula (b1).

[0042] The content of the compound represented by formula (b1) in the energy-sensitive composition is preferably from 0.001% by mass to 10% by mass, more preferably from 0.005% by mass to 5% by mass, and even more preferably from 0.01% by mass to 1.0% by mass. In addition, in the energy-sensitive composition, the mass of the compound represented by formula (b1) is preferably 0.01 parts by mass or more and 10 parts by mass or less, and more preferably 0.1 parts by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the polysilane (A).

[0043] [Photobase generator] The energy-sensitive composition includes a photobase generator. The photobase generator can be decomposed by light (e.g., by decarboxylation) to generate a base. The photobase generator may be an ionic compound or a nonionic compound.

[0044] An ionic compound consists of an anion moiety and a cation moiety. The anion portion of the ionic compound preferably contains at least one anion selected from the group consisting of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton. The cationic portion of the ionic compound preferably contains at least one cation selected from the group consisting of phosphazene compound cations and amidine compound cations.

[0045] An example of the photobase generator that is an ionic compound is a photobase generator represented by the following formula (b2). [ka] (In formula (b2), R b21 ~R b31 each independently represents a hydrogen atom, a halogen atom, a nitro group, an alkyl group, an aryl group, an arylalkyl group, or an alkoxy group; R b25 and R b26 may be linked to each other via a single bond or a divalent linking group, Z q+represents a q-valent counter cation composed of a base with a pKa of 24 or higher, q represents an integer of 1 or more.

[0046] In the compound represented by the above formula (b2), the anion moiety may also exist as an enol tautomer as shown in the following scheme. The compound represented by formula (b2) also includes a compound in which the anion moiety is the following enol tautomer. [ka]

[0047] In formula (b2), R b21 ~R b31 The halogen atom in the above formula (I) includes a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and a chlorine atom or a bromine atom is preferred. R b21 ~R b31The alkyl group according to the above may or may not have a substituent, may be linear, branched or cyclic, and may be an alkyl group having from 1 to 12 carbon atoms (preferably from 1 to 10 carbon atoms, more preferably from 1 to 6 carbon atoms), such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a cyclobutyl group, an n-pentyl group, an isopentyl group, a sec-pentyl group, a tert-pentyl group, a neopentyl group, a 2-methylbutyl group, a 1,2-dimethylpropyl group, a 1-ethylpropyl group, a cyclopentyl group, an n-hexyl group, an isohexyl group, a sec-hexyl group, a tert-hexyl group, a neohexyl group, a 2-methylpentyl group, a 1,2-dimethylbutyl group, a 2,3-dimethylbutyl group, a group, 1-ethylbutyl group, cyclohexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, neoheptyl group, cycloheptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, neooctyl group, 2-ethylhexyl group, cyclooctyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, neononyl group, Examples of such groups include a cyclononyl group, an n-decyl group, an isodecyl group, a sec-decyl group, a tert-decyl group, a neodecyl group, a cyclodecyl group, an n-undecyl group, a cycloundecyl group, an n-dodecyl group, a cyclododecyl group, a nonylbornyl group (norbornan-χ-yl group), a bornyl group (bornan-χ-yl group), a menthyl group (mentha-χ-yl group), an adamantyl group, and a decahydronaphthyl group.

[0048] Among the above-mentioned alkyl groups, linear, branched or cyclic alkyl groups having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, or a cyclobutyl group, are preferred, and among these, a methyl group, which is an alkyl group having 1 carbon atom, is more preferred.

[0049] R b21 ~R b31The aryl group in the above may be either monocyclic or condensed polycyclic, may or may not have a substituent, and may be an aryl group having 6 to 14 carbon atoms, such as a phenyl group, a naphthyl group, an anthracenyl group (anthryl group), a phenanthrenyl group (phenanthryl group), etc., of which, for example, an aryl group having 6 to 10 carbon atoms, such as a phenyl group or a naphthyl group, is preferred, and of these, a phenyl group, which is an aryl group having 6 carbon atoms, is more preferred.

[0050] R b21 ~R b31 The arylalkyl group according to the above may or may not have a substituent, may be either a monocyclic or a condensed polycyclic arylalkyl group having 7 to 15 carbon atoms, such as a benzyl group, a phenethyl group, a methylbenzyl group, a phenylpropyl group, a 1-methylphenylethyl group, a phenylbutyl group, a 2-methylphenylpropyl group, a tetrahydronaphthyl group, a naphthylmethyl group, a naphthylethyl group, an indenyl group, a fluorenyl group, an anthracenylmethyl group (anthrylmethyl group), a phenanthrenylmethyl group (phenanthrylmethyl group), and the like. Of these, a benzyl group, which is an arylalkyl group having 7 carbon atoms, is preferred.

[0051] R b21 ~R b31The alkoxy group according to the above may or may not have a substituent, may be linear, branched or cyclic, and may be an alkoxy group having from 1 to 12 carbon atoms (preferably from 1 to 6 carbon atoms, more preferably from 1 to 4 carbon atoms), and examples of such an alkoxy group include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a sec-butoxy group, a tert-butoxy group, a cyclobutoxy group, an n-pentyloxy group, an isopentyloxy group, a sec-pentyloxy group, a tert-pentyloxy group, a neopentyloxy group, a 2-methylbutoxy group, a 1,2-dimethylpropoxy group, a 1-ethylpropoxy group, a cyclopentyloxy group, an n-hexyloxy group, an isohexyloxy group, a sec-hexyloxy group, a tert-hexyloxy group, a neohexyloxy group, a 2-methylpentyloxy group, a 1,2-dimethylbutoxy group, a 2,3-dimethylbutoxy group, 1-ethylbutoxy group, cyclohexyloxy group, n-heptyloxy group, isoheptyloxy group, sec-heptyloxy group, tert-heptyloxy group, neoheptyloxy group, cycloheptyloxy group, n-octyloxy group, isooctyloxy group, sec-octyloxy group, tert-octyloxy group, neooctyloxy group, 2-ethylhexyloxy group, cyclooctyloxy group, n-nonyloxy group, isononyloxy group, sec-nonyloxy group, tert-nonyloxy group, neononyloxy group, cyclononyloxy group, n-decyloxy group, isodecyloxy group, sec-decyloxy group, tert-decyloxy group, neodecyloxy group, cyclodecyloxy group, Examples of alkoxy groups include norbornyloxy group, n-undecyloxy group, cycloundecyloxy group, n-dodecyloxy group, cyclododecyloxy group, norbornyloxy group (norbornan-χ-yloxy group), bornyloxy group (bornan-χ-yloxy group), menthyloxy group (mentha-χ-yloxy group), adamantyloxy group, and decahydronaphthyloxy group. Among these, preferred are linear, branched, or cyclic alkoxy groups having 1 to 4 carbon atoms, such as methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, tert-butoxy group, and cyclobutoxy group, and among these, more preferred is a methoxy group, which is an alkoxy group having 1 carbon atom.

[0052] R b25 and R b26 may be linked to each other via a single bond or a divalent linking group. The divalent linking group includes an alkylene group, an oxygen atom, or a sulfur atom, with an oxygen atom being preferred. The alkylene group may or may not have a substituent, and examples of the alkylene group include linear or branched alkylene groups having 1 to 4 carbon atoms, such as a methylene group, an ethylene group, and an isopropylene group.

[0053] R b21 ~R b30As the alkyl group, a hydrogen atom or an alkyl group having 1 to 12 carbon atoms is more preferable, and among these, a hydrogen atom is even more preferable. R b31 As the alkyl group, an alkyl group having 1 to 12 carbon atoms is more preferable, and among these, an alkyl group having 1 to 4 carbon atoms is even more preferable. Also, R b25 and R b26 are also preferably linked to each other via a divalent linking group. q is preferably an integer of 1 or more and 3 or less, more preferably an integer of 1 or 2, and even more preferably 1.

[0054] In addition, in the formula (b2), when the compound has an oxaxanthone skeleton, the compound has a structure represented by the following formula (b2-1), and when the compound has a ketoprofen skeleton, the compound has a structure represented by the following formula (b2-2). b25 and R b26 is not linked, and when it has a fluorenone skeleton, it is a structure represented by the following formula (b2-2). [ka] (In formula (b2-1), R b21 ~R b24 and R b27 ~R b31 , Z q+ , and q are R in formula (b2), b21 ~R b24 and R b27 ~R b31 , Z q+ , and q.) [ka] (In formula (b2-2), R b21 ~R b24 and R b27 ~R b31 , Z q+ , and q are R in formula (b2), b21 ~R b24 and R b27 ~R b31 , Z q+ , and q.)

[0055] In formula (b2), the q-valent counter cation Z q+ is composed of bases having a pKa value of 24 or more (pKa of the conjugate acid) or more, preferably 25 or more, more preferably 28 or more, and even more preferably 30 or more. The upper limit of the pKa is not particularly limited, but may be, for example, 50 or less, preferably 45 or less, more preferably 40 or less, and particularly preferably 35 or less.

[0056] Here, "pKa" refers to the pH of acetonitrile (CH 3 pKa in a CN) solvent is described, for example, in Chemical Handbook (II) (4th revised edition, 1993, edited by the Chemical Society of Japan, Maruzen Co., Ltd.), and the lower this value, the greater the acid strength. 3 The pKa in CN can also be calculated based on a database of Hammett's substituent constants and known literature values ​​(J. Org. Chem. 2016, 81, 7349-7361).

[0057] q-valent counter cation Z q+ The base having a pKa of 24 or more constituting the compound is not particularly limited as long as it has a pKa of 24 or more, and examples of the base include organic bases and inorganic bases, with organic bases being preferred.

[0058] The base having a pKa of 24 or more preferably contains at least one base selected from the group consisting of phosphazene compounds and amidine compounds from the viewpoints of basicity and nucleophilicity to silicon atoms. That is, the q-valent counter cation Z q+ It is preferred that the compound contains at least one cation selected from the group consisting of phosphazene compound cations and amidine compound cations.

[0059] (Phosphazene Compounds) Here, the term "phosphazene compound" refers to an organic compound having a -P=N- bond in the molecule. The number of -P=N- bonds in the above phosphazene compound is not particularly limited as long as the pKa is 24 or more, but may be 1 to 10, preferably 1 to 6, more preferably 1 to 5, even more preferably 2 to 4, particularly preferably 2 or 3, and most preferably 2. The phosphazene compound is preferably a compound represented by the following formula (bc-1) or a compound in which at least two structures represented by the following formula (bc-1) are linked to each other, and more preferably a compound in which at least two structures represented by the following formula (bc-1) are linked to each other. [ka] (In the above formula (bc-1), R bc1 ~R bc7 each independently represents hydrogen or a monovalent organic group which may contain a heteroatom; R bc1 ~R bc7 At least two of may be bonded to each other to form a ring.) R bc1 ~R bc7 The monovalent organic group which may contain a heteroatom preferably has 1 to 20 carbon atoms, more preferably has 1 to 10 carbon atoms, and further preferably has 1 to 6 carbon atoms. The organic group includes an alkyl group, an arylalkyl group, and the like, which may contain a heteroatom. The alkyl group which may contain a heteroatom may be linear, branched or cyclic and includes an alkyl group having from 1 to 12 carbon atoms (preferably from 1 to 10 carbon atoms, more preferably from 1 to 6 carbon atoms), such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a cyclobutyl group, an n-pentyl group, an isopentyl group, a sec-pentyl group, a tert-pentyl group, a neopentyl group, a 2-methylbutyl group, a 1,2-dimethylpropyl group, a 1-ethylpropyl group, a cyclopentyl group, an n-hexyl group, an isohexyl group, a sec-hexyl group, a tert-hexyl group, a neohexyl group, a 2-methylpentyl group, a 1,2-dimethylbutyl group, a 2,3-dimethylbutyl group, a 1 -Ethylbutyl, cyclohexyl, n-heptyl, isoheptyl, sec-heptyl, tert-heptyl, neoheptyl, cycloheptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, neooctyl, 2-ethylhexyl, cyclooctyl, n-nonyl, isononyl, sec-nonyl, tert-nonyl, neononyl , cyclononyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, neodecyl group, cyclodecyl group, n-undecyl group, cycloundecyl group, n-dodecyl group, cyclododecyl group, nonylbornyl group (norbornan-χ-yl group), bornyl group (bornan-χ-yl group), menthyl group (mentha-χ-yl group), adamantyl group, decahydronaphthyl group, and the like.

[0060] Among the above-mentioned alkyl groups, linear, branched or cyclic alkyl groups having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, or a cyclobutyl group, are preferred.

[0061] Examples of the arylalkyl group which may contain a heteroatom include an arylalkyl group having 7 to 15 carbon atoms, such as a benzyl group, a phenethyl group, a methylbenzyl group, a phenylpropyl group, a 1-methylphenylethyl group, a phenylbutyl group, a 2-methylphenylpropyl group, a tetrahydronaphthyl group, a naphthylmethyl group, a naphthylethyl group, an indenyl group, a fluorenyl group, an anthracenylmethyl group (anthrylmethyl group), and a phenanthrenylmethyl group (phenanthrylmethyl group). Of these, a benzyl group, which is an arylalkyl group having 7 carbon atoms, is preferred.

[0062] R bc1 ~R bc7 Examples of heteroatoms that the monovalent organic group may have include a nitrogen atom, an oxygen atom, a phosphorus atom, or a sulfur atom, which are preferably bonded to a carbon atom and preferably do not constitute an acid functional group such as a carboxyl group or a sulfone group. R bc7 is preferably not a hydrogen atom. R bc1 ~R bc7 The ring which can be formed by at least two of the above groups is a five-membered ring, a six-membered ring or a seven-membered ring, and preferably a six-membered ring.

[0063] As the compound in which at least two structures represented by the above formula (bc-1) are linked to each other, a compound in which 2 to 6 structures represented by the above formula (bc-1) are linked to each other is preferable, a compound in which 2 to 4 structures represented by the above formula (bc-1) are linked to each other is more preferable, and a compound in which 2 or 3 structures represented by the above formula (bc-1) are linked to each other is even more preferable. As an embodiment in which at least two of the structures represented by the above formula (bc-1) are linked to each other, a certain structure represented by the above formula (bc-1) and another structure represented by the above formula (bc-1) are preferably linked so as to share one nitrogen atom in the above formula (bc-1). The molecular weight (Mw) of the phosphazene compound is, for example, from 120 to 900, and from the viewpoint of curability or residual film properties, is preferably from 250 to 600, and more preferably from 300 to 500.

[0064] Preferable specific examples of the phosphazene compound are shown below, but the invention is not limited to these. [ka] [ka] [ka] [ka]

[0065] (Amidine compounds) The amidine compound is preferably a compound represented by the following formula (bc-2): [ka] (In the above formula (bc-2), R bc11 ~R bc14 each independently represents hydrogen or a monovalent organic group which may contain a heteroatom; R bc11 ~R bc14 At least one of R represents a monovalent organic group which may contain a heteroatom; bc11 ~R bc14 At least two of may be bonded to each other to form a ring.) R bc11 ~R bc14 Specific and preferred examples of the monovalent organic group which may contain a heteroatom are R bc1 ~R bc7 Examples of the monovalent organic group which may contain a heteroatom include the same as those mentioned above. R bc11 ~R bc14Examples of heteroatoms that the monovalent organic group may have include a nitrogen atom, an oxygen atom, a phosphorus atom, or a sulfur atom, which are preferably bonded to a carbon atom and preferably do not constitute an acid functional group such as a carboxyl group or a sulfone group. R bc14 is preferably not a hydrogen atom. R bc11 ~R bc14 Examples of the ring that can be formed by at least two of the above include a five-membered ring, a six-membered ring, or a seven-membered ring, and preferably a six-membered ring or a seven-membered ring. Amidines containing at least one ring structure (i.e., cyclic amidines) are preferred. Cyclic amidines containing two ring structures (i.e., bicyclic amidines) are more preferred. The amidine compound is more preferably a compound represented by the following formula:

[0066] [ka] (In the above formula, r represents an integer of 1 or more and 3 or less.)

[0067] Specific examples of the amidine compound include 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine, 1-ethyl-2-methyl-1,4,5,6-tetrahydropyrimidine, 1,2-diethyl-1,4,5,6-tetrahydropyrimidine, 1-n-propyl-2-methyl-1,4,5,6-tetrahydropyrimidine, 1-isopropyl-2-methyl-1,4,5,6-tetrahydropyrimidine, 1-ethyl-2-n-propyl-1 ,4,5,6-tetrahydropyrimidine, 1-ethyl-2-isopropyl-1,4,5,6-tetrahydropyrimidine, DBU (i.e., 1,8-diazabicyclo[5.4.0]-7-undecene), DBN (i.e., 1,5-diazabicyclo[4.3.0]-5-nonene), TBD (i.e., 1,5,7-triazabicyclo[4,4,0]dec-5-ene) and the like, and combinations thereof.

[0068] The compound represented by formula (b2) can be produced by mixing and reacting (for example, neutralization reaction) an acid represented by the following formula with the above-mentioned base having a pKa of 24 or more under any conditions. [ka] (In the formula, R b21 ~R b31 are R in formula (b2), b21 ~R b31 is equivalent to

[0069] As described above, the photobase generator is composed of a cationic moiety and an anionic moiety, and the molar ratio of the cationic moiety to the anionic moiety is, for example, in the range of 1:1 to 1:2, and preferably 1:1 to 1:1.5.

[0070] The energy-sensitive composition may contain one or more photobase generators.

[0071] The ratio of the mass of the compound represented by formula (b1) to the total mass of the compound represented by formula (b1) and the photobase generator is preferably 1 mass% or more and 30 mass% or less, and more preferably 5 mass% or more and 15 mass% or less.

[0072] The ratio of the mass of the base generator (B) to the mass of the energy-sensitive composition is preferably from 0.01 to 15% by mass, more preferably from 0.1 to 10% by mass, and even more preferably from 1 to 5% by mass. In addition, in the energy-sensitive composition, the mass of the base generator (B) is preferably 0.01 parts by mass or more and 30 parts by mass or less, more preferably 0.1 parts by mass or more and 20 parts by mass or less, and even more preferably 1 part by mass or more and 15 parts by mass or less, relative to 100 parts by mass of the polysilane (A).

[0073] The energy-sensitive composition may contain a base generator (B) other than the compound represented by formula (b1) and the photobase generator (also referred to as other base generators). The other base generators include thermal base generators other than the compound represented by formula (b1).

[0074] <Acid> The energy sensitive composition may further comprise an acid to enhance its stability. From the viewpoint of uniformity (compatibility, compatibility), the acid is preferably a conjugate acid of the anion moiety in the base generator represented by formula (b2) above, and specifically, an acid represented by the following formula is preferred. [ka] (In the formula, R b21 ~R b31 are R in formula (b2), b21 ~R b31 is equivalent to

[0075] The acid other than the conjugate acid may be any organic or inorganic acid, with organic acids being preferred. Examples of organic acids other than the conjugate acid include monovalent or divalent or higher organic acids having 1 to 30 carbon atoms, such as formic acid, acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid, trifluoroacetic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, propylmalonic acid, butylmalonic acid, dimethylmalonic acid, diethylmalonic acid, succinic acid, methylsuccinic acid, glutaric acid, adipic acid, itaconic acid, maleic acid, fumaric acid, citraconic acid, and citric acid. In addition, in order to maintain stability, two or more types of acids may be mixed and used.

[0076] The energy-sensitive composition may or may not contain the above-mentioned acid, but if it does contain it, the amount of the above-mentioned acid used is usually 0.001 mass% or more and 10 mass% or less, and preferably 0.01 mass% or more and 5 mass% or less, based on the mass of the solid content of the energy-sensitive composition (the mass of the energy-sensitive composition excluding the solvent).

[0077] In the energy-sensitive composition, the molar ratio of the total amount of the base generator (B) to the acid is, for example, 1:0.003 to 1:3.5, preferably 1:0.01 to 1:3, as the total amount of the base generator (B):acid. When the cationic moiety is a phosphazene, from the viewpoint of the stability of the energy-sensitive composition, the molar ratio of the base generator (B) to the acid is more preferably 1:0.003 to 1:1, as the total amount of the base generator (B):acid. With regard to the total amount of the base generator (B) and the above acid, the pH of the energy-sensitive composition may be adjusted to, for example, a range of 4 or more and 9 or less, preferably 5 or more and 7 or less.

[0078] <Solvent> The energy-sensitive composition preferably contains a solvent. Examples of the solvent include organic solvents. Specific examples of the organic solvent include acetate compounds containing a cyclic skeleton, such as cycloalkyl acetates represented by the formula (S1) described below, Alcohols such as methanol, ethanol, propanol, and n-butanol; Polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl-n-amyl ketone, methyl isoamyl ketone, and 2-heptanone; Lactone ring-containing organic solvents such as γ-butyrolactone; Derivatives of polyhydric alcohols such as compounds having an ester bond, such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol monoacetate, and compounds having an ether bond, such as monoalkyl ethers, such as monomethyl ether, monoethyl ether, monopropyl ether, or monobutyl ether, of the above polyhydric alcohols or compounds having an ester bond, such as monophenyl ether; cyclic ethers such as dioxane, and esters such as methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypropionate; Aromatic organic solvents such as anisole, ethyl benzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenetole, butyl phenyl ether, ethylbenzene, diethylbenzene, amylbenzene, isopropylbenzene, toluene, xylene, cymene, and mesitylene; nitrogen-containing organic solvents such as N,N,N',N'-tetramethylurea, N,N,2-trimethylpropionamide, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylacetamide, N,N-diethylformamide, 1,3-dimethyl-2-imidazolidinone, N-methylpyrrolidone, and N-ethylpyrrolidone; Examples include:

[0079] Among these, cycloalkyl acetate represented by the formula (S1) described later, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), N,N,N',N'-tetramethylurea (TMU), and butanol are preferred, cyclopropyl acetate, cyclobutyl acetate, cyclopentyl acetate, cyclohexyl acetate, cycloheptyl acetate, or cyclooctyl acetate is more preferred, and cyclohexyl acetate is even more preferred. These solvents may be used in combination of two or more kinds.

[0080] [ka] (In formula (S1), R s1 are each independently an alkyl group, p is an integer of 1 or more and 6 or less, and q is an integer of 0 or more and (p+1) or less. R s1 Examples of the alkyl group represented by the formula (I) include alkyl groups having 1 to 3 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, and an i-propyl group.

[0081] Specific examples of the cycloalkyl acetate represented by formula (S1) include cyclopropyl acetate, cyclobutyl acetate, cyclopentyl acetate, cyclohexyl acetate, cycloheptyl acetate, and cyclooctyl acetate. Among these, cyclooctyl acetate is preferred from the viewpoint of availability and the like.

[0082] The content of the solvent in the energy-sensitive composition is not particularly limited as long as it does not impair the object of the present invention. From the viewpoint of film-forming property, the solvent is used so that the solid content concentration of the energy-sensitive composition is preferably 0.1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 40% by mass or less. The solid content refers to the components other than the solvent. The above solvents may be used alone or in combination of two or more.

[0083] <Other ingredients> The energy-sensitive composition may contain a monohydric, dihydric or polyhydric alcohol or an ether compound having a cyclic ether as a substituent as a stabilizer. Specific examples of the stabilizer that can be used include the stabilizers described in paragraphs (0180) to (0184) of JP 2009-126940 A.

[0084] The energy-sensitive composition may contain water. The addition of water improves lithography performance. The content of water in the solvent component of the energy-sensitive composition is, for example, 0% by mass or more and less than 50% by mass, preferably 0.5% by mass or more and 5% by mass or less.

[0085] The energy-sensitive composition may contain a surfactant as necessary. Specific examples of the surfactant that can be used include those described in paragraph (0185) of JP 2009-126940 A.

[0086] <Method for producing energy-sensitive composition> The method for producing the energy-sensitive composition is not particularly limited. For example, the energy-sensitive composition is produced by mixing the above-mentioned components with a stirrer or the like. In addition, the energy-sensitive composition may be filtered using a membrane filter or the like so that the produced energy-sensitive composition is homogeneous.

[0087] <Application> The energy-sensitive composition can be used, for example, in various elements, for forming a protective film for protecting various substrates (including metal oxide-containing films and various metal-containing films), a sealant for OLED display elements, OLED lighting, hard coat, insulating film, anti-reflection film, interlayer insulating film, carbon hard mask, display panel material (flattening film, color filter pixel, organic EL partition wall, spacer), transparent coating for covering metal wiring and the like in display elements such as touch panels. Examples of the various substrates include substrates for display materials such as semiconductor substrates, liquid crystal displays, organic light-emitting displays (OLEDs), electrophoretic displays (electronic paper), touch panels, color filters, and backlights (including metal oxide-containing films and various metal-containing films), substrates for solar cells (including metal oxide-containing films and various metal-containing films), substrates for photoelectric conversion elements such as photosensors (including metal oxide-containing films and various metal-containing films), and substrates for photoelectric elements (including metal oxide-containing films and various metal-containing films). In particular, the cured product formed using the energy-sensitive composition has high hardness, and therefore the energy-sensitive composition is preferably used in applications where high hardness is required.

[0088] <Cured product and method for forming the cured product> By using the energy-sensitive composition described above, a cured product can be formed. The patterned cured product is typically formed by a method including the steps of applying the above-mentioned energy-sensitive composition onto a substrate to form a coating film, position-selectively exposing the coating film to light, developing the exposed coating film, and heating the developed coating film. Each step will be described below. The step of applying an energy-sensitive composition onto a substrate to form a coating film is referred to as a "coating film forming step." The step of position-selectively exposing the coating film is referred to as an "exposure step." The step of developing the coating film after exposure is referred to as a "development step." The step of heating the coating film after development is referred to as a "heating step."

[0089] <Coating film formation process> The method for applying the energy-sensitive composition to form a coating film is not particularly limited as long as it does not impair the effects of the present invention, and examples of the method include a method of applying the energy-sensitive composition onto a substrate using a contact transfer type coating device such as a roll coater, reverse coater, bar coater, or inkjet, or a non-contact type coating device such as a spinner (rotary coating device) or curtain flow coater. The substrate is not particularly limited, and examples thereof include a glass substrate, a quartz substrate, a transparent or translucent resin substrate (e.g., a heat-resistant material such as polycarbonate, polyethylene terephthalate, polyethersulfone, polyimide, polyamideimide, etc.), a metal, a silicon substrate, etc. Substrates such as semiconductor substrates, liquid crystal displays, organic light-emitting displays (OLEDs), electrophoretic displays (electronic paper), touch panels, color filters, backlights, etc. (including metal oxide-containing films and various metal-containing films), substrates for solar cells (including metal oxide-containing films and various metal-containing films), substrates for photoelectric conversion elements such as optical sensors (including metal oxide-containing films and various metal-containing films), substrates for optoelectronic elements (including metal oxide-containing films and various metal-containing films), etc. may also be used. The thickness of the substrate is not particularly limited and can be appropriately selected according to the usage mode of the cured product.

[0090] After applying the energy-sensitive composition, it is preferably dried (pre-baked). The drying method is not particularly limited. For example, (1) drying on a hot plate at a temperature of 80°C or higher and 180°C or lower, preferably 90°C or higher and 160°C or lower, for 60 seconds or more and 120 seconds or less; (2) leaving it at room temperature for several hours to several days; (3) putting it in a hot air heater or an infrared heater for several tens of minutes to several hours to remove the solvent, etc.

[0091] <Exposure process> In the exposure process, the coating film is selectively irradiated with active energy rays such as ultraviolet rays such as i-line (365 nm) and excimer laser light in a position-selective manner according to the desired pattern shape for exposure. By exposure, a base is generated from the photo-base generator. The generated base causes the polymerization of polysilane (A) and the like to proceed, so that the exposed part is cured, and a patterned cured product is formed by the subsequent development process.

[0092] For exposure, for example, a light source that emits ultraviolet rays such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. Position-selective exposure is performed, for example, through a mask having a shape corresponding to the pattern shape of the cured product. The exposure amount is not particularly limited, but for example, it is 30 mJ / cm 2 or more and 2000 mJ / cm 2 or less.

[0093] <PEB process> After exposure and before development, the coating film may be heated to PEB (post-exposure bake), for example at 80° C. to 180° C. for 30 to 120 seconds.

[0094] <Developing process> After the exposure step, or after PEB if PEB is performed, a development step is performed. In the development step, the unexposed parts of the coating film exposed in the exposure step are developed with a developer such as an alkaline developer or an organic solvent. The developer preferably contains an organic solvent. Specific examples of the organic solvent include those similar to the specific examples of the solvent contained in the energy-sensitive composition.

[0095] <Heating process> By heating (baking) the coating film after development, a base is generated from the compound represented by formula (b1). The generated base further promotes the polymerization of polysilane (A) into a higher molecular weight, thereby forming a patterned cured product (patterned cured film) with high hardness.

[0096] The heating temperature (baking temperature) may be equal to or higher than the temperature at which the compound represented by formula (b1) decomposes to generate a base, and is, for example, equal to or higher than 250° C., and preferably equal to or higher than 300° C. The upper limit of the heating temperature is not particularly limited and may be appropriately set depending on the substrate and the application, and is, for example, equal to or lower than 1000° C., preferably equal to or lower than 700° C., and more preferably equal to or lower than 600° C. The heating atmosphere is not particularly limited, and may be an inert gas atmosphere such as a nitrogen atmosphere or an argon atmosphere, a vacuum atmosphere, or a reduced pressure atmosphere. It may be in the air, and the oxygen concentration may be appropriately controlled. The heating time may be appropriately changed, and is 10 minutes or more and 120 minutes or less.

[0097] The thickness of the cured product formed is preferably from 10 nm to 10,000 nm, and more preferably from 50 nm to 5,000 nm.

[0098] Since the above-mentioned energy-sensitive composition contains the compound represented by formula (b1) and a photobase generator in addition to the polysilane (A), a patterned cured product having high hardness can be obtained by using the energy-sensitive composition. The pencil hardness of the resulting patterned cured product is, for example, 3H or more, and preferably 4H or more. EXAMPLES

[0099] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0100] [Synthesis of compound represented by formula (b1)] 3-Ethoxyacrylic acid chloride (4.00 g) of the following scheme and imidazole (10.40 g) were reacted in tetrahydrofuran at room temperature for 240 minutes. After that, the solvent was removed from the reaction solution using a rotary evaporator to obtain the following compound b1 (yield: 7.78 g, yield: 54.00%, yellow solid). 1 The results of H-NMR measurements are as follows: 1 H-NMR (CDCl 3 ):δ(ppm)8.16(s,1H),7.93(d,1H),7.50(s,1H),7.11(s,1H),5.87(d,1H),4.14q,2H),1.43(t,3H). [ka]

[0101] [Example 1 and Comparative Examples 1-2] In the examples and comparative examples, a chain polysilane (mass average molecular weight: 1500) containing a silanol group bonded to a silicon atom, a phenyl group, and a methyl group was used as the polysilane (A).

[0102] In the examples and comparative examples, the above-mentioned compound b1 and the following compound b2, which are thermal base generators, and the following compound b3, which is a photobase generator, were used. The pKa of the cation moiety of compound b3 is 33.0. [ka]

[0103] In the examples and comparative examples, the following solvent s1 was used. s1: Cyclohexyl acetate (CHXA)

[0104] The energy-sensitive compositions of each of the Examples and Comparative Examples were prepared by dissolving 18.3 parts by mass of polysilane (A) and a base generator of the type and amount (parts by mass) shown in Table 1 in 80 parts by mass of a solvent and filtering the solution through a fluororesin filter having a pore size of 0.1 μm.

[0105] [Preparation of patterned cured material] Each of the energy-sensitive compositions of the Examples and Comparative Examples was applied onto a glass substrate (100 mm×100 mm) using a spin coater, and prebaked at 100° C. for 120 seconds to form a coating film. The resulting coating film was exposed to 1000 mJ / cm 2 UV light. 2 Using a 1:1 line and space mask with a line width of 4 μm, position-selective broadband exposure (wavelength range 300 nm to 800 nm) was performed. After exposure, the coating film was baked (PEB) at 140° C. for 120 seconds. After the PEB treatment, the coating film was developed for 60 seconds by immersion in cyclohexyl acetate. After development, the film was heated in air at 350° C. for 30 minutes to obtain a line and space pattern (patterned cured product) having a thickness of 2 μm.

[0106] [Pencil hardness evaluation] The patterned cured product obtained in the above "Preparation of patterned cured product" was subjected to pencil hardness measurement using a pencil hardness tester at an angle of 45° and a load of 750 g in accordance with ISO 15184 and JIS K 5600-5-4. The results are shown in Table 1.

[0107] [Maximum absorption wavelength (λ max ) Measurement The maximum absorption wavelength (λ max ) was sought. A solution was prepared by dissolving 1.0 mg of the compound in 1000 mL of propylene glycol monomethyl ether, and the absorption spectrum (measurement range: 200 nm to 800 nm) was measured using a spectrophotometer (product name: UV3100PC, manufactured by Shimadzu Corporation) to determine the maximum absorption wavelength. As a result, the maximum absorption wavelength of compound b1 was 260 nm, the maximum absorption wavelength of compound b2 was 330 nm, and the maximum absorption wavelength of photobase generator b3 was 350 nm.

[0108] [Table 1]

[0109] According to the examples, it is found that an energy-sensitive composition containing a polysilane (A) and a base generator (B), in which the base generator (B) contains a compound represented by formula (b1) and a photobase generator, has high hardness. On the other hand, Comparative Example 1, which contained a photobase generator but no compound represented by formula (b1), and Comparative Example 2, which contained both a photobase generator and a thermal base generator not corresponding to formula (b1), had low hardness.

Claims

1. A composition comprising a polysilane (A), a base generator (B), and a solvent (S), The base generator (B) is an energy-sensitive composition comprising a compound represented by the following formula (b1) and a photobase generator: 【Chemistry 1】 (In formula (b1), R ｂ１ ~R ｂ３ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group, the organic group being an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, an aralkyl group, an alkoxy group, an alkoxycarbonyl group, a carbamoyl group, a thiocarbamoyl group, a carboxylate group, an acyl group, an acyloxy group, a sulfino group, an alkyl ether group, an alkenyl ether group, an alkyl thioether group, an alkenyl thioether group, an aryl ether group, or an aryl thioether group which may contain a heteroatom and which may be linear, branched, or cyclic; R ｂ４ and R ｂ５ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group, R ｂ６ represents a hydrogen atom, an alkyl group, or an alkoxy group.

2. The energy-sensitive composition according to claim 1, wherein the compound represented by formula (b1) is a compound represented by the following formula (b1-1): 【Chemistry 2】 (In formula (b1-1), R ｂ１ ~R ｂ３ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group, the organic group being an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, an aralkyl group, an alkoxy group, an alkoxycarbonyl group, a carbamoyl group, a thiocarbamoyl group, a carboxylate group, an acyl group, an acyloxy group, a sulfino group, an alkyl ether group, an alkenyl ether group, an alkyl thioether group, an alkenyl thioether group, an aryl ether group, or an aryl thioether group which may contain a heteroatom and which may be linear, branched, or cyclic; R ｂ４ represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an aliphatic group, R ｂ７ represents an alkyl group having 2 to 4 carbon atoms.

3. The energy-sensitive composition according to claim 1 or 2, wherein the photobase generator comprises a photobase generator represented by the following formula (b2): 【Chemistry 3】 (In formula (b2), R ｂ２１ ~R ｂ３１ each independently represents a hydrogen atom, a halogen atom, a nitro group, an alkyl group, an aryl group, an arylalkyl group, or an alkoxy group; R ｂ２５ and R ｂ２６ may be linked to each other via a single bond or a divalent linking group, Z ｑ＋ represents a q-valent counter cation composed of a base with a pKa of 24 or more; q represents an integer of 1 or more.

4. 4. The energy-sensitive composition of claim 3, wherein the counter cation comprises at least one cation selected from the group consisting of a phosphazene compound cation and an amidine compound cation.

5. The energy-sensitive composition according to claim 4, wherein the phosphazene compound constituting the phosphazene compound cation is a compound represented by the following formula (bc-1) or a compound in which at least two structures represented by the following formula (bc-1) are linked to each other, and the amidine compound constituting the amidine compound cation is a compound represented by the following formula (bc-2). 【Chemistry 4】 (In formula (bc-1), R ｂｃ１ ~R ｂｃ７ each independently represents hydrogen or a linear, branched or cyclic alkyl or arylalkyl group which may contain a heteroatom; R ｂｃ１ ~R ｂｃ７ At least two of these may be bonded to each other to form a ring. In formula (bc-2), R ｂｃ１１ ~R ｂｃ１４ each independently represents hydrogen or a linear, branched or cyclic alkyl or arylalkyl group which may contain a heteroatom; R ｂｃ１１ ~R ｂｃ１４ At least one of R represents a linear, branched or cyclic alkyl group or an arylalkyl group which may contain a heteroatom; ｂｃ１１ ~R ｂｃ１４ At least two of the groups may be bonded to each other to form a ring.

6. The energy-sensitive composition according to any one of claims 1 to 5, wherein the polysilane (A) essentially contains at least one of units represented by the following formulae (a1) and (a2) and may contain at least one unit selected from units represented by the following formulae (a3) ​​to (a5): 【Chemistry 5】 (In formulas (a1) to (a5), R ａ１ and R ａ２ R represents a hydrogen atom, a hydrocarbon group, an alkoxy group, an alkenyloxy group, a cycloalkoxy group, a cycloalkenyloxy group, an aryloxy group, an aralkyloxy group, or a silyl group. ａ３ represents a hydrogen atom or an alkyl group.

7. A cured product of the energy-sensitive composition according to any one of claims 1 to 6.

8. A step of applying the energy-sensitive composition according to any one of claims 1 to 6 onto a substrate to form a coating film; A step of position-selectively exposing the coating film; developing the coating film after exposure; and heating the coating film after development.

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