Substrate processing method
JP7636087B2Active Publication Date: 2025-02-26TOKYO ELECTRON LTD
Patent Information
- Application Number
- JP2023525756
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-06-03
- Filing Date
- 2022-05-25
- Publication Date
- 2025-02-26
- Estimated Expiration
- 2042-05-25
Smart Images
Figure 0007636087000001 
Figure 0007636087000002 
Figure 0007636087000003
Abstract
This substrate processing method includes the following steps (A)-(D). (A) A laminated substrate is prepared, the laminated substrate including, in the following order, a first substrate, a first absorption layer that absorbs laser light, a second absorption layer that has a higher laser light absorption coefficient than the first absorption layer, a device layer, and a second substrate. (B) The first substrate is irradiated with the laser light from the opposite side thereof to the second substrate. (C) The laser light that has passed through the first substrate is irradiated onto the first absorption layer, and a modified layer is formed in the first absorption layer. (D) The first substrate and the second substrate are separated starting from the modified layer.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Separation method
JP1998125929A
Peeling method and peeling device
JP2014049698A
Apparatus, composite laminate, method, and material for temporary substrate support
JP2015513211A
Semiconductor device manufacturing method and layered film for temporary fixing material
WO2020111146A1
Method for manufacturing chip-mounted substrate, and substrate processing device
WO2021084902A1