Resin matrix composition, prepreg, carbon fiber composite material, and method for producing resin matrix

Abstract

To provide a resin matrix composition.SOLUTION: A resin matrix composition contains an epoxy resin, a polysulfone engineering plastic, modified polyether imide produced from a nucleophilic compound having a nucleophilic functional group containing a hydroxy group, a sulfhydryl group, a carboxyl group and / or an amino group, and polyether imide, and an amine curing agent. Thereby, a resin matrix separated into two forms of an island phase and a co-continuous phase can be produced, the resin matrix has both good flexural strength and toughness, and has adequate impregnation viscosity, accordingly is suitably made to impregnate carbon fibers, and a prepreg and a carbon fiber composite material are produced.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin matrix composition, a prepreg, a carbon fiber composite, and a method for producing a resin matrix, and in particular to an epoxy resin matrix composition, an epoxy resin-based prepreg, an epoxy resin-based carbon fiber composite, and a method for producing an epoxy resin matrix. [Background technology]

[0002] Epoxy resins are thermosetting resins with a three-dimensional network crosslinking structure. Epoxy resins have already been widely applied to various parts in paints, the electronics industry, the aerospace industry, automobiles, sporting goods, etc. However, because of their network crosslinking structure, epoxy resins have drawbacks such as brittleness, fragility, and poor impact resistance. In particular, epoxy resins with high crosslinking density (e.g., tetrafunctional epoxy resins) have the above-mentioned drawbacks more prominently. Summary of the Invention [Problem to be solved by the invention]

[0003] Due to the above-mentioned drawbacks of epoxy resins, epoxy resins must be toughened to improve their properties and further increase their applicability. Conventional methods for toughening epoxy resins involve blending a thermoplastic resin and then subjecting the epoxy resin to thermally induced phase separation (TIPS). However, thermally induced phase separation can occur during the heat curing process, as the solubility of the epoxy resin in the blended thermoplastic resin decreases due to the crosslinking reaction between the epoxy resin and the curing agent, resulting in a two-phase separation phenomenon. In other words, changes in thermodynamic conditions such as temperature are often accompanied by the occurrence of phase separation, so that in order to achieve an improvement in the properties of epoxy resins in two-component systems, it is necessary to effectively control the complex and easily variable phase separation phenomenon.

[0004] In view of this, there is an urgent need to provide a resin matrix composition and a method for preparing a resin matrix in order to improve the properties and applicability of epoxy resins. [Means for solving the problem]

[0005] One aspect of the present invention provides a resin matrix composition that contains an epoxy resin, an engineering thermoplastic plastic, and a modified thermoplastic resin, thereby controlling a phase separation system.

[0006] Another aspect of the present invention provides a prepreg comprising the resin matrix composition of the above aspect.

[0007] A further aspect of the present invention provides a carbon fiber composite produced from the prepreg of the above aspect.

[0008] A further aspect of the present invention provides a method for preparing a resin matrix by mixing an epoxy resin, a modified polyetherimide, and a polysulfone-based engineering plastic under predetermined conditions.

[0009] According to one aspect of the present invention, there is provided a resin matrix composition comprising an epoxy resin, a polysulfone engineering plastic, a modified polyetherimide prepared from a nucleophilic compound having a nucleophilic functional group including a hydroxyl group, a sulfhydryl group, a carboxyl group and / or an amino group, and a polyetherimide, and an amine curing agent.

[0010] According to one embodiment of the present invention, based on 100 wt% epoxy resin, the resin matrix composition contains 0.5 wt% to 30 wt% polysulfone engineering plastics.

[0011] According to one embodiment of the present invention, based on 100 wt% epoxy resin, the resin matrix composition includes 0.5 wt% to 20 wt% modified polyetherimide.

[0012] According to one embodiment of the present invention, the ratio of the amino group of the amine curing agent to the epoxy group of the epoxy resin is 0.6 to 1.3.

[0013] According to one embodiment of the present invention, the resin matrix composition further comprises a curing accelerator, which includes an amine-based curing accelerator, a guanamine-based curing accelerator, an imidazole-based curing accelerator, and / or a phosphonium-based curing accelerator.

[0014] According to one embodiment of the present invention, the types of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, cresol novolac resin, naphthalene type epoxy resin, aliphatic epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl type epoxy resin, aminophenol, methylenediphenylamine, tetraglycidyldiaminodiphenylmethane, or a combination thereof.

[0015] According to one embodiment of the present invention, the type of the amine curing agent includes an aliphatic amine curing agent, an alicyclic amine curing agent, an aromatic amine curing agent, a dicyandiamide curing agent, a polyetheramine curing agent, a polyaminoamide curing agent, a polyamine curing agent, a polyamide curing agent, or a combination thereof.

[0016] According to another aspect of the present invention, there is provided a prepreg comprising the resin matrix composition and carbon fibers.

[0017] A further aspect of the present invention provides a carbon fiber composite material produced by subjecting the prepreg to a hot press molding process.

[0018] A further aspect of the present invention provides a method for producing a resin matrix, comprising the steps of: mixing an epoxy resin and a modified polyetherimide at a temperature of 90°C to 130°C to obtain a first solution; mixing the first solution with a polysulfone engineering plastic at a temperature of 100°C to 150°C to obtain a second solution; and adding an amine curing agent to the second solution to obtain a resin matrix. Effect of the Invention

[0019] By applying the resin matrix composition, prepreg, carbon fiber composite, and resin matrix manufacturing method of the present invention, a resin matrix that separates into two types of phase morphology can be produced by blending an epoxy resin with two types of thermoplastic resins, which provides both bending and toughness, and further provides the prepreg and carbon fiber composite with good processability and physical properties. [Brief description of the drawings]

[0020] Aspects of the present disclosure are best understood based on the following detailed description when read in conjunction with the accompanying drawings, in which: It should be noted that, in accordance with standard practice in the industry, many features have not been drawn to scale, and in fact, for clarity of discussion, the size of many features may be arbitrarily increased or decreased. [Figure 1] 1 is a flow chart illustrating a method for producing a resin matrix according to some embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] As used herein, "around," "about," "approximately," or "substantially" generally means within 20%, or within 10%, or within 5% of a stated value or range.

[0022] In order to toughen conventional epoxy resins, polysulfone engineering plastics such as polyether sulfone (PES) may be used, and 4,4-diaminodiphenyl sulfone (4,4-DDS) may be used as a curing agent to harden the resin. In this conventional method, when 0 wt% to 10 wt% of polyether sulfone is added, a resin matrix having a homogeneous phase or island morphology can be obtained. When the amount of polyether sulfone added is increased to 12 wt% to 16 wt%, the viscosity of the resin matrix changes, and the resin matrix gradually transitions to a bicontinuous phase during hardening. However, when the amount of polyether sulfone added is further increased to 20 wt% or more, the resin matrix further transitions to an inverted island phase. The inverted island phase resin matrix is ​​the toughest of the three types mentioned above, since it is mainly a thermoplastic form, but its flexural modulus and glass transition temperature (T g ) is reduced too much, further limiting the applicability of the resin matrix. It should be understood that a resin matrix having an island phase (spherical phase separation) morphology has favorable flexural strength, while a resin matrix having a bicontinuous phase morphology has favorable impact resistance and toughness.

[0023] In view of the above, the present invention provides a resin matrix composition, which contains a modified polyetherimide (PEI) in addition to a polysulfone engineering plastic, and thus produces a resin matrix having both a bicontinuous phase and an island phase by adding a small amount of polysulfone engineering plastic, and has both bending strength and impact resistance and a viscosity relatively suitable for impregnation of carbon fiber, so that the prepreg has favorable processability and the carbon fiber composite has good physical properties.

[0024] The resin matrix composition provided by the present invention includes an epoxy resin, a polysulfone engineering plastic, a modified polyetherimide, and an amine curing agent. In some embodiments, the type of epoxy resin includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, cresol novolac resin, naphthalene type epoxy resin, aliphatic epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl type epoxy resin, or a combination thereof.

[0025] In some embodiments, the bisphenol A epoxy resin may be a product available from Nan Ya Plastics Co., Ltd. under the designation NPEL 127, 128, 134, 901, 902, or 904, a product available from Hexion Co., Ltd. under the designation EPON™ 828, 830, 834, or 1001F, a product available from Chang Chun Plastics Co., Ltd. under the designation BE 114, 186, or 188, a product available from ADEKA Corporation under the designation EP 4100, 4300, or 4700, or a product available from Dow Co., Ltd. under the designation DER 331, 317, 324, or 214. In some embodiments, the bisphenol F type epoxy resin may be a commercially available product manufactured by Nan Ya Plastics Co., Ltd. under the name NPEF 170 or the like, a commercially available product manufactured by Hexion Co., Ltd. under the name EPON™ 869 or the like, a commercially available product manufactured by Mitsubishi Chemical Co., Ltd. under the name jER 806 or 807 or the like, or a commercially available product manufactured by Chang Chun Plastics Co., Ltd. under the name BE 170, 235 or 283 or the like.

[0026] In some embodiments, the novolac epoxy resin may be a commercially available product manufactured by Nanya Plastics Co., Ltd. under the designation NPPN 630, 638, or 640, a commercially available product manufactured by Meiwa Chemical Industry Co., Ltd. under the designation H series product or HF series product, or a commercially available product manufactured by Chang Chun Plastics Co., Ltd. under the designation PNE 171, 172, 174, 175, 176, or 177, etc. In some embodiments, the cresol novolac resin may be a product available from HUNTSMAN under the designation ECN 1273, 1280, 1299, or 9511, or a product available from NANYA PLASTICS under the designation NPCN-703, 704, or a product available from Chang Chun Plastics under the designation CNE-202, 220, and 200 series, or a product available from Nippon Kayaku under the designation CER-1020, EOCN-1020-62, EOCN-1020, EOCN-102S, EOCN-103S, and EOCN-104S ...

[0027] In some embodiments, the naphthalene type epoxy resin may be a commercially available product manufactured by ▲Kim Hiromori Materials Co., Ltd. under the name VastPoxy-465, a commercially available product manufactured by Huntsman under the name Araldite® MY 0816, or a commercially available product manufactured by DIC Corporation under the name EPICLON® HP-5000, HP-4700, or HP-4710. In some embodiments, the aliphatic epoxy resin may be a commercially available product manufactured by DOW under the name DER 732, DER 736, or a commercially available product manufactured by ▲Kim Hiromori Materials Co., Ltd. under the name VastPoxy-4821, 428, 484, 486, 430, or the like.

[0028] In some embodiments, the dicyclopentadiene novolac epoxy resin may be a commercially available product manufactured by Dai Nippon Printing Co., Ltd. under the name HP-7200H or the like, a commercially available product manufactured by Nippon Kayaku Co., Ltd. under the name XD-1000 or the like, a commercially available product manufactured by Zhejiang Ronde Chemical Co., Ltd. under the name 655-B-75 or the like, a commercially available product manufactured by Lianying Chemical Co., Ltd. under the name KES-7660 or the like, a commercially available product manufactured by Chang Chun Synthetic Resins Co., Ltd. under the name DNE260 or the like, a commercially available product manufactured by Shin-A T&C Co., Ltd. under the name SEV-3460, SEV-3475, SEV-3408, or SEV-3410, or a commercially available product manufactured by Huntsman under the name Tactix® 556 or Tactix® 756, or the like. In some embodiments, the biphenyl type epoxy resin may be a commercially available product such as Sinepoxy® YX 4000 manufactured by Nakako Chemical Industry Co., Ltd., a commercially available product such as VastPoxy YF-4800 manufactured by Kanematsu Hirose Materials Co., Ltd., a commercially available product such as BPNE3501 manufactured by Kasei Chemical Industry Co., Ltd., or a product such as jER YX4000 manufactured by Mitsubishi Chemical Corporation.

[0029] In some embodiments, the epoxy resin comprises a multifunctional epoxy resin, including a trifunctional epoxy resin and a tetrafunctional epoxy resin. In some embodiments, the trifunctional epoxy resin comprises an aminophenol, which may be a commercially available product from Huntsman Advanced Materials under the trade names Araldite® MY 0510, MY 0500, MY 0600, MY 0610, etc. In some embodiments, the tetrafunctional epoxy resin includes methylenediphenylamine and tetraglycidyldiaminodiphenylmethane, where methylenediphenylamine may be a commercially available product such as Araldite® MY 9655 manufactured by Huntsman Advanced Materials, and tetraglycidyldiaminodiphenylmethane may be a commercially available product such as Araldite® MY 721, MY 720, MY 725, MY 9663, MY 9634, MY 965, manufactured by Huntsman Advanced Materials.

[0030] In some embodiments, based on 100 wt% of epoxy resin, the resin matrix composition includes about 0.5 wt% to about 30 wt% of polysulfone engineering plastics, preferably about 5 wt% to about 25 wt%, more preferably about 10 wt% to about 20 wt%. If the amount of polysulfone engineering plastics is too small, for example less than about 0.5 wt%, the resin matrix exhibiting obvious two-phase separation cannot be produced, and the mechanical performance is not significantly improved. If the amount of polysulfone engineering plastics is more than about 30 wt%, the viscosity of the resin matrix produced is too high, which is disadvantageous for subsequent application and processing, and the mechanical performance is also unfavorable. In some embodiments, the polysulfone engineering plastic includes polyethersulfone (PES).

[0031] In some embodiments, the polysulfone engineering plastics may be commercially available products such as ULTRASON® S, E, P series manufactured by BASF, VW10700RP, VW30500R manufactured by Solvay Specialty Polymers Japan, Udel®, Veradel®, Eviva®, Radel®, Veriva®, and Acudel® manufactured by Solvay, and 3600G, 4100G, 4800G, and 5003P manufactured by Sumitomo Chemical. It should be understood that the above-mentioned polysulfone engineering plastics further include various functional group modified polysulfone engineering plastics such as sulfonated polysulfone engineering plastics. In some embodiments, the sulfonated polysulfone engineering plastics may be commercially available products such as S-PES manufactured by Konishi Chemical.

[0032] In some embodiments, the resin matrix composition contains about 0.5 wt% to about 20 wt% of modified polyetherimide, preferably about 2 wt% to about 15 wt%, more preferably about 4 wt% to about 10 wt%, based on 100 wt% of epoxy resin. Thus, the resin matrix composition of the present invention contains about 0.5 wt% to about 20 wt% of modified polyetherimide, and is combined with about 0.5 wt% to about 30 wt% of polysulfone engineering plastic (based on 100 wt% of epoxy resin), so that the resulting resin matrix has both an island-type spherical morphology and a co-continuous morphology, and can maintain two-phase separation.

[0033] In some embodiments, the modified polyetherimide is a polyetherimide-nucleophile modification (PEI-Nu). That is, the modified polyetherimide is prepared by reacting a nucleophile with a polyetherimide. In some embodiments, the nucleophile is a compound having a nucleophilic functional group, such as a hydroxyl group (-OH), a sulfhydryl group (-SH), a carboxyl group (-COOH), and / or an amino group (-NH2). It should be understood that a nucleophilic functional group generally refers to a functional group containing a lone electron. In some embodiments, the polyetherimide may be a commercially available product from RTP under the name RTP 2100 LF, etc., from Sigma-Aldrich under the name 700193, 700207, etc., from Ensinger under the name TECAPEI, etc., or from Technoform under the name PEI, etc.

[0034] In some embodiments, the synthesis method of the modified polyetherimide includes dispersing the polyetherimide in acetone at about 60° C., gradually adding the nucleophilic compound and reacting for about 0.5 to about 18 hours. After the reaction, the mixture is filtered with filter paper, washed repeatedly with acetone, and dried to obtain the modified polyetherimide.

[0035] In some embodiments, the ratio of the amino group of the amine curing agent to the epoxy group of the epoxy resin is about 0.6 to about 1.3. That is, based on 100% of the epoxy group of the epoxy resin, the amine curing agent contained in the resin matrix composition has about 60% to about 130% of the amino group. If too little amine curing agent is added, i.e., the ratio of the amino group to the epoxy group is less than about 0.6, the resin matrix cannot be completely cured, and conversely, if too much amine curing agent is added, i.e., the ratio of the amino group to the epoxy group is greater than about 1.3, the resulting resin matrix has defects and is disadvantageous for subsequent applications. In some embodiments, the type of amine curing agent includes an aliphatic amine curing agent, an alicyclic amine curing agent, an aromatic amine curing agent, a dicyandiamide (DICY) curing agent, a polyether amine curing agent, a polyaminoamide curing agent, a polyamine curing agent, a polyamide curing agent, or a combination thereof.

[0036] In some embodiments, the aliphatic amine curing agent includes ethylenediamine, octylamine, 1,3-propanediamine, 2,2-dimethyl-1,3-propanediamine (neopentanediamine), hexamethylenediamine, diethylenediamine, di(3-aminopropyl)amine, N,N-di(3-aminopropyl)methylamine, diethylenetetramine, diethylenetriamine, tetraethylenepentamine, pentaethylenehexamine, polyethylenepolyamines, 2,2,4-trimethylhexane-1,6-diamine, xylenediamine, and di(aminocyclohexyl)methane. In some embodiments, the cycloaliphatic amine curing agent includes 1,2-diaminocyclohexane, 1,4-diaminocyclohexane, di(4-aminocyclohexyl)methane, di(4-amino-3-methylcyclohexyl)methane, 2,2-di(4-aminocyclohexyl)propane, and 3-aminomethyl-3,5,5-trimethylcyclohexylamine (isophoronediamine).

[0037] In some embodiments, the aromatic amine curing agent includes 4-aminodiphenylmethane, di(4-aminophenyl)methane, benzylamine, m-xylylenediamine, 3,3'-diaminodiphenylsulfone, 4,4-diaminodiphenylsulfone. In some embodiments, the dicyandiamide curing agent includes DICY7 (dicyandiamide, manufactured by Japan Epoxy Resins Co., Ltd.). In some embodiments, the polyetheramine includes the Jeffamine series manufactured by Huntsman Chemical Co., such as commercially available products under the trade names Jeffamine EDR-148, Jeffamine D-230, Jeffamine D-400, or Jeffamine T-403. In some embodiments, the polyaminoamide curing agent includes polyaminoamides made with aliphatic polyamines and dimerized or trimerized fatty acids.

[0038] In some embodiments, the resin matrix composition may selectively include a curing accelerator according to the needs of the application. In some embodiments, the curing accelerator includes an amine-based curing accelerator, a guanamine-based curing accelerator, an imidazole-based curing accelerator, a phosphonium-based curing accelerator, and a combination thereof. In some specific examples, the amine-based curing accelerator includes a trialkylamine such as triethylamine or tributylamine, an amine compound such as 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, or 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), an organic dihydrazide (trade names: AMICURE VDH-J, AMICURE UDH, AMICURE LDH, manufactured by Ajinomoto Fine-Techno Co., Ltd.), a modified polyamine containing a tertiary amino group, a modified polyamine containing a urea bond, and a modified polyamine containing an imidazole. For example, modified polyamines containing tertiary amino groups may be commercially available products manufactured by ADEKA under the names EH4380S, EH3616S, EH5001P, EH4375S, etc.; modified polyamines containing imidazole may be commercially available products manufactured by Ajinomoto Fine-Techno Co., Ltd. under the names PN-23, PN-H, PN-40, ADEKA under the name EH4346S, T&K Toka under the names FXR-1121, AIR PRODUCTS, JAPAN under the name SUNMIDE LH210, etc.; and modified polyamines containing urea bonds may be commercially available products manufactured by T&K Toka under the names FXR-1020, FXR-1081, etc.

[0039] Please refer to FIG. 1, which is a flow chart showing a method 100 for producing a resin matrix according to some embodiments of the present invention. The resin matrix composition may be used to produce a resin matrix by the method 100 for producing a resin matrix and applied to a prepreg and a carbon fiber composite. First, in operation 110, an epoxy resin and a modified polyetherimide are mixed at a temperature of about 90° C. to about 130° C. to obtain a first solution. If the mixing temperature is lower than 90° C., the solubility of the epoxy resin and the modified polyetherimide is poor, while if the mixing temperature is higher than 130° C., the epoxy group in the epoxy resin may undergo a ring-opening reaction or the epoxy resin may be oxidized and deteriorated. In some embodiments, the epoxy resin may be first melted and preheated. In some embodiments, based on 100 wt% of the epoxy resin, about 0.5 wt% to about 20 wt% of the modified polyetherimide is added. In some embodiments, the modified polyetherimide is produced by reacting ethylenediamine and polyetherimide at about 60° C. for about 0.5 hours to about 18 hours.

[0040] Then, in operation 120, the polysulfone engineering plastic and the first solution are mixed and dissolved at a temperature of about 100°C to about 150°C to obtain a second solution. If the mixing temperature is lower than 100°C, the mixing effect of the polysulfone engineering plastic and the first solution is poor, while if the mixing temperature is higher than 150°C, the epoxy group in the epoxy resin may undergo ring-opening reaction or the epoxy resin may be oxidized and deteriorated. It should be noted that high-speed stirring should be continued during the mixing process until a transparent and uniform second solution is obtained. In some embodiments, based on 100 wt% of the epoxy resin, about 0.5 wt% to about 30 wt% of the polysulfone engineering plastic is added.

[0041] Thereafter, operation 130 is performed by adding an amine curing agent to the second solution to obtain a resin matrix. In some embodiments, the second solution may be optionally cooled to about 90°C before operation 130 is performed. Note that high speed stirring is also required to ensure that the resulting resin matrix is ​​uniformly mixed. The resin matrix may then be poured into a mold and cured at a temperature of about 130°C to about 230°C, preferably about 130°C to about 180°C.

[0042] As described above, the resin matrix includes both the island phase and the bicontinuous phase, and in some embodiments, the average particle size of the spherical morphology of the island phase is about 300 nm to about 2 μm, and the average particle size of the worm-like or irregular morphology of the bicontinuous phase is about 500 nm to about 2 μm. If the average particle size of the island phase is within the above range, it contributes to the bending strength of the resin matrix and contributes to the toughening effect, and if the average particle size of the bicontinuous phase is within the above range, it contributes to the applicability of the subsequent carbon fiber impregnation.

[0043] In addition, the resin matrix produced by the above method has good rheometer dynamic viscosity, which is advantageous for the subsequent processing and impregnation process of reinforcement fiber (e.g., carbon fiber) prepreg. The physical properties of the carbon fiber composite material (e.g., carbon fiber reinforced plastic (CFRP)) produced after the carbon fiber is impregnated are obviously related to the impregnation effect of the resin prepreg. Therefore, if the resin matrix has an appropriate viscosity to sufficiently impregnate the fiber, the composite material can have favorable physical properties.

[0044] The present invention further provides a prepreg comprising the resin matrix composition and carbon fibers. In some embodiments, the carbon fibers comprise polyacrylonitrile (PAN) carbon fibers. The resin matrix produced by the resin matrix composition can be impregnated into a carbon fiber material to obtain a prepreg. The prepreg can also be subjected to a hot press molding process to produce a carbon fiber composite.

[0045] The following describes the application of the present invention using several examples, but the examples are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Synthesis Example 1

[0046] At a temperature of 60°C, 50 grams of polyetherimide was added to acetone, followed by gradually adding 0.25 moles (14.95 grams) of ethylenediamine using a metering pump, and reacting for 0.5 to 18 hours. The reacted mixture was filtered through filter paper, washed multiple times with acetone, and then dried to produce modified polyetherimide. To avoid any residual ethylenediamine that has not been completely reacted, it may be verified with bromocresol green (BCG). Resin Matrix Example 1

[0047] Triglycidyl-p-aminophenol (TGPAP), a trifunctional epoxy resin, was dissolved in a beaker and preheated. All of the chemicals added below are based on 100 wt% of TGPAP. First, 4.5 wt% of the modified polyetherimide (PEI-Nu) of Synthesis Example 1 was added and blended and dissolved at a temperature of 90°C to 130°C. Next, 12 wt% of polyethersulfone (PES) was added and stirred at a temperature of 100°C to 150°C until the solution became transparent. The solution after stirring was cooled to 90°C, and 100 wt% of 4,4-diaminodiphenylsulfone was added as an amine curing agent, and mixed and stirred at 180°C for 4 hours to obtain an epoxy resin matrix. The reaction conditions, bending test, dynamic mechanical analysis (DMA) and fracture toughness (K IC The test results are shown in Table 1. The bending test of the resin matrix was based on the ASTM D790 standard, the DMA test was based on the ASTM D5026 standard, and the K IC The test is based on the ASTM D5045 standard. Comparative Examples 1 to 3

[0048] Comparative Examples 1-3 all utilized a process similar to that of Example 1. The differences were that in Comparative Example 1, no thermoplastic blending was performed, i.e., TGPAP curing was performed directly with 4,4-diaminodiphenylsulfone, in Comparative Example 2, 14.94 wt% of polyethersulfone was added but no modified polyetherimide was added, and in Comparative Example 3, 14.94 wt% of modified polyetherimide was added but no polyethersulfone was added. The reaction conditions, bending test, DMA and fracture toughness test results of Comparative Examples 1-3 are shown in Table 1.

[0049] [Table 1]

[0050] Based on Table 1, in comparison with Comparative Example 1 in which no thermoplastic engineering plastic was added, the bending test and DMA modulus were all decreased in Examples 1, 2 and 3, but the K IC In addition, in comparison with Comparative Example 2 in which the elastic modulus decreased significantly, the decrease in the elastic modulus in Example 1 was not so large, and K IC In comparison with Comparative Example 3, where the K value is only 0.9, Example 1 has a higher K value than Comparative Example 2. IC That is, in Example 1, the resin matrix prepared by adding polyethersulfone and modified polyetherimide can maintain favorable bending strength and toughness at the same time. Carbon Fiber Composites

[0051] After the resin matrices of Example 1, Comparative Example 1, and Comparative Example 2 were impregnated into the carbon fiber 3K fabric, tests such as 0° tensile strength, 0° compressive strength, interlaminar shear strength, in-plane shear strength, and processability were performed. The tensile strength test of the composite material was based on the ASTM D3039 standard, the compressive strength test of the composite material was based on the ASTM D6641 standard, the interlaminar shear strength test of the composite material was based on the ASTM D2344 standard, and the in-plane shear strength test of the composite material was based on the ASTM D3518 standard. The strength test results are shown in Table 2 below.

[0052] [Table 2]

[0053] As can be seen from Table 2 above, the carbon fiber prepreg impregnated in Example 1 has high strength and good composite properties. In addition, according to the processability test, the resin matrix of Example 1 has a moderate viscosity at the impregnation temperature, so it is suitable for impregnating the carbon fiber prepreg, whereas the resin matrix of Comparative Example 1 has a very low viscosity at the impregnation temperature, so there is serious overflow, and the resin in the carbon fiber prepreg is insufficient and unevenly distributed, and the resin matrix of Comparative Example 2 has a high viscosity at the impregnation temperature, so the impregnation of the carbon fiber prepreg is poor. In other words, the carbon fiber prepreg is sufficiently impregnated with the resin matrix of Example 1, so that it can have good composite properties.

[0054] Based on the above examples, the present invention provides a resin matrix composition, a prepreg, a carbon fiber composite, and a method for producing a resin matrix, and a resin matrix composition is prepared by adding a polysulfone engineering plastic and a modified polyetherimide to an epoxy resin to produce a resin matrix that simultaneously separates into two phases of an island phase and a co-continuous phase. The resin matrix exhibiting two-phase separation has good bending strength and toughness and has a suitable impregnation viscosity, so that it can be suitably impregnated into carbon fibers to produce a prepreg and a carbon fiber composite.

[0055] Although the present invention has been disclosed above by a number of embodiments, the embodiments do not limit the present invention, and those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present invention is based on the contents specified in the following claims. [Explanation of symbols]

[0056] 100 ways 110, 120, 130 operations

Claims

1. A resin matrix composition comprising: Epoxy resin, Polysulfone engineering plastics; a modified polyetherimide produced from a nucleophilic compound having a nucleophilic functional group including a hydroxyl group, a sulfhydryl group, a carboxyl group, and / or an amino group, and a polyetherimide; An amine curing agent; Including, When the epoxy resin is 100 wt %, the resin matrix composition contains 0.5 wt % to 12 wt % of the polysulfone engineering plastic and 0.5 wt % to 20 wt % of the modified polyetherimide. Resin matrix composition.

2. 2. The resin matrix composition according to claim 1, wherein the ratio of the amino groups of the amine curing agent to the epoxy groups of the epoxy resin is 0.6 to 1.

3.

3. 2. The resin matrix composition according to claim 1, further comprising a curing accelerator comprising an amine curing accelerator, a guanamine curing accelerator, an imidazole curing accelerator, and / or a phosphonium curing accelerator.

4. 2. The resin matrix composition according to claim 1, wherein the type of the epoxy resin includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, cresol novolac resin, naphthalene type epoxy resin, aliphatic epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl type epoxy resin, aminophenol, methylene diphenylamine, tetraglycidyl diamino diphenyl methane, or a combination thereof.

5. 2. The resin matrix composition according to claim 1, wherein the type of the amine curing agent includes an aliphatic amine curing agent, an alicyclic amine curing agent, an aromatic amine curing agent, a dicyandiamide curing agent, a polyetheramine curing agent, a polyaminoamide curing agent, a polyamine curing agent, a polyamide curing agent, or a combination thereof.

6. A prepreg comprising the resin matrix composition according to any one of claims 1 to 5 and carbon fibers.

7. A carbon fiber composite material produced by subjecting the prepreg according to claim 6 to a hot press molding process.

8. mixing an epoxy resin and a modified polyetherimide at a temperature of 90° C. to 130° C. to obtain a first solution, the modified polyetherimide being 0.5 wt % to 20 wt % when the epoxy resin is taken as 100 wt %, the modified polyetherimide being prepared from a nucleophilic compound and a polyetherimide, the nucleophilic compound having a nucleophilic functional group including a hydroxyl group, a sulfhydryl group, a carboxyl group, and / or an amino group; mixing the first solution with a polysulfone engineering plastic at a temperature of 100° C. to 150° C. to obtain a second solution, the polysulfone engineering plastic being 0.5 wt % to 12 wt % relative to 100 wt % of the epoxy resin; adding an amine curing agent to the second solution to obtain a resin matrix; A method for producing a resin matrix comprising:

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