Film, laminate, precursor composition, and composition for reducing the thermal expansion coefficient of polyimide resin
JP7637454B2Active Publication Date: 2025-02-28I S T CO LTD
Patent Information
- Application Number
- JP2024543510
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-02-27
- Filing Date
- 2024-02-22
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2044-02-22
Smart Images
Figure 0007637454000001 
Figure 0007637454000002
Abstract
The problem addressed by the present invention is to lower the thermal expansion coefficient of a polyimide film having a relatively high thermal expansion coefficient. The film according to the present invention contains a polyimide and an oxide that includes elemental boron. The oxide that includes elemental boron is preferably obtained from boric acid and an alumina sol. Furthermore, this film preferably has a thermal expansion coefficient of 50 ppm / °C or less. Furthermore, this film preferably exhibits light transmittance of 74% or more at a wavelength of 420 nm. Furthermore, this film preferably exhibits yellowness (YI) of 6.0 or less. Furthermore, this film preferably exhibits thermal conductivity within the range from 0.231 W / mK to 0.275 W / mK.
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Citation Information
Patent Citations
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