SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CONTROLLING DRESSING OF POLISHING MEMBER

Abstract

To provide a height profile to be a target in a radial direction of a polishing member even when load of a dresser is changed.SOLUTION: A substrate processor which slides a substrate on a polishing member and polishes the substrate is a dresser which dresses the polishing member by sliding it on the polishing member includes: a dresser which can adjust oscillation speed in a plurality of scan areas set on the polishing member along a radial direction; a height detection part which generates a pad profile by measuring a surface height of the polishing member along the radial direction of the polishing member; a dresser load setting part which sets dresser load to be imparted to the polishing member; a pad height correction part which calculates a correction amount of the surface height of the polishing member in accordance with a variation amount from reference load of the dresser load in the radial direction and corrects the pad profile by correcting measurement value of the surface height by the correction amount; and a moving speed calculation part adjusting the oscillation speed in each scanning area of the dresser on the basis of the corrected pad profile.SELECTED DRAWING: Figure 14

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