SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a technique capable of processing a substrate with a stably processing performance.SOLUTION: A substrate processing apparatus according to an embodiment of the present disclosure, comprises: a holding part that holds a substrate; a liquid discharge part; a first supply part; a second supply part; and a control part that controls each part. The liquid discharge part discharges a processing liquid to the substrate held by the holding part. The first supply part supplies the processing liquid to the liquid discharge part. The second supply part supplies a moisture vapor to the liquid discharge part. The second supply part includes: a moisture vapor generator that generates the moisture vapor; a supply line; a stable mechanism; a pressure gauge that measures a pressure of the moisture vapor flowing in the supply line; and a pressure adjustment mechanism. The supply line supplies the moisture vapor from the moisture vapor generator to the liquid discharge part. The stable mechanism stabilizes the amount of the moisture vapor supplied to the supply line from the moisture vapor generator. The pressure adjustment mechanism adjusts the pressure of the moisture vapor flowing in the supply line. The control part controls the pressure adjustment mechanism so that the pressure of the moisture vapor measured by the pressure gauge becomes a preset pressure.SELECTED DRAWING: Figure 3

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