Holding device

Abstract

To provide a holding device capable of easily controlling a temperature of a plurality of heating zones provided to a plate-like member holding an object to a mutually different temperature.SOLUTION: A holding device 1 comprises: a plate-like member 10 having a first front surface S1 orthogonal to a first direction; and a plurality of heating elements 50 which is arranged at the same position to the first direction in the plate-like member 10, and is held to the first front surface S1 while heating a wafer W. In the plate-like member 10, a plurality of heating zones AZ, B1Z, B2Z, and CZ which is heated to a mutually different temperature band by heating elements 50A, 50B1, 50B2, and 50C arranged in each inner part, is provided in view of the first direction, and a lower layer surface penetration part (void space) 65T is arranged between the plurality of heating zones AZ, B1Z, B2Z, and CZ in view of the first direction, and is formed so as to extend in a direction orthogonal to the first direction at a position similar to the heating elements 50A, 50B1, 50B2, and 50C with respect to the first direction.SELECTED DRAWING: Figure 2

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