Processing System

Abstract

A processing system provided with: a radiation structure for radiating energy beams on an object; a material-supplying member for supplying a molding material to be radiated with energy beams; a measurement device for obtaining information relating to the height of the surface of the object; and a distance-modifying device for modifying the distance between the material-supplying member and the surface of the object on the basis of the results measured by the measurement device.

Description

[Technical field]

[0001] The present invention relates to the technical field of, for example, a processing system for processing an object. [Background technology]

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges that such a processing system has is to appropriately process the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent Publication No. 2016 / 0375521A1 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, a measuring device that acquires information regarding the height of the surface of the object, and a distance change device that changes the distance between the material supply member and the surface based on the measurement results of the measuring device, wherein the distance change device changes the distance between the material supply member and the surface to be longer if the height of the surface is lower than a desired height, and changes the distance between the material supply member and the surface to be shorter if the height of the surface is higher than the desired height.

[0005] According to a second aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, a measuring device that acquires information regarding the height of the surface of the object, and a distance change device that changes the distance between the material supply member and the surface based on the measurement results of the measuring device.

[0006] According to a third aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, a measuring device that acquires information regarding the height of a surface of the object, and a direction changing device that changes the direction of the material supply member based on the measurement results of the measuring device.

[0007] According to a fourth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a modeling material to be irradiated by the energy beam, a measuring device that acquires information regarding the height of the surface of the object, and a material supply control device that changes the supply amount of the modeling material based on the measurement results of the measuring device.

[0008] According to a fifth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated with the energy beam, a measuring device that acquires information regarding the position of the surface of the object, and a material supply control device that controls the material supply member based on the measurement results of the measuring device.

[0009] According to a sixth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated with the energy beam, and a distance change device that changes the distance between the material supply member and the surface to be longer when the height of the surface of the object is lower than a desired height.

[0010] According to a seventh aspect, there is provided a processing system comprising: an irradiation system that irradiates an object with an energy beam; a material supply member that supplies a building material to be irradiated with the energy beam; and a concentration area changing device that, when the height of the surface of the object is lower than a desired height, changes the distance between the concentration area of ​​the building material supplied by the material supply member and the surface to be shorter.

[0011] According to an eighth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a modeling material to be irradiated with the energy beam, and a control device that controls so that a concentrated area of ​​the modeling material when the surface height of the object is lower than a desired height is positioned above the concentrated area when the surface height is higher than the desired height.

[0012] According to a ninth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated with the energy beam, a measuring device that acquires information regarding the position of the surface of the object, and a control device that controls the irradiation system to change the convergence position of the energy beam based on the measurement results of the measuring device.

[0013] According to a tenth aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, and a measurement device that acquires information regarding the height of the surface of the object, wherein the relative position of the final optical element of the irradiation system and the material supply member is variable.

[0014] According to an eleventh aspect, there is provided a processing system comprising an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, and a measuring device that acquires information regarding the height of the surface of the object, wherein the relative position between the measuring device and the material supply member is variable.

[0015] According to a twelfth aspect, there is provided an irradiation system that irradiates an object with an energy beam, a material supply member that supplies a building material to be irradiated by the energy beam, a measuring device that acquires information regarding the height of the surface of the object, and a processing system that changes the relative directional relationship between a final optical element of the irradiation system and the material supply member.

[0016] According to a thirteenth aspect, there is provided a processing system comprising an irradiation system which irradiates an object with an energy beam, a material supply member which supplies a building material to be irradiated with the energy beam, and a measurement light irradiation device which irradiates measurement light to obtain information regarding the height of the surface of the object, and in which the relative directional relationship between the measurement light irradiation device and the material supply member can be changed.

[0017] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a cross-sectional view showing a structure of a processing system according to a first embodiment. [Diagram 2] FIG. 2 is a system configuration diagram showing the system configuration of the machining system according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing a supply path of the modeling material M supplied from the material nozzle. [Figure 4] FIG. 4 is a cross-sectional view showing a plurality of measurement beams irradiated onto a measurement object having a plurality of surfaces with different heights. [Diagram 5] Each of FIGS. 5(a) to 5(c) is a plan view showing spots formed by a plurality of measurement beams on the surface of a measurement object. [Figure 6] Each of Figs. 6(a) to 6(e) is a cross-sectional view showing a state in which a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. [Figure 7] Each of Figures 7(a) to 7(c) is a cross-sectional view showing a process for forming a three-dimensional structure. [Figure 8] FIG. 8 is a cross-sectional view showing a material nozzle positioned so that the distance between the material nozzle and the printing surface (the distance between the concentrated region and the printing surface) is a reference distance. [Figure 9] FIG. 9 is a cross-sectional view showing a material nozzle positioned so that the distance between the material nozzle and the printing surface (the distance between the concentrated area and the printing surface) is longer than the reference distance. [Figure 10]FIG. 10 is a cross-sectional view showing a material nozzle positioned so that the distance between the material nozzle and the printing surface (the distance between the concentrated area and the printing surface) is shorter than a reference distance. [Figure 11] FIG. 11 is a graph showing the relationship between the height of the object (amount of object) and the distance between the material nozzle and the object surface (the distance between the concentrated area and the object surface). [Figure 12] FIG. 12 shows a new structural layer formed on a structural layer having an uneven surface, together with its shaping volume. [Figure 13] 13(a) and 13(b) are cross-sectional views showing a measurement light for acquiring information about the height of the printing surface during the period in which a structure layer is formed on the printing surface. [Figure 14] Each of FIG. 14(a) and FIG. 14(b) is a cross-sectional view showing a measurement light for acquiring information on the height of the structure layer during the period in which the structure layer is formed. [Figure 15] FIG. 15 is a plan view showing measurement light irradiated onto a plurality of different positions on the printing surface MS. [Figure 16] FIG. 16 is a system configuration diagram showing the system configuration of the machining system according to the second embodiment. [Figure 17] FIG. 17 is a plan view showing an example of an image displayed on the display. [Figure 18] FIG. 18(a) is a cross-sectional view showing the material nozzle before it rotates around an axis along at least one of the X-axis and Y-axis, and FIG. 18(b) is a cross-sectional view showing the material nozzle after it has rotated around an axis along at least one of the X-axis and Y-axis. [Figure 19] FIG. 19 is a system configuration diagram showing the system configuration of the machining system according to the fourth embodiment. [Figure 20] FIG. 20 is a graph showing the relationship between the height of the model (modeling amount) and the amount of modeling material supplied from the material nozzle. [Figure 21] FIG. 21 shows a new structural layer formed on a structural layer having an uneven surface, together with its shaping volume. [Figure 22]FIG. 22 is a cross-sectional view showing the structure of the processing system according to the fifth embodiment. [Figure 23] FIG. 23 is a system configuration diagram showing the system configuration of the machining system according to the fifth embodiment. [Figure 24] FIG. 24 is a cross-sectional view showing the structure of the processing system according to the sixth embodiment. [Diagram 25] FIG. 25 is a graph showing the relationship between the height of the object (amount of object) and the distance between the material nozzle and the object surface. [Figure 26] FIG. 26 shows a new structural layer formed on a structural layer having an uneven surface, together with its shaping volume. [Figure 27] FIG. 27 is a system configuration diagram showing the system configuration of the machining system according to the seventh embodiment. [Figure 28] FIG. 28 is a cross-sectional view showing the defocus amount corresponding to the distance between the modeling surface and the convergence position of the processing light. [Figure 29] FIG. 29 is a graph showing the relationship between the height of the object (modeling amount) and the defocus amount. [Diagram 30] FIG. 30 shows a new structural layer formed on a structural layer having an uneven surface, together with its shaping volume. [Diagram 31] FIG. 31 is a system configuration diagram showing the system configuration of the machining system according to the eighth embodiment. [Diagram 32] FIG. 32 is a perspective view showing a workpiece corresponding to an object (a pipe in the example shown in FIG. 32) with a part missing, broken or worn. [Diagram 33] FIG. 33 is a perspective view showing an original object W2 (a pipe in the example shown in FIG. 33) that is not chipped, damaged or worn. [Diagram 34] Figure 34 is an oblique view showing the three-dimensional shape of a three-dimensional structure ST to be formed by additional processing (i.e., the three-dimensional shape of the missing, damaged or worn part) calculated by calculating the difference between the three-dimensional shape of the object shown in Figure 32 and the three-dimensional shape of the original object shown in Figure 33. [Diagram 35]FIG. 35 is a perspective view of an object in which missing, broken or worn portions have been replaced by newly formed three-dimensional structures through additive processing. [Diagram 36] FIG. 36 is a perspective view showing a workpiece corresponding to an object in which a chipped, damaged or worn portion has been machined (removed in the example shown in FIG. 36). [Figure 37] FIG. 37 is a perspective view showing an object in which a missing, broken or worn portion has been removed and replaced with a newly formed three-dimensional structure through additive processing. [Figure 38] FIG. 38 is a perspective view showing an object to which a missing, damaged or worn portion has been removed and supplemented with a newly formed three-dimensional structure by additive processing, and to which a new structure has been added. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, a processing system SYS, which is one embodiment of the processing system, will be described with reference to the drawings. The processing system SYS of this embodiment is a processing system capable of forming a three-dimensional structure ST by performing additive processing. The processing system SYS can form a three-dimensional structure ST by performing additive processing based on, for example, a laser metal deposition (LMD) method. The laser metal deposition (LMD) method may also be called direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas-through-wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

[0020] In the following description, the positional relationship of various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, and essentially an up-down direction or the direction of gravity). Furthermore, the rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0021] (1) Structure of the machining system SYS of the first embodiment First, a machining system SYS according to a first embodiment (hereinafter, referred to as "machining system SYSa") will be described.

[0022] (1-1) Structure of the processing system SYSa First, the structure of the machining system SYSa of the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view showing an example of the structure of the machining system SYSa of the first embodiment. Fig. 2 is a system configuration diagram showing an example of the system configuration of the machining system SYSa of the first embodiment.

[0023] The processing system SYSa is capable of performing a modeling operation for forming a three-dimensional structure ST (i.e., a three-dimensional object having a size in any of the three-dimensional directions, i.e., a solid object, in other words, an object having a size in the X-axis direction, the Y-axis direction, and the Z-axis direction). The processing system SYSa is capable of forming the three-dimensional structure ST on a workpiece W, which is a base (i.e., a base material) for forming the three-dimensional structure ST. The processing system SYSa is capable of forming the three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is a stage 31 described later, the processing system SYSa is capable of forming the three-dimensional structure ST on the stage 31. When the workpiece W is an existing structure placed on the stage 31 (or placed on the stage 31), the processing system SYSa may be capable of forming the three-dimensional structure ST on the existing structure. In this case, the processing system SYSa may form the three-dimensional structure ST integrated with the existing structure. The operation of forming a three-dimensional structure ST integrated with an existing structure can be considered equivalent to the operation of adding a new structure to an existing structure. The existing structure may be, for example, a repair-required item having a missing part. The processing system SYSa may form a three-dimensional structure ST on the repair-required item so as to fill in the missing part of the repair-required item. Alternatively, the processing system SYSa may form a three-dimensional structure ST that can be separated from the existing structure. Note that FIG. 1 shows an example in which the workpiece W is an existing structure held by the stage 31. In the following, the explanation will be given using an example in which the workpiece W is an existing structure held by the stage 31.

[0024] As described above, the processing system SYSa can form a three-dimensional structure ST by the laser deposition welding method. In other words, the processing system SYSa can be said to be a 3D printer that forms an object using additive manufacturing technology. The additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0025] The processing system SYSa processes the modeling material M with the processing light EL to form a three-dimensional structure ST. The modeling material M is a material that can be melted by irradiation with the processing light EL of a predetermined intensity or more. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, other materials other than the metallic material and the resinous material may be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powdered granular material. However, the modeling material M does not have to be a powdered granular material. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0026] 1 and 2, in order to perform a modeling operation for forming a three-dimensional structure ST, the processing system SYSa includes a material supply source 1, a processing device 2, a stage device 3, a light source 4, a gas supply device 5, a housing 6, a measuring device 7, and a control device 8. At least a portion of each of the processing device 2, the stage device 3, and the measuring device 7 is accommodated in a chamber space 63IN inside the housing 6.

[0027] The material supply source 1 supplies the modeling material M to the processing device 2. The material supply source 1 supplies a desired amount of modeling material M according to a required amount so that the amount of modeling material M required per unit time to form a three-dimensional structure ST is supplied to the processing device 2.

[0028] The processing device 2 processes the modeling material M supplied from the material supply source 1 to form a three-dimensional structure ST. In order to form the three-dimensional structure ST, the processing device 2 includes a processing head 21, a head drive system 22, and a nozzle drive system 23. The processing head 21 further includes an irradiation optical system (irradiation system) 211, a material nozzle (i.e., a supply system that supplies the modeling material M, which may be referred to as a material supply member) 212, and a head housing 213. The processing head 21, the head drive system 22, and the nozzle drive system 23 are housed in a chamber space 63IN. However, at least a part of the processing head 21, the head drive system 22, and / or the nozzle drive system 23 may be disposed in an external space 64OUT, which is a space outside the housing 6. The external space 64OUT may be a space that an operator of the processing system SYSa can enter.

[0029] The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits the processing light EL via an optical transmission member 41 including at least one of an optical fiber and a light pipe. The irradiation optical system 211 emits the processing light EL propagated from the light source 4 via the optical transmission member 41. More specifically, the irradiation optical system 211 emits the processing light EL from a final optical element (in other words, a terminal optical element) 2112 included in the irradiation optical system 211. The final optical element 2112 is an optical element (i.e., an optical member) included in the irradiation optical system 211 that is closest to the workpiece W (in the example shown in FIG. 1, located closest to the -Z side). The irradiation optical system 211 irradiates the processing light EL from the irradiation optical system 211 downward (i.e., toward the -Z side). For this reason, the optical axis AX of the irradiation optical system 211 may be an axis along the Z axis. Below the irradiation optical system 211, a stage 31 is arranged. When the workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the workpiece W, which is an object, with the processing light EL. Specifically, the irradiation optical system 211 can irradiate the processing light EL to a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, focused) with the processing light EL. That is, the irradiation optical system 211 irradiates the processing light EL at a position where the target irradiation area EA is set. Furthermore, under the control of the control device 8, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated to the target irradiation area EA and a state in which the processing light EL is not irradiated to the target irradiation area EA. Note that the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to straight down (i.e., coinciding with the -Z axis direction), and may be, for example, a direction inclined by a predetermined angle with respect to the Z axis.

[0030] The irradiation optical system 211 is housed in a head housing 213. The irradiation optical system 211 is housed in the head housing 213 such that at least an emission port 2111 from which the processing light EL is emitted is exposed to the outside of the head housing 213.

[0031] The material nozzles 212 are attached to the head housing 213. In the first embodiment, three material nozzles 212 (however, in FIG. 1, only two material nozzles 212 are illustrated) are attached to the head housing 213. The three material nozzles 212 are attached to the head housing 213 so as to surround the optical axis AX of the irradiation optical system 211. However, two or less or four or more material nozzles 212 may be attached to the head housing 213.

[0032] The material nozzle 212 is formed with a material supply port 2121. The material nozzle 212 supplies (e.g., ejects, jets, spouts, or sprays) the modeling material M from the material supply port 2121. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and the conveying gas (i.e., a pressure-feed gas, for example, an inert gas containing at least one of nitrogen and argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. As the conveying gas, for example, a purge gas supplied from the gas supply device 5 is used. However, as the conveying gas, a gas supplied from a gas supply device other than the gas supply device 5 may be used. Although the material nozzle 212 is depicted in Fig. 1 as being tubular, the shape of the material nozzle 212 is not limited to this shape.

[0033] The material supply ports 2121 of the three material nozzles 212 face downward. The material supply ports 2121 of the three material nozzles 212 face different directions. For example, the material supply port 2121 of the first material nozzle 212 may face a first direction, the material supply port 2121 of the second material nozzle 212 may face a second direction, and the material supply port 2121 of the third material nozzle 212 may face a third direction. As shown in FIG. 3, which is a cross-sectional view showing the supply path of the modeling material M supplied from the material nozzle 212, the three material nozzles 212 are aligned so that the supply paths of the modeling material M from the three material supply ports 2121 facing different directions intersect in the concentration region CP. In other words, the three material nozzles 212 are aligned so that the modeling material M supplied from the three material supply ports 2121 facing different directions is supplied toward the concentration region CP.

[0034] In the example shown in FIG. 3, the concentration area CP is located below the surface (particularly, the upper surface, the same in the following paragraphs) of the workpiece W (i.e., a position away from the surface of the workpiece W on the -Z side). That is, in this embodiment, the processing system SYSa processes the workpiece W in a state in which the modeling material M supplied from the material nozzle 212 reaches the surface of the workpiece W (or the modeling surface MS described later) before actually reaching the concentration area CP. In this embodiment, the processing system SYSa processes the workpiece W in a state in which the concentration area CP is located below the surface of the workpiece W (or the modeling surface MS described later) (i.e., the modeling surface MS is located between the concentration area CP and the material nozzle 212). However, the concentration area CP may be located on the surface of the workpiece W. That is, the processing system SYSa may process the workpiece W in a state in which the modeling material M supplied from the material nozzle 212 reaches the surface of the workpiece W (or the modeling surface MS described later) at the same time as it reaches the concentration area CP. In this embodiment, the processing system SYSa may process the workpiece W in a state where the concentration area CP is located on the surface of the workpiece W (or on the printing surface MS described later). Alternatively, the concentration area CP may be located above the surface of the workpiece W (i.e., at a position away from the surface of the workpiece W on the +Z side). In other words, the processing system SYSa may process the workpiece W in a state where the printing material M supplied from the material nozzle 212 actually reaches the concentration area CP and then reaches the printing surface MS. In other words, in this embodiment, the processing system SYSa may process the workpiece W in a state where the concentration area CP is located above the printing surface MS (i.e., the concentration area CP is located between the printing surface MS and the material nozzle 212).

[0035] The material nozzle 212 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 212. The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W. Note that the traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined at a predetermined angle (an acute angle, as an example) with respect to the Z-axis direction, but may be toward the -Z side (i.e., directly below).

[0036] The processing system SYSa may supply the same type of modeling material M from the material supply ports 2121 of the three material nozzles 212. The processing system SYSa may supply different types of modeling materials M from the material supply ports 2121 of the three material nozzles 212.

[0037] The modeling material M supplied from the material nozzle 212 is irradiated with the processing light EL emitted by the irradiation optical system 211. As a result, the modeling material M melts. The processing system SYSa additionally processes the workpiece W using the molten modeling material M.

[0038] The head drive system 22 moves (i.e., moves) the processing head 21 (specifically, the head housing 213). For this reason, the head drive system 22 may be referred to as a moving device. The head drive system 22 moves the head housing 213, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Since the head housing 213 contains the irradiation optical system 211 and has the material nozzle 212 attached thereto, when the head drive system 22 moves the head housing 213, the irradiation optical system 211 and the material nozzle 212 also move. For this reason, the head drive system 22 may be considered to be a drive system that moves the irradiation optical system 211 and the material nozzle 212 simultaneously.

[0039] The nozzle drive system 23 moves (i.e., moves) the material nozzle 212. On the other hand, the nozzle drive system 23 does not move the irradiation optical system 211. In other words, the nozzle drive system 23 moves the material nozzle 212 relative to the irradiation optical system 211. The nozzle drive system 23 moves the material nozzle 212 separately from the irradiation optical system 211. The nozzle drive system 23 moves the material nozzle 212 independently of the irradiation optical system 211. For this reason, the nozzle drive system 23 differs from the head drive system 22, which moves the irradiation optical system 211 and the material nozzle 212 simultaneously, in that the nozzle drive system 23 can move the material nozzle 212 without moving the irradiation optical system 211. Since the nozzle drive system 23 moves the material nozzle 212, the material nozzle 212 is attached movably relative to the head housing 213.

[0040] The nozzle driving system 23 moves the material nozzle 212 along at least one of the X-axis, Y-axis, Z-axis, θX-direction, θY-direction, and θZ-direction, for example. In the first embodiment, the nozzle driving system 23 moves the material nozzle 212 along the Z-axis. When the material nozzle 212 moves along the Z-axis, the distance between the material nozzle 212 and the upper surface of the workpiece W (specifically, the distance along the Z-axis) changes. For this reason, the nozzle driving system 23 may be considered to function as a distance change device that changes the distance between the material nozzle 212 and the upper surface of the workpiece W. Furthermore, when the distance between the material nozzle 212 and the upper surface of the workpiece W changes, the distance between the concentration region CP where the modeling material M supplied from the material nozzle 212 is concentrated and the upper surface of the workpiece W (specifically, the distance along the Z-axis) changes. For this reason, the nozzle driving system 23 may be considered to function as a concentration region change device that changes the concentration region CP (specifically, changes the position of the concentration region CP, in other words, changes the distance between the concentration region CP and the upper surface of the workpiece W). The concentration region CP may be referred to as a concentration space. Furthermore, when the material nozzle 212 moves along the Z-axis, the relative position (for example, the relative position along the Z-axis) between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112) changes. For this reason, the nozzle drive system 23 may be considered to function as a device that changes the relative position between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112).

[0041] When the processing head 21 includes a plurality of material nozzles 212, the nozzle drive system 23 may move the plurality of material nozzles 212 together. That is, the nozzle drive system 23 may move the plurality of material nozzles 212 in the same movement manner. Alternatively, the nozzle drive system 23 may move at least one of the plurality of material nozzles 212 while not moving at least another of the plurality of material nozzles 212. Alternatively, the nozzle drive system 23 may move at least one of the plurality of material nozzles 212 in a first movement manner while moving at least another of the plurality of material nozzles 212 in a second movement manner different from the first movement manner.

[0042] The stage device 3 includes a stage 31. The stage 31 is accommodated in the chamber space 63IN. The workpiece W can be placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may include at least one of a mechanical chuck, an electrostatic chuck, and a vacuum chuck to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Since the stage 31 is accommodated in the chamber space 63IN, the workpiece W supported by the stage 31 is also accommodated in the chamber space 63IN. Furthermore, when the workpiece W is held, the stage 31 can release the held workpiece W. The above-mentioned irradiation optical system 211 irradiates the processing light EL during at least a part of the period during which the workpiece W is placed on the stage 31. Furthermore, the above-mentioned material nozzle 212 supplies the modeling material M during at least a portion of the period during which the workpiece W is placed on the stage 31.

[0043] The stage drive system 32 moves (i.e., moves) the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 32 moves the stage 31, the relative position between the processing head 21 and the stage 31 changes.

[0044] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulse lights (i.e., multiple pulse beams). The processing light EL may include continuous light (CW: Continuous Wave). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode). The laser light source may include at least one of a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp, etc.).

[0045] The gas supply device 5 is a supply source of purge gas for purging the chamber space 63IN. The purge gas includes an inert gas. Examples of the inert gas include at least one of nitrogen gas and argon gas. The gas supply device 5 is connected to the chamber space 63IN via a supply port 62 formed in the partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply device 5 and the supply port 62. The gas supply device 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged by the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply device 5 may be a cylinder in which an inert gas is stored. When the inert gas is nitrogen gas, the gas supply device 5 may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

[0046] As described above, when the material nozzle 212 supplies the modeling material M together with the purge gas, the gas supply device 5 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply source 1 is supplied in addition to the chamber space 63IN. Specifically, the gas supply device 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply device 5 and the mixer 12. As a result, the gas supply device 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply device 5 via the supply pipe 52. In other words, the gas supply device 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In that case, the material nozzle 212 supplies the modeling material M from the material supply port 2121 together with the purge gas for pressure-fed the modeling material M.

[0047] The housing 6 is a housing device that houses at least a part of each of the processing device 2 and the stage device 3 in a chamber space 63IN, which is an internal space of the housing 6. The housing 6 includes a partition member 61 that defines the chamber space 63IN. The partition member 61 is a member that separates the chamber space 63IN from an external space 64OUT of the housing 6. The partition member 61 faces the chamber space 63IN via its inner wall surface 611, and faces the external space 64OUT via its outer wall surface 612. In this case, the space surrounded by the partition member 61 (more specifically, the space surrounded by the inner wall surface 611 of the partition member 61) becomes the chamber space 63IN. The partition member 61 may be provided with a door that can be opened and closed. This door may be opened when the workpiece W is placed on the stage 31. The door may be opened when the workpiece W and / or the three-dimensional structure ST is removed from the stage 31. The door may be closed during the period when the molding operation and the processing operation are performed. An observation window (not shown) for visually checking the chamber space 63IN from the external space 64OUT of the housing 6 may be formed in the partition member 61.

[0048] The measuring device 7 can measure the measurement object placed on the stage 31. Specifically, the measuring device 7 can measure the position of the surface of the measurement object. That is, the measuring device 7 can obtain information on the position of the surface of the measurement object. Particularly in the first embodiment, the measuring device 7 can measure the position (so-called height) of the surface of the measurement object in the Z-axis direction. The measuring device 7 can obtain information on the position (so-called height) of the surface of the measurement object in the Z-axis direction. An example of the measurement object is the workpiece W. An example of the measurement object is a three-dimensional structure ST formed on the workpiece W. An example of the measurement object is a three-dimensional structure ST in the process of being formed (that is, a molded object that constitutes a part of the three-dimensional structure ST).

[0049] The measuring device 7 may be attached to the partition member 61 that defines the chamber space 63IN. The measuring device 7 may be attached to a structure in the chamber space 63IN that is independent of the partition member 61. The measuring device 7 may be attached to the head housing 213. When the measuring device 7 is attached to the head housing 213, it can be said that the measuring device 7 is disposed at a fixed position relative to the irradiation optical system 211 (for example, the final optical element 2112 thereof). When the measuring device 7 is attached to the head housing 213 in this manner, when the material nozzle 212 moves along the Z axis by the nozzle drive system 23 described above, the position of the material nozzle 212 with respect to the measuring device 7 changes. In other words, the relative position between the measuring device 7 and the material nozzle 212 may be variable.

[0050] The measuring device 7 may be any type of measuring device as long as it can measure the position of the measurement object. For example, the measuring device 7 may be equipped with a 3D scanner capable of three-dimensionally measuring the measurement object. For example, the measuring device 7 may be equipped with a stereo camera capable of three-dimensionally measuring the measurement object. For example, the measuring device 7 may be equipped with a measuring device capable of measuring the measurement object by irradiating the measurement object with measurement light via an irradiation optical system 211 for irradiating the workpiece W with processing light EL and detecting (i.e., receiving) the return light of the measurement light from the measurement object (e.g., at least one of reflected light and scattered light) via the irradiation optical system 211. For example, the measuring device 7 may be equipped with a measuring device capable of measuring the measurement object by irradiating the measurement object with measurement light and detecting (i.e., receiving) the return light of the measurement light from the measurement object (e.g., at least one of reflected light and scattered light). For example, the measuring device 7 may be equipped with a measuring device capable of measuring the measurement object by detecting (i.e., receiving) any light (e.g., at least one of reflected light and scattered light of environmental light) from the measurement object. For example, when the measurement object is a workpiece W, the measurement device 7 may include a measurement device capable of measuring the measurement object by detecting (i.e., receiving) any light from the workpiece W (e.g., at least one of reflected light of ambient light, scattered light of ambient light, and light from a molten pool MP described below). In the example shown in Figs. 1 and 2, the measurement device 7 irradiates a plurality of measurement light beams GL onto the surface of the measurement object, and measures the position of the measurement object based on the state of a plurality of spots formed by each of the plurality of measurement light beams GL on the surface of the measurement object. In this case, the measurement device 7 may include a plurality of measurement light emitting devices 71 and an imaging device 72.

[0051] The multiple measurement light emission devices 71 are attached to the head housing 213. That is, the multiple measurement light emission devices 71 may be disposed at a fixed position relative to the irradiation optical system 211 (particularly, the final optical element 2112) housed in the head housing 213. In this case, when the material nozzle 212 moves along the Z axis by the nozzle driving system 23 described above, the position of the material nozzle 212 with respect to each measurement light emission device 71 changes. That is, the relative position between each measurement light emission device 71 and the material nozzle 212 may be variable. Each measurement light emission device 71 emits measurement light GL toward a measurement object placed on the stage 31. That is, each measurement light emission device 71 emits measurement light GL downward from the processing head 21. The multiple measurement light emission devices 71 are aligned so that the multiple measurement light GL intersect at a certain position below the processing head 21. Incidentally, the measurement light emitting device 71 may be called an irradiation device or a measurement light irradiation device because it irradiates the measurement object with measurement light GL.

[0052] The imaging device 72 captures an image of a plurality of spots formed by the plurality of measurement light GL on the surface of the measurement object using a light receiving element 721 (in other words, an imaging element) which is an optical element that receives light from the measurement object (for example, return light of the plurality of measurement light GL). The state of the plurality of spots changes according to the position (height) of the surface of the measurement object. Specifically, as shown in FIG. 4, an example is assumed in which a plurality of measurement light GL is irradiated onto a measurement object having a plurality of surfaces CS (three surfaces CS#1, CS#2, and CS#3 in the example shown in FIG. 4) with different heights. In this case, the state of the plurality of spots on the surface CS#1 (see FIG. 5(a)), the state of the plurality of spots on the surface CS#2 (see FIG. 5(b)), and the state of the plurality of spots on the surface CS#3 (see FIG. 5(c)) are different from each other. Specifically, as shown in FIG. 5(a) to FIG. 5(c), the positional relationship of the plurality of spots is different. For example, in the example shown in FIG. 5(a) to FIG. 5(c), the plurality of measurement light GL intersects on the surface CS#1. In this case, as shown in FIG. 5(a), a single spot is formed on the surface CS#1 by overlapping a plurality of spots. On the other hand, when a plurality of measurement light beams GL intersect on the surface CS#1, the plurality of measurement light beams GL do not intersect on the surfaces CS#2 and CS#3 that are located at a different height from the surface CS#1. As a result, as shown in FIG. 5(b) to FIG. 5(c), a plurality of spots are formed on each of the surfaces CS#2 and CS#3. Furthermore, the distance between the plurality of spots becomes longer as the height of the surface CS based on the surface CS#1 becomes higher. In the example shown in FIG. 5(a) to FIG. 5(c), the distance between the plurality of spots formed on the surface CS#3 becomes longer than the distance between the plurality of spots formed on the surface CS#2 that is lower than the surface CS#3. Therefore, the image showing the state (particularly the positional relationship) of the plurality of spots captured by the imaging device 72 includes information on the position (height) of the surface of the measurement object. Therefore, the control device 8 can calculate the height of the surface of the measurement object based on the image captured by the imaging device 72. For example, the control device 8 may calculate the height of the measurement object based on an image captured by the imaging device 72.In this case, the image showing the state of the plurality of spots captured by the imaging device 72 may be considered to include information on the position (height) of the measurement object. For example, the control device 8 may calculate the ideal height of the measurement object (e.g., the height of the reference surface CS#1) based on the image captured by the imaging device 72. In this case, the image showing the state of the plurality of spots captured by the imaging device 72 may be considered to include information on the ideal height of the measurement object. For example, the control device 8 may calculate the difference between the ideal height of the measurement object (e.g., the height of the reference surface CS#1) and the actual height of the measurement object (e.g., the height of the surface CS#2 or #3) based on the image captured by the imaging device 72. In this case, the image showing the state of the plurality of spots captured by the imaging device 72 may be considered to include information on the difference between the ideal height of the measurement object (e.g., the height of the reference surface CS#1) and the actual height of the measurement object (e.g., the height of the surface CS#2 or #3).

[0053] The imaging device 72 may be attached to the head housing 213. That is, the imaging device 72 may be disposed at a fixed position relative to the irradiation optical system 211 (particularly, the final optical element 2112) housed in the head housing 213. In this case, when the material nozzle 212 moves along the Z axis by the nozzle drive system 23 described above, the position of the material nozzle 212 changes relative to the imaging device 72 (e.g., the light receiving element 721). That is, the relative position between the imaging device 72 (e.g., the light receiving element 721) and the material nozzle 212 may be variable. Note that, as described above, when the material nozzle 212 moves along the Z axis by the nozzle drive system 23, the relative position between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112) changes. For this reason, it may be considered that the relative position between the imaging device 72 (e.g., the light receiving element 721) and the material nozzle 212 changes due to the change in the relative position between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112).

[0054] The control device 8 controls the operation of the machining system SYSa. The control device 8 may include, for example, a calculation device and a storage device. The calculation device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 8 functions as a device that controls the operation of the machining system SYSa by the calculation device executing a computer program. This computer program is a computer program for making the calculation device perform (i.e., execute) the operation to be performed by the control device 8, which will be described later. In other words, this computer program is a computer program for making the control device 8 function so as to make the machining system SYSa perform the operation to be described later. The computer program executed by the calculation device may be recorded in a storage device (i.e., a recording medium) included in the control device 8, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 8 or externally attachable to the control device 8. Alternatively, the calculation device may download the computer program to be executed from a device external to the control device 8 via a network interface.

[0055] For example, the control device 8 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes a plurality of pulsed lights, the emission mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio between the length of the emission time of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 8 may control the movement mode of the processing head 21 by the head driving system 22. Furthermore, the control device 8 may control the movement mode of the material nozzle 212 by the nozzle driving system 23. The control device 8 may control the movement mode of the stage 31 by the stage driving system 32. The movement mode may include, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the control device 8 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply period).

[0056] The control device 8 may not be provided inside the processing system SYSa. For example, the control device 8 may be provided as a server or the like outside the processing system SYSa. In this case, the control device 8 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface, for example, at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB, may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark), for example, at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 8 and the processing system SYSa may be configured to be able to transmit and receive various information via the network. The control device 8 may also be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 8 via the network. The processing system SYSa may include a transmitting device (i.e., an output device that outputs information to the control device 8) that transmits information such as commands and control parameters to the control device 8 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 8 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 8 may be provided outside the processing system SYSa.

[0057] As a recording medium for recording the computer program executed by the control device 8, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), and other optical disks, magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 8 by the control device 8 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 8, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0058] (1-2) Operation of the Machining System SYSa of the First Embodiment Next, the operation of the processing system SYSa will be described. As described above, the processing system SYSa performs a modeling operation to form a three-dimensional structure ST by performing additional processing on the workpiece W. Furthermore, the processing system SYSa performs a nozzle moving operation to move the material nozzle 212 by controlling the nozzle driving system 23 based on the measurement result of the measuring device 7 during at least a part of the period during which the modeling operation is performed. Therefore, hereinafter, the modeling operation and the nozzle moving operation will be described in order.

[0059] (1-2-1) Modeling operation First, the modeling operation of the three-dimensional structure ST will be described. As described above, the processing system SYSa forms the three-dimensional structure ST by the laser build-up welding method. For this reason, the processing system SYSa may form the three-dimensional structure ST by performing an existing modeling operation conforming to the laser build-up welding method. Hereinafter, an example of the modeling operation for forming the three-dimensional structure ST using the laser build-up welding method will be briefly described.

[0060] The processing system SYSa forms a three-dimensional structure ST on the workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Measurement data of a solid object measured by at least one of a measuring device (not shown) provided in the processing system SYSa and a three-dimensional shape measuring device provided separately from the processing system SYSa may be used as the three-dimensional model data. In order to form the three-dimensional structure ST, the processing system SYSa sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYSa sequentially forms a plurality of structural layers SL one by one based on data of a plurality of layers obtained by slicing a model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST, which is a laminated structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, a flow of operations for forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

[0061] First, the operation of forming each structure layer SL will be described with reference to FIG. 6(a) to FIG. 6(e). Under the control of the control device 8, the processing system SYSa moves at least one of the processing head 21 and the stage 31 so that the target irradiation area EA is set in a desired area on the printing surface MS corresponding to the surface of the workpiece W or the surface of the already formed structure layer SL. After that, the processing system SYSa irradiates the processing light EL from the irradiation optical system 211 to the target irradiation area EA. At this time, the condensing surface on which the processing light EL is condensed in the Z-axis direction may coincide with the printing surface MS. Alternatively, the condensing surface may deviate from the printing surface MS in the Z-axis direction. As a result, as shown in FIG. 6(a), a molten pool (i.e., a pool of metal or the like melted by the processing light EL) MP is formed on the printing surface MS irradiated with the processing light EL. Furthermore, under the control of the control device 8, the processing system SYSa supplies the printing material M from the material nozzle 212. As a result, the printing material M is supplied to the molten pool MP. The modeling material M supplied to the molten pool MP is melted by the processing light EL irradiated onto the molten pool MP. Alternatively, the modeling material M supplied from the material nozzle 212 may be melted by the processing light EL before reaching the molten pool MP, and the molten modeling material M may be supplied to the molten pool MP. Thereafter, when the processing light EL is no longer irradiated onto the molten pool MP as at least one of the processing head 21 and the stage 31 moves, the molten modeling material M in the molten pool MP is cooled and solidified (i.e., solidified). As a result, as shown in FIG. 6(c), the solidified modeling material M is deposited on the modeling surface MS.

[0062] The processing system SYSa repeats a series of printing processes, including forming a molten pool MP by irradiating the processing light EL, supplying the printing material M to the molten pool MP, melting the supplied printing material M, and solidifying the molten printing material M, while moving the processing head 21 along at least one of the X-axis direction and the Y-axis direction relative to the printing surface MS, as shown in Fig. 6(d). At this time, the processing system SYSa irradiates the processing light EL to the area on the printing surface MS where a molded object is to be formed, while not irradiating the processing light EL to the area on the printing surface MS where a molded object is not to be formed. In other words, the processing system SYSa irradiates the printing surface MS with the processing light EL at a timing according to the distribution state of the area where a molded object is to be formed, while moving the target irradiation area EA along a predetermined movement trajectory on the printing surface MS. As a result, the molten pool MP also moves on the printing surface MS along a movement trajectory according to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is formed on the printing surface MS in a sequential manner in the area along the movement trajectory of the target irradiation area EA where the processing light is irradiated. As a result, as shown in FIG. 6(e), a structure layer SL corresponding to an assembly of objects made of the melted and then solidified molding material M is formed on the printing surface MS. That is, a structure layer SL corresponding to an assembly of objects formed on the printing surface MS in a pattern according to the movement trajectory of the molten pool MP (that is, a structure layer SL having a shape according to the movement trajectory of the molten pool MP in a plan view) is formed. Note that, when the target irradiation area EA is set in an area where a molded object is not desired to be formed, the processing system SYSa may irradiate the target irradiation area EA with the processing light EL and stop the supply of the molding material M. Also, when the target irradiation area EA is set in an area where a molded object is not desired to be formed, the processing system SYSa may supply the molding material M to the target irradiation area EA and irradiate the target irradiation area EA with the processing light EL having an intensity that does not allow the formation of a molten pool MP.

[0063] The processing system SYSa repeatedly performs an operation for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 8. Specifically, first, the control device 8 slices the three-dimensional model data at a layer pitch to create slice data before performing an operation for forming the structure layer SL. Then, the control device 8 generates recipe information indicating the operation content of the processing system SYSa for forming the three-dimensional structure ST based on the slice data. The recipe information may include, for example, information on the movement path of the processing head 21 by the head drive system 22 (so-called processing path information, information for controlling the movement of the irradiation optical system 211 that emits the processing light EL). The recipe information may include, for example, information on the timing at which the irradiation optical system 211 emits the processing light EL (i.e., information for controlling the operation of the light source 4 and / or the irradiation optical system 211 that emits the processing light EL). The recipe information may include, for example, information on the intensity of the processing light EL emitted by the irradiation optical system 211 (i.e., information for controlling the operation of the light source 4 and / or the irradiation optical system 211 that emits the processing light EL). The recipe information may be information that combines these pieces of information. Alternatively, in addition to or instead of generating the recipe information, the control device 8 may acquire recipe information generated by a device external to the processing system SYSa. The processing system SYSa performs an operation for forming the first structure layer SL#1 on the printing surface MS corresponding to the surface of the workpiece W based on the recipe information corresponding to the structure layer SL#1. That is, the processing system SYSa controls the head drive system 22 based on the recipe information to move the irradiation optical system 211, and controls the irradiation optical system 211 to emit the processing light EL having the desired intensity determined based on the recipe information at the desired timing determined based on the recipe information. As a result, the structure layer SL#1 is formed on the printing surface MS as shown in FIG. 7(a). After that, the processing system SYSa sets the surface (i.e., the upper surface) of the structure layer SL#1 to a new printing surface MS, and then forms the second structure layer SL#2 on the new printing surface MS.In order to form the structure layer SL#2, the control device 8 first controls at least one of the head drive system 22 and the stage drive system 32 so that the processing head 21 moves along the Z axis relative to the stage 31. Specifically, the control device 8 controls at least one of the head drive system 22 and the stage drive system 32 to move the processing head 21 toward the +Z side and / or move the stage 31 toward the -Z side so that the target irradiation area EA is set on the surface of the structure layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control device 8, the processing system SYSa forms the structure layer SL#2 on the structure layer SL#1 based on the recipe information corresponding to the structure layer SL#2 in the same operation as the operation of forming the structure layer SL#1. As a result, as shown in FIG. 7(b), the structure layer SL#2 is formed. Thereafter, the same operation is repeated until all the structure layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in FIG. 7(c), a three-dimensional structure ST is formed by a stacked structure in which a plurality of structure layers SL are stacked.

[0064] (1-2-2) Nozzle movement Next, the nozzle moving operation will be described. As described above, the nozzle moving operation is an operation of moving the material nozzle 212 by controlling the nozzle driving system 23 based on the measurement result of the measuring device 7 during at least a part of the period during which the above-mentioned modeling operation is being performed (i.e., controlling the material nozzle 212 based on the measurement result of the measuring device 7). As described above, when the material nozzle 212 moves, the distance between the material nozzle 212 and the upper surface of the workpiece W (specifically, the distance along the Z axis) changes. For this reason, the nozzle moving operation may be considered as an operation of changing the distance between the material nozzle 212 and the upper surface of the workpiece W (specifically, the distance along the Z axis) based on the measurement result of the measuring device 7. Also, as described above, when the material nozzle 212 moves, the distance (specifically, the distance along the Z axis) between the concentration region CP where the modeling material M supplied from the material nozzle 212 is concentrated and the upper surface of the workpiece W and the position of the concentration region CP change. Therefore, the nozzle moving operation may be considered to be an operation of changing the distance (specifically, the distance along the Z axis) between the concentration area CP and the upper surface of the workpiece W and the position of the concentration area CP based on the measurement result of the measuring device 7. Also, as described above, when the material nozzle 212 moves, the relative position (for example, the relative position along the Z axis) between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112) changes. Therefore, the nozzle moving operation may be considered to be an operation of changing the relative position (for example, the relative position along the Z axis) between the material nozzle 212 and the irradiation optical system 211 (particularly, the final optical element 2112) based on the measurement result of the measuring device 7. Also, as described above, when the material nozzle 212 moves, the relative position (for example, the relative position along the Z axis) between the measuring device 7 and the material nozzle 212 changes. Therefore, the nozzle moving operation may be considered to be an operation of changing the relative position (for example, the relative position along the Z axis) between the measuring device 7 and the material nozzle 212 based on the measurement result of the measuring device 7. Specifically, the nozzle movement operation may be considered to be an operation of changing the relative position (e.g., the relative position along the Z axis) between at least one of the multiple measurement light emitting devices 71 and the material nozzle 212 based on the measurement results of the measurement device 7.The nozzle moving operation may be considered to be an operation of changing the relative position (e.g., the relative position along the Z axis) between the imaging device 72 (e.g., its light receiving element 721) and the material nozzle 212 based on the measurement results of the measurement device 7.

[0065] In the first embodiment, the processing system SYSa controls the height of the object formed by the modeling operation by performing a nozzle moving operation under the control of the control device 8. Hereinafter, the technical reasons why the height of the object can be controlled by performing the nozzle moving operation will be described.

[0066] Specifically, as described above, the nozzle driving system 23 moves the material nozzle 212 along the Z axis. As a result, when the material nozzle 212 moves, the distance D1 between the material nozzle 212 and the printing surface MS (specifically, the distance along the Z axis) changes. The distance between the material nozzle 212 and the printing surface MS may mean the distance between the material supply port 2121 of the material nozzle 212 and the printing surface MS. Furthermore, when the material nozzle 212 moves along the Z axis, the concentration region CP in which the printing material M supplied from the material nozzle 212 is concentrated also moves along the Z axis. For this reason, it can be said that the nozzle driving system 23 changes the concentration region CP (specifically, changes the position of the concentration region CP) by moving the material nozzle 212. As a result, the distance D2 between the concentration region CP and the printing surface MS (specifically, the distance along the Z axis) changes. For example, FIG. 8 shows the material nozzle 212 positioned so that the distances D1 and D2 are the reference distances D10 and D20, respectively.

[0067] When the material nozzle 212 in the state shown in Fig. 8 moves toward the +Z side, the distance D1 changes to a distance D11 longer than the reference distance D10, and the distance D2 changes to a distance D21 shorter than the reference distance D20, as shown in Fig. 9. On the other hand, when the material nozzle 212 in the state shown in Fig. 8 moves toward the -Z side, the distance D1 changes to a distance D12 shorter than the reference distance D10, and the distance D2 changes to a distance D22 longer than the reference distance D20, as shown in Fig. 10.

[0068] Here, the shorter the distance D2 (i.e., the longer the distance D1), the greater the amount of the molding material M supplied to the molten pool MP. This is because the shorter the distance D2, the closer the concentrated region CP where the molding material M is concentrated is to the printing surface MS. The greater the amount of the molding material M supplied to the molten pool MP, the greater the amount of the molding material M melted in the molten pool MP. The greater the amount of the molding material M melted in the molten pool MP, the greater the amount of the molding material M solidified on the printing surface MS. As a result, the height of the object made of the solidified molding material M (i.e., the size along the Z-axis direction, hereinafter referred to as the "printing amount") becomes higher. For this reason, as shown in FIG. 11, there is a relationship between the distance D2 and the printing amount in that the shorter the distance D2, the greater the printing amount. In other words, there is a relationship between the distance D2 and the printing amount in that the longer the distance D2, the smaller the printing amount. 11, there is a relationship between the distance D1 and the printing amount such that the longer the distance D1, the greater the printing amount. In other words, there is a relationship between the distance D1 and the printing amount such that the shorter the distance D1, the smaller the printing amount.

[0069] 11 shows a graph in which the distance D2 is a positive distance when the concentration area CP is located above the printing surface MS, and is a negative distance when the concentration area CP is located below the printing surface MS. As described above, in this embodiment, the processing system SYSa processes the workpiece W in a state in which the concentration area CP is located below the printing surface MS (i.e., the printing surface MS is located between the concentration area CP and the material nozzle 212). For this reason, the distance D2 has a value within a range of an area (called a use area) smaller than zero. In this case, the relationship that the shorter the distance D2 is, the greater the printing amount means that the smaller the absolute value of the distance D2 is, the greater the printing amount is. Similarly, the relationship that the longer the distance D2 is, the smaller the printing amount is, means that the larger the absolute value of the distance D2 is, the smaller the printing amount is. For this reason, in the following description, unless otherwise specified, the distance D2 means the absolute value of the distance D2.

[0070] The processing system SYSa controls the amount of the object to be formed by performing a nozzle movement operation using the relationship that holds between the distance D2 (and further, the distance D1) and the amount of the object to be formed, under the control of the control device 8. In other words, the processing system SYSa controls the amount of the object to be formed by moving the material nozzle 212 so as to change the distance D2.

[0071] For example, when the processing system SYSa wants to increase the actual printing amount compared to the printing amount when the distance D2 is the reference distance D20 (hereinafter referred to as the “reference printing amount”), the processing system SYSa may move the material nozzle 212 so that the distance D2 is shorter than the reference distance D20. In other words, when the processing system SYSa wants to increase the actual printing amount compared to the reference printing amount when the distance D1 is the reference distance D10, the processing system SYSa may move the material nozzle 212 so that the distance D1 is longer than the reference distance D10. In other words, the processing system SYSa may increase the actual printing amount more than the reference printing amount by moving the material nozzle 212 so that the distance D2 is shorter than the reference distance D20 (i.e., the distance D1 is longer than the reference distance D10).

[0072] For example, when the processing system SYSa wants to reduce the actual printing amount compared to the reference printing amount when the distance D2 is the reference distance D20, the processing system SYSa may move the material nozzle 212 so that the distance D2 is longer than the reference distance D20. In other words, when the processing system SYSa wants to reduce the actual printing amount compared to the reference printing amount when the distance D1 is the reference distance D10, the processing system SYSa may move the material nozzle 212 so that the distance D1 is shorter than the reference distance D10. In other words, the processing system SYSa may reduce the actual printing amount to be less than the reference printing amount by moving the material nozzle 212 so that the distance D2 is longer than the reference distance D20 (i.e., the distance D1 is shorter than the reference distance D10).

[0073] 9 and 10 show an example in which the multiple material nozzles 212 move in the same direction by the same movement amount. That is, FIG. 9 and FIG. 10 show an example in which the multiple material nozzles 212 move in the same movement manner. However, the nozzle drive system 23 may move at least one of the multiple material nozzles 212 while not moving at least one other of the multiple material nozzles 212. Even in this case, the distance D2 still changes because at least one material nozzle 212 is moving. Alternatively, the nozzle drive system 23 may move at least one of the multiple material nozzles 212 in a first movement manner while moving at least one other of the multiple material nozzles 212 in a second movement manner different from the first movement manner. For example, the nozzle drive system 23 may move at least one of the multiple material nozzles 212 by a first movement amount while moving at least one other of the multiple material nozzles 212 by a second movement amount different from the first movement amount. In other words, the nozzle drive system 23 may move the multiple material nozzles 212 so that the movement amounts of the multiple material nozzles 212 are different. Even in this case, the distance D2 still changes because at least one material nozzle 212 is moving.

[0074] An example of a situation in which the printing amount is changed from the reference printing amount is a situation in which a new structural layer SL having a flat surface is formed on a printing surface MS having an uneven surface. For example, the first row (topmost diagram) of FIG. 12 shows a structural layer SL#n (n is an integer equal to or greater than 1) having an uneven surface. When a new structural layer SL#n+1 is formed on such a structural layer SL#n, the surface of the structural layer SL#n is set as the printing surface MS. As a result, the printing surface MS becomes an uneven surface. In the example shown in FIG. 12, the printing surface MS includes a printing surface MS#1, a printing surface MS#2 located at a higher position (i.e., on the +Z side, the same below) than the printing surface MS#1, a printing surface MS#3 located at a lower position (i.e., on the -Z side, the same below) than the printing surface MS#1, and a printing surface MS#4 located at the same height as the printing surface MS#1. In this case, in order to flatten the surface of the newly formed structure layer SL#n+1, the processing system SYSa may perform a nozzle movement operation to make the height of the object formed on the printing surface MS#2 lower than the height of the object formed on the printing surfaces MS#1 and MS#4, and to make the height of the object formed on the printing surface MS#3 higher than the height of the object formed on the printing surfaces MS#1 and MS#4. In other words, the processing system SYSa may perform a nozzle movement operation to make the printing amount on the printing surface MS#2 smaller than the printing amount on the printing surfaces MS#1 and MS#4, and to make the printing amount on the printing surface MS#3 larger than the printing amount on the printing surfaces MS#1 and MS#4.

[0075] Specifically, as shown in the second row of Fig. 12, the processing system SYSa may move the material nozzle 212 so that the distance D1 between the printing surface MS#2 and the material nozzle 212 during the period when a model is formed on the printing surface MS#2 is shorter than the distance D1 between the printing surfaces MS#1 and #4 and the material nozzle 212 during the period when a model is formed on the printing surfaces MS#1 and #4. In other words, as shown in the third row of Fig. 12, the processing system SYSa may move the material nozzle 212 so that the distance D2 between the printing surface MS#2 and the concentration region CP during the period when a model is formed on the printing surface MS#2 is longer than the distance D2 between the printing surfaces MS#1 and #4 and the concentration region CP during the period when a model is formed on the printing surfaces MS#1 and #4. In other words, the processing system SYSa may move the material nozzle 212 so that the concentration area CP during the period when an object is formed on the printing surface MS#2 is located below the concentration area CP during the period when an object is formed on the printing surfaces MS#1 and #4 (and further, the concentration area CP during the period when an object is formed on the printing surface MS#3). As a result, as shown in the fourth graph in FIG. 12, the printing amount on the printing surface MS#2 is less than the printing amount on the printing surfaces MS#1 and MS#4.

[0076] As shown in the second row of Fig. 12, the processing system SYSa may move the material nozzle 212 so that the distance D1 between the printing surface MS#3 and the material nozzle 212 during the period when a model is formed on the printing surface MS#3 is longer than the distance D1 between the printing surfaces MS#1 and #4 and the material nozzle 212 during the period when a model is formed on the printing surfaces MS#1 and #4. In other words, as shown in the third row of Fig. 12, the processing system SYSa may move the material nozzle 212 so that the distance D2 between the printing surface MS#3 and the concentration region CP during the period when a model is formed on the printing surface MS#3 is shorter than the distance D2 between the printing surfaces MS#1 and #4 and the concentration region CP during the period when a model is formed on the printing surfaces MS#1 and #4. In other words, the processing system SYSa may move the material nozzle 212 so that the concentration area CP during the period when an object is formed on the printing surface MS#3 is positioned above the concentration area CP during the period when an object is formed on the printing surfaces MS#1 and #4 (and further, the concentration area CP during the period when an object is formed on the printing surface MS#2). As a result, as shown in the fourth graph in FIG. 12, the printing amount on the printing surface MS#3 is greater than the printing amount on the printing surfaces MS#1 and MS#4.

[0077] As a result, the surface (particularly, the upper surface) of the structure layer SL#n+1 newly formed on the uneven printing surface MS becomes flat, as shown in the fifth row of Fig. 12. More specifically, the flatness of the surface (particularly, the upper surface) of the structure layer SL#n+1 newly formed on the uneven printing surface MS becomes greater than the flatness of the surface (particularly, the upper surface) of the structure layer SL#n+1 formed when the nozzle movement operation is not performed.

[0078] When performing a nozzle movement operation when forming a new structure layer SL#n+1 on the uneven printing surface MS, the processing system SYSa uses the measurement device 7 to acquire information on the height of the printing surface MS (i.e., the surface of the structure layer SL#n). In this case, the processing system SYSa may acquire information on the height of the printing surface MS corresponding to the surface of the structure layer SL#n during the period in which the structure layer SL#n+1 is formed. Specifically, as shown in FIG. 13(a), the processing system SYSa may irradiate a second portion MSA#12 on the printing surface MS, which is different from the first portion MSA#11, with the measurement light GL during the period in which the processing light EL is irradiated to the first portion MSA#11 on the printing surface MS. The second portion MSA#12 may be a portion located forward of the first portion MSA#11 (i.e., forward of the molten pool MP and the target irradiation area EA) in the movement direction of the irradiation optical system 211 in the printing operation (i.e., the movement direction determined by the recipe information and along at least one of the X-axis direction and the Y-axis direction). In this case, the second part MSA#12 corresponds to a part where a structure constituting another part of the structural layer SL#n+1 is formed after the structure constituting a part of the structural layer SL#n+1 is formed in the first part MSA#11. As a result, the processing system SYSa can obtain information on the height of the second part MSA#12 where the structure is to be formed later, while forming the structure in the first part MSA#11.

[0079] 13(b), the processing system SYSa performs a nozzle movement operation based on information on the height of the second part MSA#12 acquired in advance during a period in which the second part MSA#12 is irradiated with the processing light EL in order to form a modeling object in the second part MSA#12. That is, during a period in which the processing system SYSa irradiates the second part MSA#12 with the processing light EL, the processing system SYSa moves the material nozzle 212 based on information on the height of the second part MSA#12 so that the modeling amount in the second part MSA#12 becomes a desired amount determined according to the height of the second part MSA#12. Note that, during a period in which the processing light EL is irradiated to the second part MSA#12 on the modeling surface MS, the processing system SYSa may irradiate the measurement light GL to a third part MSA#13 on the modeling surface MS that is different from the second part MSA#12 (for example, a part located forward of the second part MSA#12 in the movement direction of the irradiation optical system 211).

[0080] Alternatively, the processing system SYSa may irradiate the first portion MSA#11 with the measurement light GL during the period in which the processing light EL is irradiated to the first portion MSA#11 on the printing surface MS. In other words, the processing system SYSa may irradiate the measurement light GL to the portion where the molten pool MP is formed. In this case, the processing system SYSa may acquire information about the height of the first portion MSA#11 while irradiating the first portion MSA#11 with the processing light EL, and move the material nozzle 212 based on the acquired information about the height of the first portion MSA#11.

[0081] Alternatively, the processing system SYSa may acquire information on the height of the surface of the structural layer SL#n, the surface of which is to be set on the printing surface MS when the structural layer SL#n+1 is formed, during the period in which the structural layer SL#n, the surface of which is to be set on the printing surface MS when the structural layer SL#n+1 is formed, is being formed. Specifically, as shown in FIG. 14(a), the processing system SYSa irradiates the printing surface MS, which corresponds to the surface of the structural layer SL#n-1, with the processing light EL in order to form the structural layer SL#n. In this case, the processing system SYSa may irradiate the measurement light GL to the model SM#22, which is formed as part of the structural layer SL#n, on the second part MSA#22, which is different from the first part MSA#21, on the printing surface MS, during the period in which the processing light EL is irradiated on the first part MSA#21 on the printing surface MS. The second part MSA#22 may be a part located behind the first part MSA#21 (i.e., behind the molten pool MP and the target irradiation area EA) in the movement direction of the irradiation optical system 211 in the printing operation. In this case, the second part MSA#22 corresponds to a part on which the structure object SM#22 constituting another part of the structure layer SL#n has already been formed before the structure object constituting one part of the structure layer SL#n is formed in the first part MSA#21. As a result, while forming the structure object in the first part MSA#21, the processing system SYSa can obtain information on the height of the structure object SM#22 that will become the modeling surface MS when the structure layer SL#n+1 is later formed.

[0082] 14(b), after completing the formation of the structure layer SL#n, the processing system SYSa sets the surface of the structure layer SL#n as a new printing surface MS and starts forming the structure layer SL#n+1. In this case, during the period in which the processing system SYSa irradiates the third part MSA#23, which corresponds to the surface of the object SM#22 of the new printing surface MS, with the processing light EL to form an object on the third part MSA#23, the third part MSA#23 corresponds to the surface of the object SM#22, the processing system SYSa performs a nozzle movement operation based on information on the height of the object SM#22 (i.e., information on the height of the third part MSA#23) that has been acquired in advance. In other words, when irradiating the third part MSA#23 with the processing light EL, the processing system SYSa moves the material nozzle 212 based on information on the height of the third part MSA#23 so that the amount of the object to be printed on the third part MSA#23 becomes a desired amount determined according to the height of the third part MSA#23.

[0083] As described above, when the measurement light GL is irradiated to a portion located forward or backward of the portion irradiated with the processing light EL in the moving direction of the irradiation optical system 211 (i.e., the molten pool MP and the target irradiation area EA), the moving direction of the irradiation optical system 211 may change. In this case, if the irradiation position of the measurement light GL and the irradiation position of the processing light EL are fixed in a plane along the XY plane, the machining system SYSa may not be able to irradiate the measurement light GL to a portion located forward or backward of the molten pool MP and the target irradiation area EA in the moving direction of the irradiation optical system 211. Specifically, when the irradiation optical system 211 moves along a first moving direction, the machining system SYSa can irradiate the measurement light GL to a portion located forward or backward of the molten pool MP and the target irradiation area EA in the moving direction of the irradiation optical system 211, while when the irradiation optical system 211 moves along a second moving direction intersecting the first moving direction, the machining system SYSa may not be able to irradiate the measurement light GL to a portion located forward or backward of the molten pool MP and the target irradiation area EA in the moving direction of the irradiation optical system 211. Therefore, the processing system SYSa may include a plurality of emission device groups including a plurality of measurement light emission devices 71 that respectively irradiate a plurality of intersecting measurement light beams GL. The plurality of emission device groups are arranged such that a position where the measurement light beams GL emitted from one emission device group intersect and a position where the measurement light beams GL emitted from another emission device group intersect are different along at least one of the X-axis direction and the Y-axis direction.For example, as shown in FIG. 15 , the machining system SYSa includes: (i) a first emission device group including a plurality of measurement light emission devices 71 each emitting a plurality of measurement light beams GL#1 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the -Y side and the -X side; (ii) a second emission device group including a plurality of measurement light emission devices 71 each emitting a plurality of measurement light beams GL#2 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the -X side; (iii) a third emission device group including a plurality of measurement light emission devices 71 each emitting a plurality of measurement light beams GL#3 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the -Y side and the +X side; and (iv) a fourth emission device group including a plurality of measurement light emission devices 71 each emitting a plurality of measurement light beams GL#4 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the -X side. the first and second injection device groups including a plurality of measurement light emitting devices 71 that emit a plurality of measurement light beams GL#5 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the +X side; (v) a fifth injection device group including a plurality of measurement light emitting devices 71 that emit a plurality of measurement light beams GL#5 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the +X side; (vi) a sixth injection device group including a plurality of measurement light emitting devices 71 that emit a plurality of measurement light beams GL#6 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the +Y side and the -X side; (vii) a seventh injection device group including a plurality of measurement light emitting devices 71 that emit a plurality of measurement light beams GL#7 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the +Y side; and (viii) an eighth injection device group including a plurality of measurement light emitting devices 71 that emit a plurality of measurement light beams GL#8 that intersect at positions away from the molten pool MP and the target irradiation area EA toward the +Y side and the +X side. In this case, even if the moving direction of the irradiation optical system 211 changes, the machining system SYSa can irradiate the measurement light GL to a portion located forward or backward of the molten pool MP and the target irradiation area EA in the moving direction. Alternatively, the measurement light emitting device 71 may change the irradiation position of the measurement light GL. For example, the measurement light emitting device 71 may change the irradiation position of the measurement light GL so that the measurement light GL is irradiated to a portion located forward or backward of the molten pool MP and the target irradiation area EA in the moving direction of the irradiation optical system 211.

[0084] (1-3) Technical Effects of the Machining System SYSa of the First Embodiment As described above, the processing system SYSa can control the amount of fabrication (and thus the height of the structure layer SL) by performing the nozzle movement operation. Therefore, the processing system SYSa can appropriately form a three-dimensional structure ST having a desired shape and size.

[0085] In particular, the processing system SYSa can control the modeling amount (and thus the height of the structure layer SL) by moving the material nozzle 212 independently of the irradiation optical system 211. Therefore, the processing system SYSa can perform the modeling operation without changing the recipe information, even when the nozzle movement operation is performed during at least a part of the period during which the modeling operation is performed. Therefore, the processing system SYSa can control the modeling amount (and thus the height of the structure layer SL) by performing the nozzle movement operation without affecting the modeling operation.

[0086] (2) Machining system SYS of the second embodiment Next, a machining system SYS according to a second embodiment (hereinafter, referred to as "machining system SYSb") will be described with reference to Fig. 16. Fig. 16 is a system configuration diagram showing the system configuration of the machining system SYSb according to the second embodiment.

[0087] 16, the processing system SYSb of the second embodiment is different from the processing system SYSa of the first embodiment described above in that the processing system SYSb includes a display 9b. Other features of the processing system SYSb may be the same as other features of the processing system SYSa.

[0088] The display 9b is a display device capable of displaying a desired image under the control of the control device 8. In the second embodiment, the display 9b may display an image including information about the modeling operation. For example, as shown in FIG. 17, which is a plan view showing an example of an image displayed by the display 9b, when a modeling operation for forming a structural layer SL#n+1 on a structural layer SL#n is performed, the display 9b may display an image including information about the position of the structural layer SL#n+1 formed by additional processing. That is, the display 9b may display an image including information about the position where the additional processing was performed on the modeling surface MS to form the structural layer SL#n+1. In the example shown in FIG. 17, the display 9b displays an image showing the formed structural layer SL#n+1 by a hatched area as an image including information about the position where the additional processing was performed (that is, information about the position of the structural layer SL#n+1).

[0089] The display 9b may display an image including information about the nozzle movement operation. For example, the nozzle movement operation changes the distance D2 between the concentration region CP and the printing surface MS when each part of the structure layer SL#n+1 is formed (and further, the distance D1 between the material nozzle 212 and the printing surface MS). In this case, the display 9b may display an image showing information about the position where the additional processing is performed in a display mode according to the difference in the distance D2 (or the distance D1) when the additional processing is performed. For example, the display 9b may display, in different display modes, the first part SLp1 formed in the structure layer SL#n+1 with the distance D2 being the reference distance D20, the second part SLp2 formed in the structure layer SL#n+1 with the distance D2 being the distance D21, and the third part SLp3 formed in the structure layer SL#n+1 with the distance D2 being the distance D22. In the example shown in Figure 17, the display 9b displays an image including information about the position where additional processing was performed (i.e., information about the position of structural layer SL#n+1) so that the type of hatching indicating the first portion SLp1, the type of hatching indicating the second portion SLp2, and the type of hatching indicating the third portion SLp3 are different.

[0090] Alternatively, for example, in addition to or instead of displaying each portion of the structural layer SL#n+1 in a different display mode, the display 9b may display information indicating the distance D2 (or the distance D1) when each portion is formed together with each portion of the structural layer SL#n+1. Specifically, for example, as shown in Fig. 17, the display 9b may display numerical information indicating that the distance D2 when the first portion SLp1 was formed together with the first portion SLp1 was the reference distance D20, display numerical information indicating that the distance D2 when the second portion SLp2 was formed together with the second portion SLp2 was the distance D21, and display numerical information indicating that the distance D2 when the third portion SLp3 was formed together with the third portion SLp3 was the distance D22.

[0091] The processing system SYSb of the second embodiment can achieve the same effects as those achieved by the processing system SYSa of the first embodiment described above. Furthermore, the processing system SYSb can display an image including at least one of information on the modeling operation and information on the nozzle movement operation. Therefore, the processing system SYSb can present at least one of information on the modeling operation and information on the nozzle movement operation to the operator of the processing system SYSb. For example, the processing system SYSb can present to the operator the position at which a modeled object is formed in a state in which the height of the material nozzle 212 from the modeling surface MS is changed by the nozzle movement operation.

[0092] In addition, the processing system SYSb may include an output device capable of outputting any information in addition to or instead of the display 9b. The output device may be capable of outputting at least one of information related to the modeling operation and information related to the nozzle moving operation. An example of the output device is at least one of a speaker that outputs any information as sound and a printer that outputs a paper medium on which any information is printed.

[0093] (3) Machining system SYS of the third embodiment Next, a processing system SYS of a third embodiment (hereinafter, referred to as "processing system SYSc") will be described. The processing system SYSc of the third embodiment is different from the processing system SYSa of the first embodiment described above in that the nozzle drive system 23 moves the material nozzle 212 along at least one of the θX direction and the θY direction in addition to or instead of moving the material nozzle 212 along the Z axis. That is, the processing system SYSc is different from the processing system SYSa in that the nozzle drive system 23 rotates the material nozzle 212 around a rotation axis along at least one of the X axis and the Y axis. The processing system SYSc is different from the processing system SYSa in that the nozzle movement operation rotates the material nozzle 212 around a rotation axis along at least one of the X axis and the Y axis in addition to or instead of a nozzle movement operation that moves the material nozzle 212 along the Z axis. Other features of the processing system SYSc may be the same as other features of the processing system SYSc. The nozzle moving operation of rotating the material nozzle 212 around the rotation axis may be referred to as a nozzle rotation moving operation.

[0094] When the material nozzle 212 rotates around a rotation axis along at least one of the X-axis and the Y-axis, the distance D2 between the concentration region CP and the printing surface MS changes, similar to when the material nozzle 212 moves along the Z-axis. The technical reason for this will be explained with reference to Figures 18(a) and 18(b). Figure 18(a) is a cross-sectional view showing the material nozzle 212 before rotating around a rotation axis along at least one of the X-axis and the Y-axis, and Figure 18(b) is a cross-sectional view showing the material nozzle 212 after rotating around a rotation axis along at least one of the X-axis and the Y-axis (the X-axis in the example shown in Figure 18(b)).

[0095] As shown in FIG. 18(a) and FIG. 18(b), when the material nozzle 212 rotates around a rotation axis along at least one of the X-axis and the Y-axis, the direction of the material nozzle 212 (i.e., the direction in which the material nozzle 212 faces, more specifically, the direction in which the material supply port 2121 faces) changes. For example, the direction of the material nozzle 212 with respect to the irradiation optical system 211 (e.g., the final optical element 2112) changes. For example, the relative directional relationship between the irradiation optical system 211 (e.g., the final optical element 2112) and the material nozzle 212 (i.e., the relative relationship between the direction in which the irradiation optical system 211 (e.g., the final optical element 2112) faces and the direction in which the material nozzle 212 faces) changes. For example, the direction of the material nozzle 212 with respect to the measurement device 7 (e.g., at least one of the measurement light emitting device 71 and the imaging device 72) changes. For example, the relative directional relationship between the measuring device 7 (e.g., at least one of the measuring light emitting device 71 and the imaging device 72) and the material nozzle 212 (i.e., the relative relationship between the direction in which the measuring device 7 (e.g., at least one of the measuring light emitting device 71 and the imaging device 72) faces and the direction in which the material nozzle 212 faces) changes. For this reason, in the third embodiment, the nozzle drive system 23 may be considered to function as a direction changing device that changes the direction of the material nozzle 212. When the direction of the material nozzle 212 changes, the supply direction of the modeling material M from the material nozzle 212 changes. When the supply direction of the modeling material M from the material nozzle 212 changes, the position of the concentration region CP where the modeling material M supplied from the material supply port 2121 of the multiple material nozzles 212 is concentrated changes. In the example shown in Figures 18(a) and 18(b), the material nozzle 212 is rotated so that the angle θ between the axis along the supply direction of the modeling material M from the material nozzle 212 and the Z axis becomes larger. In this case, the position of the concentration region CP changes so as to approach the printing surface MS. That is, the distance D2 between the concentration region CP and the printing surface MS changes from the distance D23 shown in Fig. 18(a) to the distance D24 shown in Fig. 18(b), which is shorter than the distance D23.18(a) and 18(b), when the material nozzle 212 rotates so that the angle θ between the axis along the supply direction of the modeling material M from the material nozzle 212 and the Z axis becomes smaller, the position of the concentration region CP moves away from the modeling surface MS. In other words, the distance D2 between the concentration region CP and the modeling surface MS changes from the distance D23 to a distance longer than the distance D23.

[0096] As already explained in the first embodiment, there is a relationship between the distance D2 and the amount of object formed, in that the shorter the distance D2, the greater the amount of object formed. For this reason, like the processing system SYSa of the first embodiment, the processing system SYSc of the third embodiment can control the amount of object formed by changing the direction of the material nozzle 212 so as to change the distance D2. As a result, the processing system SYSb of the second embodiment can obtain the same effects as those obtainable by the processing system SYSb of the first embodiment described above.

[0097] 18(a) and 18(b) show an example in which the multiple material nozzles 212 rotate in opposite directions by the same rotation amount (i.e., the signs of the rotation angles are opposite and the absolute values ​​are equal). However, the nozzle drive system 23 may change the direction of at least one of the multiple material nozzles 212 while not changing the direction of at least one other of the multiple material nozzles 212. Even in this case, the distance D2 still changes because the direction of at least one material nozzle 212 is changed. Alternatively, the nozzle drive system 23 may change the direction of at least one of the multiple material nozzles 212 in a first change manner while changing the direction of at least one other of the multiple material nozzles 212 in a second change manner different from the first change manner. For example, the nozzle drive system 23 may rotate at least one of the multiple material nozzles 212 by a first rotation amount while rotating at least one other of the multiple material nozzles 212 by a second rotation amount different from the first rotation amount. In other words, the nozzle drive system 23 may change the directions of the multiple material nozzles 212 so that the amount of change in direction differs for the multiple material nozzles 212. Even in this case, the distance D2 still changes because the direction of at least one material nozzle 212 is changed.

[0098] Furthermore, the machining system SYSb of the second embodiment described above may have components specific to the machining system SYSc of the third embodiment. The components specific to the machining system SYSc of the third embodiment may include, for example, components related to a nozzle moving operation for changing the direction of the material nozzle 212.

[0099] (4) Machining system SYS of the fourth embodiment Next, a processing system SYS of a fourth embodiment (hereinafter, referred to as "processing system SYSd") will be described. The processing system SYSd of the fourth embodiment is different from the processing system SYSa of the first embodiment described above in that, in addition to or instead of performing a nozzle moving operation for moving the material nozzle 212 based on the measurement result of the measuring device 7, the processing system SYSd performs a supply amount control operation for controlling the supply amount (specifically, the supply amount per unit time) of the modeling material M from the material nozzle 212 based on the measurement result of the measuring device 7, thereby controlling the modeling amount (and thus the height of the structure layer SL). When the processing system SYSd does not perform a nozzle moving operation, as shown in FIG. 19 showing an example of the system configuration of the processing system SYSd, the processing system SYSd may not be provided with a nozzle driving system 23. Other features of the processing system SYSd may be the same as other features of the processing system SYSa.

[0100] The supply amount of the modeling material M from the material nozzle 212 affects the modeling amount. Specifically, the greater the supply amount of the modeling material M from the material nozzle 212, the greater the amount of the modeling material M supplied to the molten pool MP. The greater the amount of the modeling material M supplied to the molten pool MP, the greater the amount of the modeling material M melted in the molten pool MP. The greater the amount of the modeling material M melted in the molten pool MP, the greater the amount of the modeling material M solidified on the modeling surface MS. As a result, the height of the model made of the solidified modeling material M (i.e., the size along the Z-axis direction, the modeling amount) becomes higher. For this reason, as shown in FIG. 20, there is a relationship between the supply amount of the modeling material M and the modeling amount such that the greater the supply amount of the modeling material M, the greater the modeling amount. In other words, there is a relationship between the supply amount of the modeling material M and the modeling amount such that the smaller the supply amount of the modeling material M, the smaller the modeling amount.

[0101] The processing system SYSd controls the amount of the modeling object by performing a supply amount control operation using the relationship that exists between the supply amount of the modeling material M and the modeling amount under the control of the control device 8. In other words, the processing system SYSd controls the amount of the modeling object by controlling the supply amount of the modeling material M based on the measurement result of the measuring device 7.

[0102] As an example, a supply amount control operation performed when a new structure layer SL having a flat surface is formed on an uneven printing surface MS will be described. For example, the first row (topmost diagram) of FIG. 21 illustrates a printing surface MS including printing surfaces MS#1 to MS#4 shown in FIG. 12. In this case, in order to flatten the surface of the newly formed structure layer SL#n+1, the processing system SYSd may perform the supply amount control operation to make the height of the object formed on the printing surface MS#2 lower than the height of the object formed on the printing surfaces MS#1 and MS#4, and to make the height of the object formed on the printing surface MS#3 higher than the height of the object formed on the printing surfaces MS#1 and MS#4. In other words, the processing system SYSd may perform the supply amount control operation to make the printing amount on the printing surface MS#2 smaller than the printing amount on the printing surfaces MS#1 and MS#4, and to make the printing amount on the printing surface MS#3 larger than the printing amount on the printing surfaces MS#1 and MS#4.

[0103] Specifically, as shown in the second graph of Fig. 21, the processing system SYSd may control the supply amount of the modeling material M to the modeling surface MS#2 during the period when a model is formed on the modeling surface MS#2, so that the supply amount of the modeling material M to the modeling surface MS#2 is smaller than the supply amount of the modeling material M to the modeling surfaces MS#1 and #4 during the period when a model is formed on the modeling surface MS#1 and #4. As a result, as shown in the third graph of Fig. 21, the modeling amount on the modeling surface MS#2 is smaller than the modeling amount on the modeling surfaces MS#1 and MS#4. On the other hand, as shown in the second graph of Fig. 21, the processing system SYSd may control the supply amount of the modeling material M to the modeling surface MS#3 during the period when a model is formed on the modeling surface MS#3, so that the supply amount of the modeling material M to the modeling surface MS#3 is larger than the supply amount of the modeling material M to the modeling surfaces MS#1 and #4 during the period when a model is formed on the modeling surface MS#1 and #4. As a result, the printing amount on the printing surface MS#3 is greater than the printing amounts on the printing surfaces MS#1 and MS#4, as shown in the third graph in Fig. 21. For this reason, by performing the supply amount control operation based on information regarding the position (height) of the printing surface MS indicated by the measurement results of the measuring device 7, the surface (particularly the upper surface) of the structure layer SL#n+1 newly formed on the uneven printing surface MS becomes a flat surface, as shown in the fourth graph in Fig. 21.

[0104] In order to control the supply amount of the modeling material M, the control device 8 may control the material supply source 1. Specifically, the control device 8 may control the supply amount of the modeling material M from the material nozzle 212 by controlling the supply amount of the modeling material M supplied by the material supply source 1 to the processing device 2 (i.e., the material nozzle 212). For example, the control device 8 may reduce the supply amount of the modeling material M from the material nozzle 212 by reducing the supply amount of the modeling material M supplied by the material supply source 1 to the processing device 2. For example, the control device 8 may reduce the supply amount of the modeling material M from the material nozzle 212 by reducing the supply amount of the modeling material M supplied by the material supply source 1 to the processing device 2.

[0105] In this way, the processing system SYSd of the fourth embodiment can control the modeling amount (and thus the height of the structure layer SL) by performing the supply amount control operation. Therefore, the processing system SYSd can appropriately form a three-dimensional structure ST having a desired shape and size, similar to the above-mentioned processing system SYSa.

[0106] In particular, the processing system SYSd can control the modeling amount (and thus the height of the structure layer SL) by controlling the supply amount of the modeling material M independently of the irradiation optical system 211. Therefore, the processing system SYSd can perform the modeling operation without changing the recipe information, even when the supply amount control operation is performed during at least a part of the period during which the modeling operation is performed. Therefore, similar to the above-mentioned processing system SYSa, the processing system SYSd can control the modeling amount (and thus the height of the structure layer SL) by performing the supply amount control operation without affecting the modeling operation.

[0107] The control device 8 may change the supply amount of the modeling material M from the multiple material nozzles 212 in the same manner. For example, the control device 8 may change the supply amount of the modeling material M from the multiple material nozzles 212 by the same change amount. Alternatively, the control device 8 may change the supply amount of the modeling material M from at least one of the multiple material nozzles 212 while not changing the supply amount of the modeling material M from at least another of the multiple material nozzles 212. Even in this case, the modeling amount still changes because the supply amount of the modeling material M from at least one material nozzle 212 has changed. Alternatively, the control device 8 may change the supply amount of the modeling material M from at least one of the multiple material nozzles 212 in a first change mode while changing the supply amount of the modeling material M from at least another of the multiple material nozzles 212 in a second change mode different from the first change mode. For example, the control device 8 may change the supply amount of the modeling material M from at least one of the multiple material nozzles 212 by a first change amount, while changing the supply amount of the modeling material M from at least another of the multiple material nozzles 212 by a second change amount different from the first change amount. In other words, the control device 8 may change the supply amount of the modeling material M from the multiple material nozzles 212 so that the change amounts of the supply amount of the modeling material M from the multiple material nozzles 212 are different. Even in this case, the modeling amount still changes because the supply amount of the modeling material M from at least one material nozzle 212 has changed.

[0108] At least one of the machining system SYSb of the second embodiment to the machining system SYSc of the third embodiment described above may have a configuration characteristic of the machining system SYSd of the fourth embodiment. The configuration characteristic of the machining system SYSd of the fourth embodiment may include, for example, a configuration characteristic of the supply amount control operation.

[0109] (5) Machining system SYS of the fifth embodiment Next, a machining system SYS (hereinafter, referred to as "machining system SYSe") of a fifth embodiment will be described with reference to Fig. 22 and Fig. 23. Fig. 22 is a cross-sectional view showing the structure of the machining system SYSe of the fifth embodiment. Fig. 23 is a system configuration diagram showing the system configuration of the machining system SYSe of the fifth embodiment.

[0110] 22 and 23, the processing system SYSe of the fifth embodiment is the same as the processing system SYSd of the fourth embodiment described above in that it performs a supply amount control operation. On the other hand, the processing system SYSe is different from the processing system SYSd in that it performs a modeling operation using a wire-shaped modeling material Me instead of the powdered or granular modeling material M.

[0111] In order to perform a modeling operation using a wire-shaped modeling material Me, the processing system SYSe differs from the processing system SYSd in that it includes a material supply source 1e and a processing device 2e instead of the material supply source 1 and the processing device 2. Furthermore, the processing system SYSe differs from the processing system SYSd in that it may not include a mixing device 12. Other features of the processing system SYSe may be the same as other features of the processing system SYSd.

[0112] The material supply source 1e differs from the material supply source 1, which supplies the powdered or granular modeling material M to the processing device 2, in that the material supply source 1e supplies a wire-shaped modeling material Me to the processing device 2e. Other characteristics of the material supply source 1e may be the same as other characteristics of the material supply source 1.

[0113] The processing device 2e is different from the processing device 2 in that it includes a processing head 21e instead of the processing head 21. Other features of the processing device 2e may be the same as other features of the processing device 2. The processing head 21e is different from the processing head 21 in that it includes a material nozzle 212e instead of the material nozzle 212. Other features of the processing head 21e may be the same as other features of the processing head 21. The material nozzle 212e is different from the material nozzle 212 that supplies the powdered or granular modeling material M from the material supply port 2121 to the modeling surface MS (the molten pool MP on the modeling surface MS) in that the material nozzle 212e supplies a wire-shaped modeling material Me from the material supply port 2121e to the modeling surface MS (the molten pool MP on the modeling surface MS). Other features of the material nozzle 212e may be the same as other features of the material nozzle 212.

[0114] The processing system SYSe of the fifth embodiment may also perform a supply amount control operation to control the supply amount of the modeling material Me from the material nozzle 212e based on the measurement result of the measuring device 7, as in the processing system SYSd of the fourth embodiment described above. For example, the processing system SYSe may control the modeling amount by controlling the amount (feed amount) of the modeling material Me fed from the material supply source 1e toward the processing device 2e. As a result, the processing system SYSe can enjoy the same effect as the processing system SYSd can enjoy. In addition, since the processing system SYSe feeds the wire-shaped modeling material Me, it is possible to reduce the amount of the modeling material Me (i.e., the wasted modeling material Me that does not contribute to the formation of the model) fed toward the outside of the molten pool MP. Therefore, the processing system SYSe can improve the utilization efficiency of the modeling material Me compared to the processing system SYSd.

[0115] (6) Machining system SYS of the sixth embodiment Next, a machining system SYS of a sixth embodiment (hereinafter, referred to as "machining system SYSf") will be described with reference to Fig. 24. Fig. 24 is a cross-sectional view showing the structure of the machining system SYSf of the sixth embodiment.

[0116] As shown in FIG. 24, the processing system SYSf of the sixth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a processing device 2f instead of the processing device 2. Other features of the processing system SYSf may be the same as other features of the processing system SYSa. The processing device 2f differs from the processing device 2 in that it includes a processing head 21f instead of the processing head 21. Other features of the processing device 2f may be the same as other features of the processing device 2. The processing head 21f differs from the processing head 21 in that the number and arrangement positions of the irradiation optical system 211 and the material nozzle 212 are different. Other features of the processing head 21f may be the same as other features of the processing head 21.

[0117] In the sixth embodiment, the processing head 21f includes a single material nozzle 212 and a plurality of irradiation optical systems 211. However, the processing head 21f may include a plurality of material nozzles 212. The processing head 21f may include a single irradiation optical system 211.

[0118] The material nozzle 212 is attached to the head housing 213 so as to supply the modeling material M directly downward (i.e., toward the -Z side) from the material nozzle 212. In other words, the material nozzle 212 is attached to the head housing 213 so as to supply the modeling material M via a supply path along the Z axis. On the other hand, the irradiation optical system 211 is attached to the head housing 213 so that the optical axis AX of the irradiation optical system 211 is inclined with respect to the Z axis. In particular, the multiple irradiation optical systems 211 are attached to the head housing 213 so as to emit processing light EL in different directions. The multiple irradiation optical systems 211 are attached to the head housing 213 so that the multiple processing light EL emitted from the multiple irradiation optical systems 211, respectively, intersect below the processing head 21f.

[0119] The processing system SYSf in which the material nozzle 212 and the irradiation optical system 211 are arranged may also perform the nozzle movement operation in the same manner as the processing system SYSa. However, the sixth embodiment differs from the first embodiment in that the material nozzle 212 supplies the modeling material M directly downward (i.e., toward the -Z side). In this case, as shown in FIG. 25, there is a relationship between the distance D1 between the material nozzle 212 and the modeling surface MS and the modeling amount such that the longer the distance D1, the smaller the modeling amount. In other words, the relationship between the distance D1 and the modeling amount in the sixth embodiment is the opposite relationship to the relationship between the distance D1 and the modeling amount in the first embodiment. This is because the material nozzle 212 supplies the modeling material M directly downward, so that the modeling material M supplied from the material nozzle 212 falls from the material nozzle 212 in a divergent manner. In other words, the modeling material M supplied from the material nozzle 212 falls so as to gradually spread outward as it moves downward. As a result, the longer the distance D1 (i.e., the farther the printing surface MS is from the material nozzle 212), the smaller the distribution density of the printing material M on the printing surface MS. When the distribution density of the printing material M on the printing surface MS becomes smaller, the amount of printing material M supplied to the molten pool MP becomes smaller. As the amount of printing material M supplied to the molten pool MP becomes smaller, the amount of printing material M melted in the molten pool MP becomes smaller. As the amount of printing material M melted in the molten pool MP becomes smaller, the amount of printing material M solidified on the printing surface MS becomes smaller. As a result, the height of the object made of the solidified printing material M (i.e., the printing amount) becomes smaller. For this reason, as shown in Figure 25, there is a relationship between the distance D1 and the printing amount in that the longer the distance D1, the smaller the printing amount.

[0120] The processing system SYSf controls the printing amount of the object by performing a nozzle movement operation using the relationship that holds between the distance D1 and the printing amount under the control of the control device 8. In other words, the processing system SYSf controls the printing amount of the object by moving the material nozzle 212 so as to change the distance D1.

[0121] As an example, a nozzle movement operation performed when forming a new structure layer SL having a flat surface on an uneven printing surface MS will be described. For example, the first row (topmost diagram) of FIG. 26 illustrates the printing surface MS including the printing surfaces MS#1 to MS#4 shown in FIG. 12. In this case, in order to flatten the surface of the newly formed structure layer SL#n+1, the processing system SYSf may perform a nozzle movement operation to make the height of the object formed on the printing surface MS#2 lower than the height of the object formed on the printing surfaces MS#1 and MS#4, and to make the height of the object formed on the printing surface MS#3 higher than the height of the object formed on the printing surfaces MS#1 and MS#4. In other words, the processing system SYSf may perform a nozzle movement operation to make the printing amount on the printing surface MS#2 smaller than the printing amount on the printing surfaces MS#1 and MS#4, and to make the printing amount on the printing surface MS#3 larger than the printing amount on the printing surfaces MS#1 and MS#4.

[0122] Specifically, as shown in the second row of Fig. 26, the processing system SYSf may move the material nozzle 212 so that the distance D1 between the printing surface MS#2 and the material nozzle 212 during the period when a model is formed on the printing surface MS#2 is longer than the distance D1 between the printing surfaces MS#1 and #4 and the material nozzle 212 during the period when a model is formed on the printing surfaces MS#1 and #4. As a result, as shown in the third row of the graph in Fig. 26, the printing amount on the printing surface MS#2 is smaller than the printing amount on the printing surfaces MS#1 and MS#4. On the other hand, as shown in the second row of Fig. 26, the processing system SYSf may move the material nozzle 212 so that the distance D1 between the printing surface MS#3 and the material nozzle 212 during the period when a model is formed on the printing surface MS#3 is shorter than the distance D1 between the printing surfaces MS#1 and #4 and the material nozzle 212 during the period when a model is formed on the printing surfaces MS#1 and #4. As a result, the printing amount on the printing surface MS#3 is greater than the printing amounts on the printing surfaces MS#1 and MS#4, as shown in the third graph in Fig. 26. For this reason, by performing the nozzle movement operation based on information regarding the position (height) of the printing surface MS indicated by the measurement results of the measuring device 7, the surface (particularly the upper surface) of the structure layer SL#n+1 newly formed on the uneven printing surface MS becomes a flat surface, as shown in the fourth graph in Fig. 26.

[0123] In this way, the processing system SYSf of the sixth embodiment can also control the modeling amount (and thus the height of the structure layer SL) by performing a nozzle movement operation, similar to the processing system SYSa of the first embodiment. Therefore, the processing system SYSf can obtain the same effects as those that the processing system SYSa can obtain.

[0124] At least one of the processing system SYSb of the second embodiment to the processing system SYSe of the fifth embodiment described above may have components specific to the processing system SYSf of the sixth embodiment. The components specific to the processing system SYSf of the sixth embodiment may include, for example, components related to the arrangement positions and the number of the irradiation optical system 211 and the material nozzle 212.

[0125] (7) Machining system SYS of the seventh embodiment Next, a processing system SYS of a seventh embodiment (hereinafter, referred to as "processing system SYSg") will be described. The processing system SYSg of the seventh embodiment is different from the processing system SYSa of the first embodiment described above in that, in addition to or instead of performing a nozzle moving operation for moving the material nozzle 212 based on the measurement result of the measuring device 7, the processing system SYSg of the seventh embodiment controls the modeling amount (and thus the height of the structure layer SL) by performing a convergence position control operation for controlling the convergence position FP of the processing light EL based on the measurement result of the measuring device 7. Note that the convergence position FP of the processing light EL may be a position in the traveling direction of the processing light EL where the area of ​​a cross section intersecting with the traveling direction of the processing light EL is smallest.

[0126] In order to perform the convergence position control operation, as shown in FIG. 27 showing an example of the system configuration of the processing system SYSg, the irradiation optical system 211 may include a focus adjustment element 2111g capable of controlling the convergence position FP of the processing light EL. The focus adjustment element 2111g is an optical member capable of changing the convergence position FP of the processing light EL in a direction along the optical axis AX of the irradiation optical system 211 (i.e., a direction along the Z axis). An example of the focus adjustment element 2111g is an optical member including two optical elements arranged along the optical axis AX of the irradiation optical system 211 and capable of changing the distance between them. Note that, when the processing system SYSg does not perform the nozzle moving operation, the processing system SYSg does not need to include the nozzle driving system 23. Other features of the processing system SYSg may be the same as other features of the processing system SYSa.

[0127] The convergence position FP of the processing light EL affects the amount of printing. Specifically, when the convergence position FP changes, the distance D3 between the printing surface MS and the convergence position FP (specifically, the distance along the Z axis, see FIG. 28) changes. In the following description, the distance D3 between the printing surface MS and the convergence position FP is referred to as the "defocus amount D3." When the defocus amount D3 changes, the fluence of the processing light EL on the printing surface MS (e.g., the amount of energy per unit area) changes. Specifically, the larger the defocus amount D3, the larger the size of the spot formed by the processing light EL on the printing surface MS, and therefore the smaller the fluence of the processing light EL on the printing surface MS. On the other hand, the smaller the defocus amount D3, the smaller the size of the spot formed by the processing light EL on the printing surface MS, and therefore the larger the fluence of the processing light EL on the printing surface MS. The greater the fluence of the processing light EL on the printing surface MS, the greater the amount of printing material M that melts in the molten pool MP. The greater the amount of printing material M that melts in the molten pool MP, the greater the amount of printing material M that solidifies on the printing surface MS. As a result, the height of the object made of the solidified printing material M (i.e., the size along the Z-axis direction, the printing amount) increases. For this reason, as shown in FIG. 29, there is a relationship between the defocus amount D3 and the printing amount in that the greater the defocus amount D3, the smaller the printing amount. In other words, there is a relationship between the defocus amount D3 and the printing amount in that the smaller the defocus amount D3, the greater the printing amount.

[0128] The processing system SYSg, under the control of the control device 8, performs a convergence position control operation using the relationship established between the convergence position FP (specifically, the defocus amount D3 determined according to the convergence position FP) and the printing amount, thereby controlling the printing amount of the object. In other words, the processing system SYSg controls the focus adjustment element 2111g to change the convergence position FP based on the measurement result of the measuring device 7, thereby controlling the printing amount of the object. More specifically, the processing system SYSg controls the focus adjustment element 2111g to change the relative positional relationship between the printing surface MS and the convergence position FP based on the measurement result of the measuring device 7, thereby controlling the printing amount of the object. In other words, the processing system SYSg controls the focus adjustment element 2111g to change the defocus amount D3 corresponding to the distance between the printing surface MS and the convergence position FP based on the measurement result of the measuring device 7, thereby controlling the printing amount of the object.

[0129] As an example, a supply amount control operation performed when forming a new structure layer SL having a flat surface on an uneven printing surface MS will be described. For example, the first row (topmost diagram) of FIG. 30 illustrates a printing surface MS including printing surfaces MS#1 to MS#4 shown in FIG. 12. In this case, in order to flatten the surface of the newly formed structure layer SL#n+1, the processing system SYSg may perform a convergence position control operation to make the height of the object formed on the printing surface MS#2 lower than the height of the object formed on the printing surfaces MS#1 and MS#4, and to make the height of the object formed on the printing surface MS#3 higher than the height of the object formed on the printing surfaces MS#1 and MS#4. In other words, the processing system SYSg may perform a convergence position control operation to make the printing amount on the printing surface MS#2 smaller than the printing amount on the printing surfaces MS#1 and MS#4, and to make the printing amount on the printing surface MS#3 larger than the printing amount on the printing surfaces MS#1 and MS#4.

[0130] Specifically, the processing system SYSg may control the convergence position FP so that the defocus amount D3 during the period when an object is formed on the printing surface MS#2 is greater than the defocus amount during the period when an object is formed on the printing surfaces MS#1 and MS#4, as shown in the second graph of FIG. 30. As a result, the printing amount on the printing surface MS#2 is less than the printing amount on the printing surfaces MS#1 and MS#4, as shown in the third graph of FIG. 30. On the other hand, the processing system SYSg may control the convergence position FP so that the defocus amount D3 during the period when an object is formed on the printing surface MS#3 is less than the defocus amount D3 during the period when an object is formed on the printing surfaces MS#1 and MS#4, as shown in the second graph of FIG. As a result, the printing amount on the printing surface MS#3 is greater than the printing amount on the printing surfaces MS#1 and MS#4, as shown in the third graph of FIG. Therefore, by performing a convergence position control operation based on information regarding the position (height) of the printing surface MS indicated by the measurement results of the measuring device 7, the surface (particularly the upper surface) of the newly formed structural layer SL#n+1 on the uneven printing surface MS becomes a flat surface, as shown in the fourth row of Figure 30.

[0131] In this way, the processing system SYSg of the seventh embodiment can control the molding amount (and thus the height of the structure layer SL) by performing the convergence position control operation. Therefore, the processing system SYSg can appropriately form a three-dimensional structure ST having a desired shape and size, similar to the above-mentioned processing system SYSa.

[0132] In particular, the processing system SYSg can control the modeling amount (and thus the height of the structure layer SL) by controlling the convergence position FP independently of the irradiation optical system 211 that moves based on the recipe information. Therefore, even when the processing system SYSg performs the convergence position control operation during at least a part of the period during which the modeling operation is performed, the processing system SYSg can perform the modeling operation without changing the recipe information. Therefore, similar to the above-mentioned processing system SYSa, the processing system SYSg can control the modeling amount (and thus the height of the structure layer SL) by performing the convergence position control operation without affecting the modeling operation.

[0133] At least one of the machining systems SYSb of the second embodiment to SYSf of the sixth embodiment may have components specific to the machining system SYSg of the seventh embodiment. The components specific to the machining system SYSg of the seventh embodiment may include, for example, components related to the convergence position control operation.

[0134] In the above description, the processing system SYSg changes the relative positional relationship between the printing surface MS and the convergence position FP of the processing light EL by controlling the focus adjustment element 2111g. However, in addition to or instead of controlling the focus adjustment element 2111g, the processing system SYSg may change the relative positional relationship between the printing surface MS and the convergence position FP of the processing light EL by moving at least one of the processing head 21 and the stage 31.

[0135] (8) Machining system SYS of the eighth embodiment Next, a machining system SYS (hereinafter, referred to as "machining system SYSh") according to an eighth embodiment will be described with reference to Fig. 31. Fig. 31 is a system configuration diagram showing the system configuration of the machining system SYSh according to the eighth embodiment.

[0136] As shown in FIG. 31, the processing system SYSh of the eighth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 2h instead of the processing device 2. The other features of the processing system SYSh may be the same as the other features of the processing system SYS. The processing device 2h is different from the processing device 2 in that it includes a three-dimensional measuring device 24h. The other features of the processing device 2h may be the same as the other features of the processing device 2. The three-dimensional measuring device 24h may be attached to the partition member 61 that defines the chamber space 63IN. The three-dimensional measuring device 24h may be attached to a structure in the chamber space 63IN that is independent of the partition member 61.

[0137] The three-dimensional measuring device 24h is a measuring device capable of measuring the three-dimensional shape of a measurement target. The measurement target may include, for example, a workpiece W that is an object to be subjected to additional processing. The measurement result of the three-dimensional measuring device 24h is output to the control device 8. In the eighth embodiment, the control device 8 may generate the above-mentioned recipe information indicating the operation content of the processing system SYSa for forming the three-dimensional structure ST based on the measurement result of the three-dimensional measuring device 24h. Thereafter, the processing system SYSh may perform additional processing on the workpiece W based on the recipe information generated based on the measurement result of the three-dimensional measuring device 24h.

[0138] An example of a situation where recipe information is generated using the measurement result of such a three-dimensional measuring device 24h is a situation where a three-dimensional structure ST corresponding to a part lost due to loss, damage, or wear (hereinafter referred to as a "lost part W11") is formed (specifically, added) for a workpiece W corresponding to an object W1 of which a part has been lost due to loss, damage, or wear, thereby generating an original object W2 in which the lost part W11 has been repaired (i.e., restored). Hereinafter, with reference to Figs. 32 to 35, a flow of operations for generating the original object W2 by forming a three-dimensional structure ST corresponding to the lost part W11 for a workpiece W corresponding to an object W1 of which the lost part W11 has been lost will be described. However, even in a situation where an arbitrary object W2' having a three-dimensional shape different from the object W1' is generated by forming (specifically, adding) a three-dimensional structure ST for a workpiece W corresponding to an arbitrary object W1', the machining system SYSh may generate recipe information using the measurement result of the three-dimensional measuring device 24h. Therefore, in the following description, the terms "object W1" and "object W2" may be read as "object W1'" and "object W2'".

[0139] FIG. 32 is a perspective view showing a workpiece W corresponding to the object W1 (a pipe in the example shown in FIG. 32) from which the missing portion W11 has disappeared. The control device 8 specifies the three-dimensional shape of the object W1 from the measurement results of the three-dimensional measuring device 24h that measures the three-dimensional shape of such a workpiece W. Meanwhile, FIG. 33 is a perspective view showing an original object W2 (a pipe in the example shown in FIG. 33). The control device 8 specifies the three-dimensional shape of the original object W2 from three-dimensional model data that indicates the three-dimensional shape of the original object W2. The control device 8 calculates the three-dimensional shape of the three-dimensional structure ST to be formed by additional processing (i.e., the three-dimensional shape of the missing portion W11) based on the measurement results of the object W1 by the three-dimensional measuring device 24h and the three-dimensional model data that indicates the three-dimensional shape of the original object W2. Specifically, the control device 8 calculates the three-dimensional shape of the three-dimensional structure ST to be formed by additional processing (i.e., the three-dimensional shape of the missing portion W11) by calculating the difference between the three-dimensional shape of the object W1 indicated by the measurement result of the three-dimensional measuring device 24h and the three-dimensional shape of the original object W2 indicated by the three-dimensional model data. Fig. 34 shows the three-dimensional shape of the three-dimensional structure ST to be formed by additional processing (i.e., the three-dimensional shape of the missing portion W11) calculated by calculating the difference between the three-dimensional shape of the object W1 shown in Fig. 32 and the three-dimensional shape of the original object W2 shown in Fig. 33.

[0140] Thereafter, the control device 8 generates recipe information based on the three-dimensional shape of the three-dimensional structure ST to be formed by the additional processing. Specifically, the control device 8 slices the three-dimensional model data indicating the three-dimensional shape of the three-dimensional structure ST to be formed by the additional processing at the layer pitch to create slice data. Thereafter, the control device 8 generates recipe information indicating the operation content of the processing system SYSa for forming the three-dimensional structure ST based on the slice data. Note that the recipe information has already been described in the first embodiment, so a detailed description thereof will be omitted.

[0141] Thereafter, the control device 8 controls the processing system SYSh to perform additional processing based on the generated recipe information. As a result, as shown in Fig. 35, an object W3 is generated in which the missing portion W11 is replaced by a three-dimensional structure ST newly formed by the additional processing. In other words, an object W3 is generated in which the object W1 from which the missing portion W11 has disappeared and the newly formed three-dimensional structure ST are integrated.

[0142] When ideal additive processing based on recipe information is performed on the object W3, the object W3 will have the same three-dimensional shape as the original object W2. Therefore, generating the object W3 may be considered equivalent to regenerating the original object W2. In other words, generating the object W3 may be considered equivalent to repairing the object W1, which has a missing, damaged, or worn portion, and regenerating the original object W2.

[0143] On the other hand, there is a possibility that ideal additional processing based on the generated recipe information is not performed. In this case, the object W3 may become an object having a three-dimensional shape different from that of the original object W2. Therefore, in order to determine whether the object W3 has the same three-dimensional shape as the original object W2, the processing system SYSh may measure the three-dimensional shape of the object W3 using the three-dimensional measuring device 24h. In this case, since the processing device 2h itself is equipped with the three-dimensional measuring device 24h, the object W3 generated on the stage 31 by the additional processing may remain placed on the stage 31. In other words, the object W3 does not need to be moved from the stage 31. After that, the control device 8 may determine whether the object W3 has the same three-dimensional shape as the original object W2 based on the measurement result of the object W3 by the three-dimensional measuring device 24h and the three-dimensional model data indicating the three-dimensional shape of the original object W2. Specifically, the control device 8 may determine that the object W3 has the same three-dimensional shape as the original object W2 when the difference between the three-dimensional shape of the object W3 indicated by the measurement result of the three-dimensional measuring device 24h and the three-dimensional shape of the original object W2 indicated by the three-dimensional model data is below an allowable threshold. The control device 8 may determine that the object W3 has a different three-dimensional shape from the original object W2 when the difference between the three-dimensional shape of the object W3 indicated by the measurement result of the three-dimensional measuring device 24h and the three-dimensional shape of the original object W2 indicated by the three-dimensional model data is above an allowable threshold.

[0144] If it is determined that the object W3 has a three-dimensional shape different from that of the original object W2, the processing system SYSh may perform processing to make the three-dimensional shape of the object W3 the same as the three-dimensional shape of the original object W2.

[0145] For example, when the amount of modeling by the additive processing performed to form the object W3 is insufficient for the ideal amount (i.e., when the three-dimensional structure ST formed by the additive processing is smaller than the missing portion W11), the processing system SYSh may further perform the additive processing on at least a part of the object W3 to make the three-dimensional shape of the object W3 the same as the three-dimensional shape of the object W2. In this case, the control device 8 may calculate the three-dimensional shape of the three-dimensional structure ST to be formed by the additive processing (i.e., the three-dimensional shape of the three-dimensional structure ST to be newly formed to make the three-dimensional shape of the object W3 the same as the three-dimensional shape of the object W2) by calculating the difference between the three-dimensional shape of the object W3 indicated by the measurement result of the three-dimensional measuring device 24h and the three-dimensional shape of the original object W2 indicated by the three-dimensional model data. After that, the control device 8 may generate recipe information based on the calculated three-dimensional shape of the three-dimensional structure ST, and control the processing system SYSh to perform the additional processing based on the generated recipe information.

[0146] For example, when the amount of modeling by the additive processing performed to form the object W3 is excessive with respect to the ideal amount (i.e., when the three-dimensional structure ST formed by the additive processing is larger than the missing portion W11), the processing system SYSh may perform a removal processing to remove at least a part of the object W3, thereby making the three-dimensional shape of the object W3 the same as the three-dimensional shape of the object W2. In this case, the control device 8 may calculate the three-dimensional shape of the removal processing part of the object W3 to be removed by the removal processing (i.e., the three-dimensional shape of the part to be removed to make the three-dimensional shape of the object W3 the same as the three-dimensional shape of the object W2) by calculating the difference between the three-dimensional shape of the object W3 indicated by the measurement result of the three-dimensional measuring device 24h and the original three-dimensional shape of the object W2 indicated by the three-dimensional model data. Thereafter, the control device 8 may generate recipe information for removing the calculated removal processing part, and control the processing system SYSh to perform the removal processing based on the generated recipe information. Furthermore, the processing system SYSh may perform removal processing on the object W3 by irradiating the object W3 with processing light EL having an intensity sufficient to melt or sublimate the object W3 from the irradiation optical system 211, without supplying the forming material M from the material nozzle 212.

[0147] After generating the object W3, the processing system SYSh may perform a finishing process on the object W3. The finishing process may include, for example, a smoothing process for smoothing a surface to be smoothed, which is at least a part of the surface of the object W3. Note that the "smoothing process for smoothing the surface to be smoothed" in the eighth embodiment may include a process for smoothing the surface to be smoothed, increasing the flatness of the surface to be smoothed (i.e., making it flat), and / or reducing the surface roughness of the surface to be smoothed (i.e., making it smaller) compared to before the smoothing process. As an example, the processing system SYSh may perform a removal process as the smoothing process, which removes unintended irregularities, etc. occurring on the surface of the object W3 by irradiating the processing light EL to the irregularities, etc. As another example, the processing system SYSh may perform a remelt process as the smoothing process, which involves irradiating the processing light EL onto unintended irregularities and the like occurring on the surface of the object W3 to melt the molding material M that constitutes the irregularities, utilizing the weight and / or surface tension of the molten molding material M to make the surface of the molten molding material M closer to a flat surface, and then cooling and solidifying the molten molding material M to smooth the surface. Alternatively, in addition to or instead of the above-mentioned smoothing process, the finishing process may include a color tone control process in which the color tone of the surface of the object W3 is controlled by irradiating the processing light EL onto the surface of the object W3 (for example, changing the color tone of the surface of the object W3 to a desired color tone).

[0148] Depending on the three-dimensional shape of the lost portion W11, it may not be easy to form a three-dimensional structure ST corresponding to the lost portion W11 by additional processing. Therefore, the processing system SYSh may perform processing to change the three-dimensional shape of the lost portion W11 to a desired three-dimensional shape that allows the three-dimensional structure ST corresponding to the lost portion W11 to be appropriately formed before forming the three-dimensional structure ST corresponding to the lost portion W11 by additional processing. Specifically, the processing system SYSh may change the three-dimensional shape of the object W1 by performing the above-mentioned removal processing on the exposed surface WS11 (i.e., the part connected to the lost portion W11, see FIG. 32) of the object W1 that is exposed to the outside due to the disappearance of the lost portion W11, and as a result, change the three-dimensional shape of the lost portion W11. For example, the processing system SYSh may change the three-dimensional shape of the object W1 by performing removal processing on the exposed surface WS11 of the object W1 shown in FIG. 32, and change it from the three-dimensional shape shown in FIG. 32 to the three-dimensional shape shown in FIG. 36. In the examples shown in Figures 32 and 36, the processing system SYSh changes the three-dimensional shape of the lost portion W11 from a relatively complex three-dimensional shape to a relatively simple three-dimensional shape by changing the three-dimensional shape of the object W1.

[0149] Depending on the state of the exposed surface WS11 of the object W1, it may not be easy to perform additional processing on the exposed surface WS11. Therefore, the processing system SYSh may perform processing to change the state of the exposed surface WS11 before forming the three-dimensional structure ST corresponding to the missing portion W11 by additional processing. For example, the processing system SYSh may change the state of the exposed surface WS11 by performing the above-mentioned removal processing on the exposed surface WS11. For example, the processing system SYSh may change the state of the exposed surface WS11 by performing the above-mentioned smoothing processing on the exposed surface WS11.

[0150] The machining system SYSh of the eighth embodiment can form an object having an ideal three-dimensional shape by using the measurement results of the three-dimensional measuring device 24h, while enjoying the same effects as those that can be enjoyed by the machining system SYSa of the first embodiment described above.

[0151] In addition, the machining system SYSh of the eighth embodiment does not need to perform a nozzle moving operation. In this case, the machining system SYSh does not need to include the nozzle driving system 23.

[0152] In the above description, the machining system SYSh forms an object having an ideal three-dimensional shape after setting the shape of the original object W2 of the workpiece W corresponding to the object W1, which is partially lost due to chipping, damage, or wear, to an ideal three-dimensional shape. However, the machining system SYSh may form an object having a shape different from the original object as an ideal three-dimensional shape in order to improve the performance of the object. For example, the machining system SYSh may form an object having a shape different from the original object, or may add a desired shape to a shape equivalent to the original object. FIG. 38 is a diagram showing an object W5 having fins W6 for rectifying a fluid passing through a pipe as the workpiece W. As shown in FIG. 38, a structure for achieving a new effect of rectifying (fins W6 in the example shown in FIG. 38) may be added by additional processing.

[0153] In the above description, the machining system SYSh performs at least one of finishing, removing, and smoothing using the processing light EL for performing additional processing. However, the machining system SYSh may perform at least one of finishing, removing, and smoothing using processing light different from the processing light EL for performing additional processing. In this case, the machining system SYSh may be equipped with an irradiation optical system for irradiating processing light for performing at least one of finishing, removing, and smoothing. Alternatively, the machining system SYSh may perform at least one of finishing, removing, and smoothing using a tool. In other words, the machining system SYSh may perform mechanical processing as at least one of finishing, removing, and smoothing.

[0154] At least one of the machining system SYSb of the second embodiment to the machining system SYSg of the seventh embodiment may have components specific to the machining system SYSh of the eighth embodiment. The components specific to the machining system SYSh of the eighth embodiment may include, for example, components related to the three-dimensional measuring device 24h.

[0155] (9) Variations If there is a possibility that the material nozzle 212 and the workpiece W may come into contact with each other due to the nozzle movement operation described above, the nozzle drive system 23 may stop the movement of the material nozzle 212 under the control of the control device 8. As a result, the material nozzle 212 and the workpiece W are prevented from coming into contact with each other.

[0156] In the above description, the processing system SYS melts the shaping material M by irradiating the shaping material M with the processing light EL. However, the processing system SYS may melt the shaping material M by irradiating the shaping material M with an arbitrary energy beam. In this case, the processing system SYS may include a beam irradiation device capable of irradiating the arbitrary energy beam in addition to or instead of the irradiation optical system 211. An example of the arbitrary energy beam is at least one of a charged particle beam and an electromagnetic wave. An example of the charged particle beam is at least one of an electron beam and an ion beam.

[0157] In the above description, the processing system SYS performs additive processing using the laser build-up welding method. However, the processing system SYS may form the three-dimensional structure ST from the modeling material M using other methods capable of forming the three-dimensional structure ST by irradiating the modeling material M with the processing light EL (or any energy beam). Alternatively, the processing system SYS may form the three-dimensional structure ST using any method for additive processing other than the method of irradiating the modeling material M with the processing light EL (or any energy beam).

[0158] (10) Additional Notes The following supplementary notes are further disclosed in relation to the above-described embodiment. [Appendix 1] Irradiating an object with an energy beam; Supplying a modeling material to be irradiated with the energy beam from a material supplying member; obtaining information regarding a height of a surface of the object; Varying the distance between the material supply member and the surface of the object based on information regarding the height of the surface of the object. A processing method comprising the steps of: [Appendix 2] Irradiating an object with an energy beam; Supplying a modeling material to be irradiated with the energy beam from a material supplying member; obtaining information regarding a height of a surface of the object; Varying the direction of the material supply member based on information regarding the height of the surface of the object. A processing method comprising the steps of: [Appendix 3] Irradiating an object with an energy beam; providing a build material to be irradiated with the energy beam; obtaining information regarding a height of a surface of the object; a material supply control device that changes the supply amount of the modeling material based on information about the height of the surface of the object; A processing method comprising the steps of: [Appendix 4] Irradiating an object with an energy beam; Supplying a modeling material to be irradiated with the energy beam from a material supplying member; obtaining information regarding a position of a surface of the object; controlling the material supply member based on information regarding a position of a surface of the object; A processing method comprising the steps of: [Appendix 5] Irradiating an object with an energy beam; Supplying a modeling material to be irradiated with the energy beam from a material supplying member; When the height of the surface of the object is lower than a desired height, the distance between the material supply member and the surface of the object is increased. A processing method comprising the steps of: [Appendix 6] Irradiating an object with an energy beam; Supplying a modeling material to be irradiated with the energy beam from a material supplying member; When the height of the surface of the object is lower than a desired height, changing the distance between the concentrated area of ​​the building material supplied by the material supply member and the surface of the object so as to increase it; A processing method comprising the steps of: [Appendix 7] Irradiating an object with an energy beam; providing a build material to be irradiated with the energy beam; Controlling the concentration area of ​​the modeling material when the height of the surface of the object is lower than a desired height so as to be located above the concentration area when the height of the surface of the object is higher than the desired height; A processing method comprising the steps of: [Appendix 8] Irradiating an object with an energy beam; providing a build material to be irradiated with the energy beam; obtaining information regarding a position of a surface of the object; Varying a convergence position of the energy beam based on information about a position of a surface of the object. A processing method comprising the steps of:

[0159] At least a part of the components of each of the above-mentioned embodiments can be appropriately combined with at least a part of other components of each of the above-mentioned embodiments. Some of the components of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present description.

[0160] The present invention is not limited to the above-described embodiments, but may be modified as appropriate within the scope of the claims and the gist or concept of the invention as can be read from the entire specification, and processing systems involving such modifications are also included in the technical scope of the present invention. [Explanation of symbols]

[0161] SYS Machining System 1 Material source 2 Processing equipment 21 Processing head 211 Irradiation optical system 212 Material nozzle 22 Head drive system 23 Nozzle drive system 3. Stage Equipment 31 Stage 7. Measurement Equipment 8 Control device W work M Build material SL structure layer MS printing surface MP molten pool EL processing light

Claims

1. an irradiation system for irradiating an object with an energy beam; a material supplying member for supplying a modeling material to be irradiated with the energy beam; a measurement device for obtaining information regarding a height of a surface of the object; a distance change device that changes the distance between the material supply member and the surface based on the measurement result of the measuring device; Equipped with The distance change device changes the distance between the material supply member and the surface to be longer when the height of the surface is lower than a desired height, and changes the distance between the material supply member and the surface to be shorter when the height of the surface is higher than the desired height.

2. The information regarding the height of the surface of the object includes at least one of information indicating the height of the object and information indicating an ideal height of the object. The processing system of claim 1 .

3. The information about the height of the surface of the object includes information about the difference between the height of the object and an ideal height of the object. The processing system according to claim 1 or 2.

4. a moving device for moving the illumination system in a first moving direction, The measuring device obtains information regarding the height of the surface ahead in the first direction of movement. The processing system according to any one of claims 1 to 3.

5. an acquisition unit that acquires irradiation system control information for controlling the irradiation system before processing the object; a control unit that controls the irradiation system based on the irradiation system control information acquired by the acquisition unit; Further comprising: After starting processing of the object, the distance between the material supply member and the surface is changed by the distance change device without changing the irradiation system control information, thereby controlling the amount of fabrication. The processing system according to any one of claims 1 to 4.

6. The distance changing device controls the material supplying member to move the material supplying member. The processing system according to any one of claims 1 to 5.

7. The material supply member supplies the modeling material from a plurality of material supply ports facing different directions; The distance change device moves the material supply member to change a concentration area of ​​the modeling material supplied from the plurality of material supply ports. The processing system of claim 6.

8. The material supply member supplies the modeling material from a plurality of material supply ports facing different directions; The distance change device moves the material supply member to change the distance between the concentrated area of ​​the modeling material supplied from the plurality of material supply ports and the object. The processing system according to claim 6 or 7.

9. the material supply member includes a first material supply member having a first material supply port facing a first direction, and a second material supply member having a second material supply port facing a second direction different from the first direction; The distance change device moves only one of the first and second material supply members to change a concentrated area of ​​the modeling material supplied from the first and second material supply ports. The processing system according to any one of claims 6 to 8.

10. the material supply member includes a first material supply member having a first material supply port facing a first direction, and a second material supply member having a second material supply port facing a second direction different from the first direction; The distance changing device changes the movement amounts of the first material supply member and the second material supply member to change the concentrated area of ​​the modeling material supplied from the first and second material supply ports. The processing system according to any one of claims 6 to 9.

11. an output device that outputs information regarding a position where the object is additionally machined by irradiating the energy beam onto the building material; The output device outputs information regarding a position of the object that has been additionally processed in accordance with a difference in distance between the material supply member and the surface when the additional processing is performed. The processing system according to any one of claims 1 to 10.

12. The output device includes a display device. The processing system of claim 11.

13. irradiating the object with an energy beam using an illumination system; supplying a build material to be irradiated with the energy beam using a material supply member; obtaining information regarding a height of a surface of the object using a metrology device; changing a distance between the material supply member and the surface based on a measurement result of the measuring device; Equipped with Varying the distance between the material supply member and the surface includes increasing the distance between the material supply member and the surface when the height of the surface is lower than a desired height, and decreasing the distance between the material supply member and the surface when the height of the surface is higher than a desired height. Processing method.

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