Antenna Device

Abstract

To suppress change of characteristics due to unevenness of manufacturing, for example, in an antenna device using a glass substrate.SOLUTION: An antenna device 1 includes: glass substrates 10 and 20; a radiation electrode 31 on a surface 11 of the glass substrate 10; a power supply electrode 32 on a surface 12 of the glass substrate 10, the power supply electrode overlapping with the radiation electrode 31 in a planer view; and a ground electrode 34 on a surface 21 of the glass substrate 20. The glass substrates 10 and 20 are overlapped so that the surface 12 of the glass substrate 10 and the surface 22 of the glass substrate 20 face each other. Since the radiation electrode 31 and the power supply electrode 32 are formed on the front surface and the back surface of the glass substrate 10, the distance between the radiation electrode 31 and the power supply electrode 32 is not changed by unevenness of manufacturing. This can prevent a change of characteristics due to unevenness of manufacturing.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an antenna device. [Background technology]

[0002] Antenna devices for high frequency bands require the use of insulating materials with low dielectric constants as substrate materials. Fluorine-based resins such as polytetrafluoroethylene are known as insulating materials with low dielectric constants, but fluorine-based resins generally have insufficient rigidity and a large thermal expansion coefficient, making it difficult to ensure pattern accuracy. For example, a 300 GHz band antenna device requires a pattern accuracy of ±1 μm, but if a fluorine-based resin is used as the substrate material, it is not realistic to ensure such accuracy.

[0003] On the other hand, insulating materials that have a low dielectric constant as fluororesin but a low thermal expansion coefficient and high rigidity include fused and solidified materials such as glass and sintered materials such as HTCC. An example of an antenna device using glass as the substrate material is described in Patent Document 1. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6159407 [Patent Document 2] JP 2020-36220 A [Patent Document 3] WO2018 / 116867 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when a fused and solidified material such as glass or a fired material such as HTCC is used as the substrate material, it is not possible to use a lamination method that is generally used for printed circuit boards made of resin or LTCC substrates made of ceramic. Therefore, when providing the radiation electrode, the power supply electrode, and the ground electrode on different layers, it is necessary to use multiple molded substrates made of fused and solidified materials or fired materials in layers.

[0006] Although it does not relate to an antenna device using a molded substrate made of a melt-solidified material or a sintered material, Fig. 2 of Patent Document 2 discloses an example in which an antenna device is constructed by stacking a substrate having a ground electrode on one surface and a feeding electrode on the other surface, and a substrate having a radiating electrode on one surface. However, with this method, there is a risk that the distance between the radiating electrode and the feeding electrode will vary due to manufacturing variations, etc., and it is difficult to maintain stable characteristics, particularly when applied to an antenna device for a high frequency band such as the 300 GHz band.

[0007] In addition, although it is not related to an antenna device using a molded substrate made of a melt-solidified material or a sintered material, Patent Document 3 discloses a structure in which a substrate having an opening is sandwiched between a substrate having a radiation electrode and a substrate having a feeding electrode. However, even with this method, there is a risk that the distance between the radiation electrode and the feeding electrode will vary due to manufacturing variations, etc.

[0008] Therefore, an object of the present disclosure is to suppress the variation in characteristics caused by manufacturing variance in an antenna device using a molded substrate made of a melt-solidified material such as glass or a fired material such as HTCC. [Means for solving the problem]

[0009] An antenna device according to one embodiment of the present disclosure comprises first and second molded substrates, a first electrode formed on one surface of the first molded substrate, a power supply electrode formed on the other surface of the first molded substrate and overlapping with the first electrode in a planar view, and a first ground electrode formed on one surface of the second molded substrate, and is characterized in that the first and second molded substrates are stacked with the other surface of the first molded substrate facing the other surface of the second molded substrate. Effect of the Invention

[0010] Thus, according to one embodiment of the present disclosure, in an antenna device using a molded substrate made of a molten and solidified material such as glass or a sintered material such as HTCC, it is possible to suppress variations in characteristics due to manufacturing variations, etc. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a side view for explaining the structure of an antenna device 1 according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram showing the structure of a glass substrate 10 used in the antenna device 1 according to the first embodiment, in which (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. [Diagram 3] FIG. 3 is a diagram showing the structure of the glass substrate 20 used in the antenna device 1 according to the first embodiment, in which (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side. [Figure 4] FIG. 4 is a side view for explaining the structure of the antenna device 2 according to the second embodiment of the present disclosure. [Diagram 5]FIG. 5 is a diagram showing the structure of a glass substrate 10 used in an antenna device 2 according to the second embodiment, in which (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. [Figure 6] Figure 6 is a diagram showing the structure of a glass substrate 20 used in an antenna device 3 according to the second embodiment, where (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side. [Figure 7] FIG. 7 is a diagram showing the structure of a glass substrate 10 used in an antenna device 3 according to a third embodiment of the present disclosure, in which (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. [Figure 8] FIG. 8 is a side view for explaining the structure of an antenna device 4 according to the fourth embodiment of the present disclosure. [Figure 9] FIG. 9 is a side view for explaining the structure of an antenna device 5 according to the fifth embodiment of the present disclosure. [Figure 10] FIG. 10 is a diagram showing the structure of a glass substrate 20 used in an antenna device 5 according to the fifth embodiment, in which (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side. [Figure 11] FIG. 11 is a bottom view of the dielectric layer 40 as viewed from the surface 42 side. [Figure 12] FIG. 12 is a side view for explaining the structure of an antenna device 6 according to the sixth embodiment of the present disclosure. [Figure 13] FIG. 13 is a side view for explaining the structure of an antenna device 7 according to the seventh embodiment of the present disclosure. [Figure 14] FIG. 14 is a side view for explaining the structure of an antenna device 7 according to the seventh embodiment of the present disclosure. [Figure 15]FIG. 15 is a side view for explaining the structure of an antenna device 8 according to the eighth embodiment of the present disclosure. [Figure 16] FIG. 16 is a plan view of the glass substrate 10 as viewed from the front surface 11 side. [Figure 17] FIG. 17 is a graph showing the simulation results of the first embodiment. [Figure 18] FIG. 18 is a side view for explaining the structure of the simulation model of Comparative Example 1. As shown in FIG. [Figure 19] FIG. 19 is a graph showing the simulation results of Comparative Example 1. [Figure 20] FIG. 20 is a graph showing the simulation results of the second embodiment. [Figure 21] FIG. 21 is a graph showing the simulation results of Comparative Example 2. [Figure 22] FIG. 22 is a graph showing the simulation results of the third embodiment. [Figure 23] FIG. 23 is a graph showing the simulation results of Example 4, which show the simulation results when the relative dielectric constant ε of the resin material is 3.0. [Figure 24] FIG. 24 is a graph showing the simulation results of Example 4, in which the relative dielectric constant ε of the resin material is 4.0. [Diagram 25] FIG. 25 is a graph showing the simulation results of Example 4, in which the relative dielectric constant ε of the resin material is 5.0. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0013] <First embodiment> FIG. 1 is a side view for explaining the structure of an antenna device 1 according to a first embodiment of the present disclosure.

[0014] As shown in Fig. 1, the antenna device 1 according to the first embodiment has a configuration in which two glass substrates 10 and 20, which are molded substrates, are stacked on top of each other. The material of the glass substrates 10 and 20 is a low-dielectric glass material having a dielectric constant lower than that of general substrate materials such as resin, and preferably a dielectric constant of less than 4. In this embodiment, glass is used as the material of the molded substrate, but the material is not limited to this and may be any other melt-solidified material or a fired material such as HTCC, represented by alumina (Al2O3).

[0015] The structures of the glass substrates 10 and 20 are shown in Figures 2 and 3. In Figure 2, (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. In Figure 3, (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side.

[0016] As shown in FIGS. 1 to 3, a radiation electrode 31 is formed on a surface 11 of the glass substrate 10, and a power supply electrode 32 is formed on a surface 12 of the glass substrate 10. The radiation electrode 31 constitutes a first electrode that radiates an antenna signal. The power supply electrode 32 is provided at a position overlapping one side of the radiation electrode 31 in a plan view. Meanwhile, a ground electrode 34, which is a first ground electrode, is formed on a surface 21 of the glass substrate 20. The ground electrode 34 is formed on almost the entire surface of the surface 21 of the glass substrate 20 except for the cutout portion 34a. Furthermore, the glass substrate 20 is provided with a through conductor 33 that penetrates from the surface 21 to the surface 22. The portion of the through conductor 33 exposed on the surface 21 is located in the cutout portion 34a, and is thereby insulated from the ground electrode 34 and is drawn out to an edge portion of the glass substrate 20 via the drawing portion 33a.

[0017] The glass substrates 10 and 20 are stacked with the surface 12 of the glass substrate 10 facing the surface 22 of the glass substrate 20 so that the through conductor 33 and the power feeding electrode 32 are connected. As a result, when an antenna signal of frequency f is input from the lead-out portion 33a, the antenna signal is supplied to the power feeding electrode 32 via the through conductor 33. Since the power feeding electrode 32 is provided at a position overlapping one side of the radiating electrode 31 in a plan view, the antenna signal is fed to the radiating electrode 31 by capacitive coupling. The frequency f of the antenna signal and its wavelength λ in a vacuum have the following relationship: λ=f / c Here, "c" is the speed of light in a vacuum (2.99792458×10 8 Therefore, if the frequency f of the antenna signal is 285 GHz, its wavelength λ in a vacuum is 1050 μm.

[0018] Between the surface 12 of the glass substrate 10 and the surface 22 of the glass substrate 20, a gap G0 corresponding to the thickness of the power supply electrode 32 is formed. The glass substrates 10 and 20 may be bonded to each other by a resin material filled in the gap G0.

[0019] The antenna device 1 according to this embodiment uses glass as the substrate material, and therefore, unlike the case where a resin material or an LTCC material is used as the substrate material, the substrate is in a hardened state at the time of forming the conductor pattern such as the radiation electrode 31. For this reason, a general lamination method in which unhardened insulating material and conductor patterns are alternately formed cannot be used. Therefore, in this embodiment, two glass substrates 10 and 20 are used, and conductor patterns are formed on the front and back of the substrates, and then the substrates are laminated to fabricate the antenna device 1. As a result, even if three or more conductor layers are required, this can be realized by using the glass substrates 10 and 20.

[0020] In addition, glass has a small thermal expansion coefficient and high rigidity, so that it is possible to obtain high pattern accuracy. Moreover, since the radiation electrode 31 and the power supply electrode 32 are formed on the front and back sides of the glass substrate 10, the distance between the radiation electrode 31 and the power supply electrode 32 does not change due to manufacturing variations. Therefore, it is possible to obtain the characteristics as designed even if the resonant frequency is in a high frequency band such as the 300 GHz band.

[0021] <Second embodiment> Fig. 4 is a side view for explaining the structure of the antenna device 2 according to the second embodiment of the present disclosure. Fig. 5 is a diagram showing the structure of a glass substrate 10 used in the antenna device 2 according to the second embodiment, where (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. Fig. 6 is a diagram showing the structure of a glass substrate 20 used in the antenna device 3 according to the second embodiment, where (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side.

[0022] 4 to 6, the antenna device 2 according to the second embodiment differs from the antenna device 1 according to the first embodiment in that a conductor pattern 36 is provided on the surface 12 of the glass substrate 10, and bump electrodes 35, 37 are provided on the surface 22 of the glass substrate 20. Since the other basic configurations are the same as those of the antenna device 1 according to the first embodiment, the same elements are given the same reference numerals and redundant explanations will be omitted.

[0023] The bump electrode 35 is connected to an end of the through conductor 33 exposed on the surface 22 of the glass substrate 20, and has a predetermined height. In this embodiment, the power supply electrode 32 and the through conductor 33 are connected via the bump electrode 35. As a result, a gap G2 defined by the height of the bump electrode 35 is formed between the power supply electrode 32 and the surface 22 of the glass substrate 20.

[0024] Moreover, when the glass substrates 10 and 20 are stacked, the plurality of conductor patterns 36 and the plurality of bump electrodes 37 are connected, thereby holding the glass substrates 10 and 20 parallel to each other. That is, the conductor patterns 36 and the bump electrodes 37 function as spacers for holding the glass substrates 10 and 20 parallel to each other. In the example shown in FIG. 5 and FIG. 6, the conductor patterns 36 and the bump electrodes 37 are provided near the corners of the glass substrates 10 and 20 in a plan view, but the positions and the number of the conductor patterns 36 and the bump electrodes 37 are not particularly limited. Moreover, as the spacers for holding the glass substrates 10 and 20 parallel to each other, it is not necessary to use conductors such as the conductor patterns 36 and the bump electrodes 37, and it is acceptable to use members made of insulating materials or members that are integrated with the molded substrate.

[0025] According to this embodiment, the gap G2 between the power supply electrode 32 and the surface 22 of the glass substrate 20 can be adjusted by adjusting the height of the bump electrode 35 and the height of the spacer. In this embodiment, no other member is provided between the gap G2, which is filled with air. The width of the gap G2 affects the antenna characteristics. Specifically, when the resonant frequency is in the 300 GHz band, providing the gap G2 shifts the resonant frequency to the high frequency side. Furthermore, by setting the gap G2 to about 10 μm, the reflection characteristics are improved compared to when the gap G2 is zero.

[0026] <Third embodiment> 7 is a diagram showing the structure of a glass substrate 10 used in an antenna device 3 according to a third embodiment of the present disclosure, where (a) is a plan view of the glass substrate 10 seen from one surface 11 side, (b) is a side view of the glass substrate 10 seen from the side, and (c) is a bottom view of the glass substrate 10 seen from the other surface 12 side. The side view of the antenna device 3 is as shown in FIG.

[0027] 7 differs from the antenna device 2 according to the second embodiment in that the radiation electrode 31 formed on the surface 11 is annular. Since the other basic configurations are the same as those of the antenna device 2 according to the second embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0028] As exemplified in this embodiment, the radiation electrode 31 does not need to have a solid pattern, and may be annular.

[0029] <Fourth embodiment> FIG. 8 is a side view for explaining the structure of an antenna device 4 according to the fourth embodiment of the present disclosure.

[0030] 8, the antenna device 4 according to the fourth embodiment differs from the antenna device 3 according to the third embodiment in that a resin material 38 is provided between the surface 12 of the glass substrate 10 and the surface 22 of the glass substrate 20. Since the other basic configurations are the same as those of the antenna device 3 according to the third embodiment, the same elements are given the same reference numerals and redundant explanations will be omitted.

[0031] The resin material 38 serves to bond the glass substrate 10 and the glass substrate 20 to each other, and is also provided inside the gap G2. As exemplified in this embodiment, the gap G2 does not need to be filled with air, and at least a portion of the gap G2 may be filled with the resin material 38. When the gap G2 is filled with the resin material 38, the relationship between the size of the gap G2 and the relative dielectric constant ε of the resin material 38 is as follows: G2<0.06(λ / √ε) It is preferable that the above formula is satisfied. This makes it possible to obtain a radiation band that functions as an antenna.

[0032] <Fifth embodiment> FIG. 9 is a side view for explaining the structure of an antenna device 5 according to the fifth embodiment of the present disclosure.

[0033] 9, the antenna device 5 according to the fifth embodiment differs from the antenna device 1 according to the first embodiment in that it further includes a dielectric layer 40 formed on the surface 21 of the glass substrate 20 and an extraction conductor 39 formed on the surface 42 of the dielectric layer 40, and in that the through conductor 33 is omitted and instead a slot 34s is provided in the ground electrode 34. Since the other basic configuration is the same as that of the antenna device 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0034] Fig. 10 shows the structure of the glass substrate 20 used in the antenna device 5 according to the fifth embodiment, where (a) is a plan view of the glass substrate 20 seen from the other surface 22 side, (b) is a side view of the glass substrate 20 seen from the side, and (c) is a bottom view of the glass substrate 20 seen from one surface 21 side. Fig. 11 is a bottom view of the dielectric layer 40 seen from the surface 42 side. The surface 42 of the dielectric layer 40 is the opposite surface to the surface 41 that faces the glass substrate 20.

[0035] 10 and 11, the lead conductor 39 overlaps with a slot 34s provided in the ground electrode 34. As a result, the lead conductor 39 is electromagnetically coupled to the power feeding electrode 32 via the slot 34s, and when an antenna signal of frequency f is input from the lead conductor 39, the antenna signal is supplied to the power feeding electrode 32 via the slot 34s. Here, no separate ground electrode is provided on the opposite side of the lead conductor 39 to the ground electrode 34, and as a result, the lead conductor 39 constitutes a microstrip line.

[0036] As exemplified in this embodiment, it is not essential to feed power to the power supply electrode 32 via the through conductor 33, and the lead conductor 39 and the power supply electrode 32 may be electromagnetically coupled via the slot 34s. Furthermore, a resin may be used as the material for the dielectric layer 40, and the dielectric layer 40 and the lead conductor 39 may be formed by a general lamination method.

[0037] Sixth embodiment FIG. 12 is a side view for explaining the structure of an antenna device 6 according to the sixth embodiment of the present disclosure.

[0038] 12, the antenna device 6 according to the sixth embodiment differs from the antenna device 5 according to the fifth embodiment in that a ground electrode 30, which is a second ground electrode, is formed on a surface 42 of a dielectric layer 40, and an extraction conductor 39 is formed inside the dielectric layer 40. Since the other basic configuration is the same as that of the antenna device 5 according to the fifth embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0039] In this embodiment, the lead conductor 39 is covered with the ground electrodes 34 and 30 from above and below, so that the lead conductor 39 constitutes a strip line.

[0040] <Seventh embodiment> 13 and 14 are side views for explaining the structure of an antenna device 7 according to a seventh embodiment of the present disclosure, and are views seen from directions different by 90 degrees from each other.

[0041] 13 and 14, the antenna device 7 according to the seventh embodiment differs from the antenna device 6 according to the sixth embodiment in that the lead conductor 39 is not provided inside the dielectric layer 40, and the side surfaces 43, 44 of the dielectric layer 40 are covered with ground electrodes 61, 62, respectively. Since the other basic configuration is the same as that of the antenna device 6 according to the sixth embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0042] The side surfaces 43 and 44 of the dielectric layer 40 constitute first and second side surfaces that are perpendicular to the surface 42 of the dielectric layer 40 and parallel to each other. The parallel side surfaces 45 and 46 of the dielectric layer 40 are surfaces that are orthogonal to the side surfaces 43 and 44, and these surfaces are not covered by the ground electrodes. The ground electrodes 61 and 62 constitute third and fourth ground electrodes, respectively. As a result, the internal region of the dielectric layer 40 surrounded by the ground electrodes 30, 34, 61, and 62 functions as a waveguide. An antenna signal can be supplied to the waveguide using a mode converter 47 or the like. When an antenna signal of frequency f is input to the waveguide, the antenna signal is supplied to the power supply electrode 32 through the slot 34s. As exemplified in this embodiment, the waveguide and the power supply electrode 32 may be electromagnetically coupled through the slot 34s.

[0043] <Eighth embodiment> FIG. 15 is a side view for explaining the structure of an antenna device 8 according to the eighth embodiment of the present disclosure.

[0044] 15, the antenna device 8 according to the eighth embodiment differs from the antenna device 1 according to the first embodiment in that a first electrode 50 having slots 50s is provided instead of the radiation electrode 31, and the first electrode 50 and the ground electrode 34 are connected via a plurality of through conductors 51, 52. Since the other basic configuration is the same as that of the antenna device 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0045] The through conductor 51 is a first through conductor arranged along the periphery of the first electrode 50, and one end of the through conductor 52 is connected to the first electrode 50. The through conductor 52 is a second through conductor arranged along the periphery of the ground electrode 34, and one end of the through conductor 52 is connected to the ground electrode 34. The glass substrate 10 and the glass substrate 20 are overlapped so that the other end of the through conductor 51 and the other end of the through conductor 52 are connected. The glass substrate 20 is provided with a through conductor 33 that penetrates from the surface 21 to the surface 22. The pattern shape of the ground electrode 34 is the same as the shape shown in FIG. 3(c), and the part of the through conductor 33 exposed on the surface 21 is led to the edge part of the glass substrate 20 via the lead part 33a. Alternatively, instead of providing the through conductor 33 and the lead part 33a, the power supply electrode 32 may be extended to the edge part of the glass substrate 20 so as not to interfere with the through conductors 51 and 52, so that an antenna signal can be directly input to the power supply electrode 32.

[0046] Fig. 16 is a plan view of the glass substrate 10 as viewed from the front surface 11 side. As shown in Fig. 16, the slot 50s provided in the first electrode 50 overlaps with the power feeding electrode 32 in plan view. As a result, the antenna device 8 according to this embodiment forms a slot antenna.

[0047] Although the above describes preferred embodiments of the present disclosure, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure, and it goes without saying that these modifications are also included within the scope of the present disclosure.

[0048] The technology according to the present disclosure includes the following configuration examples, but is not limited to these.

[0049] The antenna device according to the present disclosure comprises first and second molded substrates, a first electrode formed on one surface of the first molded substrate, a power supply electrode formed on the other surface of the first molded substrate and overlapping with the first electrode in a planar view, and a first ground electrode formed on one surface of the second molded substrate, and is characterized in that the first and second molded substrates are stacked with the other surface of the first molded substrate facing the other surface of the second molded substrate.

[0050] According to this, in an antenna device using a molded substrate made of a melt-solidified material such as glass or a fired material such as HTCC, the first electrode and the power supply electrode are formed on the front and back of the first molded substrate, so that the distance between the first electrode and the power supply electrode does not change due to manufacturing variations. This makes it possible to suppress characteristic variations caused by manufacturing variations in an antenna device using a molded substrate made of a melt-solidified material such as glass or a fired material such as HTCC.

[0051] The antenna device according to the present disclosure may further include a through conductor provided to penetrate the second molded substrate, and the first and second molded substrates may be overlapped so that the through conductor and the power feeding electrode are connected. In this way, power can be fed to the power feeding electrode via the through conductor.

[0052] The antenna device according to the present disclosure may further include a bump electrode provided at an end of the through conductor exposed on the other surface of the second molded substrate, the through conductor and the power supply electrode being connected via the bump electrode, and a gap defined by the height of the bump electrode may be formed between the power supply electrode and the other surface of the second molded substrate, which makes it possible to adjust the characteristics according to the width of the gap.

[0053] In this case, a spacer for maintaining the gap may be provided between the other surface of the first molded substrate and the other surface of the second molded substrate. This makes it possible to prevent the gap from fluctuating. Also, a resin material may be provided in the gap. This improves the adhesion between the first and second molded substrates. In this case, if the height of the gap is G2, the relative dielectric constant of the resin material is ε, and the wavelength in a vacuum of the antenna signal fed to the first electrode is λ, then: G2<0.06(λ / √ε) It is preferable that the above formula is satisfied. This makes it possible to obtain a radiation band that functions as an antenna.

[0054] The antenna device according to the present disclosure may further include a dielectric layer formed on one surface of the second molded substrate, and an extraction conductor formed inside the dielectric layer or on the opposite surface to the surface facing the second molded substrate, and the first ground electrode may have a slot overlapping with the extraction conductor, and the extraction conductor may be electromagnetically coupled to the power feeding electrode via the slot. This allows power to be fed to the power feeding electrode without using a through conductor. In this case, the extraction conductor may be formed on the opposite surface of the dielectric layer to form a microstrip line. Alternatively, the antenna device may further include a second ground electrode formed on the opposite surface of the dielectric layer, and the extraction conductor may be formed inside the dielectric layer to form a strip line.

[0055] The antenna device according to the present disclosure further comprises a dielectric layer formed on one surface of the second molded substrate, a second ground electrode formed on the surface of the dielectric layer opposite to the surface facing the second molded substrate, and third and fourth ground electrodes extending between the surface of the dielectric layer facing the second molded substrate and the opposite surface and formed on first and second opposing side surfaces, respectively, where the first ground electrode may have a slot. In this manner, a waveguide is formed by the first to fourth ground electrodes.

[0056] The antenna device according to the present disclosure further includes a plurality of first through conductors connected to the first electrode and penetrating the first molded substrate, and a plurality of second through conductors connected to the first ground electrode and penetrating the second molded substrate, the first electrode has a slot overlapping the power supply electrode in a plan view, the plurality of first through conductors are arranged along the periphery of the first electrode, and the first and second molded substrates may be overlapped so that the plurality of first through conductors and the plurality of second through conductors are connected. This allows for the configuration of a slot antenna. EXAMPLES

[0057] <Example 1> A simulation model of Example 1 having the same structure as that of the antenna device 3 according to the third embodiment was assumed, and the relationship between the gap G2 and the antenna characteristics (reflection characteristics: S11) was simulated.

[0058] In the simulation model of Example 1, the material of the glass substrates 10 and 20 was assumed to be a glass material having a relative dielectric constant ε of 3.7 and a dielectric tangent tanδ of 0.0002. The thickness of the glass substrate 10 was set to 24 μm, the thickness of the glass substrate 20 was set to 68 μm, and the planar sizes Wx and Wy (see FIG. 7) of the glass substrates 10 and 20 were both set to 700 μm.

[0059] 7, the outer diameter width a was 167 μm, the inner diameter width b was 129 μm, and the thickness was 0.26 μm. The length Pl of the feeding electrode 32 was 72 μm, and the width Pw was 17.8 μm. The diameter of the penetrating conductor 33 was 11 μm, the distance Ps1 between the center point c of the penetrating conductor 33 and the radiating electrode 31 in a planar view was 12.8 μm, and the distance Ps2 between the center point c of the penetrating conductor 33 and the edge of the feeding electrode 32 in a planar view was 13.8 μm.

[0060] The results of the simulation are shown in Figure 17. As shown in Figure 17, the resonant frequency is about 285 GHz when the gap G2 is zero, whereas the resonant frequency shifts slightly to the higher frequency side when the gap G2 is 5 μm or more. Moreover, when the gap G2 is 5 μm or 10 μm, the reflection in the resonant frequency band is significantly reduced. It was also found that a sufficient radiation band can be obtained even when the gap G2 is 30 μm.

[0061] <Comparative Example 1> A simulation model of a comparative example having the structure shown in Fig. 18 was assumed, and the relationship between the gap G1 and the antenna characteristics (reflection characteristics: S11) was simulated. The simulation model shown in Fig. 18 differs from the simulation model of Example 1 in that the power supply electrode 32 is formed on the surface 22 of the glass substrate 20. The other parameters are the same as those of the simulation model of Example 1. The gap G1 is defined by the distance between the power supply electrode 32 and the surface 12 of the glass substrate 10.

[0062] The results of the simulation are shown in Figure 19. As shown in Figure 19, when the gap G1 was 1 μm, a sufficient radiation band was obtained, but when the gap G1 was 5 μm or 10 μm, the radiation band almost disappeared, and it was confirmed that the antenna device did not function. In other words, it can be seen that even a slight change in the gap G1 significantly changes the antenna characteristics.

[0063] <Example 2> A simulation model of Example 2 having the same structure as that of the antenna device 3 according to the third embodiment was assumed, and the relationship between the gap G2 and the antenna characteristics (reflection characteristics: S11) was simulated.

[0064] In the simulation model of Example 2, a molded substrate made of Al2O3 having a relative dielectric constant ε of 9.2 and a dielectric tangent tanδ of 0.008 was assumed instead of the glass substrates 10 and 20, the thickness of the molded substrate corresponding to the glass substrate 10 was 18.2 μm, the thickness of the molded substrate corresponding to the glass substrate 20 was 46 μm, and the planar sizes Wx and Wy (see FIG. 7) of each molded substrate were both 531 μm.

[0065] 7, the outer diameter width a was 108.5 μm, the inner diameter width b was 83.5 μm, and the thickness was 0.175 μm. The length Pl of the feeding electrode 32 was 46.6 μm, and the width Pw was 11.2 μm. The diameter of the penetrating conductor 33 was 7.2 μm, the distance Ps1 between the center point c of the penetrating conductor 33 and the radiating electrode 31 in a planar view was 8.3 μm, and the distance Ps2 between the center point c of the penetrating conductor 33 and the edge of the feeding electrode 32 in a planar view was 9.0 μm.

[0066] The results of the simulation are shown in Figure 20. As shown in Figure 20, the resonant frequency is about 290 GHz when the gap G2 is zero, whereas the resonant frequency shifts to about 315 GHz when the gap G2 is 10 μm. The resonant frequency shifts to the lower frequency side as the gap G2 becomes larger, and when the gap G2 is 40 μm, the resonant frequency is almost the same as when the gap G2 is zero, and when the gap G2 exceeds 40 μm, the resonant frequency becomes lower than when the gap G2 is zero. It was also found that a sufficient radiation band can be obtained even when the gap G2 is 60 μm.

[0067] <Comparative Example 2> A simulation model of a comparative example having the structure shown in Fig. 18 was assumed, and the relationship between the gap G1 and the antenna characteristics (reflection characteristics: S11) was simulated. The other parameters were the same as those of the simulation model of Example 2. In other words, a molded substrate made of Al2O3 was assumed instead of a glass substrate.

[0068] The results of the simulation are shown in Fig. 21. As shown in Fig. 21, it was confirmed that when the gap G1 was 10 µm or 20 µm, the radiation band completely disappeared and the antenna device did not function.

[0069] <Example 3> A simulation model of Example 3 having the same structure as the antenna device 4 according to the fourth embodiment was assumed, and the relationship between the gap G2 and the antenna characteristics (reflection characteristics: S11) was simulated. An epoxy resin with a relative dielectric constant of 4.4 was assumed as the resin material 38. The other parameters were the same as those of the simulation model of Example 1.

[0070] The results of the simulation are shown in Figure 22. As shown in Figure 22, when the gap G2 was filled with the resin material 38, the wider the gap G2 was, the lower the resonant frequency shifted to the lower frequency side. However, when the gap G2 was 30 μm, the radiation band completely disappeared, and it was confirmed that the antenna device did not function.

[0071] <Example 4> A simulation model of Example 4 having the same structure as the antenna device 4 according to the fourth embodiment was assumed, and the relationship between the gap G2 and the relative dielectric constant ε of the resin material 38 and the antenna characteristics (reflection characteristics: S11) was simulated. The other parameters were the same as those of the simulation model of Example 3.

[0072] The results of the simulation are shown in Figures 23 to 25. Figure 23 shows the simulation results when the relative dielectric constant ε of resin material 38 is 3.0, Figure 24 shows the simulation results when the relative dielectric constant ε of resin material 38 is 4.0, and Figure 25 shows the simulation results when the relative dielectric constant ε of resin material 38 is 5.0. When the resonant frequency f is 285 GHz (λ=1050 μm), the value of 0.06(λ / √ε) is 36.4 μm if ε is 3.0, 31.5 μm if ε is 4.0, and 28.2 μm if ε is 5.0.

[0073] As shown in FIG. 23, when the relative dielectric constant ε is 3.0, if the gap G2 is less than 0.06 (λ / √ε) (=36.4 μm), the radiation band appears, but if the gap G2 is 0.06 (λ / √ε) (=36.4 μm) or more, the radiation band disappears. As shown in FIG. 24, when the relative dielectric constant ε is 4.0, if the gap G2 is less than 0.06 (λ / √ε) (=31.5 μm), the radiation band appears, but if the gap G2 is 0.06 (λ / √ε) (=31.5 μm) or more, the radiation band disappears. As shown in FIG. 25, when the relative dielectric constant ε is 5.0, if the gap G2 is less than 0.06 (λ / √ε) (=28.2 μm), the radiation band appears, but if the gap G2 is 0.06 (λ / √ε) (=28.2 μm) or more, the radiation band disappears. [Explanation of symbols]

[0074] 1~8 Antenna equipment 10 First glass substrate (first molded substrate) 11 One surface of the first glass substrate 12 The other surface of the first glass substrate 20 Second glass substrate (second molded substrate) 21 One surface of the second glass substrate 22 The other surface of the second glass substrate 30 Ground electrode 31 Radiation electrode (1st electrode) 32 Power supply electrode 33 Through conductor 33a Drawer section 34 Ground electrode 34a Cutout 34s Slot 35,37 Bump electrode 36 Conductor Pattern 38 Resin materials 39 Lead conductor 40 Dielectric layer 41,42 Surface of the dielectric layer 43-46 Side of dielectric layer 47 Mode Converter 50 1st electrode 50s Slots 51,52 Through conductor 61,62 Ground electrode G0~G2 Gap

Claims

1. first and second shaped substrates; A first electrode formed on one surface of the first molded substrate; a power supply electrode formed on the other surface of the first molded substrate and overlapping with the first electrode in a plan view; a first ground electrode formed on one surface of the second molded substrate; a through conductor provided through the second molded substrate; the first and second molded substrates are stacked such that the other surface of the first molded substrate faces the other surface of the second molded substrate so that the through conductor and the power supply electrode are connected; a gap equal to or larger than a thickness of the power supply electrode is formed between the other surface of the first molded substrate and the other surface of the second molded substrate; The antenna device according to claim 1, wherein the first molded substrate and the second molded substrate are bonded to each other by a resin material filled in the gap.

2. a bump electrode provided at an end of the through conductor exposed on the other surface of the second molded substrate; the through conductor and the power supply electrode are connected via the bump electrode, 2. The antenna device according to claim 1, wherein a height of the gap between the feeding electrode and the other surface of the second molded substrate is determined by a height of the bump electrode.

3. 3. The antenna device according to claim 2, further comprising a spacer for maintaining the gap between the other surface of the first molded substrate and the other surface of the second molded substrate.

4. When the height of the gap between the feeding electrode and the other surface of the second molded substrate is G2, the relative dielectric constant of the resin material is ε, and the wavelength in a vacuum of the antenna signal fed to the first electrode is λ, G2<0.06(λ / √ε) 4. The antenna device according to claim 2, wherein the following is satisfied:

5. a dielectric layer formed on the one surface of the second molded substrate; a lead conductor formed inside the dielectric layer or on a surface opposite to the surface facing the second molded substrate, the first ground electrode has a slot overlapping the lead conductor; The antenna device according to claim 1 , wherein the lead conductor is electromagnetically coupled to the feeding electrode through the slot.

6. The antenna device according to claim 5 , wherein the lead conductor is formed on the opposite surface of the dielectric layer and constitutes a microstrip line.

7. a second ground electrode formed on the opposite surface of the dielectric layer; The antenna device according to claim 5 , wherein the lead conductor is formed inside the dielectric layer and constitutes a strip line.

8. a dielectric layer formed on the one surface of the second molded substrate; a second ground electrode formed on a surface of the dielectric layer opposite to a surface facing the second molded substrate; third and fourth ground electrodes extending between a surface of the dielectric layer facing the second molded substrate and the opposite surface of the dielectric layer and formed on first and second side surfaces facing each other, The antenna device according to claim 1 , wherein the first ground electrode has a slot.

9. a plurality of first through conductors connected to the first electrodes and provided to penetrate the first molded substrate; a plurality of second through conductors connected to the first ground electrode and provided to penetrate the second molded substrate; the first electrode has a slot overlapping with the power supply electrode in a plan view, the plurality of first through conductors are arranged along a periphery of the first electrode, The antenna device according to claim 1 , wherein the first and second molded substrates are overlapped such that the plurality of first through conductors and the plurality of second through conductors are connected to each other.

10. 10. The antenna device according to claim 1, wherein the first and second molded substrates are made of a glass material.

11. first and second shaped substrates; A first electrode formed on one surface of the first molded substrate; a power supply electrode formed on the other surface of the first molded substrate and overlapping with the first electrode in a plan view; a first ground electrode formed on one surface of the second molded substrate; a through conductor provided through the second molded substrate; a bump electrode provided at an end of the through conductor exposed on the other surface of the second molded substrate; the first and second molded substrates are stacked with the other surface of the first molded substrate facing the other surface of the second molded substrate such that the through conductor and the power supply electrode are connected via the bump electrode; an antenna device, characterized in that a gap defined by a height of the bump electrode is formed between the power supply electrode and the other surface of the second molded substrate;

12. first and second shaped substrates; A first electrode formed on one surface of the first molded substrate; a power supply electrode formed on the other surface of the first molded substrate and overlapping with the first electrode in a plan view; a first ground electrode and a dielectric layer formed on one surface of the second molded substrate; a second ground electrode formed on a surface of the dielectric layer opposite to a surface facing the second molded substrate; third and fourth ground electrodes extending between a surface of the dielectric layer facing the second molded substrate and the opposite surface of the dielectric layer and formed on first and second side surfaces facing each other, the first ground electrode has a slot; The antenna device according to claim 1, wherein the first and second molded substrates are stacked with the other surface of the first molded substrate facing the other surface of the second molded substrate.

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