Multilayer capacitor and its mounting substrate

Abstract

To provide a laminate type capacitor that is increased in capacity to improve a short-circuit defect, and a mount substrate therefor.SOLUTION: A laminate type capacitor includes: a capacitor body which includes first and second surfaces including a dielectric layer 111 and first and second internal electrodes 121, 122 and facing each other, third and fourth surfaces coupled to the first and second surfaces and facing each other, and fifth and sixth surfaces coupled to the first and second surfaces, coupled to the third and fourth surfaces, and facing each other, the first internal electrode being exposed through the third, fifth and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth and sixth surfaces; and first and second external electrodes arranged on the third and fourth surfaces and connected to the first and second internal electrodes, respectively, wherein the first internal electrode is sectioned into a (1-1)st internal electrode 121a and a (1-2)nd internal electrode 121b, the second internal electrode is sectioned into a (2-1)st internal electrode 122a and a (2-2)nd internal electrode 122b, and the fifth and sixth surfaces of the capacitor body are in an electrically open state.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a multilayer capacitor and a mounting board thereof. [Background technology]

[0002] Stacked capacitors are widely used as IT components in computers, PDAs, mobile phones, etc. due to their small size, high capacitance, and ease of implementation. They are also widely used as electrical components due to their high reliability and strength.

[0003] In recent years, with the trend toward miniaturization and multi-functionalization of electronic devices, there is a demand for multilayer capacitors that are small in size and have large capacitance. For this reason, multilayer capacitors are manufactured in which the internal electrodes are exposed in the width direction of the capacitor body, maximizing the area of ​​the internal electrodes in the width direction.

[0004] In the multilayer capacitor having this structure, after the capacitor body is manufactured and before firing, side portions are separately attached to both sides in the width direction of the capacitor body, and the side portions cover the exposed portions of the internal electrodes.

[0005] However, in a multilayer capacitor having a structure in which the internal electrodes are exposed in the width direction of the capacitor body and then the side portions are attached as described above, there is a risk that the occurrence of short circuit defects at the cut surfaces in the width direction may increase, which may cause a problem of reduced insulation resistance (IR). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 2014-0142848 [Patent Document 2] Korean Patent No. 10-1832611 [Patent Document 3] Korean Patent Publication No. 2013-0101319 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a multilayer capacitor and a mounting board thereof which increase capacitance, reduce the rate of short circuits in the width direction of the capacitor body, and reduce the problem of reduced insulation resistance. [Means for solving the problem]

[0008] One aspect of the present invention provides a multilayer capacitor including a dielectric layer and first and second internal electrodes, the multilayer capacitor including first and second surfaces opposed to each other, third and fourth surfaces connected to the first and second surfaces and opposed to each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and opposed to each other, the first internal electrodes being exposed through the third, fifth, and sixth surfaces and the second internal electrodes being exposed through the fourth, fifth, and sixth surfaces, and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, the first internal electrodes being divided into a 1-1 internal electrode and a 1-2 internal electrode by a first space portion formed near the sixth surface, and the second internal electrodes being divided into a 2-1 internal electrode and a 2-2 internal electrode by a second space portion formed near the fifth surface.

[0009] In an embodiment of the present invention, the multilayer capacitor may further include first and second side parts disposed on fifth and sixth surfaces of the capacitor body, respectively.

[0010] In one embodiment of the present invention, the 1-1 internal electrode may be exposed to a third surface and a fifth surface of the capacitor body, and the 2-1 internal electrode may be exposed to a fourth surface and a sixth surface of the capacitor body.

[0011] In one embodiment of the present invention, the 1-2 internal electrode may be exposed to a sixth surface of the capacitor body and separated from a third surface of the capacitor body by the first space portion, and the 2-2 internal electrode may be exposed to a fifth surface of the capacitor body and separated from a fourth surface of the capacitor body by the second space portion.

[0012] In one embodiment of the present invention, the first space portion may include a 1-1 space portion formed elongated in a direction perpendicular to the third and fourth surfaces, and a 1-2 space portion extending vertically from an end of the 1-1 space portion to the fifth and sixth surfaces and exposed through the sixth surface, and the second space portion may include a 2-1 space portion formed elongated in a direction perpendicular to the third and fourth surfaces, and a 2-2 space portion extending vertically from an end of the 2-1 space portion to the fifth and sixth surfaces and exposed through the fifth surface.

[0013] In one embodiment of the present invention, the 1-1 internal electrode may further include a first lead portion exposed through the third and sixth surfaces, and the 2-1 internal electrode may further include a second lead portion exposed through the fourth and fifth surfaces.

[0014] In one embodiment of the present invention, a first notch may be provided in the 1-1 internal electrode at a portion connecting the third surface and the fifth surface of the capacitor body, and a second notch may be provided in the 2-1 internal electrode at a portion connecting the fourth surface and the sixth surface of the capacitor body.

[0015] In an embodiment of the present invention, the capacitor body may include an active region where the first and second internal electrodes overlap, and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively.

[0016] In one embodiment of the present invention, the first and second external electrodes may each include first and second connection portions disposed on third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, and first and second band portions each extending from the first and second connection portions to a portion of the first surface of the body.

[0017] Another aspect of the present invention relates to a capacitor body including a dielectric layer and first and second internal electrodes, the capacitor body including first and second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, the first internal electrode being exposed through the third surface and the second internal electrode being exposed through the fourth surface; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, provides a multilayer capacitor including a 1-1 internal electrode arranged on one dielectric layer to be exposed through a third and fifth surface of the capacitor body, and a 1-2 internal electrode spaced apart from the 1-1 internal electrode and the third surface and arranged to be exposed through a sixth surface of the capacitor body, wherein the second internal electrode includes a 2-1 internal electrode arranged on one dielectric layer to be exposed through a fourth and sixth surface of the capacitor body, and a 2-2 internal electrode spaced apart from the 2-1 internal electrode and the fourth surface and arranged to be exposed through a fifth surface of the capacitor body.

[0018] Another aspect of the present invention provides a mounting substrate for a multilayer capacitor, the mounting substrate including: a substrate having first and second electrode pads on one surface; and a multilayer capacitor mounted such that first and second external electrodes are connected to the first and second electrode pads, respectively. Effect of the Invention

[0019] According to an embodiment of the present invention, the capacitance of the multilayer capacitor can be increased by expanding the internal electrodes to be exposed in the width direction of the capacitor body, and both sides of the capacitor body in the width direction are electrically open, which has the effect of reducing problems of short circuits and reduced insulation resistance that may occur at the cut surfaces in the width direction. [Brief description of the drawings]

[0020] [Figure 1] 1 is a perspective view showing a multilayer capacitor according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. [Diagram 3] 2(a) and 2(b) are plan views showing first and second internal electrodes of the multilayer capacitor of FIG. 1. [Figure 4] 2 is a cross-sectional view taken along line II-II' in FIG. [Diagram 5] FIG. 2 is a cross-sectional view taken along line III-III' in FIG. [Figure 6] 5(a) and 5(b) are plan views showing other embodiments of the first and second internal electrodes. [Figure 7] 13(a) and 13(b) are plan views showing still another embodiment of the first and second internal electrodes. [Figure 8] 2 is a cross-sectional view that illustrates a schematic diagram of a substrate on which the multilayer capacitor of FIG. 1 is mounted. [Figure 9] 1 is a graph showing a comparison of BDV between the comparative example and the embodiment. [Figure 10] 1 is a graph showing a comparison of short circuit rates between a comparative example and an embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, preferred embodiments of the present invention will be described with reference to various examples. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. Furthermore, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

[0022] Additionally, throughout the specification, unless specifically stated to the contrary, "comprising" an element means that it may further include other elements, rather than excluding other elements.

[0023] To clearly explain the embodiments of the present invention, directions are defined as follows: X, Y, and Z shown in the drawings respectively indicate the length direction, width direction, and thickness direction of the multilayer capacitor.

[0024] In this embodiment, the Z direction is used as the same concept as the lamination direction in which the dielectric layers are laminated.

[0025] FIG. 1 is a perspective view showing a multilayer capacitor according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II' in FIG. 1, FIGS. 3(a) and 3(b) are plan views showing first and second internal electrodes of the multilayer capacitor of FIG. 1, FIG. 4 is a cross-sectional view taken along line II-II' in FIG. 1, and FIG. 5 is a cross-sectional view taken along line III-III' in FIG. 1.

[0026] The multilayer capacitor of this embodiment will be described below with reference to FIGS.

[0027] 1 to 5, a multilayer capacitor 100 of this embodiment includes a capacitor body 110, and first and second external electrodes 131 and 132. As shown in FIG.

[0028] The capacitor body 110 is formed by stacking a plurality of dielectric layers 111 in the Z direction and firing them, and the boundaries between adjacent dielectric layers 111 of the capacitor body 110 can be so integrated that they are difficult to see without using a scanning electron microscope (SEM).

[0029] The capacitor body 110 includes a plurality of dielectric layers 111, and first and second internal electrodes 121 and 122 having different polarities and alternately arranged in the Z direction with the dielectric layers 111 interposed therebetween.

[0030] In addition, the capacitor body 110 may include an active region in which first and second internal electrodes are alternately arranged in the Z direction with a dielectric layer 111 sandwiched therebetween as a part that contributes to forming the capacitance of the capacitor, and upper and lower cover regions 112, 113 provided on the upper and lower surfaces of the active region in the Z direction, respectively, as margin portions.

[0031] In addition, the capacitor body 110 is not particularly limited in shape, but may be approximately hexahedral and may include first and second surfaces 1, 2 facing each other in the Z direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the X direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other. In this embodiment, the first surface 1 may be a mounting surface of the multilayer capacitor 100.

[0032] The dielectric layer 111 may include a ceramic powder, such as a BaTiO3-based ceramic powder.

[0033] The BaTiO3 ceramic powder is a powder in which Ca or Zr is partially dissolved in BaTiO3 (BT) (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, but the present invention is not limited to these.

[0034] In addition to the ceramic powder, the dielectric layer 111 may further contain a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like.

[0035] The ceramic additives can include, for example, transition metal oxides or carbides, rare earth elements, magnesium (Mg), or aluminum (Al), and the like.

[0036] The first and second internal electrodes 121, 122 can be formed on each dielectric layer 111 as electrodes that apply different polarities and can be stacked alternately in the Z direction, and can be arranged alternately to face each other along the Z direction inside the capacitor body 110 with one dielectric layer 111 sandwiched between them.

[0037] At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0038] The first internal electrode 121 can be exposed through the third, fifth and sixth faces 3 , 5 , 6 of the dielectric layer 111 .

[0039] In addition, the first internal electrode 121 may be divided into a 1-1 internal electrode 121a and a 1-2 internal electrode 121b by a first space portion 123 formed at a position close to the sixth surface 6 of the capacitor body 110 in the Y direction.

[0040] The 1-1 internal electrode 121 a may be formed on the dielectric layer 111 so as to be exposed through the third surface 3 and the fifth surface 5 of the capacitor body 110 .

[0041] The 1-2 internal electrode 121b may be formed on the dielectric layer 111 on which the 1-1 internal electrode 121a is formed, so as to be exposed only through the sixth surface 6 of the capacitor body 110 while being spaced apart in the Y direction by the first space portion 123. That is, the 1-2 internal electrode 121b is formed so as to be spaced apart from the third surface 3 of the capacitor body 111.

[0042] In addition, the first space portion 123 may include a 1-1 space portion 123a formed long in the X direction and a 1-2 space portion 123b extended in the Y direction from an end of the 1-1 space portion 123a and exposed through the sixth surface 6 of the capacitor body 110. In this case, the 1-2 space portion 123b may be exposed through the third surface 3 of the capacitor body 110.

[0043] According to this embodiment, the 1-1 internal electrode 121a and the 1-2 internal electrode 121b are separated from each other by the first space portion 123, and the 1-2 internal electrode 121b is not connected to the first external electrode 131 described later, so that the sixth surface 6 of the capacitor body 110 where the 1-2 internal electrode 121b is exposed can be electrically open.

[0044] The second internal electrode 122 can be exposed through the fourth, fifth and sixth faces 4 , 5 , 6 of the dielectric layer 111 .

[0045] In addition, the second internal electrode 122 may be divided into a 2-1 internal electrode 122a and a 2-2 internal electrode 122b by a second space portion 124 formed at a position close to the fifth surface 5 of the capacitor body 110 in the Y direction.

[0046] The 2-1 internal electrode 122 a may be formed on the dielectric layer 111 so as to be exposed through the fourth face 4 and the sixth face 6 of the capacitor body 110 .

[0047] The 2-2 internal electrode 122b may be formed on the dielectric layer 111 on which the 2-1 internal electrode 122a is formed, so as to be exposed only through the fifth surface 5 of the capacitor body 111 while being spaced apart in the Y direction by the second space portion 124. That is, the 2-2 internal electrode 122b is formed so as to be spaced apart from the fourth surface 4 of the capacitor body 110.

[0048] In addition, the second space portion 124 may include a 2-1 space portion 124a formed long in the X direction and a 2-2 space portion 124b extended in the Y direction from an end of the 2-1 space portion 124a and exposed through the fifth surface 5 of the capacitor body 110. In this case, the 2-2 space portion 124b may also be exposed through the fourth surface 4 of the capacitor body 110.

[0049] According to this embodiment, the 2-1 internal electrode 122a and the 2-2 internal electrode 122b are separated from each other by the first space portion 124, and the 2-2 internal electrode 122b is not connected to the second external electrode 132 described later, so that the fifth surface 5 of the capacitor body 110 where the 2-2 internal electrode 122b is exposed can be electrically open.

[0050] At this time, an end of the 1-1 internal electrode 121a of the first internal electrode 121 exposed through the third surface 3 of the capacitor body 110 and an end of the 2-1 internal electrode 122a of the second internal electrode 122 exposed through the fourth surface 4 of the capacitor body 110 may be electrically connected to first and second external electrodes 131, 132, respectively, arranged at both ends of the capacitor body 110 in the X direction, which will be described later.

[0051] With the above-described configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122.

[0052] At this time, the capacitance of the multilayer capacitor 100 is proportional to the overlapping area of ​​the first and second internal electrodes 121 and 122 that overlap each other along the Z direction in the active region.

[0053] By configuring the first and second internal electrodes 121, 122 as in this embodiment, not only is the basic area of ​​the first and second internal electrodes 121, 122 increased, but the overlapping area between the top and bottom is also increased, thereby increasing the capacitance of the multilayer capacitor 100.

[0054] That is, when the area of ​​the mutually overlapping region of the first and second internal electrodes 121 and 122 is maximized, the capacitance can be maximized even for capacitors of the same size.

[0055] Furthermore, since the steps caused by lamination of the internal electrodes can be reduced and the accelerated life of the insulation resistance can be improved, it is possible to provide a multilayer capacitor 100 with excellent capacitance characteristics and improved reliability.

[0056] In addition, the fifth and sixth surfaces 5, 6 of the capacitor body 110 are electrically opened, and during the process of stacking a plurality of dielectric layers 111 having internal electrodes formed thereon and then cutting them into individual chips, a problem in which a portion of the first and second internal electrodes 121, 122 flows out and comes into contact with the second and first internal electrodes 122, 121 of different polarities located above and below in the Z direction, causing electrical defects, can be reduced.

[0057] At this time, the material for forming the first and second internal electrodes 121, 122 is not particularly limited, and they may be formed using a conductive paste made of at least one of precious metal materials, nickel (Ni), and copper (Cu).

[0058] The conductive paste may be printed by screen printing, gravure printing or the like, but the present invention is not limited thereto.

[0059] The multilayer capacitor 100 of this embodiment may further include first and second side portions 141 and 142.

[0060] The first side portion 141 is disposed on a fifth surface 5 of the capacitor body 110 , and the second side portion 142 is disposed on a sixth surface 6 of the capacitor body 110 .

[0061] The first and second side portions 141 and 142 are in contact with and cover the tips of the first and second internal electrodes 121 and 122 that are exposed through the fifth and sixth faces 5 and 6 of the capacitor body 110, respectively.

[0062] The first and second side portions 141 and 142 may serve to protect the capacitor body 110 and the first and second internal electrodes 121 and 122 from external impacts and the like, and to ensure the insulation and moisture resistance reliability around the capacitor body 110.

[0063] The first and second external electrodes 131, 132 are provided with voltages of different polarities, are disposed at both ends of the body 110 in the X direction, and are electrically connected to the portions of the 1-1 and 2-1 internal electrodes 121a, 122a exposed through the third and fourth surfaces 3, 4 of the capacitor body 110, respectively.

[0064] The first external electrode 131 may include a first connection portion 131a and a first band portion 131b.

[0065] The first connection portion 131a is arranged on the third surface 3 of the capacitor body 110 and contacts the end portion exposed to the outside from the 1-1 internal electrode 121a through the third surface 3 of the capacitor body 110, thereby serving to physically and electrically connect the 1-1 internal electrode 121a and the first external electrode 131 to each other.

[0066] The first band portion 131b is a portion that extends from the first connection portion 131a to a part of the first surface 1 of the capacitor body 110.

[0067] In this case, the first band portion 131b may be further extended toward the second, fifth, and sixth surfaces 2, 5, and 6 of the capacitor body 110, if necessary, to improve the bonding strength, and may be formed to cover one end of the first and second side portions 141 and 142.

[0068] The second external electrode 132 may include a second connection portion 132a and a second band portion 132b.

[0069] The second connection portion 132a is arranged on the fourth surface 4 of the capacitor body 110 and contacts the end portion exposed to the outside from the 2-1 internal electrode 122a through the fourth surface 4 of the capacitor body 110, thereby serving to physically and electrically connect the 2-1 internal electrode 122a and the second external electrode 132 to each other.

[0070] The second band portion 132 b is a portion that extends from the second connection portion 132 a to a part of the first surface 1 of the capacitor body 110 .

[0071] In this case, the second band portion 132b may be further extended toward the second, fifth, and sixth surfaces 2, 5, and 6 of the capacitor body 110 to improve the bonding strength, if necessary, and may be formed to cover the other ends of the first and second side portions 141 and 142.

[0072] In addition, the first and second external electrodes 131 and 132 may each include a plating layer to improve at least some of the structural reliability, ease of substrate mounting, durability against the outside, heat resistance, and equivalent series resistance (ESR).

[0073] For example, the plating layer may be formed by sputtering or electrolytic deposition, but is not limited thereto.

[0074] In addition, the plating layer may contain nickel most abundantly, but is not limited thereto, and may be realized by copper (Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), etc. alone or an alloy of at least one of these.

[0075] In the multilayer capacitor 100 of this embodiment, the first and second internal electrodes 121, 122 are exposed through the fifth and sixth faces 5, 6 of the capacitor body 110, so that the step of the capacitor body 110 at the ends of the first and second internal electrodes 121, 122 in the Y direction can be improved.

[0076] Therefore, even if the thickness of the dielectric layer 111 and the first and second internal electrodes 121, 122 are reduced to form a multi-layer thin film, no significant problems arise with the reliability of the multilayer capacitor 100, so that the capacitance of the multilayer capacitor 100 can be increased while also ensuring reliability.

[0077] Furthermore, conventional multilayer capacitors in which the internal electrodes are exposed on both sides of the capacitor body in the width direction are likely to have a significantly increased risk of short-circuit defects on the fifth and sixth sides of the capacitor body, compared to multilayer capacitors in which the internal electrodes are not exposed in the width direction of the capacitor body.

[0078] This may require additional steps such as cleaning the fifth and sixth surfaces of the capacitor body before attaching the side portions.

[0079] Furthermore, these short circuit defects may cause a decrease in the insulation resistance of the multilayer capacitor.

[0080] In this embodiment, the fifth and sixth surfaces 5, 6 of the capacitor body 110 are electrically opened, and in the process of stacking a plurality of dielectric layers 111 having internal electrodes formed thereon and then cutting them into individual chips, a portion of the first and second internal electrodes 121, 122 flows out through the fifth and sixth surfaces 5, 6 of the capacitor body 110, so that even if the second and first internal electrodes 122, 121 of different polarities come into contact with each other, a short circuit does not occur, thereby improving the reliability of the multilayer capacitor 110.

[0081] By reducing the proportion of short-circuit defects in the multilayer capacitor 100 in this manner, the problem of the insulation resistance of the multilayer capacitor 100 decreasing can also be alleviated.

[0082] Referring to FIG. 8, the mounting substrate of the multilayer capacitor according to this embodiment includes a substrate 210 having first and second electrode pads 221, 222 on one surface, and a multilayer capacitor 100 mounted on the upper surface of the substrate 210 such that first and second external electrodes 131, 132 are connected to the first and second electrode pads 221, 222, respectively.

[0083] In this embodiment, stacked capacitor 100 is shown and described as being mounted to substrate 210 via solder 231, 232, although a conductive paste may be used instead of solder if desired.

[0084] Experimental Form An experiment was carried out below to compare the capacitance and BDV of the multilayer capacitor of the present invention with those of a conventional multilayer capacitor, and the results are shown in FIG.

[0085] The comparative example is a multilayer capacitor having a length and width of 1.440 mm and 0.797 mm, and the first and second internal electrodes are exposed to the fifth and sixth surfaces of the capacitor body.

[0086] The example is a multilayer capacitor having the same size as the comparative example, and the first and second internal electrodes have the structure shown in FIG.

[0087] Here, the BDV is determined by applying a voltage to the multilayer capacitor starting from 0V and increasing the voltage to a voltage at which a short circuit occurs, and measuring the voltage at which a short circuit occurs.

[0088] 9, the average BDV of the comparative example was 75.7 V, while the average BDV of the example was 93.27 V, which means that the average BDV of the example increased by 20.6 V compared to the comparative example. Also, in the comparative example, the percentage of BDVs below 80 V was about 50%, while in the example, the percentage of BDVs below 80 V was about 7%, confirming that the example has a much more robust design structure than the comparative example.

[0089] Here, the short-circuit rate is determined by applying a current and voltage specified for each model, measuring the resistance value, and checking whether or not a short circuit has occurred.

[0090] 10, the short circuit rate of the comparative example was 16%, while the short circuit rate of the working example was 6%, which means that the short circuit rate of the working example was reduced by 62.5% compared to the comparative example. This shows that the reliability of the multilayer capacitor in the working example is excellent.

[0091] The present invention is not limited by the above-described embodiments and accompanying drawings, but by the appended claims.

[0092] Therefore, various substitutions, modifications and alterations are possible by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0093] For example, as shown in FIG. 6, the 1-1 internal electrode 121a of the first internal electrode 121' may further include a first lead portion 121c extending from the dielectric layer 111 at a position close to the sixth surface 6 of the capacitor body 110 so as to be exposed through the third and sixth surfaces 3, 6 of the capacitor body 110.

[0094] At this time, the first lead portion 121c may be exposed through a corner portion connecting the third and sixth faces 3 and 6 of the capacitor body 110 to each other.

[0095] The 2-1 internal electrode 122a of the second internal electrode 122' may further include a second lead portion 122c extended on the dielectric layer 111 at a position close to the fifth surface 5 of the capacitor body 110 so as to be exposed through the fourth and fifth surfaces 4, 5 of the capacitor body 110.

[0096] At this time, the second lead portion 122c may also be exposed through a corner portion connecting the fourth and fifth faces 4 and 5 of the capacitor body 110 to each other.

[0097] Since the probability of short circuit occurrence is relatively low at the positions of the fifth and sixth surfaces 5, 6 of the capacitor body 110 adjacent to the third and fourth surfaces 3, 4, this structure does not significantly increase the probability of short circuit occurrence, and can further improve the electrical connectivity of the internal electrodes and external electrodes.

[0098] 7, the 1-1 internal electrode 121a' of the first internal electrode 121'' may have a first cutout 125 at a portion connecting the third surface 3 and the fifth surface 5 of the capacitor body 110 to each other.

[0099] At this time, the first cutout portion 125 may be formed at a corner portion connecting the third surface 3 and the fifth surface 5 of the capacitor body 110 to each other.

[0100] In addition, a second cutout 126 may be provided in a portion of the 2-1 internal electrode 122a' of the second internal electrode 122'' that connects the fourth surface 4 and the sixth surface 6 of the capacitor body 110 to each other.

[0101] At this time, the second cutout portion 126 may be formed at a corner portion connecting the fourth surface 4 and the sixth surface 6 of the capacitor body 110 to each other.

[0102] The first and second cut portions 125 and 126 can further improve the moisture resistance reliability of the multilayer capacitor. [Explanation of symbols]

[0103] 100 Stacked Capacitor 110 Capacitor body 111 Dielectric layer 121, 122 First and second internal electrodes 121a, 121a' 1st-1st internal electrode 121b, 121b' 1st-2nd internal electrode 122a, 122a' 2nd-1st internal electrode 122b, 122b' 2nd-2nd internal electrode 123, 123' First Space 124, 124' Second space section 131, 132 First and second external electrodes 131a, 132a First and second connection parts 131b, 132b First and second band parts 141, 142 First and second side portions 210 Substrate 221, 222 First and second electrode pads 231, 232 Solder

Claims

1. a capacitor body including a dielectric layer, first and second internal electrodes, first and second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, the first internal electrodes being exposed through the third, fifth, and sixth surfaces, and the second internal electrodes being exposed through the fourth, fifth, and sixth surfaces; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, The first internal electrode is divided into a 1-1 internal electrode and a 1-2 internal electrode by a first space portion formed in a position close to the sixth surface, and the second internal electrode is divided into a 2-1 internal electrode and a 2-2 internal electrode by a second space portion formed in a position close to the fifth surface, the first-2 internal electrode is exposed to the sixth surface of the capacitor body and is spaced from the third surface of the capacitor body by the first space portion; the second-2 internal electrode is exposed to the fifth surface of the capacitor body and is spaced from the fourth surface of the capacitor body by the second spacer.

2. The multilayer capacitor of claim 1 , further comprising first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively.

3. the first-1 internal electrode is exposed to the third surface and the fifth surface of the capacitor body; 3. The multilayer capacitor according to claim 1, wherein the 2-1 internal electrodes are exposed to the fourth surface and the sixth surface of the capacitor body.

4. the first space portion includes a first-1 space portion formed long in a direction perpendicular to the third and fourth surfaces, and a first-2 space portion extending from an end of the first-1 space portion in a direction perpendicular to the fifth and sixth surfaces and exposed through the sixth surface; 2. The stacked capacitor of claim 1, wherein the second space portion includes a 2-1 space portion formed elongated in a direction perpendicular to the third and fourth surfaces, and a 2-2 space portion extending from an end of the 2-1 space portion in a direction perpendicular to the fifth and sixth surfaces and exposed through the fifth surface.

5. the 1-1 internal electrode further includes a first lead portion exposed through the third and sixth surfaces, 5. The multilayer capacitor according to claim 1, wherein the 2-1st internal electrode further includes a second lead portion exposed through the fourth and fifth surfaces.

6. a first cutout portion is provided in a portion of the 1-1 internal electrode connecting the third surface and the fifth surface of the capacitor body; 6. The multilayer capacitor according to claim 1, wherein a second cutout is provided in the 2-1 internal electrode at a portion connecting the fourth surface and the sixth surface of the capacitor body.

7. 7. The multilayer capacitor of claim 1, wherein the capacitor body includes an active region where the first and second internal electrodes overlap, and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively.

8. The first and second external electrodes are first and second connection parts disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, respectively; 8. The multilayer capacitor of claim 1, further comprising: first and second band portions extending from the first and second connection portions to a portion of the first surface of the capacitor body, respectively.

9. the first-2 internal electrode is exposed to the sixth surface of the capacitor body and is spaced from the third surface of the capacitor body by the first space portion; 9. The multilayer capacitor of claim 3, wherein the second-2 internal electrode is exposed to the fifth surface of the capacitor body and is separated from the fourth surface of the capacitor body by the second spacer.

10. the first space portion includes a first-1 space portion formed long in a direction perpendicular to the third and fourth surfaces, and a first-2 space portion extending from an end of the first-1 space portion in a direction perpendicular to the fifth and sixth surfaces and exposed through the sixth surface; 10. The stacked capacitor of claim 9, wherein the second space portion includes a 2-1 space portion formed elongated in a direction perpendicular to the third and fourth surfaces, and a 2-2 space portion extending from an end of the 2-1 space portion in a direction perpendicular to the fifth and sixth surfaces and exposed through the fifth surface.

11. the 1-1 internal electrode further includes a first lead portion exposed through the third and sixth surfaces, 11. The multilayer capacitor according to claim 10, wherein the 2-1 internal electrode further includes a second lead portion exposed through the fourth and fifth surfaces.

12. a first cutout portion is provided in a portion of the 1-1 internal electrode connecting the third surface and the fifth surface of the capacitor body; 12. The multilayer capacitor according to claim 11, wherein a second cutout is provided in the 2-1 internal electrode at a portion connecting the fourth surface and the sixth surface of the capacitor body.

13. a capacitor body including a dielectric layer, first and second internal electrodes, first and second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and facing each other; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, The first internal electrode includes a 1-1 internal electrode disposed on one dielectric layer so as to be exposed through the third and fifth surfaces of the capacitor body, and a 1-2 internal electrode spaced apart from the 1-1 internal electrode and the third surface and disposed so as to be exposed through the sixth surface of the capacitor body, The second internal electrode includes a 2-1 internal electrode disposed on one dielectric layer so as to be exposed through the fourth and sixth surfaces of the capacitor body, and a 2-2 internal electrode spaced apart from the 2-1 internal electrode and the fourth surface and disposed so as to be exposed through the fifth surface of the capacitor body.

14. The multilayer capacitor of claim 13 , further comprising first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively.

15. the first-1 internal electrode is exposed to the third surface and the fifth surface of the capacitor body; 15. The multilayer capacitor according to claim 13, wherein the 2-1 internal electrodes are exposed to the fourth surface and the sixth surface of the capacitor body.

16. a first cutout portion is provided in a portion of the 1-1 internal electrode connecting the third surface and the fifth surface of the capacitor body; 16. The multilayer capacitor according to claim 13, wherein a second cutout is provided in the 2-1 internal electrode at a portion connecting the fourth surface and the sixth surface of the capacitor body.

17. the 1-1 internal electrode further includes a first lead portion exposed through the third and sixth surfaces, 17. The multilayer capacitor according to claim 13, wherein the 2-1 internal electrode further includes a second lead portion exposed through the fourth and fifth surfaces.

18. a substrate having first and second electrode pads on one surface; 18. A mounting board for a multilayer capacitor comprising: the multilayer capacitor according to claim 1 , mounted such that the first and second external electrodes are connected to the first and second electrode pads, respectively.

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