Vibration Device

Abstract

To provide a vibration device which remedies the difficulty in handling and suppresses cracking or chipping of a vibrator.SOLUTION: A vibration device 1 comprises: a multilayer substrate 2 including a first face 101, a second face 102 positioned on the opposite side of the first face 101, a first insulation layer 21 including the first face 101, a second insulation layer 22 including the second face 102, a bottomed recess 40 including an opening 41 in the first face 101 and penetrating the first insulation layer 21, and a connection wiring layer 25 disposed between the first insulation layer 21 and the second insulation layer 22; a vibrator 5 which includes a container 51 including a storage space 52, a vibration element 6 stored in the storage space 52 and a connection terminal 70 disposed on an outer surface of the container 51 and electrically connected with the vibration element 6, and is disposed inside of the recess 40; and a conductive connection member 8 electrically connecting the connection wiring layer 25 and the connection terminal 70 to each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a vibration device. [Background technology]

[0002] 2. Description of the Related Art In recent years, various electronic devices have become smaller and thinner. This has led to a demand for miniaturization of vibration devices such as crystal oscillators used in these electronic devices. For example, Patent Document 1 describes that a piezoelectric oscillator, which is a vibration device, can be miniaturized by stacking a first substrate made of silicon carrying a quartz crystal unit on a second substrate made of silicon with a recess for accommodating the quartz crystal unit, bonding them together, and packaging them with the quartz crystal unit housed in the recess. Furthermore, for example, Patent Document 2 describes that one main surface of a quartz vibration plate having a vibrating portion is bonded to a first sealing member formed from quartz, and the other main surface of the quartz vibration plate is bonded to a second sealing member formed from quartz, thereby forming a sandwich-structure package, which enables the miniaturization of a quartz oscillator, which is a vibration device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-139717 A [Patent Document 2] JP 2020-120345 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the vibration devices described in Patent Documents 1 and 2 have the problem that they are difficult to handle due to their miniaturization, and because the components that make up the package are silicon substrates and quartz crystal, the vibrator or oscillator that constitutes the vibration device is fragile and prone to chipping. [Means for solving the problem]

[0005] The vibration device has a multilayer substrate having a first surface, a second surface located opposite the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a recess having an opening on the first surface and a bottom that penetrates at least the first insulating layer, and a connection wiring layer arranged between the first insulating layer and the second insulating layer, a container having an accommodating space, a vibration element accommodated in the accommodating space, and a connection terminal arranged on the outer surface of the container and electrically connected to the vibration element, and a conductive connecting member that electrically connects a vibrator arranged in the recess, the connection wiring layer, and the connection terminal. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a plan view showing a schematic structure of a vibration device according to a first embodiment. [Diagram 2] Cross-sectional view taken along line AA in Figure 1. [Diagram 3] FIG. 11 is a plan view showing a schematic structure of a vibration device according to a second embodiment. [Figure 4] Cross-sectional view of line BB in Figure 2. [Diagram 5] FIG. 11 is a plan view showing a schematic structure of a vibration device according to a third embodiment. [Figure 6] Cross-sectional view taken along line CC in Figure 5. [Figure 7] Cross-sectional view taken along line DD in Figure 5. [Figure 8] FIG. 11 is a plan view showing a schematic structure of a vibration device according to a fourth embodiment. [Figure 9] Cross-sectional view taken along line EE in Figure 8. [Figure 10] FIG. 11 is a plan view showing a schematic structure of a vibration device according to a fifth embodiment. [Figure 11] Cross-sectional view of line GG in Figure 10. [Figure 12] FIG. 13 is a plan view showing a schematic structure of a vibration device according to a sixth embodiment. [Figure 13] Cross-sectional view of line HH in Figure 12. [Figure 14]FIG. 13 is a plan view showing a schematic structure of a vibration device according to a seventh embodiment. [Figure 15] Cross-sectional view taken along line II in Figure 14. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] 1. Embodiment 1 A vibration device 1 according to a first embodiment will be described with reference to FIGS. For ease of explanation, the following figures show three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis. The direction along the X-axis is called the "X-direction", the direction along the Y-axis is called the "Y-direction", and the direction along the Z-axis is called the "Z-direction". The arrow side of each axis is also called the "plus side", and the opposite side to the arrow is also called the "minus side". The plus side of the Z direction is also called the "upper", and the minus side of the Z direction is also called the "lower". In a plan view from the Z direction, the surface on the plus side of the Z direction is called the upper surface, and the surface on the minus side of the Z direction opposite to the upper surface is called the lower surface.

[0008] 1 and 2, the resonator device 1 includes a first surface 101, a second surface 102 located on the opposite side to the first surface 101, a first insulating layer 21 including the first surface 101, a second insulating layer 22 including the second surface 102, a multilayer substrate 2 having an opening 41 on the first surface 101, a bottomed recess 40 penetrating the first insulating layer 21, and a connection wiring layer 25 arranged between the first insulating layer 21 and the second insulating layer 22, a container 51 having an accommodation space 52, a resonator element 6 accommodated in the accommodation space 52, and a connection terminal 70 arranged on the outer surface of the container 51 and electrically connected to the resonator element 6, and a conductive connection member 8 electrically connecting the resonator 5 arranged in the recess 40, the connection wiring layer 25, and the connection terminal 70. The accommodation space 52 is also referred to as an accommodation section.

[0009] First, the multilayer substrate 2 will be described. The multilayer substrate 2 is a flat plate having a rectangular outer shape when viewed in a plan view from a Z direction perpendicular to a first surface 101 of the multilayer substrate 2. In this embodiment, the first surface 101 is an upper surface of the multilayer substrate 2, and the second surface 102 is a lower surface of the multilayer substrate 2.

[0010] The multilayer substrate 2 is, for example, a substrate in which a plurality of printed wiring boards are laminated in the Z direction, which is the thickness direction of the printed wiring boards. As the multilayer substrate 2, a resin substrate such as a glass epoxy substrate, a glass phenol substrate, or a glass polyimide substrate can be used. In this embodiment, the multilayer substrate 2 is a glass epoxy substrate.

[0011] The multilayer substrate 2 has a first insulating layer 21 including a first surface 101, a second insulating layer 22 including a second surface 102, and a third insulating layer 23 disposed between the first insulating layer 21 and the second insulating layer 22. The first insulating layer 21, the third insulating layer 23, and the second insulating layer 22 are laminated in this order from top to bottom.

[0012] In the multilayer substrate 2, a first wiring layer 26 is disposed between the first insulating layer 21 and the third insulating layer 23 adjacent to each other in the Z direction, which is the stacking direction. A second wiring layer 27 is disposed between the third insulating layer 23 and the second insulating layer 22 adjacent to each other in the stacking direction.

[0013] Additionally, on the second surface 102 of the multilayer substrate 2, external terminals 28 for electrical connection to the outside are arranged.

[0014] The second insulating layer 22 and the third insulating layer 23 have a through hole 291 penetrating the second insulating layer 22 and the third insulating layer 23 in the Z direction, which is the thickness direction of each of them, and a through electrode 29 embedded inside the through hole 291. The through electrode 29 electrically connects the first wiring layer 26, the second wiring layer 27, and the external terminal 28. In this embodiment, the first insulating layer 21 does not have the through hole 291 and the through electrode 29, but the first insulating layer 21 may have the through hole 291 and the through electrode 29.

[0015] Furthermore, the multilayer substrate 2 has a bottomed recess 40 having an opening 41 on the first surface 101 . In this embodiment, the recess 40 penetrates the first insulating layer 21 including the first surface 101. That is, the first insulating layer 21 has a through portion corresponding to the recess 40. In the through portion corresponding to the recess 40 of the first insulating layer 21, the surface located on the opposite side to the first surface 101 is blocked by the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. In this manner, a bottomed recess 40 having an opening 41 in the first surface 101 and penetrating the first insulating layer 21 is formed. The bottom surface 42 of the recess 40 is the surface of the third insulating layer 23 that blocks the through portion corresponding to the recess 40 of the first insulating layer 21, facing the first insulating layer 21.

[0016] In this embodiment, the opening 41 of the recess 40 has a rectangular shape in a plan view from the Z direction, and the opening 41 is surrounded by the first surface 101. In other words, the periphery of the recess 40 is surrounded by the first surface 101.

[0017] As described above, since the first wiring layer 26 is disposed between the first insulating layer 21 and the third insulating layer 23 adjacent to each other in the stacking direction, the first wiring layer 26 can be disposed on the bottom surface 42 of the recess 40, which is the surface of the third insulating layer 23 facing the first insulating layer 21. The first wiring layer 26 disposed on the bottom surface 42 of the recess 40 can function as the connection wiring layer 25. In other words, the first wiring layer 26 serving as the connection wiring layer 25 is disposed on the bottom surface 42 of the recess 40.

[0018] The first wiring layer 26 serving as the connection wiring layer 25 disposed on the bottom surface 42 of the recess 40 is located on the negative side in the Z direction from the first surface 101 of the multilayer substrate 2, and is located on the positive side in the Z direction from the second surface 102 of the multilayer substrate 2. In other words, the first wiring layer 26 serving as the connection wiring layer 25 is disposed between the first surface 101 of the multilayer substrate 2 and the second surface 102 of the multilayer substrate 2.

[0019] The first wiring layer 26 as the connection wiring layer 25 is electrically connected via a conductive connecting member 8 to a connection terminal 70 described later, which is arranged on the outer surface of the container 51 of the vibrator 5 placed in the recess 40.

[0020] In addition, the first wiring layer 26 as the connection wiring layer 25 is electrically connected to an external terminal 28 arranged on the second surface 102 of the multilayer substrate 2 via a through electrode 29, or via the through electrode 29 and the second wiring layer 27.

[0021] Next, the vibrator 5 will be described.

[0022] The vibrator 5 has a container 51 having an accommodation space 52, a vibration element 6 accommodated in the accommodation space 52, and a connection terminal 70 disposed on the outer surface of the container 51 and electrically connected to the vibration element 6. Note that the outer surface of the container 51 means the outer surface of the container 51, and includes the upper surface, lower surface, and side surfaces of the container 51.

[0023] The container 51 includes a base 53 which is a semiconductor substrate, and a lid 54 which is also a semiconductor substrate.

[0024] The base 53 is plate-shaped. The base 53 has a surface 55 facing the lid 54 and a surface 56 located on the opposite side to the surface 55 facing the lid 54. In this embodiment, the surface 56 located on the opposite side to the surface 55 facing the lid 54 becomes the lower surface of the container 51.

[0025] In this embodiment, the base 53 is a semiconductor substrate including single crystal silicon. However, the base 53 may be a semiconductor substrate other than silicon, such as a germanium substrate, a gallium arsenide substrate, a gallium phosphide substrate, a gallium nitride substrate, or a silicon carbide substrate.

[0026] The lid 54 is box-shaped. The lid 54 has a surface 57 facing the base 53, a surface 58 located opposite the surface 57 facing the base 53, and a bottomed recess 541 that opens into the surface 57 of the lid 54 facing the base 53. In this embodiment, the surface 58 located opposite the surface 57 facing the base 53 becomes the upper surface of the container 51.

[0027] In the present embodiment, the lid 54 is a semiconductor substrate containing single crystal silicon. However, the lid 54 may be a semiconductor substrate made of a material other than silicon, such as germanium, gallium arsenide, gallium phosphide, gallium nitride, silicon carbide, or the like.

[0028] A surface 55 of the base 53 facing the lid 54 and a surface 57 of the lid 54 located on the outer edge of the recess 541 facing the base 53 are bonded via a bonding member 511 so as to close the opening of the recess 541 in the lid 54. This forms an accommodation space 52 for accommodating the vibration element 6. Note that, instead of using the bonding member 511, bonding may be performed by diffusion bonding utilizing the diffusion of metal contained in the base 53 or the lid 54, diffusion bonding between silicon, hydrophilic bonding in which a surface layer is hydrophilized to have a Si-O-Si bond layer, or the like.

[0029] The base 53 has a through hole 531 penetrating in the Z direction, which is the thickness direction of the base 53. An insulating film 532 is formed on the surface of the base 53 including the inner surface of the through hole 531, a surface 55 facing the lid 54, and a surface 56 located on the opposite side to the surface 55 facing the lid 54. A through electrode 59 is embedded in the through hole 531.

[0030] The connection terminals 70 are disposed on a surface 56 of the base 53 opposite to a surface 55 facing the lid 54. In other words, the connection terminals 70 are disposed on the outer surface of the container 51, specifically, on the underside of the container 51, which is the surface 56 of the base 53 opposite to the surface 55 facing the lid 54.

[0031] A wiring 71 is disposed on a surface 55 of the base 53 facing the lid 54. The connection terminal 70 and the wiring 71 are electrically connected by a through electrode 59.

[0032] The vibration element 6 accommodated in the accommodation space 52 has a vibration piece 61 which is a quartz substrate, an excitation electrode 62 which vibrates the vibration piece 61, a connection electrode 63 which mechanically and electrically connects the vibration element 6 to the base 53 and outputs a vibration signal to the outside, and a lead electrode 64 which electrically connects the excitation electrode 62 and the connection electrode 63. Note that, although an AT-cut quartz substrate is used as the vibration piece 61 in this embodiment, an SC-cut quartz substrate, a BT-cut quartz substrate, a Z-cut quartz substrate, an ST-cut quartz substrate, or the like may also be used.

[0033] The connection electrode 63 of the vibration element 6 and the wiring 71 arranged on the surface 55 of the base 53 facing the lid 54 are joined via a conductive member 65 such as a metal bump. As a result, the vibration element 6 is mechanically connected to the base 53, and the connection electrode 63 of the vibration element 6 is electrically connected to the wiring 71 arranged on the surface 55 facing the lid 54. The connection electrode 63 of the vibration element 6 is electrically connected to the wiring 71 arranged on the surface 55 facing the lid 54, and thus the connection terminal 70 arranged on the surface 56 of the base 53 opposite the surface 55 facing the lid 54 is electrically connected to the vibration element 6 via the conductive member 65, the wiring 71, and the through electrode 59.

[0034] Next, the arrangement of the vibrator 5 in the multilayer substrate 2 will be described. In this embodiment, the transducer 5 is disposed in a bottomed recess 40 having an opening 41 on a first surface 101 which is the upper surface of the multilayer substrate 2.

[0035] A surface 58 located opposite to a surface 57 facing the base 53 of the lid 54, which is the upper surface of the container 51 in the vibrator 5, becomes a surface 512 of the container 51 located on the opening 41 side of the recess 40 in the multilayer substrate 2. A surface 56 located opposite to a surface 55 facing the lid 54 of the base 53, which is the lower surface of the container 51 in the vibrator 5, becomes a surface 513 of the container 51 located on the bottom surface 42 side of the recess 40 in the multilayer substrate 2. In the container 51, the surface 512 of the container 51 located on the opening 41 side of the recess 40 in the multilayer substrate 2 is located opposite to the surface 513 of the container 51 located on the bottom surface 42 side of the recess 40 in the multilayer substrate 2.

[0036] The first wiring layer 26 as a connection wiring layer 25 arranged on the bottom surface 42 of the recess 40 in the multilayer substrate 2 and a connection terminal 70 arranged on a surface 56 opposite to the surface 55 facing the lid 54 of the base 53, which is the surface 513 of the container 51 located on the bottom surface 42 side of the recess 40 in the multilayer substrate 2, are electrically connected by a conductive connecting member 8.

[0037] In this manner, by disposing the vibrator 5 in the recess 40 of the multilayer substrate 2, the difficulty in handling caused by the miniaturization of the vibrator device 1 is improved. In addition, since the vibrator 5 is protected by the multilayer substrate 2, cracks, chips, etc. of the vibrator 5 can be suppressed.

[0038] In this embodiment, as described above, the member constituting the container 51 in the vibrator 5 is a silicon substrate. A semiconductor substrate such as a silicon substrate is a brittle material that easily chips. For a vibrator 5 having a container 51 made of such a brittle semiconductor substrate that easily chips, cracking or chipping of the vibrator 5 can be effectively suppressed.

[0039] In this embodiment, as described above, the multilayer substrate 2 is a glass epoxy substrate. A resin substrate such as a glass epoxy substrate has excellent mechanical properties and is less likely to crack or chip, so that the vibration device 1 can be easily handled.

[0040] In addition, in this embodiment, as shown in FIG. 2, surface 58 located opposite surface 57 facing base 53 in lid 54, which is surface 512 of container 51 located on the opening 41 side of recess 40 in multilayer substrate 2, is flush with first surface 101 of multilayer substrate 2 on which opening 41 of recess 40 in multilayer substrate 2 is formed.

[0041] Specifically, a surface 58 located opposite to a surface 57 of the lid 54 facing the base 53, which is a surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2, and a first surface 101 of the multilayer substrate 2 on which the opening 41 of the recess 40 in the multilayer substrate 2 is formed, are located on a surface F1 which is the same XY plane. In other words, the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2 and the first surface 101 of the multilayer substrate 2 are at the same position in the Z direction.

[0042] That is, the vibrator 5 is disposed within the recess 40 having the opening 41 on the first surface 101 of the multilayer substrate 2 so as not to protrude from the recess 40 .

[0043] In this manner, in this embodiment, since the vibrator 5 does not protrude above the first surface 101 of the multilayer substrate 2, cracking or chipping of the vibrator 5 can be effectively prevented.

[0044] In addition, in this embodiment, as described above, the external terminals 28 are disposed on the second surface 102, which is the lower surface of the multilayer substrate 2. Therefore, for example, when the resonator device 1 is surface-mounted on an external substrate using a suction collet, the resonator device 1 is adsorbed and held by the suction collet on the first surface 101, which is the upper surface of the multilayer substrate 2. At this time, the vibrator 5 does not protrude above the first surface 101 of the multilayer substrate 2, so the vibrator 5 does not interfere with the suction collet. This allows the suction collet to stably adsorb and hold the resonator device 1, making it possible to easily mount the resonator device 1 on an external substrate.

[0045] In addition, in this embodiment, as described above, the opening 41 of the recess 40 is surrounded by the first surface 101 in a plan view from the Z direction. This makes it possible to more effectively prevent cracking or chipping of the vibrator 5. In addition, the suction and holding of the vibration device 1 by the suction collet becomes more stable, and the vibration device 1 can be more easily mounted on an external substrate.

[0046] In this embodiment, the connection terminals 70 and the first wiring layer 26 serving as the connection wiring layer 25 are joined via a conductive connection member 8 such as a metal bump or solder paste. As a result, the vibrator 5 having the connection terminals 70 arranged on the outer surface of the container 51 and the multilayer substrate 2 having the first wiring layer 26 serving as the connection wiring layer 25 arranged on the bottom surface 42 of the recess 40 are electrically connected, and the vibrator 5 and the multilayer substrate 2 are mechanically connected.

[0047] In this embodiment, the connection terminal 70 and the first wiring layer 26 as the connection wiring layer 25 are arranged to overlap each other in a plan view from the Z direction. As a result, the connection terminal 70 and the first wiring layer 26 as the connection wiring layer 25 are joined via the conductive connection member 8, thereby making it possible to reduce the size of the vibration device 1.

[0048] When joining the connection terminal 70 of the vibrator 5 and the first wiring layer 26 as the connection wiring layer 25 of the multilayer substrate 2 via the conductive connection member 8, it is preferable to attach the conductive connection member 8 such as a metal bump or solder paste to the connection terminal 70 of the vibrator 5 in advance before placing the vibrator 5 in the recess 40 of the multilayer substrate 2. This makes it possible to easily manufacture the vibrating device 1 without having to attach the conductive connection member 8 to the connection wiring layer 25 placed on the bottom surface 42 of the recess 40 in advance before placing the vibrator 5 in the recess 40 of the multilayer substrate 2.

[0049] As described above, the vibration device 1 of this embodiment has a first surface 101, a second surface 102 located opposite the first surface 101, a first insulating layer 21 including the first surface 101, a second insulating layer 22 including the second surface 102, a multilayer substrate 2 having an opening 41 on the first surface 101 and a bottomed recess 40 penetrating the first insulating layer 21, and a connection wiring layer 25 arranged between the first insulating layer 21 and the second insulating layer 22, a container 51 with an accommodating space 52, a vibration element 6 accommodated in the accommodating space 52, and a connection terminal 70 arranged on the outer surface of the container 51 and electrically connected to the vibration element 6, and a conductive connecting member 8 electrically connecting the vibration element 6 arranged in the recess 40, the connection wiring layer 25, and the connection terminal 70. This makes it possible to provide a vibration device 1 in which the difficulty in handling that accompanies miniaturization is improved and cracking or chipping of the vibrator 5 is suppressed.

[0050] In this embodiment, the multilayer substrate 2 has three layers: a first insulating layer 21, a second insulating layer 22, and a third insulating layer 23. However, the multilayer substrate 2 may have four or more layers by stacking multiple third insulating layers 23 between the first insulating layer 21 and the second insulating layer 22.

[0051] In addition, in this embodiment, the recess 40 penetrates the first insulating layer 21, but the recess 40 may penetrate the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. In other words, it is sufficient that the recess 40 penetrates at least the first insulating layer 21.

[0052] In addition, in this embodiment, the container 51 in the vibrator 5 is made of a silicon substrate, which is a semiconductor substrate. However, the container 51 may be made of a material other than a semiconductor substrate, for example, quartz, which is a brittle material that is easily chipped, just like a semiconductor substrate.

[0053] In addition, in this embodiment, the vibrator 5 does not have an oscillation circuit, but the vibrator 5 may be an oscillator having an oscillation circuit.

[0054] 2. Embodiment 2 Next, a vibration device 1a according to a second embodiment will be described with reference to Fig. 3 and Fig. 4. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The second embodiment is similar to the first embodiment, except that the depth of the recess 40a in the multilayer substrate 2a, ie, the position of the bottom surface 42a of the recess 40a in the Z direction, is different.

[0055] As shown in FIGS. 3 and 4, the multilayer substrate 2a has a bottomed recess 40a on the first surface 101, the recess 40a having an opening 41a.

[0056] In this embodiment, the recess 40a penetrates the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. That is, the first insulating layer 21 has a first penetration portion 43 penetrating the first insulating layer 21, and the third insulating layer 23 has a second penetration portion 44 penetrating the third insulating layer 23. In this embodiment, in a plan view from the Z direction, the shape of the first penetration portion 43 corresponding to the recess 40a formed in the first insulating layer 21 and the shape of the second penetration portion 44 corresponding to the recess 40a formed in the third insulating layer 23 are substantially the same, and the first penetration portion 43 penetrating the first insulating layer 21 and the second penetration portion 44 penetrating the third insulating layer 23 overlap in a plan view from the Z direction.

[0057] The bottom surface 42a of the recess 40a is a surface of the second insulating layer 22 adjacent to the third insulating layer 23 in the stacking direction, the surface facing the third insulating layer 23. In other words, the bottom surface 42a of the recess 40a is a surface of the second insulating layer 22 located on the opposite side to the second surface 102 of the multilayer substrate 2a.

[0058] That is, in this embodiment, the depth of the recess 40a in the multilayer substrate 2a is deeper than that of embodiment 1 by an amount equivalent to the thickness of the third insulating layer 23 through which the recess 40a penetrates. In other words, the position of the bottom surface 42a of the recess 40a in the Z direction is located closer to the second surface 102 of the multilayer substrate 2a than in embodiment 1 by an amount equivalent to the thickness of the third insulating layer 23 through which the recess 40a penetrates.

[0059] Since the second wiring layer 27 is disposed between the third insulating layer 23 and the second insulating layer 22 adjacent to each other in the stacking direction, the second wiring layer 27 can be disposed on the bottom surface 42a of the recess 40a, which is the surface of the second insulating layer 22 facing the third insulating layer 23. The second wiring layer 27 disposed on the bottom surface 42a of the recess 40a can function as the connection wiring layer 25a. In other words, the second wiring layer 27 serving as the connection wiring layer 25a is disposed on the bottom surface 42a of the recess 40a.

[0060] The second wiring layer 27 as the connection wiring layer 25a arranged on the bottom surface 42a of the recess 40a is located on the negative side in the Z direction from the first surface 101 of the multilayer substrate 2a and on the positive side in the Z direction from the second surface 102 of the multilayer substrate 2a. In other words, the second wiring layer 27 as the connection wiring layer 25a is arranged between the first surface 101 of the multilayer substrate 2a and the second surface 102 of the multilayer substrate 2a.

[0061] The second wiring layer 27 as the connection wiring layer 25a is electrically connected via a conductive connecting member 8 to a connection terminal 70 arranged on the surface 513 of the container 51 located on the bottom surface 42a side of the recess 40a in the multilayer substrate 2a.

[0062] In this embodiment, as shown in FIG. 4, surface 58 located opposite surface 57 facing base 53 in lid 54, which is surface 512 of container 51 located on the opening 41a side of recess 40a in multilayer substrate 2a, is located closer to second surface 102 of multilayer substrate 2a than first surface 101 of multilayer substrate 2a on which opening 41a of recess 40a in multilayer substrate 2a is formed.

[0063] Specifically, a surface 58 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a, which is a surface 512 of the container 51 located opposite to a surface 57 of the lid 54 facing the base 53, is located below a surface F1 which is an XY plane including a first surface 101 of the multilayer substrate 2a on which the opening 41a of the recess 40a in the multilayer substrate 2a is formed. In other words, the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a and the first surface 101 of the multilayer substrate 2a are at different positions in the Z direction, and the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a is located closer to the second surface 102 of the multilayer substrate 2a than the first surface 101 of the multilayer substrate 2a.

[0064] According to this embodiment, in addition to the effects of the first embodiment, the following effects can be obtained. The surface 512 of the container 51 in the vibrator 5 located on the opening 41a side of the recess 40a in the multilayer substrate 2a is located closer to the second surface 102 of the multilayer substrate 2a than the first surface 101 of the multilayer substrate 2a. In this way, since the vibrator 5 is located closer to the second surface 102 of the multilayer substrate 2a, which is closer to the bottom surface 42a of the recess 40a, than the first surface 101 where the opening 41a of the recess 40a in the multilayer substrate 2a is formed, cracking, chipping, etc. of the vibrator 5 can be more effectively suppressed.

[0065] 3. Embodiment 3 Next, a vibration device 1b according to a third embodiment will be described with reference to Fig. 5 to Fig. 7. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The third embodiment is similar to the first embodiment, except that the shape of the recess 40b in the multilayer substrate 2b is different.

[0066] 5, the multilayer substrate 2b is a flat plate having a rectangular outer shape in plan view from the Z direction perpendicular to the first surface 101 of the multilayer substrate 2b. In plan view from the Z direction, the multilayer substrate 2b has a first side surface 20A along the X direction, a second side surface 20B facing the first side surface 20A along the X direction, a third side surface 20C adjacent to the first side surface 20A and the second side surface 20B along the Y direction, and a fourth side surface 20D facing the third side surface 20C along the Y direction. The first surface 101, which is the upper surface of the multilayer substrate 2b, and the second surface 102, which is the lower surface of the multilayer substrate 2b, are connected via the first side surface 20A, the second side surface 20B, the third side surface 20C, and the fourth side surface 20D.

[0067] 5 to 7, multilayer substrate 2b has a bottomed recess 40b having an opening 41b on first surface 101. Recess 40b penetrates first insulating layer 21 and extends in a groove shape from a first side surface 20A, which is one of the mutually opposing side surfaces of multilayer substrate 2b, to a second side surface 20B, which is the other side surface. Recess 40b communicates with the outside of multilayer substrate 2b at first side surface 20A and second side surface 20B of multilayer substrate 2b.

[0068] In addition, in this embodiment, as shown in FIG. 6, a surface 58 located opposite a surface 57 facing the base 53 in the lid 54, which is a surface 512 of the container 51 located on the opening 41b side of the recess 40b in the multilayer substrate 2b, is flush with a first surface 101 of the multilayer substrate 2b on which the opening 41b of the recess 40b in the multilayer substrate 2b is formed.

[0069] According to this embodiment, in addition to the effects of the first embodiment, the following effects can be obtained. The recess 40b in the multilayer substrate 2b is provided in a groove shape extending from the first side surface 20A, which is one of the mutually opposing side surfaces of the multilayer substrate 2b, to the second side surface 20B, which is the other side surface. In this manner, the recess 40b in the multilayer substrate 2b can be easily formed by providing the recess 40b in a groove shape extending from the first side surface 20A, which is one of the mutually opposing side surfaces of the multilayer substrate 2b, to the second side surface 20B, which is the other side surface. In other words, the manufacturing cost of the multilayer substrate 2b having the recess 40b can be reduced, and therefore, a resonation device 1b with reduced manufacturing cost can be provided.

[0070] In this embodiment, the recess 40b in the multilayer substrate 2b extends in a groove-like manner from the first side surface 20A to the second side surface 20B of the multilayer substrate 2b. However, the recess 40b may also extend in a groove-like manner from the third side surface 20C, which is one of the opposing side surfaces of the multilayer substrate 2b, to the fourth side surface 20D, which is the other side surface.

[0071] 4. Embodiment 4 Next, a vibration device 1c according to a fourth embodiment will be described with reference to Fig. 8 and Fig. 9. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The fourth embodiment is similar to the first embodiment, except that the conductive connection member 8c electrically connecting the connection wiring layer 25c arranged in the recess 40c in the multilayer substrate 2c and the connection terminal 70 arranged on the outer surface of the container 51 in the vibrator 5c is a conductive wire, the shape of the recess 40c is different, the arrangement of the connection wiring layer 25c within the recess 40c is different, and the arrangement of the vibrator 5c within the recess 40c is different.

[0072] 8 and 9, the multilayer substrate 2c has a bottomed recess 40c having an opening 41c on the first surface 101. The recess 40c has a step 45 that protrudes inwardly of the recess 40c between the opening 41c of the recess 40c and a bottom surface 42c of the recess 40c.

[0073] In this embodiment, the recess 40c penetrates the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. That is, the first insulating layer 21 has a first penetrating portion 43c penetrating the first insulating layer 21, and the third insulating layer 23 has a second penetrating portion 44c penetrating the third insulating layer 23.

[0074] The bottom surface 42c of the recess 40c is a surface of the second insulating layer 22 adjacent to the third insulating layer 23 in the stacking direction that faces the third insulating layer 23. In other words, the bottom surface 42c of the recess 40c is a surface of the second insulating layer 22 that is located on the opposite side to the second surface 102 of the multilayer substrate 2c.

[0075] In a plan view from the Z direction, the shape of the first penetrating portion 43c penetrating the first insulating layer 21 is different from the shape of the second penetrating portion 44c penetrating the third insulating layer 23. The width in the X direction of the second penetrating portion 44c penetrating the third insulating layer 23 is smaller than the width in the X direction of the first penetrating portion 43c penetrating the first insulating layer 21, and the width in the Y direction of the second penetrating portion 44c penetrating the third insulating layer 23 is smaller than the width in the Y direction of the first penetrating portion 43c corresponding to the recess 40c formed in the first insulating layer 21.

[0076] In this way, in plan view from the Z direction, the second penetrating portion 44c penetrating the third insulating layer 23 is smaller than the first penetrating portion 43c penetrating the first insulating layer 21, so that the third insulating layer 23 that becomes the step portion 45 that protrudes inward of the recess 40c can be disposed between the opening 41c of the recess 40c and the bottom surface 42c of the recess 40c. The upper surface of the step portion 45 is the surface facing the first insulating layer 21 of the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction.

[0077] Since the first wiring layer 26 is disposed between the first insulating layer 21 and the third insulating layer 23 adjacent to each other in the stacking direction, the first wiring layer 26 can be disposed on the upper surface of the step portion 45 protruding inward of the recess 40c. The first wiring layer 26 disposed on the upper surface of the step portion 45 can function as the connection wiring layer 25c. In other words, the first wiring layer 26 is disposed on the upper surface of the step portion 45 as the connection wiring layer 25c.

[0078] In this embodiment, the arrangement of the transducer 5c in the recess 40c is reversed compared to that of the first embodiment. That is, the lower surface of the container 51 in the transducer 5c is a surface 58 located opposite to a surface 57 facing the base 53 in the lid 54, and the surface 58 located opposite to the surface 57 facing the base 53 in the lid 54 is a surface 513 of the container 51 located on the bottom surface 42c side of the recess 40c in the multilayer substrate 2c. The upper surface of the container 51 in the transducer 5c is a surface 56 located opposite to a surface 55 facing the lid 54 in the base 53, and the surface 56 located opposite to the surface 55 facing the lid 54 in the base 53 is a surface 512 of the container 51 located on the opening 41c side of the recess 40c in the multilayer substrate 2c.

[0079] The bottom surface 42c of the recess 40c and a surface 513 of the container 51 of the vibrator 5c located on the bottom surface 42c side of the recess 40c are joined via a joining member 515 such as a thermosetting adhesive, thereby mechanically connecting the vibrator 5c and the multilayer substrate 2c.

[0080] A connection terminal 70 is disposed on the upper surface of the container 51 of the transducer 5c, that is, on a surface 56 located opposite to a surface 55 of the base 53 that faces the lid 54.

[0081] The connection terminal 70 and the first wiring layer 26 as the connection wiring layer 25c arranged on the upper surface of the step portion 45 in the recess 40c are electrically connected via a conductive wire, which is a conductive connection member 8c, using a wire bonding technique.

[0082] Furthermore, in this embodiment, as shown in FIG. 9, a surface 56 located opposite a surface 55 facing the lid 54 in the base 53, which is a surface 512 of the container 51 located on the opening 41c side of the recess 40c in the multilayer substrate 2c, is located closer to the second surface 102 of the multilayer substrate 2c than the first surface 101 of the multilayer substrate 2c on which the opening 41c of the recess 40c in the multilayer substrate 2c is formed.

[0083] Specifically, a surface 56 located opposite to a surface 55 facing the lid 54 of the base 53, which is a surface 512 of the container 51 located on the side of the opening 41c of the recess 40c in the multilayer substrate 2c, is located below a surface F1 which is an XY plane including a first surface 101 of the multilayer substrate 2c on which the opening 41c of the recess 40c in the multilayer substrate 2c is formed. This makes it possible to effectively prevent cracking or chipping of the vibrator 5c.

[0084] In this embodiment, the conductive wire, which is the conductive connection member 8c that electrically connects the connection terminal 70 and the first wiring layer 26 as the connection wiring layer 25c, is located below the plane F1, which is the XY plane including the first surface 101 of the multilayer substrate 2c on which the opening 41c of the recess 40c in the multilayer substrate 2c is formed. This makes it possible to effectively prevent damage to the conductive wire, which is the conductive connection member 8c.

[0085] According to this embodiment, in addition to the effects of the first embodiment, the following effects can be obtained. By connecting the first wiring layer 26 as the connection wiring layer 25c and the connection terminal 70 via the conductive wire that is the conductive connection member 8c, it is possible to improve the reliability of the electrical connection between the first wiring layer 26 as the connection wiring layer 25c and the connection terminal 70. Therefore, it is possible to provide a highly reliable resonation device 1c.

[0086] 5. Embodiment 5 Next, a vibration device 1d according to a fifth embodiment will be described with reference to Fig. 10 and Fig. 11. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The fifth embodiment is similar to the first embodiment, except that an external terminal 28d is disposed on a first surface 101d of a multilayer substrate 2d, and that a multilayer substrate 2d and a vibrator 5d are disposed upside down.

[0087] 10 and 11, the multilayer substrate 2d is upside down compared to the multilayer substrate 2d of the embodiment 1. That is, the first surface 101d of the multilayer substrate 2d is the lower surface of the multilayer substrate 2d, and the second surface 102d of the multilayer substrate 2d is the upper surface of the multilayer substrate 2d.

[0088] The multilayer substrate 2d has a first insulating layer 21d including a first surface 101d, a second insulating layer 22d including a second surface 102d, and a third insulating layer 23d disposed between the first insulating layer 21d and the second insulating layer 22d. The second insulating layer 22d, the third insulating layer 23d, and the first insulating layer 21d are stacked in this order from top to bottom.

[0089] The multilayer substrate 2d has a bottomed recess 40d having an opening 41d on the first surface 101d. The recess 40d penetrates the first insulating layer 21d. A bottom surface 42d of the recess 40d is a surface of a third insulating layer 23d adjacent to the first insulating layer 21d in the stacking direction that faces the first insulating layer 21d.

[0090] Since the first wiring layer 26 is disposed between the first insulating layer 21d and the third insulating layer 23d adjacent to each other in the stacking direction, the first wiring layer 26 can be disposed on the bottom surface 42d of the recess 40d, which is the surface of the third insulating layer 23d facing the first insulating layer 21d. The first wiring layer 26 disposed on the bottom surface 42d of the recess 40d can function as the connection wiring layer 25d. In other words, the first wiring layer 26 serving as the connection wiring layer 25d is disposed on the bottom surface 42d of the recess 40d.

[0091] In this embodiment, an external terminal 28d for electrical connection to the outside is disposed on a first surface 101d of the multilayer substrate 2d. A first insulating layer 21d including the first surface 101d has a through electrode 29. The external terminal 28d is electrically connected via the through electrode 29 to a first wiring layer 26 serving as a connection wiring layer 25d.

[0092] In this embodiment, the transducer 5d is upside down compared to the first embodiment. That is, the lower surface of the container 51 in the transducer 5d is a surface 58 located opposite to a surface 57 facing the base 53 in the lid 54, and the surface 58 located opposite to the surface 57 facing the base 53 in the lid 54 is a surface 512 of the container 51 located on the opening 41d side of the recess 40d. The upper surface of the container 51 in the transducer 5d is a surface 56 located opposite to a surface 55 facing the lid 54 in the base 53, and the surface 56 located opposite to the surface 55 facing the lid 54 in the base 53 is a surface 513 of the container 51 located on the bottom surface 42d side of the recess 40d.

[0093] In addition, in this embodiment, as shown in FIG. 11, a surface 58 located opposite a surface 57 facing the base 53 in the lid 54, which is a surface 512 of the container 51 located on the opening 41d side of the recess 40d in the multilayer substrate 2d, is flush with a first surface 101d of the multilayer substrate 2d on which the opening 41d of the recess 40d in the multilayer substrate 2d is formed.

[0094] Specifically, a surface 58 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d, which is a surface 512 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d, opposite a surface 57 of the lid 54 facing the base 53, and a first surface 101d of the multilayer substrate 2d on which the opening 41d of the recess 40d in the multilayer substrate 2d is formed, are located on the same surface F2 which is the XY plane. In other words, the surface 512 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d and the first surface 101d of the multilayer substrate 2d are at the same position in the Z direction.

[0095] That is, the transducer 5d is disposed within the recess 40 so as not to protrude from a recess 40d having an opening 41d on the first surface 101d of the multilayer substrate 2d.

[0096] In this manner, in this embodiment, the vibrator 5d does not protrude below the first surface 101d of the multilayer substrate 2d, and therefore cracking or chipping of the vibrator 5d can be effectively prevented.

[0097] In addition, in this embodiment, as described above, the external terminals 28d are arranged on the first surface 101d, which is the lower surface of the multilayer substrate 2d. Therefore, for example, when the resonator device 1d is surface-mounted on an external substrate using a suction collet, the resonator device 1d is suctioned and held by the suction collet on the second surface 102d, which is the upper surface of the multilayer substrate 2d. At this time, since the recess 40d is not arranged on the second surface 102d of the multilayer substrate 2d, the suction collet stably suctions and holds the resonator device 1d, and the resonator device 1d can be easily mounted on the external substrate. In addition, since the resonator 5d does not interfere with the suction collet, cracks and chips of the resonator 5d can be effectively suppressed.

[0098] According to this embodiment, in addition to the effects of the first embodiment, the following effects can be obtained. On the first surface 101d of the multilayer substrate 2d, an opening 41d in the bottomed recess 40d and an external terminal 28d electrically connected to the first wiring layer 26 as the connection wiring layer 25d are arranged. Therefore, by holding the second surface 102d located on the opposite side to the first surface 101d of the multilayer substrate 2d, the vibration device 1d can be easily mounted on an external substrate, and cracks and chips of the vibrator 5d can be effectively suppressed.

[0099] 6. Embodiment 6 Next, a vibration device 1e according to a sixth embodiment will be described with reference to Fig. 12 and Fig. 13. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The sixth embodiment is similar to the first embodiment, except that the resonator 5e has an integrated circuit 80 including an oscillation circuit, and the resonator 5e is an oscillator.

[0100] As shown in FIG. 12 and FIG. 13, the vibrator 5e has an integrated circuit 80. The integrated circuit 80 is disposed on a surface 55 of the base 53 facing the lid 54. The integrated circuit 80 is a circuit in which a plurality of active elements such as transistors (not shown) are electrically connected by wiring (not shown). In this embodiment, the integrated circuit 80 includes an oscillation circuit for oscillating the vibration element 6 to generate a frequency of a reference signal such as a clock signal. In addition to the oscillation circuit, the integrated circuit 80 may include, for example, a temperature compensation circuit for correcting the vibration characteristics of the vibration element 6 in response to temperature changes, a processing circuit for processing an output signal from the oscillation circuit, an electrostatic protection circuit, and the like.

[0101] A passivation film 81 is formed on the upper surface of the integrated circuit 80. Furthermore, on the upper surface of the passivation film 81, an internal connection terminal 82 is formed, which is electrically connected to the integrated circuit 80 by wiring (not shown) and is used to join the vibration element 6.

[0102] The connection electrodes 63 of the vibration element 6 and the internal connection terminals 82 are joined via conductive members 65 such as metal bumps. As a result, the vibration element 6 is mechanically connected to the base 53, and the vibration element 6 and the integrated circuit 80 are electrically connected via the internal connection terminals 82, the conductive members 65, and wiring (not shown).

[0103] By electrically connecting the vibration element 6 and the integrated circuit 80, the vibration element 6 can be caused to oscillate by an oscillation signal output from the integrated circuit 80.

[0104] Furthermore, wiring (not shown) of the integrated circuit 80 and the connection terminal 70 are electrically connected via the through electrode 59. By electrically connecting the connection terminal 70 and the integrated circuit 80 via the through electrode 59 and the wiring (not shown), it is possible to supply a ground potential or the like to the integrated circuit 80 and output a clock signal or the like from the integrated circuit 80 via the connection terminal 70.

[0105] Thus, in this embodiment, the resonator 5e is an oscillator having an integrated circuit 80 that includes an oscillation circuit.

[0106] In addition, in this embodiment, as shown in FIG. 13, surface 58 located opposite surface 57 facing base 53 in lid 54, which is surface 512 of container 51 located on the opening 41 side of recess 40 in multilayer substrate 2, is flush with first surface 101 of multilayer substrate 2 on which opening 41 of recess 40 in multilayer substrate 2 is formed.

[0107] According to this embodiment, even when the vibrator 5e is an oscillator, cracks, chips, etc. of the vibrator 5e can be effectively prevented, as in the first embodiment.

[0108] 7.Embodiment 7 Next, a vibration device 1f according to a seventh embodiment will be described with reference to Fig. 14 and Fig. 15. Note that the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. The seventh embodiment is similar to the first embodiment, except that the member constituting the container 51f of the oscillator 5f is made of quartz crystal.

[0109] As shown in Figures 14 and 15, the vibrator 5f has a container 51f with an accommodation space 52f, a vibration element 6f accommodated in the accommodation space 52f, and a connection terminal 70f arranged on the outer surface of the container 51f and electrically connected to the vibration element 6f.

[0110] The container 51f includes a first sealing substrate 85 which is a quartz substrate, a vibration substrate 86 which is a quartz substrate having an outer frame portion 90 which surrounds the vibration element 6f, and a second sealing substrate 87 which is also a quartz substrate.

[0111] The first sealing substrate 85, the vibration substrate 86, and the second sealing substrate 87 are flat plates having a rectangular outer shape when viewed from above in the Z direction.

[0112] The first sealing substrate 85 is located on the positive side in the Z direction above the vibration substrate 86, and the second sealing substrate 87 is located on the negative side in the Z direction below the vibration substrate 86. That is, the first sealing substrate 85, the vibration substrate 86, and the second sealing substrate 87 are stacked in this order from top to bottom.

[0113] The first sealing substrate 85 has a surface 851 facing the vibrating substrate 86 and a surface 852 located on the opposite side to the surface 851 facing the vibrating substrate 86. The surface 851 facing the vibrating substrate 86 is the lower surface of the first sealing substrate 85, and the surface 852 located on the opposite side to the surface 851 facing the vibrating substrate 86 is the upper surface of the first sealing substrate 85. In this embodiment, the surface 852 located on the opposite side to the surface 851 facing the vibrating substrate 86 of the first sealing substrate 85 becomes the upper surface of the container 51f.

[0114] The vibration substrate 86 has a frame-shaped outer frame portion 90 that surrounds the vibration element 6f, and the vibration element 6f provided inside the outer frame portion 90. The vibration substrate 86 has a surface 861 that faces the first sealing substrate 85, and a surface 862 located on the opposite side to the surface 861 that faces the first sealing substrate 85. The surface 862 located on the opposite side to the surface 861 that faces the first sealing substrate 85 is a surface of the vibration substrate 86 that faces the second sealing substrate 87.

[0115] The vibration element 6f has a vibration bar 91, a connecting portion 92 that connects the vibration bar 91 and the outer frame portion 90, an excitation electrode 62f that vibrates the vibration bar 91, a connection electrode 63f that electrically connects the vibration element 6f to wiring 71f and outputs a vibration signal to the outside, and a lead electrode 64f that electrically connects the excitation electrode 62f and the connection electrode 63f.

[0116] The vibrating bar 91 is thinner in the Z direction than the outer frame portion 90, the upper surface of the vibrating bar 91 is located on the negative side in the Z direction of a surface 861 of the vibrating substrate 86 that faces the first sealing substrate 85, and the lower surface of the vibrating bar 91 is located on the positive side in the Z direction of a surface 862 that is located on the opposite side to the surface 861 of the vibrating substrate 86 that faces the first sealing substrate 85. This makes it possible to suppress contact between the vibrating bar 91 and the first sealing substrate 85 and the second sealing substrate 87 when the first sealing substrate 85, the vibrating substrate 86, and the second sealing substrate 87 are stacked.

[0117] The second sealing substrate 87 has a surface 871 facing the vibrating substrate 86 and a surface 872 located on the opposite side to the surface 871 facing the vibrating substrate 86. The surface 871 facing the vibrating substrate 86 is the upper surface of the second sealing substrate 87, and the surface 872 located on the opposite side to the surface 871 facing the vibrating substrate 86 is the lower surface of the second sealing substrate 87. In this embodiment, the surface 872 located on the opposite side to the surface 871 facing the vibrating substrate 86 of the second sealing substrate 87 becomes the lower surface of the container 51f.

[0118] A surface 851 of the first sealing substrate 85 facing the vibration substrate 86 and a surface 861 of the outer frame portion 90 of the vibration substrate 86 facing the first sealing substrate 85 are bonded together via a bonding member 521. A surface 862 located on the opposite side to the surface 861 facing the first sealing substrate 85 of the outer frame portion 90 of the vibration substrate 86 and a surface 871 of the second sealing substrate 87 facing the vibration substrate 86 are bonded together via a bonding member 522. That is, the first sealing substrate 85 and the second sealing substrate 87 are bonded together via the bonding member 521, the bonding member 522, and the outer frame portion 90 of the vibration substrate 86.

[0119] In this manner, the first sealing substrate 85 and the second sealing substrate 87 are joined via the outer frame portion 90 of the vibration substrate 86, whereby an accommodating space 52f for accommodating the vibration element 6f is formed.

[0120] Further, the second sealing substrate 87 has a through hole 531f penetrating in the Z direction, which is the thickness direction of the second sealing substrate 87. A through electrode 59f is embedded in the through hole 531f.

[0121] The connection terminal 70f is disposed on a surface 872 located opposite to a surface 871 of the second sealing substrate 87 that faces the vibration substrate 86. In other words, the connection terminal 70f is disposed on the outer surface of the container 51, specifically, on the lower surface of the container 51f, which is the surface 872 located opposite to the surface 871 of the second sealing substrate 87 that faces the vibration substrate 86.

[0122] A wiring 71f is disposed on a surface 871 of the second sealing substrate 87 facing the vibration substrate 86. The connection terminal 70f and the wiring 71f are electrically connected by a through electrode 59f.

[0123] Furthermore, the wiring 71f arranged on the surface 871 of the second sealing substrate 87 facing the vibration substrate 86 and the connection electrode 63f of the vibration element 6f are joined via a conductive member 65f such as a metal bump. The connection electrode 63f of the vibration element 6f and the wiring 71f arranged on the surface 871 of the second sealing substrate 87 facing the vibration substrate 86 are electrically connected via the conductive member 65f, so that the connection terminal 70f arranged on the surface 872 located on the opposite side to the surface 871 of the second sealing substrate 87 facing the vibration substrate 86 and the vibration element 6f are electrically connected via the conductive member 65f, the wiring 71f, and the through electrode 59f.

[0124] In this embodiment, a bottomed recess 40 having an opening 41 on a first surface 101, which is the upper surface of the multilayer substrate 2, is provided with a vibrator 5f.

[0125] A surface 852 located opposite to a surface 851 facing the vibration substrate 86 in the first sealing substrate 85, which is the upper surface of the container 51f in the vibrator 5f, becomes a surface 512f of the container 51f located on the opening 41 side of the recess 40 in the multilayer substrate 2. A surface 872 located opposite to a surface 871 facing the vibration substrate 86 in the second sealing substrate 87, which is the lower surface of the container 51f in the vibrator 5f, becomes a surface 513f of the container 51f located on the bottom surface 42 side of the recess 40 in the multilayer substrate 2.

[0126] In this embodiment, as shown in FIG. 15 , a surface 852 located opposite a surface 851 facing the vibration substrate 86 in the first sealing substrate 85, which is a surface 512f of the container 51f located on the opening 41 side of the recess 40 in the multilayer substrate 2, is flush with the first surface 101 of the multilayer substrate 2 on which the opening 41 of the recess 40 in the multilayer substrate 2 is formed.

[0127] According to this embodiment, even when the oscillator 5f is made of a quartz substrate, cracks, chips, etc. of the oscillator 5f can be effectively prevented, as in the first embodiment.

[0128] In this embodiment, the vibration substrate 86 is an AT-cut quartz substrate, but the vibration substrate 86 is not limited to an AT-cut quartz substrate, and an SC-cut quartz substrate, a BT-cut quartz substrate, a Z-cut quartz substrate, an ST-cut quartz substrate, etc. may also be used.

[0129] In this embodiment, the first sealing substrate 85 and the second sealing substrate 87 are AT-cut quartz substrates. However, the first sealing substrate 85 and the second sealing substrate 87 are not limited to AT-cut quartz substrates, and at least one of the first sealing substrate 85 and the second sealing substrate 87 may be formed from a quartz substrate having a different cut angle from that of the vibration substrate 86. Alternatively, the first sealing substrate 85 and the second sealing substrate 87 may have the same cut angle as the vibration substrate 86 but the crystal axis direction may be oriented in a different direction from that of the vibration substrate 86. [Explanation of symbols]

[0130] Reference Signs List 1, 1a, 1b, 1c, 1d, 1e, 1f... Vibration device, 2, 2a, 2b, 2c, 2d... Multilayer substrate, 5, 5c, 5d, 5e, 5f... Vibrator, 6, 6f... Vibration element, 8, 8c... Conductive connection member, 21, 21d... First insulating layer, 22, 22d... Second insulating layer, 23, 23d... Third insulating layer, 25, 25a, 25c, 25d... Connection wiring layer, 26... First wiring layer, 27... Second wiring layer, 2 8, 28d...external terminal, 40, 40a, 40b, 40c, 40d...recess, 41, 41a, 41b, 41c, 41d...opening, 42, 42a, 42c, 42d...bottom surface, 51, 51f...container, 52, 52f...accommodation space, 70, 70f...connection terminal, 101, 101d...first surface, 102, 102d...second surface, 512, 512f...surface, 513, 513f...surface, F1...surface, F2...surface.

Claims

1. a multilayer substrate having a first surface, a second surface located opposite to the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a bottomed recess having an opening in the first surface and penetrating at least the first insulating layer, and a connection wiring layer disposed between the first insulating layer and the second insulating layer; a transducer that is disposed in the recess and includes a container having a storage space, a vibration element that is accommodated in the storage space, and a connection terminal that is disposed on an outer surface of the container and electrically connected to the vibration element; a conductive connection member that electrically connects the connection wiring layer and the connection terminal; having The multilayer substrate is rectangular, The recess is a groove extending from one opposing side surface of the multilayer substrate to the other opposing side surface of the multilayer substrate.

2. an external terminal electrically connected to the connection wiring layer is disposed on the second surface of the multilayer substrate; The vibration device according to claim 1 .

3. an external terminal electrically connected to the connection wiring layer is disposed on the first surface of the multilayer substrate; The vibration device according to claim 1 .

4. A multilayer substrate having a first surface, a second surface located opposite the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a bottomed recess having an opening in the first surface and penetrating at least the first insulating layer, and a connection wiring layer disposed between the first insulating layer and the second insulating layer; a transducer that is disposed in the recess and includes a container having a storage space, a vibration element that is accommodated in the storage space, and a connection terminal that is disposed on an outer surface of the container and electrically connected to the vibration element; a conductive connection member that electrically connects the connection wiring layer and the connection terminal; having A vibration device, wherein an external terminal electrically connected to the connection wiring layer is disposed on the first surface of the multilayer substrate.

5. The opening of the recess is surrounded by the first surface of the multilayer substrate. The vibration device according to claim 4 .

6. a surface of the container located on the opening side of the recess is flush with the first surface of the multilayer substrate or is located closer to the second surface of the multilayer substrate than the first surface of the multilayer substrate; A vibration device according to any one of claims 1 to 5.

7. the connection wiring layer is disposed on a bottom surface of the recess, the connection terminal is disposed on a surface of the container facing the bottom surface of the recess, the connection wiring layer and the connection terminal are joined via the conductive connection member; A vibration device according to any one of claims 1 to 6.

8. The conductive connecting member is a conductive wire. A vibration device according to any one of claims 1 to 6.

9. The container includes a base that is a semiconductor substrate and a lid that is a semiconductor substrate; The base and the lid are joined together to form the storage space. A vibration device according to any one of claims 1 to 8.

10. the container includes a first sealing substrate which is a quartz substrate, a vibration substrate which is a quartz substrate having an outer frame portion which surrounds the vibration element, and a second sealing substrate which is a quartz substrate; The first sealing substrate and the second sealing substrate are joined together via the outer frame portion of the vibration substrate to form the accommodation space. A vibration device according to any one of claims 1 to 8.

11. The multilayer substrate is a resin substrate. A vibration device according to claim 9 or 10.

Images