Speaker system, diffusion structure and headphones

Abstract

To provide a speaker system, a diffusion structure, and headphones that improve the acoustic performance of sound waves generated by an acoustic transducer.SOLUTION: A speaker system includes a first acoustic transducer 110, a second acoustic transducer 140, a sound diffusion plate 120 forming a diffusion structure, and a cover 130 disposed on the sound diffusion plate 120. The first acoustic transducer 110 generates a first sound wave W1, and the second acoustic transducer 140 generates a second sound wave W2. The diffusion structure is disposed on the first acoustic transducer 110 and guides the first sound wave W1 to propagate through a sound passage formed in the diffusion structure. After the first sound wave W1 propagates through the sound passage in the diffusion structure, the directivity of the first sound wave W1 is diffused at a sound outlet OP2 of the diffusion structure.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a speaker system, a diffusion structure and a headphone, and more particularly to a speaker system, a diffusion structure and a headphone capable of improving the acoustic performance of a sound wave generated by an acoustic transducer. [Background technology]

[0002] Acoustic transducers, such as acoustic chips with MEMS (Micro Electro Mechanical Systems) structures, can be widely used in various electronic devices due to their small size, so acoustic transducers have been rapidly developed in recent years.

[0003] However, the acoustic wave generated by the acoustic transducer having a MEMS (Micro Electro Mechanical Systems) structure has some acoustic performance (e.g., smaller sound pressure level (SPL) and high directivity), which is not conducive to use in an acoustic device with a larger device sound outlet. Therefore, it is necessary to improve these acoustic performances of the acoustic wave generated by the acoustic transducer. Summary of the Invention

[0004] Therefore, a first object of the present invention is to provide a speaker system, a diffusion structure and a headphone capable of improving the acoustic performance of a sound wave generated by an acoustic transducer.

[0005] One embodiment of the present invention provides a speaker system including a first acoustic transducer, a second acoustic transducer, and a diffusion structure. The first acoustic transducer is configured to generate a first sound wave. The second acoustic transducer is configured to generate a second sound wave. The diffusion structure is disposed on the first acoustic transducer and configured to guide the first sound wave to propagate through a sound passage formed in the diffusion structure. After the first sound wave propagates through the sound passage in the diffusion structure, the directionality of the first sound wave is diffused at a sound outlet of the diffusion structure.

[0006] One embodiment of the present invention provides an expansion structure that is or will be disposed in a speaker system. The expansion structure includes a body and a cover disposed on the body. The diffusion structure is or will be disposed on a first acoustic transducer of the speaker system. The diffusion structure is configured to guide a first sound wave generated by the first acoustic transducer to propagate through a sound passage formed in the diffusion structure.

[0007] One embodiment of the present invention provides a headphone including a first acoustic transducer and a diffusion structure. The first acoustic transducer is configured to generate a first sound wave, and the first acoustic transducer is a MEMS-fabricated speaker. The diffusion structure is disposed on the first acoustic transducer and configured to guide the first sound wave to propagate through a sound passage formed in the diffusion structure. After the first sound wave propagates through the sound passage in the diffusion structure, the directionality of the first sound wave is diffused at a sound outlet of the diffusion structure.

[0008] These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. [Brief description of the drawings]

[0009] [Figure 1]FIG. 2 is a schematic diagram of a cross-sectional view illustrating a core of a speaker system according to one embodiment of the present invention.

[0010] [Diagram 2] 1 is a schematic diagram illustrating a speaker system according to one embodiment of the present invention;

[0011] [Diagram 3] FIG. 2 is a schematic diagram illustrating a central portion of a speaker system according to an embodiment of the present invention.

[0012] [Figure 4] 2 is a schematic diagram illustrating a central portion of a sound diffuser of a speaker system according to an embodiment of the present invention; FIG.

[0013] [Diagram 5] FIG. 2 is a schematic diagram of a cross-sectional view illustrating a central portion of a speaker system according to an embodiment of the present invention.

[0014] [Figure 6] FIG. 1 is a schematic diagram of an exploded view illustrating headphones, according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] In order to provide those skilled in the art with a better understanding of the present invention, the following description will describe in detail the preferred embodiments and typical materials or range parameters of the main components. These preferred embodiments of the present invention are illustrated in the accompanying drawings with numbered elements to describe in detail the contents and effects to be achieved. Please note that the drawings are simplified schematics, and the materials and parameter ranges of the main components are examples based on the current technology, and therefore only show the components and combinations associated with the present invention to provide a clearer explanation of the basic structure, implementation or operation method of the present invention. The components are actually more complicated, and the range of parameters or materials used may develop as technology advances in the future. Additionally, for ease of explanation, the components shown in the drawings may not represent their actual number, shape and size, and details may be adjusted according to design requirements.

[0016] In the following description and claims, the terms "including," "comprising," and "having" are used in an open-ended manner and should therefore be interpreted to mean "including, but not limited to." Thus, when the terms "including," "comprising," and / or "having" are used in describing the present invention, they indicate the presence of corresponding features, regions, steps, operations, and / or components, but are not limited to the presence of one or more corresponding features, regions, steps, operations, and / or components.

[0017] In the following description and claims, when "the A1 component is formed by B1", it means that B1 is present in the formation of the A1 component or that B1 is used in the formation of the A1 component, and the presence and use of one or more other features, regions, steps, operations and / or components in the formation of the A1 component is not excluded.

[0018] In the following description and claims, the term "substantially" generally means that there may or may not be a small deviation. For example, the terms "substantially parallel" and "substantially along" mean that the angle between two components may be less than a certain degree threshold, for example, 10 degrees, 5 degrees, 3 degrees, or 1 degree. For example, the term "substantially aligned" means that the deviation between two components may be less than a certain difference threshold, for example, 2 μm or 1 μm. For example, the term "substantially the same" means that the deviation is within, for example, 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0019] In the description and claims below, the term "horizontal direction" generally means a direction parallel to a horizontal plane, the term "horizontal plane" generally means a plane parallel to the X and Y directions in the drawing (i.e., the X and Y directions of the present invention may be regarded as horizontal directions), the terms "vertical direction" and "top direction" generally mean a direction parallel to the Z direction in the drawing and perpendicular to the horizontal direction, and the X, Y and Z directions are perpendicular to each other. In the specification and claims, the term "top view" generally means a visual result seen along the vertical direction. In the specification and claims, the term "side view" generally means a visual result seen along the horizontal direction. In the specification and claims, the term "cross-sectional view" generally means a visual result seen by cutting a structure along the vertical and horizontal directions.

[0020] Terms such as first, second, third, etc. may be used to describe various components, but such components are not limited by these terms. The terms are used only to distinguish components from other components in the specification, and do not relate to the order of manufacture, unless the specification explains otherwise. The claims may not use the same terms, and may instead use terms such as first, second, third, etc., with respect to the order in which the elements are claimed. Thus, in the following description, a first component may be a second component in the claims.

[0021] It should be noted that the technical features in the different embodiments described below can be substituted, recombined, or mixed with each other to construct other embodiments without departing from the spirit of the present invention.

[0022] In the present invention, the acoustic transducer is configured to perform acoustic transformation, which may be a sound generating component, a speaker, a microspeaker or other suitable device, such that the acoustic transformation of the acoustic transducer may convert a signal (e.g. an electrical signal) into sound waves.

[0023] In the present invention, the frequency range of the sound waves generated by the acoustic transducer may be designed based on the requirements. For example, the acoustic transducer may generate sound waves in a frequency range covering the entire human audible frequency range (e.g., 20Hz-20kHz), but is not limited thereto. For example, the acoustic transducer may generate sound waves with a frequency higher than a specific frequency, so the acoustic transducer may be a high frequency sound generating unit (tweeter), but is not limited thereto. For example, the acoustic transducer may generate sound waves with a frequency lower than a specific frequency, so the acoustic transducer may be a low frequency sound generating unit (woofer), but is not limited thereto. It is noted that the specific frequency may be a value in the range of 800Hz-4kHz (e.g., 1.44kHz), but is not limited thereto. Details of the high frequency sound generating unit may be referenced in US application Ser. No. 17 / 153,849 or 17 / 720,330 filed by the applicant, which will not be described here for the sake of brevity.

[0024] Referring to Fig. 1, Fig. 1 is a schematic diagram of a cross-sectional view illustrating the core of a speaker system according to an embodiment of the present invention. As shown in Fig. 1, the speaker system 100 includes a first acoustic transducer 110 configured to generate a first sound wave W1, and a first frequency range of the first sound wave W1 may be designed based on requirements. For example, the first acoustic transducer 110 may be a high-frequency sound generating unit (which may function as a tweeter), so that the first frequency range of the first sound wave W1 may be higher than a certain frequency, but is not limited thereto.

[0025] In some embodiments, the first acoustic transducer 110 may be a MEMS fabricated device such as a MEMS speaker including a MEMS (Micro Electro Mechanical Systems) structure (e.g., a unit having an anchor structure and a membrane anchored on the anchor structure, the membrane being actuated to generate a first sound wave W1). For example, the first acoustic transducer 110, which is a MEMS speaker, may be included in a MEMS chip, and thus the first acoustic transducer 110 may be formed by a semiconductor process, but is not limited thereto. For example, the first acoustic transducer 110 may include, but is not limited to, silicon (e.g., monocrystalline silicon or polycrystalline silicon), silicon compounds (e.g., silicon carbide, silicon oxide), germanium, germanium compounds, gallium, gallium compounds (e.g., gallium nitride or gallium arsenide), or combinations thereof.

[0026] As shown in Fig. 1, the speaker system 100 includes a diffusion structure HS disposed on / above a first acoustic transducer 110, the diffusion structure HS having a sound inlet OP1 and a sound outlet OP2, a sound passage SP exists between the sound inlet OP1 and the sound outlet OP2, the first acoustic transducer 110 corresponds to the sound inlet OP1, and a first sound wave W1 generated by the first acoustic transducer 110 passes through the sound passage SP (i.e., the first sound wave W passes through the diffusion structure HS). In some embodiments, as shown in Fig. 1, the size of the sound inlet OP1 may be smaller than the size of the sound outlet OP2.

[0027] The shape of the sound inlet OP1 and the shape of the sound outlet OP2 may be any suitable shape and may be designed based on requirements. In some embodiments, the shape of the sound inlet OP1 and the shape of the sound outlet OP2 may be different.

[0028] As shown in Fig. 1, the sound passage SP of the diffusion structure HS has a first (sound passage) part SP1, the first part SP1 being between the sound inlet OP1 and the sound outlet OP2, and the first passage size of the first part SP1 is smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2. Note that "passage size" may also be referred to as the cross-sectional size / area of ​​the corresponding / associated part of the sound passage SP. In the present invention, since the first passage size of the first part SP1 is smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2, the SPL of the first sound wave W1 increases after the first sound wave W1 passes through the sound passage SP of the diffusion structure HS (i.e., the SPL of the first sound wave W1 at the sound outlet OP2 is larger than the SPL of the first sound wave W1 at the sound inlet OP1). In addition, the directivity of the first sound wave W1 may be diffused through the diffusion structure HS, so that the directivity of the first sound wave W1 is reduced when the first sound wave W1 propagates outward from the sound outlet OP2. Also, because the size of the sound inlet OP1 is smaller than the size of the sound outlet OP2, the effect of increasing the SPL of the first sound wave W1 and the effect of diffusing the first sound wave W1 are enhanced.

[0029] Due to the design of the sound passage SP of the diffusion structure HS, the length of the sound passage SP is large. In order to reduce the size of the diffusion structure HS, the diffusion structure HS may be designed so that the sound passage SP has at least one curved portion (e.g., the curved portion CP1 and / or CP2 shown in FIG. 1). Therefore, the design of the sound passage SP of the extension structure HS is achieved under the condition of minimizing the size of the extension structure HS. Taking FIG. 1 as an example, the sound passage SP has two curved portions CP1 and CP2 in an N-shape in cross section, but is not limited thereto.

[0030] An example of the speaker system 100 will be described in detail below, but the speaker system 100 of the present invention is not limited to the following.

[0031] Further, referring to Figs. 2 to 4, Fig. 2 is a schematic diagram illustrating a speaker system according to an embodiment of the present invention, Fig. 3 is a schematic diagram illustrating a central portion of the speaker system according to an embodiment of the present invention, and Fig. 4 is a schematic diagram illustrating a central portion of a sound diffusion plate of the speaker system according to an embodiment of the present invention. As shown in Figs. 1 to 4, the diffusion structure HS of the speaker system 100 includes a sound diffusion plate 120 and a cover 130 disposed on the sound diffusion plate 120. In Figs. 1 to 4, the sound diffusion plate 120 includes a body 122 having the above-mentioned sound wave inlet OP1 and the above-mentioned sound wave outlet OP2 of the diffusion structure HS, and the cover 130 is disposed on / above the body 122 and covers the sound inlet OP1. Fig. 1 is a cross-sectional view of the first acoustic transducer 110, the body 122 of the sound diffusion plate 120, and the cover 130 shown in Fig. 3. In this embodiment, the core of the speaker system 100 shown in FIG. 1 is formed by the first acoustic transducer 110 shown in FIG.

[0032] In the present invention, the body 122 may be located at any suitable position on the sound diffusing plate 120. In some embodiments, as shown in Figures 2-4, the body 122 may be located at the center of the sound diffusing plate 120, so that the first acoustic transducer 110 may correspond to the center of the sound diffusing plate 120 in the direction Z, but is not limited thereto.

[0033] As shown in Figures 1 and 4, the main body 122 has an inner channel structure 122i and an outer extension structure 122a connected to and surrounding the inner channel structure 122i, and the inner channel structure 122i is covered by a cover 130.

[0034] The outer extension structure 122a has a bottom portion 122ab and a sidewall portion 122aw connected to each other, the bottom portion 122ab is connected to the sidewall portion 122aw and the inner channel structure 122i, and the sound outlet OP2 of the main body 122 (i.e., the extension structure HS) is surrounded by the top of the sidewall portion 122aw (i.e., the sidewall portion 122aw forms the sound outlet OP2). In some embodiments, in Fig. 1 and Fig. 4, the outer extension structure 122a may be a bowl-like structure, and the shape of the sound outlet OP2 may be, but is not limited to, a rectangle with some chamfers. In Fig. 1 and Fig. 4, the outer extension structure 122a may be narrow at the bottom portion 122ab and wide at the top of the sidewall portion 22aw, but is not limited to this.

[0035] 1 and 4, the inner channel structure 122i has a hollow structure (e.g., a tubular structure) and is higher than the bottom portion 122ab of the outer extension structure 122a in the Z direction, and the inner channel CBI is present inside the inner channel structure 122i (i.e., the inner channel CBI is covered by the cover 130), and the inner channel CBI has a first end CBI_1 and a second end CBI_2, where the first end CBI_1 is the sound inlet OP1 of the body 122 (i.e., the diffusing structure HS), and the second end CBI_2, which is higher than the bottom portion 122ab of the outer extension structure 122a in the Z direction, faces the cover 130. For example, the shape of the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) may be (substantially) rectangular, and the shape of the second end CBI_2 of the inner channel CBI may be, but is not limited to, a rectangular with a chamfer.

[0036] 1, the top of the inner channel structure 122i forming the second end CBI_2 of the inner channel CBI may be between the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) and the sound outlet OP2 in the Z direction (i.e., the top of the inner channel structure 122i may not be higher than the sound outlet OP2 in the Z direction), but is not limited thereto. For example, the inner channel structure 122i may be located in the center of the body 122 (in a top view), but is not limited thereto.

[0037] As shown in Figures 1 to 3, the cover 130 may have an upper structure 132 and a side structure 134 connected to the upper structure 132 and surrounding the upper structure 122, the upper structure 132 may overlap the inner channel structure 122i of the body 122 in the Z direction, and the side structure 134 surrounds the inner channel structure 122i of the body 122. For example, in Figures 1 to 3, the cover 130 may be disposed between the sound inlet OP1 and the sound outlet OP2 of the body 122, so that the cover 130 may not be higher than the sound outlet OP2 in the Z direction, and the cover 130 is surrounded by the outer extension structure 122a of the body 122, but is not limited thereto.

[0038] As shown in Fig. 1, the cover 130 is disposed on the inner channel structure 122i, which means that in the diffusion structure HS, a space exists between the body 122 and the cover 130, and therefore a part of the sound passage SP (e.g., the curved portion CP1) is formed between the body 122 and the cover 130. In Fig. 1, the sound passage SP has a first portion SP1 formed between the inner channel structure 122i of the body 122 and the inner surface of the cover 130, and the first portion SP1 has a first passage size smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2. In FIG. 1, the sound passage SP further has a second (sound passage) portion SP2 and a third (sound passage) portion SP3, where the first portion SP1 is connected between the second portion SP2 and the third portion SP3, the second portion SP2 being between the outer extension structure 122a of the main body 122 and the outer surface of the cover 130, and the third portion SP3 being formed in the inner channel CBI of the inner channel structure 122i (i.e., the third portion SP3 is formed within the inner channel structure 122i).

[0039] In some embodiments, in Fig. 1, in the sound passage SP, the first passage size of the first portion SP1 is smaller than the second passage size of the second portion SP2 and the third passage size of the third portion SP3, so that after the first sound wave W1 passes through the sound passage SP of the diffusion structure HS, the SPL of the first sound wave W1 increases and the first sound wave W1 is diffused to reduce the directivity of the first sound wave W1. In some embodiments, the minimum passage size of the sound passage SP may be in the first portion SP1.

[0040] In Fig. 1, in order to make the first portion SP1 of the sound passage SP a smaller first passage size, the upper structure 132 of the cover 130 may be as close as possible to the inner channel structure 122i to enhance the effect of increasing the SPL of the first sound wave W1 and the effect of diffusing the first sound wave W1. Also, due to the presence of the cover 130, the first portion SP1 of the sound passage SP has a suitable length, and the longer the length of the first portion SP1 of the sound passage SP, the stronger the effect of increasing the SPL of the first sound wave W1 and the effect of diffusing the first sound wave W1.

[0041] Further, in FIG. 1, the first passage size of the first portion SP1 is smaller than the third passage size of the third portion SP3 in the sound passage SP, so that the first passage size of the first portion SP1 is smaller than the size of the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) and the size of the second end CBI_2 of the inner channel CBI. In some embodiments, the size of the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) may be larger than the size of the second end CBI_2 of the inner channel CBI, so that the first sound wave W1 may be compressed when passing through the inner channel CBI, enhancing the effect of increasing the SPL of the first sound wave W1 and the effect of diffusing the first sound wave W1. For example, in FIG. 1, the cross-sectional size of the inner channel CBI may be gradually reduced (narrowed) from the first end CBI_1 to the second end CBI_2 in the inner channel CBI.

[0042] Furthermore, the apex of the inner channel structure 122i forming the second end CBI_2 of the inner channel CBI may be designed to further affect the SPL of the first sound wave W1 in a specific frequency range overlapping at least a portion of the first frequency range of the first sound wave W1, and to enhance the clarity of the first sound wave W1 in this specific frequency range. In some embodiments, the first acoustic transducer 110 is a high-frequency sound generating unit (tweeter) for making the first frequency range of the first sound wave W1 higher than the specific frequency, so that the specific frequency range may be higher than this specific frequency (e.g., the apex of the inner channel structure 122i may affect the SPL of the mid-frequency and high-frequency sound waves). In some embodiments, the shape and size of the apex of the inner channel structure 122i (or the shape and size of the second end CBI_2 of the inner channel CBI) are related to the specific frequency range. For example, the specific frequency range may be higher as the length and / or width of the second end CBI_2 of the inner channel CBI increases.

[0043] Meanwhile, as shown in Fig. 1, the curved portions CP1 and CP2 of the sound passage SP may be caused by the cover 130 and the main body 122. For example, in Fig. 1, the curved portion CP1 connected between the first portion SP1 and the third portion SP3 may be caused by the upper structure 132 of the cover 130 and the inner channel structure 122i of the main body 122, and the curved portion CP2 connected between the first portion SP1 and the second portion SP2 may be caused by, but is not limited to, the side structure 134 of the cover 130 and the bottom portion 122ab of the outer extension structure 122a of the main body 122.

[0044] Curvature CP1 may be viewed as being formed by cover 130, which means that curvature CP1 is formed near / around cover 130 and / or that curvature CP1 is formed by cover 130. Similarly, curvature CP2 may be viewed as being formed by bottom portion 122ab, which means that curvature CP2 is formed near / around bottom portion 122ab and / or that curvature CP2 is formed by bottom portion 122ab.

[0045] Additionally, in the embodiment shown in FIG. 1, the first acoustic wave W1 propagates in a first direction, e.g., the -Z direction, through the first portion SP1, and in a second direction opposite to the first direction, e.g., the +Z direction, through the second portion SP2 and the third portion SP3.

[0046] By utilizing curves, the size of the diffusing structure HS may be reduced to a particular acoustic length corresponding to the sound passage SP.

[0047] In other words, the inner channel CBI can be seen as being formed in the inner channel structure 122i, with the size of the inner channel CBI gradually narrowing from the sound inlet OP1 towards the second end CBI_2 of the inner channel CBI. The cover 130 is disposed on the inner channel structure 122i, and the cover 130 forms the curved portion CP1 of the sound passage SP. Meanwhile, the outer channel, also known as the second (sound passage) portion SP2, can be seen as being formed between the cover 130 and the outer extension structure 122a. The sidewall portion 122aw is shaped such that the size of the outer channel gradually widens from the bottom portion of the outer extension structure 122a towards the sound outlet OP2. The curved portion CP2 of the sound passage SP is formed by the bottom portion 122ab of the outer extension structure 122a.

[0048] FIG. 5 is a schematic diagram of a cross-sectional view illustrating the center part of a speaker system according to an embodiment of the present invention, and the cross-sectional view of the structure shown in FIG. 5 may be a cross-sectional view along the A-A' cross-sectional line in FIG. 3. Compared with FIG. 1, FIG. 5 further shows the core part of the speaker system 100 shown in FIG. 1 and the surroundings of other acoustic transducers. As shown in FIG. 2-FIG. 5, the speaker system 100 may further include a second acoustic transducer 140 configured to generate a second sound wave W2, and the second frequency range of the second sound wave W2 may be designed based on requirements. For example, the second acoustic transducer 140 may be a low-frequency sound generating unit (may function as a woofer), so that the second frequency range of the second sound wave W2 may be lower than a certain frequency, but is not limited thereto. Note that the average value of the first frequency range is higher than the average value of the second frequency range.

[0049] 5, the diffusion structure HS is disposed above the first acoustic transducer 110 and is configured to guide the first sound wave W1 to propagate through a sound passage SP formed in the diffusion structure HS. After the first sound wave W1 propagates through the sound passage SP in the diffusion structure HS, the directionality of the first sound wave W1 is diffused at the sound outlet OP2 of the diffusion structure HS.

[0050] The second acoustic transducer 140 may be any suitable speaker. For example, the second acoustic transducer 140 may be a speaker having a dynamic driver (e.g., an acoustic dynamic driver), a MEMS speaker including a MEMS structure, or any other suitable speaker.

[0051] The second acoustic transducer 140 may be located at any suitable position. In some embodiments, as shown in FIG. 5, the second acoustic transducer 140 may correspond to the center of the sound diffuser 120 in the direction Z, but is not limited thereto. In some embodiments, as shown in FIG. 5, the second acoustic transducer 140 may overlap the first acoustic transducer 110 in the direction Z, but is not limited thereto. For example, in FIG. 5, the center of the first acoustic transducer 110 corresponds to the center of the second acoustic transducer 140 in the Z direction, but is not limited thereto.

[0052] The second sound wave W2 also passes through the sound diffusing plate 120. In Figs. 2 to 5, the sound diffusing plate 120 may further include a sound passing structure 124 corresponding to the second acoustic transducer 140, and the sound wave passing structure 124 has at least one hollow portion 124h, such that the second sound wave W2 passes through the hollow portion 124h and passes through the sound diffusing plate 120.

[0053] The sound-passing structure 124 may be designed based on requirements. For example, in Figs. 2-5, the sound-passing structure 124 may be directly connected to the body 122, but is not limited thereto. For example, in Figs. 2-5, the body 122 may be surrounded by the sound-passing structure 124 and / or the hollow portion 124h, but is not limited thereto. In Figs. 2-5, the sound-passing structure 124 and the body 122 may be concentric (i.e., the center of the sound-passing structure 124 may correspond to the center of the body 122 in the direction Z), and / or the hollow portion 124h and the body 122 may be concentric (i.e., the center of the hollow portion 124h may correspond to the center of the body 122 in the direction Z), but is not limited thereto.

[0054] 2 to 5, the sound-passing structure 124 has a plurality of hollows 124h (for example, six hollows 124h in the figures), and each hollow 124h has the same shape and size, but is not limited to this. In Figs. 2 to 5, the hollow 124h may overlap the second acoustic transducer 140 in the Z direction, but is not limited to this.

[0055] According to the above, the first sound wave W1 generated by the first acoustic transducer 110 and the second sound wave W2 generated by the second acoustic transducer 140 pass through the diffusion structure HS (i.e., the first sound wave W1 passes through the sound passage SP formed by the main body 122 and the cover 130, and the second sound wave W2 passes through the hollow portion 124h of the sound passing structure 124), so that two acoustic transducers may generate sound in one speaker system 100.

[0056] In the present invention, the above-described speaker system 100 is disposed within any suitable sound generating device such that the sound generating device uses a MEMS speaker (i.e., the first acoustic transducer 110) to generate a large, diffuse sound.

[0057] Referring to Fig. 6, Fig. 6 is a schematic exploded view illustrating a headphone according to an embodiment of the present invention. As shown in Fig. 6, the above-mentioned speaker system 100 may be disposed in a headphone 200, which is a type of sound generating device.

[0058] The headphones 200 may further include any suitable components based on requirements. In FIG. 6, the headphones 200 may further include a headphone cover 210 as the outermost component, and a cushion 220, and the speaker system 100 is disposed between the headphone cover 210 and the cushion 220. The headphone cover 210 and the cushion 220 are configured to protect the components disposed thereon, and the cushion 220 enhances the wearing comfort of the headphones 200. Furthermore, in FIG. 6, the headphone cover 210 has a hole 212, so that an electric wire may be connected between the acoustic transducer of the speaker system 100 and an external device through the hole 212. In FIG. 2 and FIG. 6, the sound diffuser 120 of the speaker system 100 may have a peripheral area 126 surrounding the sound passing structure 124 and the body 122, and the cushion 220 may be disposed on the peripheral area 126.

[0059] Additionally, in Fig. 6, the headphones 200 further include a foam structure 230 disposed between the sound diffusion plate 120 and the cushion 220 of the speaker system 100, and the foam structure 230 covers the sound-passing structure 124 to prevent external objects (e.g., dust) from entering the speaker system 100 through the hollow portion 124h, thereby protecting the second acoustic transducer 140. In Fig. 6, the headphones 200 further include a ring 240 disposed on the foam structure 230 to fix the foam structure 230.

[0060] To summarize the above, according to the speaker system and diffusion structure of the present invention, after the sound waves pass through the sound passage of the diffusion structure, the SPL of the sound waves increases and the sound waves are diffused so as to reduce the directivity of the sound waves.

[0061] Those skilled in the art will readily appreciate that numerous modifications and variations of the devices and methods may be made while retaining the teachings of the present invention, and therefore the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

1. A speaker system comprising: a first acoustic transducer configured to generate a first acoustic wave; a second acoustic transducer configured to generate second acoustic waves; a diffusion structure; the diffusion structure is disposed over the first acoustic transducer and configured to guide the first acoustic wave to propagate through a sound passage formed within the diffusion structure; After the first sound wave propagates through the sound passage in the diffusion structure, the directivity of the first sound wave is diffused at a sound outlet of the diffusion structure, the diffusion structure includes a body and a cover disposed on the body; the body includes an internal channel structure; an inner channel formed within the inner channel structure; the size of the inner channel gradually narrows from the sound inlet to the end of the inner channel; the end of the inner channel faces the cover; The diffusion structure further includes a sound diffusion plate; The main body is disposed within the sound diffusion plate, The speaker system, wherein the sound diffusion plate further includes at least one hollow portion, and the second sound wave passes through the at least one hollow portion.

2. 2. The speaker system of claim 1, wherein the cover is disposed over the inner channel structure, such that the curved portion of the sound passage is formed by the cover.

3. the body includes an outer extension structure; The speaker system of claim 1 , wherein an outer channel is formed between the cover and the outer extension structure.

4. the outer extension structure having a sidewall portion; 4. The speaker system of claim 3, wherein the side wall portions are shaped such that the outer channel gradually increases in size from a bottom of the outer extension structure towards the sound outlet.

5. the outer extension structure having a bottom portion; 4. The speaker system of claim 3, wherein the bottom portion of the outer extension structure defines a curved portion of the sound passage.

6. 2. The speaker system of claim 1, wherein a sound pressure level of the first sound wave at the sound outlet is greater than a sound pressure level of the first sound wave at a sound inlet of the diffusing structure.

7. The speaker system of claim 1 , wherein the first acoustic transducer functions as a tweeter for the speaker system and the second acoustic transducer functions as a woofer for the speaker system.

8. 2. The speaker system of claim 1, wherein the first acoustic transducer is a Micro Electro Mechanical Systems (MEMS) manufactured device.

9. The speaker system of claim 1 , wherein the at least one hollow portion surrounds the body.

10. The speaker system of claim 1 , wherein the body and the at least one hollow portion are concentric.

11. 2. The speaker system of claim 1, wherein a center of the first acoustic transducer corresponds to a center of the second acoustic transducer.

12. 2. The speaker system of claim 1, wherein the second acoustic transducer is an acoustic dynamic driver.

13. the body includes an inner channel structure and an outer extension structure; the sound passage includes a first portion, a second portion, and a third portion, 2. The speaker system of claim 1, wherein the first portion is formed between an inner surface of the cover and the inner channel structure, the second portion is formed between an outer surface of the cover and the outer extension structure, and the third portion is formed within the inner channel structure.

14. the first acoustic wave propagates in a first direction through the first portion, and the first acoustic wave propagates in a second direction through the second portion and the third portion; 14. The speaker system of claim 13, wherein the second direction is opposite to the first direction.

15. The sound passage is a first curved portion connecting the first portion and the second portion; 14. The speaker system of claim 13, further comprising: a second curved portion connecting the first portion and the third portion.

16. 2. The speaker system according to claim 1, wherein the sound passage is N-shaped in cross section.

17. The speaker system according to claim 1 , wherein the speaker system is applied to a headphone.

18. 1. A diffusion structure disposed within a speaker system, comprising: The main body, a cover disposed on the body; the diffusing structure is or will be disposed on a first acoustic transducer of the speaker system, The diffusion structure is configured to guide a first sound wave generated by the first acoustic transducer to propagate through a sound passage formed within the diffusion structure; After the first sound wave propagates through the sound passage in the diffusion structure, the directivity of the first sound wave is diffused at a sound outlet of the diffusion structure, the body includes an internal channel structure; an inner channel formed within the inner channel structure; the size of the inner channel gradually narrows from the sound inlet to the end of the inner channel; the end of the inner channel faces the cover; The diffusion structure further includes a sound diffusion plate; The main body is disposed within the sound diffusion plate, The sound diffusion plate has at least one hollow portion formed therein, the sound diffusion plate is disposed above the second acoustic transducer; A diffusing structure, wherein a second acoustic wave generated by the second acoustic transducer propagates through the at least one hollow portion.

19. the body includes an outer extension structure; an outer channel is formed between the cover and the outer extension structure; the outer extension structure having a sidewall portion; 20. The diffusing structure of claim 18, wherein the sidewall portions are shaped such that the outer channel gradually increases in size from the bottom of the outer extension structure towards the sound outlet of the diffusing structure.

20. A headphone, a first acoustic transducer configured to generate a first sound wave, the first acoustic transducer being a MEMS (Micro Electro Mechanical Systems) manufactured speaker; a diffusion structure; the diffusion structure is disposed over the first acoustic transducer and configured to guide the first acoustic wave to propagate through a sound passage formed within the diffusion structure; After the first sound wave propagates through the sound passage in the diffusion structure, the directivity of the first sound wave is diffused at a sound outlet of the diffusion structure, the diffusion structure includes a body and a cover disposed on the body; the body includes an internal channel structure; an inner channel formed within the inner channel structure; the size of the inner channel gradually narrows from the sound inlet to the end of the inner channel; the end of the inner channel faces the cover; The diffusion structure further includes a sound diffusion plate; The main body is disposed within the sound diffusion plate, At least one hollow portion is formed in the sound diffusion plate, the headphones include a second acoustic transducer configured to generate second sound waves; A headphone, wherein the sound diffusion plate is disposed over the second acoustic transducer, and the second sound wave propagates through the at least one hollow portion.

21. The body includes an outer extension structure, the outer extension structure having a sidewall portion; 21. The headphones of claim 20, wherein the side wall portions are shaped such that a size of an outer channel formed between the cover and the outer extension structure gradually widens from a bottom of the outer extension structure toward the sound outlet.

22. 22. The headphone of claim 21, wherein the second acoustic transducer is an acoustic dynamic driver.

Images