Flexible wiring body, drive system and imaging device

Abstract

A driving system (7) is provided with an actuator (71A) which performs at least one movement among translations in three directions that are at right angles to one another and rotations about axes in the three directions, and a flexible wiring body (73A) which connects a semiconductor element (6) that moves along with the actuator (71A) and a frame body (72) located outside the semiconductor element (6). The flexible wiring body (73A) has a main part (731A) on which the semiconductor element (6) is mounted and which is electrically connected to the semiconductor element (6), and a plurality of arm parts (732A) which extend from the main part (731A) to the frame body (72) and are three-dimensionally bent.

Description

[Technical field]

[0001] The present invention relates to a flexible wiring body, a drive system, and an imaging device. The present invention claims priority based on Japanese Patent Application No. 2020-021006, filed on February 10, 2020, the contents of which are incorporated herein by reference. [Background technology]

[0002] Some cameras on smartphones and other devices have a mechanical image stabilization (OIS) function and a mechanical focusing function, which are realized by translating the lens with a voice coil motor (VCM).

[0003] On the other hand, there are OIS systems that move the image sensor (CMOS imager, etc.) without moving the lens. While rotating the lens around an axis has no effect, the feature of this OIS system is that it can correct camera shake in the rotational direction by moving the image sensor. This type of OIS system is too large and expensive for smartphones, so it is only used in single-lens reflex cameras.

[0004] However, in recent years, there has been an increasing demand for smartphones to use OIS systems with movable image sensors. To install them in smartphones, the OIS system must be made small enough and inexpensive to manufacture, so the use of MEMS (Micro Electro Mechanical Systems) technology is being considered.

[0005] Using MEMS technology, it is possible to realize a translational and rotational actuator with a footprint similar to that of an image sensor. However, if it is designed to generate a large displacement of more than tens of micrometers, and on multiple axes, the force generated by the actuator will be small. On the other hand, dozens of wires must be taken out from the image sensor, some of which are high-frequency wires for high-speed communication, and others are power wires for supplying current to the image sensor, which consumes a lot of power. To move the image sensor, these wires must be moved together (dragged), and the resistance of this becomes a large load for the small actuator. Therefore, one of the keys to realizing a small OIS system with a movable image sensor is to increase the force generated by the actuator and to determine how to take out the wires from the image sensor.

[0006] Conventionally, there is a multi-axis MEMS assembly including a MEMS actuator configured to move in three axes. For example, a MEMS actuator is disclosed that has a conductive bend attached to a MEMS actuator core at one end and an outer frame at the other end, and the conductive bend supplies an electric signal from a photoelectric conversion element of the MEMS actuator core to the outer frame (Patent Document 1). Also, a MEMS actuator is disclosed that has a structure in which the outer frame is pressed from the periphery and the bars constituting the outer frame are fixed to each other with a latch structure, thereby raising a U-shaped thin film wiring connected to the outer frame and the inner frame (Patent Document 2). In this MEMS actuator, the U-shaped thin film wiring is deformed so as to fall and rise as the imaging element moves, which is said to reduce the mechanical load (mechanical resistance) of the multiple wirings. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] US Patent Application Publication No. 2019 / 0227266 [Patent Document 2] US Patent Application Publication No. 2015 / 0341534 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the technology of Patent Document 1 does not disclose whether the conductive bending part can pass both a high-frequency signal for high-speed communication and a large current for driving an imaging element, and there is room for improvement. Also, in the technology of Patent Document 2, the structure of the outer frame is complicated, the assembly process of the MEMS actuator is complicated, and there are concerns about the positioning performance of the imaging element attached to the MEMS actuator.

[0009] An object of the present invention is to provide a flexible wiring body, a drive system, and an imaging device that can stably pass both high-frequency signals for high-speed communication and large currents for driving an imaging element, improve the positioning performance of an imaging element attached to an actuator, and further do not require a complicated assembly process and are suitable for mass production. [Means for solving the problem]

[0010] In order to achieve the above object, the present invention provides the following means. [1] A flexible wiring body that connects a semiconductor element that moves in association with an actuator that moves in at least one of three mutually orthogonal translational directions and rotational directions about an axis in the three directions, to a frame body that is positioned outside the semiconductor element, a main portion on which the semiconductor element is mounted and which is electrically connected to the semiconductor element; A plurality of arms extending from the main portion toward the frame body and bent three-dimensionally; Have death, The arm portion is bent so as to have a main surface intersecting with a main surface of the main portion, and is further bent back, The deformation of the arm portion provides the semiconductor element with degrees of freedom in rotation about an axis in the horizontal direction, the vertical direction, and a direction perpendicular to the main surface of the semiconductor element. A flexible wiring body.

[0012] [ 2 ] The number of the arms is four or more, ToThe flexible wiring body described herein.

[0013] [ 3 In a plan view of the main portion, the plurality of arms are disposed symmetrically with respect to the main portion; The plurality of arms are folded back and bent to maintain a balanced state of forces due to elastic deformation. [1] Or [2] The flexible wiring body according to claim 1.

[0014] [ 4 The arm portion is a first portion having a major surface substantially perpendicular to a major surface of the main portion; A second portion provided at one end of the first portion and curved back; A third portion disposed opposite the first portion; a fourth portion provided at one end of the third portion and having a main surface substantially parallel to a main surface of the main portion; having The first region, the second region, and the third region are disposed substantially perpendicular to a main surface of the main portion. 3 ] The flexible wiring body according to any one of the preceding claims.

[0015] [ 5 ] The arm portion is composed of a resin layer and a plurality of linear conductive layers formed side by side on the resin layer and insulated from each other, 4 ] The flexible wiring body according to any one of the preceding claims.

[0016] [ 6 ] the plurality of arms have a total of 20 or more conductive layers, 5

[0023] A flexible wiring body according to the present invention.

[0017] [ 7 ] an actuator that moves in at least one of three mutually orthogonal translational directions and rotational directions about an axis in the three directions; and6 and a flexible wiring body according to any one of the preceding claims. The actuator comprises: A base portion fixed to the substrate; a movable portion to which the main portion of the flexible wiring body and the semiconductor element are attached; and a plurality of spring portions connecting the base portion and the movable portion. A drive system having

[0018] [ 8 ]The above-mentioned [further comprises at least one displacement sensor that measures the displacement of at least one of the movable part and the plurality of spring parts. 7

[0023] A drive system as described in

[0019] [ 9 ] The actuator is formed of MEMS. 7

[0023] A drive system as described in

[0020] [ 10 ] the actuator is an electrostatic actuator, 7 ]~[ 9 ] A drive system according to any one of the preceding claims.

[0021] [ 11 ] The actuator is an electromagnetic actuator. 7 ]~[ 9 ] A drive system according to any one of the preceding claims.

[0022] [ 12 ] the actuator comprises a MEMS mounted on a substrate and at least one coil disposed within the substrate and electrically connected to an external circuit; The MEMS has a base supported by a substrate, a movable part fixed to the main part of the flexible wiring body and the semiconductor element, a plurality of spring parts connecting the base and the movable part, and at least one magnetic body attached to the movable part.11

[0023] A drive system as described in

[0023] [ 13 ] the magnetic body is formed using magnetic powder or a plated body and is embedded in the movable part, 12

[0023] A drive system as described in

[0024] [ 14 ] the magnetic powder particles are bonded to each other by a film or a resin binder, 13

[0023] A drive system as described in

[0025] [ 15 ] the semiconductor element is an image sensor, 7 ]~[ 12 ] A drive system according to any one of the preceding claims.

[0026] [ 16 ]the above[ 15

[0023] The drive system according to

[0023] The imaging device, wherein the drive system performs one or both of image stabilization and focus adjustment by driving the imaging element. Effect of the Invention

[0027] According to the present invention, it is possible to provide a flexible wiring body, a drive system, and an imaging device that can stably pass both high-frequency signals for high-speed communication and large currents for driving an imaging element, can improve the positioning performance of an imaging element attached to an actuator, and further does not require a complicated assembly process and is suitable for mass production. [Brief description of the drawings]

[0028] [Figure 1] FIG. 1 is an exploded perspective view illustrating a schematic configuration of an imaging device according to an embodiment of the present invention. [Diagram 2]FIG. 2(a) is a plan view that shows a schematic configuration of the drive system in FIG. 1, and FIG. 2(b) is a cross-sectional view taken along line II' in FIG. 1(a). [Diagram 3] FIG. 3 is a partially enlarged cross-sectional view of FIG. [Figure 4] FIG. 4 is a development view of the flexible wiring body in FIG. [Diagram 5] 5(a) is a bottom view showing a schematic configuration of the actuator in FIG. 2(b), FIG. 5(b) is a schematic cross-sectional view taken along line II-II' in FIG. 5(a), and FIG. 5(c) is an enlarged cross-sectional view of the insulating portion in FIG. 5(b). [Figure 6] FIG. 6(a) is a plan view showing a modified example of the drive system in FIG. 2(a), and FIG. 6(b) is a cross-sectional view taken along line III-III' in FIG. 6(a). [Figure 7] FIG. 7 is a partially enlarged cross-sectional view of FIG. 6(b). [Figure 8] FIG. 8 is a development view of the flexible wiring body in FIG. [Figure 9] FIG. 9 is a plan view showing another modified example of the flexible wiring body in FIG. [Figure 10] FIG. 10(a) is a partial plan view showing a state in which the flexible wiring body of FIG. 9 is mounted on an actuator, and FIG. 10(b) is a partial cross-sectional view of FIG. 10(a). [Figure 11] FIG. 11 is a plan view showing another modified example of the flexible wiring body in FIG. [Figure 12] 12(a) is a partial plan view showing a state in which the flexible wiring body of FIG. 11 is mounted on an actuator, and FIG. 12(b) is a partial cross-sectional view of FIG. 12(a). [Figure 13] FIG. 13 is a bottom view showing a modification of the actuator of FIG. [Figure 14] FIG. 14 is a bottom view showing another modified example of the actuator of FIG. [Figure 15] FIG. 15 is a cross-sectional view showing a modification of the actuator in FIG. 2(b). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the drawings used in the following description may show characteristic parts in an enlarged scale for the sake of convenience in order to make the characteristics of the present invention easier to understand. For this reason, the dimensional ratios of each component may differ from the actual ones.

[0030] Fig. 1 is an exploded perspective view showing a schematic configuration of an imaging device according to an embodiment of the present invention. As shown in Fig. 1, the imaging device 1 includes a lens 2, an AF unit 3, a glass member 4, a cover member 5, a semiconductor element 6, and a drive system 7. The imaging device 1 is, for example, a camera mounted on a mobile device such as a smartphone, although it is not particularly limited thereto. The semiconductor element 6 is, for example, an imaging element. In this embodiment, the drive system 7 performs one or both of image stabilization and focus adjustment by driving the semiconductor element 6 as the imaging element.

[0031] 2(a) is a plan view showing a schematic configuration of the drive system 7 in FIG. 1, FIG. 2(b) is a cross-sectional view taken along line II' in FIG. 1(a), and FIG. 3 is a partially enlarged cross-sectional view of FIG. 2(b). The drive system 7 includes an actuator 71A that moves in at least one of three mutually orthogonal directions (e.g., X, Y, and Z directions) and rotates about an axis in the three directions, and a flexible wiring body 73A that connects a semiconductor element 6 that moves along with the actuator 71A to a frame body 72 positioned outside the semiconductor element 6. In this embodiment, the actuator 71A moves in the X and Y directions of the mutually orthogonal X, Y, and Z directions, and rotates about an axis in the Z direction (θz direction).

[0032] The flexible wiring body 73A has a main portion 731A on which the semiconductor element 6 is placed and which is electrically connected to the semiconductor element 6, and a plurality of arm portions 732A which extend from the main portion 731A toward the frame body 72 and are bent three-dimensionally. In this embodiment, the flexible wiring body 73A has four arm portions 732A, and the four arm portions 732A are arranged, for example, line-symmetrically with respect to a line which passes through the center of the main portion 731A and runs along the Y direction in a plan view.

[0033] The arm portion 732A is bent to have a principal surface 732a that intersects with the principal surface 731a of the main portion 731A (FIG. 2(b)), and is further bent back (FIG. 2(a)). The deformation of the arm portion 732A provides the semiconductor element 6 with freedom of rotation about an axis in the horizontal direction (X direction), vertical direction (Y direction), and direction perpendicular to the principal surface of the semiconductor element 6 (Z direction).

[0034] The flexible wiring body 73A has four arms 732A, but is not limited thereto, and may have four or more arms 732A. In addition, in a plan view of the main part 731A, it is preferable that the arms 732A are arranged symmetrically with respect to the main part 731A, and the arms 732A are folded back and bent to maintain a balanced state of forces due to elastic deformation. However, it is not necessary that the forces due to elastic deformation are balanced. The arms 732A may be arranged symmetrically with respect to the main part 731A, and the arms 732A may be folded back and bent, and a state in which no force due to elastic deformation is generated in any of the arms 732A may be maintained. This can reduce the driving power of the actuator 71A, thereby achieving power saving.

[0035] Specifically, the arm portion 732A has a first portion 732Aa having a main surface 732a substantially perpendicular to the main surface 731a of the main portion 731A, a second portion 732Ab provided at one end of the first portion 732Aa and curved back, a third portion 732Ac arranged opposite to the first portion 732Aa, and a fourth portion 732Ad provided at one end of the third portion 732Ac and having a main surface 732b substantially parallel to the main surface 731a of the main portion 731A. The first portion 732Aa, the second portion 732Ab, and the third portion 732Ac are arranged substantially perpendicular to the main surface 731a of the main portion 731A.

[0036] The main portion 731A is fixed to the upper surface 711a of the stage portion 711A via an adhesive layer 74A. A first portion 732Aa of the arm portion 732A is fixed to a side surface 711b of the stage portion 711A via an adhesive layer 75A, and a fourth portion 732Ad of the arm portion 732A is fixed to the upper surface 72a of the frame body 72 via an adhesive layer 76A (FIG. 3). The main portion 731A moves in accordance with the movement of the stage portion 711A in the X direction, Y direction, and / or θz direction, and the second portion 732Ab and the third portion 732Ac of the arm portion 732A are deformed in accordance with the movement of the main portion 731A.

[0037] Fig. 4 is a development view of flexible wiring body 73A in Fig. 2(a). In this embodiment, flexible wiring body 73A is mountain-folded along lines L1, L1 in Fig. 4, and further, the middle parts of each of four arm parts 732A are folded back and bent to form a three-dimensional structure as shown in Fig. 2(a) and Fig. 2(b).

[0038] The flexible wiring body 73A is composed of a resin layer 733A and a plurality of linear conductive layers 734A that are arranged on the resin layer 733A and insulated from each other. That is, the main part 731A and the arm part 732A are composed of the resin layer 733A and a plurality of linear conductive layers 734A that are arranged on the resin layer 733A and insulated from each other. The resin layer 733A may be composed of a single layer or may be composed of multiple layers made of different materials. The plurality of conductive layers 734A may also be composed of a single layer or may be composed of multiple layers made of different materials. One end 734Aa of the conductive layer 734A is electrically connected to the semiconductor element 6 via a wire part 77 such as a bonding wire made of metal, and the other end 734Ab is electrically connected to a connector terminal (not shown) (FIG. 3). The thickness of the resin layer 733A is, for example, 10 μm to 30 μm, and the thickness of the conductive layer 734A is, for example, 5 μm to 15 μm. The resin layer 733A is made of, for example, polyimide (PI), and the conductive layer 734A is made of, for example, copper (Cu). In this figure, the conductive layer is a single layer, but it may be multi-layered in order to perform more complicated wiring. Also, an insulating protective film may be formed on the conductive layer. Furthermore, in this figure, only the semiconductor element 6 is mounted on the flexible wiring body 73A, but other elements may be mounted.

[0039] The arm portions 732A preferably have 20 or more conductive layers 734A in total. In this embodiment, five conductive layers 734A are provided in the arm portion 732A, and the arm portions 732A have 20 conductive layers 734A in total. However, as long as the conductive layers 734A are provided with 20 or more conductive layers in total, there is no limit to the number of arms and the number of conductive layers or layers of each arm, and they can be changed appropriately according to the specifications. This makes it possible to fully respond to an increase in wiring due to high performance of the semiconductor element 6. In addition, in this embodiment, the conductive layers 734A of the 20 lines have the same line width in a plan view, but this is not limited thereto, and the conductive layers 734A of the 20 lines may have different line widths. For example, the conductive layers 734A may include a narrow conductive layer for communication and a wide conductive layer for power. This allows the multiple conductive layers 734A to have a conductive layer that carries a high-frequency signal for high-speed communication and a conductive layer that carries a large current for driving the image sensor, making it possible to pass both the high-frequency signal for high-speed communication and the large current for driving the image sensor through the flexible wiring body 73A.

[0040] The method for forming the flexible wiring body 73A is not particularly limited, and it can be formed using a subtractive method in which a circuit is formed by etching the copper foil of a copper laminate, or a semi-additive method in which a circuit is formed by electrolytic copper plating on an insulating substrate having a conductive layer.

[0041] Fig. 5(a) is a bottom view showing a schematic configuration of the actuator 71A in Fig. 2(b), Fig. 5(b) is a schematic cross-sectional view taken along line II-II' in Fig. 5(a), and Fig. 5(c) is an enlarged cross-sectional view of the insulating part in Fig. 5(b). In this embodiment, the actuator 71A is an electrostatic actuator.

[0042] The actuator 71A has a plurality of bases 712A fixed to the substrate 8, a movable part 713A to which a main part 731A of a flexible wiring body 73A and the semiconductor element 6 are attached via a stage part 711A, and a plurality of spring parts 714A connecting the base 712A and the movable part 713A. The actuator 71A is not limited in shape as long as it has the base 712A, the movable part 713A, and the plurality of spring parts 714A, but from the viewpoints of miniaturization and ease of manufacture, it is formed of, for example, MEMS.

[0043] Specifically, the multiple bases 712A have fixed parts X11, X12, GND14, GND15, GND14, θ12 arranged on one end side of the actuator 71A in the X direction, and fixed parts X21, X22, θ22, GND23, GND25, GND23 arranged on the other end side of the actuator 71A in the X direction. The symbol "X" of the fixed parts indicates that the voltage is applied when the movable part 713A is translated in the X direction, the symbol "GND" indicates that the voltage is applied when the movable part 713A is rotated in the θz direction. The fixed parts X11 and X12 are connected to the substrate 8 via the extraction electrode 79A. The other fixed parts have the same configuration, so their description will be omitted.

[0044] The two fixed parts X11 and X12 are formed with one of the teeth of the comb-tooth electrode, and the other of the teeth is formed on the first movable part 713AA described later. The four fixed parts GND14, GND14, GND15, and θ12 are each connected to the first movable part 713AA described later via the first spring part 714AA. The two fixed parts X21 and X22 are each formed with one of the teeth of the comb-tooth electrode, and the other of the teeth is formed on the first movable part 713AB described later. The four fixed parts θ22, GND23, GND25, and GND23 are each connected to the first movable part 713AB described later via the first spring part 714AA.

[0045] Further, the multiple bases 712A have fixed parts Y11, Y12, GND31, GND35, GND31, θ31 arranged on one end side of the actuator 71A in the Y direction, and fixed parts Y21, Y22, θ41, GND42, GND45, GND42 arranged on the other end side of the actuator 71A in the Y direction. The symbol "Y" of the fixed parts indicates a part to which a voltage is applied when the movable part 713A is moved in the Y direction, the symbol "GND" indicates a part that is grounded, and the symbol "θ" indicates a part to which a voltage is applied when the movable part 713A is rotated in the θz direction.

[0046] The two fixed parts Y11 and Y12 are formed with one of the teeth of the comb-tooth electrode, and the other of the teeth is formed on the first movable part 713AC described later. The four fixed parts GND31, GND35, GND31, and θ31 are each connected to the first movable part 713AC described later via the first spring part 714AA. The two fixed parts Y21 and Y22 are each formed with one of the teeth of the comb-tooth electrode, and the other of the teeth is formed on the first movable part 713AD described later. The four fixed parts θ22, GND23, GND25, and GND23 are each connected to the first movable part 713AD described later via the first spring part 714AA.

[0047] The movable part 713A has four first movable parts 713AA, 713AB, 713AC, 713AD arranged on all four sides (XY directions) of the second movable part described below, a second movable part 713AE arranged in the center of the four first movable parts 713AA to 713AD and connected to the four first movable parts 713AA to 713AD via a plurality of second spring parts 714AB and having an approximately cross shape in a planar view, and a third movable part 713AF arranged in the center of the second movable part 713AE and connected to the second movable part 713AE via a plurality of third spring parts 714AC and having an approximately X shape in a planar view.

[0048] The first movable parts 713AA, 713AB, 713AC, and 713AD are, for example, substantially parallel cross-shaped frames in a plan view. Fixed parts GND14, GND15, GND14, and θ12 are arranged on both sides of the first movable part 713AA in the Y direction, and fixed parts X11 and X12 are arranged inside the first movable part 713AA. Fixed parts θ22, GND23, GND25, and GND23 are arranged on both sides of the first movable part 713AB in the Y direction, and fixed parts X21 and X22 are arranged inside the first movable part 713AB. Similarly, fixed parts GND31, GND35, GND31, and θ31 are arranged on both sides of the first movable part 713AC in the X direction, and fixed parts Y11 and Y12 are arranged inside the first movable part 713AC. Furthermore, fixed parts θ41, GND42, GND45, and GND42 are arranged on both sides of the first movable part 713AD in the X direction, and fixed parts Y21 and Y22 are arranged inside the first movable part 713AD.

[0049] The fixed parts GND14, GND15, GND14, and θ12 are each connected to the first movable part 713AA via the first spring part 714AA. The fixed parts θ22, GND23, GND25, and GND23 are each connected to the first movable part 713AB via the first spring part 714AA. The fixed parts GND31, GND35, GND31, and θ31 are each connected to the first movable part 713AC via the first spring part 714AA. The fixed parts θ41, GND42, GND45, and GND42 are each connected to the first movable part 713AD via the first spring part 714AA. In addition to functioning as a mechanical connection part, the multiple first spring parts 714AA also function as an electrical connection part.

[0050] The first movable part 713AA is provided with insulating parts 715AA and 715AB for insulating the fixed part GND14 from the fixed part θ12,GND15. The first movable part 713AB is provided with insulating parts 715AC and 715AD for insulating the fixed part GND23 from the fixed part θ22,GND25. The first movable part 713AC is provided with insulating parts 715AE and 715AF for insulating the fixed part GND31 from the fixed part θ31,GND35. The first movable part 713AD is provided with insulating parts 715AG and 715AH for insulating the fixed part GND42 from the fixed part θ41,GND45. The insulating parts are formed of one or more layers made of materials such as silicon nitride (SiN) and polysilicon (p-Si), and are formed by trench isolation or the like.

[0051] In this embodiment, the fixed portion X11 has the same potential as the fixed portion X21, and the fixed portion X12 has the same potential as the fixed portion X22. The fixed portion Y11 has the same potential as the fixed portion Y21, and the fixed portion Y12 has the same potential as the fixed portion Y22. When a voltage is applied to the fixed portions X11 and X21, the first movable portions 713AA and 713AB move in one direction in the X direction (for example, the +X direction), and when a voltage is applied to the fixed portions X12 and X22, the first movable portions 713AA and 713AB move in the other direction in the X direction (for example, the -X direction). On the other hand, when a voltage is applied to the fixed portions Y11 and Y21, the first movable portions 713AC and 713AD move in one direction in the Y direction (for example, the +Y direction), and when a voltage is applied to the fixed portions Y12 and Y22, the first movable portions 713AC and 713AD move in the other direction in the Y direction (for example, the -X direction).

[0052] The second movable part 713AE is, for example, a frame-shaped body having a substantially cross-shaped outer shell in a plan view, and is connected to the four first movable parts 713AA, 713AB, 713AC, and 713AD via eight second spring parts 714AB. Two second spring parts 714AB are arranged on one end side in the X direction of the second movable part 713AE, and two second spring parts 714AB are also arranged on the other end side. In addition, two second spring parts 714AB are arranged on one end side in the Y direction of the second movable part 713AE, and two second spring parts 714AB are also arranged on the other end side. The second spring parts 714AB are designed so that the second movable part 713AE moves in one direction (either the X direction or the Y direction).

[0053] A plurality of comb teeth on one side that constitute a plurality of comb-tooth electrodes are formed on the second movable portion 713AE, and a plurality of comb teeth on the other side that constitute a plurality of comb-tooth electrodes are formed on the third movable portion 713AF. In this embodiment, the four comb-tooth electrodes are disposed between the second movable portion 713AE and the third movable portion 713AF so as to be rotationally symmetrical by 180° with respect to the center of the third movable portion 713AF.

[0054] The second movable part 713AE has six moving parts θ51, θ52, GND55, θ61, θ62, and GND65 arranged to surround the third movable part 713AF. The moving parts θ51, θ52, GND55, θ61, θ62, and GND65 are arranged to be 180° rotationally symmetrical with respect to the center of the third movable part 713AF. The symbol "GND" of the moving parts indicates that the part is grounded, and the symbol "θ" indicates that the part is applied with voltage when rotated in the θz direction.

[0055] The moving part θ51 is connected to the fixed part θ31 via the second spring part 714AB and the first spring part 714AA. The moving part θ52 is connected to the fixed part θ22 via the second spring part 714AB and the first spring part 714AA. The moving part GND55 is connected to the fixed parts GND15 and GND35 via the second spring part 714AB and the first spring part 714AA. The moving part θ61 is connected to the fixed part θ41 via the second spring part 714AB and the first spring part 714AA. The moving part θ62 is connected to the fixed part θ12 via the second spring part 714AB and the first spring part 714AA. The moving part GND65 is connected to the fixed parts GND25 and GND45 via the second spring part 714AB and the first spring part 714AA. Further, the plurality of second spring portions 714AB and the first spring portion 714AA function as electrical connecting portions in addition to functioning as mechanical connecting portions.

[0056] In addition, between adjacent moving parts of the six moving parts θ51, θ52, GND55, θ61, θ62, GND65, insulating parts 716AA, 716AB, 716AC, 716AD, 716AE, 716AF are provided. The insulating parts are formed of one or more layers made of materials such as SiN and p-Si, and are formed by trench isolation or the like. In this embodiment, as shown in FIG. 5(c), the insulating part 716AB has a first layer 716ABa made of SiN and a second layer 716ABb made of p-Si. The insulating parts 716AA, 716AC to 716AF have the same configuration as the insulating part 716AB, and therefore their description will be omitted.

[0057] The third movable part 713AF is, for example, a frame-shaped body having a substantially X-shape in a plan view, and is connected to the second movable part 713AE via a plurality of third spring parts 714AC. The plurality of third spring parts 714AC function as electrical connection parts in addition to functioning as mechanical connection parts. The third spring part 714AC is disposed at one end side in the X direction of the third movable part 713AF, and the third spring part 714AC is disposed at the other end side. The third spring part 714AC is disposed at one end side in the Y direction of the third movable part 713AF, and the third spring part 714AC is disposed at the other end side. In this embodiment, the four third spring parts 714AC are disposed so as to be line-symmetrical with respect to a line corresponding to y=x or y=-x with the center of the third movable part 713AF as the origin. The third movable part 713AF is fixed to the stage part 711A via an adhesive layer 78A (FIG. 2(b)).

[0058] In this embodiment, the moving part θ51 has the same potential as the fixed part θ31, and the moving part θ52 has the same potential as the fixed part θ22. The moving part θ61 has the same potential as the fixed part θ41, and the moving part θ62 has the same potential as the fixed part θ12. The moving parts GND55 and GND65 have the same potential as the fixed parts GND35 and GND45. When the same voltage is applied to the moving parts θ51 and θ61, the third movable part 713AF moves in one direction in the θz direction (for example, clockwise), and when the same voltage is applied to the moving parts θ52 and θ62, the third movable part 713AF moves in the other direction in the θz direction (for example, counterclockwise).

[0059] By applying a voltage to a predetermined fixed portion and / or movable portion as described above, the first movable portions 713AA-713AD and the second movable portion 713AE translate in the X direction and / or Y direction, and the third movable portion 713AF rotates in the θz direction. Therefore, the third movable portion 713AF moves in the X direction, Y direction and / or θz direction. The stage portion 711A moves in the X direction, Y direction and / or θz direction with the movement of the third movable portion 713AF, and the main portion 731A of the flexible wiring body 73A moves in the X direction, Y direction and / or θz direction with the movement of the stage portion 711A. The multiple arms 732A of the flexible wiring body 73A easily deform and follow the movement of the main portion 731A.

[0060] The method of forming the actuator 71A is not particularly limited, and for example, the actuator 71A can be formed by using a substrate such as SOI in which silicon single crystals are formed on both sides of an oxide film, and performing etching such as DRIE (deep reactive etching) on ​​the handle layer and the active layer. The insulating portion in the actuator 71A can be formed by combining DRIE, LPCVD, polishing, and the like.

[0061] The driving system 7 may include at least one displacement sensor that measures the displacement of at least one of the movable part and the plurality of spring parts. For example, the driving system 7 may use a driving comb electrode to measure the displacement of the third movable part 713AF, or may further include another displacement sensor. By inputting a signal from the displacement sensor to a control unit (not shown) and controlling the driving of the actuator 71A based on the signal, it is possible to realize a more accurate position control of the semiconductor element 6.

[0062] As described above, according to this embodiment, the flexible wiring body 73A has the main portion 731A on which the semiconductor element 6 is placed and electrically connected to the semiconductor element 6, and the multiple arms 732A extending from the main portion 731A toward the frame body 72 and bent three-dimensionally, so that the main surfaces 732a of the multiple arms 732A integrally molded with the main portion 731A are non-parallel to the main surface 731a of the main portion 731A, and the multiple arms 732A bend easily and sufficiently in the out-of-plane direction with respect to the translation (X direction and / or Y direction) and rotation (θz direction) of the main portion 731A fixed to the stage portion 711A, and the movement of the actuator 71A is not easily hindered, and as a result, the positioning performance of the semiconductor element 6 placed on the main portion 731A can be improved. In addition, by providing the arms 732A with a conductive layer for communication and a conductive layer for power, both a high-frequency signal for high-speed communication and a large current for driving the image sensor can be stably passed. Furthermore, flexible wiring body 73A can be formed by performing a simple bending process on the developed body of flexible wiring body 73A, so that a complicated assembly process is not required and mass production is also possible.

[0063] Furthermore, when viewed in a plan view of the main portion 731A, the multiple arm portions 732A are arranged symmetrically with respect to the main portion 731A, and the multiple arm portions 732A are folded back and bent to maintain a balanced state of forces due to elastic deformation. Therefore, even if the actuator 71A is formed of MEMS or the like and generates a small force, the resistance force due to the rigidity of the flexible wiring body 73A is small, so that the movement of the actuator 71A is less likely to be hindered, and highly precise movement of the semiconductor element 6 can be achieved.

[0064] Furthermore, the arm portion 732A has a first portion 732Aa having a main surface 732a substantially perpendicular to the main surface 731a of the main portion 731A, a second portion 732Ab provided at one end of the first portion 732Aa and curved back, and a third portion 732Ac arranged opposite the first portion 732Aa, which are arranged substantially perpendicular to the main surface 731a of the main portion 731A.Therefore, the multiple arm portions 732A can reliably follow the translation (X direction and / or Y direction) and rotation (θz direction) of the main portion 731A fixed to the stage portion 711A, which can further improve the positioning performance of the semiconductor element 6 placed on the main portion 731A and can improve the connection reliability.

[0065] According to the present embodiment, the actuator 71A is provided with a plurality of insulating parts 715AA-715AF, 716AA-716AF, and the driving mechanism and circuit for translation in the X direction, the driving mechanism and circuit for translation in the Y direction, and the driving mechanism and circuit for rotation in the θz direction are provided electrically independent of each other, so that any movement in the X direction, Y direction, and / or θz direction can be realized. Furthermore, the driving circuit of the actuator 71A is connected to a circuit (not shown) of the substrate 8, so that the wiring of the actuator 71A and the wiring of the semiconductor element 6 (the conductive layer of the flexible wiring body 73A) can be formed separately above and below the stage part 711A, and physical interference between these wirings can be reliably prevented. Furthermore, by flip-chip connecting the plurality of base parts 712A of the actuator 71A to the substrate 8, the fine parts of the movable part 713A of the actuator 71A can be protected.

[0066] Fig. 6(a) is a plan view showing a modified example of the driving system 7 in Fig. 2(a), Fig. 6(b) is a cross-sectional view taken along line III-III' in Fig. 6(a), and Fig. 7 is a partially enlarged cross-sectional view of Fig. 6(b). The driving system in Fig. 6(a) differs from the configuration of the driving system 7 in Fig. 2(a) mainly in that it does not have a stage portion 711A and the actuator 71A is directly connected to the flexible wiring body 73A via an adhesive layer 80A. The same components as those in the driving system 7 in Fig. 2(a) are denoted by the same reference numerals and will not be described.

[0067] The flexible wiring body 73A in FIG. 6(a) has the same configuration as the flexible wiring body 73A in FIG. 2(a) in the developed state, and has a different configuration from the flexible wiring body 73A in FIG. 2(a) in the state in which a three-dimensional structure is formed by processing. As shown in FIG. 6(b), the flexible wiring body 73A has a housing portion 81A that is defined by a main portion 731A and an arm portion 732A and houses a semiconductor element 6. As shown in FIG. 7, the main portion 731A is fixed to the lower surface 6a of the semiconductor element 6 via an adhesive layer 82A. The first portion 732Aa of the arm portion 732A is fixed to the side surface 6b of the semiconductor element 6 via an adhesive layer 83A (FIG. 7). In addition, one end portion 734Aa of the conductive layer 734A is electrically connected to the semiconductor element 6 via a joint portion 84A formed by ultrasonic connection, thermocompression bonding, connection using a conductive adhesive, or the like, and the other end portion 734Ab is electrically connected to a connector terminal (not shown).

[0068] Fig. 8 is a development view of flexible wiring body 73A in Fig. 6(a). In this modification, flexible wiring body 73A is mountain-folded along lines L2, L2 in Fig. 8, and further, the middle parts of each of four arm portions 732A are folded back and bent to form a three-dimensional structure as shown in Fig. 6(a) and Fig. 6(b).

[0069] In this manner, according to this modification, the flexible wiring body 73A can be applied to the drive system 7 that does not have the stage section 711A. That is, the flexible wiring body 73A has a main section 731A on which the semiconductor element 6 is placed and which is electrically connected to the semiconductor element 6, and a plurality of arm sections 732A that extend from the main section 731A toward the frame body 72 and are three-dimensionally bent, so that the main surfaces 732a of the plurality of arm sections 732A integrally molded with the main section 731A are non-parallel to the main surface 731a of the main section 731A, and the plurality of arm sections 732A are easily and sufficiently bent in the out-of-plane direction with respect to the translation (X direction and / or Y direction) and rotation (θz direction) of the main section 731A fixed to the stage section 711A, and the movement of the actuator 71A is not easily hindered, and as a result, the positioning performance of the semiconductor element 6 placed on the main section 731A can be improved. Furthermore, since the semiconductor element 6 and the flexible wiring body 73A are electrically connected by providing the joint portion 84A instead of providing a wire portion, this can contribute to making the configuration including the semiconductor element 6 and the drive system 7 low-profile.

[0070] Fig. 9 is a plan view showing another modified example of the flexible wiring body in Fig. 4. Fig. 10(a) is a partial plan view showing a state in which the flexible wiring body in Fig. 9 is mounted on an actuator, and Fig. 10(b) is a partial cross-sectional view of Fig. 10(a). The flexible wiring body in Fig. 9 differs from the flexible wiring body in Fig. 4 in that the shape of the arms is different.

[0071] As shown in FIG. 9, the flexible wiring body 73B has a main portion 731B on which the semiconductor element 6 is placed and which is electrically connected to the semiconductor element 6, and a plurality of arm portions 732B which extend from the main portion 731B toward the frame body 72 (see FIG. 2(a) and FIG. 2(b)) and are bent three-dimensionally.

[0072] 10(a) and 10(b), the arm portion 732B has a first portion 732Ba having a main surface 732c substantially perpendicular to the main surface 731b of the main portion 731B, a second portion 732Bb provided at one end of the first portion 732Ba and curved back, a third portion 732Bc arranged opposite to the first portion 732Ba, and a fourth portion 732Ad provided at one end of the third portion 732Bc and having a main surface 732d substantially parallel to the main surface 731b of the main portion 731B. The first portion 732Ba, the second portion 732Bb, and the third portion 732Bc are arranged substantially perpendicular to the main surface 731b of the main portion 731B (FIG. 10(b)).

[0073] The fourth portion 732Bd has an extension portion 732Bda arranged perpendicular to the third portion 732Bc, and an extension portion 732Bdb arranged perpendicular to the extension portion 732Bda (FIG. 9). In a state where the flexible wiring body 73B is mounted on the actuator 71A (FIG. 10(a)), the extension portion 732Bda extends in a direction (X direction) away from the main portion 731B in a plan view, and the extension portion 732Bdb extends in a lateral direction (Y direction) from the extension portion 732Bda. The two extension portions 732Bdb provided on the two adjacent arm portions 732B extend in the lateral direction (Y direction) and also extend in a direction away from each other. In this modification, the fourth portion 732Bd is provided on a plane different from the main portion 731B, and is disposed below the main portion 731B.

[0074] In this modification, the other end 734Bb of the conductive layer 734B is provided on the extending portion 732Bdb, one end 734Ba of the conductive layer 734B is electrically connected to the semiconductor element 6, and the other end 734Bb is electrically connected to a connector terminal (not shown). In addition, in a state in which the flexible wiring body 73B is bent three-dimensionally, the other end 734Bb of the conductive layer 734B is disposed on the lower side (back side) of the resin layer 733B in the Z direction (FIG. 10(b)).

[0075] The arm portion 732B may have a fifth portion 732Be between the main portion 731B and the first portion 732Ba, which serves as a margin portion when the arm portion 732B is bent (FIG. 9). The widthwise dimension (Y direction) of the fifth portion 732Be is preferably smaller than the widthwise dimension of the main portion 731B. This makes it easier to form the first portion 732Ba by bending, and also makes it possible to suppress buckling of the conductive layer 734B at the bent portion, thereby further improving the electrical connection reliability of the conductive layer 734B.

[0076] According to this modified example, the fourth portion 732Bd has an extension portion 732Bda arranged perpendicular to the third portion 732Bc, and an extension portion 732Bdb arranged perpendicular to the extension portion 732Bda, thereby improving the design freedom of the fourth portion 732Bd to be inserted into the connector terminal.

[0077] Fig. 11 is a plan view showing another modified example of the flexible wiring body in Fig. 4. Fig. 12(a) is a partial plan view showing a state in which the flexible wiring body in Fig. 11 is mounted on an actuator, and Fig. 12(b) is a partial cross-sectional view of Fig. 12(a).

[0078] As shown in FIG. 11, the flexible wiring body 73C has a main portion 731C on which the semiconductor element 6 is placed and which is electrically connected to the semiconductor element 6, and a plurality of arm portions 732C which extend from the main portion 731C toward the frame body 72 (see FIG. 2(a) and FIG. 2(b)) and are bent three-dimensionally.

[0079] As shown in Fig. 12(a) and Fig. 12(b), the arm portion 732C has a first portion 732Ca having a main surface 732e substantially perpendicular to the main surface 731c of the main portion 731C, a second portion 732Cb provided at one end of the first portion 732Ca and curved back, a third portion 732Cc arranged opposite to the first portion 732Ca, and a fourth portion 732Cd provided at one end of the third portion 732Cc and having a main surface 732f substantially parallel to the main surface 731c of the main portion 731C. The first portion 732Ca, the second portion 732Cb, and the third portion 732Cc are arranged substantially perpendicular to the main surface 731c of the main portion 731C. (Fig. 10(b)).

[0080] The fourth portion 732Cd has an extension portion 732Cda arranged perpendicular to the third portion 732Cc, and an extension portion 732Cdb arranged perpendicular to the extension portion 732Cda (FIG. 11). In a state where the flexible wiring body 73C is mounted on the actuator 71A (FIG. 12(a)), the extension portion 732Cda extends in a direction (X direction) away from the main portion 731C in a plan view, and the extension portion 732Cdb extends in a lateral direction (Y direction) from the extension portion 732Cda. The two extension portions 732Cdb provided on the two adjacent arm portions 732C extend in the lateral direction (Y direction) and also extend in a direction away from each other. In this modification, the fourth portion 732Cd is provided on the same plane as the main portion 731C.

[0081] In this modification, the other end 734Cb of the conductive layer 734C is provided on the extending portion 732Cdb, one end 734Ca of the conductive layer 734C is electrically connected to the semiconductor element 6, and the other end 734Bb is electrically connected to a connector terminal (not shown). In a state in which the flexible wiring body 73C is bent three-dimensionally, the other end 734Cb of the conductive layer 734C is disposed on the upper side (front side) of the resin layer 733C in the Z direction (FIG. 12(b)).

[0082] According to this modified example, the fourth portion 732Cd has an extension portion 732Cda arranged perpendicular to the third portion 732Cc, and an extension portion 732Cdb arranged perpendicular to the extension portion 732Cda. Therefore, similar to the fourth portion 732Bd of the flexible wiring body 73B, the design freedom of the fourth portion 732Cd that is inserted into the connector terminal can be improved.

[0083] FIG. 13 is a bottom view showing a modification of the actuator 71A of FIG. 13, the actuator 71B has a plurality of base portions 712B fixed to the substrate 8 (see FIG. 2(b)), a movable portion 713B to which the main portion 731A of the flexible wiring body 73A and the semiconductor element 6 are attached, and a plurality of spring portions 714B connecting the base portion 712B and the movable portion 713B. The actuator 71B is formed of, for example, MEMS, similar to the actuator 71A.

[0084] The multiple bases 712B have fixed parts X31, X32, GND51, and GND51 arranged on one end side of the actuator 71B in the X direction, and fixed parts X41, X42, GND51, and GND51 arranged on the other end side of the actuator 71B in the X direction. Fixed parts X31 and X32 are connected to the substrate 8 via an extraction electrode (not shown) (see FIG. 5(b)). The other fixed parts have the same configuration, so their description will be omitted.

[0085] The two fixed parts X31 and X32 are each formed with one of the teeth of a comb-tooth electrode, and the other of the teeth is formed on a first movable part 713BA described later. The two fixed parts GND51 and GND51 are each connected to a first movable part 713BA described later via a first spring part 714BA. The two fixed parts X41 and X42 are each formed with one of the teeth of a comb-tooth electrode, and the other of the teeth is formed on a first movable part 713BB described later. The two fixed parts GND51 and GND51 are each connected to a first movable part 713BB described later via a first spring part 714BA.

[0086] In addition, the multiple base portions 712B have fixed portions Y31, Y32, GND51, and GND51 arranged on one end side of the actuator 71B in the Y direction, and have fixed portions Y41, Y42, GND51, and GND51 arranged on the other end side of the actuator 71B in the Y direction.

[0087] The two fixed parts Y31 and Y32 are formed with one of the teeth of a comb electrode, and the other of the teeth is formed on a first movable part 713BC described later. The two fixed parts GND51 and GND51 are each connected to a first movable part 713BC described later via a first spring part 714BA. The two fixed parts Y41 and Y42 are each formed with one of the teeth of a comb electrode, and the other of the teeth is formed on a first movable part 713BD described later. The two fixed parts GND51 and GND51 are each connected to a first movable part 713BD described later via a first spring part 714BA.

[0088] The movable part 713B has four first movable parts 713BA, 713BB, 713BC, 713BD arranged on all four sides (XY directions) of the second movable part described later, and a second movable part 713BE which is arranged in the center of the four first movable parts 713BA-713BD, is connected to the four first movable parts 713BA-713BD via multiple second spring parts 714BB, and has an approximately windmill-shaped second movable part 713BE when viewed in a plane.

[0089] The first movable parts 713BA, 713BB, 713BC, and 713BD are, for example, frames that are substantially parallel crosses in plan view. Fixed parts GND51, GND51 are arranged on both sides of the first movable part 713BA in the Y direction, and fixed parts X31, X32 are arranged inside the first movable part 713BA. Similarly, fixed parts GND51, GND51 are arranged on both sides of the first movable part 713BB in the Y direction, and fixed parts X41, X42 are arranged inside the first movable part 713BB. Moreover, fixed parts GND51, GND51 are arranged on both sides in the X direction of the first movable part 713BC, and fixed parts Y31, Y32 are arranged inside the first movable part 713BC. Moreover, fixed parts GND51, GND51 are arranged on both sides in the X direction of the first movable part 713BD, and fixed parts Y41, Y42 are arranged inside the first movable part 713BD.

[0090] The fixed parts GND51 are connected to the first movable parts 713BA-713BD via the first spring parts 714BA, respectively. The first spring parts 714BA function as electrical connection parts in addition to functioning as mechanical connection parts.

[0091] In this modification, by applying any voltage to the fixed parts X31, X32, X41, X42, Y31, Y32, Y41, Y42, the first movable parts 713BA, 713BB, 713BC, 713BD move independently, and the second movable part 713BE moves in the X, Y, and θz directions. For example, if the same voltage is applied to the fixed parts X32 and X41, the first movable parts 713BA and 713BB move equally in the X direction (rightward), and the second movable part 713BE moves in the +X direction (rightward). Also, if the same voltage is applied to the fixed parts X32, X42, Y32, Y42, the first movable parts 713BA, 713BB, 713BC, 713BD move equally toward the center, and the second movable part 713BE rotates in the θz direction (clockwise).

[0092] The second movable part 713BE is connected to the four first movable parts 713BA, 713BB, 713BC, and 713BD via eight second spring parts 714BB. Two second spring parts 714BB are arranged on one end side in the X direction of the second movable part 713BE, and two second spring parts 714BB are arranged on the other end side. Two second spring parts 714BB are arranged on one end side in the Y direction of the second movable part 713BE, and two second spring parts 714BB are arranged on the other end side. By appropriately designing the second spring parts 714BB, the first movable parts 713BA and 713BB can move only in the X direction, and the first movable parts 713BC and 713BD can move only in the Y direction. The second movable part 713BE is fixed to the stage part 711A via an adhesive layer 78A (see FIG. 2(b)).

[0093] According to this modified example, a drive mechanism and circuit for translation in the X direction, and a drive mechanism and circuit for translation in the Y direction are provided independently, and the translation in the X direction and the translation in the Y direction are controlled to also rotate in the θz direction, so that it is possible to realize movement of the second movable part 713BE in the X direction, the Y direction and / or the θz direction.

[0094] FIG. 14 is a bottom view showing another modified example of the actuator 71A of FIG. 14, the actuator 71C has a plurality of base portions 712C fixed to the substrate 8 (see FIG. 2(b)), a movable portion 713C to which the main portion 731A of the flexible wiring body 73A and the semiconductor element 6 are attached, and a plurality of spring portions 714C connecting the base portion 712C and the movable portion 713C. The actuator 71C is formed of, for example, MEMS, similar to the actuator 71A.

[0095] The multiple bases 712C have fixed parts X51, X52, GND61, X61, X62, and GND61 arranged on one end side of the actuator 71C in the X direction, and fixed parts X71, X72, GND61, X81, X82, and GND61 arranged on the other end side of the actuator 71C in the X direction. The fixed parts X51 and X52 are connected to the substrate 8 via an extraction electrode (not shown) (see FIG. 5(b)). The other fixed parts have the same configuration, so their description will be omitted.

[0096] The two fixed parts X51 and X52 have one of the teeth of the comb-tooth electrode formed thereon, and the other of the teeth is formed on a first movable part 713CAA described later. Similarly, the two fixed parts X61 and X62 have one of the teeth of the comb-tooth electrode formed thereon, and the other of the teeth is formed on a first movable part 713CAB described later. The two fixed parts GND61 and GND61 are connected to the first movable part 713CAA and the first movable part 713CAB described later, respectively, via the two first spring parts 714CA. Further, one of the teeth of the comb-tooth electrode is formed on each of the two fixed portions X71 and X72, and the other of the teeth is formed on a first movable portion 713CBA described later. Similarly, one of the teeth of the comb-tooth electrode is formed on each of the two fixed portions X81 and X82, and the other of the teeth is formed on a first movable portion 713CBB described later. The two fixed portions GND61 and GND61 are connected to the first movable portion 713CBA and the first movable portion 713CBB described later, respectively, via the two first spring portions 714CA.

[0097] In addition, the multiple base portions 712C have fixed portions Y51, Y52, GND61, Y61, Y62, GND61 arranged on one end side of the actuator 71C in the Y direction, and fixed portions Y71, Y72, GND61, Y81, Y82, GND61 arranged on the other end side of the actuator 71C in the Y direction.

[0098] The two fixed parts Y51 and Y52 have one of the teeth of the comb-tooth electrode formed thereon, and the other of the teeth is formed on a first movable part 713CCA described later. Similarly, the two fixed parts Y61 and Y62 have one of the teeth of the comb-tooth electrode formed thereon, and the other of the teeth is formed on a first movable part 713CCB described later. The two fixed parts GND61 and GND61 are connected to the first movable part 713CCA and the first movable part 713CCB described later, respectively, via the two first spring parts 714CA. Further, one of the teeth of the comb-tooth electrode is formed on each of the two fixed portions Y71 and Y72, and the other of the teeth is formed on a first movable portion 713CDA described later. Similarly, one of the teeth of the comb-tooth electrode is formed on each of the two fixed portions Y81 and Y82, and the other of the teeth is formed on a first movable portion 713CDB described later. The two fixed portions GND61 and GND61 are connected to the first movable portion 713CDA and the first movable portion 713CDB described later, respectively, via the two first spring portions 714CA.

[0099] The movable part 713C has eight first movable parts 713CAA, 713CAB, 713CBA, 713CBB, 713CCA, 713CCB, 713CDA, 713CDB arranged on all four sides (XY directions) of the second movable part described below, and a second movable part 713CE which is approximately rectangular in plan view and arranged in the center of the eight first movable parts 713CAA to 713CDB, connected to the eight first movable parts 713CAA to 713CDB via multiple second spring parts 714CB.

[0100] The first movable parts 713CAA, 713CAB, 713CBA, 713CBB, 713CCA, 713CCB, 713CDA, and 713CDB are, for example, substantially rectangular frames in plan view. A fixed part X51 is disposed on the opposite side of the first movable part 713CAA from the second movable part 713CE in the X direction, and fixed parts X52 and GND61 are disposed inside the first movable part 713CAA. A fixed part X61 is disposed on the opposite side of the first movable part 713CAB from the second movable part 713CE in the X direction, and fixed parts X52 and GND61 are disposed inside the first movable part 713CAB. Furthermore, a fixed portion X71 is arranged on the opposite side of the first movable portion 713CBA to the second movable portion 713CE in the X direction, and fixed portions X72 and GND61 are arranged inside the first movable portion 713CBA. Further, a fixed portion X81 is arranged on the opposite side of the first movable portion 713CBB to the second movable portion 713CE in the X direction, and fixed portions X82 and GND61 are arranged inside the first movable portion 713CBB.

[0101] Similarly, a fixed portion Y52 is disposed on the opposite side of the first movable portion 713CCA to the second movable portion 713CE in the Y direction, and fixed portions Y51 and GND61 are disposed inside the first movable portion 713CCA. Further, a fixed portion X62 is disposed on the opposite side of the first movable portion 713CCB to the second movable portion 713CE in the Y direction, and fixed portions Y61 and GND61 are disposed inside the first movable portion 713CCB. Furthermore, a fixed portion Y72 is arranged on the opposite side of the first movable portion 713CDA to the second movable portion 713CE in the Y direction, and fixed portions Y71 and GND61 are arranged inside the first movable portion 713CDA. Further, a fixed portion Y82 is arranged on the opposite side of the first movable portion 713CDB to the second movable portion 713CE in the Y direction, and fixed portions Y81 and GND61 are arranged inside the first movable portion 713CDB.

[0102] The fixed parts GND61 are connected to the first movable parts 713CAA-713CDB via the first spring parts 714CA, respectively. The first spring parts 714CA function as electrical connection parts in addition to functioning as mechanical connection parts.

[0103] In this modification, when a voltage is applied to the fixed parts X52, X62, X71, and X81, the first movable parts 713CAA, 713CAB, 713CBA, and 713CBB move in one direction in the X direction (for example, the +X direction), and when a voltage is applied to the fixed parts X51, X61, X72, and X82, the first movable parts 713CAA, 713CAB, 713CBA, and 713CBB move in the other direction in the X direction (for example, the -X direction). On the other hand, when a voltage is applied to the fixed parts Y52, Y62, Y71, and Y81, the first movable parts 713BC and 713BD move in one direction in the Y direction (for example, the +Y direction), and when a voltage is applied to the fixed parts Y51, Y61, Y72, and Y82, the first movable parts 713BC and 713BD move in the other direction in the Y direction (for example, the -Y direction).

[0104] The second movable portion 713CE is connected to the eight first movable portions 713CAA, 713CAB, 713CBA, 713CBB, 713CCA, 713CCB, 713CDA, and 713CDB via the eight second spring portions 714CB. Two second spring portions 714CB are arranged on one end side of the second movable portion 713CE in the X direction, and two second spring portions 714CB are arranged on the other end side. Two second spring portions 714CB are arranged on one end side of the second movable portion 713BE in the Y direction, and two second spring portions 714CB are arranged on the other end side. The second movable portion 713CE is fixed to the stage portion 711A via an adhesive layer 78A (see FIG. 2(b)).

[0105] In this modification, the second movable part 713CE has the same potential as the fixed part GND61. For example, when a voltage is applied to one of the fixed parts X52, X62, X71, X81 and the fixed parts X51, X61, X72, and X82, and one of the fixed parts Y52, Y62, Y71, and Y81 and the fixed parts Y51, Y61, Y72, and Y82, the first movable parts 713CAA, 713CAB, 713CBA, and 713CBB move in one direction in the X direction (for example, the +X direction), and the first movable parts 713CCA, 713CCB, 713CDA, and 713CDB move in one direction in the Y direction (for example, the +Y direction). Then, the second movable part 713CE moves in the X, Y, and θz directions along with the movement of the first movable parts 713CAA to 713CDB. For example, when the same voltage is applied to the fixed parts X52, X62, X71, and X81, the first movable parts 713CAA, 713CAB, 713CBA, and 713CBB move equally in the +X direction (rightward), and the second movable part 713CE moves in the +X direction (rightward). When the same voltage is applied to the fixed parts X52, X61, X71, X82, Y52, Y61, Y71, and Y82, the first movable parts 713CAA and 713CBA move in the +X direction, the first movable parts 713CAB and 713CBB move in the -X direction, the first movable parts 713CCA and 713CDA move in the +Y direction (upward), the first movable parts 713CBB and 713CDB move in the -Y direction, and the second movable part 713CE moves in the θz direction (clockwise).

[0106] By selectively applying voltages to predetermined fixed portions as described above, the first movable portions 713CAA-713CDB translate in the X direction and / or Y direction, and the second movable portion 713BE moves in the X, Y, and θz directions.

[0107] According to this modified example, a drive mechanism and circuit for translation in the X direction, and a drive mechanism and circuit for translation in the Y direction are provided independently, and the translation in the X direction and the translation in the Y direction are controlled to rotate in the θz direction, so that movement of the second movable part 713CE in the X direction, Y direction and / or θz direction can be realized.

[0108] Fig. 15 is a cross-sectional view showing a modification of actuator 71A in Fig. 2(b) This modification differs from actuator 71A in that the actuator is an electromagnetic actuator.

[0109] 15, the actuator 71D has a MEMS 711D attached to a substrate 8, and a plurality of coils 712D provided in the substrate 8 and electrically connected to an external circuit (not shown). The MEMS 711D has a base 711DA supported by the substrate 8, a movable part 711DB fixed to a main part 731A of a flexible wiring body 73A and the semiconductor element 6, a plurality of spring parts 711DC connecting the base 711DA and the movable part 711DB, and a plurality of magnetic bodies 711DD attached to the movable part 711DB.

[0110] The multiple coils 712D are disposed directly below the MEMS 711D at positions corresponding to the multiple magnetic bodies 711DD, and are embedded in a substrate 8 such as a printed circuit board or a ceramic substrate. The configurations of the base 711DA, movable part 711DB, and multiple spring parts 711DC of the MEMS 711D are basically the same as the configurations of the base, movable part, and multiple spring parts of the actuator described above, and therefore description thereof will be omitted.

[0111] The magnetic body 711DD is formed by using magnetic powder such as a neodymium magnet, and is embedded in the movable part 711DB. The magnetic body 711DD is obtained by forming a hole in a substrate such as SOI by DRIE, placing magnetic powder in the hole, and fixing the magnetic powder in the hole by film formation. The magnetic powders are bonded to each other by a film formed body, which is made of alumina (Al2O3), for example, and formed by ALD. Alternatively, the magnetic powders are bonded to each other by a resin binder. Furthermore, instead of embedding the magnetic powder, a magnetic body (for example, CoPt) may be formed in the hole by plating. This allows the thickness of the magnetic body 711DD to be increased relative to the thickness of the substrate such as SOI, and allows the magnetic body 711DD with high magnetic force to be formed in the movable part 711DB.

[0112] The actuator 71D may have at least one displacement sensor that measures the displacement of at least one of the movable portion 711DB and the plurality of spring portions 711DC. For example, the displacement sensor and its circuit may be formed in the MEMS 711D.

[0113] According to this modification, the movable part 711DB can be moved in the X direction, Y direction and / or θz direction using the actuator 71D, which is an electromagnetic actuator, and similarly to the electrostatic actuator, it is possible to realize highly accurate movement of the semiconductor element 6.

[0114] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and variations are possible within the scope of the gist of the present invention as described in the claims.

[0115] For example, in this embodiment, the actuator 71A performs translation in the X and Y directions among the mutually orthogonal XYZ directions, and rotation around the Z axis (θz direction), but is not limited thereto, and may perform at least one of translation in the X, Y, and Z directions among the mutually orthogonal XYZ directions, and rotation around the X axis (θx direction), rotation around the Y axis (θy direction), and rotation around the Z axis (θz direction). Even when a flexible wiring body having the same configuration as above is used for such an actuator, the multiple arms can follow at least one of translation in three mutually orthogonal directions and rotation around the three axes, thereby improving the positioning performance of the semiconductor element placed on the main part, and also allowing both a high-frequency signal for high-speed communication and a large current for driving the image sensor to flow stably. [Explanation of symbols]

[0116] 1. Imaging device 2 Lenses 3 AF unit 4 Glass components 5 Cover member 6. Semiconductor elements 6a Bottom side 6b side 7. Drive System 8 Substrate 71A Actuator 71B Actuator 71C Actuator 71D Actuator 72 Frame 72a Top side 73A flexible wiring body 73B Flexible wiring body 73C Flexible wiring body 74A Adhesive layer 75A adhesive layer 76A Adhesive layer 77 Wire section 78A Adhesive layer 79A extraction electrode 80A adhesive layer 81A Storage unit 82A Adhesive layer 83A Adhesive layer 84A joint 711a top side 711A Stage section 711b side 711DA base 711DB moving parts 711DC Multiple spring parts 711DD Magnetic material 712A base 712B base 712C base 712D Coil 713A Moving part 713AA First moving part 713AB First moving part 713AC First moving part 713AD First moving part 713AE Second moving part 713AF Third moving part 713B Moving part 713BA First moving part 713BB First moving part 713BC First moving part 713BD First moving part 713BE Second moving part 713C Moving part 713CAA First moving part 713CAB First moving part 713CBA First moving part 713CBB First moving part 713CCA First moving part 713CCB First moving part 713CDA First moving part 713CDB First moving part 713CE Second moving part 714A Multiple Spring Sections 714AA First spring part 714AB Second spring part 714AC 3rd spring part 714B Multiple spring parts 714BA First spring part 714BB Second spring part 714C Multiple spring parts 714CA First Spring Section 714CB Second spring part 715AA Insulation part 715AB Insulation 715AC Insulation 715AD Insulation part 715AE Insulation 715AF Insulation part 715AG Insulation part 715AH Insulation part 716AA Insulation part 716AB Insulation 716ABa 1st layer 716ABb Second layer 716AC Insulation Part 716AD Insulation part 716AE Insulation part 716AF Insulation part 731a Main surface 731A Main Section 731b main surface 731B Main Section 731C Main Section 731c main surface 732a Main side 732A Wrist 732Aa First part 732Ab Second site 732Ac Third part 732Ad The fourth part 732b Main side 732B Wrist 732Ba First Part 732Bb Second part 732Bc Third Part 732Bd Fourth part 732Bda extension 732Bdb Extension 732Be Part 5 732c Main side 732C Wrist 732Ca First site 732Cb Second part 732Cc Third part 732Cd Fourth part 732Cda extension 732Cdb extension 732d Main surface 732e Main side 732f Main side 733A Resin layer 733B Resin layer 733C Resin layer 734A Conductive layer 734Aa One end 734Ab Other end 734B Conductive layer 734Ba One end 734Bb Other end 734C Conductive layer 734Ca one end 734Cb Other end X11, X12, GND14, GND15, θ12 fixed part X21, X22, θ22, GND23, GND25 fixed part Y11,Y12,GND31,GND35,θ31 fixed part Y21,Y22,θ41,GND42,GND45 fixed part Fixed parts of X31, X32, GND51 Fixed parts of X41, X42, GND51 Fixed parts of Y31, Y32, GND51 Fixed parts of Y41, Y42, GND51 Fixed parts of X51, X52, GND61, X61, X62 Fixed parts of X71, X72, GND61, X81, X82 Fixed parts of Y51, Y52, GND61, Y61, Y62 Fixed parts of Y71, Y72, GND61, Y81, Y82 Moving parts of θ51, θ52, GND55, θ61, θ62, GND65

Claims

1. A flexible wiring body that connects a semiconductor element that moves with an actuator that moves in at least one of three mutually orthogonal translational directions and rotational directions about an axis of the three directions, to a frame body that is positioned outside the semiconductor element, a main portion on which the semiconductor element is mounted and which is electrically connected to the semiconductor element; A plurality of arms extending from the main portion toward the frame body and bent three-dimensionally; Have The arm portion is bent so as to have a main surface intersecting with a main surface of the main portion, and is further bent back, A flexible wiring body in which deformation of the arm portion provides freedom of rotation about an axis in the horizontal direction, the vertical direction, and a direction perpendicular to a main surface of the semiconductor element.

2. The flexible wiring body according to claim 1 , wherein the number of the arms is four or more.

3. 3. The flexible wiring body according to claim 1, wherein, in a plan view of the main portion, the plurality of arm portions are disposed symmetrically with respect to the main portion, and the plurality of arm portions are folded back and bent to maintain a balanced state of forces due to elastic deformation.

4. The arm portion is a first portion having a major surface substantially perpendicular to a major surface of the main portion; A second portion provided at one end of the first portion and curved back; A third portion disposed opposite the first portion; a fourth portion provided at one end of the third portion and having a main surface substantially parallel to a main surface of the main portion; having The flexible wiring body according to any one of claims 1 to 3, wherein the first portion, the second portion and the third portion are arranged substantially perpendicular to a main surface of the main portion.

5. The flexible wiring body according to any one of claims 1 to 4, wherein the arm portion is composed of a resin layer and a plurality of linear conductive layers formed in parallel on the resin layer and insulated from each other.

6. The flexible wiring body according to claim 5 , wherein the plurality of arms have a total of 20 or more conductive layers.

7. An actuator that moves in at least one of three translational directions perpendicular to each other and rotational directions about an axis in the three directions; and the flexible wiring body according to any one of claims 1 to 6, The actuator comprises: A base portion fixed to the substrate; a movable portion to which the main portion of the flexible wiring body and the semiconductor element are attached; and a plurality of spring portions connecting the base portion and the movable portion. A drive system having

8. The drive system of claim 7 , further comprising at least one displacement sensor that measures a displacement of at least one of the movable part and the plurality of spring parts.

9. The drive system according to claim 7 , wherein the actuator is formed by MEMS.

10. The drive system according to any one of claims 7 to 9, wherein the actuator is an electrostatic actuator.

11. A drive system according to any one of claims 7 to 9, wherein the actuator is an electromagnetic actuator.

12. the actuator includes a MEMS mounted on a substrate and at least one coil disposed within the substrate and electrically connected to an external circuit; The drive system according to claim 11, wherein the MEMS has a base supported on a substrate, a movable part fixed to the main part of the flexible wiring body and the semiconductor element, a plurality of spring parts connecting the base and the movable part, and at least one magnetic body attached to the movable part.

13. The drive system according to claim 12 , wherein the magnetic body is formed using a magnetic powder or a plated body and is embedded in the movable part.

14. The drive system of claim 13 , wherein the magnetic powders are bonded together by a coating or a resin binder.

15. The drive system according to any one of claims 7 to 12, wherein the semiconductor element is an imaging element.

16. A drive system according to claim 15, The imaging device, wherein the drive system performs one or both of image stabilization and focus adjustment by driving the imaging element.

Images