Flux transfer device, flux transfer method, and mounting device

Abstract

This flux transfer device (1) is provided with: a transfer stage (21) which stores flux; a holding tool (13) which holds an electronic component (CP) on a holding surface (13a) so that an electrode forming surface (CPA) of the electronic component (CP) is immersed in the flux stored on the transfer stage (21); an imaging unit (31) which acquires the captured image of at least one of the electrode forming surface (CPA) of the electronic component (CP) after flux transfer and the transfer stage (21) after the flux transfer; and a detection unit (51) which detects the inclination of the holding surface (13a) relative to the transfer stage (21) on the basis of the captured image.

Description

[Technical field]

[0001] The present invention relates to a flux transfer device, a flux transfer method, and a mounting device. [Background technology]

[0002] Solder bonding is generally used widely for mounting electronic components using methods such as flip chip bonding. In this flip chip bonding method, in order to improve the connection between the solder and the electrodes, a flux (oxide film remover, surfactant, etc.) is transferred to the electrode formation surface of the electronic component before mounting the electronic component on the board. Since the amount of flux affects the soldering quality, flux transfer devices may be equipped with a mechanism to detect transfer failure.

[0003] For example, Patent Document 1 discloses a flux transfer device having an illumination device that irradiates a flux-immersed area of ​​a transfer stage with light, an imaging means that captures an image of the flux-immersed area, and a control means that compares the image captured by the imaging means with a preregistered image and determines whether the image captured by the imaging means is good or bad. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4960160 Summary of the Invention [Problem to be solved by the invention]

[0005] According to the invention described in Patent Document 1, it is possible to prevent transfer defects of flux caused by poor flatness during flux film formation, and reduce mounting defects of electronic components on a substrate.

[0006] However, when the electrode formation surface of the electronic component is inclined with respect to the flux provided on the transfer stage, the resonance device described in Patent Document 1 may not be able to sufficiently suppress transfer defects.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flux transfer device, a flux transfer method, and a mounting device that can suppress transfer defects. [Means for solving the problem]

[0008] A flux transfer device according to one embodiment of the present invention is a flux transfer device that transfers flux to an electrode formation surface of an electronic component, and includes a transfer stage that stores flux, a holding tool that holds the electronic component with a holding surface so that the electrode formation surface of the electronic component is immersed in the flux stored in the transfer stage, an imaging unit that obtains an image of at least one of the electrode formation surface of the electronic component after the flux transfer and the transfer stage after the flux transfer, and a detection unit that detects the inclination of the holding surface relative to the transfer stage based on the image.

[0009] According to this aspect, for example, by repeating prototyping so that the inclination of the holding surface with respect to the transfer stage is approximately zero, it is possible to suppress transfer defects of the flux. In particular, when the electronic component is large, that is, when the inclination of the holding surface with respect to the transfer stage significantly affects transfer defects of the flux at the end of the electrode formation surface, transfer defects can be effectively suppressed.

[0010] In the above aspect, the holding tool may further include a first adjustment unit configured to be able to adjust the attitude of the holding tool based on the inclination.

[0011] This makes it possible to suppress fluctuations in the flux liquid surface caused by changing the posture of the transfer stage, thereby making it possible to suppress the occurrence of transfer defects caused by adjustments to the posture of the transfer stage.

[0012] In the above aspect, the apparatus may further include a second adjustment unit configured to be able to adjust the attitude of the transfer stage based on the inclination.

[0013] According to this, the inclination of the holding tool with respect to the transfer stage can be adjusted without adjusting the attitude of the holding tool, and therefore the occurrence of displacement errors when adjusting the attitude of the holding tool can be suppressed.

[0014] In the above aspect, the imaging unit may image the electrode formation surface of the electronic component from below after the flux transfer.

[0015] With this, based on the captured image acquired by the imaging section, not only the inclination of the electronic component with respect to the transfer stage can be detected, but also the positional deviation of the electronic component in the in-plane direction of the electrode formation surface can be detected.

[0016] In the above aspect, the detection unit may compare the captured image with a reference image obtained from the electrode formation surface of the electronic component after the flux has been normally transferred.

[0017] With this, even if the flux has low visibility and is difficult to detect by image analysis, it can be detected with high accuracy by image analysis of the difference between the captured image and the reference image.

[0018] In the above aspect, the detection section may obtain an image of at least one sub-area from the captured image, and compare the image of the at least one sub-area with a reference image.

[0019] This makes it possible to reduce the time required for detection compared to a case in which a captured image of the entire electrode formation surface is compared with a reference image.

[0020] In the above embodiment, the at least one sub-area may include a corner area provided at a corner of the electrode formation surface.

[0021] According to this, by determining whether the flux has been transferred successfully in the corner sub-area that is displaced the most when the inclination of the holding tool relative to the transfer stage changes, it is possible to quickly evaluate whether the flux has been transferred poorly over the entire electrode formation surface.

[0022] In the above aspect, at least one imaging area may include a strip-shaped area extending along a long side or a short side of the electrode formation surface.

[0023] According to this, by identifying the position of the transfer failure in the band-shaped sub-area, it is possible to calculate the inclination angle of the holding tool with respect to the transfer stage.

[0024] In the above aspect, the holding tool may be a bonding tool for mounting an electronic component to an object.

[0025] A flux transfer method according to another aspect of the present invention is a flux transfer method for transferring flux to an electrode formation surface of an electronic component, the method including storing flux in a transfer stage, holding the electronic component on a holding surface of a holding tool, immersing the electrode formation surface of the electronic component in the flux stored in the transfer stage, obtaining an image of at least one of the electrode formation surface of the electronic component after the flux transfer and the transfer stage after the flux transfer, and detecting an inclination of the holding surface relative to the transfer stage based on the image.

[0026] According to this aspect, for example, by repeating prototyping so that the inclination of the holding surface with respect to the transfer stage is approximately zero, it is possible to suppress transfer defects of the flux. In particular, when the electronic component is large, that is, when the inclination of the holding surface with respect to the transfer stage significantly affects transfer defects of the flux at the end of the electrode formation surface, transfer defects can be effectively suppressed.

[0027] In the above aspect, the method may further include adjusting the attitude of the transfer stage or the holding tool based on the tilt.

[0028] In the above-described aspect, the method may further include releasing the electronic component without mounting it on the target object, and immersing an electrode-forming surface of another electronic component in the flux stored in the transfer stage.

[0029] In the above-described embodiment, the method may further include immersing the electronic component again in the flux stored on the transfer stage.

[0030] According to this, even electronic components with insufficient flux transfer can be reused, thereby reducing loss of electronic components.

[0031] A mounting device according to another aspect of the present invention is a mounting device that mounts an electronic component having flux transferred to its electrode formation surface onto an object, and includes a transfer stage that stores the flux, a mounting tool that holds the electronic component with a holding surface so that the electrode formation surface of the electronic component is immersed in the flux stored in the transfer stage and mounts the electronic component on the object, an imaging unit that obtains an image of at least one of the electrode formation surface of the electronic component after the flux transfer and the transfer stage after the flux transfer, and a detection unit that detects the inclination of the holding surface relative to the transfer stage based on the image.

[0032] According to this aspect, for example, by repeating prototyping so that the inclination of the holding surface with respect to the transfer stage becomes approximately zero, it is possible to suppress mounting defects caused by poor transfer of flux. Effect of the Invention

[0033] According to the present invention, it is possible to provide a flux transfer device, a flux transfer method, and a mounting device that can suppress transfer defects. [Brief description of the drawings]

[0034] [Figure 1] FIG. 1 is a diagram illustrating a schematic configuration of a flux transfer device according to a first embodiment. [Diagram 2]FIG. 2 is a diagram illustrating an outline of the configuration of a posture control unit according to the first embodiment. [Diagram 3] 4 is a flowchart illustrating a flux transfer method using the flux transfer device according to the first embodiment. [Figure 4] FIG. 13 is a diagram illustrating a schematic view of step S20. [Diagram 5] 11A and 11B are diagrams illustrating an example of a captured image of an electrode formation surface and sub-areas. [Figure 6] FIG. 13 is a diagram showing another example of a captured image of the electrode formation surface and sub-areas. [Figure 7] FIG. 11 is a diagram illustrating an outline of the configuration of a posture control unit according to a second embodiment. [Figure 8] FIG. 13 is a diagram illustrating an outline of the configuration of a posture control unit according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings of the present embodiment are merely examples, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0036] First Embodiment First, the configuration of a flux transfer device 1 according to a first embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a diagram that shows a schematic configuration of the flux transfer device according to the first embodiment. Figure 2 is a diagram that shows a schematic configuration of a posture control unit according to the first embodiment.

[0037] The flux transfer device 1 includes a transport unit 10, a transfer unit 20, a posture control unit 30, and a mounting unit 40.

[0038] The transport unit 10 transports the electronic component CP. Specifically, the transport unit 10 is configured to be able to transport the electronic component CP between the transfer unit 20 and the attitude control unit 30 and between the attitude control unit 30 and the mounting unit 40. The transport unit 10 transports the electronic component CP taken out from a feeder (not shown) to the transfer unit 20, transports the electronic component CP onto which the flux FX has been transferred to the attitude control unit 30, and transports the electronic component CP onto which the image of the electrode formation surface CPa has been captured to the mounting unit 40. The transport unit 10 may transport the electronic component CP onto which the image of the electrode formation surface CPa has been captured back to the transfer unit 20, or may release it onto a tray (not shown).

[0039] The transfer unit 10 includes a bonding head 11 and an actuator 17. The bonding head 11 holds an electronic component CP. The actuator 17 moves the bonding head 11 in three axial directions.

[0040] The bonding head 11 includes a holding tool 13 and an inclination adjustment mechanism 15 .

[0041] The holding tool 13 detachably holds the electronic component CP on the holding surface 13a. The holding tool 13 is, for example, a suction collet that holds the electronic component CP by vacuum suction. In the case of a suction collet, for example, the holding surface 13a is a flat surface with suction holes, and the electronic component CP may be held in contact with the holding surface 13a or may be held at a distance from the holding surface 13a. However, the holding tool 13 is not limited to a suction collet as long as the electronic component CP can be held so that the electrode formation surface CPa of the electronic component CP is immersed in the flux FX of the transfer stage 21. The holding tool 13 is attached to an inclination adjustment mechanism 15.

[0042] The tilt adjustment mechanism 15 is configured to be able to adjust the attitude of the holding tool 13 .

[0043] The tilt adjustment mechanism 15 sets the attitude of the holding tool 13 with respect to the transfer stage 21, for example, so that the surface of the flux FX stored in the transfer stage 21 and the electrode formation surface CPa of the electronic component CP are approximately parallel. The "attitude of the holding tool 13 with respect to the transfer stage 21" is defined as, for example, the "tilt of the holding surface 13a of the holding tool 13 with respect to the transfer surface 21a of the transfer stage 21." The tilt adjustment mechanism 15 corresponds to an example of a "first adjustment unit" according to the present invention.

[0044] The inclination adjustment mechanism 15 sets the attitude of the holding tool 13 with respect to the mounting stage 41, for example, so that the electrode formation surface CPa of the electronic component CP and the mounting surface BDa of the substrate BD are approximately parallel to each other. The "attitude of the holding tool 13 with respect to the mounting stage 41" is defined as, for example, "the inclination of the holding surface 13a of the holding tool 13 with respect to the placement surface 41a of the mounting stage 41."

[0045] The transfer unit 20 transfers the flux FX onto an electrode formation surface (the surface on which the bump electrodes are formed) CPa of the electronic component CP.

[0046] The transfer unit 20 includes a transfer stage 21 .

[0047] An immersion area 23 is formed on the transfer surface 21a of the transfer stage 21. The immersion area 23 is a recess formed to a predetermined depth. For example, the flux FX applied to the transfer surface 21a of the transfer unit 20 is leveled by a first squeegee, and then excess flux FX is scraped off from the transfer surface 21a by a second squeegee. This causes the flux FX to be uniformly stored in the immersion area 23. The surface of the flux FX is provided on approximately the same plane as the transfer surface 21a of the transfer stage 21. The electrode formation surface PCa of the electronic component CP held by the holding tool 13 of the transport unit 10 is immersed in the flux FX stored in the immersion area 23 of the transfer unit 20.

[0048] The posture control unit 30 detects the inclination of the holding surface 13a with respect to the transfer stage 21, and controls the posture of the holding tool 13 so that the inclination becomes approximately zero. In other words, based on the detected inclination, the posture of the holding tool 13 is changed so that the surface of the flux FX on the transfer stage 21 and the electrode formation surface CPa of the electronic component CP become approximately parallel.

[0049] The attitude control unit 30 includes an imaging section 31 , a light 33 , a detection section 35 , and a control section 37 .

[0050] The imaging unit 31 captures an image of the electronic component CP held by the holding tool 13, and obtains an image of the electrode formation surface CPa after the flux transfer. The imaging unit 31 is, for example, a CCD camera, but is not limited to this as long as it can obtain an image of the electrode formation surface CPa after the flux transfer.

[0051] The illumination 33 irradiates light onto the electrode formation surface CPa after the flux transfer when the imaging unit 31 images the electronic component CP held by the holding tool 13. That is, the imaging unit 31 images the electrode formation surface CPa after the flux transfer in a state illuminated by the illumination 33. The illumination 33 is, for example, a ring illumination, but is not limited to this as long as it can irradiate light onto the electrode formation surface CPa after the flux transfer.

[0052] The detection unit 35 detects the inclination of the holding surface 13a with respect to the transfer stage 21 based on the captured image acquired by the imaging unit 31. A reference image acquired from the electrode formation surface of the electronic component after the flux has been normally transferred is registered in advance in the detection unit 35. The detection unit 35 compares the captured image acquired by the imaging unit 31 with the pre-registered reference image. Then, the detection unit 35 evaluates the transfer status (success or failure of transfer, amount of transfer, transfer distribution, etc.) of the flux FX to the electrode formation surface CPa by performing image analysis of the difference between the captured image and the reference image.

[0053] The detection unit 35, for example, obtains images of the multiple sub-areas from the captured image obtained by the imaging unit 31, and compares the images with a reference image for each sub-area. That is, the detection unit 35 determines the transfer status of the flux FX for each sub-area (success or failure of transfer, amount of transfer, transfer distribution, etc.). For example, the detection unit 35 calculates the direction and angle of inclination of the holding surface 13a with respect to the transfer stage 21 by correlating position information of each of the multiple sub-areas with information on success or failure of transfer of the flux FX in each of the multiple sub-areas. The number, area, and shape of the multiple sub-areas are not limited as long as they are smaller than the electrode formation surface CPa of the electronic component CP.

[0054] The sub-areas acquired by the detection unit 35 may include, for example, corner sub-areas provided at the corners of the electrode forming surface CPa. By determining whether the flux FX has been transferred to the corners that are most displaced when the angle of the holding tool 13 relative to the transfer stage 21 changes, it is possible to quickly determine whether the flux FX has been transferred to the entire electrode forming surface CPa. Furthermore, the sub-areas acquired by the detection unit 35 may include, for example, at least one of a band-shaped sub-area provided along the long side of the electrode forming surface CPa over substantially the entire width in the long side direction, and a band-shaped sub-area provided along the short side over substantially the entire width in the long side direction. By determining the position of the transfer failure in the band-shaped sub-area, it is possible to detect the magnitude of the angle of the holding tool 13 relative to the transfer stage 21.

[0055] The number of sub-areas acquired from the captured image acquired by the imaging unit 31 may be one. The sub-areas acquired by the detection unit 35 may include, for example, a frame-shaped sub-area provided in a frame shape along an edge of the electrode formation surface CPa, or may include a grid-shaped sub-area or a cross-shaped sub-area formed by combining strip-shaped sub-areas. Images of multiple sub-areas may be captured individually by multiple cameras provided for each sub-area.

[0056] The control unit 37 controls the tilt adjustment mechanism 15 of the transport unit 10 based on the tilt detected by the detection unit 35. That is, the control unit 37 changes the tilt of the holding surface 13a with respect to the transfer stage 21.

[0057] Each of the detection unit 35 and the control unit 37 is, for example, a computer in which a predetermined program is installed, that is, a combination of hardware and software. Both the detection unit 35 and the control unit 37 may be configured by separate programs installed in one computer, or both the detection unit 35 and the control unit 37 may be configured by one program installed in one computer.

[0058] The mounting unit 40 mounts an electronic component CP on a substrate BD. The electronic component CP is soldered to the substrate BD by flip-chip bonding. The electronic component CP corresponds to an example of a "mounted object" according to the present invention, and the substrate BD corresponds to an example of an "object" according to the present invention.

[0059] The mounting unit 40 includes a mounting stage 41. A substrate BD is placed on a placement surface 41a of the mounting stage 41. The mounting stage 41 includes a temperature control unit (e.g., a heater, etc.). The transport unit 10 presses an electronic component CP onto the substrate BD on the mounting unit 40, and an electrode formation surface CPa of the electronic component CP is soldered to a mounting surface BDa of the substrate BD. In other words, the holding tool 13 corresponds to a bonding tool that mounts the electronic component CP onto the substrate BD in the flip chip bonding method.

[0060] Next, a flux transfer method using the flux transfer device 1 according to the first embodiment will be described with reference to Figs. 3 to 6. Fig. 3 is a flow chart that outlines the flux transfer method using the flux transfer device according to the first embodiment. Fig. 4 is a diagram that outlines the state of step S20. Fig. 5 is a diagram that shows an example of a captured image of the electrode formation surface and a sub-area. Fig. 6 is a diagram that shows another example of a captured image of the electrode formation surface and a sub-area.

[0061] First, flux FX is stored on the transfer stage 21 (S10). The flux FX is applied to the transfer surface 21a of the transfer stage 21 with a first squeegee. At this time, the inside of the immersion area 23 is filled with the flux FX. Next, excess flux FX provided outside the immersion area 23 is removed with a second squeegee.

[0062] Next, the electrode formation surface CPa is immersed in the flux FX (S20). The electronic component CP held by the holding tool 13 is pressed against the flux FX to immerse the electrode formation surface CPa in the flux FX. Next, the electronic component CP is lifted up from the immersion area 23. The flux FX is transferred to the electrode formation surface CPa, and the shape of the electrode formation surface CPa is transferred to the flux FX on the transfer stage 21 as if embossed.

[0063] As shown in FIG. 4, when the holding tool 13 is inclined at an angle θ with respect to the transfer stage 21, the electrode formation surface CPa of the electronic component CP has an area where the flux FX is transferred and an area where the flux FX is not transferred.

[0064] Next, the electrode formation surface CPa after the flux transfer is imaged (S30). The transport unit 10 is moved from above the transfer unit 20 to above the attitude control unit 30. Light is irradiated from the illumination 33 onto the electrode formation surface CPa of the electronic component CP held by the holding tool 13. The illuminated electrode formation surface CPa is imaged by the imaging unit 31 to obtain an image of the electrode formation surface CPa on which the flux FX has been transferred to at least a portion thereof.

[0065] Position information of the bump electrodes, etc. may be obtained from the captured image of the electrode formation surface CPa obtained in step S30. The position information of the bump electrodes, etc. obtained here may be used to align the electronic component CP when mounting it on the substrate BD.

[0066] Next, the captured image of the sub-area is compared with the reference image (S40). An image of an arbitrary sub-area is acquired from the captured images acquired in step S30. A reference image of the sub-area is acquired from a reference image (the electrode formation surface of the electronic component after the flux has been transferred normally) registered in advance. The captured image of each sub-area is compared with the reference image to detect the amount and position of the flux FX transferred in the sub-area.

[0067] In the example shown in FIG. 5, captured images of sub-areas R1a and R1b are acquired from a captured image of the entire electrode formation surface CPa. The sub-area R1a is a corner sub-area provided at each of the four corners of the electrode formation surface CPa. The sub-area R1b is a strip-shaped sub-area provided along the long side of the electrode formation surface CPa over substantially the entire width in the short side direction. For example, by determining whether the flux FX has been transferred in each of the sub-areas R1a, which are corner sub-areas, the tilt direction of the holding tool 13 with respect to the transfer stage 21 can be detected. In addition, by determining the position of the end of the area where the flux FX has been transferred in the sub-area R1b, which is a strip-shaped sub-area, the tilt angle θ of the holding tool 13 with respect to the transfer stage 21 can be calculated. Specifically, when the depth of the immersed area 23 is Y and the length of the area where the flux FX has been transferred is X, the angle θ can be calculated by the following formula. sinθ=Y / X

[0068] The comparison of the captured image in the corner sub-area with the reference image may be performed simultaneously with the comparison of the captured image in the strip sub-area with the reference image, or may be performed before or after the comparison. Specifically, the captured image in the corner sub-area may be compared with the reference image to detect whether or not the holding tool 13 is inclined with respect to the transfer stage 21, and then it may be determined whether or not to acquire the strip sub-area. For example, if the comparison of the captured image in the corner sub-area with the reference image does not detect an inclination exceeding the allowable range, the acquisition of the strip sub-area may be omitted, and if an inclination exceeding the allowable range is detected, a strip sub-area having a longitudinal direction in a direction suitable for calculating the angle θ may be acquired. Also, the acquisition of the corner sub-area may be omitted, and the presence or absence, direction, angle, etc. of the inclination of the holding tool 13 with respect to the transfer stage 21 may be detected by comparing the captured image in the strip sub-area with the reference image.

[0069] As in the example shown in FIG. 6, a plurality of sub-areas R2 arranged in a matrix may be acquired from a captured image of the entire electrode formation surface CPa.

[0070] Next, it is determined whether the inclination exceeds the allowable range (S50).

[0071] If it is determined in step S50 that the inclination exceeds the allowable range, the attitude of the holding tool 13 is controlled (S60). In other words, if a transfer failure of the flux FX to the electrode formation surface CPa is detected, the control unit 37 controls the inclination adjustment mechanism 15 of the transport unit 10 based on the inclination of the holding surface 13a relative to the transfer stage 21 detected by the detection unit 35. For example, the control unit 37 may automatically control the inclination adjustment mechanism 15 of the transport unit 10. Furthermore, the control unit 37 may display on a display the direction and magnitude of the inclination of the holding surface 13a relative to the transfer stage 21 detected by the detection unit 35, and control the inclination adjustment mechanism 15 of the transport unit 10 based on a manually input control parameter.

[0072] After the inclination of the holding surface 13a with respect to the transfer stage 21 is adjusted to approximately zero by the inclination adjustment mechanism 15, the electronic component CP is transported to the transfer unit 20, and the electrode formation surface CPa is again immersed in the flux FX stored in the transfer stage 21. At this time, the flux FX is newly stored, but the flux FX stored initially may be reused.

[0073] The operation of the flux transfer device 1 after the inclination of the holding surface 13a with respect to the transfer stage 21 is adjusted to approximately zero by the inclination adjustment mechanism 15 is not limited to the above. The electronic component CP may be transported to a recovery tray and released from the holding tool 13, and the flux transfer may be resumed with another electronic component.

[0074] If it is determined in step S50 that the tilt does not exceed the allowable range, the electronic component CP is mounted on the board BD (S70). In other words, if the flux FX has been transferred substantially uniformly to the electrode formation surface CPa, the transport unit 10 transports the electronic component CP above the mounting unit 40 and presses the electronic component CP against the board BD. The board BD is heated, and the electronic component CP is soldered to the board BD.

[0075] As described above, the flux transfer device 1 has an imaging unit 31 that acquires an image of the electrode forming surface CPa of the electronic component CP after flux transfer, and is equipped with a detection unit 35 that detects the inclination of the holding surface 13a relative to the transfer stage 21 based on the image of the electrode forming surface CPa.

[0076] This makes it possible to suppress transfer defects of the flux FX by, for example, repeating prototyping so that the inclination of the holding surface 13a with respect to the transfer stage 21 becomes approximately zero. In particular, when the electronic component CP is large, that is, when the inclination of the holding surface 13a with respect to the transfer stage 21 significantly affects transfer defects of the flux FX at the end of the electrode formation surface CPa, transfer defects can be effectively suppressed.

[0077] The flux transfer device 1 includes an inclination adjustment mechanism 15 that is configured to be able to adjust the attitude of the holding tool 13. This makes it possible to suppress fluctuations in the liquid surface of the flux FX caused by changing the attitude of the transfer stage 21. Therefore, it is possible to suppress the occurrence of transfer defects caused by changing the attitude of the transfer stage 21.

[0078] The imaging unit 31 captures an image of the electrode formation surface CPa of the electronic component CP after the flux transfer from below. This makes it possible to detect not only the inclination of the holding surface 13a with respect to the transfer stage 21 but also the positional deviation of the electronic component CP in the in-plane direction of the electrode formation surface CPa based on the captured image acquired by the imaging unit 31. Therefore, it is possible to correct the positional deviation of the electronic component CP with respect to the board BD.

[0079] The detection unit 35 compares the captured image with a reference image obtained from the electrode formation surface of the electronic component after the flux has been normally transferred. With this, even if the flux has low visibility and is difficult to detect by image analysis, it can be detected with high accuracy by image analysis of the difference between the captured image and the reference image.

[0080] The detection unit 35 compares the captured image with the reference image in at least one sub-area. This can reduce the time required for detection compared to the case where the captured image of the entire electrode formation surface CPa is compared with the reference image.

[0081] The corner sub-areas are included in the sub-areas acquired by the detection unit 35. This makes it possible to quickly evaluate transfer defects of the flux FX over the entire electrode formation surface CPa by determining whether the transfer of the flux FX has been successful in the corner sub-area that is most displaced when the inclination of the holding tool 13 with respect to the transfer stage 21 changes.

[0082] The sub-areas acquired by the detection unit 35 include band-shaped sub-areas. This makes it possible to calculate the angle of inclination of the holding surface 13a with respect to the transfer stage 21 by identifying the position of the transfer failure in the band-shaped sub-area.

[0083] By using the above-described flux transfer device 1 to transfer the flux FX to the electrode formation surface CPa of the electronic component CP, transfer defects of the flux FX can be suppressed.

[0084] After the detector 35 detects the inclination of the holding surface 13a relative to the transfer stage 21, the electrode formation surface CPa of the electronic component CP is again immersed in the flux FX stored in the transfer stage 21. This makes it possible to reuse electronic components CP for which the flux FX has not been sufficiently transferred, thereby reducing loss of electronic components CP.

[0085] After the detector 35 detects the inclination of the holding surface 13a relative to the transfer stage 21, the electronic component CP may be released without being mounted on the board BD.

[0086] Other embodiments will be described below. Note that the same or similar components as those shown in Figures 1 to 6 are denoted by the same or similar reference numerals, and the description thereof will be omitted as appropriate. Also, similar effects due to similar components will not be mentioned one by one.

[0087] <Second embodiment> Next, the structure of the flux transfer device 2 according to the second embodiment will be described with reference to Fig. 7. Fig. 7 is a diagram showing a schematic configuration of a posture control unit according to the second embodiment.

[0088] In the second embodiment, the transfer unit 20 further includes an inclination adjustment mechanism 25.

[0089] The tilt adjustment mechanism 25 is configured to be able to adjust the attitude of the transfer stage 21. The tilt adjustment mechanism 25 sets the attitude of the transfer stage 21 with respect to the holding tool 13, for example, so that the surface of the flux FX stored in the transfer stage 21 and the electrode formation surface CPa of the electronic component CP are approximately parallel. The "attitude of the transfer stage 21 with respect to the holding tool 13" is defined as, for example, "the inclination of the transfer surface 21a of the transfer stage 21 with respect to the holding surface 13a of the holding tool 13." The tilt adjustment mechanism 25 corresponds to an example of a "second adjustment unit" according to the present invention.

[0090] The attitude control unit 30 detects the inclination of the holding surface 13a relative to the transfer stage 21, and the control unit 37 controls the inclination adjustment mechanism 25 of the transfer unit 20 so that the inclination becomes approximately zero. The inclination adjustment mechanism 15 of the transport unit 10 is set so that the inclination of the holding surface 13a relative to the mounting stage 41 becomes approximately zero. This makes it possible to adjust the inclination of the holding tool 13 relative to the transfer stage 21 without adjusting the attitude of the holding tool 13. Therefore, it is possible to suppress the occurrence of inclination of the electronic component CP relative to the board BD due to a displacement error when adjusting the attitude of the holding tool 13.

[0091] The control unit 37 of the posture control unit 30 may control both the inclination adjustment mechanism 15 of the transport unit 10 and the inclination adjustment mechanism 25 of the transfer unit 20.

[0092] <Third embodiment> Next, the structure of the flux transfer device 3 according to the third embodiment will be described with reference to Fig. 8. Fig. 8 is a diagram showing a schematic configuration of a posture control unit according to the third embodiment.

[0093] In the third embodiment, the posture control unit 330 includes an illumination 333 and an imaging unit 331 provided above the transfer stage 21. The illumination 333 irradiates the transfer stage 21 with light after the flux transfer, and the imaging unit 331 images the surface of the flux FX on the transfer stage 21 after the flux transfer. The detection unit 35 compares the captured image acquired by the imaging unit 331 with a reference image of the surface of the flux FX on the transfer stage 21 after the flux FX has been properly transferred. Since the flux FX on the transfer stage 21 after the flux transfer has unevenness formed thereon according to the shape of the electrode formation surface CPa of the electronic component CP, the transfer status of the flux FX to the electrode formation surface CPa can be detected by acquiring a captured image of the flux FX on the transfer stage 21 and performing image analysis. The control unit 37 may control the inclination adjustment mechanism 25 of the transfer unit 20 or the inclination adjustment mechanism 15 of the transport unit 10.

[0094] As described above, according to one aspect of the present invention, it is possible to provide a flux transfer device, a flux transfer method, and a mounting device capable of suppressing transfer defects.

[0095] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those illustrated, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0096] 1...Flux transfer device, 10...Transport unit, 11...Bonding head, 13…Holding tool, 15...Tilt adjustment mechanism, 17...actuator, 20...transcription unit, 21...transcription stage, 23…soaking area, 25...Tilt adjustment mechanism, 30...attitude control unit, 31...imaging unit, 33…Lighting, 35...detection unit, 37...Control section, 40…Mounting unit, 41…Implementation stage, FX…Flux, CP...Electronic parts, PCa…electrode formation surface, BD...circuit board.

Claims

1. A flux transfer device that transfers flux to an electrode formation surface of an electronic component, comprising: a transfer stage for storing the flux; a holding tool that holds the electronic component with a holding surface so that the electrode formation surface of the electronic component is immersed in the flux stored in the transfer stage; an imaging unit for acquiring an image of the electrode formation surface of the electronic component after flux transfer; a detection unit that compares the captured image with a reference state of a flux application state and detects a transfer state of the flux transferred to the electronic component, thereby calculating an inclination of the holding surface with respect to the transfer stage; Equipped with Flux transfer device.

2. Further comprising a first adjustment unit configured to adjust the attitude of the holding tool based on the inclination. The flux transfer device according to claim 1 .

3. a second adjustment unit configured to adjust the attitude of the transfer stage based on the inclination, The flux transfer device according to claim 1 or 2.

4. the imaging unit images the electrode formation surface of the electronic component from below after flux transfer; The flux transfer device according to claim 1 .

5. the detection unit compares the captured image with a reference state of the flux application state indicated by a reference image acquired from an electrode formation surface of an electronic component after the flux has been normally transferred; The flux transfer device according to claim 3 .

6. The detection unit obtains an image of at least one sub-area from the captured image and compares the image of the at least one sub-area with a reference image. The flux transfer device according to claim 5 .

7. The at least one sub-area includes a corner sub-area provided at a corner of the electrode formation surface. The flux transfer device according to claim 6.

8. The at least one sub-area includes a strip-shaped sub-area extending along a long side or a short side of the electrode forming surface. The flux transfer device according to claim 6 or 7.

9. The holding tool is a bonding tool that mounts the electronic component on an object. The flux transfer device according to any one of claims 1 to 8.

10. A flux transfer method for transferring flux to an electrode formation surface of an electronic component, comprising the steps of: storing flux on a transfer stage; holding the electronic component on a holding surface of a holding tool; immersing the electrode formation surface of the electronic component in flux stored in the transfer stage; acquiring an image of the electrode formation surface of the electronic component after flux transfer; comparing the captured image with a reference state of the flux application state to detect a transfer state of the flux transferred to the electronic component, thereby calculating an inclination of the holding surface with respect to the transfer stage; Including, Flux transfer method.

11. further comprising adjusting an attitude of the transfer stage or the holding tool based on the tilt. The flux transfer method according to claim 10.

12. and releasing the electronic component without mounting it on an object, and immersing an electrode formation surface of another electronic component in the flux stored in the transfer stage. The flux transfer method according to claim 11.

13. The method further includes immersing the electronic component again in the flux stored in the transfer stage. The flux transfer method according to claim 11.

14. A mounting apparatus that mounts an electronic component having an electrode formed surface onto an object, the apparatus comprising: a transfer stage for storing the flux; a mounting tool that holds the electronic component on a holding surface so that the electrode formation surface of the electronic component is immersed in the flux stored on the transfer stage, and mounts the electronic component on the object; an imaging unit for acquiring an image of the electrode formation surface of the electronic component after flux transfer; a detection unit that compares the captured image with a reference state of a flux application state and detects a transfer state of the flux transferred to the electronic component, thereby calculating an inclination of the holding surface with respect to the transfer stage; Equipped with Mounting equipment.

Images