Electronic equipment cases, electronic equipment and composites

Abstract

To provide an electronic device case that combines a frame and a back case made of different materials by a sealing layer, having a high binding effect, good appearance effect, weak signal shielding effect, high mechanical properties, wide range of application, and long service life, and satisfies consumers' consumption experience, an electronic device, and a complex.SOLUTION: An electronic device case includes a frame 10, a sealing layer 200 that is provided on the outer surface of at least a portion of the frame and includes a plurality of sub-sealing layers 210 and 220 that are stacked in order, and a rear case 20 connected to the frame by the sealing layer, and the two adjacent sub-sealing layers have different components.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] (Priority information) This application claims priority to and the benefit of Chinese Patent Application No. 201811161748.4, filed with the State Intellectual Property Office of the People's Republic of China on September 30, 2018, the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the technical field of electronic devices, and more particularly to electronic device cases, electronic devices, and composite devices. [Background technology]

[0003] In recent years, with the popularization of 5G and wireless charging technology, the requirements for electronic device signals are becoming higher and higher. Currently, electronic device cases such as mobile phone cases are often made of metal materials, which have a strong shielding effect on electromagnetic signals, so signals cannot effectively penetrate the electronic device case, and the current electronic device case cannot meet the consumer experience.

[0004] Therefore, there remains a need to improve upon current electronic device cases. Summary of the Invention

[0005] The present application provides an electronic device case, in which a frame and a back case made of different materials are bonded together by a sealing layer, and the electronic device case has a high bonding effect, a good appearance effect, a low shielding effect on signals, high mechanical properties, a wide range of applications, or a long service life, thereby satisfying consumer experience.

[0006] In one aspect of the present application, the present application provides an electronic device case. According to an embodiment of the present application, the electronic device case includes a frame, a sealing layer provided on at least a part of the outer surface of the frame, the sealing layer including a plurality of sub-sealing layers arranged in order, and a rear case connected to the frame by the sealing layer, and the components of the two adjacent sub-sealing layers are different. The inventors have found that the electronic device case has a strong bond between the rear case and the frame, high mechanical properties, and a beautiful appearance effect, and by adopting different components for each sub-sealing layer, the frame and the rear case, which are made of different materials and have a large difference in thermal expansion coefficient, can be firmly bonded by the sealing layer, the difference in thermal expansion coefficient between the structures of the two adjacent layers is small, the consistency is higher, the possibility of failure caused by temperature change is significantly reduced, the service life is long, and the signal use requirements are well met, the problem of signal shielding is avoided, and the increasing aesthetic requirements of users are not only met, but also the use performance is good and the user experience is improved.

[0007] In another aspect of the present application, the present application provides an electronic device. According to an embodiment of the present application, the electronic device includes the above-mentioned electronic device case. The inventors have found that the electronic device has a simple structure, is easy to implement, can implement 5G and wireless charging functions, has a strong ability to transmit and receive signals, has a long service life, and has all the characteristics and advantages of the above-mentioned electronic device case, and has strong market competitiveness.

[0008] The present application provides a composite. According to an embodiment of the present application, the composite includes a first member, a sealing layer provided on at least a part of the outer surface of the first member, the sealing layer including a plurality of sub-sealing layers arranged in a stacked order, and the components of two adjacent sub-sealing layers are different, and a second member connected to the first member by the sealing layer. The inventor has found that in the composite, It has been found that the bonding strength between the first and second components is strong, and by using different components for each sub-encapsulating layer, the first and second components, which are made of different materials and have a large difference in thermal expansion coefficient, can be firmly bonded to the encapsulating layer, the difference in thermal expansion coefficient between the two adjacent layer structures is small, the compatibility is higher, the possibility of composite failure due to temperature changes is greatly reduced, and a composite with ideal mechanical properties, long service life, good appearance effect, high strength, weak shielding effect against signals, and high usability can be obtained, which is suitable for manufacturing electronic device cases. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram of an electronic device case according to an embodiment of the present application. [Diagram 2] FIG. 1 is a schematic diagram illustrating the configuration of an electronic device according to an embodiment of the present application. [Diagram 3] FIG. 13 is a schematic diagram of an electronic device case according to another embodiment of the present application. [Figure 4] 1 is a schematic diagram of an electronic device case according to some embodiments of the present application. [Diagram 5] FIG. 1 is a schematic diagram of a composite according to one embodiment of the present application. [Figure 6] FIG. 2 is a schematic diagram of a composite according to another embodiment of the present application. [Figure 7] 1 is a flow chart of a method for producing a composite in one embodiment of the present application. [Figure 8] FIG. 13 is a schematic diagram of the measurement of the bonding strength between the frame and the rear case in an embodiment of the present application. [Figure 9] 1 is a scanning electron microscope photograph of a cross section of an encapsulating layer in one embodiment of the present application. [Figure 10] 1 is a scanning electron microscope line scan spectrum of a sub-sealing layer containing borosilicate glass powder in one embodiment of the present application. [Figure 11] 1 is a scanning electron microscope line scan spectrum of a sub-sealing layer containing phosphate glass powder in one embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The following examples of the present application are described in detail. The following examples are illustrative and are merely for the purpose of interpreting the present application, and should not be understood as limiting the present application. If no specific techniques or conditions are specified in the examples, they are carried out according to the techniques, conditions or product instructions described in the literature in this field. If no manufacturer is specified, the reagents or equipment used are all common products that are commercially available.

[0011] The present application has been completed based on the following recognition and findings of the inventors.

[0012] Currently, electronic device cases, such as mobile phone cases, are often manufactured by using an all-metal member to process it, injection molding an inorganic member (e.g., glass or ceramic) on the metal member, and dispensing an adhesive between the TP and the frame to bond the metal member and the inorganic member (e.g., glass or ceramic), so that the strength of the manufactured electronic device case is not high, the bonding force between the metal member and the inorganic member is not strong, it is easy to break, and the service life is short. In response to the above technical problem, the inventor has conducted extensive research and found that in order to improve the bonding force between the metal member and the inorganic member, the sealing layer between the metal member and the inorganic member can be made into a multi-layer structure, and each sub-sealing layer can adopt different components to adjust the difference in thermal expansion coefficient between the adjacent two-layer structure, so that the degree of matching between the adjacent two-layer structure is higher, the probability of breakage is greatly reduced, and the bonding force is further improved, and the metal member is first pretreated to obtain a bonding promotion layer on its surface, which strengthens the bonding force between the bonding promotion layer and the sealing layer, and further has a strong bonding force between the metal member and the inorganic member.

[0013] In view of this, in one aspect of the present application, the present application provides an electronic device case. According to an embodiment of the present application, referring to FIG. 1 (FIG. 1 corresponds to a cross-sectional view taken along line A-A' in FIG. 2) and FIG. For reference, the electronic device case includes a frame 10, a sealing layer 200 provided on at least a portion of the outer surface of the frame 10 and including a plurality of sub-sealing layers (two sub-sealing layers 210 and 220 are illustrated as an example in FIG. 1 ) stacked in sequence, with two adjacent sub-sealing layers having different components, and a rear case 20 connected to the frame 10 by the sealing layer 200. The inventors have found that in this electronic device case, the bond between the rear case and the frame is strong, the mechanical properties are excellent, and the appearance effect is beautiful; by using different components for the sub-encapsulating layer, the thermal expansion coefficient of the sub-encapsulating layer and its affinity with the rear case and the frame can be flexibly adjusted; furthermore, the frame and the rear case, which are made of different materials and have a large difference in thermal expansion coefficient, can be firmly bonded by the encapsulating layer, the difference in thermal expansion coefficient between the two adjacent layer structures is small, the compatibility is higher, the possibility of defects caused by temperature changes is significantly reduced, the bonding strength is high, the service life is long, and the signal use requirements are well met, the signal shielding problems are avoided, and not only can the increasing aesthetic requirements of users be met, but also the use performance is good and the user experience is improved.

[0014] In addition, the description method "two adjacent layers" used in this specification refers to any two adjacent layers of an electronic device case or a composite described later, including, but not limited to, a frame and a sub-sealing layer adjacent thereto, two adjacent sub-sealing layers, a back case and a sub-sealing layer adjacent thereto. "The components of the two adjacent sub-sealing layers are different" refers to the components contained in the two adjacent sub-sealing layers being different and / or the contents of each component being different. "The difference in thermal expansion coefficient between the two adjacent layers is within ±10%" refers to the difference in thermal expansion coefficient between the two adjacent layers divided by the larger value of the thermal expansion coefficient of the two adjacent layers being 10% or less. Specifically, referring to FIG. 1, the frame 10 and the sub-sealing layer 220 are two adjacent layers, and the difference in thermal expansion coefficient between them is equal to (thermal expansion coefficient of the frame 10-thermal expansion coefficient of the sub-sealing layer 220) / the larger value of the thermal expansion coefficient of the frame 10 and the sub-sealing layer 220. "Arrangement direction of the frame, sealing layer, and rear case" refers to the direction in which the frame, sealing layer, and rear case are arranged (or stacked), and specifically, may refer to the direction indicated by the arrow in Figure 1, and other similar descriptions have similar meanings.

[0015] According to the embodiment of the present application, in order to obtain a better matching of thermal expansion coefficients between different layers of the electronic device case, the thermal expansion coefficient of the sealing layer 200 is between the thermal expansion coefficients of the frame 10 and the rear case 20, and the difference in thermal expansion coefficient between two adjacent layers of the frame 10, the plurality of sub-sealing layers, and the rear case 20 is within ±10%. As a result, the matching of thermal expansion coefficients of the structures of each layer is higher, and the bonding strength between the frame and the rear case is stronger. In some embodiments of the present application, the gradient of the thermal expansion coefficients of the plurality of sub-sealing layers increases or decreases in the arrangement direction of the frame 10, the sealing layer 200, and the rear case 20 (see the direction indicated by the arrow in FIG. 1). As a result, the thermal expansion coefficients of the structures of each layer change gradually, the matching is higher, and the bonding strength between the frame and the rear case is stronger, which effectively alleviates the problem of the thermal expansion coefficients not matching between the rear case and the frame, and effectively improves various defects and defects caused by thermal vibration, which improves the mechanical properties of the electronic device case, and significantly reduces the probability of breakage. Specifically, when the thermal expansion coefficient of the frame is larger than that of the rear case, the thermal expansion coefficients of the sub-sealing layers have a decreasing gradient in the above direction. When the thermal expansion coefficient of the frame is smaller than that of the rear case, the thermal expansion coefficients of the sub-sealing layers have a increasing gradient in the above direction. This allows the thermal expansion coefficients to be gradually increased or decreased in the direction from the frame to the rear case, thereby significantly improving various problems caused by thermal expansion.

[0016] According to an embodiment of the present application, the frame is a metal frame, and the rear case is an inorganic rear case. Referring to FIG. 3, between the metal frame 10 and the sealing layer 200, Further, a bond-promoting layer 30 is provided. This obviously promotes the bonding between the metal frame and the inorganic rear case, strengthens the bonding force, and realizes seamless stepless bonding, so that the mechanical properties of the case are high and the appearance is beautiful. According to the embodiment of the present application, in order to further improve the bonding force between the metal frame and the inorganic rear case, the bond-promoting layer satisfies at least one of the following conditions: the bond-promoting layer and the sealing layer are similar and soluble to each other; the surface of the bond-promoting layer that is away from the metal frame has a concave-convex structure; and the bond-promoting layer has a porous structure. Thus, the similarity and mutual solubility enhances the wettability between the bond-promoting layer and the sealing layer, and the concave-convex structure effectively increases the bonding force between the bond-promoting layer and the sealing layer, and the porous structure allows a part of the sealing layer to be filled in the porous structure, which further increases the bonding force between the bond-promoting layer and the sealing layer, so that the bond strength of the obtained case is higher and the usage performance is better.

[0017] According to the embodiment of the present application, the material forming the metal frame includes aluminum alloy or stainless steel, which provides a wide supply source of the material, low price, high strength, and high performance. In some embodiments of the present application, the stainless steel may be at least one selected from SUS301 stainless steel, SUS304 stainless steel, and SUS316L stainless steel, or at least one selected from stainless steels such as S30110, S30408, and S31603 in GB / T 20878-2007 Stainless Steel and Heat-Resistant Steel Symbols and Chemical Composition. The aluminum alloy may be selected from 5052 aluminum alloy, 5182 aluminum alloy, 6063 aluminum alloy, 6061 aluminum alloy, 6013 aluminum alloy, and 7-series aluminum with a zinc content in the range of 1% to 10%, etc.

[0018] According to an embodiment of the present application, the bonding promotion layer is M or MxO nIn this case, M is at least one selected from Al, Ti, Ni, and Mo, x is 1, 2, or 3, and n is an integer of 1 to 6. Specifically, in some embodiments, the bond-promoting layer may be a metal layer, specifically an Al layer, a Ti layer, a Ni layer, or a Mo layer. In other embodiments, the bond-promoting layer may be a metal oxide layer, specifically an iron oxide, an aluminum oxide, a titanium oxide, a nickel oxide, or a molybdenum oxide. This helps to obtain an electronic device case with a strong bond between the bond-promoting layer and the metal frame, which is not easily removed, and has a higher wettability between the bond-promoting layer and the sealing layer, which has a strong bond, and a high bonding effect. In addition, the bond-promoting layer and the sealing layer are similar in composition and soluble in each other, and can be more easily melted and bonded, and can also form a concave-convex structure and a porous structure, which can further improve the bond strength and the use performance of the case. As can be understood by those skilled in the art, the specific components of the bond-promoting layer may be related to the material of the metal frame, and may, for example, include oxides of the corresponding metals forming the metal frame; for example, if the metal frame is an aluminum alloy, the bond-promoting layer may contain aluminum oxide and oxides of alloying elements in the aluminum alloy.

[0019] According to the embodiment of the present application, the thickness of the bonding promotion layer is 1 to 10 μm, for example, the thickness of the bonding promotion layer may be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. This allows the bonding promotion layer to have a suitable thickness, have a beautiful appearance, firmly bond the metal frame and the sealing layer, and the bonding promotion layer does not obviously expand under the influence of temperature, which is helpful in extending the service life of the electronic device case. With respect to the above thickness range, if the thickness of the bonding promotion layer is too thin, the degree of pretreatment is relatively insufficient, and the properties of the bonding promotion layer are close to the bonding with the metal frame, and the bonding with the inorganic rear case (e.g., glass or ceramic) is relatively insufficient, the wettability is relatively low, and the bonding force with the inorganic rear case is relatively insufficient; if the thickness of the bonding promotion layer is too thick, the pretreatment is relatively excessive, and the properties of the bonding promotion layer are close to the bonding with the inorganic rear case, The bonding strength with the metal frame is relatively insufficient, and the entire resin is easily dissolved into the inorganic rear case during sealing, and the bonding strength with the metal frame is relatively insufficient.

[0020] In some embodiments of the present application, in order to improve the aesthetics of the frame, the frame may be subjected to a decorative treatment, for example, by at least one of polishing, sandblasting, hairline finishing, physical vapor deposition (PVD) plating, laser engraving, spraying, anti-fingerprint coating (AF Coating), etc., to obtain a frame with a high decorative effect, and further improve the aesthetics and practicality of the frame.

[0021] According to an embodiment of the present application, the material forming the inorganic back case includes glass or ceramic, etc., which has a wide material supply source, high strength, little signal shielding, and is helpful for realizing 5G and wireless charging functions. In some embodiments of the present application, the material forming the inorganic back case is at least one selected from chemically and physically strengthened high aluminum glass, ZrO2(3Y) ceramic with phase transition strengthening characteristics, and ZrO2(3Y)-Al2O3 ceramic with phase change transition characteristics. According to an embodiment of the present application, the material forming the glass back case includes chemically and physically strengthened high aluminum glass, which makes the inorganic back case stronger in strength, better meets the usage demands, has a longer service life, and has a higher signal transmittance.

[0022] In some embodiments of the present application, the rear case can be decorated to improve the aesthetics of the rear case, for example, by glazing, laser engraving, PVD coating, AF coating, etc. The rear case can be processed by at least one of coating, hairline finishing, polishing, etc. to obtain a rear case with a high decorative effect, and further improve the aesthetics and practicality of the rear case.

[0023] According to the embodiment of the present application, the shape of the rear case may be two-dimensional, 2.5-dimensional, or three-dimensional, etc., which makes the appearance of the rear case beautiful.

[0024] According to some embodiments of the present application, the frame is a ceramic frame, and the rear case is a glass rear case. Specifically, the material forming the ceramic frame is at least one selected from ZrO2(3Y) ceramics having phase transition strengthening properties, ZrO2(3Y)-Al2O3 ceramics having phase transition strengthening properties, and the material forming the glass rear case is selected from chemically and physically strengthened high aluminum glass, etc., which can better meet the usage demands, have a beautiful appearance, a longer service life, and a high signal transmittance.

[0025] According to the embodiment of the present application, the materials forming the sub-sealing layers each independently include glass powder and adhesive, and the glass powder in the two adjacent sub-sealing layers is different. For example, when the sealing layer includes two sub-sealing layers, one sub-sealing layer may be borosilicate oxide-based glass powder and another sub-sealing layer may be phosphate oxide-based glass powder, one sub-sealing layer may be sulfide-based glass powder and another sub-sealing layer may be borosilicate oxide-based glass powder, one sub-sealing layer may be halide-based glass powder and another sub-sealing layer may be borosilicate oxide-based glass powder, or one sub-sealing layer may be borate-based glass powder and another sub-sealing layer may be silicate oxide-based glass powder. In some other embodiments, the two sub-sealing layers may both be made of the same type of glass powder (e.g., both are borosilicate oxide-based glass powders), but the components and / or contents of the glass powders may be different; specifically, the types of oxides and / or other substances in the borosilicate oxide-based glass powder may be the same, but the contents of various oxides and / or other substances may be different, and the types of oxides and / or other substances in the borosilicate oxide-based glass powder may be different. In this way, the sealing layer firmly bonds the frame and the rear case, and each sub-sealing layer may be formed of a glass powder having a different thickness. By adjusting the components of the layers, the thermal expansion coefficient matching and affinity between the structures of each layer can be improved, resulting in an electronic device case with high performance and long service life. Furthermore, the multilayer structure of multiple sub-encapsulating layers can be easily observed by line scanning with a scanning electron microscope (SEM).

[0026] According to an embodiment of the present application, in order to further improve the bonding strength between the frame and the rear case, in the material forming the sub-sealing layer, the mass ratio of the glass powder to the adhesive is 88-92:8-12. Thus, the components are within the above content ranges, the bonding strength between the frame and the rear case is higher, which is more helpful in realizing the integration between the frame and the rear case, and further, the seamless stepless bonding between the frame and the rear case is realized, so that the appearance of the electronic device case is more beautiful and neat, and the components of the sealing layer within the above ranges are more helpful in realizing the matching of the expansion coefficient between it and the frame and the rear case.

[0027] According to an embodiment of the present application, in the process of manufacturing the sub-sealing layer, a glass powder, an adhesive, and a solvent may be mixed to prepare a sealing slurry, and then the sub-sealing layer may be formed using the sealing slurry. There are no particular limitations on the specific amount of the solvent used, and those skilled in the art may determine an appropriate amount of the solvent used based on the fluidity of the sealing slurry that forms the sub-sealing layer.

[0028] According to the embodiment of the present application, the glass powder does not contain lead, which makes the glass powder harmless to the human body, environmentally friendly, and favorable to consumers.

[0029] According to an embodiment of the present application, the glass powder includes at least one of silicate oxide-based (such as high silica glass, soda lime glass, aluminosilicate glass, borosilicate glass), phosphate-based, borate-based glass powder, sulfide-based glass powder, and halide-based glass powder, which provides a wide supply source of glass powder, strong adhesion, suitable expansion coefficient, and high performance.

[0030] According to the embodiment of the present application, when the rear case is a glass rear case, in order to obtain an electronic device case with higher performance and flatter and more beautiful appearance, the glass powder in the sealing layer is a low melting point glass powder, specifically, the temperature at which the glass powder completely melts is lower than the softening point of the glass rear case, so that when the frame and the rear case are sealed, the temperature has not yet reached the softening point of the glass rear case, and the glass rear case does not soften and deform, so that the flatness, appearance and optical performance of the electronic device are not affected, and no defects or defects caused by too high temperature occur.

[0031] According to the embodiment of the present application, when the frame is a metal frame, the glass powder and the above-mentioned bonding promotion layer are similar and soluble to each other, and the specific components of the bonding promotion layer and the sealing layer can be adjusted as necessary to improve the bonding strength. In some specific embodiments of the present application, the bonding promotion layer is a metal oxide layer (i.e., M x O n where M is at least one of Fe, Al, Ti, Ni and Mo, x is 1, 2 or 3, and n is an integer of 1 to 6) or metal layer (i.e. M, where M is at least one of Al, Ti, Ni and Mo), and the corresponding glass powder may be at least one selected from silicate oxide-based (e.g., high silica glass, soda lime glass, aluminosilicate glass, borosilicate glass), phosphate-based, borate-based glass powder, sulfide-based glass powder and halide-based glass powder. This makes the sealing layer and the bond-promoting layer similar and soluble to each other, which is conducive to good interdiffusion and penetration between the sealing layer and the bond-promoting layer, making the bond between them more dense, and further conducive to improving the bond strength between the sealing layer and the bond-promoting layer.

[0032] According to an embodiment of the present application, the adhesive comprises at least one of silicate-based inorganic adhesive (such as, but not limited to, water glass, etc.) and water-based polyurethane, which makes the adhesive have a strong adhesive effect, can effectively prepare the glass powder into a sealing slurry, and is helpful in applying the sealing slurry to the surface of the bond-promoting layer.

[0033] According to an embodiment of the present application, the solvent includes at least one of ethanol and water, so that the adhesive and glass powder can be uniformly dispersed in the solvent, and the bonding between the sealing layer, the bonding promotion layer and the rear case can be strengthened.

[0034] The electronic device case according to the embodiment of the present application can effectively bond the rear case and the frame, which are made of different materials and have a large difference in thermal expansion coefficient, by passing through multiple sub-sealing layers with different components, and the case has excellent bonding strength and can realize various complex shapes and structures. Specifically, referring to FIG. 4 (sealing layers are not shown), the connection position between the frame 10 and the rear case 20 in the electronic device case can be an inner right angle structure (a in FIG. 4), an inner step structure (b in FIG. 4), an outer curved surface structure (c in FIG. 4), or a curved surface structure with an inner surface protruding outward (f in FIG. 4), and the inner surface of the frame can be a structure gradually inwardly inclined (d in FIG. 4), a structure gradually outwardly inclined (e in FIG. 4), or a curved surface structure protruding inward (g in FIG. 4). This can realize various complex shapes to facilitate assembly with internal elements or to realize special lighting effects.

[0035] In another aspect of the present application, the present application provides an electronic device. According to an embodiment of the present application, the electronic device includes the above-mentioned composite or the above-mentioned electronic device case. The inventors have found that the electronic device has a simple structure, is easy to implement, can implement 5G and wireless charging functions, has a strong ability to transmit and receive signals, has a long service life, and has all the characteristics and advantages of the above-mentioned composite or the above-mentioned electronic device case, and has strong market competitiveness.

[0036] According to an embodiment of the present application, the electronic device includes at least one of a mobile phone, a tablet computer, a notebook computer, a virtual reality (VR) device, an augmented reality (AR) device, a wearable device, and a game console, which has a wide range of applications and can improve the consumer experience.

[0037] In addition to the electronic device case described above, the electronic device may further include structures that conventional electronic devices should have. For example, referring to FIG. 2, the electronic device is a mobile phone, and may further include a fingerprint module 21, an imaging module 22, a control module 23, a CPU, a connection circuit, a package structure, etc., and the description thereof will be omitted here.

[0038] The present application provides a composite. According to an embodiment of the present application, referring to Fig. 5, the composite includes a first member 100, a sealing layer 200 provided on the outer surface of the first member 100 and including a plurality of sub-sealing layers (two sub-sealing layers 210 and 220 are illustrated as an example in Fig. 5) stacked in order, and the components of two adjacent sub-sealing layers are different, and a second member 300 connected to the first member 100 by the sealing layer 200. The inventor found that in the composite, the bonding strength between the first and second components is strong, and by providing multiple sub-encapsulating layers with different components, the components of the sub-encapsulating layers can be flexibly adjusted to adjust the thermal expansion coefficient; by forming a sub-encapsulating layer in this way with a small difference in thermal expansion coefficient, the thermal expansion coefficient transitions gradually from the first component to the second component, resulting in higher compatibility, which greatly reduces the possibility of the composite failing due to temperature changes, and has ideal mechanical properties, a long service life, a good appearance effect, high strength, and a weak shielding effect on the composite's signals, making it suitable for manufacturing electronic device cases.

[0039] According to an embodiment of the present application, referring to FIG. 6, the first member is a metal member, the second member is an inorganic member, and a bond-promoting layer 30 is further provided between the metal member and the sealing layer. This helps to obtain a case with higher affinity between the metal member and the sealing layer, stronger bonding force, and better performance. In some embodiments of the present application, the material forming the metal member includes stainless steel or aluminum alloy. This makes the metal member widely available, low in price, high in strength, and suitable in expansion coefficient, and is suitable for manufacturing the frame of an electronic device case. In some embodiments of the present application, the stainless steel may be at least one selected from SUS301 stainless steel, SUS304 stainless steel, and SUS316L stainless steel, or at least one selected from stainless steels such as S30110, S30408, and S31603, which are designated in GB / T 20878-2007 Stainless Steel and Heat-Resistant Steel Symbols and Chemical Compositions. The aluminum alloy may be selected from 5052 aluminum alloy, 5182 aluminum alloy, 6063 aluminum alloy, 6061 aluminum alloy, 6013 aluminum alloy, and 7-series aluminum alloys having a zinc content in the range of 1% to 10%, and the like.

[0040] According to the embodiments of the present application, the material forming the inorganic member includes glass or ceramic, which has a wide supply source of inorganic members, low price, suitable expansion coefficient, little shielding of signals, suitable for manufacturing the back case of electronic device cases, and is useful for realizing 5G and wireless charging functions, and the inorganic member and the sealing layer are similar and soluble to each other, and diffusion and wetting occur between them during sealing, which is useful for realizing a high sealing effect, strong bonding strength, and seamless bonding and integration. In some embodiments of the present application, the material forming the inorganic member is at least one selected from chemically and physically strengthened high aluminum glass, ZrO2(3Y) ceramic with phase transition strengthening properties, and ZrO2(3Y)-Al2O3 ceramic with phase transition strengthening properties.

[0041] According to the embodiment of the present application, the bond-promoting layer may be obtained by performing a pretreatment on the surface of the metal member, and in order to obtain a bond-promoting layer with good performance, the pretreatment method includes at least one of a chemical vapor deposition method and a molten salt electrolysis method. Thus, the method of forming the bond-promoting layer is simple, convenient, and easy to realize. The components, thickness, etc. of the bond-promoting layer are the same as those of the above-mentioned bond-promoting layer, and the description thereof is omitted here.

[0042] According to an embodiment of the present application, the first member is a ceramic member, and the second member is a glass member. Specifically, the material forming the ceramic member is at least one selected from ZrO2(3Y) ceramics having phase transition strengthening properties, ZrO2(3Y)-Al2O3 ceramics having phase transition strengthening properties, and the material forming the glass member includes high aluminum glass that is chemically and physically strengthened. Thus, the first member and the second member have more suitable expansion coefficients, better strength, can better meet the usage demand, have a longer service life, and have a higher signal transmittance.

[0043] In another aspect of the present application, the present application provides a method for producing a composite, according to an embodiment of the present application, with reference to Fig. 7, the method includes the following steps S100 to S200.

[0044] In S100, a sealing layer is formed on at least a portion of an outer surface of the first component using a sealing slurry.

[0045] According to an embodiment of the present application, the sealing slurry contains glass powder, so that the sealing layer formed by the sealing slurry has strong adhesive force, which is helpful to improve the bonding strength between the first member and the second member, and the glass powder is consistent with the above description, so the description is omitted here.

[0046] According to the embodiment of the present application, the sealing slurry is formed by mixing glass powder, adhesive and solvent, and the glass powder, adhesive and solvent are the same as those described above, and the description is omitted here. According to the embodiment of the present application, the sealing slurry includes 88 to 92 parts by weight of glass powder, 8 to 12 parts by weight of adhesive and an appropriate amount of solvent. According to the embodiment of the present application, there is no special restriction on the specific amount of the solvent used, and a person skilled in the art can determine an appropriate amount of solvent used based on the fluidity of the sealing slurry forming the sealing layer. This provides the sealing slurry with excellent mixing effect and excellent viscosity, which is helpful for applying it to the surface of the bond-promoting layer.

[0047] In some embodiments of the present application, each of the sub-sealing layers is formed by the following steps: the sealing slurry is applied to the corresponding outer surface (the outer surface of the first member or other sub-sealing layer), the sub-sealing layer is obtained, and the above operation can be repeated multiple times to obtain a sealing layer including multiple sub-sealing layers. This makes it possible to obtain a sealing layer that is easy to operate, convenient, easy to realize, and has excellent performance. In some other embodiments of the present application, each of the sub-sealing layers is formed by the following steps: the sealing slurry is applied to the corresponding outer surface (the outer surface of the first member or other sub-sealing layer), the sealing slurry layer is obtained, the sealing slurry layer is heated until melted, the molten sealing slurry layer is then solidified, the sub-sealing layer is obtained, the application step is repeated multiple times to form multiple sealing slurry layers, and the multiple sealing slurry layers are heated until melted and then solidified to obtain a sealing layer including multiple sub-sealing layers. This is easy to operate, convenient, and easy to implement, and can increase the bonding strength between the sealing layer and the first member, which is further helpful in achieving a seamless bond between the first member and the second member.

[0048] According to an embodiment of the present application, when the first member is a metal member, the method further includes pretreating the first member to form a bonding promotion layer on at least a portion of the surface of the first member before forming the sealing layer.

[0049] According to an embodiment of the present application, before pre-treating the first component, the method may further include degreasing, cleaning and drying the first component, which allows obtaining a clean surface of the first component and is useful for pre-treating the surface.

[0050] According to the embodiment of the present application, the first component and the bond-promoting layer are consistent with the above description, and therefore the description is omitted here.

[0051] According to an embodiment of the present application, the pretreatment includes performing at least one of an oxidation treatment and a coating treatment on the first component, which can form a bonding-promoting layer that is easy to operate, convenient, easy to realize, has a suitable expansion coefficient, is similar to the sealing layer, and is soluble with each other, which is conducive to the subsequent seamless bonding between the first component and the second component.

[0052] According to an embodiment of the present application, the coating process can be performed by at least one of a chemical vapor deposition method and a molten salt electrolysis method. This allows a bond-promoting layer to be obtained that is easy to operate, convenient, easy to realize, and has excellent performance. According to an embodiment of the present application, when the pretreatment is performed by a chemical vapor deposition method, a single metal layer or metal oxide layer is deposited on the surface of the first member. This provides a strong bond between the bond-promoting layer and the first member and the sealing layer. According to an embodiment of the present application, when the pretreatment is performed by a molten salt electrolysis method, a single metal layer is formed on the surface of the first member alone. This provides better performance for the bond-promoting layer, which is more helpful in achieving seamless bonding between the first member and the second member and achieving integration.

[0053] In some embodiments of the present application, a specific example of forming a bond-promoting layer by molten salt electrolysis is described. The operation may be to immerse the first member as a cathode in a molten salt, and obtain a thin layer of a dissimilar metal coating on the surface of the first member by electrolyzing the molten salt, thereby obtaining a bonding-promoting layer that is easy to operate, convenient, easy to realize, and has excellent performance.

[0054] According to the embodiments of the present application, the oxidation treatment may be a metal oxidation treatment method known in the art, which can directly oxidize the outer surface of the metal component to form a metal oxide layer, which has higher bonding strength and better performance of the resulting case.

[0055] In S200, a second member is brought into contact with the encapsulation layer, the encapsulation layer is heated until melted, and the molten encapsulation layer is solidified to obtain the composite.

[0056] According to the embodiment of the present application, the second member is consistent with the above description, and the description is omitted here.

[0057] According to the embodiment of the present application, the temperature at which the sealing layer completely melts is lower than the softening temperature of the second member, so that diffusion and wetting occur between the sealing layer and the second member, resulting in a high sealing effect, an excellent bonding effect, little damage to the second member, and a beautiful appearance of the composite. Note that the temperature at which the sealing layer completely melts refers to the minimum temperature value at which the sealing layer completely melts, and the softening temperature of the second member refers to the temperature at which the second member begins to soften.

[0058] According to the embodiment of the present application, the above composite manufacturing method is easy to operate, convenient, and easy to realize, the bonding promotion layer can be more firmly connected to the sealing layer, and the first and second components can be more firmly bonded, and the obtained composite has all the above-mentioned characteristics and advantages, so the description is omitted here. And, the method can also be applied to manufacture the above-mentioned electronic device case, as long as the first component is a frame and the second component is a back case, and the specific operations are completely the same.

[0059] The embodiments of the present invention will be described in detail below.

[0060] Unless otherwise specified, in the following examples and comparative examples, the performance of electronic device cases is tested by the following methods.

[0061] Performance detection method

[0062] Bond strength performance detection: pull-out force test.

[0063] Specific operations

[0064] Equipment: Universal testing machine

[0065] Test piece: The first and second parts are each manufactured into a test piece with dimensions of 30mm*12mm*0.7mm, and the bonding area of ​​the first and second parts (or the area of ​​the sealing layer) is 6mm*12mm.

[0066] Test method: The test piece was fixed to the test stand and a load was applied at a speed of 5 mm / min using a universal testing machine until the unbonded portion of the first member or the second member broke or the bonded surface fell off. A schematic diagram of the test is shown in Figure 8.

[0067] Characterization of multiple sub-encapsulation layers: Scanning Electron Microscope (SEM) linescan. Example 1

[0068] Electronics case construction

[0069] Metal frame: The forming material is stainless steel, the bonding promotion layer on its surface is a metal oxide layer (aluminum oxide layer), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0070] Sub-sealing layer 1: contains 92 parts by weight of borosilicate oxide-based glass powder, 8 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, apply it to the outer surface of the bond-promoting layer, heat it until it melts, and then harden it to obtain a vitrified sub-sealing layer 1.

[0071] Sub-sealing layer 2: Contains 92 parts by weight of phosphate oxide glass powder, 8 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0072] Inorganic back case: The forming material is high aluminum glass.

[0073] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%, and the thermal expansion coefficients of the metal frame, sub-sealing layer 1, sub-sealing layer 2 and the inorganic rear case gradually decrease.

[0074] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more.

[0075] The case was cut to obtain a cross section as shown in Figure 3, and the position corresponding to the sealing layer was observed by a scanning electron microscope, and a scanning electron microscope photograph is shown in Figure 9, in which the part above the horizontal line corresponds to sub-sealing layer 2 and the part below the horizontal line corresponds to sub-sealing layer 1, sub-sealing layer 1 and sub-sealing layer 2 were line scanned, and the scan spectra are shown in Figures 10 and 11, respectively. As can be seen from Figures 9, 10, and 11, there was no sealing mark even when the sealing position was observed under magnification, and sub-sealing layers of different components could be detected and characterized by line scanning with a scanning electron microscope. Example 2

[0076] Electronics case construction

[0077] Metal frame: The forming material is an aluminum alloy, the bonding promotion layer on its surface is a metal oxide layer (titanium oxide layer), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0078] Sub-sealing layer 1: contains 88 parts by weight of borosilicate oxide-based glass powder, 12 parts by weight of silicate-based inorganic adhesive and an appropriate amount of ethanol. The method of forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is applied to the outer surface of the bonding promotion layer, and then heated until melted and then solidified to obtain the sub-sealing layer 1.

[0079] Sub-sealing layer 2: 88 parts by weight of phosphate oxide glass powder, 12 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurries. The first step is to form a vitrified resin layer and apply it to the outer surface of the vitrified sub-sealing layer 1.

[0080] Inorganic back case: The forming material is high aluminum glass.

[0081] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0082] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 3

[0083] Electronics case construction

[0084] Metal frame: the forming material is stainless steel, the bonding promotion layer on its surface is a metal oxide layer (nickel oxide), the thickness of the bonding promotion layer is 5 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0085] Sub-sealing layer 1: Contains 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0086] Sub-sealing layer 2: Contains 90 parts by weight of phosphate oxide glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0087] Inorganic back case: The material is ZrO2(3Y) ceramic.

[0088] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0089] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 4

[0090] Electronics case construction

[0091] Metal frame: The forming material is an aluminum alloy, the bonding promotion layer on its surface is a metal oxide layer (molybdenum oxide), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0092] Sub-sealing layer 1: 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of silicate The method for forming the sub-sealing layer 1 includes mixing the above raw materials to form a sealing slurry, applying it to the outer surface of the bonding promotion layer, heating it until it melts, and then curing it to obtain a vitrified sub-sealing layer 1.

[0093] Sub-sealing layer 2: Contains 90 parts by weight of phosphate oxide glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0094] Inorganic back case: The material is ZrO2(3Y) ceramic.

[0095] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0096] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 5

[0097] Electronics case construction

[0098] Metal frame: The forming material is an aluminum alloy, the bonding promotion layer on its surface is a metal layer (aluminum layer), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0099] Sub-sealing layer 1: Contains 90 parts by weight of sulfide-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0100] Sub-sealing layer 2: Contains 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0101] Inorganic back case: The material is ZrO2(3Y)-Al2O3 ceramic.

[0102] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0103] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 6

[0104] Electronics case construction

[0105] Metal frame: The material is an aluminum alloy, and the bonding-promoting layer on the surface is a metal layer (titanium layer). The thickness of the bonding-promoting layer is 10 μm, and the method for forming the bonding-promoting layer is molten salt electrolysis.

[0106] Sub-sealing layer 1: Contains 90 parts by weight of halide-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0107] Sub-sealing layer 2: Contains 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0108] Inorganic back case: The material is ZrO2(3Y)-Al2O3 ceramic.

[0109] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0110] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 7

[0111] Electronics case construction

[0112] Metal frame: the forming material is stainless steel, the bonding promotion layer on its surface is a metal layer (nickel layer), the thickness of the bonding promotion layer is 10 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0113] Sub-sealing layer 1: Contains 90 parts by weight of phosphate-based glass powder, 10 parts by weight of water-based polyurethane and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0114] Sub-sealing layer 2: Contains 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0115] Inorganic back case: The material is ZrO2(3Y)-Al2O3 ceramic.

[0116] The difference in thermal expansion coefficient between the bond promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bond promotion layer and the sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between the sub-sealing layer 1 and the sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between the sub-sealing layer 2 and the inorganic rear case is Within ±10%.

[0117] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 8

[0118] Electronics case construction

[0119] Metal frame: The material is stainless steel, the bond-promoting layer on the surface is a metal layer (molybdenum layer), the thickness of the bond-promoting layer is 10 μm, and the method for forming the bond-promoting layer is molten salt electrolysis.

[0120] Sub-sealing layer 1: Contains 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0121] Sub-sealing layer 2: Contains 90 parts by weight of silicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0122] Inorganic back case: The material is ZrO2(3Y)-Al2O3 ceramic.

[0123] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0124] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 9

[0125] Electronics case construction

[0126] Metal frame: The material is stainless steel, the bond-promoting layer on the surface is a metal layer (molybdenum layer), the thickness of the bond-promoting layer is 10 μm, and the method for forming the bond-promoting layer is molten salt electrolysis.

[0127] Sub-sealing layer 1: Contains 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the bond-promoting layer, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0128] Sub-sealing layer 2: 90 parts by weight of silicate oxide glass powder, 10 parts by weight of silicate inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials. The sealing slurry is then applied to the outer surface of the vitrified sub-sealing layer 1.

[0129] Sub-sealing layer 3: Contains 90 parts by weight of phosphate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 3 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 2.

[0130] Inorganic back case: The material is ZrO2(3Y)-Al2O3 ceramic.

[0131] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 2 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 3 and the inorganic back case is within ±10%.

[0132] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 10

[0133] Electronics case construction

[0134] Metal frame: The forming material is stainless steel, the bonding promotion layer on its surface is a metal oxide layer (aluminum oxide layer), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0135] Sub-sealing layer 1: contains 92 parts by weight of borosilicate oxide-based glass powder, 8 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, apply it to the outer surface of the bond-promoting layer, heat it until it melts, and then harden it to obtain a vitrified sub-sealing layer 1.

[0136] Sub-sealing layer 2: Contains 88 parts by weight of borosilicate oxide-based glass powder (the same glass powder as that of sub-sealing layer 1 is used), 12 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0137] Inorganic back case: The forming material is high aluminum glass.

[0138] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0139] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 11

[0140] Electronics case construction

[0141] Metal frame: The forming material is stainless steel, the bonding promotion layer on its surface is a metal oxide layer (aluminum oxide layer), the thickness of the bonding promotion layer is 1 μm, and the method of forming the bonding promotion layer is chemical vapor deposition.

[0142] Sub-sealing layer 1: contains 92 parts by weight of aluminosilicate oxide-based glass powder, 8 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, apply it to the outer surface of the bond-promoting layer, heat it until it melts, and then harden it to obtain a vitrified sub-sealing layer 1.

[0143] Sub-sealing layer 2: Contains 92 parts by weight of borosilicate oxide-based glass powder, 8 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0144] Inorganic back case: The forming material is high aluminum glass.

[0145] The difference in thermal expansion coefficient between the bonding promotion layer and the metal frame is within ±10%, the difference in thermal expansion coefficient between the bonding promotion layer and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0146] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 100N or more. Example 12

[0147] The electronic device case is configured as follows: This Example Metal frame in but surface To Same as Example 1, except that it does not include a cohesion promoting layer.

[0148] The difference in thermal expansion coefficient between the sub-sealing layer 1 and the metal frame is within ±10%, the difference in thermal expansion coefficient between the sub-sealing layer 1 and the sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between the sub-sealing layer 2 and the inorganic rear case is within ±10%.

[0149] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the metal frame and the inorganic rear case, and hardly blocks signals. The connection strength between the metal frame of the electronic device case and the inorganic rear case is 60-80N or more. Example 13

[0150] Electronics case construction

[0151] Ceramic frame: The forming material is ZrO2(3Y)-Al2O3 ceramic.

[0152] Sub-sealing layer 1: Contains 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the ceramic component, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0153] Sub-sealing layer 2: Contains 90 parts by weight of silicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0154] Glass back case: The forming material is high aluminum glass.

[0155] The difference in thermal expansion coefficient between the ceramic frame and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the glass back case is within ±10%.

[0156] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the ceramic frame and the glass rear case, and causes little signal obstruction. The connection strength between the ceramic frame and the glass rear case of the electronic device case is 100N or more. Example 14

[0157] Electronics case construction

[0158] Ceramic frame: The forming material is ZrO2(3Y) ceramic.

[0159] Sub-sealing layer 1: Contains 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the ceramic component, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0160] Sub-sealing layer 2: Contains 90 parts by weight of silicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0161] Glass back case: The forming material is high aluminum glass.

[0162] The difference in thermal expansion coefficient between the ceramic frame and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the glass back case is within ±10%.

[0163] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the ceramic frame and the glass rear case, and causes little signal obstruction. The connection strength between the ceramic frame and the glass rear case of the electronic device case is 100N or more. Example 15

[0164] Electronics case construction

[0165] Ceramic frame: The forming material is ZrO2(3Y)-Al2O3 ceramic.

[0166] Sub-sealing layer 1: 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry. The method comprises forming a vitrified sub-encapsulation layer 1, applying it to the outer surface of the ceramic member, heating it until it melts, and then curing it to obtain a vitrified sub-encapsulation layer 1.

[0167] Sub-sealing layer 2: Contains 90 parts by weight of silicate oxide-based glass powder, 10 parts by weight of silicate-based inorganic adhesive, and an appropriate amount of ethanol. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0168] Sub-sealing layer 3: Contains 90 parts by weight of phosphate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 3 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 2.

[0169] Glass back case: The forming material is high aluminum glass.

[0170] The difference in thermal expansion coefficients between the ceramic frame and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficients between sub-sealing layers 1 and 2 is within ±10%, the difference in thermal expansion coefficients between sub-sealing layers 2 and 3 is within ±10%, the difference in thermal expansion coefficients between sub-sealing layer 3 and the glass back case is within ±10%, and the thermal expansion coefficients of the ceramic frame, sub-sealing layer 1, sub-sealing layer 2, sub-sealing layer 3 and the glass back case gradually decrease.

[0171] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the ceramic frame and the glass rear case, and causes little signal obstruction. The connection strength between the ceramic frame and the glass rear case of the electronic device case is 100N or more. Example 16

[0172] Electronics case construction

[0173] Ceramic frame: The forming material is ZrO2(3Y) ceramic.

[0174] Sub-sealing layer 1: Contains 90 parts by weight of borate-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, which is then applied to the outer surface of the ceramic component, heated until melted, and then cured to obtain a vitrified sub-sealing layer 1.

[0175] Sub-sealing layer 2: Contains 92 parts by weight of borate-based glass powder (the same glass powder as that of the sub-sealing layer 1 is used), 8 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0176] Glass back case: The forming material is high aluminum glass.

[0177] The difference in thermal expansion coefficient between the ceramic frame and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the glass back case is within ±10%.

[0178] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the ceramic frame and the glass rear case, and causes little signal obstruction. The connection strength between the ceramic frame and the glass rear case of the electronic device case is 100N or more. (Example 17)

[0179] Electronics case construction

[0180] Ceramic frame: The forming material is ZrO2(3Y) ceramic.

[0181] Sub-sealing layer 1: Contains 90 parts by weight of borosilicate oxide-based glass powder, 10 parts by weight of water-based polyurethane and an appropriate amount of water. The method of forming the sub-sealing layer 1 is to mix the above raw materials to form a sealing slurry, apply it to the outer surface of the ceramic component, heat it until it melts, and then harden it to obtain a vitrified sub-sealing layer 1.

[0182] Sub-sealing layer 2: Contains 90 parts by weight of aluminosilicate oxide-based glass powder, 10 parts by weight of water-based polyurethane, and an appropriate amount of water. The method for forming the sub-sealing layer 2 is to mix the above raw materials to form a sealing slurry, and then apply it to the outer surface of the vitrified sub-sealing layer 1.

[0183] Glass back case: The forming material is high aluminum glass.

[0184] The difference in thermal expansion coefficient between the ceramic frame and sub-sealing layer 1 is within ±10%, the difference in thermal expansion coefficient between sub-sealing layer 1 and sub-sealing layer 2 is within ±10%, and the difference in thermal expansion coefficient between sub-sealing layer 2 and the glass back case is within ±10%.

[0185] The electronic device case of this embodiment has a beautiful and neat appearance, can achieve a seamless step-free connection between the ceramic frame and the glass rear case, and causes little signal obstruction. The connection strength between the ceramic frame and the glass rear case of the electronic device case is 100N or more. Comparative Example 1

[0186] This is the same as Example 1, except that the sealing layer is a single layer structure and contains borosilicate glass powder, the metal frame is an aluminum alloy, and the difference in thermal expansion coefficient between the metal frame and the sealing layer is 30%, and the difference in thermal expansion coefficient between the sealing layer and the inorganic back case is 20%. The case obtained in this comparative example is prone to cracking after sealing because the difference in thermal expansion coefficient between the metal frame and the back case is too large.

[0187] In the present description, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying the relative importance or quantity of the indicated technical features. Thus, a feature qualified with "first" or "second" may explicitly or implicitly include one or more of the feature. In the present description, "plurality" means two or more, unless otherwise clearly and specifically limited.

[0188] In the description of this specification, a description referring to the terms "one embodiment", "several embodiments", "examples", "specific examples" or "several examples" means that the specific features, configurations, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the exemplary expressions of the above terms are not necessarily limited to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner. In addition, unless mutually inconsistent, a person skilled in the art can combine or combine different embodiments or examples described in this specification and features of different embodiments or examples.

[0189] Although the embodiments of the present application have been shown and described above, the above embodiments are merely illustrative and should not be construed as limiting the present application. It should not be understood as being limiting, and those skilled in the art may make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application.

Claims

1. A frame, a sealing layer provided on at least a portion of an outer surface of the frame, the sealing layer including a plurality of sub-sealing layers stacked in order; a rear case in contact with the frame via the sealing layer; Equipped with The components of the adjacent two sub-encapsulating layers are different, the frame is a metal frame, and the back case is an inorganic back case; A bonding-promoting layer is further provided between the metal frame and the sealing layer, The bonding promotion layer includes an oxide of a metal that constitutes the metal frame. Electronic device case.

2. a thermal expansion coefficient of the sealing layer is between a thermal expansion coefficient of the frame and a thermal expansion coefficient of the rear case, and a difference in thermal expansion coefficient between adjacent two layers of the frame, the plurality of sub-sealing layers, and the rear case is within ±10%. The electronic device case according to claim 1 .

3. a gradient of the thermal expansion coefficient of the plurality of sub-sealing layers increases or decreases in a direction in which the frame, the sealing layer, and the rear case are arranged; The electronic device case according to claim 1 .

4. The bond-promoting layer satisfies at least one of the following conditions, which are: the bond-promoting layer has an uneven structure on a surface thereof away from the metal frame; The bond-promoting layer has a porous structure. The bond-promoting layer is M or M ｘ O ｎ wherein M is at least one selected from Fe, Al, Ti, Ni, and Mo; x is 1, 2, or 3; and n is an integer from 1 to 6; and The thickness of the bond-promoting layer is 1 to 10 μm. The electronic device case according to claim 1 .

5. The material forming the metal frame includes stainless steel or aluminum alloy; The material forming the inorganic back case includes glass or ceramic; The electronic device case according to claim 3 .

6. The frame is a ceramic frame and the back case is a glass back case. The electronic device case according to claim 1 .

7. The materials forming the sub-encapsulation layers are each independently Glass powder, and Including adhesive, a mass ratio of the glass powder to the adhesive is 88 to 92:8 to 12, and the components of the glass powder in the two adjacent sub-sealing layers are different; The electronic device case according to claim 1 .

8. The glass powder satisfies at least one of the following conditions, which is: The glass powder is free of lead; and The glass powder contains at least one of a silicate oxide-based, a phosphate-based, a borate-based glass powder, a sulfide-based glass powder, and a halide-based glass powder. The electronic device case according to claim 7.

9. An electronic device case comprising the electronic device case according to any one of claims 1 to 8. electronic equipment.

10. A first member; A sealing layer provided on at least a part of the outer surface of the first member, the sealing layer including a plurality of sub-sealing layers stacked in order, and the components of two adjacent sub-sealing layers are different; a second member connected to the first member by the sealing layer; Including, the first member is a metal member, the second member is an inorganic member, and a bond-promoting layer is further provided between the metal member and the sealing layer; The bonding promotion layer includes an oxide of a metal constituting the first component. Complex.

11. The thermal expansion coefficient of the sealing layer is between the thermal expansion coefficients of the first member and the second member, and the difference in thermal expansion coefficient between adjacent two layers of the first member, the plurality of sub-sealing layers, and the second member is within ±10%. The complex of claim 10.

12. A gradient of the thermal expansion coefficient of the plurality of sub-sealing layers increases or decreases in an arrangement direction of the first member, the sealing layer, and the second member. The complex of claim 10.

13. The bond-promoting layer satisfies at least one of the following conditions, which are: the condition that the bond-promoting layer has an uneven structure on a surface thereof facing away from the first member; The bond-promoting layer has a porous structure. The bond-promoting layer is M or M ｘ O ｎ wherein M is at least one selected from Fe, Al, Ti, Ni, and Mo; x is 1, 2, or 3; and n is an integer from 1 to 6; and The thickness of the bond-promoting layer is 1 to 10 μm. The complex of claim 10.

Images