Image display device

Abstract

To make temperature distribution of a rear face of a display panel nearly uniform.SOLUTION: An image display device comprises: a display panel for displaying an image; an inner plate provided on a rear face side of the display panel; a circuit substrate arranged at a position corresponding to a part of a rear face of the display panel on a rear face side of the inner plate; and a heat insulation member provided on an opposite side of the display panel of the inner plate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an image display device including a display panel for displaying an image. [Background technology]

[0002] An image display device equipped with a display panel that displays images is known (Patent Document 1). This image display device has an inner plate (back cover) disposed along the back surface of the display panel, and a circuit board fixed at a position corresponding to a part of the back surface of the inner plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 017210 Brochure Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned conventional technology, since the circuit board is fixed to a part of the back surface of the inner plate behind the display panel, heat radiated from the circuit board is transmitted through the inner plate to the part of the display panel overlapping with the circuit board, causing a local rise in temperature of the display panel, resulting in a problem of uneven temperature distribution on the back surface of the display panel.

[0005] An object of one aspect of the present invention is to provide an image display device that can make the temperature distribution on the back surface of a display panel closer to uniform. [Means for solving the problem]

[0006] In order to solve the above problems, an image display device according to one embodiment of the present invention comprises a display panel for displaying an image, an inner plate provided on the rear side of the display panel, a circuit board arranged on the rear side of the inner plate at a position corresponding to a portion of the rear side of the display panel, and an insulating member provided on the opposite side of the inner plate from the display panel. Effect of the Invention

[0007] According to one aspect of the present invention, the temperature distribution on the back surface of the display panel can be made closer to uniform. [Brief description of the drawings]

[0008] [Figure 1] 1 is a side view of an image display device according to a first embodiment. [Diagram 2] 4 is a schematic diagram showing a temperature distribution on the back surface of a display panel provided in the image display device. FIG. [Diagram 3] FIG. 11 is a side view of an image display device according to a comparative example. [Figure 4] 4 is an image based on actual measurement data showing the temperature distribution on the back surface of a display panel provided in the image display device. [Diagram 5] 1 is a side view of another image display device according to the first embodiment. [Figure 6] FIG. 11 is a side view of an image display device according to a second embodiment. [Figure 7] FIG. 11 is a side view of an image display device according to a third embodiment. [Figure 8] FIG. 11 is a side view of an image display device according to a fourth embodiment. [Figure 9] FIG. 11 is a side view of an image display device according to a fifth embodiment. [Figure 10] 10 is a cross-sectional view taken along line BB shown in FIG. 9. [Figure 11] 4 is a plan view of a heat insulating member provided in the image display device. FIG. [Figure 12] 13 is a plan view of another heat insulating member provided in the image display device. FIG. [Figure 13]FIG. 13 is a side view of an image display device according to a sixth embodiment. [Figure 14] FIG. 13 is a side view of another image display device according to the sixth embodiment. [Figure 15] FIG. 13 is a side view of an image display device according to a seventh embodiment. [Figure 16] FIG. 11 is a side view of an image display device according to a comparative example. [Figure 17] FIG. 13 is a side view of another image display device according to the seventh embodiment. [Figure 18] FIG. 13 is a rear view of the image display device according to the eighth embodiment. [Figure 19] 4 is a plan view of a heat insulating member provided in the image display device. FIG. [Figure 20] 13 is a plan view of another heat insulating member provided in the image display device. FIG. [Figure 21] 13 is a plan view of still another heat insulating member provided in the image display device. FIG. [Figure 22] FIG. 13 is a side view of an image display device according to a ninth embodiment. [Diagram 23] FIG. 23 is a side view of an image display device according to a tenth embodiment. [Figure 24] 4 is a plan view of a heat insulating member provided in the image display device. FIG. [Diagram 25] FIG. 23 is a side view of an image display device according to an eleventh embodiment. [Figure 26] FIG. 23 is a side view of an image display device according to a twelfth embodiment. [Figure 27] FIG. 23 is a side view of an image display device according to a thirteenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] [Embodiment 1] Hereinafter, one embodiment of the present invention will be described in detail.

[0010] Fig. 1 is a side view of an image display device 1 according to embodiment 1. Fig. 2 is a schematic diagram showing the temperature distribution on a rear surface 8 of a display panel 2 provided in the image display device 1.

[0011] The image display device 1 comprises a display panel 2 that displays an image on a front surface 7, an inner plate 3 provided on the rear surface 8 side of the display panel 2, a circuit board 4 arranged on the rear surface 9 side of the inner plate 3 at a position corresponding to a portion of the rear surface 8 of the display panel 2, and a heat insulating member 5 provided between the circuit board 4 and the inner plate 3.

[0012] The heat insulating member 5 is attached so as to engage with a plurality of bosses 10 provided on the inner plate 3 for mounting the circuit board 4 thereon.

[0013] The heat insulating member 5 is disposed at a position that encompasses the circuit board 4 when viewed from a direction perpendicular to the rear surface 8 of the display panel 2.

[0014] In this manner, the heat insulating member 5 is provided between the inner plate 3 provided on the rear surface 8 side of the display panel 2 and the circuit board 4 arranged on the rear surface 9 side of the inner plate 3 at a position corresponding to a part of the rear surface 8 of the display panel 2. Therefore, heat generated from the circuit board 4 and directed toward the display panel 2 is blocked by the heat insulating member 5 provided between the inner plate 3 provided on the rear surface 8 side of the display panel 2 and the circuit board 4. As a result, the temperature distribution on the rear surface 8 of the display panel 2 can be made closer to uniform.

[0015] Fig. 3 is a side view of an image display device according to a comparative example. Fig. 4 is an image based on actual measurement data showing the temperature distribution on the back surface of a display panel provided in an image display device according to a comparative example. For convenience of explanation, the same reference numerals are used for members having the same functions as those described above, and their explanations will not be repeated.

[0016] The image display device according to the comparative example has a similar configuration to the image display device 1 according to the first embodiment, except that the heat insulating member 5 is not provided.

[0017] Since the insulating member 5 is not provided, the heat radiated from the circuit board 4 is transmitted through the inner plate 3 to the areas 12, 13, and 14 surrounded by dashed lines in Figure 4 which overlap with the circuit board 4 on the rear surface 8 of the display panel 2. As a result, as shown in Figure 4, the temperatures of the areas 12, 13, and 14 of the display panel 2 rise locally, making the temperature distribution of the display panel 2 uneven.

[0018] According to this embodiment, by arranging the heat insulating member 5 on the inner plate 3, the heat insulating member 5 in direct contact with the inner plate 3 suppresses the thermal conduction from the circuit board 4 to the display panel 2 before the heat radiated from the circuit board 4 is transmitted to the display panel 2. This reduces the amount of heat transmitted from the circuit board 4 through the inner plate 3 to the display panel 2. This suppresses a local increase in temperature of the display panel 2. As a result, the temperature distribution of the display panel 2 becomes more uniform than before, and local brightness deterioration of the display panel 2 does not occur.

[0019] 5 is a side view of another image display device 1A according to embodiment 1. For ease of explanation, the same reference numerals are given to members having the same functions as those described above, and the explanation thereof will not be repeated.

[0020] The image display device 1A further includes a back chassis 6 that supports the display panel 2. The back chassis 6 is configured to function as a heat insulating member that suppresses the conduction of heat radiated from the circuit board 4.

[0021] In this way, by disposing the back chassis 6 configured as a heat insulating member between the inner plate 3 and the circuit board 4, the heat radiated from the circuit board 4 is conducted to the back chassis 6 configured as a heat insulating member. Then, the heat is conducted from the back chassis 6 to the inner plate 3. Therefore, the amount of heat conducted from the inner plate 3 to the display panel 2 is suppressed. Therefore, localized brightness deterioration of the display panel 2 due to heat conduction from the circuit board 4 is suppressed.

[0022] Moreover, the heat conducted from the back chassis 6 to the inner plate 3 is uniformly distributed by the inner plate 3 and is conducted so as to spread over the entire surface of the display panel 2. As a result, the heat distribution on the display panel 2 is spread out, and localized deterioration of the display panel 2 is suppressed.

[0023] [Embodiment 2] Other embodiments of the present invention will be described below. For ease of explanation, the same reference numerals are given to members having the same functions as those described in the above embodiment, and the description thereof will not be repeated.

[0024] 6 is a side view of an image display device 1B according to embodiment 2. The heat insulating member 5 is provided between the circuit board 4 and a back chassis 6 that supports the display panel 2. As shown in FIG.

[0025] The heat insulating member 5 is disposed between the back chassis 6 and the circuit board 4 on the circuit board 4 side.

[0026] The heat insulating member 5 is attached so as to engage with a plurality of bosses 10 provided on the back chassis 6 for mounting the circuit board 4 thereon.

[0027] In this manner, the heat insulating member 5 is disposed on the circuit board 4 side between the back chassis 6 and the circuit board 4. The heat insulating member 5 has substantially the same size as the circuit board 4 when viewed in a direction perpendicular to the display panel 2.

[0028] In the image display device 1B configured in this manner, the conduction of heat radiated from the circuit board 4 is suppressed by the heat insulating member 5 arranged on the circuit board 4 side. The conduction of the heat is further suppressed by the back chassis 6 and the inner plate 3. Therefore, local temperature rise in the display panel 2 is suitably suppressed. As a result, brightness degradation due to local burn-in of the display panel 2 does not occur.

[0029] [Embodiment 3] 7 is a side view of an image display device 1C according to embodiment 3. For ease of explanation, members having the same functions as those described in the above embodiments are denoted by the same reference characters, and the explanation thereof will not be repeated.

[0030] The heat insulating member 5 is disposed on the back chassis 6 side between the back chassis 6 and the circuit board 4. The heat insulating member 5 has at least approximately the same size as the circuit board 4.

[0031] In the image display device 1C configured in this manner, the conduction of heat radiated from the circuit board 4 is suppressed by the heat insulating member 5 arranged on the back chassis 6 side. The conduction of the heat is further suppressed by the back chassis 6 and the inner plate 3. Therefore, local temperature rise in the display panel 2 is suitably suppressed. As a result, brightness deterioration due to local burn-in of the display panel 2 does not occur.

[0032] [Embodiment 4] 8 is a side view of an image display device 1D according to embodiment 4. For ease of explanation, members having the same functions as those described in the above embodiments are denoted by the same reference characters, and the explanation thereof will not be repeated.

[0033] The heat insulating member 5D of the image display device 1D is disposed on the entire surface of the back chassis 6.

[0034] In the image display device 1D configured in this manner, the conduction of heat radiated from the circuit board 4 is suppressed by the heat insulating member 5D. Then, the heat flows through the heat insulating member 5D in the upward direction indicated by the arrow A. As a result, the amount of heat conducted from the heat insulating member 5D to the back chassis 6 and the inner plate 3 is reduced. Furthermore, the heat conduction from the heat insulating member 5D toward the display panel 2 is suppressed by the back chassis 6 and the inner plate 3. As a result, brightness degradation due to localized burn-in of the display panel 2 does not occur.

[0035] [Embodiment 5] Fig. 9 is a side view of an image display device 1E according to embodiment 5. Fig. 10 is a cross-sectional view taken along line BB shown in Fig. 9. Fig. 11 is a plan view of a heat insulating member 5E provided in the image display device 1E. For ease of explanation, members having the same functions as those described in the above embodiments are denoted by the same reference characters, and their explanation will not be repeated.

[0036] The bosses 10 for mounting the circuit board 4 are formed in a quadrangular prism shape, for example, as shown in FIG.

[0037] As shown in FIG. 11, the heat insulating member 5E has notches 15 and 16 for engaging with the six bosses 10. As shown in FIG.

[0038] The notch 15 includes a notched elongated hole portion 17 extending from one short side along one long side of the insulation member 5E, and three engagement holes 18, 19, and 20 protruding from both ends and the center of the notched elongated hole portion 17 toward one long side to engage with the upper left boss 10, the upper right boss 10, and the upper central boss 10. The notch 16 includes a notched elongated hole portion 21 extending from one short side along the other long side of the insulation member 5E, and three engagement holes 22, 23, and 24 protruding from both ends and the center of the notched elongated hole portion 21 toward one long side to engage with the lower left boss 10, the lower right boss 10, and the lower central boss 10.

[0039] To attach this heat insulating member 5E to the image display device 1E, first, this heat insulating member 5E is inserted between the back chassis 6 and the circuit board 4 in the direction of arrow A1 with the notched long holes 17 and 21 corresponding to the positions of the bosses 10. Then, the heat insulating member 5E is moved in the direction of arrow A2 so that the engagement holes 18, 19, and 20 and the engagement holes 22, 23, and 24 are engaged with the six bosses 10, respectively.

[0040] This makes it possible to attach the heat insulating member 5E by inserting it from the side of the boss 10 on which the circuit board 4 is placed, and the heat insulating member 5E can be easily attached to the image display device 1E.

[0041] 12 is a plan view of another heat insulating member 5E provided in an image display device 1E. The heat insulating member 5E has six cylindrical holes 25 bored at positions corresponding to the six bosses 10, respectively.

[0042] To attach this heat insulating member 5E to the image display device 1E, first, the six bosses 10 are attached to the back chassis 6. Then, the six cutout holes 25 of the heat insulating member 5E are aligned with the positions of the six bosses 10, and the heat insulating member 5E is inserted into the bosses 10. After that, the circuit board 4 is attached to the end faces of the six bosses 10.

[0043] This allows the heat insulating member 5E to be firmly attached to the image display device 1E.

[0044] [Embodiment 6] 13 is a side view of an image display device 1F according to embodiment 6. For ease of explanation, members having the same functions as those described in the above embodiments are denoted by the same reference characters, and the explanation thereof will not be repeated.

[0045] The image display device 1F includes an inner plate 3F provided on the rear surface 8 side of the display panel 2. The inner plate 3F has a protrusion 26 that protrudes from the rear surface 9 toward the circuit board 4, and the thickness of the inner plate 3F varies partially.

[0046] The rear surface 9 of the inner plate 3F is disposed at a distance of several millimeters from the back chassis 6 along a direction perpendicular to the display panel 2.

[0047] The protrusion 26 of the inner plate 3F is formed at a position that encompasses the circuit board 4 when viewed from a direction perpendicular to the display panel 2, and is formed in the same area as the heat insulating member 5F. The heat insulating member 5F is formed at a position that encompasses the circuit board 4 when viewed from a direction perpendicular to the display panel 2.

[0048] The heat insulating member 5F is attached by engaging with the boss 10 via the notch. Therefore, the heat radiated from the circuit board 4 is insulated by the heat insulating member 5F, but the heat transferred from the circuit board 4 through the boss 10 passes through the notch of the heat insulating member 5F to the back chassis 6.

[0049] Therefore, the heat transferred from the boss 10 to the back chassis 6 is uniformly distributed by the protrusion 26 provided on the inner plate 3F.

[0050] Therefore, even if the temperature of the connection between the boss 10 and the back chassis 6 rises due to heat flowing from the boss 10 to the back chassis 6, the heat transmitted to the display panel 2 side of the back chassis 6 can be uniformly distributed by providing a protrusion 26 on the inner plate 3F that is arranged on the display panel 2 side of the back chassis 6.

[0051] 14 is a side view of another image display device 1G according to embodiment 6. For ease of explanation, the same reference numerals are given to members having the same functions as those described in the above embodiments, and the explanation thereof will not be repeated.

[0052] The image display device 1G includes an inner plate 3G provided on the rear surface 8 side of the display panel 2. The inner plate 3G has an inclined portion 27 that is inclined so that the thickness decreases from a position corresponding to the upper end of the circuit board 4 toward the upper side, and the thickness varies partially.

[0053] The heat transferred from the boss 10 to the back chassis 6 is uniformly distributed by the inclined portion 27 thus provided on the inner plate 3G.

[0054] According to this configuration, the heat transferred from the boss 10 to the back chassis 6 can be uniformly distributed without increasing the thickness of the housing of the image display device 1G by providing a protrusion on the inner plate. Therefore, the effect of uniformly distributing heat can be obtained while making the image display device 1G thinner.

[0055] In this way, even if the temperature of the connection between the boss 10 and the back chassis 6 rises due to heat flowing from the boss 10 to the back chassis 6, the heat transmitted to the display panel 2 side of the back chassis 6 can be uniformly distributed by providing an inclined portion 27 on the inner plate 3G that is arranged on the display panel 2 side of the back chassis 6.

[0056] [Embodiment 7] 15 is a side view of an image display device 1H according to embodiment 7. For ease of explanation, members having the same functions as those described in the above embodiments are denoted by the same reference characters, and the explanation thereof will not be repeated.

[0057] The image display device 1H has an inner plateless structure, and includes a back chassis 6H provided on the back surface 8 of the display panel 2. The back chassis 6H is formed so that the back surface 8 side of the display panel 2 is flat to improve the appearance and to fix the display panel 2 and dissipate heat.

[0058] A tray chassis 28 is provided on the back chassis 6H on the opposite side to the display panel 2. The tray chassis 28 is fixed by a plurality of bosses 34 and fastening members 36 provided on the back chassis 6H in order to increase the setting strength.

[0059] A circuit board 4H and a heat insulating member 5H are provided on the side of the tray chassis 28 opposite the back chassis 6H. The heat insulating member 5H is disposed between the circuit board 4H and the tray chassis 28. The circuit board 4H and the heat insulating member 5H are fixed together by a plurality of bosses 35 and fastening members 37 provided on the tray chassis 28. In this manner, the heat insulating member 5H is provided between the circuit board 4H and the display panel 2, and between the circuit board 4H and the back chassis 6H.

[0060] In this manner, since the heat insulating member 5H is disposed between the circuit board 4H and the tray chassis 28 disposed on the rear surface 8 side of the display panel 2, a local increase in temperature of the display panel 2 can be suppressed.

[0061] 16 is a side view of an image display device according to a comparative example. This image display device includes an inner plate 93 provided on the rear surface 8 of the display panel 2. The inner plate 93 is formed so that the rear surface 8 side of the display panel 2 is flat to fix the display panel 2 and dissipate heat.

[0062] A back chassis 96 is provided on the opposite side of the inner plate 93 to the display panel 2. The back chassis 96 has a bent portion that is bent in a direction away from the display panel 2 in order to improve the appearance, increase the set strength, and fix the circuit board 4 and the like.

[0063] The circuit board 4 is provided on the opposite side of the bent portion of the back chassis 96 to the inner plate 93 , and is fixed by a plurality of bosses 38 and fastening members 39 provided on the back chassis 96 .

[0064] In this configuration, heat dissipation from the circuit board 4 causes the temperature of the display panel 2 to rise locally.

[0065] 17 is a side view of another image display device 1I according to embodiment 7. Components similar to those described above are given the same reference characters, and detailed description of these components will not be repeated.

[0066] The heat insulating member 5I is provided between the tray chassis 28 and the back chassis 6H, and is disposed at a position corresponding to the circuit board 4H. This allows the heat generated from the circuit board 4H and passing through the tray chassis 28 toward the display panel 2 to be blocked by the heat insulating member 5I.

[0067] In the inner plateless structure, as shown in Figures 15 and 17, the side of the back chassis 6H facing the back surface 8 of the display panel 2 must be flat, and it is not possible to give it a shape by squeezing or bending it as in the comparative example of Figure 16. Therefore, a tray chassis 28 can be added to provide heat insulating members 5H and 5I.

[0068] [Embodiment 8] Fig. 18 is a rear view of an image display device 1J according to embodiment 8. Fig. 19 is a plan view of a heat insulating member 5J1 provided in the image display device 1J. Components similar to those described above are given the same reference symbols, and detailed descriptions of these components will not be repeated.

[0069] The image display device 1J includes a back chassis 6J provided on the back surface 8 of the display panel 2. Facing the back chassis 6J, a power supply board 29, a TCON board 30, and a main board 31 are arranged in this order along the X direction.

[0070] The image display device 1J includes a heat insulating member 5J1 disposed between the back chassis 6J and the power supply board 29, the TCON board 30, and the main board 31 so as to straddle the power supply board 29, the TCON board 30, and the main board 31 when viewed from a direction perpendicular to the back chassis 6J. The heat insulating member 5J1 is formed so as to overlap the power supply board 29, the TCON board 30, and the main board 31. The heat insulating member 5J1 has a plurality of cutout holes 40. The power supply board 29, the TCON board 30, and the main board 31 each have a plurality of cutout holes 41. The heat insulating member 5J1, the power supply board 29, the TCON board 30, and the main board 31 are fixed to the back chassis 6J by bosses and fastening members (not shown) that correspond to the cutout holes 40 and 41.

[0071] Heat radiated from the power supply board 29, the TCON board 30, and the main board 31 is transmitted to the area of ​​the back surface 8 of the display panel 2 that overlaps with the power supply board 29, the TCON board 30, and the main board 31, causing the temperature of that area of ​​the display panel 2 to rise locally, resulting in an uneven temperature distribution of the display panel 2.

[0072] Providing the heat insulating member 5J1 can insulate the three boards, namely, the power supply board 29, the TCON board 30, and the main board 31. Also, since the heat insulating member 5J1 is disposed across the boards, it can prevent burn-in at intermediate positions between the boards on the rear surface 8 of the display panel 2. Thus, providing the heat insulating member 5J1 can suppress a local increase in temperature of the display panel 2.

[0073] 20 is a plan view of another heat insulating member 5J2 provided in an image display device 1J. Components similar to those described above are given the same reference characters, and detailed description of these components will not be repeated.

[0074] The image display device 1J may include a heat insulating member 5J2 arranged between the back chassis 6J and the power supply board 29 and the TCON board 30 so as to straddle the power supply board 29 and the TCON board 30 when viewed from a direction perpendicular to the back chassis 6J.

[0075] 21 is a plan view of still another heat insulating member 5J3 provided in an image display device 1J. Components similar to those described above are given the same reference characters, and detailed description of these components will not be repeated.

[0076] The image display device 1J may include a heat insulating member 5J3 disposed between the back chassis 6J and the TCON board 30 and the main board 31 so as to straddle the TCON board 30 and the main board 31.

[0077] In this manner, the heat insulating members 5J1, 5J2, and 5J3 are disposed across at least two substrates.

[0078] [Embodiment 9] 22 is a side view of an image display device 1K according to embodiment 9. Components similar to those described above are given the same reference characters, and detailed description of these components will not be repeated.

[0079] The image display device 1K includes a heat insulating member 5K, which has an insulating function in addition to a heat insulating function against heat generated from the circuit board 4, and can be made of resin, for example, polycarbonate.

[0080] The heat insulating member 5K is provided on the circuit board 4 side between the back chassis 6 and the circuit board 4, and is attached so as to engage with a plurality of bosses 10 provided on the back chassis 6 for mounting the circuit board 4 thereon.

[0081] [Embodiment 10] Fig. 23 is a side view of an image display device 1L according to embodiment 10. Fig. 24 is a plan view of a heat insulating member 5L provided in the image display device 1L. Components similar to those described above are given the same reference symbols, and detailed descriptions of these components will not be repeated.

[0082] The image display device 1L includes a heat insulating member 5L formed to cover the circuit board 4. The heat insulating member 5L has a bottom plate portion 33 formed to cover the surface of the circuit board 4 facing the display panel 2, and side plate portions 32 protruding from both ends of the bottom plate portion 33 to cover the end faces of the circuit board 4.

[0083] Since the heat insulating member 5L is formed so as to cover the circuit board 4 in this manner, the heat generated from the circuit board 4 can be released from the surface of the circuit board 4 opposite the display panel 2. This makes it possible to prevent the heat released from the circuit board 4 from being conducted to the display panel 2.

[0084] [Embodiment 11] 25 is a side view of an image display device 1M according to embodiment 11. Components similar to those described above are given the same reference characters, and detailed description of these components will not be repeated.

[0085] The image display device 1M includes a heat insulating member 5M. The surface of the heat insulating member 5M facing the circuit board 4 is formed in an uneven shape.

[0086] This allows air to flow through the gap between the circuit board 4 and the heat insulating member 5M. Therefore, the heat generated in the circuit board 4 can be carried by the air and released. As a result, it is possible to suppress a local increase in temperature of the display panel 2. Therefore, it is possible to prevent the occurrence of a local change in brightness of the display panel 2.

[0087] [Embodiment 12] 26 is a side view of an image display device 1N according to embodiment 12. Components similar to those described above are designated by the same reference characters, and detailed description of these components will not be repeated.

[0088] The image display device 1N includes a heat insulating member 5N. The heat insulating member 5N is disposed on the opposite side of the back chassis 6 to the display panel 2, and is formed so as to become thinner with increasing distance from the circuit board 4 along a direction parallel to the front surface 7 of the display panel 2. The circuit board 4 is attached to a plurality of bosses 10 provided on the back chassis 6.

[0089] As a result, when the heat dissipated from the circuit board 4 is insulated by the heat insulating member 5N, heat conduction at the position where the circuit board 4 overlaps the display panel 2 is suppressed, and heat dissipated from the center of the circuit board 4 can be suppressed. As a result, a local increase in temperature of the display panel 2 can be suppressed. Therefore, the occurrence of local brightness changes in the display panel 2 can be prevented.

[0090] [Embodiment 13] 27 is a side view of an image display device 1P according to embodiment 13. Components similar to those described above are designated by the same reference characters, and detailed description of these components will not be repeated.

[0091] The image display device 1P includes a heat insulating member 5P. The heat insulating member 5P is provided between the back chassis 6 and the circuit board 4, and is disposed in a tilted position with respect to the circuit board 4. The heat insulating member 5P is attached so as to engage with a plurality of bosses 10 provided on the back chassis 6 for mounting the circuit board 4.

[0092] Heat radiated from the circuit board 4 is transmitted to the area of ​​the back surface 8 of the display panel 2 that overlaps with the circuit board 4, causing a localized rise in temperature in that area of ​​the display panel 2, resulting in an uneven temperature distribution in the display panel 2.

[0093] When insulating the heat emitted from the circuit board 4, the heat conduction at the position where the circuit board 4 overlaps the display panel 2 is suppressed, and by changing the inclination of the heat insulating member 5P, it is possible to adjust the heat distribution at the position where it overlaps with the circuit board 4. As a result, it is possible to suppress a local increase in temperature of the display panel 2.

[0094] 〔summary〕 Image display devices 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G of the present invention comprise a display panel 2 for displaying an image, inner plates 3, 3F, 3G provided on the rear surface 8 side of the display panel 2, a circuit board 4 arranged on the rear surface 9 side of the inner plates 3, 3F, 3G in a position corresponding to a portion of the rear surface 8 of the display panel 2, and insulating members 5, 5D, 5E, 5F provided between the circuit board 4 and the inner plates 3, 3F, 3G.

[0095] According to the above configuration, the heat generated from the circuit board and directed toward the display panel is blocked by the heat insulating member provided between the inner plate provided on the rear side of the display panel and the circuit board arranged on the rear side of the inner plate at a position corresponding to a part of the rear side of the display panel. Therefore, a local increase in temperature of the display panel is suppressed. As a result, an image display device that can make the temperature distribution of the rear side of the display panel closer to uniform can be realized.

[0096] In the image display device 1A according to aspect 2 of the present invention, in the above aspect 1, it is preferable that the heat insulating member 5 includes a back chassis 6 supporting the display panel 2.

[0097] According to the above-mentioned configuration, the back chassis can function as a heat insulating member, and therefore, a local increase in temperature of the display panel can be suppressed with a simple configuration.

[0098] In image display devices 1B, 1C, 1D, 1E, 1F, and 1G according to aspect 3 of the present invention, in the above-mentioned aspect 1, it is preferable that the heat insulating member 5 is provided between a back chassis 6 supporting the display panel 2 and the circuit board 4.

[0099] According to the above configuration, the heat generated from the circuit board and directed toward the display panel can be blocked by the heat insulating member provided between the back chassis 6 supporting the display panel 2 and the circuit board 4.

[0100] In the image display device 1B according to a fourth aspect of the present invention, in the above-mentioned third aspect, it is preferable that the heat insulating member 5 is disposed on the circuit board 4 side between the back chassis 6 and the circuit board 4.

[0101] According to the above configuration, the conduction of heat radiated from the circuit board is suppressed by the heat insulating member disposed on the circuit board side.

[0102] In an image display device 1C according to a fifth aspect of the present invention, in the above-mentioned third aspect, it is preferable that the heat insulating member 5 is disposed on the side of the back chassis 6 between the back chassis 6 and the circuit board 4.

[0103] According to the above configuration, the conduction of heat radiated from the circuit board is suppressed by the heat insulating member arranged on the back chassis side.

[0104] An image display device 1D according to a sixth aspect of the present invention is preferably configured as in the third aspect, in which the heat insulating member 5D is disposed on the entire surface of the back chassis 6.

[0105] According to the above configuration, the conduction of heat radiated from the circuit board is suppressed by the heat insulating member 5 arranged on the entire surface of the back chassis. The heat flows upward through the heat insulating member. Therefore, the amount of heat conducted from the heat insulating member to the back chassis and the inner plate is reduced.

[0106] It is preferable that the image display device 1·1A·1B·1C·1D·1E·1F·1G of aspect 7 of the present invention, in accordance with aspect 1 above, further comprises a back chassis 6 supporting the display panel 2, and that the insulating members 5·5D·5E·5F are attached so as to engage with bosses 10 provided on the back chassis 6 for installing the circuit board 4.

[0107] According to the above configuration, the boss provided on the back chassis for mounting the circuit board can also be used for mounting the heat insulating member.

[0108] In the image display devices 1E, 1F, and 1G according to an eighth aspect of the present invention, in the above-mentioned seventh aspect, it is preferable that the heat insulating members 5E, 5E, and 5F have notches 15 and 16 for engaging with the boss 10.

[0109] According to the above configuration, the heat insulating member can be easily attached to the image display device.

[0110] In the image display device 1·1A·1B·1C·1D·1E·1F·1G of aspect 9 of the present invention, in the above-mentioned aspect 1, it is preferable that the insulating members 5·5D·5E·5F are arranged in a position that encompasses the circuit board 4 when viewed from a direction perpendicular to the rear surface 8 of the display panel 2.

[0111] According to the above configuration, the heat insulating member can effectively block the heat radiated from the circuit board.

[0112] In the image display devices 1F-1G according to Aspect 10 of the present invention, in accordance with Aspect 1 above, it is preferable that the thickness of the inner plates 3F-3G varies partially.

[0113] According to the above configuration, the heat transferred from the circuit board through the boss to the back chassis can be uniformly distributed.

[0114] An image display device 1F according to an eleventh aspect of the present invention is similar to the tenth aspect above, in that the inner plate 3F preferably has a protrusion 26 protruding from the rear surface 9 thereof toward the circuit board 4.

[0115] According to the above configuration, heat transferred from the circuit board through the boss is uniformly distributed by the convex portion protruding from the rear surface of the inner plate toward the circuit board.

[0116] An image display device 1G according to aspect 12 of the present invention is preferably such that, in aspect 10 above, the inner plate 3G has an inclined portion 27 that slopes so that the thickness decreases upward from a position corresponding to the upper end of the circuit board 4.

[0117] According to the above configuration, heat transferred from the circuit board through the boss is uniformly distributed by the inclined portion of the inner plate, which is inclined so that its thickness decreases upward from a position corresponding to the upper end of the circuit board.

[0118] Image display devices 1H, 1I, 1J, 1K, 1L, 1M, 1N, 1P of aspect 13 of the present invention comprise a display panel 2 for displaying an image, a circuit board 4 arranged on the rear surface 8 side of the display panel 2 at a position corresponding to a portion of the rear surface 8 of the display panel 2, and insulating members 5H, 5I, 5J, 5K, 5L, 5M, 5N, 5P provided between the circuit board 4 and the display panel 2.

[0119] According to the above configuration, the heat generated from the circuit board and directed toward the display panel is blocked by the heat insulating member provided between the circuit board and the display panel. This prevents local increases in temperature of the display panel. As a result, an image display device that can achieve a uniform temperature distribution on the back surface of the display panel can be realized.

[0120] It is preferable that, in the above-mentioned embodiment 13, the image display device 1H / 1I of aspect 14 of the present invention further includes a back chassis 6H formed in a flat shape with respect to the rear surface 8 of the display panel 2, and the heat insulating member 5H / 5I is disposed between the back chassis 6H and the circuit board 4H.

[0121] According to the above configuration, a heat insulating member is disposed between the back chassis, which is formed in a flat shape on the rear surface of the display panel, and the circuit board, which is disposed at a position corresponding to a part of the rear surface of the display panel, so that heat generated from the circuit board and directed toward the display panel is blocked by the heat insulating member.

[0122] It is preferable that, in the above-mentioned embodiment 14, the image display device 1H of aspect 15 of the present invention further comprises a tray chassis 28 provided on the opposite side of the back chassis 6H from the display panel 2, and the insulating member 5H is arranged between the tray chassis 28 and the circuit board 4H.

[0123] According to the above configuration, a heat insulating member is disposed between the tray chassis provided on the opposite side of the back chassis to the display panel and the circuit board disposed at a position corresponding to a part of the back surface of the display panel, so that the heat generated from the circuit board and directed toward the display panel is blocked by the heat insulating member.

[0124] It is preferable that, in the above-mentioned embodiment 14, the image display device 1H of aspect 16 of the present invention further comprises a tray chassis 28 provided on the opposite side of the back chassis 6H from the display panel 2, and that the insulating member 5I is arranged between the back chassis 6H and the tray chassis 28.

[0125] According to the above configuration, a heat insulating member is disposed between the back chassis, which is formed in a flat shape on the back surface of the display panel, and the tray chassis, which is provided on the opposite side of the back chassis from the display panel, so that heat generated from the circuit board and directed toward the display panel is blocked by the heat insulating member.

[0126] An image display device 1I according to aspect 17 of the present invention is preferably such that, in aspect 14 above, the circuit board 4H includes a first sub-board (power supply board 29), a second sub-board (TCON board 30), and a third sub-board (main board 31), and the heat insulating members 5J1, 5J2, and 5J3 are formed so as to overlap at least two of the first sub-board (power supply board 29), the second sub-board (TCON board 30), and the third sub-board (main board 31) when viewed from a direction perpendicular to the back chassis 6H.

[0127] According to the above configuration, burn-in can be prevented in the display panel at an intermediate position between the first sub-substrate, the second sub-substrate, and the third sub-substrate.

[0128] An image display device 1J of aspect 18 of the present invention is preferably such that, in aspect 17, the first sub-substrate is a power supply substrate 29, the second sub-substrate is a TCON substrate 30, the third sub-substrate is a main substrate 31, and the heat insulating members 5J1, 5J2, and 5J3 are formed so as to overlap the power supply substrate 29, the TCON substrate 30, and the main substrate 31.

[0129] According to the above configuration, burn-in of the display panel at an intermediate position between the power supply board, the TCON board, and the main board can be prevented.

[0130] An image display device 1L according to a nineteenth aspect of the present invention is preferably configured in the above thirteenth aspect such that the heat insulating member 5L is formed so as to cover the circuit board 4.

[0131] According to the above configuration, the heat generated from the circuit board can be dissipated from the surface of the circuit board opposite the display panel, thereby preventing the heat dissipated from the circuit board from being conducted to the display panel.

[0132] An image display device 1M according to a twentieth aspect of the present invention is preferably such that in the above thirteenth aspect, the surface of the heat insulating member 5M facing the circuit board 4 is formed in an uneven shape.

[0133] According to the above-mentioned configuration, air can be circulated through the gap between the circuit board and the heat insulating member, so that heat generated in the circuit board can be carried by the air and released.

[0134] (Additional Notes) In an image display device 1K according to another aspect of the present invention, in the thirteenth aspect, it is preferable that the heat insulating member 5K has insulating properties.

[0135] According to the above configuration, the insulating properties of the heat insulating member can prevent electrical leakage from the circuit board.

[0136] In an image display device 1N according to yet another embodiment of the present invention, in the above-mentioned embodiment 13, it is preferable that the heat insulating member 5N is formed so that its thickness decreases with increasing distance from the circuit board 4 in a direction parallel to the display panel 2.

[0137] According to the above configuration, when the heat emitted from the circuit board is insulated by the insulating member, heat conduction at the position where the circuit board overlaps the display panel is suppressed, and heat emitted from the center of the circuit board can be suppressed.

[0138] In an image display device 1P according to still another aspect of the present invention, in the thirteenth aspect, it is preferable that the heat insulating member 5P is disposed at an angle with respect to the circuit board 4.

[0139] According to the above configuration, when insulating the heat emitted from the circuit board, heat conduction at the position where the circuit board overlaps the display panel is suppressed, and by changing the inclination of the insulating member, the heat distribution at the position where it overlaps with the circuit board can be adjusted.

[0140] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. The technical scope of the present invention also includes embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Furthermore, new technical features can be formed by combining the technical means disclosed in the respective embodiments. [Explanation of symbols]

[0141] 1 Image display device 2 Display Panel 3 Inner plate 4 Circuit Board 5. Insulation materials 6 Back Chassis 7 Front 8 Back 9 Back 10. Boss 15 Notch 16 Notch 17 Notch slot 18, 19, 20 Engagement hole 21 Notch slot 22, 23, 24 Engagement hole portion 25 Hole 26 Convex 27 Slope 28 Tray Chassis 29 Power supply board (1st sub-board, 2nd sub-board, 3rd sub-board) 30 TCON board (1st sub board, 2nd sub board, 3rd sub board) 31 Main board (first sub-board, second sub-board, third sub-board) 32 Side plate part 33 Bottom plate part

Claims

1. a display panel for displaying an image; an inner plate provided on the rear side of the display panel; a circuit board disposed on a rear surface side of the inner plate at a position corresponding to a part of a rear surface of the display panel; a heat insulating member provided on a side of the inner plate opposite to the display panel; A back chassis supporting the display panel, The image display device, wherein the heat insulating member is disposed between the back chassis and the circuit board and is inclined with respect to the circuit board.

2. a display panel for displaying an image; an inner plate provided on the rear side of the display panel; a circuit board disposed on a rear surface side of the inner plate at a position corresponding to a part of a rear surface of the display panel; a heat insulating member provided on a side of the inner plate opposite to the display panel; A back chassis supporting the display panel, The image display device, wherein the heat insulating member is provided between the back chassis and the circuit board, and is formed so as to become thinner with increasing distance from the circuit board.

Images