Terminal structure and method for manufacturing same

Abstract

To reduce a possibility of occurrence of insulation breakdown between terminals.SOLUTION: The present invention relates to a terminal structure in which a plurality of terminals 10 conductively connected by soldering for each of a plurality of wires 4 is disposed on a terminal installation surface 2b of a terminal block, and the terminals are resin-molded so as to be enclosed together with the wires, such that an insulation property is secured. In the terminal, the side of a termination part 10u is defined as a soldering region 10a, and an opening 13 is formed for limiting an extension of a molten solder 5m from the soldering region to the adjacent terminal installation surface 2b.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a terminal structure that prevents short circuits between soldered terminals and a method for manufacturing the same. [Background technology]

[0002] Semiconductor pressure sensors equipped with electronic components (semiconductor elements) such as a sensor chip as a pressure detection element are known. In recent years, one-chip semiconductor pressure sensors have also been developed in which a pressure detection element and a signal processing circuit are integrated on the same silicon chip. For example, Patent Document 1 describes a semiconductor pressure sensor with improved waterproofing.

[0003] This semiconductor pressure sensor has a contact pin connected to a connection pin (lead pin) from the semiconductor pressure detection unit by a wiring material made of an FPC (flexible printed circuit board) provided within the pressure sensor body as an output terminal in the pressure sensor body, the contact pin is fitted into a terminal connected to the tip of an electric wire to the outside, and the connection part (connector part) between the terminal of the electric wire and the contact pin is molded with room temperature curing resin.

[0004] As described above, in conventional semiconductor pressure sensors, a connector part is provided in which a contact pin is fitted to the terminal of an electric wire connected to an external device, and when waterproofing is required, the connector part and the like are filled with resin. In order to improve the reliability of the connection and reduce costs in such waterproof pressure sensors, it is possible to eliminate the connector part and directly connect the electric wire to the outside to a terminal integrated with the contact pin installed on a terminal block inside the pressure sensor body. The electric wire required for such a direct-wire-attached semiconductor pressure sensor is usually a three-wire type (output, power supply, ground), and the length used for connecting to an external device is about 0.5 to 3 m.

[0005] A commonly used terminal structure such as this terminal block is one in which the end of the conductor wire (conductive material) leading to the outside is soldered to each terminal arranged on the terminal mounting surface to establish an electrical connection, and then the terminal connection portion is surrounded by a resin molding to ensure insulation (see, for example, Patent Documents 2 and 3).

[0006] Here, if ultrasonic welding is used to connect the conductor to the terminal, for example, it will increase the number of management steps, such as polishing and replacing the horn anvil and other parts due to wear, and the associated joining conditions, and there is also the possibility that the stranded conductor may break due to mechanical loads such as twisting. As a countermeasure to such increased management steps and because it has excellent rigidity (resistance) against mechanical loads, soldering is sometimes used. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2001-141588 A [Patent Document 2] Japanese Patent Application Publication No. 63-241883 [Patent Document 3] Patent No. 3131229 Summary of the Invention [Problem to be solved by the invention]

[0008] However, in such a terminal structure, the terminal is inserted into the terminal block or is insert-molded together with the terminal block, and an adhesive is applied to fix the terminal or to seal the gap between the terminal and the terminal block. In this case, if peeling occurs between the fixing adhesive and the molding resin, a gap is likely to be formed.

[0009] For example, as shown in FIG. 13, a terminal 1 is inserted into a terminal mounting surface 2b of a terminal block 2 and fixed with an adhesive 3, with the gap in the inserted portion being filled with adhesive (see FIG. 13(a)). An end of a conductor (conductive material) 4e, which is the core wire of an electric wire 4 such as a power line or a signal line, is soldered to the end of the terminal 1 protruding from the terminal block 2 with a solder material 5 to provide a conductive connection (see FIG. 13(b) and FIG. 13(c)).

[0010] In this terminal block 2, depending on the installation environment, moisture w may penetrate through the core wire (conductor) 4e of the electric wire 4 from the end of the terminal 1 on the side of the mating circuit or board (not shown) of the electric wire 4. In addition, if interfacial peeling occurs between the solder material 5 and the resin material 6 of the resin mold, the gap G continues to the terminal installation surface 2b side (see FIG. 13(d)). If these conditions are met at the same time, the terminals 1 on the terminal installation surface 2b side may short-circuit, causing insulation breakdown, as described below.

[0011] 14, multiple terminals 1 are arranged in parallel on the terminal installation surface 2b of the terminal block 2, and if a gap G is formed on the terminal installation surface 2b side of the terminal block 2 due to interfacial peeling between the adhesive 3 and the resin material 6 of the resin mold, allowing moisture w to penetrate, there is a possibility that the terminals 1 on the terminal installation surface 2b side will short-circuit and cause insulation breakdown. Note that metal materials such as solder material 5 may cause migration or whiskers on the surface, and if a gap exists on the surface side, it may grow without limit and cause a short circuit.

[0012] Therefore, an object of the present invention is to provide a terminal structure capable of reducing the possibility of dielectric breakdown occurring between terminals and a method for manufacturing the same. [Means for solving the problem]

[0013] One aspect of the invention of a terminal structure that solves the above problems is a terminal structure in which a plurality of terminal portions, to which a conductive material is electrically connected by soldering with molten solder, are arranged on a terminal installation surface, and the terminal portions are surrounded by resin molding together with the conductive material to ensure insulation, and the end sides of the terminal portions are soldered to the conductive material, and a limiting portion is formed to limit the extension of the molten solder from the soldering area toward the adjacent terminal installation surface.

[0014] Furthermore, one aspect of the invention for a method for manufacturing a terminal structure that solves the above-mentioned problems is a method for manufacturing a terminal structure in which a plurality of terminal portions, to which a conductive material is conductively connected by soldering with molten solder, are arranged on a terminal installation surface, and the terminal portions are surrounded by resin molding together with the conductive material to ensure insulation, characterized in that the conductive material is soldered to the terminal portions to establish a conductive connection while restricting the molten solder from extending from the soldering area toward the terminal installation surface so that the end side of the terminal portions becomes the soldering area of ​​the conductive material.

[0015] In these embodiments, the diffusion (wetting and spreading) of molten solder from the soldering area on the end side of the terminal portion to the terminal installation surface side is restricted, and the resin comes into contact with the surface of the terminal portion on the terminal installation surface side to be molded without the presence of solder.

[0016] With this structure, even if a gap is formed between the solder surface located on the end side of the terminal portion and the resin mold, moisture can be prevented from penetrating into the terminal installation surface side of the terminal portion even if the moisture penetrates from the conductive end side that is soldered.

[0017] One aspect of the invention of a terminal structure that solves the above problems is a terminal structure in which a plurality of terminal portions, to which a conductive material is electrically connected by soldering with molten solder, are arranged in parallel on a terminal installation surface, and the terminal portions are surrounded by a resin molding together with the conductive material to ensure insulation, characterized in that the terminal portions are arranged so that the creepage distance on the terminal installation surface between adjacent portions is greater than the adjacent spacing when the terminal portions are arranged in series in a straight line.

[0018] In this embodiment, the creepage distance on the terminal mounting surface of adjacent terminal portions is made larger than the adjacent distance that ensures insulation between the terminal portions, in other words, the adjacent spacing when viewed from the front in the parallel direction, and the terminal portions are resin molded.

[0019] With this structure, even if a gap is formed between the terminal mounting surface and the resin mold and moisture penetrates into the terminal mounting surface, the creeping distance of the terminal mounting surface between the terminal portions can be increased, thereby reducing the possibility of moisture continuing between the terminal portions. Effect of the Invention

[0020] In this way, according to one embodiment of the present invention, it is possible to provide a structure and a manufacturing method that can prevent moisture from continuously flowing between adjacent terminal portions and thereby reduce the insulation properties, and that can reduce the possibility of dielectric breakdown occurring between the terminal portions. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a diagram illustrating an example of a terminal connection structure of a pressure sensor implementing a first embodiment of the terminal structure and its manufacturing method of the present invention, where (a) is an external view showing the pressure sensor, and (b) is a plan view of the pressure sensor as viewed from the extension direction of the electric wire. [Diagram 2] 2(a) is a partially sectional front view of the pressure sensor in an upright position taken along line IIa-IIa in FIG. 1, and FIG. 2(b) is a sectional plan view of line IIb-IIb in FIG. 2(a). [Diagram 3]FIG. 3 is a diagram illustrating the terminal, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing the gap formed around the terminal. [Figure 4] FIG. 4 is a diagram showing the first alternative embodiment, where (a) is an elevational front view showing the single terminal structure, and (b) is an elevational front view showing the terminal after resin molding. [Diagram 5] FIG. 5 is a diagram showing the second alternative embodiment, where (a) is an elevational front view showing the single terminal structure, and (b) is an elevational front view showing the terminal after resin molding. [Figure 6] FIG. 6 is a diagram showing the third alternative embodiment, where (a) is a perspective view showing the single terminal structure, and (b) is an elevational side view thereof. [Figure 7] FIG. 7 is a diagram showing the fourth alternative embodiment, where (a) is a perspective view showing the single terminal structure, and (b) is an elevational side view thereof. [Figure 8] FIG. 8 is a diagram illustrating an example of a terminal connection structure of a pressure sensor implementing a second embodiment of the terminal structure and its manufacturing method of the present invention, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing a gap formed around the terminal. [Figure 9] FIG. 9 is a diagram illustrating an example of a terminal connection structure of a pressure sensor implementing a third embodiment of the terminal structure and its manufacturing method of the present invention, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing a gap formed around the terminal. [Figure 10]FIG. 10 is a diagram showing an example of a terminal connection structure of a pressure sensor implementing a fourth embodiment of the method for manufacturing a terminal structure of the present invention, in which (a) is a side view explaining soldering to the horizontal terminal, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing the gap formed around the terminal. [Figure 11] FIG. 11 is a diagram showing an example of a terminal connection structure of a pressure sensor having a fourth embodiment of the terminal structure of the present invention, in which (a) is an elevated front view showing the parallel terminals after resin molding, (b) is a plan view showing the terminals after resin molding, and (c) is an elevated front view showing gaps formed around the terminals. [Figure 12] FIG. 12 is a diagram showing an example of a terminal connection structure of a pressure sensor including a fifth embodiment of the terminal structure of the present invention, in which (a) is an elevated front view showing the parallel terminals after resin molding, (b) is a plan view showing the terminals after resin molding, and (c) is an elevated front view showing gaps formed around the terminals. [Figure 13] FIG. 13 is a diagram illustrating the prior art terminal structure, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing the gap formed around the terminal. [Figure 14] FIG. 14 is a diagram for explaining the prior art terminal structure, and is an elevational front view showing the parallel terminals after resin molding. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figures 1 to 3 are diagrams showing an example of a terminal connection structure of a pressure sensor implementing a first embodiment of the terminal structure and its manufacturing method of the present invention.

[0023] <First embodiment of terminal structure> 1 and 2, the pressure sensor 100 is constructed with a connector 101A having a waterproof function and accommodating a three-wire electric wire 4 for output, power supply, and ground, and a sensor element 101B accommodating a signal line conductively connected to a sensor main body having a waterproof function such as a sensor chip or a circuit board (not shown). This pressure sensor 100 is electrically connected with waterproofness (insulation) ensured inside a connector case 102A and a sensor case 102B, respectively, so as to prevent dielectric breakdown between the conductors in the connector 101A and the sensor element 101B.

[0024] In particular, in the connector 101A on the device side of this embodiment, the core wires (conductors) 4e of each electric wire 4 of the input / output lines (power supply voltage, zero V, signal output) connected to the sensor element 101B are housed in the connector case 102A and soldered to each terminal (terminal portion) 10 of the terminal block 2 for conductive connection, and although not shown, various conductors in the sensor case 102B of the sensor element 101B are conductively connected to the terminals 10. Incidentally, in the connector 101A, the connector case 102A is filled with a resin material 6 and resin molded so as to surround the entire terminal 10, thereby ensuring waterproofing around the terminal 10, and the sensor element 101B also ensures waterproofing so that moisture does not penetrate from the sensor case 102B side to the connector 101A side.

[0025] The terminal 10 is inserted or insert-molded into the terminal block 2, and adhesive 3 is applied to the terminal mounting surface 2b to seal or fix the gap at the insertion point of the terminal block 2, and the core wire 4e of the electric wire 4 is soldered to the termination portion 10u on one end side with molten solder 5m to provide an electrical conductive connection.

[0026] This terminal 10 has a terminal surface 10f formed as an affinity surface for the molten solder 5m, and the molten solder 5m spreads out while blending with the terminal surface 10f, generating surface tension and extending in a direction from the end portion 10u toward the terminal base portion 10b on the terminal installation surface 2b side, and the solidified solder material 5 of the molten solder 5m is conductively connected to the core wire 4e of the electric wire 4.

[0027] At this time, the molten solder 5m may be solidified and soldered to the solder material 5 in a state where it extends to the terminal base 10b side close to the terminal installation surface 2b of the terminal 10. In this case, the entire terminal surface 10f of the terminal 10 is covered with the solder material 5 that is incompatible with the resin material 6 for resin molding, and when the resin material 6 is also incompatible with the adhesive 3 that fixes the terminal 10 to the terminal block 2, peeling may occur at the interface between them, forming a continuous gap G. That is, in this terminal structure, there is a possibility that a gap G may be formed from the core 4e side of the electric wire 4 through the surfaces of the solder material 5 and the adhesive 3 to the terminal installation surface 2b (see Figures 13 and 14). Then, in the terminal 10 of this terminal block 2, moisture w that penetrates from the end portion 10u side, which is the mating circuit or board side of the electric wire 4, through the gap G depending on the installation environment may cause a short circuit between adjacent terminals 10.

[0028] Therefore, as shown in FIG. 3(a), the terminal 10 of this embodiment has a soldering area 10a that is a predetermined area sufficient for soldering the core wire 4e of the electric wire 4 to the terminal surface 10f, for example, more than half the area of ​​the terminal surface 10f, and a rectangular opening 13 is formed between both side edges 10s of the soldering area 10a on the terminal installation surface 2b side.

[0029] The opening 13 of the terminal 10 is formed to be large enough to ensure a current capacity between the opening 13 and both sides 10s, and functions as a limiting portion that limits the tendency of the molten solder 5m used to solder the core 4e of the electric wire 4 to the end 10u to spread and extend beyond the soldering area 10a toward the terminal installation surface 2b side by narrowing the gap between the opening 13 and both sides 10s, as shown in Figures 3(b) and 3(c). Here, in this embodiment, a case where the terminal 10 is soldered in an upright position is described as an example, but the present invention is not limited to this. Even when the terminal 10 is soldered with the molten solder 5m placed on it while the terminal 10 is turned sideways, the extension of the molten solder 5m that spreads due to surface tension can be limited.

[0030] As a result, when the resin material 6 is filled into the connector case 102A and resin-molded to ensure insulation after the core wire 4e of the electric wire 4 is soldered as shown in FIG. 3(d), the resin material 6 can be prevented from coming into close contact with the terminal surface 10f where no solder material 5 is present, thereby preventing the formation of a gap G.

[0031] Therefore, even if a gap G is formed between the adhesive 3 or solder material 5 on the terminal installation surface 2b and the resin material 6, the terminal 10 can prevent the gap G on the adhesive 3 side from communicating with the solder material 5 side. At this time, since the resin material 6 is filled inside the opening 13 of the terminal 10, the resin materials 6 on the front and back of the terminal 10 are more firmly attached to each other than in a state where there is no limiting portion, so that the adhesion between the terminal 10 and the resin material 6 can be improved.

[0032] <First embodiment of method for manufacturing terminal structure> 1 to 3, the connector 101A of the pressure sensor 100 is manufactured by preparing a terminal 10 having an opening 13 formed in advance, which is inserted or insert-molded into the terminal mounting surface 2b of the terminal block 2 and has a gap sealed or fixed with an adhesive 3, soldering the core wire 4e of the electric wire 4 to the end portion 10u of the terminal 10 to establish an electrical conductive connection, and then filling the connector case 102A with a resin material 6 and resin-molding the entire terminal 10, thereby ensuring waterproofing around the terminal 10.

[0033] In this manufacturing procedure (manufacturing method), molten solder 5m is supplied so as to flow into the soldering area 10a while the core wire 4e of the electric wire 4 is brought into contact with the end portion 10u protruding from the terminal block 2 of each terminal 10, thereby solidifying the solder material 5 so as to maintain the connection while ensuring electrical conductivity, thereby creating an installation structure for the terminal 10.

[0034] At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 10, the flow path from the soldering area 10a toward the terminal mounting surface 2b is narrowed between both side edges 10s and the opening 13, and the diffusion of the molten solder from the soldering area 10a is restricted by its own surface tension together with the edges of the opening 13.

[0035] As a result, as described above, it is possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 10 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

[0036] In this way, the installation structure of the terminal 10 and its manufacturing method of this embodiment can prevent moisture w that has permeated from the opposing circuit or substrate of the wire 4 from penetrating through the gap G on the solder material 5 side to the gap G on the adhesive 3 side and spreading over the surface of the terminal installation surface 2b.

[0037] Therefore, the pressure sensor 100 can prevent moisture w from penetrating between adjacent terminals 10 in the terminal block 2 and causing a short circuit, and can prevent dielectric breakdown from occurring between the terminals 10.

[0038] As shown in Fig. 4(a), the terminal 10 according to the first alternative aspect of this embodiment has a notch 14 formed on the terminal installation surface 2b side of the soldering region 10a, which extends in the width direction from one side edge 10s of the terminal 10. As with the opening 13 of this embodiment, the notch 14 of this terminal 10 functions as a restricting portion that restricts the molten solder 5m from diffusing (extending) from the soldering region 10a by narrowing the gap between the one side edge 10s, as shown in Fig. 4(b).

[0039] As shown in Fig. 5(a), a terminal 10 according to a second alternative aspect of this embodiment has a pair of notches 15 formed on the terminal installation surface 2b side of the soldering region 10a, which extend in the width direction from both side edges 10s of the terminal 10. As with the opening 13 of this embodiment, the notches 15 of this terminal 10 function as restricting portions that narrow the central gap between the side edges 10s to restrict the molten solder 5m from diffusing (extending) from the soldering region 10a, as shown in Fig. 5(b).

[0040] In this way, even in these other aspects of the terminal 10, the gap G formed between the adhesive 3 side or the solder material 5 side of the terminal installation surface 2b and the resin material 6 can be prevented from communicating with each other, and the moisture w that has permeated from the mating circuit or board side of the electric wire 4 can be prevented from spreading to the surface of the terminal installation surface 2b. Therefore, it is possible to prevent a short circuit caused by the infiltrating moisture w between adjacent terminals 10 in the terminal block 2 of the pressure sensor 100, which would cause insulation breakdown. By providing the opening 13 and the notches 14, 15 in the terminal 10 in this way, the bonding area between the resin material 6 on the front and back of the terminal 10 at the narrowed portion of the terminal 10 can be increased, so that the peeling of the resin material 6 from the terminal 10 can be prevented and adhesion can be improved.

[0041] Furthermore, in the terminal 10 of the third and fourth other aspects of this embodiment, instead of the opening 13 and the notches 14 and 15, a rib shape or a step protruding from the terminal surface 10f may be formed, or a rib shape continuing between the side edges 10s may be formed. Specifically, the terminal 10 of the third other aspect may be curved to form a rib shape 17 protruding from the terminal surface 10f on one side, as shown in FIG. 6. In addition, the terminal 10 of the fourth other aspect may be formed into a hook shape bent into a two-stage L-shape to form a step portion 18, as shown in FIG. 7. In this case, as in the opening 13 of this embodiment, the rib shape 17 or the step portion 18 can function as a limiting portion that limits the molten solder 5m from diffusing (extending) from the soldering region 10a, and the same action and effect can be obtained, and it is possible to prevent the terminals 10 from being short-circuited by the moisture w that penetrates between them, which causes insulation breakdown.

[0042] <Second embodiment of terminal structure> 8 is a diagram showing an example of a terminal connection structure of a pressure sensor implementing a second embodiment of the terminal structure and its manufacturing method of the present invention. Here, since this embodiment has substantially the same configuration as the above-described embodiment, the same reference numerals are used for similar configurations and mainly the characteristic parts will be described (the same applies to other embodiments described below).

[0043] In FIG. 8(a), in the pressure sensor 100, similarly to the above-described embodiment, the terminals (terminal portions) 20 to which the core wires 4e of the electric wires 4 for input / output to the pressure sensor chip are soldered for conductive connection are arranged in parallel with the terminal block 2 in the connector case 102A, and the terminals 20 are resin-molded so as to surround the entire terminals 20 by filling the connector case 102A with a resin material 6, thereby ensuring waterproofing.

[0044] The terminal 20 has a plating (or a pre-solder) 21 formed on the soldering area 10a of the terminal surface 10f, which makes the terminal 20 have a more compatible surface with the molten solder 5m than the terminal 10 of the above embodiment. As shown in Fig. 8(b) and Fig. 8(c), the molten solder 5m for soldering the core wire 4e of the electric wire 4 is effectively compatible with the plating 21 of the soldering area 10a, while the soldering area 10a itself functions as a restricting portion by suppressing (limiting) the active diffusion of the molten solder 5m away from the soldering area 10a toward the terminal installation surface 2b. The type of plating may be a general tin plating or gold plating, or may be any other type of metal plating that can improve the wettability of the solder. The method of forming this compatible surface is more effective when the terminal is made of a material that is difficult to wet with solder, such as stainless steel. Furthermore, by using a material that has been partially plated in the areas that will become the soldering areas before pressing, the material surface that is difficult for solder to wet is exposed on both side edges 10s, which provides further benefits by preventing the solder from diffusing to those areas.

[0045] As a result, in the terminal 20, as shown in FIG. 8(d), when the core wire 4e of the electric wire 4 is soldered and then resin molded to ensure insulation, the resin material 6 can be brought into close contact with the terminal surface 10f where no solder material 5 is present, thereby restricting the formation of gaps G, which may form between the adhesive 3 or solder material 5 on the terminal mounting surface 2b and the resin material 6, and preventing the gaps G from communicating with each other.

[0046] <Second embodiment of method for manufacturing terminal structure> In FIG. 8, the connector 101A of the pressure sensor 100 is manufactured by preparing a terminal 20 in which plating 21 has been formed in advance on the soldering area 10a of the terminal surface 10f as an affinity surface for molten solder 5m, and the terminal 20 is inserted or insert-molded into the terminal mounting surface 2b of the terminal block 2, and the gap is sealed or fixed with adhesive 3. The core wire 4e of the electric wire 4 is soldered to the end portion 10u of the terminal 20 to establish an electrical conductive connection. After that, resin material 6 is filled into the connector case 102A and resin-molded so as to surround the entire terminal 20, thereby ensuring waterproofing around the terminal 20.

[0047] In this manufacturing procedure, molten solder 5m is supplied so as to flow into the soldering area 10a while the core wire 4e of the electric wire 4 is brought into contact with the end portion 10u of each terminal 20, thereby ensuring electrical conductivity, and solidifying the solder material 5 so as to maintain the connection state, thereby creating an installation structure for the terminal 20.

[0048] At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 20, it actively blends with the plating 21 of the soldering area 10a and is restricted from diffusing from the soldering area 10a by its own surface tension.

[0049] This makes it possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 20 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6, as described above.

[0050] In this way, in the installation structure of the terminal 20 of this embodiment and its manufacturing method, as in the above-described embodiment, it is possible to prevent moisture w that has permeated from the mating circuit or board side of the electric wire 4 from penetrating through the gap G on the solder material 5 side to the gap G on the adhesive 3 side and spreading over the surface of the terminal installation surface 2b, thereby preventing dielectric breakdown from occurring between the terminals 20 of the pressure sensor 100.

[0051] Here, although not shown in the drawings, it goes without saying that another aspect of this embodiment may be combined with the above-described first embodiment.

[0052] <Third embodiment of terminal structure> FIG. 9 is a diagram showing an example of a terminal connection structure of a pressure sensor implementing the third embodiment of the terminal structure and the manufacturing method thereof according to the present invention.

[0053] In FIG. 9(a), in the pressure sensor 100, similarly to the above-described embodiment, the terminals (terminal portions) 30 to which the core wires 4e of the electric wires 4 for input / output to the pressure sensor chip are soldered for conductive connection are arranged in parallel with the terminal block 2 in the connector case 102A, and the terminals 30 are resin-molded so as to surround the entire terminals 30 by filling the connector case 102A with a resin material 6, thereby ensuring waterproofing.

[0054] As shown in Figures 9(b) and 9(c), the terminal 30 has an adjacent region 30n below the soldering region 10a on the terminal surface 10f formed as a non-compatible surface that is less compatible with the molten solder 5m than the soldering region 10a, and the adjacent region 30n functions as a limiting portion that limits the descent of the molten solder 5m toward the terminal installation surface 2b.

[0055] Furthermore, the adjacent region 30n of the terminal 30 is formed as an affinity surface that is compatible with the resin material 6, and is adapted to prevent the resin material 6 from peeling off at the interface with the terminal surface 10f during resin molding, thereby preventing the formation of a gap G. Specific examples of non-compatible surfaces for solder and compatible surfaces for resin material include coatings, resin paint films such as polyurethane, and electrodeposition coatings, which are formed by a method that inhibits the wetting and spreading of solder while not affecting the adhesion of the resin material 6 or the adhesiveness of the adhesive 3.

[0056] As a result, in the terminal 30, as shown in FIG. 9(d), when the core wire 4e of the electric wire 4 is soldered to the soldering area 10a and then resin molded to ensure insulation, the presence of the solder material 5 in the adjacent area 30n of the soldering area 10a is suppressed while promoting close contact of the resin material 6, and gaps G that may form between the adhesive 3 or solder material 5 on the terminal mounting surface 2b and the resin material 6 can be suppressed from communicating with each other.

[0057] <Third embodiment of method for manufacturing terminal structure> In FIG. 9, the connector 101A of the pressure sensor 100 is manufactured by a procedure in which an adjacent area 30n on the terminal installation surface 2b side adjacent to the soldering area 10a is formed in advance as a non-compatible surface that is less compatible with the molten solder 5m than the soldering area 10a, and a compatible surface that is compatible with the resin material 6, and a terminal 30 is prepared by being inserted or insert-molded into the terminal installation surface 2b of the terminal block 2 and the gap is sealed or fixed with adhesive 3, and the core wire 4e of the electric wire 4 is soldered to the end portion 10u of the terminal 30 to establish an electrical conductive connection, and then the resin material 6 is filled into the connector case 102A and resin-molded so as to surround the entire terminal 30, thereby ensuring waterproofing around the terminal 30.

[0058] In this manufacturing procedure, molten solder 5m is supplied so as to flow into the soldering area 10a while the core wire 4e of the electric wire 4 is brought into contact with the end portion 10u of each terminal 30, thereby ensuring electrical conductivity, and solidifying the solder material 5 so as to maintain the connection state, thereby creating an installation structure for the terminal 30.

[0059] At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 30, it is restricted from diffusing from the soldering area 10a to the adjacent area 30n below, and the resin material 6 for resin molding actively blends with and adheres to the adjacent area 30n.

[0060] As a result, as described above, the solder material 5 can be retained within the soldering area 10a of the terminal 30 while the resin material 6 can be actively adhered to the adjacent area 30n, and the gap G formed between the solder material 5 and the resin material 6 can be prevented from connecting to the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

[0061] In this way, in the installation structure of the terminal 30 of this embodiment and its manufacturing method, as in the above-described embodiment, it is possible to prevent moisture w that has permeated from the mating circuit or board side of the electric wire 4 from penetrating through the gap G on the solder material 5 side to the gap G on the adhesive 3 side and spreading over the surface of the terminal installation surface 2b, thereby preventing dielectric breakdown from occurring between the terminals 10 of the pressure sensor 100.

[0062] Here, although not shown in the drawings, it goes without saying that another aspect of this embodiment may be combined with one or both of the first and second embodiments described above.

[0063] <Fourth embodiment of method for manufacturing terminal structure> In FIG. 10, the connector 101A of the pressure sensor 100 is manufactured by the following procedure: preparing a conventional terminal 1 as shown in FIG. 13; applying a plate-shaped mask material 41 made of a material having a non-affinity with which the molten solder 5m is incompatible to a boundary portion adjacent to the soldering area 10a; supplying molten solder 5m melted by a soldering iron 45 to the soldering area 10a; soldering the core wire 4e of the electric wire 4 to the end portion 10u of the terminal 1 for electrical continuity; and then filling the connector case 102A with a resin material 6 and resin-molding the entire terminal 1, thereby ensuring waterproofing around the terminal 1.

[0064] In this manufacturing procedure, molten solder 5m is supplied so as to flow into the soldering area 10a while the core wire 4e of the electric wire 4 is brought into contact with the end portion 10u of each terminal 1, thereby ensuring electrical conductivity, and solidifying the solder material 5 so as to maintain the connection, thereby creating an installation structure for the terminal 1.

[0065] At this time, when the molten solder 5m is poured into the soldering region 10a of the terminal 1, the mask material 41 prevents the molten solder 5m from diffusing beyond the adjacent boundary of the soldering region 10a toward the terminal installation surface 2b.

[0066] As a result, as in the above-described embodiment, it is possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 1 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

[0067] Here, in this embodiment, the mask material 41 is pressed against the soldering area 10a to restrict soldering to adjacent areas, but this is not limited to this. For example, instead of the mask material 41, a resist material may be applied (temporarily placed) as a mask to prevent adhesion of the molten solder 5m, and the resist material may be removed after soldering.

[0068] In this way, in the method of manufacturing the terminal 1 of this embodiment, as in the above-described embodiment, it is possible to prevent moisture w that has permeated from the opposing circuit or substrate of the wire 4 from penetrating through the gap G on the solder material 5 side to the gap G on the adhesive 3 side and spreading onto the surface of the terminal mounting surface 2b, thereby preventing dielectric breakdown from occurring between the terminals 1 of the pressure sensor 100.

[0069] Here, as another aspect of this embodiment, although not shown in the drawings, it goes without saying that it may be combined with one or more of the first to third embodiments described above.

[0070] <Fourth embodiment of terminal structure> FIG. 11 is a diagram showing an example of a terminal connection structure of a pressure sensor including the terminal structure according to the fourth embodiment of the present invention.

[0071] In FIG. 11(a), in the pressure sensor 100, similarly to the above-described embodiment, terminals (terminal portions) 50a to 50c to which core wires 4e of electric wires 4 for input / output to the pressure sensor chip are soldered for conductive connection are arranged in parallel on a terminal block 52 in a connector case 102A, and the connector case 102A is filled with resin material 6 and resin-molded so as to surround the entire terminals 50a to 50c, thereby ensuring waterproofing of the terminals 50a to 50c.

[0072] The terminal block 52 is fabricated such that the terminals 50a to 50c are inserted or insert-molded into the terminal mounting surfaces 52a to 52c, respectively, and gaps are sealed or fixed with adhesive 3, with the central terminal mounting surface 52b being offset from the terminal mounting surfaces 52a, 52c on either side of them toward the terminal end.

[0073] 11(b), the terminals 50a to 50c are arranged in parallel so that the terminal surfaces 50f coincide with the extension surface 50e in the width direction, and are fixed to the terminal installation surfaces 52a to 52c so that the end portions 50u are at the same height because they are the soldering positions of the core wires 4e of the electric wires 4. The terminals 50a to 50c may be formed so that the terminal 50b is shorter than the terminals 50a and 50c and buried and fixed in the terminal installation surfaces 52a to 52c, or may be formed to the same length so that the terminal 50b is buried and fixed deeper than the terminals 50a and 50c.

[0074] Here, the terminals 50a to 50c in this embodiment are arranged in series so that the terminal surfaces 50f are aligned on a straight line of the extension line of the extension surface 50e shown in FIG. 11, and the terminal installation surfaces 52a to 52c are offset while the adjacent intervals in the parallel (series) direction in the above-mentioned embodiment are made the same. For this reason, the mutual relationship between the offset adjacent locations of the terminals 50a to 50c will be described below using the X direction, Y direction, and Z direction, which are mutually orthogonal to each other, to describe the three-dimensional space. In short, the offset relationship of the terminals 50a to 50c will be described with the X direction being the parallel direction in which the width direction of the terminal surfaces 50f are in series (the direction parallel to the terminal installation surfaces 52a to 52c extending the extension line of the extension surface 50e). Similarly, the offset relationship will be described with the Y direction being the thickness direction between the front and back of the terminal surfaces 50f of the terminals 50a to 50c, that is, the direction parallel to the terminal installation surfaces 52a to 52c and orthogonal to the X direction. The offset relationship will be described with the longitudinal direction from the terminal installation surfaces 52a to 52c of the terminals 50a to 50c toward the end portion 50u, that is, the direction perpendicular to the X and Y directions parallel to the terminal installation surfaces 52a to 52c, being the Z direction.

[0075] That is, the terminals 50a to 50c are installed on terminal installation surfaces 52a to 52c at so-called Z-direction offset positions, with the installation planes being staggered in the longitudinal direction, and are arranged so that the creepage distance in the X direction + Z direction between adjacent points is larger than the adjacent spacing on terminal installation surface 2b at the same height (the adjacent spacing in only the X direction when viewed from the front perpendicular to the parallel direction).

[0076] 11(c), even if a gap G is formed between the solder material 5 or adhesive 3 and the resin material 6 and the terminals 50a-50c communicate with each other, the creepage distance between the installation points on the terminal installation surfaces 52a-52c can be made larger (longer) than between the terminals 1 on the terminal installation surface 2b shown in Fig. 14, and the possibility of a short circuit caused by the moisture w can be reduced. Also, if the terminals 50a-50c and the resin material 6 peel off at or near the interface and cracks occur, the cracks are difficult to repair, and the possibility of a short circuit caused by the moisture w can be reduced.

[0077] In this manner, in the installation structure of the terminals 50a to 50c of this embodiment, even if moisture w that has permeated from the opposing circuit or substrate of the wire 4 enters through the gap G on the solder material 5 side and the adhesive 3 side, the creepage distance between adjacent locations on the terminal installation surfaces 52a to 52c can be increased to prevent short circuits, thereby reducing the possibility of dielectric breakdown occurring between the terminals 10 of the pressure sensor 100.

[0078] Here, although not shown in the drawings, it goes without saying that this embodiment may be combined with one or more of the above-mentioned first to third embodiments.

[0079] <Fifth embodiment of terminal structure> FIG. 12 is a diagram showing an example of a terminal connection structure of a pressure sensor including the terminal structure according to the fifth embodiment of the present invention.

[0080] In FIG. 12(a), in the pressure sensor 100, similarly to the above-described embodiment, terminals (terminal portions) 60a to 60c to which core wires 4e of electric wires 4 for input / output to the pressure sensor chip are soldered for conductive connection are arranged in parallel on a terminal block 62 in a connector case 102A, and the connector case 102A is filled with resin material 6 and resin molded so as to surround the entire terminals 60a to 60c, thereby ensuring waterproofing of the terminals 60a to 60c.

[0081] The terminal block 62 is produced such that the terminals 60a to 60c are inserted or insert-molded into a terminal installation surface 62b at the same level in the longitudinal direction (Z direction), and gaps are sealed with an adhesive 3 or the terminals are fixed with the adhesive 3.

[0082] In contrast, as shown in FIG. 12(b), the central terminal 60b is fixed in a so-called in-plane offset position in which the widthwise extension surface 60e of the terminal surface 60f is arranged in parallel so as to be shifted in the vertical direction relative to the adjacent direction from the extension surfaces 60e of the terminals 60a, 60c on both sides, i.e., in the Y direction.

[0083] In other words, the terminals 60a to 60c are disposed on the terminal mounting surface 62b at so-called Y-direction offset positions in a plane, which are staggered in the Y direction perpendicular to the parallel X direction, and are disposed such that the creepage distance in the X direction + Y direction between adjacent portions is larger than the adjacent spacing on the terminal mounting surface 2b (the adjacent spacing only in the X direction when viewed from the front perpendicular to the parallel direction).

[0084] 12(c), even if a gap G is formed between the solder material 5 or adhesive 3 and the resin material 6 and the terminals 60a-60c communicate with each other, the creepage distance between the installation locations on the terminal installation surface 62b can be made larger (longer) than between the terminals 1 on the terminal installation surface 2b shown in Fig. 14, and the possibility of a short circuit caused by the moisture w can be reduced. In addition, even if the terminals 60a-60c and the resin material 6 peel off at or near the interface and cracks occur, the cracks are difficult to repair, and the possibility of a short circuit caused by the moisture w can be reduced.

[0085] In this way, even in the installation structure of the terminals 60a to 60c of this embodiment, even if moisture w that has permeated from the opposing circuit of the wire 4 or the substrate enters through the gap G on the solder material 5 side and the adhesive 3 side, the creepage distance between adjacent locations on the terminal installation surface 62b can be increased to prevent short circuits, and the possibility of dielectric breakdown occurring between the terminals 10 of the pressure sensor 100 can be reduced.

[0086] Here, although not shown in the drawings, it goes without saying that this embodiment may be combined with one or more of the above-mentioned first to fourth embodiments.

[0087] In this embodiment, a pressure sensor has been used as an example, however, the present invention is not limited to pressure sensors and can be applied to other devices such as pressure switches, solenoid valve coils, relay connectors, and other devices that require general waterproofing, in which terminals and electric wires are soldered together and housed inside a waterproof cover, and a resin material is filled inside the waterproof cover.

[0088] The scope of the present invention is not limited to the exemplary embodiments shown and described, but includes all embodiments that achieve the same effect as the object of the present invention. Moreover, the scope of the present invention is not limited to the combination of inventive features defined by each claim, but may be defined by any desired combination of specific features among all the respective disclosed features. [Explanation of symbols]

[0089] 1, 10, 20, 30, 50a~50c, 60a~60c……Terminal 2, 52, 62...terminal block 2b, 52a~52c, 62b...Terminal installation surface 3. Glue 4...Electric wire 4e……Core wire 5...Solder material 5m...molten solder 6...Resin material 10a...Soldering area 10s……side 10u, 50u, 60u...terminal part 13...Opening 14, 15...Notch 21...Plating 30n...adjacent area 41...Mask material 45...soldering iron 100...Pressure sensor 101A……Connector 101B...Sensor element 102A……Connector case 102B...Sensor case G...gap w……Moisture

Claims

1. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation, the terminal portion is bonded and fixed to the terminal installation surface by an adhesive, The terminal portion has an end side that is a soldering area for the conductive material, and a limiting portion is formed that limits the extension of the molten solder from the soldering area toward the adjacent terminal installation surface, thereby achieving close contact of the resin mold with the terminal portion between the soldering area and the adhesive, thereby avoiding dielectric breakdown between the terminal portions on the terminal installation surface side that occurs when a gap opens between the solder surface of the soldering area and the resin mold that may form on the adhesive surface on the terminal installation surface side.

2. 2. The terminal structure according to claim 1, wherein the limiting portion is formed narrower than the soldering area of ​​the terminal portion to limit the molten solder from extending toward the terminal installation surface.

3. The terminal structure according to claim 2, characterized in that the limiting portion has an opening formed between both widthwise sides of the terminal portion, or a notch formed on one or both widthwise sides of the terminal portion, making the limiting portion narrower than the soldering area.

4. The terminal structure according to claim 1, characterized in that the limiting portion is formed such that an area adjacent to the soldering area of ​​the terminal portion has a surface that is incompatible with the molten solder, thereby limiting the molten solder from extending toward the terminal installation surface.

5. 5. The terminal structure according to claim 1, wherein the soldering area of ​​the terminal portion has a surface that is compatible with the molten solder.

6. 6. The terminal structure according to claim 1, wherein the terminal portion has a surface in which an area adjacent to the soldering area is in close contact with the resin mold.

7. A method for manufacturing a terminal structure, comprising: a terminal portion to which a conductive material is electrically connected by soldering with molten solder, the terminal portion being disposed on a terminal installation surface; and a resin molding is applied to surround the terminal portion together with the conductive material to ensure insulation, the method comprising the steps of: The terminal portion is bonded and fixed to the terminal installation surface by an adhesive, A method for manufacturing a terminal structure, characterized in that the molten solder is restricted from extending from the soldering area toward the terminal installation surface so that the end side of the terminal portion becomes the soldering area of ​​the conductive material, and tight contact between the resin mold and the terminal portion between the soldering area and the adhesive is achieved, thereby avoiding insulation breakdown between the terminal portions on the terminal installation surface side caused by a gap between the solder surface of the soldering area and the resin mold that may form on the adhesive surface on the terminal installation surface side, and soldering the conductive material to the terminal portion to establish a conductive connection.

8. preparing a terminal portion having a limiting portion formed thereon that limits the extension of the molten solder from the soldering area toward the terminal installation surface side so that an end side of the terminal portion becomes a soldering area of ​​the conductive material; 8. The method for manufacturing a terminal structure according to claim 7, wherein the conductive material is soldered to the terminal portion for electrical connection.

9. The method for manufacturing a terminal structure described in claim 7, characterized in that the conductive material is soldered to the terminal portion to establish an electrical connection while temporarily placing a mask that limits the extension of the molten solder from the soldering area, so that the end side of the terminal portion becomes the soldering area of ​​the conductive material.

10. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged in parallel on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation, The terminal portion is bonded and fixed to the terminal installation surface by an adhesive, and an end side of the terminal portion is a soldering area of ​​the conductive material, The terminal portions are arranged so that the creepage distance on the terminal installation surface between adjacent portions is greater than the adjacent spacing when the terminal portions are arranged in series in a straight line, thereby reducing the possibility of dielectric breakdown between the terminal portions on the terminal installation surface side compared to when the terminal portions are arranged in series, even when a gap between the solder surface of the soldering area and the resin mold, which may be formed on the adhesive surface on the terminal installation surface side, communicates.

11. 11. The terminal structure according to claim 10, wherein the terminal portions are arranged at offset positions in one or both of the Y direction parallel to the terminal installation surface and the Z direction perpendicular to the terminal installation surface, when the X direction is a series direction in which the installation locations of the terminal portions are aligned in a straight line, among the X direction, Y direction, and Z direction which are orthogonal to each other.

12. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged in parallel on a terminal installation surface, and the terminal parts are resin-molded together with the conductive material to ensure insulation, The terminal structure is a combination of the terminal structure according to any one of claims 1 to 6 and the terminal structure according to any one of claims 10 and 11.

13. A terminal structure in which a plurality of terminal portions to which a conductive material is electrically connected by soldering with molten solder are arranged on a terminal installation surface, and the terminal portions are surrounded by a resin mold together with the conductive material to ensure insulation, the terminal portion is bonded and fixed to the terminal installation surface by an adhesive, The terminal portion has an end side that is a soldering area of ​​the conductive material and a soldering area on a surface that is compatible with the molten solder, and achieves close contact with the terminal portion of the resin mold between the soldering area and the adhesive, thereby avoiding insulation breakdown between the terminal portions on the terminal installation surface side that would occur if a gap were to form between the solder surface of the soldering area and the resin mold, which may form on the adhesive surface on the terminal installation surface side, and which would result in insulation breakdown between the terminal portions on the terminal installation surface side.

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