Method, program, recording medium, and apparatus for analyzing resin molded products
Patent Information
- Application Number
- JP2022006020
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-01-18
- Publication Date
- 2025-03-13
- Estimated Expiration
- 2042-01-18
AI Technical Summary
【0022】 本発明によれば、上記のように、樹脂成形品の厚み方向における繊維配向の分布を合成することによって、合成された繊維配向に基づいて樹脂成形品の収縮量を解析する場合に、樹脂成形品の収縮量を正確に解析することができる。
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Abstract
Description
[Technical field]
[0001] The present invention relates to a resin molded product analysis method, a program, a recording medium, and a resin molded product analysis device for analyzing the amount of shrinkage of a resin molded product made of a resin material containing fiber. [Background technology]
[0002] 2. Description of the Related Art Conventionally, there has been known a shape prediction device that predicts the shape of an injection molded product using a fiber-reinforced resin (see, for example, Patent Document 1).
[0003] The above-mentioned Patent Document 1 discloses a shape prediction device that predicts the shape of an injection molded product using a fiber-reinforced resin by analyzing the fiber orientation of the fibers mixed in the resin. In this shape prediction device, a resin flow analysis model corresponding to the shape of an input injection molded product is divided into a finite number of resin flow analysis elements. Then, this shape prediction device acquires fiber orientation data of the fibers mixed in the resin by performing a resin flow analysis for each divided resin flow analysis element. Then, this shape prediction device converts the fiber orientation data by obtaining a composite vector of the fiber orientation data of a plurality of resin flow analysis elements in order to acquire fiber orientation data for each structural analysis element larger than the resin flow analysis element. The shape prediction device described in the above-mentioned Patent Document 1 predicts the shape of an injection molded product by performing a structural analysis using the composite fiber orientation data. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2008-120089 A Summary of the Invention [Problem to be solved by the invention]
[0005] Here, although it is not specified in the above Patent Document 1, when predicting the shape of an injection molded product (resin molded product) by synthesizing fiber orientations analyzed in a state where the product is divided into relatively fine elements, as in the shape prediction device described in the above Patent Document 1, it is possible to obtain the distribution of fiber orientation by dividing the resin molded product into relatively fine elements (virtual nodes) along the thickness direction, and to analyze the shrinkage amount while reducing the processing load by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product. However, since the resin molded product is solidified in sequence from the surface layer side in the thickness direction by being cooled in the mold, when the central part in the thickness direction is cooled and solidified, it is solidified while being influenced by the resin on the surface layer side that has already solidified. Therefore, when analyzing the shrinkage amount of a resin molded product based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product, there is a problem that the shrinkage amount analyzed based on the fiber orientation is different from the actual shrinkage amount, since the influence of solidification in sequence from the surface layer side in the thickness direction is not taken into account.
[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a resin molded product analysis method, program, recording medium, and resin molded product analysis device that are capable of accurately analyzing the amount of shrinkage of a resin molded product when analyzing the amount of shrinkage of a resin molded product based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product. [Means for solving the problem]
[0007] In order to achieve the above object, a resin molded product analysis method according to a first aspect of the present invention is a resin molded product analysis method for analyzing an amount of shrinkage of a resin molded product molded from a resin material containing fiber, the method comprising the steps of: dividing the resin molded product into a plurality of minute elements; setting a plurality of virtual nodes along a thickness direction of the resin molded product for each of the plurality of minute elements or for each of a plurality of nodes constituting the vertices of each minute element; acquiring an analytical orientation by analyzing fiber orientation for each of the plurality of virtual nodes of each minute element or for each of the nodes; and acquiring an analytical orientation for each of the plurality of virtual nodes of each minute element or for each of the nodes in order from a surface layer side of the resin molded product. The method includes the steps of: calculating a corrected orientation for analyzing the amount of shrinkage by performing a calculation to correct the amount of shrinkage; analyzing the amount of shrinkage of each of the multiple microelements or multiple nodes based on the corrected orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage at each of the analyzed multiple microelements or multiple nodes, wherein the step of calculating the corrected orientation includes a step of calculating a corrected orientation at each of the multiple virtual nodes of each microelement or each node by performing a calculation to correct the analysis orientation based on the correction result at a virtual node on the surface side of the microelement or each node.
[0008] In the resin molded product analysis method according to the first aspect, as described above, a correction orientation for analyzing the shrinkage amount is calculated by performing a calculation to correct the analytical orientation in each of the multiple virtual nodes of each microelement or each node in order from the surface layer side of the resin molded product. Then, a correction orientation is calculated by performing a calculation to correct the analytical orientation based on the correction result in the virtual node on the surface layer side of each microelement or each node in order from the surface layer side of each microelement or each node. As a result, a correction calculation is performed based on the correction result in the virtual node on the surface layer side of each microelement or each node in order from the surface layer side of the resin molded product for the analytical orientation, which is the fiber orientation analyzed in each of the multiple virtual nodes of each microelement or each node, so that the analyzed fiber orientation (analysis orientation) can be corrected taking into account the influence of the resin material solidifying in order from the surface layer side. Therefore, the shrinkage amount of the resin molded product can be analyzed by synthesizing the distribution of the fiber orientation corrected taking into account the influence of the resin material solidifying in order from the surface layer side. As a result, by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product, the amount of shrinkage of the resin molded product can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation.
[0009] In the resin molded product analysis method according to the first aspect, the step of acquiring the analysis orientation preferably includes a step of acquiring a target analysis orientation, which is an analysis orientation at a target virtual node, which is one virtual node among the plurality of virtual nodes, at a target virtual node, and the step of calculating the correction orientation includes a step of calculating a target correction orientation, which is a correction orientation at a target virtual node, by performing a calculation to correct the target analysis orientation based on an adjacent correction orientation, which is a correction orientation calculated at an adjacent virtual node adjacent to the surface layer side of the target virtual node among the plurality of virtual nodes, and a step of repeating the step of calculating the target correction orientation at each of the plurality of virtual nodes in order from the surface layer side of the resin molded product. With this configuration, at each of the plurality of virtual nodes set in the thickness direction of the generated resin molded product, the correction orientation can be calculated from the surface layer side toward the inside, layer by layer, using the correction result at the virtual node adjacent to the surface layer side. Therefore, compared to the case where the correction results at all virtual nodes on the surface layer side are used at each of the plurality of virtual nodes, the number of virtual nodes used to calculate the correction orientation can be reduced, and therefore correction to the analysis orientation for analyzing the amount of shrinkage can be easily performed. As a result, by using the correction results at the adjacent virtual nodes on the surface layer side, the amount of shrinkage of the resin molded product can be easily and accurately analyzed based on the synthesized corrected fiber orientation.
[0010] In this case, the step of calculating the target correction orientation preferably includes a step of calculating the target correction orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node. Here, when the layer adjacent to the surface layer side is cooled and solidified first, it is considered that a difference occurs between the actual shrinkage amount and the shrinkage amount calculated based on the analyzed fiber orientation due to the difference in elastic modulus with the adjacent layer that has already solidified. In consideration of this, in the present invention, the target correction orientation is calculated by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node. With this configuration, in addition to the correction orientation at the virtual node adjacent to the surface layer side, the elastic modulus at the virtual node adjacent to the surface layer side can also be taken into consideration to correct the analysis orientation. Therefore, the analysis orientation, which is the fiber orientation analyzed to analyze the shrinkage amount, can be corrected more accurately. As a result, when the shrinkage amount is analyzed based on the correction orientation, which is the corrected fiber orientation, the shrinkage amount can be analyzed more accurately and precisely.
[0011] In the resin molding analysis method for calculating the target analysis orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node, the step of calculating the target correction orientation preferably includes a step of calculating a correction coefficient based on the elastic modulus of the resin material at the adjacent virtual node and the temperature difference between the target virtual node and the adjacent virtual node, and a step of performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the correction coefficient. With this configuration, since the elastic modulus of the resin material changes depending on the temperature, the analytical orientation can be corrected more accurately to analyze the amount of shrinkage while considering the influence caused by the difference in the elastic modulus with the adjacent layer that has already solidified by using the correction coefficient calculated based on the temperature difference with the virtual node adjacent to the surface layer side and the elastic modulus at the adjacent virtual node. As a result, when the amount of shrinkage is analyzed by synthesizing the correction orientation that is the corrected fiber orientation, the amount of shrinkage can be analyzed more accurately and precisely.
[0012] In this case, preferably, the step of performing a calculation to correct the target analysis orientation includes a step of performing a calculation to correct the target analysis orientation by calculating an average of the target analysis orientation and an adjacent correction orientation weighted by a correction factor. In this configuration, the calculation to correct the analysis orientation can be performed more easily by calculating an average of the adjacent correction orientation weighted by a correction factor. As a result, the shrinkage amount can be more easily analyzed based on the correction orientation, which is the corrected analysis orientation.
[0013] In the resin molded product analysis method according to the first aspect, the step of analyzing the shrinkage amount preferably includes a step of analyzing the shrinkage amount of each of the multiple microelements or multiple nodes based on an average of the corrected orientations calculated at each of the multiple virtual nodes of each microelement or each node, and analyzing the shrinkage amount of the resin molded product based on the shrinkage amount at each of the analyzed multiple microelements or multiple nodes. With this configuration, it is possible to easily obtain the fiber orientation synthesized in the thickness direction by obtaining the average of the corrected orientations calculated at each virtual node. Therefore, it is possible to easily obtain the corrected orientation synthesized for each microelement or each node based on the corrected orientation, so that it is possible to easily analyze the shrinkage amount for each microelement or each node. As a result, it is possible to easily and accurately analyze the shrinkage amount of the resin molded product, taking into account the influence of the resin material solidifying in order from the surface layer side.
[0014] In the resin molded product analysis method according to the first aspect, the step of setting a plurality of virtual nodes preferably includes a step of setting an even number of virtual nodes along the thickness direction of the resin molded product in each of a plurality of infinitesimal elements or a plurality of nodes. With this configuration, since an even number of virtual nodes are set, calculations from one side and calculations from the other side in the thickness direction are performed the same number of times, so that the calculation of the correction orientation can be performed in sequence from the surface layer side for all of the plurality of virtual nodes. As a result, unlike the case where an odd number of virtual nodes are set, similar correction calculations can be performed in sequence from both one side and the other side for all virtual nodes without any remainder, so that the correction calculation can be performed more easily for all virtual nodes.
[0015] In the resin molded product analysis method according to the first aspect, the step of analyzing the shrinkage amount preferably includes a step of analyzing the shrinkage amount in the flow direction of the resin material and the orthogonal direction orthogonal to the flow direction in a plane along the surface of the resin molded product at each of the multiple microelements or multiple nodes based on the corrected orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzing the shrinkage amount in the flow direction and the orthogonal direction of the resin molded product based on the shrinkage amount in the flow direction and the orthogonal direction at each of the analyzed multiple microelements or multiple nodes. With this configuration, a calculation is performed to correct the fiber orientation in two directions, the flow direction and the orthogonal direction of the resin material, so that the processing load required for the correction calculation can be reduced compared to the case where the fiber orientation is corrected in three directions, including the flow direction, the orthogonal direction, and the thickness direction. As a result, the processing load when analyzing the shrinkage amount in the resin molded product can be reduced by analyzing the shrinkage amount in two directions, the flow direction and the orthogonal direction, based on the calculated corrected orientation.
[0016] A program according to a second aspect of the present invention causes a computer to execute the resin molding analysis method according to the first aspect.
[0017] In a program according to a second aspect of the present invention, by causing a computer to execute the resin molded product analysis method according to the first aspect, the distribution of fiber orientation in the thickness direction of the resin molded product is synthesized, and when the shrinkage amount of the resin molded product is analyzed based on the synthesized fiber orientation, the shrinkage amount of the resin molded product can be accurately analyzed.
[0018] A storage medium according to a third aspect of the present invention has the program according to the second aspect recorded thereon and is computer-readable.
[0019] A storage medium according to a third aspect of the present invention has a program according to the second aspect recorded thereon and is computer-readable, so that when the distribution of fiber orientation in the thickness direction of a resin molded product is synthesized and the amount of shrinkage of the resin molded product is analyzed based on the synthesized fiber orientation, the amount of shrinkage of the resin molded product can be accurately analyzed.
[0020] A resin molded product analysis device according to a fourth aspect of the present invention is a resin molded product analysis device that analyzes the amount of shrinkage of a resin molded product molded from a resin material containing fiber, and includes a microelement division unit that divides the resin molded product into a plurality of microelements, a virtual node setting unit that sets a plurality of virtual nodes along the thickness direction of the resin molded product in each of the plurality of microelements or in each of a plurality of nodes constituting the vertices of each microelement, an analytical orientation acquisition unit that acquires an analytical orientation by analyzing the orientation of fibers in each of the microelements or in each of the plurality of virtual nodes of each node, and a correction unit that corrects the analytical orientation in sequence from the surface layer side of the resin molded product in each of the microelements or in each of the plurality of virtual nodes of each node. The system includes a correction orientation calculation unit that calculates a correction orientation for analyzing the amount of shrinkage by performing a calculation to calculate a correction orientation for analyzing the amount of shrinkage, and a shrinkage amount analysis unit that analyzes the amount of shrinkage of each of the multiple microelements or multiple nodes based on the correction orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzes the amount of shrinkage of the resin molded product based on the shrinkage amount at each of the analyzed multiple microelements or multiple nodes, where the correction orientation calculation unit is configured to calculate the correction orientation at each of the multiple virtual nodes of each microelement or each node by performing a calculation to correct the analysis orientation based on the correction result at the virtual node on the surface side of the microelement or each node.
[0021] The resin molded product analysis device according to the fourth aspect of the present invention, as described above, calculates the corrected orientation for analyzing the shrinkage amount by performing a calculation to correct the analytical orientation in each of the multiple virtual nodes of each microelement or each node in order from the surface layer side of the resin molded product. Then, calculates the corrected orientation by performing a calculation to correct the analytical orientation based on the correction result in the virtual node on the surface layer side of the microelement or each node in order from the surface layer side of the resin molded product. As a result, the analytical orientation, which is the fiber orientation analyzed in each of the multiple virtual nodes of each microelement or each node, is corrected based on the correction result in the virtual node on the surface layer side of the resin molded product in order from the surface layer side of the resin molded product, so that the analyzed fiber orientation (analysis orientation) can be corrected taking into account the influence of the resin material solidifying in order from the surface layer side. Therefore, the shrinkage amount of the resin molded product can be analyzed by synthesizing the distribution of the fiber orientation corrected taking into account the influence of the resin material solidifying in order from the surface layer side. As a result, by synthesizing the distribution of fiber orientation in the thickness direction of a resin molded product, it is possible to provide a resin molded product analysis device that can accurately analyze the amount of shrinkage of a resin molded product when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation. Effect of the Invention
[0022] According to the present invention, by synthesizing the distribution of fiber orientation in the thickness direction of a resin molded product as described above, the amount of shrinkage of the resin molded product can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation. [Brief description of the drawings]
[0023] [Figure 1] 1 is a block diagram showing a configuration of an analysis device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic diagram showing division of minute elements of a resin molded product. [Diagram 3] FIG. 13 is a schematic diagram for explaining the setting of a virtual node in one infinitesimal element. [Figure 4]FIG. 2 is a schematic diagram showing fiber orientation in a resin molded product. [Diagram 5] FIG. 13 is a diagram for explaining an analytical orientation and a correction orientation. [Figure 6] FIG. 13 is a diagram for explaining calculation of a corrected orientation. [Figure 7] FIG. 1 is a flowchart illustrating a resin molded product analysis method according to an embodiment. [Figure 8] FIG. 11 is a flowchart for explaining details of a method for correcting analytical orientation according to one embodiment. [Figure 9] FIG. 13 is a schematic diagram for explaining setting of a virtual node at one node according to a modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[0025] (Configuration of analysis device) The configuration of an analysis device 100 according to the present embodiment will be described with reference to Figures 1 to 6. The analysis device 100 is an example of the "resin molded product analysis device" and the "computer" in the claims.
[0026] The analysis device 100 is configured to be capable of analyzing the shape (warpage) of a resin molded product 1 (see FIG. 2) by analyzing the amount of shrinkage of the resin molded product 1 (see FIG. 2) made of a resin material containing fibers (reinforced fibers). The resin material for molding the resin molded product 1 is, for example, a fiber-reinforced resin made by compounding a thermoplastic resin such as PP resin or ABS resin with fibers such as glass fiber or carbon fiber. The resin molded product 1 is molded by injection molding in which a resin material is filled into a mold. The resin molded product 1 may include an insert molded product integrally molded with a metal part or the like.
[0027] As shown in Fig. 1, the analysis device 100 includes one or more processors 10, such as a central processing unit (CPU), and a storage unit 20 including a read only memory (ROM), a random access memory (RAM), and a storage device. The storage unit 20 is, for example, a hard disk drive or a semiconductor storage device. The analysis device 100 is a personal computer (PC) used by an operator who analyzes the amount of shrinkage of the resin molded product 1. Note that a part or all of the processing performed by the analysis device 100 executing a program 21 may be performed by hardware such as a dedicated arithmetic circuit.
[0028] The analysis device 100 performs analysis of the amount of shrinkage of the resin molded product 1 by having the processor 10 execute a program 21 stored in the storage unit 20. The program 21 is CAE (Computer Aided Engineering) software for performing analysis by simulating molding of a resin material. The program 21 may be read from the recording medium 101 or provided from an external server or the like via a transmission path such as a network such as the Internet or a LAN (Local Area Network). The recording medium 101 is a computer-readable recording medium such as an optical disk, a magnetic disk, or a non-volatile semiconductor memory, and the program 21 is recorded therein.
[0029] In addition to the program 21, the storage unit 20 stores various analysis data 22 used to analyze the amount of shrinkage. The analysis data 22 includes, for example, thermophysical properties of the resin material, such as viscosity, elastic modulus, and thermal conductivity, and material property data, such as a state diagram. The analysis data 22 also includes various parameters used in analyzing the amount of shrinkage. The various parameters of the analysis data 22 include, for example, boundary conditions acquired based on an input operation by an operator to an operation unit (not shown). The boundary conditions include the gate position, injection speed, resin temperature, and mold temperature.
[0030] Moreover, the analysis device 100 includes a display unit 30 such as a liquid crystal display device, and a reading unit 40 for reading the program 21 and various data from the recording medium 101. The reading unit 40 is a reader device or the like according to the type of the recording medium 101. Moreover, the analysis data 22 stored in the memory unit 20 may be read by the reading unit 40 from the recording medium 101 created by an operator, or may be created by the operator in an external server or the like and acquired from the external server via a transmission path.
[0031] (Processor configuration) In this embodiment, the processor 10 includes an infinitesimal element division unit 11, a virtual node setting unit 12, an analytical orientation acquisition unit 13, a correction orientation calculation unit 14, and a shrinkage amount analysis unit 15. Specifically, the processor 10 as hardware is configured to include the infinitesimal element division unit 11, the virtual node setting unit 12, the analytical orientation acquisition unit 13, the correction orientation calculation unit 14, and the shrinkage amount analysis unit 15 as functional blocks of the software (program 21).
[0032] As shown in FIG. 2, in this embodiment, the minute element division unit 11 of the processor 10 divides the resin molded product 1 into a plurality of minute elements. Specifically, the analysis device 100 acquires shape data of the resin molded product 1 by acquiring three-dimensional CAD information of the resin molded product 1 based on an input operation by an operator who analyzes the resin molded product 1. Then, the minute element division unit 11 divides the three-dimensional shape data of the resin molded product 1 into a plurality of minute elements (meshes) in order to generate an analysis model of the resin molded product 1. Furthermore, the minute element division unit 11 divides the resin molded product 1 in the thickness direction of each portion of the resin molded product 1 so that the number of minute elements is one. Furthermore, one minute element has a rectangular parallelepiped shape.
[0033] For example, in a portion of the resin molded product 1 that is shaped to extend along the XY plane (part a in FIG. 2), the thickness direction is the Z direction. Therefore, the microelement division unit 11 divides the resin molded product 1 into a plurality of microelements so that the number of microelements in the Z direction is at least one (one layer). The resin molded product 1 of this embodiment is molded by allowing the resin material to flow from one sprue part S. Therefore, in part a, the resin material is filled into the mold that molds the resin molded product 1 while flowing along the X1 direction.
[0034] In each part of the resin molded product 1, the flow direction of the resin is defined as MD (Machine Direction), and the orthogonal direction perpendicular to MD in a plane along the surface of the resin molded product 1 (in a plane perpendicular to the thickness direction) is defined as TD (Transverse Direction). For example, in part a of Fig. 2, MD is the X direction in the figure, and TD is the Y direction in the figure. In addition, the processor 10 sets MD, TD, and the thickness direction in each of the multiple microelements based on the acquired shape data of the resin molded product 1.
[0035] 3, in this embodiment, the virtual node setting unit 12 of the processor 10 sets a plurality of virtual nodes P along the thickness direction of the resin molded product 1 in each of the plurality of infinitesimal elements divided by the infinitesimal element dividing unit 11. Specifically, the virtual node setting unit 12 sets an even number (e.g., 20) of virtual nodes P along the thickness direction of the resin molded product 1 in each of the plurality of infinitesimal elements of the resin molded product 1. For example, in one infinitesimal element 1a of the plurality of infinitesimal elements included in part a of FIG. 2, the virtual node setting unit 12 sets 20 virtual nodes P1 to P along the Z direction. 20 Here, the virtual node P1 is set so as to be located on the surface of the resin molded product 1 in the Z2 direction. 20 is set so as to be located on the surface of the resin molded product 1 on the Z1 direction side.
[0036] Obtaining fiber orientation (analysis orientation) In this embodiment, the analytical orientation acquisition unit 13 of the processor 10 analyzes the orientation of fibers included in the resin material at each of the multiple virtual nodes P of each microelement set by the virtual node setting unit 12. Specifically, the analytical orientation acquisition unit 13 executes the program 21 to simulate the flow state of the resin material at each of the multiple virtual nodes P based on the analysis data 22 stored in the storage unit 20. Then, the analytical orientation acquisition unit 13 calculates a three-dimensional fiber orientation tensor at each of the multiple virtual nodes P. The fiber orientations in the MD, TD, and thickness directions are calculated from the three-dimensional fiber orientation tensor. In detail, the analytical orientation acquisition unit 13 executes the program 21 to calculate flow data such as the resin temperature, resin pressure, and flow speed of the resin material during injection molding, thereby calculating (analyzing) the fiber orientation at each of the multiple virtual nodes P. Then, the analytical orientation acquisition unit 13 acquires the analyzed fiber orientation as an analytical orientation Q (see FIG. 5). The analyzed fiber orientation, ie, analytical orientation Q, is a simulation of the fiber orientation in the actual resin molded product 1.
[0037] As shown in FIG. 4, the fiber-containing resin molded product 1 has a bias in fiber orientation in the flow direction (MD), transverse direction (TD), and thickness direction of the resin material. The fibers (reinforcing fibers) contained in the resin molded product 1 have an elongated shape, and the ratio of fibers oriented in MD increases due to the shear force of the resin material when it flows in the mold. In addition, in the resin molded product 1, the MD orientation becomes large (strong) on the surface side (surface side) in the thickness direction, and the fiber direction (fiber orientation) becomes random on the center side (inside) in the thickness direction. For example, in the fiber orientation (fiber orientation) of the microelement 1a in FIG. 3, the ratio of fibers arranged along the X direction, which is the MD, on the surface side (near the surface) is relatively high.
[0038] As shown in Fig. 5, in this embodiment, the analytical orientation Q acquired by the analytical orientation acquisition unit 13 is expressed by a three-dimensional fiber orientation tensor. The fiber orientation vectors in the MD, TD, and thickness directions are calculated from the three-dimensional fiber orientation tensor. The value on the vertical axis in Fig. 5 indicates the magnitude value of the fiber orientation vector (MD) in the resin material. In the fiber orientation tensor, the closer the value is to 1.0, the higher the ratio (probability) of fibers arranged along the MD (X direction). And the closer the value is to 0.0, the higher the ratio (probability) of fibers arranged along the TD (Y direction) or thickness direction.
[0039] <Analysis Orientation Correction> Here, in molding the resin molded product 1, the resin material of the resin molded product 1 is gradually cooled and solidified in the mold starting from the surface layer side in the thickness direction. Therefore, in molding the resin molded product 1, the surface layer side portion is cooled and solidified first, and the center side (inner side) portion in the thickness direction shrinks while being influenced by the surface layer side portion. Therefore, when analyzing the shrinkage amount of the resin molded product 1 based on the fiber orientation (analysis orientation Q), it is necessary to not only analyze the fiber orientation in each portion of the resin molded product 1, but also to analyze the shrinkage amount taking into consideration the influence of the resin material solidifying starting from the surface layer side.
[0040] 5 and 6, the corrected orientation calculation unit 14 of the processor 10 is configured to calculate the corrected fiber orientation R at each of the multiple virtual nodes P by correcting the analytical orientation Q acquired by the analytical orientation acquisition unit 13 in order to analyze the shrinkage amount of the resin molded product 1. Specifically, in this embodiment, the corrected orientation calculation unit 14 calculates the corrected orientation R for analyzing the shrinkage amount at each of the multiple virtual nodes P of each minute element by performing a calculation to correct the analytical orientation Q in order from the surface layer side of the resin molded product 1. Also, in this embodiment, the corrected orientation calculation unit 14 performs a calculation to correct the analytical orientation Q at each of the multiple virtual nodes P of each minute element based on the correction result at the virtual node P on the surface layer side of the minute element.
[0041] As shown in FIG. 6, for example, in the infinitesimal element 1a in FIG. 3, the nth virtual node P n The analytical orientation Q obtained in n Correct the orientation R by correcting n The calculation of the nth virtual node P n are the first to tenth virtual nodes P1 to P2 counting from the Z2 direction. 10 That is, the n-1th virtual node P n-1 is the nth virtual node P n The n-1th virtual node P n-1 Analytical orientation Q in analytical orientation Q n-1 , the correction orientation R is the correction orientation R n-1 In addition, the virtual node P n and virtual node P n-1 are examples of the "target virtual node" and the "adjacent virtual node" in the claims, respectively. And the analytical orientation Q n is an example of the "target analysis orientation" in the claims. Also, the correction orientation R n and the correction orientation R n-1 are examples of a "target corrective orientation" and an "adjacent corrective orientation" in the claims, respectively.
[0042] The corrected orientation calculation unit 14 calculates the virtual node P n Correction orientation R n When calculating, the virtual node P n Virtual node P adjacent to the surface side n-1 The correction result in the corrected orientation R n-1 Based on this, the virtual node P n Analysis of orientation Q n A calculation is performed to correct the virtual node P n Correction orientation R n The calculation is done by using the correction coefficient k and the virtual node P adjacent to the surface layer side n-1 Correction orientation R n-1 This is expressed as equation (1).
number
[0043] In this embodiment, the corrected orientation calculation unit 14 calculates the virtual node P based on the flow data (resin material analysis results) from the analysis orientation acquisition unit 13. n-1 and virtual node P n and the temperature difference between the virtual node P n-1 and the elastic modulus of the resin material in. Specifically, in this embodiment, the correction coefficient k is calculated by the calculation of formula (2).
number
[0044] In detail, the analysis orientation acquisition unit 13 executes the program 21 to simulate the injection molding of the resin molded product 1 at each of the multiple virtual nodes P, thereby analyzing (calculating) the resin temperature at any of the following points during the molding process: when dwelling is completed, when VP (velocity pressure) is switched from the filling process to the dwelling process, or when the mold is released. Then, based on the resin temperature calculated at each of the multiple virtual nodes P, the analysis orientation acquisition unit 13 calculates the resin temperature at each of the multiple virtual nodes P. n and virtual node P n-1 and is acquired as the adjacent layer temperature difference. The solidification temperature is an inherent value specific to the resin material, and is acquired based on the material property data included in the analysis data 22 stored in the storage unit 20. Similarly, the elastic modulus of the resin material is calculated based on the material property data included in the analysis data 22 stored in the storage unit 20. The analysis data 22 stored in the storage unit 20 includes a conditional formula for calculating the elastic modulus of the resin material of the resin molded product 1. The elastic modulus of the resin material forming the resin molded product 1 changes in value so as to increase approximately linearly in proportion to the decrease in temperature. Therefore, the correction coefficient k becomes a value greater than 1, and the virtual node P n and virtual node P n-1 The larger the temperature difference (the larger the difference in elastic modulus) between the virtual node P n and virtual node P n-1 The temperature difference between the adjacent layer (virtual node P n-1 ) is calculated to be a size that takes into account the elastic modulus of the
[0045] In addition, the virtual node P n is the virtual node P1~P 10 However, the virtual node P 11 ~P 20 Even in the virtual node P n In this case, the virtual node adjacent to the surface layer is the virtual node P n+1 In this embodiment, the corrected orientation calculation unit 14 calculates the virtual node P n Correction orientation R nThe correction orientation calculation unit 14 is configured to calculate the correction orientation R at each of the plurality of virtual nodes P by repeating a calculation similar to that of the calculation of (a) at each of the plurality of virtual nodes P for each infinitesimal element in order from the surface layer side of the resin molded product 1. For example, the correction orientation calculation unit 14 calculates the correction orientation R at each of the 20 virtual nodes P1 to P included in the infinitesimal element 1a. 20 For virtual nodes P1, P2, P3, . . ., P 10 Analysis orientations Q1 to Q 10 By performing a calculation to correct the correction orientations R1 to R 10 Calculate the virtual node P 20 , P 19 , P 18 , , P 11 Analysis of orientation Q 20 ~Q 11 By performing a calculation to correct the correction orientation R 20 ~R 11 Since the virtual nodes P1 and P2 are on the outermost layer side, the analytical orientations Q1 and Q 20 However, the correction orientations R1 and R 20 Then, at the second or subsequent virtual node P from the surface side, the corrected orientation R is calculated by the calculation shown in formula (1).
[0046] Analysis of shrinkage amount In this embodiment, the shrinkage amount analysis unit 15 of the processor 10 analyzes the shrinkage amount of each of the multiple microelements based on the average of the corrected orientations R calculated at each of the multiple virtual nodes P of each microelement. The shrinkage amount analysis unit 15 is also configured to analyze the shrinkage amount in at least two directions of the flow direction (MD), the perpendicular direction (TD), and the thickness direction of the resin material for each of the multiple microelements.
[0047] For example, the shrinkage amount analysis unit 15 calculates the shrinkage amount of the 20 virtual nodes P1 to P 20 The correction orientations R1 to R 20The shrinkage amount analysis unit 15 then calculates the shrinkage amount in the infinitesimal element 1a by taking the calculated average value as the ratio of the shrinkage amount (shrinkage rate) between the flow direction (MD) and the orthogonal direction (TD). For example, the calculated corrected orientations R1 to R 20 is 0.8, the amount of shrinkage in the infinitesimal element 1a is calculated so that the ratio of the amount of shrinkage in MD to the amount of shrinkage in TD becomes 0.8:0.2.
[0048] Then, the shrinkage amount analysis unit 15 (processor 10) analyzes the shrinkage amount in the flow direction (MD) and the orthogonal direction (TD) of the resin molded product 1 based on the shrinkage amount in the flow direction (MD) and the orthogonal direction (TD) of each of the analyzed microelements. As described above, the processor 10 (shrinkage amount analysis unit 15) of the analysis device 100 analyzes the shape (warpage deformation) of the resin molded product 1 by analyzing the shrinkage amount of the resin molded product 1 taking into consideration the fiber orientation due to the flow of the resin material and the influence (difference in elastic modulus) due to the solidification of the resin material in sequence from the surface layer side.
[0049] The processor 10 is also configured to display the analysis results of the resin molded product 1 on the display unit 30. For example, the processor 10 displays the resin molded product 1 in a shape after analysis (shape after deformation) on the display unit 30 as the analysis result. The processor 10 is also configured to display the corrected orientation R calculated by the corrected orientation calculation unit 14 on the display unit 30 so that it is visible.
[0050] (Resin molded product analysis method) Next, a resin molded product analysis method using the analysis device 100 of this embodiment will be described with reference to Fig. 7. The resin molded product analysis method of this embodiment is a method for analyzing the amount of shrinkage of a resin molded product 1 that is molded from a resin material containing fibers. The resin molded product analysis method of this embodiment is implemented by causing the processor 10 of the analysis device 100 to execute a program 21.
[0051] First, in step S1, shape data of the resin molded product 1 is acquired, and various analysis data 22 used to analyze the amount of shrinkage are acquired (stored).
[0052] Next, in step S2, the resin molded article 1 is divided into a plurality of minute elements (meshes). Specifically, the shape data of the resin molded article 1 is divided into a plurality of minute elements, and an analytical model of the resin molded article 1 is generated.
[0053] Next, in step S3, in each of the plurality of infinitesimal elements, a plurality of virtual nodes P are set along the thickness direction of the resin molded product 1. For example, in the infinitesimal element 1a, an even number (20) of virtual nodes P1 to P 20 is set.
[0054] Next, in step S4, the fiber orientation is analyzed at each of the multiple virtual nodes P of each infinitesimal element to obtain an analytical orientation Q. For example, in the infinitesimal element 1a, the fiber orientation is analyzed at 20 virtual nodes P1 to P 20 One of the virtual nodes P n Analysis of orientation Q n is obtained.
[0055] Next, in step S5, a calculation is performed to correct the analytical orientation Q in each of the multiple virtual nodes P of each infinitesimal element, starting from the surface layer side of the resin molded product 1, thereby calculating a corrected orientation R for analyzing the amount of shrinkage. Specifically, a calculation is performed to correct the analytical orientation Q in each of the multiple virtual nodes P of each infinitesimal element, based on the correction result in the virtual node P on the surface layer side of the infinitesimal element itself, thereby calculating the corrected orientation R. The method of correcting the analytical orientation Q (method of calculating the corrected orientation R) will be described in detail later.
[0056] Next, in step S6, the shrinkage amounts in the flow direction (MD) and the orthogonal direction (TD) of each of the microelements are analyzed based on the average of the corrected orientations R calculated at each of the virtual nodes P of each of the microelements. Then, the shrinkage amounts in the MD and TD of the resin molded product 1 are analyzed based on the shrinkage amounts in the MD and TD of each of the analyzed microelements.
[0057] Next, in step S7, the analysis result of the amount of shrinkage of the resin molded article 1 is displayed on the display unit 30. Specifically, the shape of the resin molded article 1 after the analysis (the shape after deformation) is displayed on the display unit 30. In addition, the calculated corrected orientation R is displayed on the display unit 30 so as to be visible.
[0058] <Method of correcting analytical orientation> Next, a method for correcting the analytical orientation Q will be described in detail with reference to FIG. 8. As an example, a virtual node P n Analysis of orientation Q n The correction method will be described below. Note that n=1 to 20.
[0059] First, in step S51, 20 virtual nodes P1 to P 20 The virtual nodes P1 and P2 on the outermost side of the layer 20 In the cases of n=1 and 20, the analytical orientations Q1 and Q 20 However, the correction orientations R1 and R 20 is obtained as:
[0060] Next, in step S52, n=2 is set, and 20 virtual nodes P1 to P 20 The second virtual node P from the surface side n At the virtual node P n The virtual node P adjacent to the surface side of n-1 The elastic modulus of the resin material at the virtual node P n and virtual node P n-1 Based on the temperature difference between the virtual node P and the virtual node P, the correction coefficient k is calculated. nIn addition, when n = 11 to 19, the adjacent virtual node is the virtual node P n+1 It becomes.
[0061] Next, in step S53, the virtual node P n-1 The corrected orientation R calculated in n-1 Based on the correction coefficient k, the analytical orientation Q n Specifically, the analytical orientation Q n and the corrected orientation R weighted by the calculated correction coefficient k n-1 Analyze the orientation Q by calculating the average of n This results in a correction orientation R n-1 and virtual node P n-1 Based on the elastic modulus of the resin material in and the orientation Q n A calculation is performed to correct the corrected orientation R n is calculated.
[0062] Next, in step S54, steps S52 and S53 are repeated for each of the multiple virtual nodes P in order from the surface layer side of the resin molded product 1 (while changing the value of n). 10 Steps S52 and S53 are repeated in this order to obtain the corrected orientations R2 to R 10 Similarly, the virtual node P 19 Hereafter, virtual node P 18 , P 17 , , P 11 Steps S52 and S53 are repeated in this order to obtain the corrected orientation R 11 ~R 19 is calculated.
[0063] As described above, by executing steps S51 to S54, the 20 virtual nodes P n (Virtual nodes P1~P 20 ) Analysis orientation Q n (Analysis orientation Q1~Q20 ) is corrected to obtain the corrected orientation R n (Correction orientation R1~R 20 ) is calculated. The same process is carried out for each of the multiple infinitesimal elements of the resin molded product 1.
[0064] [Effects of this embodiment] In this embodiment, the following effects can be obtained.
[0065] In the resin molded product analysis method of the present embodiment, as described above, a calculation is performed to correct the analytical orientation Q in each of the multiple virtual nodes P of each minute element, starting from the surface layer side of the resin molded product 1, to calculate the corrected orientation R for analyzing the amount of shrinkage. Then, a calculation is performed to correct the analytical orientation Q in each of the multiple virtual nodes P of each minute element, based on the correction result (corrected orientation R) in the virtual node P on the surface layer side of the minute element, to calculate the corrected orientation R. As a result, a calculation is performed to correct the analytical orientation Q, which is the fiber orientation analyzed in each of the multiple virtual nodes P of each minute element, starting from the surface layer side of the resin molded product 1, based on the correction result in the virtual node P on the surface layer side of the minute element, to correct the analyzed fiber orientation (analysis orientation Q) taking into account the influence of the solidification of the resin material in sequence from the surface layer side. Therefore, the amount of shrinkage of the resin molded product 1 can be analyzed by synthesizing the distribution of the fiber orientation corrected taking into account the influence of the solidification of the resin material in sequence from the surface layer side. As a result, by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product 1, the amount of shrinkage of the resin molded product 1 can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product 1 based on the synthesized fiber orientation.
[0066] In this embodiment, as described above, one of the multiple virtual nodes P n (Target virtual node) At virtual node P n Analysis of orientation Q n (Target analysis orientation) is obtained. Then, virtual node P among multiple virtual nodes P is obtained. n The virtual node P adjacent to the surface side of n-1 Corrected orientation R calculated at (adjacent virtual node)n-1 Based on (adjacent correction orientation), the analysis orientation Q n By performing a calculation to correct the virtual node P n Correction orientation R n (Object corrected orientation) is calculated. Then, the corrected orientation R n The calculation of is repeated for each of the multiple virtual nodes P in order from the surface layer side of the resin molded product 1. As a result, for each of the multiple virtual nodes P set in the thickness direction of the generated resin molded product 1, the corrected orientation R can be calculated from the surface layer side toward the inside, layer by layer, using the correction result (corrected orientation R) for the virtual node P adjacent to the surface layer side. Therefore, for each of the multiple virtual nodes P, the number of virtual nodes P used to calculate the corrected orientation R can be reduced compared to the case where the correction results for all virtual nodes P on the surface layer side of the virtual node P are used, so that the correction of the analytical orientation Q for analyzing the shrinkage amount can be easily performed. As a result, by using the correction result for the virtual node P adjacent to the surface layer side, the shrinkage amount of the resin molded product 1 can be easily and accurately analyzed based on the synthesized corrected fiber orientation.
[0067] In addition, in this embodiment, as described above, the correction orientation R n-1 (adjacent correction orientation) and virtual node P n-1 Based on the elastic modulus of the resin material at (adjacent virtual nodes), the analytical orientation Q n By performing a calculation to correct the (target analysis orientation), the corrected orientation R n Here, when the layer adjacent to the surface layer side is cooled and solidified first, it is considered that a difference occurs between the actual shrinkage amount and the shrinkage amount calculated based on the analyzed fiber orientation due to the difference in elastic modulus between the layer adjacent to the surface layer side and the layer adjacent to the surface layer side that has already solidified. In consideration of this, in this embodiment, a corrected orientation R n-1 and virtual node P n-1 Based on the elastic modulus of the resin material in and the orientation Q n By performing a calculation to correct the correction orientation R nThis allows the analytical orientation Q to be corrected by taking into consideration the elastic modulus at the virtual node P adjacent to the surface layer side in addition to the corrected orientation R at the virtual node P adjacent to the surface layer side. Therefore, the analytical orientation Q, which is the fiber orientation analyzed to analyze the amount of shrinkage, can be corrected with higher accuracy. As a result, when the amount of shrinkage is analyzed based on the corrected fiber orientation R, the amount of shrinkage can be analyzed with higher accuracy.
[0068] In this embodiment, as described above, the virtual node P n-1 Elastic modulus of the resin material at (adjacent virtual node) and virtual node P n (Target virtual node) and virtual node P n-1 Based on the temperature difference between the n-1 Based on the (adjacent correction orientation) and the correction coefficient k, the analytical orientation Q n A calculation is performed to correct (target analysis orientation). As a result, since the elastic modulus of the resin material changes depending on the temperature, by using a correction coefficient k calculated based on the temperature difference with the adjacent virtual node P on the surface layer side and the elastic modulus at the adjacent virtual node P, it is possible to more accurately correct the analysis orientation Q to analyze the amount of shrinkage while considering the influence caused by the difference in the elastic modulus with the adjacent layer that has already solidified. As a result, when the amount of shrinkage is analyzed by synthesizing the corrected fiber orientation, the amount of shrinkage can be analyzed more accurately.
[0069] In this embodiment, as described above, the analytical orientation Q n (target analysis orientation) and the corrected orientation R weighted by the correction coefficient k n-1 (adjacent correction orientation) and the analytical orientation Q by calculating the average n This results in a correction orientation R weighted by the correction coefficient k. n-1 Analyze the orientation Q by calculating the average of n As a result, the corrected analytical orientation Q (analysis orientation Q n ) is the corrective orientation R (corrective orientation Rn ) the amount of shrinkage can be more easily analyzed.
[0070] In addition, in this embodiment, as described above, the shrinkage amount of each of the multiple microelements is analyzed based on the average of the corrected orientation R calculated at each of the multiple virtual nodes P of each microelement, and the shrinkage amount of the resin molded product 1 is analyzed based on the shrinkage amount of each of the analyzed multiple microelements. In this way, by obtaining the average of the corrected orientation R calculated at each of the virtual nodes P, the fiber orientation synthesized in the thickness direction can be easily obtained. Therefore, based on the corrected orientation R, the corrected orientation R synthesized for each microelement can be easily obtained, so that the shrinkage amount for each microelement can be easily analyzed. As a result, the shrinkage amount of the resin molded product 1 can be easily and accurately analyzed, taking into account the influence of the resin material solidifying in order from the surface layer side.
[0071] Furthermore, in this embodiment, as described above, an even number (e.g., 20) of virtual nodes P are set in each of the multiple infinitesimal elements along the thickness direction of the resin molded product 1. As a result, an even number of virtual nodes P are set, and by performing calculations from one side and the other side in the thickness direction the same number of times, it is possible to calculate the correction orientation R for all of the multiple virtual nodes P in order from the surface layer side. As a result, unlike the case where an odd number of virtual nodes P are set, similar correction calculations can be performed in order from both one side and the other side for all of the virtual nodes P without any remainder, so that the correction calculations can be performed more easily for all of the virtual nodes P.
[0072] In addition, in this embodiment, as described above, based on the corrected orientation R calculated at each of the multiple virtual nodes P of each microelement, the shrinkage amount in the flow direction (MD) of the resin material and the orthogonal direction (TD) perpendicular to the flow direction in the plane along the surface of the resin molded product 1 is analyzed for each of the multiple microelements, and the shrinkage amount in the flow direction and the orthogonal direction of the resin molded product 1 is analyzed based on the shrinkage amount in the flow direction and the orthogonal direction for each of the analyzed multiple microelements. As a result, since a calculation is performed to correct the fiber orientation (analysis orientation Q) in two directions, the flow direction and the orthogonal direction of the resin material, the processing load required for the correction calculation can be reduced compared to the case where the fiber orientation is corrected in three directions including the flow direction, the orthogonal direction, and the thickness direction. As a result, by analyzing the shrinkage amount in two directions, the flow direction and the orthogonal direction, based on the calculated corrected orientation R, the processing load in analyzing the shrinkage amount in the resin molded product 1 can be reduced.
[0073] In addition, in this embodiment, the program 21, the recording medium 101, and the analysis device 100 can accurately analyze the amount of shrinkage of the resin molded product 1 when analyzing the amount of shrinkage of the resin molded product 1 based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product 1, as in the above-mentioned resin molded product analysis method.
[0074] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.
[0075] For example, in the above embodiment, an example was shown in which a plurality of virtual nodes P are set in each of a plurality of infinitesimal elements along the thickness direction of the resin molded product 1, but the present invention is not limited to this. In the present invention, a plurality of virtual nodes Pa may be set in each of a plurality of nodes 201 constituting the vertices of a plurality of infinitesimal elements along the thickness direction (Z direction) of the resin molded product 1, as in the virtual nodes Pa according to a modification shown in FIG.
[0076] In the above embodiment, the virtual node P n Analysis orientation Q at (target virtual node) n When correcting (target analysis orientation), the virtual node P adjacent to the surface layer side n-1 Corrected orientation R calculated at (adjacent virtual node) n-1 Although an example of performing a correction calculation based on (adjacent correction orientation) has been shown, the present invention is not limited to this. In the present invention, a calculation for correcting the analytical orientation Q may be performed based on the correction results (correction orientation R) of not only the virtual node P adjacent to the surface side but also a plurality of virtual nodes P on the surface side of the virtual node P itself.
[0077] In the above embodiment, the virtual node P n (Target virtual node) and virtual node P n-1 Virtual node P calculated based on the temperature difference with (adjacent virtual node) n-1 In the above example, the correction coefficient k is calculated based on the elastic modulus of the resin material at the virtual node P. However, the present invention is not limited to this example. For example, the correction coefficient k may be calculated based on the elastic modulus of the resin material at the virtual node P without calculating the elastic modulus. n and virtual node P n-1 The correction coefficient k may be calculated based on the temperature difference between the virtual nodes P and the target node P. Also, the correction coefficient k may not be calculated for each of the virtual nodes P, but may be a common value for one infinitesimal element. Also, the correction coefficient k may be a constant characteristic value that is preset for each characteristic of the resin material for the entire resin molded product 1.
[0078] In the above embodiment, the analytical orientation Q n (target analysis orientation) and the corrected orientation R weighted by the correction coefficient k n-1(adjacent correction orientation) and the analytical orientation Q by calculating the average n However, the present invention is not limited to this. For example, the analytical orientation Q without using the correction coefficient k n and the correction orientation R n-1 Analyze the orientation Q by calculating the average of n That is, the virtual node P n Analysis orientation Q of (target virtual node) n When correcting, virtual node P n The specific calculation formula may take any form as long as it is configured to perform correction calculations starting from the surface layer side based on physical properties such as the elastic modulus or temperature at the virtual node P on the surface side of the layer itself.
[0079] In the above embodiment, 20 virtual nodes P are set in one infinitesimal element, and the shrinkage amount of the infinitesimal element is analyzed based on the average of the calculated correction orientations R for each of the 20 virtual nodes P. However, the present invention is not limited to this. For example, the shrinkage amount of the infinitesimal element may be analyzed based on the average of the calculated correction orientations R for each of 10 virtual nodes P, which is less than 20. Also, more than 20 virtual nodes P may be set. Also, the number of virtual nodes P in each of the multiple infinitesimal elements may be made different depending on the size of each of the multiple infinitesimal elements in the thickness direction.
[0080] In the above embodiment, an example is shown in which an even number of virtual nodes P are set in each of a plurality of infinitesimal elements, but the present invention is not limited to this. For example, an odd number of virtual nodes P may be set. In this case, when a calculation is performed to correct the analytical orientation Q from both sides of the surface layer side, one virtual node P at the center will be left over. When a calculation is performed to correct the analytical orientation Q at the remaining one virtual node P at the center, a calculation may be performed to correct the analytical orientation Q based on the correction orientation R at the virtual node P adjacent to one side, or a calculation may be performed to correct the analytical orientation Q based on the correction orientation R at the two virtual nodes P adjacent to both sides.
[0081] In the above embodiment, the shrinkage amount in two directions, the flow direction (MD) and the perpendicular direction (TD), of the resin material is analyzed based on the calculated corrected orientation R for each of the multiple microelements, but the present invention is not limited to this. For example, the fiber orientation in three directions including the thickness direction may be analyzed, and the shrinkage amount in the three directions may be analyzed by correcting the orientation in the three directions.
[0082] In the above embodiment, the resin molded product 1 is divided into a plurality of minute elements each having a hexahedron (rectangular parallelepiped) as an analysis model of the resin molded product 1, but the present invention is not limited to this. For example, the minute elements may be tetrahedrons. Furthermore, the minute elements may be two-dimensional elements such as triangles or rectangles.
[0083] In the above embodiment, the resin molded product 1 is divided into a plurality of minute elements so that the number of minute elements divided in the thickness direction of each portion of the resin molded product 1 is one (one layer), but the present invention is not limited to this. For example, the resin molded product 1 may be divided into a plurality of minute elements in the thickness direction.
[0084] In the above embodiment, the analytical orientation Q n To calculate the correction of (target analysis orientation), the virtual node P n (Target virtual node) and adjacent virtual node P n-1 In the example shown, the correction coefficient k is calculated by simulating the resin temperature at the time when the pressure retention of the mold is completed when the temperature difference with the adjacent virtual node is calculated, but the present invention is not limited to this. For example, the correction coefficient k may be calculated by simulating the resin temperature at the time when the resin molded product 1 is removed from the mold. [Explanation of symbols]
[0085] 1 Resin molded products 11 Micro element division part 12 Virtual node setting section 13 Analysis orientation acquisition section 14 Correction Orientation Calculation Unit 15 Shrinkage Analysis Section 21 Programs 100 Analysis equipment (resin molding analysis equipment, computers) 101 Recording media
Claims
1. A method for analyzing a resin molded product, which analyzes a shrinkage amount of a resin molded product molded from a resin material containing fiber, comprising the steps of: Dividing the resin molded product into a plurality of minute elements; setting a plurality of virtual nodes along a thickness direction of the resin molded product for each of the plurality of microelements or for each of a plurality of nodes constituting vertices of each of the plurality of microelements; obtaining an analytical orientation by analyzing the orientation of the fiber at each of the plurality of virtual nodes of each of the microelements or each of the nodes; A step of calculating a correction orientation for analyzing the amount of shrinkage by performing a calculation to correct the analytical orientation in each of the infinitesimal elements or each of the multiple virtual nodes of each of the nodes, starting from the surface layer side of the resin molded product; analyzing the amount of shrinkage of each of the microelements or the nodes based on the corrected orientation calculated for each of the virtual nodes of each of the microelements or the nodes, and analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage of each of the analyzed microelements or the nodes; The method for analyzing plastic molded products includes a step of calculating the corrected orientation by performing a calculation to correct the analysis orientation at each of the multiple virtual nodes of each of the infinitesimal elements or each of the nodes based on a correction result at the virtual node that is on the surface side of the element itself.
2. The step of acquiring the analytical orientation includes a step of acquiring, at a target virtual node which is one of the virtual nodes among the plurality of virtual nodes, a target analytical orientation which is the analytical orientation at the target virtual node; The step of calculating the corrected orientation includes: A step of calculating a target correction orientation, which is the correction orientation at the target virtual node, by performing a calculation to correct the target analysis orientation based on an adjacent correction orientation, which is the correction orientation calculated at an adjacent virtual node adjacent to the surface side of the target virtual node among the plurality of virtual nodes; 2. The method for analyzing a resin molded product according to claim 1, further comprising: repeating the step of calculating the target corrected orientation for each of the plurality of virtual nodes in order from a surface layer side of the resin molded product.
3. 3. The method for analyzing a resin molded product according to claim 2, wherein the step of calculating the target correction orientation includes a step of calculating the target correction orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node.
4. The step of calculating the object corrected orientation comprises: calculating a correction coefficient based on an elastic modulus of the resin material at the adjacent virtual node and a temperature difference between the target virtual node and the adjacent virtual node; The resin molded product analysis method according to claim 3 , further comprising: performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the correction coefficient.
5. 5. The method for analyzing a resin molded product according to claim 4, wherein the step of performing a calculation to correct the target analysis orientation includes a step of performing a calculation to correct the target analysis orientation by calculating an average of the target analysis orientation and the adjacent correction orientation weighted by the correction coefficient.
6. A method for analyzing a resin molded product according to any one of claims 1 to 5, wherein the step of analyzing the amount of shrinkage includes a step of analyzing the amount of shrinkage of each of the multiple microelements or multiple nodes based on the average of the corrected orientation calculated at each of the multiple virtual nodes of each of the multiple microelements or each of the nodes, and a step of analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage at each of the analyzed multiple microelements or multiple nodes.
7. A method for analyzing a resin molded product according to any one of claims 1 to 6, wherein the step of setting the plurality of virtual nodes includes a step of setting an even number of the plurality of virtual nodes along a thickness direction of the resin molded product in each of the plurality of infinitesimal elements or the plurality of nodes.
8. The method for analyzing a resin molded product according to any one of claims 1 to 7, wherein the step of analyzing the amount of shrinkage includes a step of analyzing the amount of shrinkage in the flow direction of the resin material and an orthogonal direction perpendicular to the flow direction in a plane along the surface of the resin molded product at each of the multiple microelements or multiple nodes based on the corrected orientation calculated at each of the multiple virtual nodes of each of the multiple microelements or each of the nodes, and analyzing the amount of shrinkage in the flow direction of the resin molded product and the orthogonal direction based on the amount of shrinkage in the flow direction and the orthogonal direction at each of the analyzed multiple microelements or multiple nodes.
9. A program for causing a computer to execute the resin molding analysis method according to any one of claims 1 to 8.
10. A recording medium on which the program according to claim 9 is recorded and which is readable by the computer.
11. A resin molded product analysis device that analyzes a shrinkage amount of a resin molded product molded from a resin material containing fiber, comprising: a microelement dividing unit that divides the resin molded product into a plurality of microelements; a virtual node setting unit that sets a plurality of virtual nodes along a thickness direction of the resin molded product in each of the plurality of infinitesimal elements or in each of a plurality of nodes that constitute the vertices of each of the infinitesimal elements; an analytical orientation acquisition unit that acquires an analytical orientation by analyzing the orientation of the fiber in each of the infinitesimal elements or each of the plurality of virtual nodes of each of the nodes; a correction orientation calculation unit that calculates a correction orientation for analyzing the shrinkage amount by performing a calculation to correct the analytical orientation in each of the infinitesimal elements or each of the multiple virtual nodes of each of the nodes, starting from the surface layer side of the resin molded product; a shrinkage amount analysis unit that analyzes the amount of shrinkage of each of the plurality of infinitesimal elements or each of the plurality of nodes based on the corrected orientation calculated for each of the plurality of virtual nodes of each of the infinitesimal elements or each of the nodes, and analyzes the amount of shrinkage of the resin molded product based on the amount of shrinkage of each of the analyzed plurality of infinitesimal elements or each of the plurality of nodes, The corrected orientation calculation unit is configured to calculate the corrected orientation at each of the multiple virtual nodes of each of the infinitesimal elements or each of the nodes by performing calculations to correct the analysis orientation based on the correction result at the virtual node on the surface side of the infinitesimal element or each of the nodes, in the plastic molded product analysis device.
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