ACF attachment device and ACF attachment method

Abstract

To provide an ACF sticking device and the like capable of suppressing the occurrence of a defective circuit board.SOLUTION: An ACF sticking device 100 includes: a supply unit 110 that supplies a tape comprising a base material layer and an ACF (Anisotropic Conductive Film) layer; a cutting unit 120 that cuts the ACF layer of the tape supplied from supply unit 110; a crimping unit 130 that peels the cut ACF layer from the base material layer and crimps the same to the circuit board; a light source 190 that is supported by the base material layer to irradiate the cutting position of the cut ACF layer with illumination light; an ACF imaging unit 170 that is supported by the base material layer to pick up an image of the ACF layer including the cut position under the illumination light; and a control unit 150 that controls the crimping unit 130 based on the image of the ACF layer including the cut position picked up by the ACF imaging unit 170.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an ACF (Anisotropic Conductive Film) joining device and an ACF joining method for joining an ACF to a substrate. [Background technology]

[0002] Conventionally, there are devices that apply ACF as an adhesive material for bonding components to a substrate. There are also devices that inspect whether or not the ACF is properly applied to a substrate based on an image (image data) generated by a camera capturing an image of the substrate after the ACF is applied to the substrate by this type of device (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-229453 A Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional equipment for attaching ACF to a substrate (ACF attachment equipment), for example, if the ACF is not properly attached to the substrate (i.e., if the substrate is defective), the operation of the equipment is stopped to prevent the substrate determined to be defective from being sent directly to subsequent processes by the equipment.

[0005] Here, for example, in the case of soft substrates such as flexible (film) substrates, when an ACF attached to a substrate determined to be defective is peeled off from the substrate, the substrate is damaged, such as scratched or deformed, and the damaged substrate becomes unusable. Therefore, it is desirable to suppress the occurrence of defective substrates, which are substrates to which an ACF is not properly attached.

[0006] The present invention provides an ACF bonding device and the like that can suppress the occurrence of defective boards. [Means for solving the problem]

[0007] An ACF application device according to one embodiment of the present invention includes a supply unit that supplies a tape consisting of a base material layer and an ACF (Anisotropic Conductive Film) layer, a cutting unit that cuts the ACF layer of the tape supplied from the supply unit, a pressing unit that peels the cut ACF layer from the base material layer and presses it onto a substrate, a light source that is supported by the base material layer and irradiates illumination light onto a cutting position of the cut ACF layer, an ACF imaging unit that is supported by the base material layer and images the ACF layer including the cutting position under the illumination light, and a control unit that controls the pressing unit based on an image of the ACF layer including the cutting position imaged by the ACF imaging unit.

[0008] Moreover, an ACF attachment method according to one embodiment of the present invention includes a supplying step of supplying a tape consisting of a base material layer and an ACF (Anisotropic Conductive Film) layer; a cutting step of cutting the ACF layer of the tape supplied in the supplying step; an irradiation step of irradiating illumination light onto a cutting position of the cut ACF layer supported by the base material layer; an ACF imaging step of imaging the ACF layer supported by the base material layer and including the cutting position under the illumination light; and a control step of controlling a pressing unit to peel the cut ACF layer from the base material layer and press it onto a substrate based on the image of the ACF layer including the cutting position captured in the ACF imaging step.

[0009] Furthermore, these comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. Effect of the Invention

[0010] According to the present invention, it is possible to provide an ACF bonding device and the like that can suppress the occurrence of defective substrates. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic front view showing an ACF joining device according to an embodiment. [Diagram 2] FIG. 2 is a side view for explaining the positional relationship between an imaging unit and a light source provided in the ACF joining device according to the embodiment. [Diagram 3] FIG. 3 is a perspective view showing a substrate according to the embodiment. [Figure 4] FIG. 4 is a diagram for explaining a first example of an image generated by imaging using an ACF imaging unit included in the ACF joining device according to the embodiment. [Diagram 5] FIG. 5 is a diagram for explaining a second example of an image generated by imaging with the ACF imaging unit included in the ACF joining device according to the embodiment. [Figure 6] FIG. 6 is a block diagram showing a functional configuration of an ACF joining device according to an embodiment. [Figure 7] FIG. 7 is a flowchart showing a processing procedure of the ACF joining device according to the embodiment. [Figure 8] FIG. 8 is a side view for explaining the positional relationship between an imaging unit and a light source provided in an ACF joining device according to a modified example. [Figure 9] FIG. 9 is a top view for explaining the positional relationship between an imaging unit and a light source included in an ACF joining device according to a modified example. [Figure 10] FIG. 10 is a cross-sectional view for explaining a light source provided in an ACF bonding device according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] In the following, an ACF application device and the like according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of the components, steps and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept of the present invention will be described as optional components.

[0013] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0014] In this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are mutually orthogonal and are both orthogonal to the Z-axis. In the following embodiments, the X-axis may be described as the positive direction of the substrate transport direction, the Z-axis may be described as the upward direction, and the Z-axis may be described as the downward direction.

[0015] In addition, in the following embodiments, the ACF application device will be described as being viewed from the negative Y-axis direction as a front view, from the side of the X-axis direction as a side view, and from the positive Z-axis direction as a top view.

[0016] (Embodiment) [composition] First, the configuration of an ACF joining device according to the embodiment will be described.

[0017] Fig. 1 is a schematic front view of an ACF bonding apparatus 100 according to an embodiment. Specifically, Fig. 1 is a diagram showing a specific example of the hardware configuration of the ACF bonding apparatus 100. Fig. 2 is a side view for explaining the positional relationship between the imaging units (ACF imaging unit 170 and board imaging unit 180) and light sources (ACF light source 60 and board light source 61) included in the ACF bonding apparatus 100 according to an embodiment. Fig. 3 is a perspective view showing a board 400 according to an embodiment.

[0018] In Figures 1 and 2, the direction in which the imaging units (ACF imaging unit 170 and board imaging unit 180) capture images is indicated by a dashed line arrow, and the direction in which the light sources (ACF light source 60 and board light source 61) irradiate illumination light (optical axis direction) is indicated by a dashed line arrow.

[0019] In FIG. 1, the computer 90 is illustrated as a functional block.

[0020] The ACF attachment device 100 is a device that attaches an ACF (ACF layer 310) for bonding components to a substrate 400. Specifically, the ACF attachment device 100 attaches the ACF layer 310 of a tape 300 to the substrate 400 placed on a stage 70 using a pressure bonding head 50.

[0021] The ACF bonding apparatus 100 is, for example, a part of a component mounting system for producing a display panel or the like. In this component mounting system, for example, the ACF bonding apparatus 100 bonds an ACF layer 310, which is an ACF, to an electrode portion 410 provided on a substrate 400, and a component pressure bonding apparatus (not shown) thermocompresses the substrate 400 and the component via the ACF. The ACF bonding apparatus 100 bonds the ACF layer 310 to the substrate 400, which has been transported from an upstream apparatus by a substrate transport apparatus (not shown), for example. The substrate 400 to which the ACF layer 310 has been attached is transported by the substrate transport apparatus to a component pressure bonding apparatus located downstream of the ACF bonding apparatus 100, for example.

[0022] The tape 300 is composed of an ACF layer 310 and a base layer 320 which is a separator for supporting the ACF layer 310. The ACF layer 310 is a layer made of tape-shaped ACF. The base layer 320 is a tape-shaped film made of a resin such as polyethylene terephthalate.

[0023] The ACF attachment device 100 cuts (half-cuts) the ACF layer 310 to a predetermined size so that the ACF layer 310 remains held by the base layer 320 with the cutter 40. Furthermore, the ACF attachment device 100 peels the ACF layer 310 from the base layer 320 by sandwiching the base layer 320 with two peeling pins of the peeling unit 30 and moving them in the negative direction of the X-axis. Furthermore, the ACF attachment device 100 generates an image (image data) by capturing an image of an alignment mark 420 of the substrate 400 with the substrate imaging unit 180 while irradiating the substrate 400 with illumination light from the substrate light source 61, adjusts the position of the substrate 400 placed on the stage 70 by adjusting the position of the stage 70 based on the image, and attaches a piece 311, which is the ACF layer 310 cut to a predetermined size, to the substrate 400 with the pressure bonding head 50.

[0024] An example of the substrate 400 is a film-like flexible substrate made of resin, etc. The substrate 400 may be a rigid substrate such as a glass substrate.

[0025] Examples of components that can be attached to the substrate 400 via the ACF layer 310 include electronic components such as an integrated circuit (IC), a tape carrier package (TCP), and flexible printed circuits (FPC).

[0026] As shown in FIG. 1, the ACF application device 100 includes a reel 10, a tape support unit 20, a feed roller 21, a peeling unit 30, a cutter 40, a bonding head 50, an ACF light source 60, a substrate light source 61, a stage 70, a backup stage 80, an ACF imaging unit 170, and a substrate imaging unit 180.

[0027] Although not shown, these components are supported by a drive mechanism for driving (moving) the components such as a guide and a motor, a support member for fixing the position, and the like.

[0028] In addition, these components, or the driving mechanism for driving these components, are communicatively connected to a computer 90 provided in the ACF application device 100 via wireless or control lines, etc., and perform predetermined operations by being controlled by the computer 90.

[0029] The computer 90 controls each of the components of the ACF pasting device 100. The computer 90 is realized by, for example, a communication interface for communicating with each of the components of the ACF pasting device 100, a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, a processor for executing the program, and the like.

[0030] The reel 10 is a reel for housing the tape 300 and supplying the housed tape 300. One end of the tape 300 is connected to a feed roller 21, and the tape 300 is wound up and supplied below the crimping head 50 as the feed roller 21 rotates.

[0031] The tape support portion 20 is a support member that supports the tape 300 located between the reel 10 and the feed roller 21 .

[0032] The feed roller 21 is a container that is rotated by a motor (not shown) and winds up the tape 300 .

[0033] The peeling unit 30 is a mechanism for peeling the ACF layer 310 from the base material layer 320. The peeling unit 30 has, for example, two peeling pins and a drive mechanism for driving the two peeling pins. The peeling unit 30, for example, sandwiches the base material layer 320 and moves it in the negative direction of the X-axis to peel the ACF layer 310 from the base material layer 320. Specifically, after the piece 311 is attached to the substrate 400 by the pressure bonding head 50, the peeling unit 30 sandwiches the base material layer 320 with the two peeling pins and moves the two peeling pins in the negative direction of the X-axis. As a result, the peeling pins enter between the base material layer 320 and the ACF layer 310 (piece 311) in contact with the substrate 400, and the piece 311 in contact with the substrate 400 can be peeled off from the base material layer 320.

[0034] The cutter 40 is a blade that cuts the ACF layer 310 supported by the base layer 320. For example, the cutter 40 cuts the ACF layer 310 by moving up and down by a drive mechanism having a guide and a motor (not shown) driven by the computer 90. Specifically, the cutter 40 does not cut the base layer 320, but cuts the ACF layer 310, that is, by half-cutting, to form a piece 311 that is the cut ACF layer 310. As a result, the ACF layer 310 is moved by the feed roller 21 below the pressure bonding head 50 and above the backup stage 80 in a state where it has been cut to a predetermined size by the cutter 40 and is supported by the base layer 320.

[0035] It should be noted that the cutter 40, for example, clamps the tape 300 from above and below and cuts only the ACF layer 310 out of the ACF layer 310 and the base material layer 320, but the components located above the tape 300 are not shown in each figure.

[0036] The compression head 50 is a head that compresses the ACF layer 310 (more specifically, the piece 311) onto the substrate 400. For example, the compression head 50 compresses the ACF layer 310 (more specifically, the piece 311) onto the substrate 400 by a drive mechanism having a guide and a motor (not shown) that is driven by the computer 90 to move up and down.

[0037] The stage 70 is a base on which the substrate 400 is placed. Specifically, the stage 70 holds the substrate 400 in a state where it does not overlap with the edge of the substrate 400 in a top view (i.e., the end of the substrate 400 protrudes). The stage 70 is, for example, a three-axis stage that is controlled by a computer 90 and can move in the X, Y, and Z directions.

[0038] The backup stage 80 is a base that supports the edge of the substrate 400 placed on the stage 70. The backup stage 80 is, for example, a one-axis stage that is controlled by a computer 90 and can move in the Z direction.

[0039] The substrate light source 61 is a light source that irradiates illumination light onto the substrate 400 placed on the stage 70. The substrate light source 61 irradiates illumination light towards the substrate 400 from below, for example.

[0040] The substrate imaging section 180 is a camera that captures an image of the substrate 400 placed on the stage 70. Specifically, the substrate imaging section 180 captures an image of the alignment mark 420 on the substrate 400 to generate an image (image data) including the alignment mark 420. The substrate imaging section 180 captures an image of the substrate 400 from above, for example.

[0041] 2, the substrate light source 61 and the substrate imaging section 180 are disposed opposite to each other. An edge of the substrate 400 that protrudes from the stage 70 is disposed between the substrate light source 61 and the substrate imaging section 180. The substrate light source 61 irradiates illumination light from below the substrate 400 toward the edge of the substrate 400. The substrate 400 has, for example, translucency that transmits the illumination light. The substrate imaging section 180 detects the illumination light that has transmitted through the substrate 400 to image an alignment mark on the substrate 400.

[0042] The light source used for the board light source 61 is, for example, an LED (Light Emitting Diode), but may be any light source such as a fluorescent lamp or a light bulb.

[0043] The ACF light source 60 is a light source that irradiates illumination light onto the ACF layer 310 of the tape 300. Specifically, the ACF light source 60 irradiates illumination light toward the cutting position 500 shown in FIG.

[0044] Cut location 500 is the location of the cut in ACF layer 310 made by cutter 40 .

[0045] The ACF light source 60 irradiates illumination light, for example, from below the ACF layer 310 toward the cutting position 500. Specifically, for example, the ACF light source 60 irradiates illumination light, for example, from below the ACF layer 310 and in a direction intersecting the vertical direction (the Z-axis direction in this embodiment), in other words, from a direction intersecting the normal direction of the ACF layer 310, toward the cutting position 500. In other words, the ACF light source 60 irradiates illumination light from obliquely below the ACF layer 310.

[0046] The normal direction of ACF layer 310 refers to the direction of the normal to either the surface of ACF layer 310 that is pressure-bonded to substrate 400 or the surface opposite to that surface.

[0047] The ACF imaging unit 170 is a camera that images the cutting position 500 and the ACF layer 310 in the vicinity of the cutting position 500. The ACF imaging unit 170 images the cutting position 500, for example, from below the ACF layer 310. Specifically, for example, the ACF imaging unit 170 images the cutting position 500 from below the ACF layer 310 and in a direction intersecting the vertical direction (in this embodiment, the Z-axis direction), in other words, from a direction intersecting the normal direction of the ACF layer 310. In other words, the ACF imaging unit 170 images the ACF layer 310 from obliquely below.

[0048] Fig. 4 is a diagram for explaining a first example of an image generated by imaging by the ACF imaging section 170 included in the ACF pasting device 100 according to the embodiment. Specifically, Fig. 4(a) is a diagram for explaining a first example of how the ACF imaging section 170 included in the ACF pasting device 100 according to the embodiment captures an image, and Fig. 4(b) is a diagram that diagrammatically shows an example of an image generated by the ACF imaging section 170 capturing an image in the state shown in Fig. 4(a).

[0049] In addition, in FIG. 4 and FIG. 5 described later, the direction in which the imaging section (ACF imaging section 170) captures images is indicated by a dashed line arrow.

[0050] As shown in FIG. 4( a ), for example, the ACF imaging unit 170 images the cutting position 500 of the ACF layer 310 from below the tape 300 .

[0051] Here, as shown in FIG. 4B, if the ACF layer 310 is not cut properly, the ACF layer 310 may peel off from the base layer 320, resulting in the formation of a defective portion 330. If the ACF layer 310 is attached to the substrate 400 in a state in which the defective portion 330 is formed, a component may not be properly attached to the substrate 400 via the ACF layer 310. Therefore, the ACF layer 310 is peeled off from the substrate 400 to which the ACF layer 310 with the defective portion 330 formed thereon is attached (i.e., a defective substrate), and the ACF layer 310 is attached again. However, if the substrate 400 is a substrate that is easily deformed or easily scratched, such as a flexible substrate as described above, damage such as deformation or scratches may occur when the ACF layer 310 is peeled off, making it impossible to reuse the substrate.

[0052] Therefore, before bonding the ACF layer 310 to the substrate 400, the ACF bonding device 100 judges whether the cut shape of the ACF layer 310 is good or bad (for example, whether there is a defective part 330 or not) based on an image generated by imaging the cutting position 500, and performs a process of bonding the ACF layer 310 to the substrate 400 based on the judgment result. In this way, the ACF bonding device 100 suppresses the generation (manufacturing) of defective substrates.

[0053] Fig. 5 is a diagram for explaining a second example of an image generated by imaging by the ACF imaging section 170 included in the ACF pasting device 100 according to the embodiment. Specifically, Fig. 5(a) is a diagram for explaining a second example of how the ACF imaging section 170 included in the ACF pasting device 100 according to the embodiment captures an image, and Fig. 5(b) is a diagram that typically shows an example of an image generated by the ACF imaging section 170 capturing an image in the state shown in Fig. 5(a).

[0054] Note that (a) in Figure 5 shows a state in which, for example, the tape 300 is moved by the feed roller 21 from the state shown in (a) in Figure 4, and then the ACF layer 310 is cut by the cutter 40 to form a slice 311.

[0055] As shown in (a) of Fig. 5, for example, the ACF imaging section 170 images the cutting position 500 of the ACF layer 310 from below the tape 300. As shown in (a) of Fig. 4 and (a) of Fig. 5, for example, the ACF application device 100 uses the ACF imaging section 170 to image the ACF layer 310 every time it is cut, and judges whether both ends of the piece 311 to be applied to the substrate 400 (for example, both ends in the extending direction of the tape 300) are acceptable (that is, whether the cut shape of the piece 311 is acceptable).

[0056] If the cut shape of the piece 311 is good, that is, if there are no defective parts 330, 331 such as curling at either end of the piece 311, the ACF application device 100 applies the piece 311 to the substrate 400. On the other hand, if the piece 311 is defective, that is, if there are defective parts 330, 331, the ACF application device 100 does not apply the ACF layer 310 to the substrate 400. If the piece 311 is defective, the ACF application device 100 applies the piece 311 to a member other than the substrate 400, such as a jig, or uses the feed roller 21 to feed the defective piece 311 as is without applying the piece 311.

[0057] The state in which segment 311 is determined to be defective may be set arbitrarily in advance, and is not particularly limited. For example, segment 311 may be determined to be defective when it is turned up, like defective portion 330. Alternatively, segment 311 may be determined to be defective when it is torn (e.g., chipped). Alternatively, segment 311 may be determined to be defective when the length in the X-axis direction of segment 311 is outside a specified range.

[0058] For example, the computer 90 determines whether the cut portion of the ACF layer 310 is a straight line, and if it is determined that the cut portion is a straight line, determines the ACF layer 310 (more specifically, the segment 311) as good, and if it is determined that the cut portion is not a straight line, determines the ACF layer 310 as bad. For example, the computer 90 may store appropriate image data for determining that the ACF layer 310 is good, and may determine whether the ACF layer 310 is good or bad by comparing the appropriate image data with the image data generated by the ACF imaging unit 170. In addition, whether the length of the segment 311 in the X-axis direction is outside a specified range may be determined based on, for example, the amount of deviation of the cut position between the segment 311 and the subsequent ACF layer 310 in (b) of FIG. 5 from a reference position.

[0059] 2, for example, the ACF light source 60 is located on the opposite side of the ACF imaging unit 170 with respect to the backup stage 80 and the compression bonding head 50 in the supply direction of the tape 300 (X-axis direction in this embodiment) and in a direction intersecting the vertical direction (Y-axis direction in this embodiment). This makes it easier for reflected light 310 from the ACF layer irradiated by the ACF light source 60 to be incident on the ACF imaging unit 170.

[0060] The light source used for the ACF light source 60 is, for example, an LED, but may be any light source such as a fluorescent lamp or a light bulb.

[0061] Next, a characteristic functional configuration of the ACF joining device 100 having the above-mentioned hardware configuration will be described.

[0062] FIG. 6 is a block diagram showing a functional configuration of the ACF joining device 100 according to the embodiment.

[0063] The ACF application device 100 includes a supply section 110, a cutting section 120, a pressing section 130, a determination section 140, a control section 150, a board holding section 160, an ACF imaging section 170, a board imaging section 180, a light source 190, and a memory section 200.

[0064] The supply unit 110 is a mechanism for supplying the tape 300 composed of the base layer 320 and the ACF layer 310. Specifically, the supply unit 110 supplies the tape 300 below the compression unit 130 (more specifically, the compression head 50). The supply unit 110 is realized by, for example, the reel 10, the tape support unit 20, the feed roller 21, and a motor (not shown) that rotates the feed roller 21.

[0065] The cutting unit 120 is a mechanism that cuts the ACF layer 310 of the tape 300 supplied from the supply unit 110. Specifically, the cutting unit 120 cuts only the ACF layer 310 out of the ACF layer 310 and the base material layer 320 of the tape 300. The cutting unit 120 is realized, for example, by a cutter 40 and a drive mechanism having a guide and a motor (not shown) that move the cutter 40 up and down.

[0066] The bonding unit 130 is a mechanism for peeling off the cut ACF layer 310 (i.e., piece 311) from the base material layer 320 and bonding it to the substrate 400. The bonding unit 130 is realized by, for example, a bonding head 50, a drive mechanism having a guide and a motor (not shown) for moving the bonding head 50 up and down, and a peeling unit 30.

[0067] The light source 190 is a light source that is supported by the base layer 320 and irradiates illumination light onto the cutting position 500 of the cut ACF layer 310. The light source 190 includes, for example, an ACF light source 60.

[0068] In the present embodiment, the light source 190 is disposed below the board imaging section 180 so as to face the board imaging section 180, and irradiates illumination light onto the edge of the board 400 from below the board 400. For example, the light source 190 further includes a light source 61 for board in addition to the light source 60 for ACF. That is, the light source 190 is realized by, for example, the light source 60 for ACF and the light source 61 for board.

[0069] Also, for example, light source 190 (more specifically, ACF light source 60) is disposed at a position where illumination light is irradiated to cutting position 500 from a direction intersecting with the normal direction of ACF layer 310 (Z-axis direction in this embodiment). Alternatively, for example, ACF light source 60 is disposed at a position where illumination light is irradiated to cutting position 500 from a direction intersecting with the direction in which cutting unit 120 cuts ACF layer 310. Alternatively, for example, ACF light source 60 is disposed at a position where illumination light is irradiated to cutting position 500 from a direction intersecting with the direction in which crimping head 50 crimps ACF layer 310 to substrate 400.

[0070] The ACF imaging unit 170 is a camera that images the ACF layer 310 , which is supported by the base layer 320 and includes the cutting position 500 , under illumination light irradiated by the light source 190 .

[0071] The substrate holding unit 160 is a base that holds the substrate 400 having the alignment mark 420 on its edge without overlapping the edge when viewed from above. The substrate holding unit 160 is configured to be freely movable in the X, Y and Z axis directions, for example, under the control of the control unit 150. The substrate holding unit 160 is realized by a stage 70, for example.

[0072] The substrate imaging section 180 is a camera that captures an image of the alignment mark 420 on the substrate 400 held by the substrate holding section 160 using transmitted light that is irradiated from a light source 190 (e.g., a substrate light source 61) and passes through the edge of the substrate 400.

[0073] The determination unit 140 is a processing unit that determines whether the cut shape of the cut ACF layer 310 is good or bad, based on an image of the ACF layer 310 including the cutting position 500 captured by the ACF imaging unit 170. For example, the determination unit 140 determines whether or not there is a turnover, a chip, or the like at both ends of the cut ACF layer 310. For example, the determination unit 140 determines whether or not there is a turnover, a chip, or the like at both ends of the cut ACF layer 310 by whether or not both ends of the ACF layer 310 in the image are straight lines. For example, if there is no turnover, a chip, or the like at both ends of the cut ACF layer 310, the determination unit 140 determines that the cut shape of the cut ACF layer 310 is good, and if there is turnover, a chip, or the like, the determination unit 140 determines that the cut shape of the cut ACF layer 310 is bad.

[0074] Alternatively, the determination unit 140 may determine whether the length of the segment 311 (in this embodiment, the length in the X-axis direction) is within a specified range (i.e., whether it is within a specified range or outside a preset range) as a determination of the quality of the cut shape of the cut ACF layer 310. For example, when the length of the segment 311 is within the specified range, the determination unit 140 determines the ACF layer 310 (more specifically, the segment 311) as good, and when the determination unit 140 determines that the length of the segment 311 is outside the specified range, the determination unit 140 determines that the ACF layer 310 is defective. For example, when the amount of deviation of the cutting position between the segment 311 and the ACF layer 310 following the segment 311 from a predetermined reference position as shown in (b) of FIG. 5 is less than a predetermined amount of deviation, the determination unit 140 determines that the length of the segment 311 is within the specified range, and when the amount of deviation is equal to or greater than the predetermined amount of deviation, the determination unit 140 determines that the length of the segment 311 is outside the specified range.

[0075] The determining unit 140 may determine the acceptability of the cut shape of one end of the cut ACF layer 310. Alternatively, the determining unit 140 may determine the acceptability of the cut shape of one end of the cut ACF layer 310, and when determining that the cut shape is acceptable, may further determine the acceptability of the cut shape of the other end.

[0076] The determination unit 140 is realized by, for example, a processor such as a CPU (Central Processing Unit) included in the computer 90 and a control program stored in a memory included in the computer 90 and executed by the processor.

[0077] The control unit 150 is a processing unit that controls the operation and operation timing of each component included in the ACF bonding device 100, such as the supply unit 110, the cutting unit 120, the compression unit 130, the substrate holding unit 160, the ACF imaging unit 170, the substrate imaging unit 180, and the light source 190. The control unit 150 also controls the compression unit 130 based on an image of the ACF layer 310 including the cutting position captured by the ACF imaging unit 170 (i.e., an image generated by the ACF imaging unit 170 capturing an image of the cutting position 500). Specifically, for example, when the determination unit 140 determines that the cut shape of the cut ACF layer 310 is good, the control unit 150 causes the compression unit 130 to peel the cut ACF layer 310 from the base layer 320 and compress (also referred to as attaching or sticking) the cut ACF layer 310 to the substrate 400. On the other hand, when the determination result of the determination unit 140 is defective, the control unit 150 does not cause the bonding unit 130 to bond the cut ACF layer 310 to the substrate 400. In this case, for example, the control unit 150 does not cause the bonding unit 130 to bond the cut ACF layer 310 to the substrate 400, but drives a stage or the like on which members such as jigs other than the substrate 400 are arranged to be positioned below the bonding unit 130 (more specifically, the bonding head 50), and controls the bonding unit 130 to bond the cut ACF layer 310, whose cut shape has been determined to be defective, to the member.

[0078] The control unit 150 is realized, for example, by a processor such as a CPU possessed by the computer 90, a control program stored in a memory possessed by the computer 90 and executed by the processor, and a communication interface for communicating with the cutting unit 120, the crimping unit 130, etc.

[0079] The memory unit 200 is a storage device that stores various data indicating the size of the substrate 400, the attachment position and attachment direction of the cut ACF layer 310, the operation of each component, the timing of the operation, the timing of transferring the substrate 400 to a component pressure-bonding device or the like located downstream of the ACF bonding device 100, control programs executed by the determination unit 140 and the control unit 150, etc., appropriate information used by the determination unit 140 to determine the acceptability of the cut shape of the cut ACF layer 310 (for example, threshold information such as the above-mentioned image data, information indicating a prescribed range of the length of the slice 311, information indicating a reference position of the cutting position, information for determining the acceptability of the cut shape based on the amount of deviation of the cutting position from the reference position (for example, the above-mentioned predetermined deviation amount) used by the determination unit 140 to determine the acceptability of the cut shape of the ACF layer 310), etc. The memory unit 200 is realized by, for example, a flash memory, an HDD (Hard Disk Drive), etc.

[0080] [Processing Procedure] Next, a processing procedure of the ACF joining device 100 according to the embodiment will be described in detail.

[0081] FIG. 7 is a flowchart showing the processing procedure of the ACF joining device 100 according to the embodiment.

[0082] First, the control unit 150 controls the supply unit 110 to cause the supply unit 110 to supply the tape 300 (S101). For example, the control unit 150 controls the feed roller 21 to move the tape 300 in the positive direction of the X-axis from the state of the tape 300 shown in (a) of Fig. 4. Note that the following description will be given assuming that the cut state of the end of the ACF layer 310 on the positive side of the X-axis is good.

[0083] Next, the control unit 150 controls the cutting unit 120 to cut the ACF layer 310 (S102). Specifically, the control unit 150 causes the cutting unit 120 to cut only the ACF layer 310 out of the ACF layer 310 and the base layer 320 of the tape 300.

[0084] Next, the control unit 150 controls the light source 190 to irradiate the cutting position 500 of the ACF layer 310 with illumination light (S103). Specifically, the control unit 150 causes the ACF light source 60 to irradiate the cutting position 500 of the ACF layer 310 with illumination light.

[0085] Next, the control unit 150 controls the ACF imaging unit 170 to image the cut position 500 of the ACF layer 310 while the light source 190 is irradiating the cut position 500 of the ACF layer 310 with illumination light, thereby causing the ACF imaging unit 170 to image the cut position 500 of the ACF layer 310 (S104). Specifically, the control unit 150 causes the ACF imaging unit 170 to image the cut position 500 of the ACF layer 310, thereby causing the ACF imaging unit 170 to generate an image including the cut position of the ACF layer 310.

[0086] Next, the judgment unit 140 judges whether the cut shape of the cut ACF layer 310 is good or bad, based on the image of the ACF layer 310 including the cut position 500 captured by the ACF imaging unit 170 (S105).

[0087] When the determining unit 140 determines that the cut shape of the cut ACF layer 310 is good (Yes in S105), the control unit 150 controls the supply unit 110 to move the cut ACF layer 310 below the compression unit 130 (more specifically, the compression head 50) and causes the substrate holding unit 160 to hold the substrate 400 (S106). For example, the control unit 150 controls a substrate transport unit (not shown) that transports the substrate 400 to cause the substrate holding unit 160 to hold the substrate 400.

[0088] Next, the control unit 150 controls the light source 190 to irradiate illumination light onto the substrate 400 placed on the substrate holding unit 160 (S107). Specifically, the control unit 150 causes the substrate light source 61 to irradiate illumination light onto the alignment mark 420 of the substrate 400 placed on the substrate holding unit 160.

[0089] Next, while the illumination light is being irradiated onto the alignment mark 420 by the light source 190, the control unit 150 controls the board imaging unit 180 to image the alignment mark 420 (S108). Specifically, the control unit 150 causes the board imaging unit 180 to image the alignment mark 420, thereby causing the board imaging unit 180 to generate an image including the alignment mark 420.

[0090] Next, the control unit 150 controls the substrate holding unit 160 based on the image including the alignment mark 420 generated by the substrate imaging unit 180, thereby moving the substrate 400 so that the edge of the substrate 400 is positioned above the backup stage 80, that is, below the bonding unit 130 (more specifically, the bonding head 50) (S109).

[0091] Next, the control unit 150 controls the bonding unit 130 to cause the bonding unit 130 to bond (in other words, attach) the cut ACF layer 310 to the substrate 400 (S110). For example, the control unit 150 causes the bonding head 50 to lower, thereby attaching the cut ACF layer 310 to the substrate 400. Furthermore, the control unit 150 causes the bonding head 50 to rise. Furthermore, the control unit 150 controls the peeling unit 30 to move two peeling pins sandwiching the base layer 320 in the negative direction of the X-axis, thereby peeling the cut ACF layer 310 from the base layer 320. As a result, the cut ACF layer 310 is peeled off from the base layer 320 and attached to the substrate 400.

[0092] When the determining unit 140 determines that the cut shape of the cut ACF layer 310 is defective (No in S105), the control unit 150 discards the cut ACF layer 310 (piece 311) without attaching it to the substrate 400 (S111). For example, the control unit 150 drives a stage or the like on which members such as jigs other than the substrate 400 are arranged to place it below the bonding unit 130 (more specifically, the bonding head 50), and controls the bonding unit 130 to bond the cut ACF layer 310, whose cut shape is determined to be defective, to the members, thereby discarding the cut ACF layer 310. Alternatively, for example, the control unit 150 rotates the feed roller 21 to move the cut ACF layer 310, for example, toward the positive X-axis direction shown in FIG. 1, without attaching it to the substrate 400.

[0093] The process in step S106 in which the control unit 150 causes the substrate holding unit 160 to hold the substrate 400 may be performed before S101, or may be performed between steps S101 and S105.

[0094] Moreover, steps S107 and S108 may be executed after step S106.

[0095] [Variations] In the above, the light source 60 for ACF and the light source 61 for the substrate are realized as different light sources, but the light source 60 for ACF and the light source 61 for the substrate may be realized as a single light source.

[0096] Fig. 8 is a side view for explaining the positional relationship between the imaging section (ACF imaging section 170 and board imaging section 180) and the light source (shared light source 62) provided in the ACF bonding device according to the modified example. Fig. 9 is a top view for explaining the positional relationship between the imaging section (ACF imaging section 170 and board imaging section 180) and the light source (shared light source 62) provided in the ACF bonding device according to the modified example.

[0097] The ACF bonding device according to the modified example is similar to the ACF bonding device 100 except for the specific configuration of the light source 190.

[0098] 8, the direction in which the imaging units (ACF imaging unit 170 and board imaging unit 180) capture images is indicated by a dashed-dotted arrow, the direction in which the light source (shared light source 62) irradiates illumination light (optical axis direction) is indicated by a dashed-dotted arrow, and the illumination range of the illumination light is indicated by a dashed-dotted line. The illumination range is, for example, a range that is 1 / 2 the maximum intensity of the illumination light.

[0099] In FIG. 9, the electrode portion 410 and the alignment marks 420 of the substrate 400 are omitted.

[0100] In addition, in FIG. 9, the location of the crimping head 50 is indicated by a dashed line.

[0101] 8, the shared light source 62 is a light source that irradiates illumination light onto the substrate 400 (more specifically, the edge of the substrate 400) from below the substrate 400. The shared light source 62 is disposed below the substrate imaging section 180 and facing the substrate imaging section 180. The substrate imaging section 180 images an image of an alignment mark 420 of the substrate 400 held by the substrate holding section 160 using transmitted light that is irradiated from the shared light source 62 and passes through the edge of the substrate 400.

[0102] Moreover, the shared light source 62 irradiates illumination light onto the cutting position 500 of the ACF layer 310. For example, the shared light source 62 is disposed so that the ACF layer 310 is located within the irradiation range of the illumination light irradiated by the shared light source 62.

[0103] Thereby, the shared light source 62 functions as the light source 60 for the ACF and also functions as the light source 61 for the substrate.

[0104] Fig. 10 is a cross-sectional view for explaining a light source (shared light source 62) included in an ACF bonding device according to a modified example. Note that, among the components included in the shared light source 62, Fig. 10 shows cross sections of only a holder 64 and a polarizing film 65.

[0105] In FIG. 10, the optical axis of the illumination light emitted by the shared light source 62 is indicated by a dashed line, and the illumination range of the illumination light is indicated by a two-dot chain line.

[0106] The shared light source 62 includes an LED light source 63 , a holder 64 , and a polarizing film 65 .

[0107] The LED light source 63 is a light source having an LED for emitting illumination light. A holder 64 is attached to an illumination port of the LED light source 63 through which the illumination light is emitted.

[0108] The holder 64 is a cylindrical body that guides the illumination light emitted from the LED light source 63. The holder 64 may be formed using any material such as metal, resin, etc. Furthermore, a material having a high reflectance (e.g., a reflectance of 90% or more) to the illumination light may be disposed on the inner surface of the holder 64. For example, the holder 64 may be realized by a cylindrical body formed of resin, metal, etc., and a film provided on the inner surface of the cylindrical body and having a high reflectance to the illumination light.

[0109] An LED light source 63 is attached to one end of the holder 64, and a polarizing film 65 is attached to the other end.

[0110] The polarizing film 65 is disposed at the other end of the holder 64, and is a film for widening the viewing angle (light distribution angle) of the illumination light irradiated from the other end. The material used for the polarizing film 65 is not particularly limited as long as it has the function of widening the viewing angle (light distribution angle) of the illumination light. The polarizing film 65 has, for example, a film-shaped rubber body in which fine silicone rubber strips are arranged parallel to each other in transparent silicone rubber, and film-shaped polycarbonate disposed on both sides of the rubber body.

[0111] Generally, light emitted from an LED often has a narrow angle distribution, unlike light from a fluorescent lamp, etc. Therefore, by widening the distribution angle of the illumination light emitted from the LED light source 63 by the polarizing film 65, the shared light source 62 can irradiate the illumination light onto the substrate 400 and the ACF layer 310.

[0112] [Effects, etc.] As described above, the ACF application device 100 according to the embodiment includes a supply unit 110 that supplies the tape 300 consisting of the base material layer 320 and the ACF layer 310, a cutting unit 120 that cuts the ACF layer 310 of the tape 300 supplied from the supply unit 110, a pressing unit 130 that peels the cut ACF layer 310 (e.g., piece 311) from the base material layer 320 and presses it onto the substrate 400, a light source 190 (e.g., ACF light source 60) that is supported by the base material layer 320 and irradiates illumination light onto a cutting position 500 of the cut ACF layer 310, an ACF imaging unit 170 that is supported by the base material layer 320 and images the ACF layer 310 including the cutting position 500 under the illumination light, and a control unit 150 that controls the pressing unit 130 based on an image of the ACF layer 310 including the cutting position 500 imaged by the ACF imaging unit 170.

[0113] According to this, since the cutting position 500 can be imaged by the ACF imaging unit 170 while the light source 190 irradiates the ACF layer 310 with illumination light, for example, even when the contrast between the ACF layer 310 and the base material layer 320 is low, the ACF imaging unit 170 can generate a high-definition image showing the cut shape of the cut ACF layer 310. Therefore, based on such a high-definition image, the control unit 150 can accurately control the bonding unit 130, for example, to cause the bonding unit 130 to bond the cut ACF layer 310 to the substrate 400, or, if the cut ACF layer 310 is defective, to bond the cut ACF layer 310 to a member other than the substrate 400. Therefore, the ACF bonding device 100 can suppress the occurrence of defective substrates.

[0114] Also, for example, the ACF application device 100 further includes a determination unit 140 that determines whether the cut shape of the cut ACF layer 310 is good or bad, based on an image of the ACF layer 310 including the cutting position 500 captured by the ACF imaging unit 170. In this case, for example, when the determination result of the cut shape by the determination unit 140 is good, the control unit 150 causes the compression unit 130 to peel the cut ACF layer 310 from the base material layer 320 and compress it onto the substrate 400, and when the determination result is bad, the control unit 150 does not cause the compression unit 130 to compress the cut ACF layer 310 onto the substrate 400.

[0115] According to this, if the cut ACF layer 310 is defective based on the determination result of the determination unit 140, the control unit 150 can appropriately discard the cut ACF layer 310 without pressing it against the substrate 400. This further suppresses the occurrence of defective substrates. Also, as described above, the ACF imaging unit 170 can generate a high-resolution image showing the cut shape of the cut ACF layer 310. Therefore, the determination unit 140 determines whether the cut shape is good or bad based on such a high-resolution image, and can therefore accurately determine whether the cut shape is good or bad.

[0116] Also, for example, the ACF bonding apparatus 100 further includes a substrate holding unit 160 that holds a substrate 400 having an alignment mark 420 on its edge in a state where the substrate 400 does not overlap the edge when viewed from above, and a substrate imaging unit 180 that images the alignment mark 420 of the substrate 400 held by the substrate holding unit 160 from above. In this case, for example, the light source 190 (for example, the shared light source 62) is disposed below the substrate imaging unit 180 and facing the substrate imaging unit 180. Also, for example, the substrate imaging unit 180 images the alignment mark 420 of the substrate 400 held by the substrate holding unit 160 by using transmitted light that is irradiated from the light source 190 and passes through the edge.

[0117] That is, the light source 190 may be realized by a single light source that serves as both the ACF light source 60 and the board light source 61, like the shared light source 62. This allows the configuration of the ACF bonding device 100 to be simplified compared to the case where multiple light sources are used.

[0118] Furthermore, for example, the light source 190 (for example, the ACF light source 60 or the shared light source 62) is disposed so as to irradiate the cutting position 500 with illumination light from a direction intersecting the normal direction of the ACF layer 310.

[0119] Components of the ACF laminating device 100, such as the backup stage 80, are often arranged directly below the tape 300. Furthermore, for example, the backup stage 80 often has a heating unit such as a heater, and in such a case, it is difficult to make the backup stage 80 translucent to transmit the illumination light. Therefore, the light source 190 is arranged to irradiate the cutting position 500 with illumination light in a direction intersecting the normal direction of the ACF layer 310, that is, from an oblique direction, so that the illumination light can be appropriately irradiated to the cutting position 500 without being hindered by the components of the ACF laminating device 100. Furthermore, by irradiating the illumination light from an oblique direction, the difference in light intensity due to the irradiation position of the illumination light can be suppressed compared to the case where the illumination light is irradiated directly below, so that the ACF imaging unit 170 can generate a high-definition image showing the cut shape of the cut ACF layer 310.

[0120] Moreover, the ACF application method according to the embodiment includes a supplying step (S101) of supplying tape 300 consisting of base material layer 320 and an ACF layer, a cutting step (S102) of cutting ACF layer 310 of tape 300 supplied in the supplying step, an irradiation step (S103) of irradiating illumination light onto cutting position 500 of the cut ACF layer 310 supported by base material layer 320, an ACF imaging step (S104) of imaging ACF layer 310 supported by base material layer 320 and including cutting position 500 under illumination light, and a control step (e.g., S105 or S111) of controlling compression unit 130 for peeling off the cut ACF layer 310 from base material layer 320 and compressing it to substrate 400 based on the image of ACF layer 310 including the cut position imaged in the ACF imaging step.

[0121] This provides the same effects as the ACF application device 100.

[0122] (Other embodiments) Although the ACF joining device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0123] For example, all or some of the components of the processing unit such as the determination unit and control unit of the ACF application device may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

[0124] Furthermore, the components of the processing section of the ACF application device may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0125] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose.

[0126] The present invention can be realized not only as an ACF pasting device, but also as a program including, as steps, processes performed by each component of the ACF pasting device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) on which the program is recorded. In other words, the above-mentioned comprehensive or specific aspects may be realized as a system, a device, an integrated circuit, a computer program, or a computer-readable non-transitory recording medium, or as any combination of the system, device, integrated circuit, computer program, and recording medium.

[0127] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0128] The ACF bonding device according to the present invention can be used as an ACF bonding device that bonds ACF to a substrate and is provided in a mounting device for manufacturing a display panel. [Explanation of symbols]

[0129] 10 Reels 20 Tape support part 21 Feed roller 30 Peeling section 40 Cutter 50 Crimping head 60 ACF light source 61 Light source for board 62 Shared light source 63 LED light source 64 Holder 65 Polarizing Film 70 Stages 80 Backup Stage 90 Computer 100 ACF attachment device 110 Supply section 120 Cutting section 130 Crimping section 140 Judgment section 150 Control section 160 Board holding part 170 ACF imaging unit 180 Substrate imaging unit 190 Light source 200 Storage section 300 Tape 310 ACF layer 311 Intersection 320 Base material layer 330, 331 defective part 400 Substrates 410 Electrode section 420 Alignment Mark 500 cutting position

Claims

1. a supply unit that supplies a tape including a base layer and an ACF (Anisotropic Conductive Film) layer; a cutting unit that cuts the ACF layer of the tape supplied from the supply unit; a pressure-bonding unit for peeling the cut ACF layer from the base layer and pressure-bonding the ACF layer to a substrate; a light source that irradiates illumination light onto a cutting position of the ACF layer that is supported by the base layer and cut; an ACF imaging unit that is supported by the base layer and images the ACF layer including the cutting position under the illumination light; A control unit that controls the pressure bonding unit based on an image of the ACF layer including the cutting position captured by the ACF imaging unit; a substrate holder that holds the substrate having an alignment mark on an edge portion in a state where the substrate does not overlap with the edge portion in a top view; a substrate imaging unit configured to image, from above, the alignment mark of the substrate held by the substrate holding unit, the light source is disposed below the board imaging unit and facing the board imaging unit, the substrate imaging unit images the alignment mark of the substrate held by the substrate holding unit using transmitted light that is irradiated from the light source and passes through the edge portion; ACF application device.

2. Further, a determination unit is provided that determines whether or not a cut shape of the cut ACF layer is good based on an image of the ACF layer including the cutting position captured by the ACF imaging unit, The control unit is When the judgment result of the cut shape by the judgment unit is good, the pressure-bonding unit is caused to peel the cut ACF layer from the base material layer and pressure-bond the ACF layer to the substrate, If the judgment result is bad, the pressure bonding unit does not press the cut ACF layer onto the substrate. The ACF joining device according to claim 1 .

3. The light source is disposed so as to irradiate the illumination light to the cutting position from a direction intersecting a normal direction of the ACF layer.

3. The ACF joining device according to claim 1 or 2.

4. A supplying step of supplying a tape including a base layer and an ACF (Anisotropic Conductive Film) layer; a cutting step of cutting the ACF layer of the tape supplied in the supplying step; an irradiation step of irradiating an illumination light onto a cutting position of the ACF layer supported by the base layer and cut; an ACF imaging step of imaging the ACF layer supported by the base layer and including the cutting position under the illumination light; a control step of controlling a pressure-bonding unit for peeling the cut ACF layer from the base layer and pressure-bonding the cut ACF layer to a substrate based on an image of the ACF layer including the cutting position captured in the ACF imaging step; a substrate holding step of holding the substrate having an alignment mark on an edge portion by a substrate holding part in a state where the substrate does not overlap with the edge portion in a top view; a substrate imaging step of imaging the alignment mark of the substrate held by the substrate holding unit from above by a substrate imaging unit; the illumination light is emitted from a light source disposed below the substrate imaging unit and facing the substrate imaging unit; In the substrate imaging step, an image of the alignment mark of the substrate held by the substrate holding unit is captured by transmitted light irradiated from the light source and transmitted through the edge portion. How to attach ACF.

Images