Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component

JP7650831B2Active Publication Date: 2025-03-25RESONAC CORP
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Patent Information

Application Number
JP2022005547
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-01-18
Publication Date
2025-03-25
Estimated Expiration
2036-03-31
Patent Text Reader

Abstract

A photosensitive resin composition is provided that has excellent pattern-forming properties even when forming a thick photosensitive layer of 70 μm or more. The present invention comprises: (A) component: a compound having a photopolymerizable functional group; and (B) component: a compound having a molar absorption coefficient of 8.0 × 10 for light having a wavelength of 365 nm. 3 and a photopolymerization initiator having a viscosity of less than 100µm / mol cm, wherein the photosensitive resin composition has an absorbance of less than 0.35 for light with a wavelength of 365nm when the thickness of the photosensitive resin composition is 50µm.
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Citation Information

Patent Citations

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