Resin molding device, covering body winding mechanism, and method for manufacturing resin molded product

Abstract

To provide a resin molding device equipped with the function of wrapping a cover around a resin material.SOLUTION: A resin molding device has: a cover wrapping mechanism 8 that wraps a cover 7 around the outer face of a resin material J; and a resin molding mechanism 10 that performs resin molding operation using the resin material J wrapped with the cover 7.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus, a covering winding mechanism, and a method for manufacturing a resin molded product. [Background technology]

[0002] 2. Description of the Related Art Resin molding methods using a resin material include a method of resin-sealing an object to be molded by pushing out a resin material contained in a pot of a molding die into a cavity of the molding die using a plunger.

[0003] Here, the resin material contained in the pot generates resin dust during transportation and installation in the pot. This resin dust not only has a negative effect on the sealing equipment but also requires cleaning work. For this reason, the resin pellets shown in Patent Document 1 have been considered as a means of preventing dust generation from the resin material. These resin pellets form a dust-preventing film made of aleurone and wax on the surface to suppress the generation of resin dust. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-291242 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the resin material in the pot is pushed out into the cavity by the plunger, the molten resin material penetrates into the sliding portion between the inner surface of the pot and the plunger, which results in the generation of resin residue.

[0006] To address this problem, the inventors of the present application have devised the idea of ​​reducing resin residue by placing a covering that surrounds the resin material between the inner surface of the pot and the resin material, making it more difficult for the molten resin material to penetrate into the sliding portion between the inner surface of the pot and the plunger.

[0007] The proposed configuration involves placing a covering body that surrounds the resin material between the inner surface of the pot and the resin material, and wrapping the covering body around the resin material before placing it in the pot, and then placing the resin material wrapped around the covering body in the pot.

[0008] Therefore, the present invention has been made to realize a specific configuration for placing a covering body that surrounds the resin material between the inner surface of the pot and the resin material, and its main objective is to provide a function for automatically wrapping a covering body around the resin material in a resin molding device. [Means for solving the problem]

[0009] In other words, the resin molding apparatus of the present invention is characterized by having a coating winding mechanism that winds a coating around the outer peripheral surface of a resin material, and a resin molding mechanism that performs resin molding using the resin material with the coating wound around it. Effect of the Invention

[0010] According to the present invention thus configured, it is possible to provide a function of automatically wrapping a coating around a resin material in a resin molding device. [Brief description of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view showing a schematic configuration of a resin molding mechanism of a resin molding apparatus according to an embodiment of the present invention; [Diagram 2] 4 is a schematic diagram showing an example of a coating surrounding the resin material of the embodiment; FIG. [Diagram 3] FIG. 2 is a functional block diagram of the resin molding apparatus according to the embodiment. [Figure 4] FIG. 2 is a perspective view showing a schematic configuration of a covering winding mechanism of the embodiment. [Diagram 5] 5A to 5C are diagrams illustrating the operation of the covering winding mechanism of the embodiment. [Figure 6] FIG. 2 is a perspective view showing a schematic configuration of a resin material transport mechanism according to the embodiment; [Figure 7] 5 is a cross-sectional view showing a schematic configuration of an opening of a storage section of a first transport section and a second transport section of the embodiment. FIG. [Figure 8] 6(a) is a cross-sectional view taken from the arrow A in FIG. 6(d) before the resin material is contained in the pot, and FIG. 6(b) is a cross-sectional view taken from the arrow B in FIG. 6(d), showing a schematic configuration of the transporting and containing section of the same embodiment. [Figure 9] 6(a) is a cross-sectional view taken from the arrow A in FIG. 6(d) after the resin material has been placed in the pot, and FIG. 6(b) is a cross-sectional view taken from the arrow B in FIG. 6(d), showing a schematic configuration of the transporting and storing section of the same embodiment. [Figure 10] 4A to 4C are diagrams for explaining a method for manufacturing a resin molded product according to the embodiment. [Figure 11] 4A to 4C are diagrams for explaining a method for manufacturing a resin molded product according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0013] As described above, the resin molding apparatus of the present invention is characterized by comprising a coating winding mechanism that winds a coating around the outer peripheral surface of a resin material, and a resin molding mechanism that performs resin molding using the resin material with the coating wound around it.

[0014] This resin molding device is equipped with a covering body winding mechanism that winds a covering body around the outer peripheral surface of the resin material, so that the resin molding device can be given a function of automatically winding a covering body around the resin material, and resin molding can be performed using the resin material wrapped with a covering body. As a result, a covering body that surrounds the resin material is placed between the inner surface of the pot and the resin material during resin molding, so that the resin material can be prevented from touching the inner surface of the pot, and resin residue that adheres to the inner surface of the pot can be reduced. In addition, since the resin material is surrounded by the covering body, even if the resin is a high-flow resin such as a mold underfill (MUF) resin or clear resin, the molten resin material is less likely to penetrate into the sliding part between the inner surface of the pot and the plunger, and resin residue generated by the resin material that has penetrated into the sliding part can be reduced. By reducing the resin residue in this way, contamination of the next resin molding can be reduced, and the quality of the resin molded product can be improved. In addition, equipment troubles caused by resin residue can be prevented, and the frequency of cleaning work can be reduced. Furthermore, by using the covering body, an increase in the sliding resistance of the plunger can be prevented, so that the quality of the resin molded product can be stabilized and the life span of the pot and plunger can be extended.

[0015] In order to simplify the process of wrapping the coating around the resin material, it is desirable for the coating winding mechanism to deform the coating from both circumferential sides of the resin material and wind the coating around the outer peripheral surface of the resin material.

[0016] In the case where the resin material is cylindrical, a specific embodiment of the coating winding mechanism preferably has a deformation section that deforms the coating from both circumferential sides of the resin material to align the coating with the outer peripheral surface of the resin material, and a rotation section that rotates the resin material together with the coating in a state in which the coating is aligned by the deformation section, around the central axis.

[0017] It is desirable that the coating winding mechanism has a mounting section on which the resin material is positioned and placed, and that with the resin material placed on the mounting section, the deformation section aligns the coating with the resin material. With this configuration, the deformation portion can stably perform the operation of fitting the covering body to the outer peripheral surface of the resin material.

[0018] It is desirable that the deformation portion has a curved contact surface that conforms to the outer peripheral surface of the resin material, and that the contact surface moves along the outer peripheral surface of the resin material to conform the coating to the outer peripheral surface of the resin material. With this configuration, since the deforming portion has a curved contact surface, the covering body can be fitted closely to the outer peripheral surface of the resin material without any gaps.

[0019] The covering body is sheet-shaped, and it is desirable that the width dimension of the covering body is such that it can cover the entire axial direction of the outer peripheral surface of the resin material, and that the length dimension of the covering body is such that it can be wrapped around the outer peripheral surface of the resin material one or more times. With this configuration, the entire outer peripheral surface of the resin material can be covered with the covering body, further reducing the amount of resin residue adhering to the inner surface of the pot.

[0020] It is preferable that the resin molding apparatus of the present invention further includes a transport mechanism that transports the resin material wrapped with the covering to the resin molding mechanism. With this configuration, operations from the coating winding mechanism to the resin molding mechanism can be carried out automatically.

[0021] It is preferable that the resin molding mechanism has a molding die in which a pot is formed, and that the cover is in close contact with the inner surface of the pot. By the cover being in close contact with the inner surface of the pot, the cover covers the peripheral portion of the tip surface of the plunger and blocks the sliding portion between the inner surface of the pot and the plunger, making it difficult for the molten resin material to penetrate into the sliding portion.

[0022] As a specific configuration for the covering to adhere to the inner surface of the pot, it is desirable that the covering adhere to the inner surface of the pot by the internal pressure applied by the resin material melted or softened in the pot. Here, the internal pressure applied by the melted or softened resin material occurs when the melted or softened resin material is pushed by the plunger and spreads in the circumferential direction during the injection operation by the plunger, or when the melted or softened resin material is pushed by the plunger and the cull portion of the mold and spreads in the circumferential direction. With this configuration, it is not necessary to adhere the covering to the inner surface of the pot when placing the covering in the pot, so that the covering can be easily placed in the pot.

[0023] In order to prevent the coating or components constituting the coating from being introduced into the cavity along with the molten resin material, it is desirable for the coating to be made of a material that does not melt or thermally decompose at the molding temperature.

[0024] Although the coating is extruded from the pot together with the molten resin material, it is not introduced into the cavity of the mold and remains in the cull or runner of the mold after the resin molding, and therefore the coating is discarded together with the resin remaining in the cull or runner after the resin molding.

[0025] In addition, the coating winding mechanism of the present invention is used in a resin molding device that performs resin molding using a resin material wrapped around a coating, and is characterized in that the coating is wound around the outer peripheral surface of the resin material one or more times before resin molding.

[0026] Furthermore, a method for producing a resin molded product using the above-mentioned resin molding apparatus is also an aspect of the present invention.

[0027] <One embodiment of the present invention> Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate. The same components are given the same reference numerals and the description thereof will be omitted as appropriate.

[0028] <Basic configuration of resin molding device 100> The resin molding apparatus 100 of this embodiment resin-moldes a molding object W to which an electronic component Wx is connected, by transfer molding using a resin material J.

[0029] Here, the molding object W may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, or the like, with or without wiring. The resin material J for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is, for example, a cylindrical tablet-like solid. The electronic component Wx connected to the upper surface of the molding object W may be, for example, an electronic element such as a bare chip, a resistor element, or a capacitor element, or at least one of these electronic elements sealed with resin.

[0030] Specifically, the resin molding apparatus 100 includes a resin molding mechanism 10 for molding resin using a resin material J, as shown in FIG. 1. The resin molding mechanism 10 includes one molding die 2 (hereinafter, lower die 2) in which a pot 21 for accommodating the resin material J is formed, the other molding die 3 (hereinafter, upper die 3) that is provided opposite the lower die 2 and in which a cavity 31 into which the resin material J is injected is formed, and a clamping mechanism (not shown) for clamping the lower die 2 and the upper die 3. The lower die 2 is provided on a movable platen (not shown) that is raised and lowered by the clamping mechanism via a lower die holding member 4. The upper die 3 is provided on an upper fixed platen (not shown) via an upper die holding member (not shown). The lower die holding member 4 includes, for example, a heater plate or a heat insulating plate.

[0031] In the lower die 2, for example, a plurality of pots 21 are formed so as to open on the upper surface of the lower die 2. The pots 21 are constituted by through holes 2H formed in the lower die 2, and the through holes 2H are formed by fitting cylindrical pot members 20 made of, for example, cemented carbide or steel into the lower die 2. The pots 21 have a shape corresponding to the shape of the resin material J, and in this embodiment, since the resin material J is cylindrical, the pots 21 also have a circular cross-sectional shape corresponding thereto. In addition, a mounting portion 22 is formed on the upper surface of the lower die 2, on which the molding object W is mounted.

[0032] A cavity 31 is formed on the lower surface (mold surface) of the upper mold 3 to accommodate the electronic component Wx of the molding object W mounted on the mounting portion 22 of the lower mold 2. A cull portion 32, which is a recess, is formed on the lower surface of the upper mold 3 in a portion facing the pot 21 of the lower mold 2, and a runner portion 33 is formed to connect the cull portion 32 and the cavity 31.

[0033] The resin molding mechanism 10 includes a plunger unit 5 having a plurality of plungers 51 for pushing out the resin material J contained in the plurality of pots 21 of the lower mold 2, and a drive mechanism 6 for moving the plunger unit 5 so that the plungers 51 move back and forth within the pots 21.

[0034] The plunger unit 5 is provided below the lower mold 2, and the plunger 51 is provided by being inserted into the through-hole 2H of the lower mold 2. The upper surface of the plunger 51 forms the bottom surface of the pot 21 of the lower mold 2. The plunger 51 presses the resin material J, which is heated and melted in the pot 21, from the pot 21 toward the upper mold 3.

[0035] The drive mechanism 6 moves the plunger unit 5 relative to the lower die 2, whereby the plunger 51 advances and retreats (moves up and down) within the pot 21. The drive mechanism 6 in this embodiment is provided on the opposite side of the plunger unit 5 to the lower die 2 (below the plunger unit 5). Here, the drive mechanism 6 may be, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod.

[0036] Then, when the plunger unit 5 is raised in a state in which the lower die 2 and the upper die 3 are clamped by the clamping mechanism, the resin material J melted by the heat of a heater (not shown) provided in the resin molding mechanism 10 is injected into the cavity 31. As a result, the electronic component Wx of the molding object W accommodated in the cavity 31 is sealed with resin.

[0037] <Characteristics of the manufacturing method for resin molded product P> Next, a characteristic feature of the method for producing the resin molded product P using the above-mentioned resin molding apparatus 100 will be described.

[0038] As shown in FIG. 1, when resin material J is placed in pot 21 of lower mold 2, cover 7 is placed between the inner surface of pot 21 and resin material J so that resin material J does not come into contact with the inner surface of pot 21.

[0039] The covering body 7 surrounds the entire circumference of the resin material J while opening the direction in which the resin material J is extruded within the pot 21. Specifically, the covering body 7 surrounds the entire circumference of the outer peripheral surface of the resin material J within the pot 21 without covering the upper surface of the resin material J.

[0040] The covering 7 is a consumable material that is discarded after each resin molding, and may be made of, for example, paper, resin, cellulose, woven fabric, nonwoven fabric, or a composite of these. Examples of composite materials include a resin film containing a filler, paper laminated with a resin film such as a heat-resistant film of 10 μm or less, paper coated with resin, paper impregnated with resin, and paper made by mixing pulp and resin fibers. These coverings 7 are made of a material that does not melt or pyrolyze at the molding temperature (for example, about 170° C.) required for resin sealing with the resin material J.

[0041] Specifically, as shown in FIG. 2, the covering body 7 is, for example, a rectangular sheet-like body, and is arranged in the pot 21 in a state where it is wrapped around the outer peripheral surface of the resin material J. Here, as shown in the development view of FIG. 2(d), the width dimension L1 of the covering body 7 is a dimension that covers the entire axial direction of the outer peripheral surface of the resin material J, and the length dimension L2 of the covering body 7 is a dimension that allows the covering body 7 to be wrapped around the outer peripheral surface of the resin material J one or more times. For example, the width dimension L1 of the covering body 7 is about 0.5 to 3 mm longer than the width dimension of the resin material J, and the length dimension L2 of the covering body 7 is 1.1 to 1.5 times the circumference of the outer circumference of the resin material J, assuming that the circumference of the resin material J is one revolution. By configuring the covering body 7 in this way by wrapping the sheet-like covering body 7 around the resin material J, the configuration of the covering body 7 can be simplified and the processing cost can be reduced.

[0042] Moreover, the thickness of the covering body 7 is larger than the clearance (gap) between the inner surface of the pot 21 and the plunger 51, and the covering body 7 itself is configured not to enter the sliding portion between the inner surface of the pot 21 and the plunger 51. For example, when the clearance is 10 μm, the thickness of the covering body 7 is 50 μm.

[0043] The covering body 7 is configured to be in close contact with the inner surface of the pot 21. Specifically, the covering body 7 is configured to be in close contact with the inner surface of the pot 21 by the internal pressure applied from the resin material J melted or softened in the pot 21. In this embodiment, the covering body 7 is wrapped around the resin material J and is not constrained in the circumferential direction, so that the resin material J and the covering body 7 are not in close contact with each other and a gap may be generated between them. As a result, the covering body 7 is likely to spread in the radial direction by the internal pressure applied from the molten or softened resin material J, and is likely to be in close contact with the inner surface of the pot 21. The internal pressure applied from the molten or softened resin material J is mainly a pressure generated by the molten or softened resin material J being pushed by the plunger 51 and spreading in the circumferential direction during the injection operation by the plunger 51, or the molten or softened resin material J being pushed by the plunger 51 and the cull portion 32 of the upper die 3 and spreading in the circumferential direction.

[0044] By configuring the covering 7 to adhere closely to the inner surface of the pot 21 in this manner, the covering 7 blocks the sliding portion between the inner surface of the pot 21 and the plunger 51, making it even more difficult for the molten resin material J to penetrate into the sliding portion. Also, since the covering 7 adheres closely to the inner surface of the pot 21 due to the internal pressure applied from the resin material J melted or softened in the pot 21, there is no need to adhere the covering 7 to the inner surface of the pot 21 when placing the covering 7 in the pot 21, making it easier to place the covering 7 in the pot 21.

[0045] <Configuration for automating the manufacturing method of resin molded product P> As a configuration for automating the above-mentioned manufacturing method of the resin molded product P, the resin molding apparatus 100 of this embodiment further includes a coating body winding mechanism 8 that winds a coating body 7 around the outer peripheral surface of the resin material J, and a resin material transport mechanism 9 that transports the resin material J wrapped with the coating body 7 to a resin molding mechanism 10, as shown in Fig. 3 to Fig. 6, and the resin molding mechanism 10 performs resin molding using the resin material J wrapped with the coating body 7. Note that, as shown in Fig. 3, the coating body winding mechanism 8, the resin material transport mechanism 9 and the resin molding mechanism 10 are controlled by a control unit COM.

[0046] <Covering body winding mechanism 8> The coating winding mechanism 8, as shown in Figs. 4 and 5, deforms the coating 7 from both circumferential sides of the cylindrical resin material J, and winds the coating 7 around the outer peripheral surface of the resin material J.

[0047] Specifically, the coating winding mechanism 8 has a mounting section 81 on which the resin material J is positioned and placed, a deformation section 82 that deforms the coating 7 from both circumferential sides of the resin material J placed on the mounting section 81 to align the coating 7 with the outer peripheral surface of the resin material J, and a rotation section 83 that rotates the resin material J with the coating 7 aligned by the deformation section 82 together with the coating 7 around the central axis.

[0048] The placement unit 81 receives the resin material J from the resin material supply unit 11 (see FIG. 4) and positions the resin material J. The placement unit 81 in this embodiment positions the resin material J so that the central axis of the resin material J does not shift when the resin material J is laid on its side along the horizontal direction. Specifically, the placement unit 81 has a placement surface 81a shaped to fit and fix the laid-on resin material J. The placement surface 81a in this embodiment has a V-shaped cross section, but may also have a polygonal cross section (the cross section is the inner shape of a polygon) or a partially circular cross section (the cross section is the shape of a part of the inner side of a circle).

[0049] The deformation portion 82 has a curved contact surface 82a that conforms to the outer peripheral surface of the resin material J, and the contact surface 82a moves along the outer peripheral surface of the resin material J, thereby causing the coating 7 to conform to the outer peripheral surface of the resin material J. Specifically, the contact surface 82a has a shape that corresponds to a portion of the inside of a hollow cylinder.

[0050] Two of the deformation units 82 are provided so as to sandwich the resin material J from both sides. Specifically, the two deformation units 82 are provided along a direction perpendicular to the central axis of the resin material J in a lying state. Each of the two deformation units 82 is provided so as to be movable up and down by a gripping arm 84. The two deformation units 82 are also configured so that the distance between them can be enlarged or reduced by the gripping arm 84. Furthermore, each deformation unit 82 is provided so as to be rotatable with respect to the gripping arm 84, and for example, rotates with respect to the gripping arm 84 while moving along the outer peripheral surface of the resin material J. The gripping arm 84 moves in the up and down directions and in the enlargement and reduction directions by a driving unit 85. As the driving unit 85, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod can be used.

[0051] As shown in FIG. 5(a), the deforming portion 82 is in the raised position by the gripping arm 84, and the covering body 7 in the developed state is placed on the resin material J placed on the placement portion 81. Then, as shown in FIG. 5(b), when the deforming portion 82 is lowered by the gripping arm 84, the deforming portion 82 deforms the covering body 7 to bring the covering body 7 into a state along the outer peripheral surface of the resin material J. Thereafter, the gripping arm 84 reduces the distance between the two deforming portions 82 and raises the gripping arm 84. As a result, as shown in FIG. 5(c), the resin material J is lifted from the placement portion 81, and the contact surface 82a moves along the outer peripheral surface of the resin material J, so that the covering body 7 covers the entire outer peripheral surface of the resin material J. In addition, in this state, one end of the covering body 7 is located inside the other end of the covering body 7, and the other end of the covering body 7 is in a state of extending downward from between the two deforming portions 82.

[0052] The rotating unit 83 rotates the resin material J together with the coating 7, with the coating 7 being conformed by the deformation unit 82, around the central axis, thereby wrapping the entire coating 7 around the outer peripheral surface of the resin material J without any gaps.

[0053] 5(d), in a state in which the resin material J has been lifted from the placement part 81 by the two deformation parts 82, the rotating part 83 comes into contact with the covering body 7 and rotates the resin material J and the covering body 7 about the central axis to wrap the entire covering body 7 around the resin material J. Here, the rotating part 83 is provided at a position where it comes into contact with the upper part of the lifted resin material J. In addition, the rotating part 83 is configured using a motor and a roller rotated by the motor.

[0054] Specifically, the rotating section 83 rotates the coating 7 and the resin material J so that the other end of the coating 7 (the portion extending downward from between the two deformation sections 82) is aligned with the outer peripheral surface of the resin material J, and in FIG. 5(d), the coating 7 and the resin material J are rotated clockwise. As a result, the coating 7 is wrapped around the outer peripheral surface of the resin material J by one or more turns, and the resin material J is packaged by the coating 7. Hereinafter, the resin material J with the coating 7 wrapped around its outer peripheral surface is referred to as the "coated resin material J."

[0055] 4 and 6, the coating winding mechanism 8 has a push unit 86 that pushes out the coated resin material J to the transport mechanism 9 and delivers it thereto. The push unit 86 delivers the coated resin material J, which is held by the two deformation units 82 and laid down, to the transport mechanism 9 by pushing it out along the central axis. Specifically, the push unit 86 has a push member 861 that pushes out both the resin material J and the coating 7, and a drive unit 862 that moves the push member 861 back and forth. Note that the drive unit 862 may be, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod.

[0056] The push member 861 has a shape capable of pushing out both the resin material J and the covering 7 without interfering with the two deformation portions 82, and is, for example, T-shaped (see FIG. 4). This T-shaped push member 861 pushes the upper portions of the two deformation portions 82 in the resin material J, and also pushes the portion between the two deformation portions 82, as shown in FIG. 5(e).

[0057] <Resin material transport mechanism 9> As shown in FIG. 6, the resin material transport mechanism 9 transports the coated resin material J to the resin molding mechanism 10 and stores the coated resin material J in the pot 21 of the lower mold 2.

[0058] As shown in Figure 6, the resin material conveying mechanism 9 of this embodiment has a first conveying section 91 that receives the coated resin material J from the coating body winding mechanism 8, a second conveying section 92 that receives the coated resin material J from the first conveying section 91, and a conveying and storing section 93 that receives the coated resin material J from the second conveying section 92 and stores it in the pot 21.

[0059] In addition, in Figure 6, (a) shows the state of delivery from the coating body winding mechanism 8 to the first conveying section 91, (b) shows the state of delivery from the first conveying section 91 to the second conveying section 92, (c) shows the state of delivery from the second conveying section 92 to the conveying and storing section 93, and (d) shows the state of delivery from the conveying and storing section 93 to the pot 21.

[0060] The first conveying section 91 conveys the coated resin material J from the coating body winding mechanism 8 to the second conveying section 92, and has one or more storage sections 91a for storing the coated resin material J. The storage section 91a is a storage space having a circular cross section in accordance with the cylindrical shape of the resin material J. The storage section 91a is formed in the first storage member 911. As shown in FIG. 7, the storage section 91a of the first conveying section 91 is formed so as to open on the surfaces of the first storage member 911 facing each other. Then, in a state where the first storage member 911 is positioned to the side of the coating body winding mechanism 8 (see FIG. 6(a)), the coated resin material J is introduced from an opening formed on one surface. Also, the first storage member 911 is moved to a transfer position to the second conveying section 92 by a moving mechanism (not shown) (see FIG. 6(b)), and in this state, the coated resin material J is discharged from an opening formed on the other surface.

[0061] As shown in Fig. 7, the inside diameter of the opening, which is the end of the storage section 91a of the first transport section 91 on the side where the coated resin material J is placed, is configured to increase toward the opening side. Here, a tapered surface 91b is formed at the opening. With this configuration, the coating body 7 is less likely to get caught on the opening when storing the coated resin material J, and the coating body 7 can be smoothly stored in the storage section 91a. In addition, it is possible to prevent the end of the coating body 7 from bending, resulting in an uncovered portion on the outer peripheral surface of the resin material J.

[0062] As shown in FIG. 6(b), the first transport section 91 has a push section 912 that pushes out the coated resin material J from the storage section 91a of the first storage member 911 to the second transport section 92 and delivers it to the second transport section 92. The push section 912 delivers the coated resin material J to the second transport section 92 by pushing it out along the central axis. Specifically, the push section 912 has a push member 912a that pushes out both the resin material J and the coating 7, and a drive section (not shown) that moves the push member 912a forward and backward. The push member 912a has a shape that can push out both the resin material J and the coating 7, and is, for example, a flat plate shape. The first storage member 911 has a slit 911S that can push out both the resin material J and the coating 7 by the flat plate-shaped push member 912a. The push member 912a delivers a plurality of coated resin materials J to the second transport section 92 all at once.

[0063] As shown in FIG. 6, the second conveying section 92 conveys the coated resin material J from the first conveying section 91 to the conveying and storing section 93, and has one or more storing sections 92a (see FIG. 7) for storing the coated resin material J, similar to the first conveying section 91. Since the resin material J is cylindrical, the storing section 92a is a storing space having a circular cross section to match the cylindrical shape of the resin material J. The storing section 92a is formed in the second storing member 921. The storing section 92a of the second conveying section 92 is an opening formed on one side of the second storing member 921, through which the coated resin material J is put in and taken out.

[0064] As shown in Fig. 7, the inner diameter of the opening, which is the end of the storage section 92a of the second transport section 92 on the side where the coated resin material J is placed, is configured to increase toward the opening side. Here, a tapered surface 92b is formed at the opening. With this configuration, the coating body 7 is less likely to get caught on the opening when storing the coated resin material J, and the coating body 7 can be smoothly stored in the storage section 92a. In addition, it is possible to prevent the end of the coating body 7 from bending, resulting in an uncovered portion on the outer peripheral surface of the resin material J.

[0065] The second conveying section 92 also has a push section 922 that pushes out and delivers the coated resin material J from the storage section 92a of the second storage member 921 to the second conveying section 92. The push section 922 delivers the coated resin material J to the conveying and storing section 93 by pushing it upward along the central axis direction. Here, the conveying and storing section 93 is provided above the second conveying section 92, and the second conveying section 92 receives the resin material J from the first conveying section 91 in a horizontal state (see FIG. 6(b)), and delivers the resin material J to the conveying and storing section 93 in an upright state rotated 90 degrees (see FIG. 6(c)). The second conveying section 92 can be rotated by a drive section (not shown) such as a motor.

[0066] Specifically, the push unit 922 has a push member 922a that pushes out both the resin material J and the covering body 7, and a drive unit 922b that moves the push member 922a forward and backward. The push member 922a has a shape that can push out both the resin material J and the covering body 7, for example, a flat plate shape. Similarly to the first housing member 911, the second housing member 921 has a slit (not shown) that can push out both the resin material J and the covering body 7 with the flat plate-shaped push member 922a. The push member 922a transfers a plurality of coated resin materials J to the conveying housing unit 93 all at once.

[0067] As shown in FIG. 6, the conveying and storing section 93 conveys and inputs the coated resin material J from the second conveying section 92 to the pot 21, and has one or more storage sections 93a (see FIG. 8 and FIG. 9) for storing the coated resin material J, similar to the first conveying section 91. The storage section 93a is a storage space having a circular cross section corresponding to the cylindrical shape of the resin material J. The storage section 93a is formed in the third storage member 931. The storage section 93a of the conveying and storing section 93 is inserted and removed from the opening formed on the lower surface of the third storage member 931. In addition, the third storage member 931 is provided with a holding shutter 932 that temporarily holds the coating body 7 and the resin material J stored in the storage section 93a so that they do not fall, as shown in FIG. 8(b) and FIG. 9(b). The position of the holding shutter 932 may be any position that can hold the coating body 7 and the resin material J relative to the storage section 93a. Furthermore, the third storage member 931 is moved by a moving mechanism (not shown) to a position for delivery to the pot 21 (here, a position where the storage portion 93a and the pot 21 are vertically aligned) (see FIGS. 6(d), 8 and 9).

[0068] 8 and 9, the inner diameter of the opening, which is the end of the storage section 93a of the transport storage section 93 into which the coated resin material J is pushed, is configured to increase toward the opening side. Here, a tapered surface 93b is formed at the opening. With this configuration, the coating body 7 is less likely to get caught in the opening when storing the coated resin material J, and the coating body 7 can be smoothly stored in the storage section 93a. It is also possible to prevent the end of the coating body 7 from bending, resulting in an uncovered portion on the outer peripheral surface of the resin material J.

[0069] The transporting and storing section 93 also has a push section 933 that pushes out and delivers the coated resin material J from the storing section 93a of the third storing member 931 to the pot 21. The push section 933 charges the coated resin material J into the pot 21 by pushing it downward along the central axis. That is, the resin material J is put in and taken out from the opening of the storing section 93a, which is configured to become larger toward the opening side. Here, the storing section 93a of the transporting and storing section 93 is positioned above the pot 21, and the push section 933 pushes both the covering body 7 and the resin material J downward to store the coated resin material J in the pot 21. When the push section 933 stores the coated resin material J in the pot 21, the holding shutter 932 is opened (see FIG. 9(b)). In FIG. 9(b), the holding shutter 932 is configured to move in a direction perpendicular to the arrangement direction of the pots 21 (or the storage portion 93a), but it may be configured to move in another direction (for example, the arrangement direction of the pots 21 (or the storage portion 93a)).

[0070] Specifically, the push section 933 has a push member 933a that pushes out both the resin material J and the covering body 7, and a drive section (not shown) that moves the push member 933a forward and backward. The push member 933a has a shape that can push out both the resin material J and the covering body 7, for example, a flat plate shape. In detail, the push member 933a has a push end portion 933a1 that is in a flat plate shape and is separated for each pot 21, and the upper portions of the multiple push end portions 933a1 are connected to each other, so that the push member 933a can push out both the resin material J and the covering body 7 to each pot 21. In addition, the third storage member 931 has a slit 933s (see FIG. 8 and FIG. 9) that can push out both the resin material J and the covering body 7 by the flat push end portion 933a1. In addition, the multiple coated resin materials J are delivered to the pot 21 all at once by the push member 933a.

[0071] 8 and 9, a protrusion 933a2 for pushing the resin material J is formed on the surface (lower surface) of the push end 933a1 that pushes the coating 7 and the resin material J. This configuration makes it possible to prevent the coating 7 from being damaged compared to a case in which the surface (lower surface) of the push end 933a1 that pushes the coating 7 and the resin material J is a flat surface. When the surface (lower surface) of the push end 933a1 that pushes the coating 7 and the resin material J is a flat surface, the shape of the push member 933a is simple and easy to design, and costs can be reduced.

[0072] <Overall process of manufacturing resin molded product P> Next, a description will be given of an example of the operation of the resin molding apparatus 100. In this embodiment, all operations of the resin molding apparatus 100, such as the coating body winding operation of the coating body winding mechanism 8, the resin material transport operation of the resin material transport mechanism 9, and the resin molding operation of the resin molding mechanism 10, are performed and controlled by the control unit COM (see FIG. 3).

[0073] <Coating winding operation> 5(a), the resin material J supplied from the resin material supply unit 11 is placed on the placement unit 81 of the covering winding mechanism 8. In this state, the covering 7 in an unfolded state is transported above the resin material J by a transport mechanism (not shown).

[0074] 5(b), the two deformation parts 82 of the covering winding mechanism 8 descend to deform the covering 7 along the outer peripheral surface of the resin material J. Next, as shown in FIG. 5(c), the distance between the two deformation parts 82 is reduced, so that the two deformation parts 82 lift up the resin material J together with the covering 7. At this time, the covering 7 wound around the resin material J comes into contact with the rotating part 83.

[0075] In this state, as shown in FIG. 5(d), by rotating the rotating portion 83, the coating 7 rotates together with the resin material J, and the entire coating 7 is wrapped around the resin material J without any gaps.

[0076] After the covering body 7 is wound, as shown in Fig. 5(e), the push unit 84 pushes the covering body 7 and the resin material J to deliver the coated resin material J to the storage unit 91a of the first conveying unit 91. If the first conveying unit 91 has multiple storage units 91a, the above operation is repeated to deliver the coated resin material J to the multiple storage units 91a.

[0077] <Transportation operation> After receiving the coated resin material J in the state shown in Fig. 6(a), the first conveying section 91 moves to a transfer position to the second conveying section 92 as shown in Fig. 6(b). At this transfer position, the storage section 91a of the first conveying section 91 and the storage section 92a of the second conveying section 92 face each other in the horizontal direction. Then, the push section 912 of the first conveying section 91 pushes the coated resin material J stored in the storage section 91a in the horizontal direction and transfers it to the storage section 92a of the second conveying section 92.

[0078] Next, after receiving the coated resin material J, the second conveying section 92 rotates 90 degrees to an upright state as shown in Fig. 6(c). In this state, the storage section 92a of the second conveying section 92 and the storage section 93a of the conveying and storing section 93 face each other in the up-down direction. Then, the push section 922 of the second conveying section 92 pushes the coated resin material J stored in the storage section 92a upward and transfers it to the storage section 93a of the conveying and storing section 93. After receiving the coated resin material J in the storage section 93a, the conveying and storing section 93 closes the holding shutter 932 to hold the coating body 7 and the resin material J so that they do not fall.

[0079] After receiving and holding the coated resin material J, the transport and storage section 93 moves to a position for feeding the coated resin material J into the pot 21 as shown in FIG. 6(d). At this feeding position, the storage section 93a of the transport and storage section 93 and the pot 21 face each other in the vertical direction (see FIG. 8). Then, the holding shutter 932 of the transport and storage section 93 opens, and the push section 933 of the transport and storage section 93 pushes out at least the coating body 7 of the coated resin material J stored in the storage section 93a and stores it in the pot 21 (see FIG. 9). In this embodiment, the push section 933 pushes out both the coating body 7 and the resin material J, so that the coating body 7 can be reliably pushed to the back of the pot 21. In this embodiment, the width dimension L1 of the coating body 7 is longer than the width dimension of the resin material J by about 0.5 to 3 mm, so that the coating body 7 can be fed to the bottom of the pot 21 together with the resin material J that falls under its own weight without significant damage. Through the above series of operations, the coated resin material J is stored in the pot 21.

[0080] <Resin molding operation> By the above operation, the resin material J and the covering body 7 are contained in the pot 21, and the object W is attached to the attachment portion 22 of the lower mold 2 using another object transport mechanism (not shown), as shown in FIG. 10(a).

[0081] 10(b), the upper die 3 and the lower die 2 are clamped together to sandwich the object W between the upper die 3 and the lower die 2. At this time, the electronic component Wx of the object W is accommodated in the cavity 31 of the upper die 3.

[0082] Then, the molten resin material J in the pot 21 is pushed out by the plunger 51. As a result, the molten resin material J passes through the cull portion 32 and the runner portion 33 of the upper die 3 and is introduced into the cavity 31, as shown in FIG.

[0083] 11(a), the molten resin material J is heated for a time required for hardening, thereby hardening the resin material J to form a hardened resin. As a result, the electronic component Wx in the cavity 31 and the surrounding substrate are sealed in the hardened resin (sealing resin) molded to correspond to the shape of the cavity 31.

[0084] Next, after the time required for curing has elapsed, the upper mold 3 and the lower mold 2 are opened, and the encapsulated substrate (resin molded product P) is released together with the unnecessary resin J1 as shown in FIG. 11(b), and transported together. Here, the unnecessary resin J1 consists of the resin (cull J11) remaining in the cull portion 32 and the resin (runner J12) remaining in the runner portion 33. Thereafter, in another space away from the molding dies (upper mold 3 and lower mold 2), the unnecessary resin J1 is removed from the resin molded product P as shown in FIG. 11(c), and the unnecessary resin J1 is discarded. Here, after the resin molding, the coating 7 remains in the cull portion 32 or the runner portion 33, and is included in the unnecessary resin J1 (cull J11 or runner J12) remaining in the cull portion 32 and the runner portion 33, and is discarded together with the unnecessary resin J1.

[0085] <Effects of this embodiment> According to the resin molding apparatus 100 of the present embodiment, since the resin molding apparatus 100 is provided with a covering body winding mechanism 8 that winds the covering body 7 around the outer peripheral surface of the resin material J, the resin molding apparatus 100 can be provided with a function of automatically winding the covering body 7 around the resin material J, and resin molding can be performed using the resin material J in a state in which the covering body 7 is wound around it. As a result, the covering body 7 that surrounds the resin material J is disposed between the inner surface of the pot 21 and the resin material J during resin molding, so that the resin material J can be prevented from touching the inner surface of the pot 21, and the resin residue that adheres to the inner surface of the pot 21 can be reduced. In addition, since the resin material J is surrounded by the covering body 7, even if the resin material J is a high-flow resin such as a mold underfill (MUF) resin or clear resin, the molten resin material J is less likely to enter the sliding portion between the inner surface of the pot 21 and the plunger 51, and the resin residue generated by the resin material J that has entered the sliding portion can be reduced. Here, since the covering body 7 is open in the direction in which the resin material J is extruded, it does not interfere with the extrusion of the resin material J by the plunger 51.

[0086] By reducing the resin residue in this way, contamination of the next resin molding can be reduced, improving the quality of the resin molded product P. Also, equipment trouble caused by the resin residue can be prevented, and the frequency of cleaning work can be reduced. Furthermore, by using the cover 7, an increase in the sliding resistance of the plunger 51 can be prevented, realizing stabilization of the quality of the resin molded product P and realizing a longer life for the pot 21 and the plunger 51.

[0087] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0088] For example, in the above embodiment, the pot is formed in the lower mold and the cavity is formed in the upper mold, but the pot or the cavity may be formed in either mold.

[0089] Furthermore, the pot and plunger are not limited to those having a circular cross section, but may have other shapes, such as a rectangular cross section or other polygonal cross sections.

[0090] Furthermore, although the resin material transport mechanism in the above embodiment is divided into three parts, the first transport section, the second transport section, and the transport storage section, the first transport section and the second transport section may be configured as a single transport section, or the second transport section and the transport storage section may be configured as a single transport section. Also, the resin material may be transported from the coating winding mechanism to the pot by a single transport section.

[0091] Furthermore, the resin molding device is not limited to a multi-plunger type, and may be one having one plunger. In this case, the plunger unit has a configuration having one plunger.

[0092] Furthermore, the pair of molds is not limited to an upper mold and a lower mold, but may be other molds that can be used for transfer molding (for example, a top-gate type mold in which an intermediate plate exists).

[0093] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0094] 100...Resin molding equipment J...Resin material P...Resin molded product 10...Resin molding mechanism 21. Pot 2...Molding mold (lower mold) 32. Cal Department 33 Runner section 7...covering body 8. Cover winding mechanism 81 ... Placement section 82... Deformation section 82a...Contact surface 83 Rotating part 9. Resin material transport mechanism 91a... Storage unit 92a... Storage section 93a... Storage unit

Claims

1. A coating winding mechanism that winds a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, The coating winding mechanism deforms the coating from both circumferential sides of the resin material to wind the coating around the outer circumferential surface of the resin material.

2. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, The coating winding mechanism is a resin molding device that has a deformation unit that deforms the coating from both circumferential sides of the resin material to align the coating with the outer peripheral surface of the resin material, and a rotation unit that rotates the resin material together with the coating in a state in which the coating is aligned by the deformation unit, around a central axis.

3. The resin molding apparatus according to claim 2, wherein the coating winding mechanism has a placement section on which the resin material is positioned and placed, and the deformation section aligns the coating with the resin material when the resin material is placed on the placement section.

4. The resin molding apparatus according to claim 2 or 3, wherein the deformation portion has a curved contact surface that conforms to an outer peripheral surface of the resin material, and the contact surface moves along the outer peripheral surface of the resin material to conform the coating body to the outer peripheral surface of the resin material.

5. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, The covering body is in a sheet shape, The width dimension of the covering body is a dimension capable of covering the entire outer peripheral surface of the resin material in the axial direction, A resin molding apparatus, wherein the length of the covering body is such that the outer circumferential surface of the resin material can be wrapped around the covering body one or more times.

6. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the coating body; a resin material transport mechanism that transports the resin material wrapped around the covering to the resin molding mechanism.

7. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, the resin molding mechanism has a molding die in which a pot is formed, A resin molding apparatus, wherein the covering body is in close contact with the inner surface of the pot.

8. 8. The resin molding apparatus according to claim 7, wherein the covering body is brought into close contact with the inner surface of the pot by an internal pressure applied from the resin material melted or softened within the pot.

9. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, A resin molding apparatus, wherein the covering body is made of a material that does not melt or thermally decompose at molding temperatures.

10. A coating winding mechanism for winding a coating around an outer peripheral surface of a cylindrical resin material; a resin molding mechanism that performs resin molding using the resin material wrapped around the covering body, The resin molding apparatus, wherein the coating remains in a cull portion or a runner portion of a molding die after the resin molding, and is discarded together with the resin remaining in the cull portion or the runner portion.

11. The resin molding device is used in a resin molding apparatus that performs resin molding using a cylindrical resin material wrapped around a coating body, a covering body winding mechanism that deforms the covering body from both circumferential sides of the resin material before resin molding, and winds the covering body around an outer peripheral surface of the resin material one or more times.

12. A resin molding device for molding resin using a resin material wrapped around a coating body, Before the resin molding, the covering is wrapped around an outer peripheral surface of the resin material at least once. The covering body is in a sheet shape, The width dimension of the covering body is a dimension capable of covering the entire outer peripheral surface of the resin material in the axial direction, A covering winding mechanism, the covering having a length dimension that allows the covering to be wound around the outer circumferential surface of the resin material one or more times.

13. A method for producing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 10.

Images