Evaporation source for vacuum deposition equipment

Abstract

To provide a vacuum deposition source of a vacuum deposition apparatus without losing a function of adjusting a vacuum deposition rate at a good response while an enlargement of an apparatus and a complication of a control are avoided.SOLUTION: A vapor deposition source DS arranged in a vacuum chamber 1 DS for a vacuum deposition apparatus Dm according to the invention sublimates or vaporizes a vapor deposition material Ms to deposit on a substrate to be deposited Sw. The vapor deposition source includes a container Mb in which the vapor deposition material is filled and heating means Ht for heating the vapor deposition material in the container. The container has an inflow entrance 51a that faces an inside of the container and includes a discharge passage 51 that allows a discharge of the vapor deposition material vaporized or sublimated by heating to inside the vacuum chamber. A conductance adjustment plate 6 is rotatably incorporated in the container, the conductance adjustment plate partitioning the inside of the container to a first space 4a of a vapor deposition source side and a second space 5a of an inflow entrance side. A valve member 6b and a dispersion hole 6a penetrating through in a plate thickness direction are arranged in the conductance adjustment plate, the valve member selectively blocking the inflow entrance of the discharge passage according to a rotation position of the conductance adjustment plate.SELECTED DRAWING: Figure 2

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