Heat dissipation board

JP7662505B2Active Publication Date: 2025-04-15DENSO CORP +2
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Patent Information

Application Number
JP2021207167
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-21
Publication Date
2025-04-15
Estimated Expiration
2041-12-21

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Abstract

To prevent an increase in heat resistance which is caused when a metal plate is interposed between a graphite plate and a semiconductor device.SOLUTION: A heat dissipation substrate 6 on which a semiconductor device 8 is mounted comprises: a graphite plate 14, having a pair of principal surfaces 14S1 and 14S2, which is formed by laminating a plurality of graphenes 14a in a surface direction; and a metal plate 16 which is bonded to one of the principal surfaces of the graphite plate. The metal plate has a groove 16a in which the semiconductor device is placed. In a direction perpendicular to a lamination direction of the plurality of graphenes, at least portions of the metal plate are arranged so as to face each other across the groove.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • JP1992048624U

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    JP2005101353A

  • Power semiconductor module

    JP2008066610A

  • Semiconductor package

    JP2021100006A