Composition, cured product, and method for producing the cured product

Abstract

The purpose of the present invention is to provide a composition able to form a cured product having high adhesive strength.　The present invention is a composition having a cationically polymerizable component and an acid generator. The cationically polymerizable component contains an alkylene oxide-modified bisphenol-type epoxy compound, a first epoxy compound having an epoxy equivalent weight of 400 or more, and a second epoxy compound having an epoxy equivalent weight of less than 400. The content of the alkylene oxide-modified bisphenol-type epoxy compound is preferably 5-80 parts by mass relative to 100 parts by mass of the cationically polymerizable component.

Description

[Technical field]

[0001] The present invention relates to a composition having a cationically polymerizable component containing a specific epoxy compound and an acid generator. [Background technology]

[0002] In electronic substrates, adhesives are sometimes used as a method for bonding components such as semiconductors and optical components onto insulating substrates. Due to the recent trend toward high integration of electronic substrates, high positional accuracy is required for bonding components. Patent documents 1 and 2 disclose a method in which an adhesive is used to perform temporary fixing through an ultraviolet irradiation process, and then a heating process is used to perform permanent fixing. Patent documents 1 and 2 also disclose a composition whose main ingredient is an epoxy resin as an adhesive used for bonding optical components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-019286 A [Patent Document 2] JP 2019-073574 A Summary of the Invention

[0004] However, the adhesives described in Patent Documents 1 and 2 sometimes have insufficient adhesive strength.

[0005] The present invention has been made in consideration of the above problems, and has an object to provide a composition capable of forming a cured product having high adhesive strength.

[0006] As a result of intensive research, the present inventors have found that in a composition containing a cationically polymerizable component including an epoxy compound and an acid generator, excellent adhesive strength can be exhibited by using an alkylene oxide-modified bisphenol epoxy compound, an epoxy compound having an epoxy equivalent of a predetermined amount or more, and an epoxy compound having an epoxy equivalent of less than a predetermined amount in combination, and have thus completed the present invention.

[0007] That is, the present invention relates to a composition comprising a cationically polymerizable component and an acid generator, the cationically polymerizable component comprising a compound represented by the following general formula (A), a first epoxy compound having an epoxy equivalent of 400 or more and being an epoxy compound other than the compound represented by the following general formula (A), and a second epoxy compound having an epoxy equivalent of less than 400 and being an epoxy compound other than the compound represented by the following general formula (A).

[0008] [ka] (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 12 carbon atoms, a halogen atom, or a group in which a hydrogen atom in the alkyl group or aryl group is substituted with a halogen atom, Z 1 and Z 2 each independently represents a linear or branched alkylene group having 1 to 10 carbon atoms, or a group in which a hydrogen atom of the alkylene group is substituted with a halogen atom, m 1 and m 2 each independently represents an integer of 0 to 20, m 1 and m 2 The sum of is an integer between 1 and 30.)

[0009] In the present invention, m in the above general formula (A) 1 and m 2 The sum of these is preferably an integer of 1 to 15.

[0010] In the present invention, the content of the compound represented by the above general formula (A) is preferably 5 parts by mass or more and 80 parts by mass or less in 100 parts by mass of the above cationically polymerizable component.

[0011] In the present invention, it is preferable that the first epoxy compound is an aromatic epoxy compound, and the second epoxy compound is an aliphatic epoxy compound. In particular, it is preferable that the first epoxy compound is a bisphenol type epoxy compound, and the second epoxy compound is a hydrogenated bisphenol type epoxy compound.

[0012] In the present invention, the total content of the first epoxy compound and the second epoxy compound is preferably 20 parts by mass or more and 80 parts by mass or less in 100 parts by mass of the cationically polymerizable component.

[0013] In the present invention, the acid generator preferably contains a triarylsulfonium salt and a monoarylsulfonium salt.

[0014] In the present invention, it is preferable that the composition contains a polyfunctional alcohol compound, and that the polyfunctional alcohol compound contains at least one of an aromatic alcohol compound and an aliphatic alcohol compound.

[0015] The present invention provides a cured product of the above-mentioned composition.

[0016] The present invention provides a method for producing a cured product, which comprises a step of polymerizing the cationically polymerizable component in the above-mentioned composition. [Brief description of the drawings]

[0017] [Figure 1]FIG. 1 is a diagram showing a method for evaluating the adhesive strength of a composition. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The present invention relates to a composition, a cured product thereof, and a method for producing the cured product. The composition, the cured product, and the method for producing the cured product of the present invention will be described in detail below.

[0019] A. Composition First, the composition of the present invention will be described. The composition of the present invention comprises a cationically polymerizable component and an acid generator, the cationically polymerizable component comprising a compound represented by the following general formula (A), a first epoxy compound having an epoxy equivalent of 400 or more and being an epoxy compound other than the compound represented by the following general formula (A), and a second epoxy compound having an epoxy equivalent of less than 400 and being an epoxy compound other than the compound represented by the following general formula (A).

[0020] [ka] (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 12 carbon atoms, a halogen atom, or a group in which a hydrogen atom in the alkyl group or aryl group is substituted with a halogen atom, Z 1 and Z 2 each independently represents a linear or branched alkylene group having 1 to 10 carbon atoms, or a group in which a hydrogen atom of the alkylene group is substituted with a halogen atom, m 1 and m 2 each independently represents an integer of 0 to 20, m 1 and m 2 The sum of these represents an integer between 1 and 30.)

[0021] According to the present invention, a cured product having high adhesive strength can be formed. The reason why the composition exhibits such effects by containing the compound represented by general formula (A) (hereinafter sometimes referred to as "compound A"), the first epoxy compound, and the second epoxy compound is presumed to be as follows. The cured product of the above composition includes a cured product of compound A, a first epoxy compound, and a second epoxy compound, and has "-Z" derived from compound A. 1 -O-" and "-Z 2 The cured product has a structure with excellent flexibility such as "-O-", a high molecular weight portion due to the inclusion of the first epoxy compound, and a crosslinked structure due to the inclusion of the second epoxy compound with a low epoxy equivalent, which is sufficiently formed. As a result, the cured product contains a flexibility-imparting portion and a high molecular weight portion, and a crosslinked structure linking these two portions is sufficiently formed. By having such a structure, the cured product can exhibit high durability against deformation while having flexibility that allows it to exhibit excellent conformability to the adherend. For this reason, the cured product has high adhesive strength. In addition, since the composition contains compound A, the first epoxy compound and the second epoxy compound, it becomes easy to form a cured product having excellent extensibility, durability under high temperature conditions (heat resistance), durability under high temperature and high humidity conditions (humid heat resistance) and light resistance.

[0022] 1. Cationic polymerizable component The cationically polymerizable component used in the present invention contains compound A, a first epoxy compound having an epoxy equivalent of 400 or more and being an epoxy compound other than compound A, and a second epoxy compound having an epoxy equivalent of less than 400 and being an epoxy compound other than compound A. The cationically polymerizable component includes all compounds having a cationically polymerizable group. Therefore, a compound having both a cationically polymerizable group and a radically polymerizable group is considered to be a cationically polymerizable compound. Examples of the cationically polymerizable group include cyclic ether groups such as an epoxy group, an oxetane group, a cyclic lactone group, a cyclic acetal group, a cyclic thioether group, and a spiro orthoester group, and a vinyl ether group, etc. That is, examples of the cationically polymerizable compound include cyclic ether compounds such as an oxetane compound, a cyclic lactone compound, a cyclic acetal compound, a cyclic thioether compound, and a spiro orthoester compound, and a vinyl ether compound, etc.

[0023] (1) Compound A The cationic polymerizable component used in the present invention contains a compound represented by the above general formula (A). By containing such a compound, the composition of the present invention can form a cured product having high adhesive strength.

[0024] R in the above general formula (A) 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 Examples of the alkyl group having 1 to 4 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a s-butyl group, and a t-butyl group.

[0025] R in the above general formula (A) 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10Examples of the aryl group having 6 to 12 carbon atoms represented by the formula (1) include a phenyl group, an o-tolyl group, a m-tolyl group, a p-tolyl group, a 2,4-xylyl group, a p-cumenyl group, a mesityl group, a 1-naphthyl group, a 2-naphthyl group, an o-biphenylyl group, a m-biphenylyl group, and a p-biphenylyl group.

[0026] Z in the above general formula (A) 1 and Z 2 Examples of the linear or branched alkylene group having 1 to 10 carbon atoms represented by the formula (I) include linear alkylene groups having 1 to 10 carbon atoms and branched alkylene groups having 2 to 10 carbon atoms. Examples of the linear alkylene group having 1 to 10 carbon atoms include groups in which one hydrogen atom has been removed from a linear alkyl group having 1 to 10 carbon atoms. Examples of the branched alkylene group having 2 to 10 carbon atoms include a group in which one hydrogen atom has been removed from a branched alkyl group having 3 to 10 carbon atoms, and an alkylidene group such as an ethylidene group (methylmethine group) in which one hydrogen atom has been removed from the same carbon atom as the bonding site of a linear alkyl group having 2 to 10 carbon atoms. Examples of the linear or branched alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a s-butyl group, a t-butyl group, an amyl group, an isoamyl group, a t-amyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a t-octyl group, a nonyl group, an isononyl group, a decyl group, and an isodecyl group. Specific examples of the linear or branched alkylene group having 1 to 10 carbon atoms include a methylene group, a methylmethine group, an isopropylidene group, an ethylene group, a propylene group, and a trimethylene group.

[0027] Examples of the halogen atom in the above general formula (A) include fluorine, chlorine, bromine, and iodine.

[0028] R in the above general formula (A) 1 and R 2are each independently preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, and particularly preferably a hydrogen atom or a methyl group. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0029] R in the above general formula (A) 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 is preferably a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom, more preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and particularly preferably a hydrogen atom. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0030] Z in the above general formula (A) 1 and Z 2 is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, more preferably a linear or branched alkylene group having 2 to 5 carbon atoms, further preferably a linear or branched alkylene group having 2 to 4 carbon atoms, and particularly preferably a linear or branched alkylene group having 2 to 3 carbon atoms. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0031] In the above general formula (A), m 1 and m 2 is preferably an integer of 0 to 15, more preferably an integer of 0 to 8, and particularly preferably an integer of 0 to 6.1 and m 2 The sum of is preferably an integer of 1 to 15, and particularly preferably an integer of 1 to 12. This is because the composition can more easily form a cured product having high adhesive strength. Also, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. m 1 and m 2 The sum of is preferably an integer of 1 to 10, and particularly preferably an integer of 1 to 5. This is because the composition can more easily form a cured product having excellent heat resistance and moist heat resistance.

[0032] In the present invention, R in the above general formula (A) 1 and R 2 is a hydrogen atom or a methyl group, and R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 is a hydrogen atom, and Z 1 and Z 2 is a linear or branched alkylene group having 2 to 3 carbon atoms, m 1 and m 2 is an integer from 0 to 6, and m 1 and m 2 It is most preferable that the sum of is an integer of 1 to 12. This is because the composition can more easily form a cured product having high adhesive strength. Also, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0033] The weight average molecular weight (Mw) of the compound A is preferably 300 to 2,000, more preferably 400 to 1,500, and particularly preferably 450 to 1,200. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the present invention, the weight average molecular weight is a molecular weight calculated using standard polystyrene standards and determined by gel permeation chromatography (GPC). The weight average molecular weight can be measured, for example, using a GPC (LC-2000plus series) manufactured by JASCO Corporation, using tetrahydrofuran as an elution solvent, polystyrene standards for calibration curves of Mw 1,110,000, 707,000, 397,000, 189,000, 98,900, 37,200, 13,700, 9,490, 5,430, 3,120, 1,010, and 589 (TSKgel standard polystyrene manufactured by Tosoh Corporation), and measuring columns of KF-804, KF-803, and KF-802 (manufactured by Showa Denko Corporation). The measurement temperature can be 40° C., and the flow rate can be 1.0 mL / min.

[0034] The epoxy equivalent of compound A is preferably 100 to 1,000, more preferably 150 to 800, and particularly preferably 200 to 700. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The epoxy equivalent is a value obtained by dividing the molecular weight of an epoxy compound by the number of epoxy groups in the compound, and in the present invention, the value is measured in accordance with JIS K 7236.

[0035] The content of compound A is preferably 5 to 80 parts by mass, more preferably 10 to 80 parts by mass, further preferably 15 to 70 parts by mass, particularly preferably 20 to 60 parts by mass, and most preferably 30 to 45 parts by mass, in 100 parts by mass of the cationic polymerizable component. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0036] The content of compound A is preferably 5 to 90 parts by mass, more preferably 10 to 80 parts by mass, further preferably 15 to 70 parts by mass, particularly preferably 20 to 60 parts by mass, and most preferably 30 to 45 parts by mass, in the total of 100 parts by mass of compound A, the first epoxy compound, and the second epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0037] The content of compound A is preferably 5 to 80 parts by mass, more preferably 10 to 70 parts by mass, further preferably 15 to 60 parts by mass, particularly preferably 20 to 50 parts by mass, and most preferably 25 to 45 parts by mass, in 100 parts by mass of the solid content of the composition. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The solid content of the composition refers to the total of all components in the composition other than the solvent.

[0038] The content of compound A is preferably 5 to 80 parts by mass, more preferably 10 to 70 parts by mass, further preferably 15 to 60 parts by mass, particularly preferably 20 to 50 parts by mass, and most preferably 25 to 45 parts by mass, in 100 parts by mass of the composition. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0039] (2) Epoxy compounds The cationically polymerizable component used in the present invention contains an epoxy compound having an epoxy equivalent equal to or greater than a predetermined amount, and an epoxy compound having an epoxy equivalent equal to or less than a predetermined amount. The epoxy compound used in the present invention includes all compounds containing an epoxy group other than compound A. For example, a compound containing both an epoxy group and an oxetane group corresponds to an epoxy compound. Examples of such epoxy compounds include aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds.

[0040] In the present invention, among the above epoxy compounds, a first epoxy compound having an epoxy equivalent of 400 or more is used in combination with a second epoxy compound having an epoxy equivalent of less than 400. By using such a first epoxy compound and a second epoxy compound in combination, the composition of the present invention can form a cured product having high adhesive strength.

[0041] (a) Aromatic epoxy compounds The aromatic epoxy compound is a compound that has an aromatic ring and an epoxy group and does not have a cycloalkene oxide structure.

[0042] Examples of aromatic epoxy compounds include glycidyl ethers of monohydric phenols such as phenol, cresol, and butylphenol, and their alkylene oxide adducts; polyglycidyl ethers of polyhydric phenols such as polyhydric phenols having two or more aromatic rings, and their alkylene oxide adducts; phenol novolac type epoxy compounds; glycidyl ethers of phenols having two or more phenolic hydroxyl groups, such as resorcinol, hydroquinone, and catechol; polyglycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, such as benzenedimethanol, benzenediethanol, and benzenedibutanol; polyglycidyl esters of polybasic aromatic compounds having two or more carboxylic acids, such as phthalic acid, terephthalic acid, and trimellitic acid; glycidyl esters of benzoic acids such as benzoic acid, toluic acid, and naphthoic acid; and epoxidized products of styrene oxide and divinylbenzene.

[0043] As the aromatic epoxy compound, polyglycidyl ether of polyhydric phenols, polyglycidyl ether of phenols, polyglycidyl ether of aromatic compounds having two or more alcoholic hydroxyl groups, glycidyl ester of benzoic acid, and polyglycidyl ester of polybasic aromatic compounds are preferred, and polyglycidyl ether of polyhydric phenols is particularly preferred. By including such a compound, the composition of the present invention can form a cured product having higher adhesive strength.

[0044] As the polyglycidyl ether of polyhydric phenols, a bisphenol-type epoxy compound, which is a polyglycidyl ether of polyhydric phenols having a bisphenol structure, is preferred, and among them, a bisphenol-type epoxy compound represented by the following general formula (1) is preferred. This is because the above composition makes it easier to form a cured product having high adhesive strength. In addition, the above composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In addition, n in the general formula (1) 1 The larger the number, the larger the epoxy equivalent of the compound.

[0045] [ka] (In the formula, R 11 and R 12 each independently represents a hydrogen atom or a methyl group; R 13 represents a hydrogen atom or a glycidyl group, n 1 represents an integer equal to or greater than 0)

[0046] Specific examples of the compound represented by the general formula (1) include bisphenol A type epoxy resins, bisphenol E type epoxy resins, and bisphenol F type epoxy resins.

[0047] As the polyglycidyl ether of polyhydric phenols, a compound represented by the following general formula (2) is also preferred. This is because the composition can more easily form a cured product having high adhesive strength. Also, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0048] [ka] (In the formula, R 14 , R 15 and R 16 each independently represents a hydrogen atom or a methyl group.

[0049] Examples of commercially available products that can be used as aromatic epoxy compounds include Denacol EX-121, Denacol EX-145, Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012 (manufactured by Nagase Chemtex); Oxol PG-100, Oxol EG-200, Oxol EG-210, Oxol EG-250 (manufactured by Osaka Gas Chemicals); HP4032, HP4032D, HP4700(D IC); ESN-475V (Nippon Steel & Sumitomo Metal Chemical); Epicoat YX8800 (Mitsubishi Chemical); Marproof G-0105SA, Marproof G-0130SP (NOF); Epicron N-665, Epicron HP-7200 (DIC); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3 000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku); ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901, ADEKA RESIN EP-3300E, ADEKA RESIN EP-3950S, KRM-430 (manufactured by ADEKA); TECHMORE VG-3101L (manufactured by Printec), etc.

[0050] (b) Alicyclic epoxy compounds An alicyclic epoxy compound is a compound that has a cycloalkene oxide structure and does not have an aromatic ring. The cycloalkene oxide structure is a structure in which an aliphatic ring and an epoxy ring share a part of the ring structure, such as a cyclohexene oxide structure or a cyclopentene oxide structure, which is obtained by epoxidizing a cyclohexene ring-containing compound or a cyclopentene ring-containing compound with an oxidizing agent.

[0051] Among the alicyclic epoxy compounds, examples of compounds having one cycloalkene oxide structure include 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, dicyclopentadiene diepoxide, dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, and 1,2-epoxy-2-epoxyethylcyclohexane.

[0052] Moreover, an example of a compound having two cycloalkene oxide structures is a compound represented by the following general formula (3).

[0053] [ka] (In the formula, X 3 represents a direct bond or a divalent linking group having one or more atoms.

[0054] X 3 Examples of the linking group represented by the formula (I) include a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide group, and groups in which a plurality of these groups are linked together.

[0055] The divalent hydrocarbon group includes a linear or branched alkylene group having 1 to 10 carbon atoms. The alkylene group is represented by Z in the general formula (A). 1 and Z 2 Examples of the alkylene group include the linear or branched alkylene group having 1 to 10 carbon atoms represented by the following formula:

[0056] In the present invention, X 3is preferably a divalent linking group, more preferably a divalent hydrocarbon group, an ester bond, or a group in which a plurality of these are linked, and particularly preferably a group in which a divalent hydrocarbon group is linked to an ester bond. This is because the composition can more easily form a cured product having high adhesive strength. Also, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The divalent hydrocarbon group is preferably a linear or branched alkylene group having 1 to 8 carbon atoms, more preferably a linear alkylene group having 1 to 5 carbon atoms, and particularly preferably a linear alkylene group having 1 to 3 carbon atoms. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0057] More specifically, the compound having two cycloalkene oxide structures includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, ester, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-metadioxane, bis(3,4-epoxycyclohexylmethyl)adipate, bis(3,4-epoxy-6-methylcyclohexane-1-ylmethyl)adipate, methylene bis(3,4-epoxycyclohexane), ethylene bis(3,4-epoxycyclohexane), and the like.

[0058] As the alicyclic epoxy compound, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate are preferred. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0059] Commercially available products that can be used as the alicyclic epoxy compound include, for example, those described in Japanese Patent No. 6103653 and the like.

[0060] (c) Aliphatic epoxy compounds The aliphatic epoxy compound is a compound which has an epoxy group and does not have a cycloalkene oxide structure or an aromatic ring.

[0061] Examples of the aliphatic epoxy compound include aliphatic epoxy polymers such as glycidyl ethers of aliphatic alcohols or their alkylene oxide adducts; polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts; polyglycidyl esters of aliphatic long-chain polybasic acids; homopolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate; and copolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate with other vinyl monomers.

[0062] The aliphatic epoxy compound is preferably a polyglycidyl ether of an aliphatic polyhydric alcohol or its alkylene oxide adduct. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. Examples of the polyglycidyl ether of an aliphatic polyhydric alcohol or an alkylene oxide adduct thereof include polyglycidyl ethers of chain aliphatic polyhydric alcohols having a linear or branched aliphatic group and no cycloalkyl ring or alkylene oxide adducts thereof, and polyglycidyl ethers of aliphatic ring-containing aliphatic polyhydric alcohols having a cycloalkyl ring or alkylene oxide adducts thereof.

[0063] As the polyglycidyl ether of a chain aliphatic polyhydric alcohol or its alkylene oxide adduct, for example, a compound represented by the following general formula (4) is preferable. By including such a compound, the composition of the present invention can form a cured product having higher adhesive strength.

[0064] [ka] (In the formula, X 4 represents a linear or branched divalent aliphatic hydrocarbon group, One or more methylene groups in the aliphatic hydrocarbon group may be substituted with -O-, and one or more hydrogen atoms in the aliphatic hydrocarbon group may be substituted with a hydroxyl group.

[0065] In the above general formula (4), X 4 represents a straight-chain or branched divalent aliphatic hydrocarbon group, a group in which one or more methylene groups in the aliphatic hydrocarbon group are substituted with -O-, a group in which one or more hydrogen atoms in the aliphatic hydrocarbon group are substituted with hydroxyl groups, or a group in which one or more methylene groups in the aliphatic hydrocarbon group are substituted with -O- and one or more hydrogen atoms in the aliphatic hydrocarbon group are substituted with hydroxyl groups.

[0066] X 4 Examples of the linear or branched divalent aliphatic hydrocarbon group represented by the formula (I) include groups in which one hydrogen atom has been removed from a monovalent aliphatic hydrocarbon group.

[0067] The monovalent aliphatic hydrocarbon group may be an alkyl group. Examples of the alkyl group include linear or branched alkyl groups having 1 to 20 carbon atoms, specifically including methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, t-butyl, amyl, isoamyl, t-amyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, and icosyl groups.

[0068] Also, X 4 Examples of the linear or branched divalent aliphatic hydrocarbon group represented by the formula (I) include groups having one or more carbon-carbon double bonds or carbon-carbon triple bonds in the main chain, such as groups in which one hydrogen atom has been removed from a group in which one or more methylene groups in an alkyl group have been replaced with a carbon-carbon double bond or a carbon-carbon triple bond. Specific examples include divalent unsaturated aliphatic hydrocarbon groups obtained by removing two hydrogen atoms from a straight-chain or branched unsaturated hydrocarbon compound having a carbon-carbon double bond or a carbon-carbon triple bond. Examples of the unsaturated hydrocarbon compound include propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, and 1-eicosene. Examples of the unsaturated hydrocarbon compound include conjugated dienes such as isoprene, butadiene, 2,3-dimethyl-butadiene, 2-phenyl-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, 1,3-octadiene, 1,3-cyclohexadiene, 2-methyl-1,3-octadiene, 1,3,7-octatriene, myrcene, and chloroprene, as well as polymers of conjugated dienes obtained by polymerizing a monomer component containing at least a conjugated diene. More specific examples of the linear or branched divalent aliphatic hydrocarbon group include an ethenyl group, a propenyl group, and a group in which two hydrogen atoms have been removed from a conjugated diene polymer such as 1,3-polybutadiene. The divalent unsaturated aliphatic hydrocarbon group is preferably a group having a carbon-carbon double bond, and more preferably a group having two or more carbon-carbon double bonds. The group having a carbon-carbon double bond is preferably a divalent group obtained by removing two hydrogen atoms from a polymer of a conjugated diene, and more preferably a divalent group obtained by removing two hydrogen atoms from 1,3-polybutadiene. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0069] X 4 Specific examples of the aliphatic epoxy compound in which is a linear or branched divalent aliphatic hydrocarbon group include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, and diglycidyl ether of polybutadiene having hydroxyl groups at both ends.

[0070] As the polyglycidyl ether of an aliphatic ring-containing aliphatic polyhydric alcohol or its alkylene oxide adduct, for example, a compound represented by the following general formula (5) is preferable. By including such a compound, the composition of the present invention can form a cured product having higher adhesive strength.

[0071] [ka] (In the formula, X 5 represents a divalent aliphatic hydrocarbon group having a cycloalkyl ring, One or more methylene groups in the aliphatic hydrocarbon group may be substituted with -O-, and one or more hydrogen atoms in the aliphatic hydrocarbon group may be substituted with a hydroxyl group.

[0072] In the above general formula (5), X 5 represents a divalent aliphatic hydrocarbon group having a cycloalkyl ring, a group in which one or more methylene groups in the aliphatic hydrocarbon group are substituted with -O-, a group in which one or more hydrogen atoms in the aliphatic hydrocarbon group are substituted with hydroxyl groups, or a group in which one or more methylene groups in the aliphatic hydrocarbon group are substituted with -O- and one or more hydrogen atoms in the aliphatic hydrocarbon group are substituted with hydroxyl groups.

[0073] X 5 Examples of the cycloalkyl ring in the divalent aliphatic hydrocarbon group having a cycloalkyl ring represented by the following formula include a cycloalkylene group in which one hydrogen atom has been removed from a cycloalkyl group.

[0074] Examples of the cycloalkyl group include monocyclic aliphatic hydrocarbon groups such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, a cyclodecyl group, a methylcyclopentyl group, a methylcyclohexyl group, a dimethylcyclohexyl group, a trimethylcyclohexyl group, a tetramethylcyclohexyl group, a pentamethylcyclohexyl group, an ethylcyclohexyl group, and a methylcycloheptyl group; and polycyclic aliphatic hydrocarbon groups such as a bicyclo[2.1.1]hexyl group, a bicyclo[2.2.1]heptyl group, a bicyclo[2.2.2]octyl group, a bicyclo[4.3.1]decyl group, a bicyclo[3.3.1]nonyl group, a bornyl group, a bornenyl group, a norbornyl group, a norbornenyl group, a 6,6-dimethylbicyclo[3.1.1]heptyl group, a tricyclobutyl group, and an adamantyl group.

[0075] X 5 Examples of the cycloalkyl group include a combination of a cycloalkylene group obtained by removing one hydrogen atom from the above cycloalkyl group and a linear or branched divalent aliphatic hydrocarbon group. Also, X 5Examples of the linked group include a group in which two cycloalkylene groups are linked by a straight-chain or branched divalent aliphatic hydrocarbon group. Examples of such linked groups include a group having a hydrogenated bisphenol structure, which is a structure in which two cyclohexyl groups are linked by an alkylidene group. Examples of alkylidene groups include ethylidene groups (>CHCH3), propylidene groups (>CHCH2CH3), isopropylidene groups (>CH(CH3)2), butylidene groups (>CHCH2CH2CH3), isobutylidene groups (>CHCH2(CH3)2), pentylidene groups (>CHCH2CH2CH2CH3), hexylidene groups (>CHCH2CH2CH2CH2CH3), heptylidene groups (>CHCH2CH2CH2CH2CH2CH3), octylidene groups (>CHCH2CH2CH2CH2CH2CH3), and the like.

[0076] X 5 However, as the compound which is a divalent aliphatic hydrocarbon group having a cycloalkyl ring, a hydrogenated bisphenol type epoxy compound which is a glycidyl ether of a polyhydric alcohol having a hydrogenated bisphenol structure is preferred, and a hydrogenated bisphenol type epoxy compound represented by the following general formula (5-1) is particularly preferred. By including such a compound, the composition of the present invention can form a cured product having higher adhesive strength.

[0077] [ka] (In the formula, R 17 and R 18 each independently represents a hydrogen atom or a methyl group; R 19 represents a hydrogen atom or a glycidyl group, n 2 represents an integer equal to or greater than 0.)

[0078] Specific examples of the compounds represented by the above general formulas (5) and (5-1) include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, and hydrogenated bisphenol F diglycidyl ether.

[0079] Representative examples of aliphatic epoxy compounds other than those mentioned above include glycidyl ethers of aliphatic alcohols such as allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, and C12-13 mixed alkyl glycidyl ether; polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, and glycerin; and diglycidyl esters of aliphatic long-chain dibasic acids. Further examples include monoglycidyl ethers of aliphatic higher alcohols, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, and epoxidized polybutadiene.

[0080] The aliphatic epoxy compound is also preferably an aliphatic epoxy polymer having a repeating unit containing an epoxy group. Such an aliphatic epoxy polymer includes a structural unit represented by the following general formula (I) (hereinafter, sometimes referred to as "structural unit I") and a structural unit represented by the following general formula (II) (hereinafter, sometimes referred to as "structural unit II"), and preferably includes at least one of these structural units. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0081] [ka] (In the formula, R 1a represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, and s represents an integer of 1 to 6. * represents a bonding site.

[0082] [ka] (In the formula, R 2a-1represents a hydrogen atom or a methyl group, R 2a-2 represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, and t represents an integer of 1 to 6. * represents the site of attachment.

[0083] R in general formula (I) 1a and R in general formula (II) 2a-2 Examples of the linear or branched alkyl group having 1 to 6 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a s-butyl group, a t-butyl group, an amyl group, an isoamyl group, a t-amyl group, and a hexyl group.

[0084] R in general formula (I) 1a is preferably a hydrogen atom or a linear or branched alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom or a methyl group, and particularly preferably a hydrogen atom. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0085] In the general formula (I), s is an integer of 1 to 6, preferably an integer of 1 to 3, more preferably an integer of 1 to 2, and particularly preferably 1. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0086] R in general formula (II) 2a-1 is preferably a methyl group. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0087] R in general formula (II) 2a-2is preferably a hydrogen atom or a linear or branched alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom or a methyl group, and particularly preferably a hydrogen atom. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0088] In the general formula (II), t is an integer of 1 to 6, preferably an integer of 1 to 3, more preferably an integer of 1 to 2, and particularly preferably 1. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0089] The aliphatic epoxy polymer preferably has at least one of the structural unit I and the structural unit II, and more preferably has the structural unit II. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0090] The content of the structural unit II may be any content that can obtain a desired adhesive strength, and for example, in 100 parts by mass of the total of the structural unit I and the structural unit II, it is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 90 parts by mass or more, and particularly preferably 100 parts by mass. This is because the above composition makes it easier to form a cured product having high adhesive strength. In addition, the above composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0091] The total content of the structural unit I and the structural unit II may be any content that can obtain the desired adhesive strength, and is preferably 5 parts by mass or more, more preferably 10 parts by mass or more and 70 parts by mass or less, and particularly preferably 20 parts by mass or more and 40 parts by mass or less, in 100 parts by mass of the aliphatic epoxy polymer. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0092] In the aliphatic epoxy polymer, the monomer capable of forming a structural unit other than the structural unit I and the structural unit II may be a compound having no cycloalkene oxide structure or aromatic ring, and preferred examples thereof include alkyl acrylates and alkyl methacrylates.

[0093] Examples of alkyl acrylates and alkyl methacrylates include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, 2-ethylhexyl acrylate, and 2-ethylhexyl methacrylate.

[0094] The weight average molecular weight of the aliphatic epoxy polymer is preferably 1,000 to 100,000, more preferably 3,000 to 50,000, further preferably 4,000 to 30,000, and particularly preferably 5,000 to 20,000. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0095] The aliphatic epoxy compound may also include a silane coupling agent having an epoxy group and an alkoxysilyl group (hereinafter, may be referred to as "a silane coupling agent having an epoxy group"). The aliphatic epoxy compound may be used in combination with the aliphatic polyhydric alcohol or its alkylene oxide adduct polyglycidyl ether and aliphatic epoxy polymer. By using a silane coupling agent having an epoxy group, the composition of the present invention can form a cured product having a higher adhesive strength to inorganic oxides. In the present invention, all compounds having an epoxy group and an alkoxysilyl group are considered to be silane coupling agents having an epoxy group.

[0096] Examples of silane coupling agents having an epoxy group include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-(2,3-epoxypropoxypropyl)methyldimethoxysilane, 3-(2,3-epoxypropoxypropyl)methyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane. In the present invention, 3-glycidoxypropyltrimethoxysilane is preferred because the composition can more easily form a cured product having high adhesive strength, and the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0097] Commercially available products can be used as the aliphatic epoxy compound. For example, Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841 , Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase ChemteX); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (manufactured by Kyoeisha Chemical), Adeka Glysilol ED-503, Adeka Glysilol ED-503G, Adeka Glysilol ED-506, Adeka Glysilol ED-523T, Adeka Resin EP-4088S, KRM-532P (manufactured by ADEKA), 2EH (manufactured by Yokkaichi Chemical), and the like.

[0098] (3) First epoxy compound In the present invention, among the above-mentioned epoxy compounds, an epoxy compound having an epoxy equivalent of 400 or more is used as the first epoxy compound. The epoxy equivalent of the first epoxy compound is preferably 5,000 or less, more preferably 2,500 or less, even more preferably 1,500 or less, and most preferably 1,000 or less. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0099] The molecular weight of the first epoxy compound is preferably 700 to 10,000, more preferably 5,000 or less, even more preferably 3,000 or less, particularly preferably 2,500 or less, and most preferably 2,000 or less. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. When the first epoxy compound has a molecular weight distribution, the molecular weight of the first epoxy compound means the weight average molecular weight (Mw).

[0100] The number of functional groups of the first epoxy compound, i.e., the number of epoxy groups, may be 1 or more, but is preferably 5 or less, more preferably 3 or less, and particularly preferably 2. This is because the composition can more easily form a cured product having high adhesive strength.

[0101] As the first epoxy compound, any of aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds can be used, but the first epoxy compound preferably contains at least one of aromatic epoxy compounds and aliphatic epoxy compounds. By containing an aromatic epoxy compound as the first epoxy compound, the composition can more easily form a cured product having high adhesive strength. In addition, by containing an aliphatic epoxy compound as the first epoxy compound, the composition can more easily form a cured product having excellent stretchability. In the present invention, it is particularly preferred that the first epoxy compound contains an aromatic epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0102] As the aromatic epoxy compound contained in the first epoxy compound, any of the aromatic epoxy compounds listed above can be used as long as it satisfies the desired epoxy equivalent, but the first epoxy compound preferably contains any of polyglycidyl ethers of polyhydric phenols, polyglycidyl ethers of phenols, polyglycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, glycidyl esters of benzoic acids, and polyglycidyl esters of polybasic aromatic compounds, and more preferably contains polyglycidyl ethers of polyhydric phenols. By containing such a compound, the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the present invention, the polyglycidyl ether of polyhydric phenols contained in the first epoxy compound preferably contains a bisphenol type epoxy compound, and more preferably contains a bisphenol type epoxy compound represented by the above general formula (1). This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the bisphenol type epoxy compound represented by the above general formula (1) used as the first epoxy compound, n 1 is appropriately adjusted to obtain a desired epoxy equivalent, and is usually 1 or more, but is preferably 1 to 50, more preferably 2 to 20, even more preferably 3 to 15, and particularly preferably 4 to 10. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the bisphenol type epoxy compound represented by the above general formula (1) used as the first epoxy compound, R 11 and R 12is preferably a methyl group. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the bisphenol type epoxy compound represented by the above general formula (1) used as the first epoxy compound, R 13 When a plurality of n are present, each may independently be either a hydrogen atom or a glycidyl group. However, since it is preferable that the number of epoxy groups in one molecule of the compound is 2 to 3, n 1 One R in each repeat unit 13 is a glycidyl group, and n 1 - 1 R 13 is a hydrogen atom, or all R 13 is preferably a hydrogen atom. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0103] As the aliphatic epoxy compound contained in the first epoxy compound, any of the above-mentioned aliphatic epoxy compounds can be used as long as it satisfies the desired epoxy equivalent, but the first epoxy compound preferably contains at least one of the compound represented by the above general formula (4) and an aliphatic epoxy polymer containing at least one of the structural unit I and the structural unit II. This is because the above composition makes it easier to form a cured product having high adhesive strength. In addition, the above composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the compound represented by the general formula (4) used as the first epoxy compound, X 4 The linear or branched divalent aliphatic hydrocarbon group represented by the formula (I) is appropriately set so as to obtain a desired epoxy equivalent. 4The number of carbon atoms of the linear or branched divalent aliphatic hydrocarbon represented by the formula (I) is, for example, preferably 50 or more, more preferably 70 or more and 700 or less, even more preferably 90 or more and 200 or less, and particularly preferably 100 or more and 150 or less. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. X 4 As the linear or branched divalent aliphatic hydrocarbon represented by the formula (1), both a group in which one hydrogen atom has been removed from a linear or branched alkyl group and a divalent unsaturated aliphatic hydrocarbon group are preferred, but a divalent unsaturated aliphatic hydrocarbon group is more preferred. As the divalent unsaturated aliphatic hydrocarbon group, a group having a carbon-carbon double bond is particularly preferred, and a group having two or more carbon-carbon double bonds is more preferred. The group having a carbon-carbon double bond is preferably a divalent group obtained by removing two hydrogen atoms from a polymer of a conjugated diene, and more preferably a divalent group obtained by removing two hydrogen atoms from 1,3-polybutadiene. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0104] The content of the first epoxy compound is preferably 1 to 60 parts by mass, more preferably 5 to 50 parts by mass, further preferably 10 to 40 parts by mass, and particularly preferably 15 to 35 parts by mass, in 100 parts by mass of the cationic polymerizable component. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0105] The content of the first epoxy compound is preferably 1 to 60 parts by mass, more preferably 5 to 50 parts by mass, further preferably 10 to 40 parts by mass, and particularly preferably 15 to 35 parts by mass, in 100 parts by mass of the total of the compound A, the first epoxy compound, and the second epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0106] The content of the first epoxy compound is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, further preferably 10 to 30 parts by mass, and particularly preferably 10 to 20 parts by mass, based on 100 parts by mass of the solid content of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0107] The content of the first epoxy compound is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, further preferably 10 to 30 parts by mass, and particularly preferably 10 to 20 parts by mass, in 100 parts by mass of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0108] The total content of the first epoxy compound and the second epoxy compound is preferably 20 to 80 parts by mass, more preferably 25 to 75 parts by mass, further preferably 30 to 70 parts by mass, and particularly preferably 35 to 65 parts by mass, in 100 parts by mass of the cationic polymerizable component. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0109] (4) Second epoxy compound In the present invention, among the above-mentioned epoxy compounds, an epoxy compound having an epoxy equivalent of less than 400 is used as the second epoxy compound. The epoxy equivalent of the second epoxy compound is preferably 100 to 350, more preferably 120 to 300, and particularly preferably 140 to 250. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0110] The molecular weight of the second epoxy compound is preferably 100 to 800, more preferably 200 to 600, and particularly preferably 300 to 400. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. When the second epoxy compound has a molecular weight distribution, the molecular weight of the second epoxy compound means the weight average molecular weight (Mw).

[0111] The number of functional groups of the second epoxy compound, i.e., the number of epoxy groups, may be 1 or more, but is preferably 5 or less, more preferably 3 or less, and particularly preferably 2. This is because the composition can more easily form a cured product with excellent stretchability.

[0112] As the second epoxy compound, any of aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds can be used, but the second epoxy compound preferably contains at least one of aromatic epoxy compounds and aliphatic epoxy compounds, and more preferably contains an aliphatic epoxy compound. By containing an aliphatic epoxy compound as the second epoxy compound, the composition has excellent stretchability, light resistance, etc. It is also preferable that the second epoxy compound contains an aromatic epoxy compound, because the inclusion of such an epoxy compound as the second epoxy compound makes it easier for the composition to form a cured product having high adhesive strength.

[0113] As the aliphatic epoxy compound contained in the second epoxy compound, any of polyglycidyl ethers of linear aliphatic polyhydric alcohols or their alkylene oxide adducts, and polyglycidyl ethers of aliphatic ring-containing aliphatic polyhydric alcohols or their alkylene oxide adducts can be used. However, the second epoxy compound preferably contains a polyglycidyl ether of aliphatic ring-containing aliphatic polyhydric alcohols or their alkylene oxide adducts, and more preferably contains a compound represented by the above general formula (5). In general formula (5), X 5 is preferably a group containing a structure in which two cycloalkylene groups are linked by a linear or branched divalent aliphatic hydrocarbon group, and X 5 is more preferably a group containing a hydrogenated bisphenol structure. That is, the second epoxy compound preferably contains a hydrogenated bisphenol type epoxy compound as an aliphatic epoxy compound, and more preferably contains a compound represented by the above general formula (5-1). This is because the above composition makes it easier to form a cured product having high adhesive strength. In addition, the above composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the compound represented by the general formula (5) used as the second epoxy compound, X 5 The divalent aliphatic hydrocarbon group having a cycloalkyl group represented by the formula (I) is appropriately set so as to obtain a desired epoxy equivalent, but preferably has 6 or more and 30 or less carbon atoms, and more preferably has 10 or more and 20 or less carbon atoms. In the compound represented by general formula (5-1) used as the second epoxy compound, n 2 is appropriately adjusted to obtain a desired epoxy equivalent, but is preferably 0 to 2, more preferably 0 or 1 or less, and particularly preferably 0. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the compound represented by the general formula (5-1) used as the second epoxy compound, R 17 and R 18 is preferably a methyl group. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the compound represented by the general formula (5-1) used as the second epoxy compound, R 19 When a plurality of are present, each may be independently either a hydrogen atom or a glycidyl group, but it is preferable that all are hydrogen atoms. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0114] The second epoxy compound preferably contains a silane coupling agent having an epoxy group as an aliphatic epoxy compound, because this provides the composition with excellent adhesive strength. In the present invention, the second epoxy compound preferably contains a silane coupling agent having an epoxy group and an epoxy compound other than the silane coupling agent having an epoxy group, and in particular, it is preferable to contain a silane coupling agent having an epoxy group and an aromatic epoxy compound or an aliphatic epoxy compound other than the silane coupling agent having an epoxy group. For example, the second epoxy compound preferably contains a silane coupling agent having an epoxy group and an aliphatic epoxy compound other than the silane coupling agent having an epoxy group, such as the above-mentioned chain aliphatic polyhydric alcohol or its alkylene oxide adduct polyglycidyl ether, aliphatic ring-containing aliphatic polyhydric alcohol or its alkylene oxide adduct polyglycidyl ether, etc. This is because the above composition makes it easier to form a cured product having high adhesive strength. In addition, the above composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance and light resistance.

[0115] As the aromatic epoxy compound contained in the second epoxy compound, any of the aromatic epoxy compounds listed above can be used as long as it satisfies the desired epoxy equivalent, but the second epoxy compound preferably contains any of polyglycidyl ethers of polyhydric phenols, polyglycidyl ethers of phenols, polyglycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, glycidyl esters of benzoic acids, and polyglycidyl esters of polybasic aromatic compounds, and is particularly preferably a polyglycidyl ether of polyhydric phenols. By containing such a compound, the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The polyglycidyl ether of polyhydric phenols contained in the second epoxy compound preferably contains a bisphenol type epoxy compound, more preferably contains a bisphenol type epoxy compound represented by the above general formula (1). This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. In the bisphenol epoxy compound represented by the above general formula (1) used as the second epoxy compound, n 1 is appropriately adjusted to obtain a desired epoxy equivalent, but is preferably 0 to 2, more preferably 0 or 1 or less, and particularly preferably 0. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0116] The content of the second epoxy compound is preferably 1 to 60 parts by mass, more preferably 5 to 50 parts by mass, further preferably 15 to 45 parts by mass, and particularly preferably 25 to 40 parts by mass, in 100 parts by mass of the cationic polymerizable component. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0117] The content of the second epoxy compound is preferably 1 to 60 parts by mass, more preferably 5 to 50 parts by mass, further preferably 15 to 45 parts by mass, and particularly preferably 25 to 40 parts by mass, in 100 parts by mass of the total of the compound A, the first epoxy compound, and the second epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0118] The content of the second epoxy compound is preferably 1 to 50 parts by mass, more preferably 5 to 50 parts by mass, further preferably 15 to 40 parts by mass, and particularly preferably 20 to 35 parts by mass, based on 100 parts by mass of the solid content of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0119] The content of the second epoxy compound is preferably 1 to 50 parts by mass, more preferably 5 to 50 parts by mass, further preferably 15 to 40 parts by mass, and particularly preferably 20 to 35 parts by mass, in 100 parts by mass of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0120] When a silane coupling agent having an epoxy group is used as the second epoxy compound, the content is preferably 5 to 50 parts by mass, more preferably 10 to 40 parts by mass, and particularly preferably 15 to 30 parts by mass, in 100 parts by mass of the second epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0121] (5) Other cationic polymerizable components The composition of the present invention may contain cationically polymerizable components other than the compound A, the first epoxy compound, and the second epoxy compound (hereinafter, may be referred to as "other cationically polymerizable components"). The other cationic polymerizable components include all compounds having a cationic polymerizable group, and therefore those having both a cationic polymerizable group and a radical polymerizable group are also included in the cationic polymerizable compound. Other cationic polymerizable components include oxetane compounds, vinyl ether compounds, cyclic lactone compounds, cyclic acetal compounds, cyclic thioether compounds, and spiroorthoester compounds.

[0122] (a) Oxetane compounds The oxetane compound is a compound that has an oxetane structure and does not have an epoxy structure. Examples of oxetane compounds include 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3 and bifunctional oxetane compounds such as 3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, 3-ethyl-3-(3-ethyl-3-oxetanylmethyloxymethyl)oxetane, and xylylene bisoxetane; and monofunctional oxetane compounds such as 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, and 3-ethyl-3-(chloromethyl)oxetane. These compounds can be used alone or in combination of two or more.

[0123] Commercially available oxetane compounds include, for example, ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, and OXT-212 (manufactured by Toagosei Co., Ltd.), Ethanacole OXBP, OXTP, HBOX, and OXIPA (manufactured by Ube Industries, Ltd.), and the like.

[0124] (b) Vinyl ether compounds The vinyl ether compound is a compound that has a vinyl ether structure and does not have an epoxy structure. Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, and 1,6-cyclohexanedimethanol divinyl ether.

[0125] Commercially available vinyl ether compounds include, for example, 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether (manufactured by Maruzen Petrochemicals).

[0126] (c) Other cationically polymerizable components The total content of the other cationic polymerizable components is preferably 50 parts by mass or less, more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less, based on 100 parts by mass of the solid content of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0127] (6) Cationic Polymerizable Component The total content of the compound A, the first epoxy compound and the second epoxy compound in the cationic polymerizable component is preferably 30 parts by mass or more, more preferably 50 parts by mass or more, even more preferably 70 parts by mass or more, even more preferably 90 parts by mass or more, particularly preferably 95 parts by mass or more, and most preferably 100 parts by mass, in 100 parts by mass of the cationic polymerizable component. That is, it is particularly preferable that the cationic polymerizable component contains only the compound A, the first epoxy compound and the second epoxy compound. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance and light resistance.

[0128] The total content of the compound A, the first epoxy compound and the second epoxy compound is preferably 50 parts by mass or more and 95 parts by mass or less, more preferably 60 parts by mass or more and 90 parts by mass or less, and particularly preferably 70 parts by mass or more and 85 parts by mass or less, in 100 parts by mass of the solid content of the composition. This is because the composition makes it easier to form a cured product having high adhesive strength. In addition, the composition makes it easier to form a cured product having excellent stretchability, heat resistance, moist heat resistance and light resistance.

[0129] The total content of the compound A, the first epoxy compound, the second epoxy compound, and the other cationic polymerizable components, i.e., the total content of the cationic polymerizable components, is preferably 50 parts by mass or more, more preferably 60 parts by mass or more and 95 parts by mass or less, and particularly preferably 70 parts by mass or more and 90 parts by mass or less, in 100 parts by mass of the solid content of the composition. By setting the content of the cationic polymerizable components in such a range, the composition of the present invention can form a cured product having higher adhesive strength.

[0130] 2. Acid generator The acid generator used in the present invention is not particularly limited and may be any compound capable of generating an acid under predetermined conditions. Examples of such acid generators include photoacid generators capable of generating an acid when irradiated with light such as ultraviolet light, and thermal acid generators capable of generating an acid when irradiated with heat. The acid generator may contain at least one of a photoacid generator and a thermal acid generator, but it is preferable to contain a photoacid generator from the viewpoints of ease of curing, reduction of damage caused by heat to peripheral members used adjacent to the composition when the composition is cured, and increased freedom of selection of peripheral members, etc. In addition, a photoacid generator has the advantage of a fast curing speed. In addition, the acid generator preferably contains a thermal acid generator from the viewpoint of facilitating the formation of a cured product even in places where light has difficulty reaching. In addition, since the curing speed of the thermal acid generator is relatively slow, this can be utilized to easily perform lamination with other members after the curing treatment (heat treatment). In the present invention, it is preferable to use a photoacid generator and a thermal acid generator in combination. This is because the composition is easily cured at low temperatures and can easily form a cured product with stable high adhesive strength. In addition, the composition causes less damage to the adherend.

[0131] (1) Photoacid generator A photoacid generator is a compound capable of generating an acid when irradiated with active energy rays (hereinafter sometimes simply referred to as "energy rays") such as visible light, ultraviolet light, X-rays, electron beams, and high frequency waves.

[0132] Examples of photoacid generators include double salts of onium salts or their derivatives, or oxime sulfonate compounds, halogen-containing compounds, diazoketone compounds, sulfone compounds, sulfonic acid compounds, diazomethane compounds, nitrobenzyl compounds, benzoin tosylate compounds, iron arene complexes, and acetophenone derivative compounds, which can be used alone or in combination of two or more. In the present invention, it is preferable to use double salts of onium salts or their derivatives as the photoacid generator. By using such a photoacid generator, the composition of the present invention can form a cured product with excellent sensitivity and higher adhesive strength.

[0133] Examples of double salts that are onium salts or derivatives thereof include salts of a cation and anion represented by the following general formula (i).

[0134] [A] m+ [B] m- (i)

[0135] Here, cation [A] m+ is an onium, the structure of which can be represented, for example, by the following general formula:

[0136] [(R 19 ) a Q] m+ (ii)

[0137] In the above general formula (ii), R 19 represents an organic group having 1 to 60 carbon atoms and which may contain any number of atoms other than carbon atoms. a represents an integer of 1 to 5. a R 19 are each independent and may be the same or different. a R 19 At least one of these represents the above organic group having an aromatic ring. Q represents an atom or an atomic group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F and N=N. Also, a cation [A] m+ When the valence of Q in the formula is q, the relationship m=aq must hold. However, N=N is treated as having a valence of 0.

[0138] In addition, the anion [B] m- is preferably a halide complex, and the structure thereof can be represented, for example, by the following general formula (iii).

[0139] [LX b ] m- (iii)

[0140] In the above general formula (iii), L represents a metal or metalloid that is the central atom of a halide complex, and is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, or Co. X represents a halogen atom. b represents an integer from 3 to 7. In addition, the anion [B] m- When the valence of L in is p, the relationship m=bp must hold.

[0141] The anion [LX b ] m- A specific example of the compound is tetrakis(pentafluorophenyl)borate [(C6F5)4B]. - , tetrafluoroborate (BF4) - , Hexafluorophosphate (PF6) - , Hexafluoroantimonate (SbF6) - , Hexafluoroarsenate (AsF6) - , Hexachloroantimonate (SbCl6) - , tris(pentafluoromethyl)trifluorophosphate ion (FAP anion), and the like.

[0142] In addition, the anion [B] m- may be a structure represented by the following general formula (iv).

[0143] [LX b-1 (OH)] m- (iv)

[0144] Here, L, X, and b are as defined above. Other anions include perchlorate ion (ClO4) - , trifluoromethylsulfite ion (CF3SO3) - , fluorosulfonate ion (FSO3) -, toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctane sulfonate, tetraarylborate, and tetrakis(pentafluorophenyl)borate.

[0145] In the present invention, among such onium salts, the following aromatic onium salts (A) to (C) are particularly effective for use. Among these, one type may be used alone, or two or more types may be used in combination.

[0146] (a) Aryl diazonium salts such as phenyl diazonium hexafluorophosphate, 4-methoxyphenyl diazonium hexafluoroantimonate, and 4-methylphenyl diazonium hexafluorophosphate.

[0147] (b) Diaryl iodonium salts such as diphenyl iodonium hexafluoroantimonate, di(4-methylphenyl) iodonium hexafluorophosphate, di(4-tert-butylphenyl) iodonium hexafluorophosphate, and triaryl iodonium tetrakis(pentafluorophenyl)borate.

[0148] (c) Sulfonium cations represented by the following Group I or Group II and sulfonium salts such as hexafluoroantimony ion and tetrakis(pentafluorophenyl)borate ion

[0149] [ka]

[0150] [ka]

[0151] Other examples of the photoacid generator include iron-arene complexes such as (η5-2,4-cyclopentadiene-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl)benzene]-iron-hexafluorophosphate, and mixtures of aluminum complexes such as tris(acetylacetonato)aluminum, tris(ethylacetonatoacetato)aluminum, and tris(salicylaldehyde)aluminum with silanols such as triphenylsilanol.

[0152] Among these, from the viewpoints of practicality and photosensitivity, the photoacid generator is preferably an aromatic iodonium salt, an aromatic sulfonium salt, or an iron-arene complex, more preferably an aromatic sulfonium salt, further preferably a triarylsulfonium salt having a structure in which three aromatic rings are bonded to a sulfur atom (S), and particularly preferably a triarylsulfonium salt represented by the following general formula (6). This is because the above composition has excellent sensitivity and can easily form a cured product with a stable high adhesive strength.

[0153] [ka]

[0154] (In the formula, R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 and R 30 each independently represents a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted ester group having 2 to 10 carbon atoms; R 31 , R 32 , R 33 and R 34 each independently represents a hydrogen atom, a halogen atom, or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms; R 35represents a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or any of the substituents selected from the following chemical formulas (6a) to (6c), An q- represents a q-valent anion, and p represents the charge neutralizing coefficient.)

[0155] [ka] (In the formula, R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 145 , R 146 , R 147 , R 148 and R 149 each independently represents a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted ester group having 2 to 10 carbon atoms; R 140 , R 141 , R 142 , R 143 and R 144 each independently represents a hydrogen atom, a halogen atom, or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, * represents the bonding position with S in formula (2).

[0156] In the compound represented by the above general formula (2), R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R 147 , R 148 and R 149 The halogen atom represented by the following formula (1) is the same as the "halogen atom" in the general formula (A) described in the above section "1. Cationic polymerizable component."

[0157] R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R 147 , R 148 and R 149 Examples of the substituted or unsubstituted alkyl group having 1 to 10 carbon atoms represented by the formula (1) include linear or branched alkyl groups having 1 to 10 carbon atoms, and groups in which at least one of a methylene group and a hydrogen atom in the alkyl group has been substituted.

[0158] Examples of the linear or branched alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a s-butyl group, a t-butyl group, an amyl group, an isoamyl group, a t-amyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a t-octyl group, a nonyl group, an isononyl group, a decyl group, and an isodecyl group.

[0159] Examples of the divalent group substituting one or more methylene groups in the alkyl group include the divalent groups represented by Group 1 below (note that the divalent groups represented by Group 1 above are not adjacent to each other). Group 1: -O-, -S-, -NR'-, -NR'-(C=O)-O-, -CO-, -(C=O)-O-, -O-(C=O)-, -O-(C=O)-O-, -SiR'2 - R' represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. The alkyl group having 1 to 10 carbon atoms is the same as the above R 21 and the like.

[0160] Examples of the group that substitutes one or more hydrogen atoms in the alkyl group include halogen atoms and hydrogen atoms.

[0161] Such an R 21 Examples of the substituted or unsubstituted alkyl group represented by the above formulae include methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t-amyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, tridecafluorohexyl, pentadecafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, Methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl, trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, t-butoxycarbonylmethyl, ethyloxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloyloxyethyl, methacryloyloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, and the like.

[0162] R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 145 , R 146 , R 147 , R 148 and R 149 The substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms represented by the formula (I) includes a group in which -O- is bonded to a methylene group at the terminal of the alkyl group. The alkyl group constituting the alkoxy group includes the above-mentioned R 21 The same applies to substituted or unsubstituted alkyl groups represented by the following formula (1):

[0163] Such an R 21Specific examples of the substituted or unsubstituted alkoxy group represented by the formula (I) and (II) include methoxy, ethoxy, propyloxy, isopropyloxy, butyloxy, s-butyloxy, t-butyloxy, isobutyloxy, pentyloxy, isoamyloxy, t-amyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-methoxyethyloxy, 3-methoxypropyloxy, 4-methoxybutyloxy, 2-butoxyethyloxy, methoxyethoxyethyloxy, methoxyethoxyethoxyethyloxy, 3-methoxybutyloxy, 2-methylthioethyloxy, and trifluoromethyloxy.

[0164] R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 145 , R 146 , R 147 , R 148 and R 149 The ester group having 2 to 10 carbon atoms represented by the formula (I) may be any group having an ester bond (-CO-O- or -O-CO-) at the end of the bond site, and may be a group in which an ester bond is bonded to a methylene group at the end of the bond site of an alkyl group. 21The same applies to substituted or unsubstituted alkyl groups represented by the following formula (1):

[0165] Such an R 21 Specific examples of the ester group represented by the formula (I) include methoxycarbonyl, ethoxycarbonyl, isopropyloxycarbonyl, phenoxycarbonyl, acetoxy, propionyloxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, t-butylcarbonyloxy, methoxyacetyloxy, and benzoyloxy.

[0166] pAn in general formula (6) q- The q-valent anion represented by the formula [B] is m- Among the above, anions having a specific valence can be mentioned. pAn q- As an example of the q-valent anion represented by the formula: tetrakis(pentafluorophenyl)borate [(C6F5)4B] - , tetrafluoroborate (BF4) - , Hexafluorophosphate (PF6) - , Hexafluoroantimonate (SbF6) - , Hexafluoroarsenate (AsF6) - , Hexachloroantimonate (SbCl6) - , tris(pentafluoromethyl)trifluorophosphate ion (FAP anion), perchlorate ion (ClO4) - , trifluoromethylsulfite ion (CF3SO3) - , fluorosulfonate ion (FSO3) - , toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctane sulfonate, tetraarylborate, and tetrakis(pentafluorophenyl)borate.

[0167] In the present invention, R 35is preferably selected from the chemical formulas (6a) to (6c), and more preferably is the chemical formula (6b). 35 By virtue of having the above-mentioned structure, the composition of the present invention is capable of forming a cured product having excellent sensitivity and higher adhesive strength.

[0168] R 21 , R 22 , 423 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 and R 34 is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or an ester group having 2 to 10 carbon atoms, but is preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and is particularly preferably a hydrogen atom or a halogen atom. This is because the composition is capable of forming a cured product having excellent sensitivity and higher adhesive strength.

[0169] R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R147 , R 148 and R 149 is preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and is particularly preferably a hydrogen atom or a halogen atom, because the composition is capable of forming a cured product having excellent sensitivity and higher adhesive strength.

[0170] (2) Thermal acid generator The thermal acid generator is a compound capable of generating an acid by the application of heat. Although there is no particular limitation, a double salt, which is an onium salt that releases a Lewis acid by the application of heat, or a derivative thereof is preferable. As the double salt or its derivative which is an onium salt, there may be mentioned the compound [A] described in the above section "(1) Photoacid generator". m+ [B] m- Examples of the salt include cations and anions represented by the following formula:

[0171] Among these onium salts, the thermal acid generator is preferably a monoarylsulfonium salt having a structure in which one aromatic ring is bonded to a sulfur atom (S), and more preferably a triarylsulfonium salt represented by the following general formula (7), because the composition has excellent low-temperature curing properties.

[0172] [ka] (In the formula, R 41 represents an arylalkyl group having 7 to 22 carbon atoms, one or more hydrogen atoms in the arylalkyl group may be substituted by an alkyl group having 1 to 10 carbon atoms; R 42 represents an alkyl group having 1 to 10 carbon atoms, An q’- represents a q'-valent anion, where q' is 1 or 2, and p' is a coefficient that keeps the charge neutral.

[0173] R in the above general formula (7) 41Examples of the arylalkyl group having 7 to 22 carbon atoms represented by the formula (1) include groups in which one or more hydrogen atoms in an alkyl group having 1 to 10 carbon atoms are substituted with an aryl group having 6 to 12 carbon atoms, as described above in "(1) Photoacid generator."

[0174] Examples of the aryl group having 6 to 12 carbon atoms include a phenyl group, an o-tolyl group, a m-tolyl group, a p-tolyl group, a 2,4-xylyl group, a p-cumenyl group, a mesityl group, a 1-naphthyl group, a 2-naphthyl group, an o-biphenylyl group, a m-biphenylyl group, and a p-biphenylyl group.

[0175] The alkyl group having 1 to 10 carbon atoms which substitutes one or more hydrogen atoms in the arylalkyl group is the same as the alkyl group having 1 to 10 carbon atoms described above in "(1) Photoacid generator."

[0176] Examples of such arylalkyl groups include a benzyl group, a phenethyl group, a phenylpropyl group, an o-methylbenzyl group, an m-methylbenzyl group, and a p-methylbenzyl group.

[0177] R in the above general formula (7) 42 The alkyl group having 1 to 10 carbon atoms represented by the following formula is the same as the alkyl group having 1 to 10 carbon atoms described in the above "(1) Photoacid generator".

[0178] p'An in the above general formula (7) q’-Examples of the q'-valent anion represented by the formula (1) include a methanesulfonate anion, a dodecylsulfonate anion, a benzenesulfonate anion, a toluenesulfonate anion, a trifluoromethanesulfonate anion, a naphthalenesulfonate anion, a diphenylamine-4-sulfonate anion, a 2-amino-4-methyl-5-chlorobenzenesulfonate anion, a 2-amino-5-nitrobenzenesulfonate anion, and the anions described in JP-A-10-235999 and JP-A-10-235999. The present invention is described in Japanese Patent Application Publication No. 10-337959, Japanese Patent Application Publication No. 11-102088, Japanese Patent Application Publication No. 2000-108510, Japanese Patent Application Publication No. 2000-168233, Japanese Patent Application Publication No. 2001-209969, Japanese Patent Application Publication No. 2001-322354, Japanese Patent Application Publication No. 2006-248180, Japanese Patent Application Publication No. 2006-297907, Japanese Patent Application Publication No. 8-253705, Japanese Patent Publication No. 2004-503379, Japanese Patent Application Publication No. 2005-336150, International Publication No. 2006 / 28006, and the like. In addition to organic sulfonate anions such as sulfonate anions, examples of the anions include chloride ions, bromide ions, iodide ions, fluoride ions, chlorate ions, thiocyanate ions, perchlorate ions, hexafluorophosphate ions, hexafluoroantimonate ions, tetrafluoroborate ions, octyl phosphate ions, dodecyl phosphate ions, octadecyl phosphate ions, phenyl phosphate ions, nonylphenyl phosphate ions, tris(pentafluoromethyl)trifluorophosphate ions (FAP anions), 2,2'-methylenebis(4,6-di-t-butylphenyl)phosphonate ions, tetrakis(pentafluorophenyl)borate ions, quencher anions having the function of de-exciting (quenching) active molecules in an excited state, and metallocene compound anions such as ferrocene and luteocene having an anionic group such as a carboxyl group, a phosphonic acid group, or a sulfonic acid group on the cyclopentadienyl ring. Among these, hexafluorophosphate ion, hexafluoroantimonate ion, and tetrakis(pentafluorophenyl)borate ion are preferred because of their high heat resistance.

[0179] The temperature range at which the thermal acid generator generates an acid by heat and can cure the composition is not particularly limited, but is preferably 50 to 250°C, more preferably 100 to 220°C, even more preferably 130 to 200°C, and particularly preferably 150 to 180°C, in terms of good thermal stability during the process, and because a cured product of the composition can be easily formed.

[0180] Examples of commercially available products that can be used as thermal acid generators include San-Aid SI-B2A, San-Aid SI-B3A, San-Aid SI-B3, San-Aid SI-B4, San-Aid SI-60, San-Aid SI-80, San-Aid SI-100, San-Aid SI-110, San-Aid SI-150 (all manufactured by Sanshin Chemical Industry Co., Ltd.), Adeka Opton CP-66, Adeka Opton CP-77 (all manufactured by ADEKA), etc. These can be used alone or in combination of two or more.

[0181] (3)Other When the acid generator contains both a photoacid generator and a thermal acid generator, it is preferable to use a combination of the photoacid generator and the thermal acid generator that are listed as preferred. The acid generator preferably contains a triarylsulfonium salt and a monoarylsulfonium salt. This is because the composition is easily cured at low temperatures and can easily form a cured product with high adhesive strength. In addition, the composition causes less damage to the adherend. The content of the acid generator, either alone or in total, is preferably 0.01 parts by mass to 10 parts by mass, and more preferably 0.1 parts by mass to 5 parts by mass, per 100 parts by mass of the solid content of the composition, because the composition has excellent sensitivity and can easily form a cured product having a high adhesive strength. Incidentally, although commercial acid generators are sometimes sold in a state of being dispersed or dissolved in a solvent, the content of the acid generator in the present invention represents the content as a solid content excluding the solvent.

[0182] The content of the acid generator, either alone or in combination, is preferably 0.05 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, even more preferably 1 to 7 parts by mass, and particularly preferably 1.5 to 6 parts by mass, relative to 100 parts by mass of the cationically polymerizable component. By setting the content within such a range, the cationically polymerizable component can be sufficiently cured.

[0183] 3. Polyfunctional alcohol compounds In order to improve the curability of the composition of the present invention, a polyfunctional alcohol compound can be added. The polyfunctional alcohol compound is a compound having two or more hydroxyl groups, and examples thereof include aromatic alcohol compounds and aliphatic alcohol compounds.

[0184] In the present invention, the polyfunctional alcohol compound preferably contains at least one of an aromatic alcohol compound and an aliphatic alcohol compound, and more preferably contains an aromatic alcohol compound, because the composition has excellent heat resistance. It is also preferable that the polyfunctional alcohol compound contains an aliphatic alcohol compound, since this gives the composition excellent stretchability and curability. In the present invention, it is particularly preferred that the polyfunctional alcohol compound contains both an aromatic alcohol compound and an aliphatic alcohol compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0185] The aromatic alcohol compound is a polyfunctional alcohol compound containing an aromatic hydrocarbon ring. Examples of such aromatic alcohol compounds include polyhydric phenols having two or more aromatic rings or their alkylene oxide adducts, polycarbonate diols using polyhydric phenols having two or more aromatic rings, and polyester polyols using aromatic polybasic acids such as phthalic acid.

[0186] As the aromatic alcohol compound, polyhydric phenols having two or more aromatic rings or their alkylene oxide adducts, polycarbonate diols using polyhydric phenols having two or more aromatic rings are preferred, polyhydric phenols having a bisphenol structure or their alkylene oxide adducts, and polycarbonate diols using polyhydric phenols having a bisphenol structure are more preferred, alkylene oxide adducts of polyhydric phenols having a bisphenol structure are even more preferred, and a compound represented by the following general formula (8) is particularly preferred. By using such an aromatic alcohol, the composition of the present invention has excellent curability and is easy to form a cured product having high adhesive strength and heat resistance.

[0187] [ka] (In the formula, R 51 , R 52 , R 53 , R 54 , R 55 , R 56 , R 57 , R 58 , R 59 and R 60 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 12 carbon atoms, a halogen atom, or a group in which a hydrogen atom in the alkyl group or aryl group is substituted with a halogen atom, Z 21 and Z 22 each independently represents a linear or branched alkylene group having 1 to 10 carbon atoms, or a group in which a hydrogen atom of the alkylene group is substituted with a halogen atom, m 21 and m 22 each independently represents an integer of 0 to 20, m 21 and m 22 The sum of is an integer between 1 and 30.)

[0188] R in general formula (8) 51 , R 52 , R 53 , R 54 , R55 , R 56 , R 57 , R 58 , R 59 and R 60 And Z 21 and Z 22 The groups represented by the following formula (A) are R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 And Z 1 and Z 2 It can be the same as the groups listed above. Also, m 21 and m 22 Each of the above is an integer of 0 to 20, preferably an integer of 0 to 15, and more preferably an integer of 0 to 10. This is because the composition has excellent curing properties and can easily form a cured product having high adhesive strength and heat resistance. m 21 and m 22 The sum of is an integer of 1 to 30, preferably an integer of 1 to 20, and more preferably an integer of 5 to 15. By using such an aromatic alcohol compound, the composition has excellent curing properties and can easily form a cured product having high adhesive strength and heat resistance.

[0189] The aliphatic alcohol compound is a polyfunctional alcohol compound that does not contain an aromatic hydrocarbon ring. Examples of such aliphatic alcohol compounds include chain aliphatic alcohols having a straight-chain or branched aliphatic group and no cycloalkyl ring, and ring-containing aliphatic alcohols having a cycloalkyl ring. In the present invention, the aliphatic alcohol compound preferably contains a chain aliphatic alcohol, more preferably contains a bifunctional or trifunctional chain aliphatic alcohol, and particularly preferably contains a trifunctional chain aliphatic alcohol. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0190] Examples of the chain aliphatic alcohol include polyethylene glycol, polypropylene glycol, and polycaprolactone triol having three hydroxyl groups at the terminals.

[0191] In the present invention, the aliphatic alcohol compound is preferably polyethylene glycol or polycaprolactone triol having three hydroxyl groups at its terminals. By using such an aliphatic alcohol, the composition of the present invention has excellent stretchability and curability, and can easily form a cured product having high adhesive strength.

[0192] An example of a polycaprolactone triol having three hydroxyl groups at its terminals is a compound having a structure represented by the following general formula (9): Such a polycaprolactone triol can be obtained by adding ε-caprolactone to a triol.

[0193] [ka] (In the formula, R 43 represents a group derived from a triol, k 1 and k 2 are each independently an integer of 0 or more, and k 3 is an integer equal to or greater than 1, and k 1 +k 2 +k 3 is 2 or more.)

[0194] R 43Examples of the group derived from a triol represented by the formula (I) include a 2,2-dimethylbutane-triyl group, a propane-1,2,3-triyl group, and a triethylamine-triyl group.

[0195] R 43 Examples of triols that give the above formula include trimethylolpropane, glycerin, and triethanolamine. The number of carbon atoms in the triol is preferably 10 or less, more preferably 2 to 8, and even more preferably 3 to 6. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0196] Commercially available polycaprolactone triols having three hydroxyl groups at their terminals include, for example, PLACCEL 303, 305, 308, 309, 312 and 320 (manufactured by Daicel).

[0197] The hydroxyl value of the polyfunctional alcohol is preferably 150 to 1,000, more preferably 100 to 800, further preferably 200 to 600, and particularly preferably 300 to 500. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0198] The molecular weight of the polyfunctional alcohol is preferably 200 to 5,000, more preferably 300 to 3,000, further preferably 400 to 1,500, and particularly preferably 500 to 1,000. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0199] From the viewpoint of the stretchability of the resulting composition, the number of hydroxyl groups in the polyfunctional alcohol is preferably 2 to 10, more preferably 2 to 5, further preferably 2 to 3, and particularly preferably 2. This is because the above composition makes it easier to form a cured product with excellent stretchability. The number of hydroxyl groups in the polyfunctional alcohol is preferably 2 to 10, more preferably 2 to 5, and particularly preferably 3 to 4. This is because the composition can more easily form a cured product having excellent heat resistance.

[0200] The content of the polyfunctional alcohol is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, further preferably 10 to 35 parts by mass, and particularly preferably 20 to 30 parts by mass, relative to 100 parts by mass of the cationic polymerizable component. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The content of the polyfunctional alcohol is preferably 10 to 60 parts by mass, more preferably 20 to 55 parts by mass, further preferably 30 to 50 parts by mass, and particularly preferably 35 to 50 parts by mass, relative to 100 parts by mass of the cationic polymerizable component, because the composition can easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance, and can easily be made to have excellent curability.

[0201] The content of the polyfunctional alcohol is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, further preferably 10 to 35 parts by mass, and particularly preferably 20 to 30 parts by mass, relative to 100 parts by mass of the total of the compound A, the first epoxy compound, and the second epoxy compound. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance. The content of the polyfunctional alcohol is preferably 10 to 60 parts by mass, more preferably 20 to 55 parts by mass, further preferably 30 to 50 parts by mass, and particularly preferably 35 to 50 parts by mass, relative to 100 parts by mass in total of the compound A, the first epoxy compound, and the second epoxy compound, because the composition can easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance, and can easily be made to have excellent curability.

[0202] The content of the polyfunctional alcohol is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, further preferably 10 to 30 parts by mass, and particularly preferably 15 to 25 parts by mass, based on 100 parts by mass of the solid content of the composition. This is because the composition can more easily form a cured product having high adhesive strength. In addition, the composition can more easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance.

[0203] When the polyfunctional alcohol compound contains both an aromatic alcohol compound and an aliphatic alcohol compound, the content of the aromatic alcohol compound is preferably 40 parts by mass or more and 90 parts by mass or less, more preferably 50 parts by mass or more and 80 parts by mass or less, and particularly preferably 60 parts by mass or more and 75 parts by mass or less, in 100 parts by mass of the polyfunctional alcohol compound. This is because the composition can easily form a cured product having excellent stretchability, heat resistance, moist heat resistance, and light resistance, and can easily be made to have excellent curability.

[0204] 4. Hardening retarder In order to improve the storage stability of the composition of the present invention, a curing retarder can be added. The curing retarder is a compound that has the effect of suppressing the polymerization reaction of the cationic polymerizable component and delaying the curing of the composition.

[0205] Examples of the hardening retarder include onium salts such as sulfonium salts, polyols, aliphatic compounds having a hydroxyl group, ether-based compounds, amine-based compounds, and alkylsulfide-based compounds, with sulfonium salts being preferred. The sulfonium salt that can be used as a cure retarder has no particular limitation on the cationic moiety, and it is necessary to select an appropriate counter anion. Suitable counter anions include, for example, BF4 - , (NC)2N - , CH3SO3 - , CH3-Ph-SO3 - , (CN)3C - etc.

[0206] The curing retarder may be a commercially available product. Examples of commercially available curing retarders include Cyracure UVI-6990 (manufactured by Union Carbide Co., Ltd.) and San-Aid SI-S (manufactured by Sanshin Chemical Industry Co., Ltd.).

[0207] The content of the curing retarder in the composition of the present invention is not particularly limited, but is preferably 0.001 to 5 parts by mass relative to 100 parts by mass of the solid content. When the content of the curing retarder is within the above range, the composition becomes easily cured. In addition, although commercially available products of the curing retarder are sometimes sold in a state dispersed or dissolved in a solvent, the content of the curing retarder in the present invention represents the content as the solid content excluding the solvent.

[0208] 5. Solvent The composition of the present invention may include a solvent. The solvent is capable of dispersing or dissolving each component in the composition, and is not polymerized by the acid generator. In addition, even if they are liquid at room temperature (25°C) and atmospheric pressure, the cationic polymerizable component described in the section "1. Cationic polymerizable component", the acid generator described in the section "2. Acid generator", the polyfunctional alcohol compound described in the section "3. Polyfunctional alcohol compound", and the curing retarder described in the section "4. Curing retarder" are not included in the solvent.

[0209] As such a solvent, either water or an organic solvent can be used, but it is preferable to use an organic solvent. The content of the organic solvent may be any content that can obtain the desired adhesive strength and storage stability, and is preferably 80 parts by mass or more, more preferably 90 parts by mass or more, and even more preferably 95 parts by mass or more, in 100 parts by mass of the solvent, and it is particularly preferable that the content is 100 parts by mass, that is, that the solvent contains only an organic solvent. By setting the content within such a range, the composition can form a cured product having high adhesive strength.

[0210] Examples of the organic solvent include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, and 2-heptanone; polyhydric alcohols and derivatives thereof such as ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, propylene glycol, propylene glycol monoacetate, dipropylene glycol, and monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, and monophenyl ether of dipropylene glycol monoacetate; cyclic ethers such as dioxane; ethyl formate, methyl lactate, ethyl lactate, methyl acetate, and the like. Examples of the organic solvent include ethyl acetate, butyl acetate, methyl pyruvate, methyl acetoacetate, ethyl acetoacetate, ethyl pyruvate, ethyl ethoxyacetate, methyl methoxypropionate, ethyl ethoxypropionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-hydroxy-3-methylbutanoate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, and other esters; aromatic hydrocarbons such as toluene and xylene; lactones such as γ-caprolactone, δ-caprolactone, ε-caprolactone, dimethyl-ε-caprolactone, δ-valerolactone, γ-valerolactone, and γ-butyrolactone, and these solvents can be used as one or more mixed solvents. Among these organic solvents, derivatives of polyhydric alcohols, lactones, and carbonates are preferred, carbonates are more preferred, and propylene carbonate is particularly preferred. By using such an organic solvent, the composition can form a cured product having high adhesive strength.

[0211] The molecular weight of the organic solvent is preferably from 50 to 300, more preferably from 80 to 200, and particularly preferably from 90 to 150. When the molecular weight is within such a range, the composition can form a cured product having high adhesive strength.

[0212] The boiling point of the organic solvent is preferably from 100 to 350°C, more preferably from 130 to 300°C, further preferably from 200 to 300°C, and particularly preferably from 200 to 250°C, in order to minimize volatilization from the cured product.

[0213] The content of the solvent is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, and particularly preferably 120 parts by mass or less, relative to 100 parts by mass of the photoacid generator. When the content is within such a range, the composition can form a cured product having high adhesive strength.

[0214] The content of the solvent is preferably 10 parts by mass or less, more preferably 0.5 to 7 parts by mass, further preferably 0.7 to 5 parts by mass, and particularly preferably 1 to 4 parts by mass, in 100 parts by mass of the composition. When the content is within such a range, the composition can form a cured product having high adhesive strength.

[0215] 6.Other Additives The composition of the present invention contains a specific cationically polymerizable component and an acid generator, and further contains, as necessary, other cationically polymerizable components, a sensitizer, a radically polymerizable component, a radical polymerization initiator, and a solvent, but may also contain other components other than these. Examples of other components include various additives such as inorganic fillers, organic fillers, pigments, silane coupling agents, colorants such as dyes, photosensitizers, defoamers, thickeners, thixotropic agents, surfactants, leveling agents, flame retardants, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, and adhesion promoters. Other components may be added as necessary, and the total content thereof is preferably 30 parts by mass or less in 100 parts by mass of the solid content of the composition.

[0216] The method for producing the composition of the present invention is not particularly limited as long as it is a method that can uniformly mix the above-mentioned components, and for example, a method of adding a benzocarbazole sensitizer, a photoacid generator, and a solvent to a non-aromatic epoxy compound and mixing them can be mentioned. As for the mixing method, a method using a known mixing device can be adopted, and for example, a method using a three-roll mill, a sand mill, a ball mill, etc. can be mentioned.

[0217] The uses of the composition of the present invention are not particularly limited as long as they are used to form a cured product, and examples of the uses include optical films, adhesives, glasses, optical materials such as imaging lenses, paints, coating agents, lining agents, inks, high refractive index materials, water-soluble materials, resists for semiconductors, displays, MEMS, and medical devices, liquid resists, printing plates, insulating varnishes, insulating sheets, laminates, printed circuit boards, sealants for semiconductor devices, LED packages, liquid crystal injection ports, organic EL, optical elements, electrical insulation, electronic components, and separation membranes, molding materials, putties, glass fiber impregnation agents, fillers, passivation films for semiconductors and solar cells, etc., interlayer insulating films, protective films, protective films for color filters, Examples of such optical lenses include spacers, DNA separation chips, microreactors, nanobiodevices, recording materials for hard disks, solid-state imaging elements, light-emitting diodes, organic light-emitting devices, luminescent films, fluorescent films, actuators, holograms, plasmon devices, polarizing plates, polarizing films, retardation films, prism lens sheets used in the backlights of liquid crystal display devices, Fresnel lens sheets used in the screens of projection televisions and the like, lens portions of lens sheets such as lenticular lens sheets, or backlights using such sheets, optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, and casting agents for optical modeling.

[0218] The composition of the present invention is preferably used as an adhesive from the viewpoint of more effectively exerting the effect of forming a cured product having high adhesive strength. Specific applications of the adhesive include optical materials such as glasses and imaging lenses, electronic materials such as laminates and printed circuit boards, in-vehicle devices such as head-up displays and car navigation systems, and display panels such as organic EL and liquid crystal. Among them, it is preferable to use the adhesive for bonding members that require high transparency even when used in an environment exposed to energy rays, such as printed wiring boards on which electronic components are mounted by soldering, members for image display devices exposed to energy rays from backlights, LED light sources, etc.; members used outdoors such as vehicles, aircraft, ships, and other transportation devices, building materials, and solar cell members; members exposed to energy rays for the purpose of sterilization, decontamination, etc., such as medical instruments; and members that require light resistance and are required for bonding flexible members such as flexible printed wiring boards, which require high adhesive strength even when the bonded object is deformed.

[0219] The material to be adhered by the adhesive may be either an inorganic material or an organic material. Examples of organic materials include cellulose esters such as diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetylpropionyl cellulose, and nitrocellulose; polyamides; polyimides; polyurethanes; epoxy resins; polycarbonates; polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, and polybutylene terephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, polymethylpentene, polytetrafluoroethylene, and cycloolefin polymers; vinyl compounds such as polyvinyl alcohol, polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethyl methacrylate and polyacrylic acid esters; polycarbonates; polysulfones; polyethersulfones; polyether ketones; polyetherimides; and polymer materials such as polyoxyethylene and norbornene resins. Examples of inorganic materials include glasses such as soda glass and quartz glass, metals, and metal oxides.

[0220] B. Cured product Next, the cured product of the present invention will be described. The cured product of the present invention is a cured product of the composition of the present invention, and being a cured product of the above-mentioned composition, it can exhibit high adhesive strength.

[0221] As the composition is the same as that described in the section "A. Composition", a description thereof will be omitted here.

[0222] The planar shape, thickness, etc. of the cured product can be appropriately set depending on the application of the cured product, etc.

[0223] The method for producing the cured product is not particularly limited as long as it is a method that can form the cured product of the composition into a desired shape. Such a production method is similar to the content described in the section "C. Production method of the cured product" below, so the description here is omitted.

[0224] Uses of the cured product of the present invention are the same as those described in the section "A. Composition."

[0225] C. Manufacturing method of the cured product Next, the method for producing the cured product of the present invention will be described. The method for producing a cured product of the present invention is characterized by having a curing step of curing the above-mentioned composition. Since the curing step uses the above-mentioned composition, a cured product exhibiting excellent adhesive strength can be easily formed.

[0226] 1. Hardening process The curing step is a step of hardening the composition. The curing method may be any method capable of forming a polymer by polymerizing cationic polymerizable components together, and examples of the curing method include a method of carrying out an energy ray irradiation treatment and a method of carrying out a heat treatment. The curing method is preferably a method of performing an energy ray irradiation treatment when the composition contains a photoacid generator as an acid generator, and is preferably a method of performing a heat treatment when the composition contains a thermal acid generator, and is preferably a method of performing both the energy ray irradiation treatment and the heat treatment, because this makes it easier to cure the composition.

[0227] Examples of the energy ray include visible light, ultraviolet light, electron beam, X-ray, radiation, and high frequency, and ultraviolet light is economically most preferable. Examples of the source of ultraviolet light include ultraviolet laser, mercury lamp, xenon laser, and metal halide lamp. The composition of the present invention can be cured by an LED light source. Examples of the energy ray from an LED light source include ultraviolet light. Examples of the wavelength of the energy ray from an LED light source include 350 to 405 nm. The energy ray and the exposure time to the energy ray can be the same as those described in International Publication WO 2013 / 172145 and the like.

[0228] The amount of energy radiation to be applied is not particularly limited and can be appropriately determined depending on the composition of the composition. From the viewpoint of preventing deterioration of the components in the composition, the amount of energy radiation to be applied is preferably 100 to 2000 mJ / cm. 2 is preferred.

[0229] As a curing method, a method using an energy ray irradiation treatment and a heat treatment in combination is also preferred, and it is particularly preferred to carry out a heat treatment (post-baking treatment) after the energy ray irradiation treatment, because this makes it easy to form a cured product with excellent adhesive strength. The heat treatment conditions are preferably, for example, 70 to 250° C. and 1 to 100 minutes, because this makes it easy to form a cured product with excellent adhesive strength.

[0230] The composition to be cured is the same as that described in the section "A. Composition," and therefore will not be described here.

[0231] 2.Other processes The method for producing the cured product of the present invention may have other steps as necessary. Such steps include a step of applying the composition onto a substrate before the above-mentioned curing step. The composition can be applied by known methods such as a spin coater, a roll coater, a bar coater, a die coater, a curtain coater, various printing methods, and immersion.

[0232] The substrate can be appropriately selected depending on the application of the cured product, and examples thereof include soda glass, quartz glass, semiconductor substrates, metals, paper, plastics, etc. After being formed on the substrate, the cured product may be peeled off from the substrate and used, or may be transferred from the substrate to another adherend and used.

[0233] Other steps include a pre-baking step, which is a heat treatment for removing the solvent in the coating film of the composition after the step of applying the composition onto a substrate. The heating conditions in the pre-baking step may be any conditions capable of removing the solvent in the composition, and may be, for example, 70 to 150° C. for 30 to 300 seconds.

[0234] 3.Cured product The cured product produced by the production method of the present invention and its uses are the same as those described in the section "B. Cured product."

[0235] The present invention is not limited to the above-mentioned embodiment. The above-mentioned embodiment is merely an example, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits similar effects is included in the technical scope of the present invention. EXAMPLES

[0236] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0237] [Examples 1 to 31 and Comparative Examples 1 to 5] A composition was obtained by blending compound A, a first epoxy compound, a second epoxy compound, a polyfunctional alcohol compound, an acid generator, and a hardening retarder according to the blending ratios shown in Tables 1 to 3 below. The following materials were used for each component. The blending amounts in the tables indicate parts by mass of each component.

[0238] <Compound A> A1: Propylene oxide modified bisphenol A type epoxy resin (compound represented by the following formula (A1), m+n=2, epoxy equivalent 255) A2: Propylene oxide modified bisphenol A type epoxy resin (compound represented by the following formula (A1), m+n=10, epoxy equivalent 510)

[0239] [ka]

[0240] <First epoxy compound> B1: Aromatic epoxy compound (compound represented by the following formula (B1), epoxy equivalent 875 to 975, #1004 manufactured by Mitsubishi Chemical Corporation) B2: Aromatic epoxy compound (compound represented by the following formula (B1), epoxy equivalent 1,750 to 2200, #1007 manufactured by Mitsubishi Chemical Corporation) B3: Aromatic epoxy compound (compound represented by the following formula (B1), epoxy equivalent 450 to 550, #1001 manufactured by Mitsubishi Chemical Corporation) B4: Aliphatic epoxy compound (compound represented by the following formula (B4), epoxy equivalent 700, Denalex R-15EPT manufactured by Nagase ChemteX Corporation) B5: Aromatic epoxy compound (a compound represented by the following formula (B5), trifunctional, epoxy equivalent of 450 or more) B6: Aliphatic epoxy polymer (a copolymer of 70 parts by mass of methyl methacrylate and 30 parts by mass of glycidyl methacrylate represented by the following formula (B6), epoxy equivalent 580, weight average molecular weight 8,000)

[0241] [ka] In the above formula, n and m each independently represent any number that results in the above epoxy equivalent.

[0242] <Second epoxy compound> C1: Aliphatic epoxy compound (compound represented by the following formula (C1), epoxy equivalent: 215) C2: Aliphatic epoxy compound (compound represented by the following formula (C2), n = 5 to 7, epoxy equivalent 300) C3: Aromatic epoxy compound (compound represented by the following formula (C3), epoxy equivalent: 190) C4: Aromatic epoxy compound (compound represented by the following formula (C4), epoxy equivalent: 170) C5: Aromatic epoxy compound (compound represented by the following formula (C5), epoxy equivalent 170, R710 manufactured by EPOX) C6: Aromatic epoxy compound (compound represented by the following formula (C6), epoxy equivalent 205 to 215, VG-3101L manufactured by Printec Co., Ltd.) C7: Alicyclic epoxy compound (compound represented by the following formula (C7), epoxy equivalent 128 to 145, Celloxide 2021P manufactured by Daicel Corporation) C8: Silane coupling agent with epoxy group (3-glycidoxypropyltrimethoxysilane, epoxy equivalent 236)

[0243] [ka] In the above formula, each n independently represents an arbitrary number that results in the above epoxy equivalent.

[0244] <Polyfunctional alcohol compounds> D1: Aromatic alcohol (compound represented by the following formula (D1), n+m=10, molecular weight 809, hydroxyl value 404) D2: Aliphatic alcohol (a compound represented by the following formula (D2), molecular weight 300, hydroxyl value 530 to 550, Plaxel 303 manufactured by Daicel Corporation) D3: Aliphatic alcohol (a compound represented by the following formula (D2), molecular weight 850, hydroxyl value 190 to 200, Plaxel 308 manufactured by Daicel Corporation) D4: Aromatic alcohol (a compound represented by the following formula (D4), molecular weight 2,000, hydroxyl value 51 to 61, Daicel Corporation, Plaxel CD220) D5: Aromatic alcohol (a compound represented by the following formula (D4), molecular weight 530, hydroxyl value 207 to 217, Plaxel CD205 manufactured by Daicel Corporation) D6: Aliphatic alcohol (polyethylene glycol, molecular weight 400, hydroxyl value 200)

[0245] [ka] In the above formula, n and m each independently represent any number that results in the above hydroxyl value.

[0246] <Acid generator> E1: Photoacid generator (a compound represented by the following formula (E1), a triarylsulfonium salt (50% by mass solution in propylene carbonate)) F1: Thermal acid generator (a compound represented by the following formula (F1), monoarylsulfonium salt (50% by mass solution in propylene carbonate), SI-80 manufactured by Sanshin Chemical Industry Co., Ltd.)

[0247] [ka]

[0248] <Cure retarder> G1: Curing retarder (compound represented by the following formula (G1) (50% by mass solution in propylene carbonate), SI-S manufactured by Sanshin Chemical Industry Co., Ltd.)

[0249] [ka]

[0250] [evaluation] The resulting compositions were evaluated for adhesive strength, moist heat resistance, stretchability, light resistance, heat resistance, storage stability and curability according to the following procedures.

[0251] 1.Adhesive strength (1) Adhesive strength 1 Two rectangular glass substrates 2 (see Figure 1) measuring 25 mm in length, 50 mm in width, and 2 mm in thickness were wiped with acetone. In addition, three sheets of fluororesin tape (AGF-100FR, manufactured by Chukoh Chemical Industries, Ltd.) measuring 19 mm in length, 10 mm in width, and 130 μm in thickness were stacked together to prepare a fluororesin tape 3 with a circular hole 7 measuring 5.5 mm in diameter punched in the center. Of the two substrates 2, a line L was drawn 1.5 cm from one end in the longitudinal direction of one of the substrates 2, and a fluororesin tape 3 was attached to the substrate 2 so that a hole 7 was located at the center in the width direction of the substrate 2, aligned with the line L, as shown in FIG. 1 (1). The compositions of the Examples and Comparative Examples were injected as adhesive 5 into the hole 7 of the fluororesin tape 3, and the film thickness was adjusted to match that of the fluororesin tape 3 by wiping with a glass rod. Next, in the state (2) where the fluororesin tape 3 was peeled off (where a cylindrical coating film had been formed), 365 nm light was applied at 3,000 mJ / cm using an LED (an LED lamp with a peak top at 365 nm within the range of 300 nm to 500 nm, manufactured by ITEC Systems). 2 After that, as shown in (3), two rectangular PET films (Lumirror T60, 5 mm wide × 2 mm long × 100 μm thick) were used as spacers 4, and the two substrates 2 were attached together and fixed with clips as shown in (4). In this state, the two substrates 2 were heated at 100°C for 1 hour, and then cooled in an environment at room temperature of 25°C for 1 hour, and the spacers 4 were removed to obtain an evaluation sample. The obtained evaluation sample was subjected to a compression shear test at room temperature (25°C) using an AUTOGRAPH AGS-X manufactured by Shimadzu Corporation, and a force of 10 kN from a load cell was applied to the two substrates at a speed of 15 mm / min in a direction parallel to their longitudinal directions and toward each other as shown in (5). The maximum load N at the time of break was calculated based on the area of ​​the adhesive mm 2 The compressive shear strength (MPa) was calculated by dividing the measured value by the formula (1) and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. +++: 10MPa or more ++: Less than 10MPa, 5MPa or more +: Less than 5MPa, 2MPa or more -: Less than 2MPa It can be determined that the higher the compressive shear strength, the more sufficiently cured the adhesive is and the higher the adhesive strength is.

[0252] (2) Adhesive strength 2 The evaluation was performed in the same manner as in "1. Adhesive strength 1" above, except that the heating conditions while fixed with clips were changed from 100°C for 1 hour to 80°C for 1 hour to obtain an evaluation sample.

[0253] 2. Moisture and heat resistance The evaluation samples prepared in the above "1. Adhesive strength 1" evaluation were left to stand for 200 hours under conditions of 80°C and 80% relative humidity (RH), and then the compressive shear strength (MPa) was measured (the measurement result is regarded as the adhesive strength after the moist heat resistance test). Next, the retention rate of adhesive strength after moist heat resistance test (adhesive strength after moist heat resistance test / adhesive strength 1×100(%)) relative to the compressive shear strength measured in "1. Adhesive strength 1" (hereinafter simply referred to as adhesive strength 1) was determined and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. +++:90% or more ++: 70% or more but less than 90% +: 50% or more but less than 70% -: Less than 50% The higher the retention rate, the more excellent the heat resistance.

[0254] 3.Stretchability The compositions of the Examples and Comparative Examples were applied to a 20 cm × 30 cm glass plate using a bar coder to a thickness of 100 μm, and 365 nm light was applied to the glass using an LED (an LED lamp having a peak top at 365 nm within the range of 300 nm to 500 nm, manufactured by ITEC Systems) at 3000 mJ / cm. 2 After irradiation, the glass plate was heated at 100°C for 2 hours. The cured composition was then peeled off from the glass plate to obtain a film-like test piece. The test piece was measured for tensile elongation by the following method and evaluated according to the following criteria. The results are shown in Tables 1 to 3.

[0255] <Method for measuring tensile elongation> According to JIS K 7113, the test pieces obtained above were cut into dumbbell shapes No. 3 to prepare tensile test pieces, and the tensile elongation (%) was measured at 25°C under conditions of a test speed of 50 mm / min and a span of 40 mm, and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. +++: 50% or more ++: Less than 50% 30% or more +: Less than 30% 10% or more -: Less than 10% A larger tensile elongation indicates better stretchability.

[0256] 4. Light resistance A film-like test piece was obtained in the same manner as in "3. Stretchability" above. The obtained test piece was exposed to light for 500 hours at 180 mW (300 nm to 400 nm) using a light resistance tester (Xenon light resistance tester Table Sun XT-1500L manufactured by Suga Test Instruments) for evaluation samples. The difference in transmittance (%) at a wavelength of 430 nm before and after the exposure treatment ((transmittance (%) before light resistance test - transmittance (%) before light resistance test)) was measured and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. ++: The transmittance difference (%) is less than 1%. +: The transmittance difference (%) is 1% or more and less than 10%. -: The transmittance difference (%) is 10% or more. The smaller the difference in transmittance, the better the light resistance.

[0257] 5.Heat resistance The evaluation sample prepared in the above "1. Adhesive strength 1" evaluation was heat-treated at 240°C for 6 minutes, and then cooled in an environment at room temperature of 25°C for 1 hour to prepare a sample for heat resistance evaluation, which was then evaluated (the measurement result was regarded as the adhesive strength after the heat resistance test). Next, the retention rate of adhesive strength after heat resistance test (adhesive strength after heat resistance test / adhesive strength 1×100(%)) relative to the compressive shear strength measured in "1. Adhesive strength 1" (hereinafter simply referred to as adhesive strength 1) was determined and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. +++:90% or more ++: 70% or more but less than 90% +: 50% or more but less than 70% -: Less than 50% The higher the retention rate, the more excellent the heat resistance.

[0258] 6.Storage stability The compositions of the Examples and Comparative Examples were filled into screw cap bottles and allowed to stand for 30 days at 10° C. The viscosity of the compositions after standing at 25° C. was measured using an E-type viscometer. Next, the viscosity change (%) was calculated according to the following formula and evaluated according to the following criteria. The results are shown in Tables 1 to 3 below. Viscosity change (%) = (viscosity after standing - viscosity before standing) / before standing × 100 ++: Viscosity change (%) is less than 1%. +: Viscosity change (%) is 1% or more. The smaller the change in viscosity, the more excellent the storage stability.

[0259] 7.Curability The compositions of the examples and comparative examples were coated on a glass plate using a wire bar coater to a thickness of about 30 μm, cured using a high pressure mercury lamp at 100 mW-2000 mJ, and left to stand at 25°C under atmospheric pressure to measure the time until the tackiness disappeared and evaluated according to the following criteria. The results are shown in Tables 1 to 3. +++: Less than 1 minute ++: 1 minute or more but less than 10 minutes +: More than 10 minutes or the tack did not disappear. The shorter the time until the tack disappears, the better the curability is.

[0260] [Table 1]

[0261] [Table 2]

[0262] [Table 3]

[0263] [summary] From Tables 1 to 3, it was confirmed that the compositions of the examples were capable of forming cured products having high adhesive strength, and that the compositions of the examples were capable of forming cured products having excellent stretchability, heat resistance, moist heat resistance, and light resistance. [Industrial Applicability]

[0264] The composition of the present invention can form a cured product having high adhesive strength.

Claims

1. A cationically polymerizable component; An acid generator; having The cationically polymerizable component is A compound represented by the following general formula (A), a first epoxy compound having an epoxy equivalent of 400 or more and being an epoxy compound other than a compound represented by the following general formula (A); a second epoxy compound having an epoxy equivalent of less than 400 and being an epoxy compound other than a compound represented by the following general formula (A); Including, The acid generator is A triarylsulfonium salt; A monoarylsulfonium salt; A composition comprising: 【Chemistry 1】 (In the formula, R １ , R ２ , R ３ , R ４ , R ５ , R ６ , R ７ , R ８ , R ９ and R １０ each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 12 carbon atoms, a halogen atom, or a group in which a hydrogen atom in the alkyl group or aryl group is substituted with a halogen atom, Z １ and Z ２ each independently represents a linear or branched alkylene group having 1 to 10 carbon atoms, or a group in which a hydrogen atom of the alkylene group is substituted with a halogen atom, m １ and m ２ each independently represents an integer from 0 to 20, m １ and m ２ The sum of is an integer from 1 to 30.

2. m １ and m ２ The composition according to claim 1, wherein the sum of is an integer from 1 to 15.

3. 3. The composition according to claim 1, wherein the content of the compound represented by general formula (A) is 5 parts by mass or more and 80 parts by mass or less in 100 parts by mass of the cationically polymerizable component.

4. the first epoxy compound comprises an aromatic epoxy compound; The composition of any one of claims 1 to 3, wherein the second epoxy compound comprises an aliphatic epoxy compound.

5. the first epoxy compound comprises a bisphenol type epoxy compound; The composition of claim 4 , wherein the second epoxy compound comprises a hydrogenated bisphenol type epoxy compound.

6. The composition according to any one of claims 1 to 5, wherein a total content of the first epoxy compound and the second epoxy compound is 20 parts by mass or more and 80 parts by mass or less in 100 parts by mass of the cationically polymerizable component.

7. The composition comprises a polyfunctional alcohol compound, The composition according to any one of claims 1 to 6, wherein the polyfunctional alcohol compound comprises at least one of an aromatic alcohol compound and an aliphatic alcohol compound.

8. A cured product of the composition according to any one of claims 1 to 7.

9. A method for producing a cured product, comprising the step of polymerizing the cationically polymerizable component in the composition according to any one of claims 1 to 7.

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