SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The substrate processing device addresses the challenge of non-uniform etching by using a heat radiation suppressing member to maintain the temperature of the processing liquid, ensuring uniform etching across the substrate surface.

JP7664706B2Active Publication Date: 2025-04-18SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
JP2021008823
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-01-22
Publication Date
2025-04-18
Estimated Expiration
2041-01-22

AI Technical Summary

Technical Problem

In batch type substrate processing devices, it is challenging to maintain uniform etching depth across multiple substrates due to differences in film thickness, and the temperature of the processing liquid, such as phosphoric acid, tends to decrease as it moves from the center to the outer periphery of the substrate, leading to non-uniform etching rates.

Method used

A substrate processing device with a holding portion and a rotating body that supplies heated processing liquid to the substrate, while a heat radiation suppressing member is used to minimize heat loss from the substrate's back surface, allowing the processing liquid to maintain its temperature and ensuring uniform etching across the substrate.

Benefits of technology

The solution effectively suppresses the reduction in processing rate by maintaining the temperature of the processing liquid, thereby ensuring uniform etching and meeting strict processing requirements across the substrate surface.

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Abstract

To provide a substrate processing apparatus and a substrate processing method capable of suppressing a decrease in substrate processing rate by suppressing a decrease in the temperature of a processing liquid.SOLUTION: A substrate processing apparatus includes a holding portion that holds a substrate, a rotatable rotating body 10 having the holding portion and having a facing surface 111 facing the substrate held by the holding portion with a gap therebetween, a supply portion that supplies a heated processing liquid to the surface of the substrate held by the holding portion opposite to the surface facing the facing surface 111, a heat dissipation suppressing member 51 facing the substrate without contact between the facing surface 111 and the surface facing the facing surface 111 of the substrate, and a heat retaining portion 50 having a driving mechanism 52 for advancing and retracting the heat dissipation suppressing member 51 with respect to the substrate 1.SELECTED DRAWING: Figure 2
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Citation Information

Patent Citations

  • Substrate heat-treating device

    JP1998270302A

  • Substrate treating device

    JP2001326210A

  • Wire grid type polarizer and method for manufacturing the same

    JP2011090141A

  • Systems and methods for etching silicon nitride

    JP2012023366A

  • Substrate processing device and substrate processing method

    JP2012069696A