Metal-resin bonded body and resin composition

By roughening the copper surface and using a polyamide resin with a high melting point and a modified polyolefin resin, the bonding strength and airtightness between polyamide resin and copper are significantly improved, addressing the challenges of existing bonding methods.

JP7664716B2Active Publication Date: 2025-04-18MITSUI CHEMICALS INC
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Patent Information

Application Number
JP2021039130
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-11
Publication Date
2025-04-18
Estimated Expiration
2041-03-11

AI Technical Summary

Technical Problem

Existing methods for bonding polyamide resin compositions to copper members, particularly in automotive electronics, face challenges in achieving sufficient bonding strength and airtightness.

Method used

A metal resin bonding body is created by roughening the surface of a copper member and bonding it with a resin member containing a polyamide resin with a melting point of 280° C. or higher and a modified polyolefin resin, achieving a bonding strength of 40 MPa or more and reduced helium leakage.

Benefits of technology

The solution provides a robust and airtight bond between the polyamide resin and copper, enhancing the mechanical strength and leak resistance of the metal resin bonded body.

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Abstract

To provide a metal resin joined body which is obtained by strongly joining a resin member obtained by molding a polyamide resin composition and a copper member, and has enhanced airtightness.SOLUTION: A metal resin joined body has a copper member whose surface is roughened, and a resin member containing a polyamide resin (A) joined to the roughened surface of the copper member, wherein a joint strength of the copper member and the resin member obtained by dividing a breaking load (N) measured at a room temperature (23°C) by a tensile testing machine under conditions of a distance between chucks of 60 mm and tensile speed of 10 mm / min by a joined area of the copper member and the resin member is 40 MPa or more, and a leak amount of helium measured by a method according to ISO 19095 in a joined part between the copper member and the resin member is 1×10-6 Pa m3 / s or less.SELECTED DRAWING: None
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Citation Information

Patent Citations

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    JP2017132243A

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    JP2018095838A

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