Remote optimization of purge flow rates in vessels

Abstract

Optimizing purge flow parameters in the substrate container includes flowing a purge working fluid into the interior of the substrate container, draining the purge working fluid from the interior of the substrate container, modifying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition within the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the modified purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the flow in and out according to the optimized purge flow parameters. The substrate container may include, for example, a front-opening integrated pod or a reticle pod.

Description

[Technical field]

[0001] The present disclosure relates to controlling the environment within a wafer-carrying substrate container, such as a front-opening integrated pod (FOUP), or a reticle-carrying substrate container. [Background technology]

[0002] Substrates in the form of wafers can be processed to form semiconductor devices. Substrates may include glass, silicon, or any other material suitable for semiconductor devices. Substrates may have a panel shape, and the panels may be circular, rectangular, or any other shape suitable for processing and transport in a container. Wafer substrates, hereafter "substrates", undergo a series of process steps including material layer deposition, doping, etching, or chemical or physical reactions of a particular substrate material. Substrate containers are used to store substrates and transport in-process substrates within a manufacturing facility. Substrate containers include, for example, FOUPs, which typically include a shell with an interior space for holding substrates, and plates for connecting with various conveyors and other devices, for example so that the FOUP can move around the processing facility. The shell and plates are secured to each other, for example by welding, adhesives, connectors, etc.

[0003] During processing, gas must be introduced and removed from the FOUP, for example during a purging process, and therefore the FOUP must have one or more positions where gas can enter or exit the FOUP; for example, substrates may be transferred from the FOUP to processing equipment via an equipment front-end module (EFEM), which generally includes a load port for accepting the FOUP, a transfer unit, a frame or "mini-environment," and a fan filter unit used to generate gas flow within the EFEM.

[0004] When a FOUP is docked to the load port, the load port door connects with the FOUP door and disengages the FOUP door from the FOUP shell. When the FOUP door is disengaged (opened) from the shell, the EFEM allows a transfer unit housed within the EFEM to access substrates stored within the FOUP. The flow of gas introduced by the fan filter unit flows from the top of the EFEM, through the EFEM to the bottom of the EFEM. Summary of the Invention

[0005] The present disclosure relates to optimizing purge flow parameters of a wafer-carrying substrate container, such as a FOUP or pod (e.g., a reticle pod) used in semiconductor manufacturing. More specifically, the present disclosure relates to remotely measuring environmental conditions, such as relative humidity, within the FOUP in real time while purging, and further remotely optimizing purge flow parameters, such as purge flow rate, in various scenarios including open or closed door purge processes.

[0006] In at least one exemplary embodiment, the system includes a first processing device disposed inside the FOUP in which the substrate is inserted. The system also includes a sensor communicatively coupled to the first processing device within the interior of the FOUP. The sensor may be configured to detect at least one environmental condition within the interior of the FOUP. According to at least one exemplary embodiment, the first processing device, the sensor, or a combination thereof may be disposed on an interior wall of the FOUP or on a door of the FOUP, may be integral with the interior wall or door, or may be attached to the interior wall or door. According to at least one other exemplary embodiment, any of the first processing device, the sensor, or both may be disposed on the substrate or wafer, or may be disposed in or adjacent to a purge module disposed within the interior of the FOUP.

[0007] In at least one exemplary embodiment, a method of optimizing purge flow parameters in a FOUP includes flowing a purge working fluid into an interior of the FOUP, draining the purge working fluid from the interior of the FOUP, modifying purge flow parameters of the purge working fluid for a predetermined period of time, sensing at least one environmental condition within the interior of the FOUP during the predetermined period of time, determining optimized purge flow parameters based on the modified purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the flow in and out according to the optimized purge flow parameters.

[0008] In the following detailed description, embodiments are described by way of example only, since various changes and modifications will become apparent to those skilled in the art from the following detailed description. The use of the same reference numbers in the various figures indicates similar or identical items. [Brief description of the drawings]

[0009] [Figure 1] 1 is a front perspective view of a substrate container in accordance with at least one exemplary embodiment; [Diagram 2] FIG. 1 is an exploded view of a substrate container in accordance with at least one example embodiment. [Diagram 3] FIG. 13 is an exploded view of a substrate container in accordance with at least one other exemplary embodiment. [Figure 4] FIG. 1 is a schematic diagram of a substrate container interacting with an EFEM in accordance with at least one example embodiment. [Diagram 5] FIG. 1 illustrates a load port for docking a substrate container in accordance with at least one example embodiment. [Figure 6] 1 is a schematic diagram of a system for a purge process for a substrate container in accordance with at least one example embodiment. [Figure 7] FIG. 1 is a flow diagram of a method for optimizing purge flow parameters in a vessel, according to at least one example embodiment. [Figure 8]FIG. 1 is a flow diagram of a method for optimizing a sensor response in a container in accordance with at least one exemplary embodiment. [Figure 9] FIG. 1 is a flow diagram of a method of operating an optimized purge process in a vessel in accordance with at least one example embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the following detailed description, reference is made to the accompanying drawings, which form a part of the description. In the drawings, like symbols typically identify like components unless the context dictates otherwise. Furthermore, unless otherwise indicated, the description of each successive drawing may refer to features from one or more of the previous drawings to provide a clear context and substantive description of the present exemplary embodiment. However, the exemplary embodiments described in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that the aspects of the present disclosure as generally described herein and illustrated in the drawings may be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are expressly contemplated herein.

[0011] The present disclosure relates to optimizing purge flow parameters of a wafer-carrying or reticle-carrying substrate container, such as a FOUP or reticle pod used in semiconductor manufacturing. More specifically, the present disclosure relates to remotely measuring environmental conditions, such as relative humidity, in real time during a purge process, and remotely optimizing purge flow parameters, such as purge flow rate, in the substrate container in various scenarios, such as during a FOUP open or closed door purge process.

[0012] As defined herein, the terms "real-time" or "real time" may refer to various operations in computing or other processes that must guarantee response times within specified or predetermined times (deadlines), typically within a fraction of a second, for example. A real-time process is generally one that has a maximum duration and occurs in defined time steps fast enough to affect the environment in which it occurs.

[0013] It will be appreciated that substrates in the form of wafers may be processed to form semiconductor devices. Substrate containers may be used to hold such substrates during processing. In at least one non-limiting embodiment, the container may be a reticle container. The substrate container may be accessed through a front opening or cover of the substrate container.

[0014] In one embodiment, when purging a FOUP (e.g., open door purge, closed door purge, etc.), typically environmental conditions such as relative humidity (%RH) may be measured or detected, for example, by one or more sensors, and the detected %RH data may be stored, for example, using a %RH data logger. The sensor, data logger, or combination thereof may be disposed on a substrate inside the FOUP and positioned to capture %RH measurements at various locations (e.g., front, rear, right, and left of the interior of the FOUP in various slots that house wafers). After the purge process is completed, the sensor or data logger is removed from the substrate and the stored %RH data may be downloaded to a controller and analyzed by the controller to determine a relationship between the %RH data and the environmental conditions at which the %RH data was obtained. Alternatively, the sensor or data logger may be attached to a structural element of the FOUP, for example, a wafer support.

[0015] In at least one exemplary embodiment, while purging a substrate carrier such as a FOUP, environmental conditions, e.g., %RH, may be measured or detected, e.g., by one or more sensors in the FOUP, and the detected %RH data may be communicated in real time to an external controller or processor via an internal controller or processor inside the FOUP. The sensors may be coupled to a controller in the FOUP that communicates the detected %RH data in real time to the external controller. In at least one exemplary embodiment, sensors may be placed on wafers inside the FOUP to capture %RH at various locations (e.g., front, back, right, and left inside the FOUP, in various slots that accommodate wafers). In at least one other exemplary embodiment, sensors may be placed on the interior walls of the FOUP or on the door (inside) of the FOUP, e.g., integral with or attached to the interior wall or door.

[0016] In at least one exemplary embodiment, an internal controller may be implemented in place of an external controller, and thus the external controller may be optional. In at least one exemplary embodiment, the internal controller may be located in the FOUP, in the EFEM, or in any other location suitable for communication with sensors. In at least one exemplary embodiment, the external controller may be configured to monitor real-time environmental conditions, such as %RH inside the FOUP, during the purge process. The external controller and / or user may make adjustments (e.g., FOUP geometry, purge design (e.g., number and / or configuration of inlet / outlet purge ports), EFEM configuration, purge flow parameters (e.g., gas flow rates), etc.) so that the purge process, purge efficiency, and purge performance may be fine-tuned and optimized in real time. Additionally, the external controller may store, for each of various applicable operating scenarios (e.g., open door purge, closed door purge, etc.), the corresponding adjustment results (e.g., optimized gas flow rates, etc.) as a set of individual purge "recipes" that can be utilized to optimize a specified environmental response (e.g., desired pressure, etc.) during the purge process when the corresponding operating scenario occurs.

[0017] FIG. 1 is a front perspective view of a substrate container 100 according to at least one embodiment.

[0018] 1, the substrate container 100 includes a door 104 and a shell 102. The door 104 couples to the shell 102 to form an enclosed interior space. The door 104 may be coupled to the shell 102 by being mechanically latched or suction fitted into a corresponding opening in the shell 102, or the door 104 may be coupled to the shell 102 (e.g., via a hinge) at one of the top, bottom, or either side of a corresponding opening in the shell 102. In at least one exemplary embodiment, the door of the FOUP may be coupled to the shell of the FOUP at a bottom opening of the shell.

[0019] Figure 2 is an exploded view of a substrate container 110 in accordance with at least one example embodiment, showing the substrate container 110 with the door 111 removed (e.g., open). As shown in Figure 2, the shell 113 defines an interior space 117 of the substrate container 110 in which a substrate may be stored.

[0020] The shell 113 may include an opening 119 that may be surrounded by a door 111 coupled to the shell 113. The substrate container 110 may be accessed by moving (e.g., opening, removing) the door 111. For example, the door 111 may be coupled to the shell 113 by fitting the door 111 into the opening 119 in the shell 113. In at least one exemplary embodiment, one or more of the door 111 and the shell 113 may include a locking mechanism (not shown) to prevent inadvertent opening or removal of the door 111. In at least another exemplary embodiment, the opening in the shell 113 may be at the bottom of the shell.

[0021] As shown in FIG. 2, the shell 113 may further include a first side wall 114, a second side wall 116, a rear wall 118, and a top wall 120, as well as a bottom wall 122.

[0022] In at least one exemplary embodiment, first side wall 114 may be opposite and parallel to second side wall 116 separated by top wall 120 and bottom wall 122. First side wall 114 may be referred to as the left side and right side wall 116 may be referred to as the right side, although the designations of "left" or "right" are a matter of perspective and are not intended to be limiting in any way.

[0023] The top wall 120 and the bottom wall 122 each extend between the first side wall 114 and the second side wall 116. In at least one exemplary embodiment, the top wall 120 may be opposite and parallel to the bottom wall 122 separated by the first side wall 114 and the second side wall 116. The bottom wall 122 includes an edge 124A that extends along the front opening 119. The edge 124A also extends between the first side wall 114 and the second side wall 116 of the shell 113. The first side wall 114 includes an edge 124B that extends along the front opening 119. The edge 124B of the first side wall 114 also extends between the top wall 120 and the bottom wall 122 of the shell 113. The forward edges 124A and 124B, in at least one exemplary embodiment, are perpendicular to one another and define the front opening 119.

[0024] The substrate container 110 may include an equipment connector (also referred to as an "automation flange") 126 on the top wall 120 of the shell 113. In at least one exemplary embodiment, the equipment connector 126 allows for automated attachment (not shown) for moving the substrate container 110. The automated attachment may include, but is not limited to, an automated arm (also referred to as an "overhead transfer system") that may be connected to the substrate container 110. For example, the automated arm may be used to move the substrate container 110 between different processing equipment. In at least one exemplary embodiment, the substrate container 110 may include one or more handles (not shown) to allow a user (e.g., a technician, etc.) to manually move the substrate container 110.

[0025] The substrate container 110 may further include a number of shelves 115 for holding substrates within the interior space 117 .

[0026] In at least one exemplary embodiment, the interior space 117 includes the interior walls / inner surfaces of the walls 114, 116, 118, 120 and / or 122. A portion of the shelf 115 on the inner surface of the second sidewall 116 is obscured in FIG. 2, but it may have a similar configuration as the portion of the shelf 115 on the first sidewall 114. The shelves 115 on the inner surfaces of the walls 114 and 116 may be configured to cooperatively hold a substrate (not shown) within the interior space 117. For example, the shelf 115 may form and / or define a slot and is sized to hold a particular size substrate (e.g., a 150 mm wafer, a 200 mm wafer, etc.).

[0027] According to at least one exemplary embodiment, when the door 111 of the substrate container 110 is open, a purge gas may be supplied to the interior space 117 to reduce the ingress of the external environment (e.g., gas, particles, humidity, etc.) into the substrate container 110 through the front opening 119. For example, the supplied purge gas may flow out of the interior space 117 through the front opening 119, thus reducing the ingress of gas or substances into the interior space 117 through the front opening 119. In at least one exemplary embodiment, the door of the load port is configured to connect with the door 111 and to disengage (open the door 111) the door 111 from the shell 113. In at least one exemplary embodiment, the controller is configured to open / close the door 111. The purge process may be controlled before opening the door, during the door opening, during the door closing, and when the door is closed. The purge gas may be a generally inert gas, such as nitrogen. The purge gas may also be clean dry air (CDA) or extra clean dry air (xCDA). The purge gas may further be any gas used to condition the substrate, or any other suitable gas. It will be appreciated that a purge tower, diffuser, or manifold (not shown) may facilitate the flow of the gaseous working fluid or purge gas into the substrate container 110 such that the purge gas is directed toward and then away from the wafers contained in the substrate container 110. The purge gas may clean the container and its contents, trap residual moisture, oxygen, and atmospheric micro-contaminants (AMC), and facilitate the migration of particulates toward an exit purge port or door opening.

[0028] The bottom wall 122 of the substrate container 110 includes inlet purge ports (112A, 112B, 112C) for supplying purge gas to the interior space 117. For example, the substrate container 110 may be supplied with a first flow of purge gas through the first inlet purge port 112A, a second flow of purge gas through the second inlet purge port 112B, a third flow of purge gas through the third inlet purge port 112C, or a combination thereof. In at least one exemplary embodiment, one or more of the inlet purge ports (112A, 112B, 112C) may be configured as either an inlet purge port or an outlet purge port. The substrate container 110 may include a fourth inlet / outlet purge port (not shown). The embodiments described and enumerated herein are not limited to four or fewer purge ports. That is, the quantities described and enumerated herein are provided for illustrative purposes only and are not intended to be limiting. In at least one exemplary embodiment, the inlet / outlet purge ports may be located in a sidewall of the substrate container 110 .

[0029] The shell 113 has an exterior surface 150. Each of the inlet / outlet purge ports (112A, 112B, 112C, etc.) extends from the interior space 117 through the bottom wall 122 to the exterior surface 150 of the shell 113. The substrate container 110 may include four inlet / outlet purge ports, or a variable number of inlet / outlet purge ports. In at least one exemplary embodiment, the substrate container 110 may include one or more inlet purge ports. In at least one exemplary embodiment, the substrate container 110 may include one or more front inlet purge ports (corresponding to and fluidly connecting with 210 and / or 240, respectively, of FIG. 5) and one or more rear inlet purge ports (corresponding to and fluidly connecting with 220 and / or 230, respectively, of FIG. 5). In at least one exemplary embodiment, one or more of the front purge ports may be outlet purge ports for exhausting gases in the interior space 117 from the substrate container 110.

[0030] The inlet purge ports (112A, 112B, 112C) allow for the entry of fluid, such as a purge gas (e.g., nitrogen), into the substrate container 110. A check valve (not shown, e.g., a mechanical check valve) may be provided to facilitate the exit of fluid, including gas purged from the substrate container 110, from the interior space 117 of the substrate container 110 through an outlet purge port (112A, 112B, 112C, or a fourth purge port).

[0031] 3 is an exploded view of a substrate container 121, according to at least one example embodiment. The substrate container 121 includes an open front 123, a door 125, and a shell 127. Wafers 129 can be inserted and removed horizontally through the open front 123. A slot (not visible) formed in the interior of the shell 127 accommodates the wafers 129. The door 125 can include a seal to engage with the shell 127 to create an internal environment isolated from the surrounding atmosphere.

[0032] FIG. 4 is a schematic diagram 130 of a substrate container 138 interacting with an EFEM 148, according to one embodiment. The substrate container 138 is docked to a load port 142 adjacent to the EFEM 148. The substrate container 138 may be any front opening substrate carrier, such as, for example, a FOUP, a front opening shipping box (FOSB), or a multi-purpose carrier (MAC). It will be generally understood by those skilled in the art that many of the concepts disclosed herein may be applicable to other substrate containers or carriers, more specifically, other front opening or bottom opening substrate containers or carriers. The substrate container 138 may include equipment hookups 134. When the substrate container 110 is attached to the EFEM 148, the front opening 132 of the substrate container 110 is positioned along the interior of the EFEM 148.

[0033] In use, the substrate container 138 can be docked onto the load port 142 and a door of the load port 142 connects with the door of the substrate container 138 (e.g., 125 in FIG. 3 ) and disengages the door of the substrate container 138 from the shell of the substrate container 138. When the door of the substrate container 138 is disengaged (opened) from the shell, the EFEM 148 allows a robot arm housed within the EFEM 148 to access the semiconductor wafers 140 stored within the substrate container 138. Gas (e.g., nitrogen, extra clean dry air, etc.) can flow from the top 150 of the EFEM 148 through the EFEM 148 to the bottom 144 of the EFEM 148 as shown by the arrows in FIG. 4 to reduce contaminants within the EFEM 148.

[0034] When the front opening 132 of the substrate container 138 connects with the load port opening 146 of the EFEM 148 to form a FOUP-EFEM connection, some of the gas flowing through the EFEM 148 and across the load port opening 146 may enter the interior 136 of the container 138 and potentially impede the purging ability of the substrate container 138 by temporarily causing an increase in the internal environment, such as the relative humidity and / or oxygen level, within the microenvironment of the substrate container 138, which may be undesirable. Furthermore, not all EFEMs have the same structure. The size and dimensions of the EFEM, as well as the internal structure of the EFEM, may vary depending on the manufacturer. Variations in size and structure between EFEMs from various manufacturers may cause differences in the purging performance of the substrate container 138 when the substrate container 138 is utilized with different EFEMs. It will be appreciated that during a purge process of the substrate container 138, purge gas may be distributed throughout the interior of the container 138, including the front opening 132, to counter turbulent flow of gas from the EFEM 148 through the front opening 132 and into the interior space 136. A controller (discussed in detail in FIGS. 6 and 7 ) may be configured to adjust purge flow parameters (e.g., gas flow rates) of the substrate container 138 to achieve optimized environmental response (e.g., %RH, pressure, etc.) due to influences from the various EFEMs.

[0035] FIG. 5 illustrates a load port 200 for docking a substrate container (not shown), according to one embodiment. The load port 200 includes inlets / outlets 210, 220, 230, 240, one or more of which may be configured as either an inlet or an outlet. An EFEM having a sidewall 250 is attached to the substrate container, and an additional EFEM 260 may be adjacent to the EFEM. The substrate container (e.g., 110 in FIG. 2) may include, for example, inlet and outlet purge ports (e.g., 112A, 112B, 112C, etc. in FIG. 2) corresponding to the location of the outlet 210, as well as the outlets 220, 230, and 240. In at least one exemplary embodiment, during a door-opening purge process, for example, the outlet 210 may not have the intended effect and therefore may not be used, as the purge gas may flow out of the container through the opening (where it is located when the door is closed). In at least one exemplary embodiment, purge gas may always flow through 220 and 230 and may also flow through 240.

[0036] During operation, a first flow of purge gas may be supplied to the substrate container from any of the inlets 220, 230, 240 through a first inlet purge port in the bottom wall of the shell. A second flow of another purge gas may be supplied to the substrate container from an unused one of the inlets 220, 230, 240 through a second inlet purge port in the bottom wall of the shell. A third flow of purge gas may be supplied to the substrate container from yet another one of the inlets 220, 230, 240 through a third inlet purge port in the bottom wall of the shell. As noted above, the embodiments described and enumerated herein are not limited to three or fewer inlet ports, rather the number of ports is provided for illustrative purposes only and is not intended to be limiting.

[0037] The purge gas may be exhausted from the interior space of the substrate container through an outlet purge port in the bottom wall of the shell from the outlet 210. Such a configuration is sometimes referred to as a 3 in / 1 out configuration. Those skilled in the art will recognize that other desirable configurations, such as, for example, 2 in / 2 out, may also be included.

[0038] In at least one other exemplary embodiment, a first flow of purge gas may be supplied to the substrate container from one of the inlets 220, 230, 240 through a first inlet purge port in the bottom wall of the shell. A second flow of purge gas may be supplied to the substrate container from an unused one of the inlets 220, 230, 240 through a second inlet purge port in the bottom wall of the shell. The purge gas may be exhausted from the interior space of the substrate container from the first and second outlets 210 through first and second outlet purge ports in the bottom wall of the shell. Such a configuration may be referred to as a 2in / 2out configuration.

[0039] FIG. 6 is a schematic diagram of a system 300 for purging a substrate container 310 in accordance with at least one example embodiment.

[0040] The system 300 includes a substrate container 310 having an interior space, one or more substrates 330 that may be inserted into the interior space, a first controller or processor 320 disposed in the interior space, and one or more sensors 340 coupled to a first processing device within the interior space. The sensor 340 may be configured to detect at least one environmental condition in the interior space.

[0041] In at least one exemplary embodiment, the container 310 may be a wafer or reticle carrier, e.g., a FOUP or pod (such as an extreme ultraviolet (EUV) reticle pod). The first controller 320 or the sensor 340, or a combination thereof, may be disposed on an interior wall or door of the container 310. Alternatively or additionally, one or more of the first controller 320, the sensor 340, or a combination thereof may be disposed on a substrate 330 disposed within the container 310. In yet another exemplary embodiment, the first controller 320, the sensor 340, or a combination thereof may be disposed, for example, at the front, rear, right, and left of the interior space of the container 310, or in various slots (see, e.g., FIG. 2) that accommodate the substrate 330. In yet another exemplary embodiment, the first controller 320 and / or the sensor 340 may be integrated into or attached to an interior wall or door.

[0042] The system 300 may also include a second controller or processor 350. In at least one exemplary embodiment, the second controller 350 may be located outside the vessel 310. The first controller 320 is configured to communicate at least one environmental condition (e.g., %RH) to the second controller 350. In at least another exemplary embodiment, the second controller 350 may be located on the substrate, in or on the vessel 310, in a load port, in the EFEM, or a combination thereof. In at least another exemplary embodiment, the second controller 350 may be a stand-alone controller or part of a factory information system. In at least one exemplary embodiment, the first controller 320 may communicate directly with a device 360 ​​(e.g., a laptop or any other suitable device). In such an embodiment, the second controller 350 is housed in the device 360.

[0043] FIG. 6 shows an expanded view of the first controller 320 and four sensors 340 between the container 310 and the second controller 350. The first controller 320 and the sensors 340 are disposed within the container 310. According to at least one embodiment, the four sensors 340 are disposed on or around the leading edge, trailing edge, left edge, and right edge of the first wafer in the stack of wafers (e.g., 25 wafers each disposed in a slot). The first controller 320 is disposed at the center of the first wafer. The number of sensors is not limited to those shown and described herein, but rather is provided for illustrative purposes only. In at least one exemplary embodiment, the sensors 340 may be disposed on a removable three-dimensional lattice structure disposed inside the container 310. In at least one exemplary embodiment, in the case of an open door purge (of the vessel 310), the sensors 340 may be positioned near the front opening of the vessel 310 to measure conditions (e.g., environmental conditions and / or responses) at the junction of the vessel 310 with the outside environment. In at least another exemplary embodiment, the sensors 340 may be evenly distributed throughout the sidewall of the vessel 310, or may be positioned in any other suitable or desired location.

[0044] In at least one exemplary embodiment, each wafer in a stack of wafers may have a similar set of sensors on the wafer (e.g., one on the center board with the first controller 320 and four on the edge, i.e., five sensors 340), with each sensor on a given wafer corresponding to a first controller 320. However, the embodiments described and enumerated herein are not so limited in quantity, and the quantities are provided for illustrative purposes only.

[0045] In at least one exemplary embodiment, the first controller 320 may include a power source (e.g., a battery or any other suitable power source), a communication module (e.g., a Bluetooth or any other suitable wired or wireless communication module), and a memory. The memory may be configured to store the detected environmental conditions (e.g., %RH data) obtained from the sensor 340. The communication module may communicate the detected real-time %RH data to the communication module of the second controller 350 in real-time.

[0046] In at least one exemplary embodiment, the second controller 350 may include a power source (e.g., a battery or any other suitable power source), a communication module (e.g., a Bluetooth or any other suitable wired or wireless communication module), and a memory. The memory may be configured to store the detected real-time environmental conditions (e.g., %RH data) obtained from the first controller 320. The second controller 350 may also include a display device (e.g., an LCD or any other suitable monitor) to display the obtained %RH data. In at least one exemplary embodiment, the %RH data may be displayed for the leading edge, trailing edge, left edge, and right edge of each of the 25 wafers.

[0047] The first controller 320 and the second controller 350 allow real-time environmental conditions (e.g., %RH data) inside the vessel 310 to be remotely analyzed by the second controller 350. The first controller 320 may be disposed inside the sealed vessel 310 and wirelessly communicate the real-time %RH data to the second controller 350 disposed outside the vessel 310. Advantageously, the real-time %RH data may be measured throughout the vessel 310 during purge testing and adjustments may be made to one or more of the vessel 310 geometry, purge design, or EFEM configuration. Adjustments to the purge design may include changing the inlet / outlet purge port configuration, purge gas flow rate, etc. Such adjustments may be implemented to fine-tune and optimize the purge process in real time.

[0048] The environmental conditions (e.g., %RH data, oxygen levels, temperature, measured presence of airborne molecular contaminants, and / or measured presence of one or more volatile organic compounds) inside the vessel may be measured at multiple locations within the vessel 310, for example, every wafer slot and between slots (e.g., 25 slots), and may be remotely monitored when a sensor 340 is hard mounted, for example, to each silicon wafer or substrate located in each of the wafer slots (e.g., 25 slots). Sensors may also be placed on an interior wall or door (e.g., inside) of the vessel 310 so that the environmental conditions (e.g., %RH data) may be measured at desired locations.

[0049] The second controller 350 may communicate with a sensor outside the vessel 310 that measures the ambient environmental conditions (e.g., %RH). The first controller 320 and / or the second controller 350 may communicate directly with a device 360 ​​(e.g., a laptop or any other suitable device), either wired or wirelessly. The second controller may be directly connected to the device 360, for example, by USB.

[0050] In the exemplary embodiment of FIG. 6, the vessel 310 is docked to a load port 370 and attached to an EFEM 380 .

[0051] During operation, the second controller 350 may control the flow of a purge working fluid (e.g., gas, etc.) into the interior space of the vessel 310 via the inlet purge port and the discharge of the purge working fluid from the interior space via the outlet purge port to modify a purge flow parameter (e.g., gas flow rate, etc.) of the purge working fluid over a predetermined period of time. The second controller may be further configured to determine an optimized purge flow parameter (e.g., gas flow rate, etc.) based on the modified purge flow parameter inside the vessel 310 and at least one detected environmental condition (e.g., %RH, pressure, temperature, etc.) during the predetermined period of time.

[0052] FIG. 7 illustrates an operational flow 400 for optimizing purge flow parameters in a vessel in accordance with at least one example embodiment.

[0053] Although operational flow 400 is illustrated as separate blocks that may include one or more operations, acts, or functions as illustrated by one or more of blocks 410, 420, 430, 440, 450, and 460, various blocks may be divided into additional blocks, combined into fewer blocks, or eliminated depending on the desired implementation. As a non-limiting example, a description of method 400 performed by one or more of the devices or components illustrated in system 300 corresponding to its depiction in FIG. 7 according to one or more exemplary embodiments described herein relates to optimizing purge flow parameters in a vessel. Process flow 400 may begin at block 410.

[0054] Block 410 may refer to the controller 350 causing a purge working fluid to flow into the interior of a container, which may be a wafer container or a reticle container (e.g., a FOUP), through an inlet purge port of the container. The purge working fluid may include one or more of nitrogen, clean dry air (CDA), extra clean dry air (xCDA), a gas for conditioning the container environment, or any other suitable fluid. Block 410 may be followed by block 420.

[0055] Block 420 may refer to the controller 350 causing the purge working fluid to be evacuated from the interior of the vessel through an outlet purge port of the vessel. Block 420 may be followed by block 430.

[0056] Block 430 may refer to the controller 350 varying purge flow parameters of the purge working fluid over a predetermined period of time. In at least one exemplary embodiment, the purge flow parameters include flow rates of the purge working fluid (e.g., at each inlet / outlet purge port or diffuser). In at least one exemplary embodiment, the purge flow parameters may be varied by changing the geometry of the vessel shell and / or door of the vessel, by changing the configuration and / or geometry of the inlet and / or outlet purge ports, and / or by changing the geometry of the diffuser, etc.

[0057] In at least one exemplary embodiment, changing the purge flow parameter includes changing the purge flow parameter from a first predetermined configuration to a second predetermined configuration, e.g., from a low flow rate to a high flow rate, or vice versa. The purge flow parameter (e.g., gas flow rate) may be changed from the first predetermined configuration to the second predetermined configuration discretely (e.g., changing the purge flow parameter every predetermined period, such as every two minutes), or continuously (e.g., gradually changing the purge flow parameter from a first value to a second value during or within a determined period of time). Block 430 may be followed by block 440.

[0058] Block 440 may refer to one or more of the sensors 340 detecting at least one environmental condition within the interior of the container during a predetermined period of time. The at least one environmental condition may include one or more of relative humidity (%RH), pressure (e.g., absolute pressure), oxygen level, temperature, a measured presence of airborne molecular contaminants, a measured presence of one or more volatile organic compounds, etc. The at least one environmental condition may be communicated by the controller 320 from the one or more sensors 340 to the controller 350. Block 440 may be followed by block 450.

[0059] Block 450 may refer to the controller 350 determining optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition for a predetermined period of time.

[0060] In at least one exemplary embodiment, the optimized purge flow parameters (e.g., gas flow rate) may be obtained or determined, for example, by achieving a desired (predetermined or optimal) environmental response (e.g., inside the vessel). The desired environmental response may include adjusting one or more of the relative humidity (%RH), oxygen level, temperature, measured presence of airborne molecular contaminants, and / or measured presence of one or more volatile organic compounds inside the vessel to respective predetermined threshold levels. The desired environmental response may also include generating a desired pressure (e.g., absolute pressure) inside the vessel. The environmental response may be detected or measured by a sensor inside the vessel, and the detected data may be communicated to a controller outside the vessel.

[0061] During a predetermined period (time for purge testing), the vessel door is open during a predetermined period, the vessel door is closed during a predetermined period, changing the number of substrates (e.g., wafers) inside the vessel during a predetermined period, changing the substrate slot (e.g., position) inside the vessel during a predetermined period, opening the vessel door during a predetermined period when the vessel door is closed, closing the vessel door during a predetermined period when the vessel door is open, changing the EFEM configuration (e.g., flow effects from the EFEM geometry, and flow parameters of the EFEM) during a predetermined period, changing the position of the container (e.g., left or right or center) relative to the automation or database during a predetermined period (e.g., the EFEM is 3 A variety of operational scenarios may occur, including: removing a substrate from the interior of the vessel during a predetermined period of time; placing a substrate inside the vessel during a predetermined period of time; changing the condition of the substrate inside the vessel during a predetermined period of time (e.g., moisture, contamination, etc.); changing the purge inlet and outlet port configurations for the vessel during a predetermined period of time (e.g., changing from 3 in / 1 out to 2 in / 2 out or vice versa, or changing an n+1 configuration (n in / 1 out (n is 4 or more)) or vice versa). A controller (e.g., 350 of FIG. 6 or any other suitable controller) analyzes the environmental responses and determines optimized purge flow parameters (e.g., gas flow rates) for each applicable operational scenario. In one embodiment, the controller's analysis of the environmental responses and determination of optimized purge flow parameters for each applicable operating scenario may be accomplished through design of experiments (DOE), trained neural networks, modeling, etc.

[0062] Purge efficiency, purge performance, and / or purge flow parameters may be subject to variation due to various operational scenarios. Under each operational scenario to achieve a desired environmental response, the corresponding optimized purge flow parameters may be stored as a corresponding individualized purge "recipe" that may be utilized to optimize the desired environmental response during the purge process when the corresponding operational scenario occurs. In at least one exemplary embodiment, if optimization is performed for a container, the controller may act in real time (e.g., purge the container using a recipe corresponding to such container). Block 450 may be followed by block 460.

[0063] Block 460 may refer to the controller 350 adjusting the inflow and outflow according to the optimized purge flow parameters. For example, the controller 350 may provide an optimal purge "recipe" or control to the loadport.

[0064] The optimized purge efficiency, purge performance, or one or more of the purge flow parameters may minimize the purge gas (e.g., nitrogen) to adequately protect the contents of the substrate container. In at least one exemplary embodiment, the adjustment in block 460 may be performed when the purge process operation is started (i.e., after purge test, determine the "recipe"). The controller 350 may select the correct (best or corresponding) purge "recipe" for a given scenario and adjust the purge flow rate accordingly to achieve the desired environmental response. Thus, the purge efficiency and purge performance may be optimized for each scenario, thereby improving the yield and minimizing the consumption of gas (e.g., nitrogen).

[0065] FIG. 8 is a flow diagram of a method 500 for optimizing a sensor response (eg, sensed data or parameter) in a vessel according to at least one example embodiment.

[0066] The process flow 500 may include one or more operations, acts, or functions illustrated by one or more blocks 510, 520, 530, 540, and 550. Although illustrated as separate blocks, various blocks may be divided into additional blocks, combined into fewer blocks, or eliminated, depending on the desired implementation. As a non-limiting example, a description of a method 500 performed by one or more of the devices or components illustrated in system 300, corresponding to its depiction in FIG. 8, according to one or more exemplary embodiments described herein, relates to optimizing a sensor response in a vessel. The process flow 500 may begin at block 510.

[0067] Block 510 may refer to one or more sensors 340 detecting at least one environmental condition within the interior of the container. The at least one environmental condition may include one or more of relative humidity (%RH), pressure (e.g., absolute pressure), oxygen level, temperature, a measured presence of airborne molecular contaminants, a measured presence of one or more volatile organic compounds, etc. Block 510 may be followed by block 520.

[0068] Block 520 may refer to a controller (e.g., 320, or 350 via 320) obtaining at least one detected / sensed environmental condition from one or more sensors 340. Block 520 may be followed by block 530.

[0069] Block 530 may refer to the controller determining whether at least one detected / sensed environmental condition matches / is a desired (predetermined or optimal) environmental condition. If true, block 530 may be followed by block 550. If false, block 530 may be followed by block 540.

[0070] Block 550 may indicate that the automation (including the controller) continues with its predetermined operation.

[0071] Block 540 may refer to the controller adjusting or modifying a purge flow parameter (e.g., gas flow rate) based on at least one detected / sensed environmental condition (see block 430). Block 540 may be followed by block 510.

[0072] FIG. 9 is a flow diagram of a method 600 of operating an optimized purge process in a vessel according to at least one example embodiment.

[0073] Process flow 600 may include one or more operations, acts, or functions illustrated by one or more blocks 610, 620, 630, 640, 650, and 660. Although illustrated as separate blocks, various blocks may be divided into additional blocks, combined into fewer blocks, or eliminated, depending on the desired implementation. As a non-limiting example, a description of method 600 performed by one or more of the devices or components illustrated in system 300, corresponding to its depiction in FIG. 9, according to one or more exemplary embodiments described herein, relates to operating an optimized purge process in a vessel. Process flow 600 may begin at block 610.

[0074] Block 610 may refer to the automated system transporting the container from a first location to a second location. Block 610 may be followed by block 620.

[0075] Block 620 (see blocks 510 and 520) may refer to the controller (e.g., 320, or 350 via 320) obtaining at least one detected / sensed environmental condition during transport from one or more sensors 340. Block 620 may be followed by block 630.

[0076] Block 630 may refer to the automated system placing the container in a second location (e.g., a port of use). Block 630 may be followed by block 640.

[0077] Block 640 may refer to the controller (e.g., 320, or 350 through 320) analyzing one or more of the detected or sensed at least one environmental condition (e.g., determining whether there is an optimized recipe corresponding to the detected or sensed at least one environmental condition, see block 450). Block 640 may be followed by block 650.

[0078] Block 650 may refer to the controller determining an optimized recipe corresponding to the detected / sensed at least one environmental condition (see block 450) if the at least one environmental condition is present. Block 650 may be followed by block 660.

[0079] Block 660 may refer to the controller controlling the purge process of the vessel with an optimized recipe, if there is a recipe from block 650, or configuring the vessel to obtain an optimized recipe for at least one detected / sensed environmental condition (see blocks 410-450).

[0080] Aspects: Any of the embodiments 1 to 26 may be combined with any of the embodiments 27 to 30, and any one of the embodiments 1 to 30 may be combined with any one of the embodiments 31 to 37.

[0081] Aspect 1. A method for optimizing purge flow parameters for a front opening integrated pod (FOUP), comprising: flowing a purge working fluid into an interior of the FOUP; Discharging a purge working fluid from within the FOUP; Varying purge flow parameters of a purge working fluid for a predetermined period of time; Detecting at least one environmental condition within an interior of the FOUP during a predetermined period of time; determining optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition during a predetermined period of time; Adjusting the inflow and outflow according to the optimized purge flow parameters; The method includes:

[0082] Example 2. The method of example 1, further comprising communicating the at least one environmental condition to an automated device.

[0083]

[0023] Example 3. The method of example 1 or example 2, wherein the purge working fluid comprises one or more of nitrogen, clean dry air, extra clean dry air, and a gas for conditioning the container environment.

[0084] Aspect 4. The method of any one of aspects 1 to 3, wherein the at least one environmental condition comprises one or more of relative humidity, pressure, oxygen level, temperature, and the measured presence of airborne molecular contaminants or one or more volatile organic compounds.

[0085] Embodiment 5. The method of any one of embodiments 1 to 4, wherein the altering comprises altering a purge flow parameter from a first predetermined configuration to a second predetermined configuration.

[0086] Aspect 6. The method of any one of aspects 1 to 5, wherein optimized purge flow parameters are determined to adjust one or more of the relative humidity, oxygen level, temperature, and measured presence of airborne molecular contaminants or one or more volatile organic compounds within the interior of the FOUP to respective predetermined threshold levels.

[0087]

[0023] Example 7. The method of any one of Examples 1 to 6, wherein optimized purge flow parameters are determined to produce a desired pressure within the interior of the FOUP.

[0088]

[0023] Aspect 8. The method of any one of aspects 1 to 7, wherein a door to the interior of the FOUP is open during a predetermined period of time.

[0089]

[0023] Aspect 9. The method of any one of aspects 1 to 7, wherein a door to the interior of the FOUP is closed for a predetermined period of time.

[0090]

[0023] Example 10. The method of any one of examples 1 to 9, further comprising varying the number of substrates within the FOUP during a given period of time.

[0091] Example 11. The method of any one of Examples 1 to 10, further comprising changing a slot of a substrate within the interior of the FOUP during a predetermined period of time.

[0092]

[0023] Aspect 12. The method of any one of aspects 1 to 11, further comprising, when a door to the interior of the FOUP is closed, opening the door within a predetermined period of time.

[0093]

[0023] Aspect 13. The method of any one of aspects 1 to 11, further comprising, when a door to the interior of the FOUP is open, closing the door within a predetermined period of time.

[0094] Example 14. The method of any one of Examples 1 to 13, further comprising changing a configuration of the device front-end module during a predetermined period of time.

[0095]

[0023] Example 15. The method of any one of examples 1 to 14, further comprising changing a position of the FOUP relative to the automated equipment during a predetermined period of time.

[0096]

[0036] Example 16. The method of any one of examples 1 to 15, further comprising removing the substrate from the interior of the FOUP during a predetermined period of time.

[0097]

[0036] Example 17. The method of any one of examples 1 to 16, further comprising placing the substrate within an interior of the FOUP for a predetermined period of time.

[0098] Example 18. The method of any one of examples 1 to 17, further comprising altering a state of the substrate within the interior of the FOUP during a predetermined period of time.

[0099]

[0031] Example 19. The method of any one of examples 1 to 18, further comprising varying a purge inlet port configuration and a purge outlet port configuration of the FOUP during a predetermined period of time.

[0100]

[0031] Embodiment 20. The method of any one of embodiments 1 to 19, wherein the purge flow parameter comprises a flow rate.

[0101]

[0031] Example 21. The method of any one of examples 1 to 20, wherein the sensor is configured to detect at least one environmental condition.

[0102]

[0031] Aspect 22. The method of aspect 21, wherein the sensor is integral with an interior wall of the FOUP.

[0103]

[0026] Aspect 23. The method of aspect 21, wherein the sensor is integral with the door of the FOUP.

[0104]

[0031] Example 24. The method of example 21, wherein the sensor is attached to a wall of the FOUP.

[0105]

[0023] Example 25. The method of example 21, wherein the sensor is attached to a door of the FOUP or located within or adjacent to the purge module.

[0106]

[0036] Example 26. The method of example 21, wherein the sensor is disposed on a wafer disposed within the FOUP.

[0107] A front opening integrated pod (FOUP) or a pod having an interior space; A substrate to be inserted into the internal space; a first processing device disposed in the interior space; a sensor coupled to the first processing device and disposed in the interior space, the sensor configured to detect at least one environmental condition in the interior space; A system comprising:

[0108] Aspect 28. The system of aspect 27, wherein the sensor is disposed on an interior wall of the FOUP or pod or on a door of the FOUP or pod, the sensor being integral with or attached to the interior wall or door.

[0109]

[0071] Aspect 29. The system of aspect 27, wherein the sensor is disposed on a wafer disposed in the FOUP or pod.

[0110]

[0036] A second processing device disposed outside the interior space, comprising: a second processing device; flowing a purge working fluid into the interior space; Discharging the purging working fluid from the interior space; Varying purge flow parameters of the purge working fluid over a period of time; a second processing device configured to control the the first processing device is configured to communicate at least one environmental condition to the second processing device; 30. The system of any one of aspects 27 to 29, wherein the second processing device is configured to determine optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition during a predetermined period of time.

[0111] A method of optimizing purge flow parameters in a vessel, comprising: Flowing a purge working fluid into an interior of a container; Discharging the purge working fluid from the interior of the container; Varying purge flow parameters of a purge working fluid for a predetermined period of time; Detecting at least one environmental condition within the container during a predetermined period of time; determining optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition during a predetermined period of time; Adjusting the inflow and outflow according to the optimized purge flow parameters; The method includes:

[0112] A method of generating a purge recipe, comprising: Flowing a purge working fluid into an interior of a container; Discharging the purge working fluid from the interior of the container; Varying purge flow parameters of a purge working fluid for a predetermined period of time; Detecting at least one environmental condition within the container during a predetermined period of time; determining optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition during a predetermined period of time; generating a purge recipe based on the optimized purge flow parameters; The method includes:

[0113] A method of optimizing a sensor response in a container, comprising: (a) sensing at least one environmental condition within an interior of a container; When at least one environmental condition does not match the optimized environmental condition, modifying a purge flow parameter of the purge working fluid, and proceeding to (a); The method includes:

[0114] A method for determining a purge recipe, comprising: Flowing a purge working fluid into an interior of a container; Discharging the purge working fluid from the interior of the container; Varying purge flow parameters of a purge working fluid for a predetermined period of time; Detecting at least one environmental condition within the container during a predetermined period of time; determining optimized purge flow parameters based on the altered purge flow parameters and the at least one detected environmental condition during a predetermined period of time; determining a purge recipe based on the optimized purge flow parameters; The method includes:

[0115] Aspect 35. A method including altering a purge flow parameter of a purge working fluid within an interior of a front-opening integrated pod by sensing at least one environmental condition within the interior of the front-opening integrated pod in real time.

[0116] Aspect 36. A method comprising altering in real time a purge flow parameter of a purge working fluid within an interior of a front-opening integrated pod by sensing at least one environmental condition within the interior of the front-opening integrated pod.

[0117] Aspect 37. A method comprising altering in real time a purge flow parameter of a purge working fluid within a front-opening integrated pod by sensing in real time at least one environmental condition within the front-opening integrated pod.

[0118] The examples disclosed in this application should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the appended claims, rather than the above description, and all modifications that come within the meaning and scope of the claims are intended to be embraced therein.

[0119] The terms used herein are intended to describe particular embodiments and are not intended to be limiting. The terms "a," "an," and "the" include the plural unless otherwise specified. The terms "comprises" and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components.

[0120] With regard to the foregoing description, it should be understood that changes may be made in details, particularly in matters of materials of construction used and shape, size and arrangement of parts without departing from the scope of the present disclosure. The specification and described embodiments are exemplary only, the true scope and spirit of the present disclosure being indicated in the following claims.

Claims

1. flowing a purge working fluid into an interior of a substrate container; discharging the purge working fluid from the interior of the substrate container; Varying a purge flow parameter of the purge working fluid for a predetermined period of time; sensing at least one environmental condition within the interior of the substrate container during the predetermined period of time; determining optimized purge flow parameters based on the modified purge flow parameters and the at least one detected environmental condition during the predetermined time period; adjusting said inflow and said outflow according to said optimized purge flow parameters; optimizing the purge flow parameters in the substrate container by

2. Communicating said at least one environmental condition to an automated device or a database. The method of claim 1 further comprising:

3. the purge working fluid comprises one or more of nitrogen, clean dry air, extra clean dry air, and a gas for conditioning the container environment; 10. The method of claim 1, wherein the at least one environmental condition comprises one or more of relative humidity, pressure, oxygen level, temperature, and a measured presence of airborne molecular contaminants or one or more volatile organic compounds.

4. 2. The method of claim 1, wherein the optimized purge flow parameters are determined to adjust one or more of the relative humidity, oxygen level, temperature, and a measured presence of airborne molecular contaminants or one or more volatile organic compounds within the interior of the substrate container to respective predetermined threshold levels.

5. Varying either the number of substrates within the substrate container or the substrate slots within the substrate container during the predetermined period of time. The method of claim 1 further comprising:

6. the substrate container is a front-opening integrated pod or a reticle pod; The method of claim 1.

7. Changing the configuration of the device front-end module during the predetermined period. The method of claim 1 further comprising:

8. Changing the position of the substrate container relative to automated equipment during the predetermined period. The method of claim 1 further comprising:

9. Changing a state of the substrate within the substrate container during the predetermined period of time. The method of claim 1 further comprising:

10. Varying a purge inlet port configuration and a purge outlet port configuration of the substrate container during the predetermined period of time. The method of claim 1 further comprising:

11. 10. The method of claim 1, wherein a sensor is configured to detect the at least one environmental condition, the sensor being mounted on an inner wall of the substrate container, or on a door of the FOUP, or located within or adjacent to a purge module.

12. a first controller disposed in an internal space of a front-opening integrated pod or pod, the first controller having a substrate inserted into the internal space of the front-opening integrated pod or pod; a sensor communicatively coupled to the first controller within the interior space, the sensor configured to detect at least one environmental condition within the interior space; and A system comprising:

13. a second controller external to the interior space, The second controller: flowing a purge working fluid into the interior space; Discharging the purge working fluid from the interior space; Varying purge flow parameters of the purge working fluid over a predetermined period of time; A second controller configured to control Further comprising: the first controller is configured to communicate the at least one environmental condition to the second controller; the second controller is configured to determine optimized purge flow parameters based on the modified purge flow parameters and the at least one detected environmental condition during the predetermined time period. The system of claim 12.

14. A method comprising altering a purge flow parameter of a purge actuation fluid within a front-opening integrated pod by sensing at least one environmental condition within the front-opening integrated pod in real time.

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