Thermoelectric Module

Abstract

To provide a sealing structure of a thermoelectric module.SOLUTION: A thermoelectric module 500 includes a first metal support 510, a first heat conductive layer 520 which is arranged on the first metal support and is composed of a resin composition containing an epoxy resin and an inorganic filler, a second heat conductive layer 530 which is arranged on the first heat conductive layer and is composed of a resin composition containing a silicon resin and an inorganic filler, a plurality of first electrodes 540 arranged on the second heat conductive layer, a plurality of P type thermoelectric legs and a plurality of N type thermoelectric legs which are alternately arranged on the plurality of first electrodes, a plurality of second electrodes arranged on the plurality of P type thermoelectric legs and the plurality of N type thermoelectric legs, a third heat conductive layer which is arranged on the plurality of second electrodes and is composed of the same resin composition as the resin composition constituting the first heat conductive layer, and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged so as to surround the upper surface of the first heat conductive layer and the side face of the first heat conductive layer.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a thermoelectric module, and more particularly to a substrate and electrode structure of a thermoelectric element. . [Background technology]

[0002] Thermoelectric phenomena occur due to the movement of electrons and holes inside a material. It is a phenomenon that occurs when heat and electricity are directly converted into each other.

[0003] Thermoelectric elements are a general term for elements that utilize the thermoelectric phenomenon, and are made by connecting P-type and N-type thermoelectric materials with metal electrodes. The structure has a PN junction pair formed by bonding between them.

[0004] Thermoelectric elements are elements that utilize the temperature change of electrical resistance, a phenomenon in which an electromotive force is generated due to a temperature difference. The Seebeck effect is a phenomenon in which heat is absorbed or generated by electric current. They can be classified into elements that utilize the Peltier effect, etc.

[0005] Thermoelectric elements are widely used in home appliances, electronic components, communication components, etc. The thermoelectric element can be applied to cooling devices, heating devices, power generation devices, etc. There are increasing demands on the thermoelectric performance of semiconductors.

[0006] The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, and has a plurality of thermoelectric legs between an upper substrate and a lower substrate. The thermoelectric legs are arranged in the form of an array, and a plurality of upper electrodes are disposed between the plurality of thermoelectric legs and the upper substrate. and a plurality of bottom electrodes are disposed between the plurality of thermoelectric legs and the bottom substrate. Several upper electrodes and a number of lower electrodes connect the thermoelectric legs in series or in parallel.

[0007] Generally, the upper and lower substrates are made of aluminum oxide (Al 2 O 3 ) substrate. Due to the problem of flatness, aluminum oxide (Al 2 O 3 ) The substrate must maintain a certain level of thickness. This increases the overall thickness of the thermoelectric element.

[0008] Meanwhile, when the thermoelectric module is used for cooling, it can be applied to refrigerators or water purifiers. However, there is a problem that the thermoelectric element corrodes due to condensation and moisture caused by low temperature implementation. In order to solve this problem, conventionally, a sealant was placed directly on the side of the thermoelectric element to prevent moisture. However, the sealant was directly attached to the thermoelectric element, so There is a problem that the thermal and hydraulic performance is reduced. Summary of the Invention [Problem to be solved by the invention]

[0009] The technical problem to be solved by the present invention is to provide a substrate and electrode structure for a thermoelectric element. It is.

[0010] Another technical object of the present invention is to provide a sealed structure for a thermoelectric module. It is. [Means for solving the problem]

[0011] The thermoelectric module according to an embodiment of the present invention includes a first metal support, a metal plate disposed on the first metal support, and a a first thermally conductive layer made of a resin composition containing an epoxy resin and an inorganic filler; A first heat conductive layer is disposed on the first heat conductive layer, and the first heat conductive layer is made of a resin composition containing a silicone resin and an inorganic filler. a second thermally conductive layer, a plurality of first electrodes disposed on the second thermally conductive layer, and a A plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs arranged alternately, a plurality of second electrodes disposed on the N-type thermoelectric legs and the plurality of N-type thermoelectric legs; A third thermal conductive layer is disposed on the upper surface of the first thermal conductive layer and is made of the same resin composition as the resin composition constituting the first thermal conductive layer. a second metal support disposed on the third thermally conductive layer, the second thermally conductive layer being A layer is disposed on a top surface of the first thermally conductive layer and surrounding a side surface of the first thermally conductive layer.

[0012] The width of the first metal support is greater than the width of the first thermally conductive layer, and the second thermally conductive layer is A metal support may be disposed on at least a portion of a side surface of the first thermally conductive layer and a top surface of the first metal support. do.

[0013] A resin composition that is disposed between the plurality of second electrodes and the third thermally conductive layer and forms the second thermally conductive layer. The fourth thermally conductive layer is made of the same resin composition as the composition of the fourth thermally conductive layer. The insulating layer 3 may be disposed so as to surround an upper surface of the third thermally conductive layer and a side surface of the third thermally conductive layer.

[0014] The width of the second thermally conductive layer may be 1.01 to 1.2 times the width of the first thermally conductive layer.

[0015] The second thermally conductive layer can bond the first thermally conductive layer and the first electrodes. .

[0016] The second thermally conductive layer may further bond the first thermally conductive layer to the first metal support. can.

[0017] At least a portion of the side surfaces of the first electrodes may be embedded in the second thermally conductive layer.

[0018] The second thermal conductive layer is filled with 0.1 to 0.9 times the thickness of the side surfaces of the first electrodes. It is possible.

[0019] The inorganic filler contained in the resin composition forming the first thermal conductive layer is aluminum oxide, aluminum nitride, or the like. It may include at least one of aluminum and boron nitride.

[0020] The boron nitride may be boron nitride agglomerates in which plate-like boron nitride particles are solidified.

[0021] The silicone resin contained in the resin composition forming the second thermal conductive layer is PDMS (polydimethylsilane). methylsiloxane), which is contained in the resin composition forming the second thermally conductive layer. The inorganic filler may be aluminum oxide.

[0022] A thermoelectric module according to another embodiment of the present invention includes a first thermally conductive plate; a thermoelectric element disposed on the base; a second thermally conductive plate disposed on the thermoelectric element; and a heat conductive plate disposed between the first heat conductive plate and the second heat conductive plate and surrounding the thermoelectric element; a sealing portion; and the thermoelectric element includes a first substrate; a plurality of thermoelectric labels disposed on the first substrate. a second substrate disposed on the plurality of thermoelectric legs; a plurality of first electrodes disposed between the second substrate and the plurality of thermoelectric legs; an electrode including a plurality of second electrodes; and an output line electrically connected to the electrode; The sealing part includes a body having a hole in the center to accommodate the thermoelectric element; Between the lower surface of the body and the first thermal conductive plate and between the upper surface of the body and the second thermal conductive plate and a sealing member disposed between each of the ports.

[0023] The body has a first groove formed at a predetermined depth on the bottom surface and along the periphery of the hole. and a second groove formed on the top surface to a predetermined depth and along the periphery of the hole. It can include.

[0024] The sealing member includes a first sealing member inserted into a first groove of the body; and a second groove of the body. a second sealing member inserted into the

[0025] a third sealing member disposed on the underside of the body between the first groove and the hole; and a fourth sealing member disposed on the underside of the body between the first groove and an outer corner of the body. This can be done.

[0026] The third seal member and the fourth seal member may be of a closed configuration.

[0027] a fifth sealing member disposed on an upper surface of the body between the second groove and the hole; and a sixth sealing member disposed on the upper surface of the body between the second groove and an outer corner of the body. This can be done.

[0028] The fifth seal and the sixth seal may be of closed configuration.

[0029] The first substrate is disposed on the first thermally conductive plate, and is coated with an epoxy resin and an inorganic filler. a first thermally conductive layer made of a resin composition containing a silicone resin; The thermal conductive layer may include a second thermally conductive layer made of a resin composition including an inorganic resin and an inorganic filler.

[0030] The body may include through holes through which the first and second output wires pass. Cut.

[0031] The height of the body may be 3 to 5 times the depth of the first groove.

[0032] The shortest distance between the first groove and the second groove may be 1 to 3 times the depth of the first groove.

[0033] The depth of the first groove is smaller than the shortest distance from the bottom surface of the body to the through hole. This is also fine.

[0034] The body is made of expanded polystyrene (EPS). It could be.

[0035] The first heat conductive plate, the body and the second heat conductive plate are each The first heat transfer member is inserted into the fastening holes. and a fastening member for fastening the body and the second thermally conductive plate. This can be done. Effect of the Invention

[0036] According to the embodiment of the present invention, a thermoelectric element having excellent thermal conductivity and high reliability can be obtained. In particular, the thermoelectric element according to the embodiment of the present invention can be realized with a small thickness and can also be used at a high temperature. High resistance to temperature changes minimizes damage or peeling caused by temperature changes It is possible.

[0037] According to another embodiment of the present invention, a thermoelectric module having excellent waterproof and dustproof properties can be obtained. can be done. [Brief description of the drawings]

[0038] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3]FIG. 2 is a cross-sectional view of a thermoelectric module on the lower substrate side. [Figure 4] 13 is another example of a cross-sectional view of the lower substrate side of the thermoelectric module. [Diagram 5] FIG. 2 is a cross-sectional view of a lower substrate side of a thermoelectric module according to an embodiment of the present invention. [Figure 6] FIG. 11 is a cross-sectional view of a lower substrate side of a thermoelectric module according to another embodiment of the present invention. [Figure 7] FIG. 11 is a cross-sectional view of a lower substrate side of a thermoelectric module according to still another embodiment of the present invention. [Figure 8] FIG. 13 is a cross-sectional view of a lower substrate side of a thermoelectric module according to still another embodiment of the present invention. [Figure 9] FIG. 11 is a cross-sectional view of a lower substrate side of a thermoelectric module according to still another embodiment of the present invention. [Figure 10] FIG. 4 is a cross-sectional view of a thermoelectric module according to another embodiment of the present invention. [Figure 11] FIG. 11 is a top view of the seal of FIG. [Figure 12] FIG. 11 is a perspective view of the fuselage of FIG. [Figure 13] FIG. 11 is a cross-sectional view of a thermoelectric module according to still another embodiment of the present invention. [Figure 14] FIG. 13 is a top view of a sealing portion of a thermoelectric module according to yet another embodiment of the present invention. [Figure 15] 1 is a diagram illustrating a thermoelectric element according to an embodiment of the present invention applied to a water purifier; [Figure 16] 1 is a diagram illustrating an example in which a thermoelectric device according to an embodiment of the present invention is applied to a refrigerator; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0039] The present invention can be modified in various ways and can have various embodiments. Specific examples are illustrated and described in the drawings. However, this does not imply that the invention should be limited to specific embodiments. The present invention is not intended to be limited to the above, and all modifications within the spirit and scope of the present invention are intended to be included. , equivalents or alternatives.

[0040] Although ordinal terms such as second, first, etc. may be used to describe various components, The components are not limited by the terms. The terms do not limit one component to another. For example, the second structure may be used without departing from the scope of the present invention. A component may be named a first component, and a first component may be named a second component. The term and / or refers to a combination of several associated listed items or to several Includes any of the related listed items.

[0041] An element is referred to as being "coupled" or "connected" to another element. In some cases, the components may be directly connected or connected to other components. It should be understood that there may be other components in between. When an element is said to be "directly connected" or "directly connected" to another element It should be understood that there are no other components in between.

[0042] The terms used in this application are merely used to describe specific embodiments and are not intended to be limiting of the present invention. The singular expression is not intended to limit the scope of the invention unless the context clearly indicates otherwise. In this application, terms such as "including" or "having" are used as described in the specification. There are features, numbers, steps, operations, components, parts or combinations thereof It is intended to specify that one or more other features, numbers, steps, The possibility of the presence or addition of any action, component, part, or combination thereof It should be understood that this is not a priori exclusion.

[0043] Unless otherwise defined, all terms used herein, including technical or scientific terms, The term is commonly understood by those having ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries have the same meaning as those in The term "common" should be construed to have a meaning consistent with the meaning it has in the context of the relevant art and is not intended to be limiting unless otherwise specified in this application. Unless defined as white, it is not to be interpreted in an idealized or overly formal sense.

[0044] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and redundant description thereof will be omitted. do.

[0045] FIG. 1 is a cross-sectional view of a thermoelectric element, and FIG. 2 is a perspective view of the thermoelectric element.

[0046] 1 and 2, a thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermocouple 130, and a P-type thermocouple 140. It includes an N-type thermoelectric leg 130 , an N-type thermoelectric leg 140 , an upper electrode 150 and an upper substrate 160 .

[0047] The lower electrode 120 is connected to the lower substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. The upper electrode 150 is disposed between the upper substrate 160 and the P-type thermoelectric leg 130 and the N 140. Thus, the plurality of P-type thermoelectric legs 130 and The N-type thermoelectric legs 140 are electrically connected to the lower electrode 120 and the upper electrode 150. A pair of electrodes are disposed between the lower electrode 120 and the upper electrode 150 and are electrically connected to each other. The P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can form a unit cell. .

[0048] For example, a voltage is applied to the lower electrode 120 and the upper electrode 150 through the lead wires 181 and 182. When a voltage is applied, the P-type thermoelectric leg 130 is heated by the Peltier effect to the N-type thermoelectric leg 140. The substrate through which the current flows absorbs heat and acts as a cooling element, and the N-type thermoelectric leg 140 is connected to the P-type The substrate with current passing through the thermoelectric legs 130 can heat up and act as a heating element.

[0049] Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are made of bismuth (Bi) and The thermoelectric leg is a bismuth telluride (Bi-Te)-based thermoelectric leg containing bismuth tellurium (Te) as the main raw material. The P-type thermoelectric leg 130 is made of antimony (Sb), nickel, and tantalum (Nb) in a ratio of 100 wt% of the total weight. Ni, aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron ( B), Gallium (Ga), Tellurium (Te), Bismuth (Bi) and Indium (In) Bismuth telluride (Bi-Te)-based main raw material containing at least one of the following: .999wt% and a mixture containing 0.001-1wt% Bi or Te in the thermoelectric leg. For example, if the main raw material is Bi-Se-Te, and Bi or Te is added to the total weight The N-type thermoelectric leg 140 may further contain 0.001 to 1 wt % of the total weight of 0wt% of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu ), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth Bismuth telluride containing at least one of bismuth (Bi) and indium (In) (Bi-Te)-based main raw material 99~99.999wt% and mixture containing Bi or Te 0 For example, the main raw material may be Bi-Sb-T e, and may further contain Bi or Te in an amount of 0.001 to 1 wt% of the total weight. .

[0050] The P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are formed in a bulk type or a laminate type. Generally, the bulk type P-type thermoelectric leg 130 or the bulk type N-type thermoelectric leg 140 is a thermal The electrical materials are heat-treated to produce ingots, which are then crushed and sieved. After obtaining powder for thermoelectric legs, the powder is sintered and the sintered body is cut. The stacked P-type thermoelectric leg 130 or the stacked N-type thermoelectric leg 140 can be obtained. A paste containing a thermoelectric material is applied onto a sheet-shaped substrate to form a unit component, and then the unit component is It is obtained through the process of stacking and cutting materials.

[0051] At this time, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 have the same shape and structure. The P-type thermoelectric elements may have different shapes and volumes. Since the electrical conduction characteristics of the N-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different from each other, 40 is formed to have a height or cross-sectional area different from that of the P-type thermoelectric leg 130 You may do so.

[0052] The performance of the thermoelectric device according to an embodiment of the present invention can be expressed by a thermoelectric figure of merit. The exponent (ZT) can be expressed as in mathematical formula 1.

[0053]

number

[0054] where α is the Seebeck coefficient [V / K], σ is the electrical conductivity [S / m], and α 2 σ is the power factor ([W / mK 2 ]) and T is is the temperature and k is the thermal conductivity [W / mK]. k is a·c p ρ, and a is the thermal diffusivity [cm 2 / S], and c p is the specific heat [J / gK] and ρ is the density [g / cm 3 ].

[0055] To obtain the thermoelectric performance index of a thermoelectric element, a Z meter is used to measure the Z value (V / K). The measured Z value can then be used to calculate the thermoelectric figure of merit (ZT).

[0056] Here, the lower substrate 110 is disposed between the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. The lower electrode 120 is connected to the upper substrate 160, and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are connected to the upper substrate 160. The upper electrode 150 disposed between the blocks 140 is made of copper (Cu), silver (Ag) and nickel (N It may include at least one of i).

[0057] The lower substrate 110 and the upper substrate 160 may be formed to have different sizes. For example, the volume, thickness or area of ​​one of the lower substrate 110 and the upper substrate 160 is smaller than that of the other. In this way, the heat absorption performance of the thermoelectric element can be improved. For example, the width of the lower substrate 110 may be equal to or larger than the width of the upper substrate 160. According to this, the lower electrode disposed at the end of the lower substrate 110 may be formed larger. This can facilitate connecting the lead wires 181, 182.

[0058] In addition, a heat dissipation pattern is formed on at least one surface of the lower substrate 110 and the upper substrate 160. For example, a concave-convex pattern may be formed. This can improve the heat dissipation performance of the thermoelectric element. When the concave-convex pattern comes into contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, When formed on a surface that is in contact with the thermoelectric legs, the bonding properties between the thermoelectric legs and the substrate may also be improved.

[0059] At this time, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be in the shape of a cylinder, a polygonal column, an ellipse, or the like. It may have a columnar shape, etc.

[0060] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a stacked structure. For example, the P-type thermoelectric leg or N-type thermoelectric leg is a sheet-shaped substrate coated with a semiconductor material. The method may be such that a plurality of structures are stacked and then cut. This prevents material loss and improves electrical conductivity.

[0061] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be a zone melting (zo It can be manufactured by the zone melting method or the powder sintering method. According to the method, an ingot is made using thermoelectric material, and then the ingot is The refinement is carried out by gradually applying heat to the granules so that the grains are realigned in a single direction. The thermoelectric legs are obtained by cooling the powder. After the ingot is manufactured, it is crushed and sieved to obtain the powder for the thermoelectric leg, which is then The thermoelectric legs are obtained through a sintering process.

[0062] FIG. 3 is an example of a cross-sectional view of the lower substrate side of a thermoelectric module, and FIG. 13 is another example of a cross-sectional view of the external substrate side. FIG.

[0063] 3-4, the thermoelectric element 100 may be disposed on a metal support 200. The lower substrate 110 of the device 100 is disposed on a metal support 200. A bottom electrode 120 may be disposed.

[0064] The structures of the P-type thermoelectric leg, N-type thermoelectric leg, upper electrode, and upper substrate are shown in Figs. 1 and 2. Therefore, the explanation of the overlapping contents will be omitted.

[0065] Referring to FIG. 3, the lower substrate 110 is made of aluminum oxide (Al 2 O 3 ) substrate At this time, due to the flatness problem of the aluminum oxide substrate, the thickness T1 of the lower substrate 110 is 0. The thickness of the lower substrate 110 cannot be less than 0.65 mm. Since the thickness of the electrode 120 must also be increased, the overall thickness of the thermoelectric element 100 is There are problems that cannot be avoided.

[0066] Referring to FIG. 4, the lower substrate 110 is made of a resin composition including an epoxy resin and an inorganic filler. In this case, the thermal conductive layer does not have a problem of flatness, so aluminum oxide is used. It is possible to fabricate the substrate with a smaller thickness T2, for example, 0.65 mm or less, compared to an aluminum substrate. In the structure shown in FIG. 4, the lower electrode 120 is made of a resin composition including an epoxy resin and an inorganic filler. A Cu substrate is placed on the thermal conductive layer and pressed, and then the Cu substrate is etched into the shape of the electrode. However, the thickness of the lower substrate 110 must be less than 0.65 mm. If the temperature is increased, the lower substrate 110 and the metal support 200 become vulnerable to temperature changes, which can cause peeling between the lower substrate 110 and the metal support 200. This causes a problem of reducing the reliability of the thermoelectric element 100. It can be mixed with a heat conducting plate.

[0067] FIG. 5 is a cross-sectional view of the lower substrate side of a thermoelectric module according to an embodiment of the present invention, and FIG. FIG. 7 is a cross-sectional view of a lower substrate side of a thermoelectric module according to another embodiment of the present invention. FIG. 8 is a cross-sectional view of a lower substrate side of a thermoelectric module according to still another embodiment of the present invention. FIG. 9 is a cross-sectional view of a lower substrate side of a thermoelectric module according to another embodiment of the present invention. 11 is a cross-sectional view of a lower substrate side of a thermoelectric module according to another embodiment. FIG.

[0068] Referring to FIG. 5, the lower substrate side of the thermoelectric module 500 according to the embodiment of the present invention is made of metal. A support 510, a first thermally conductive layer 520 disposed on the metal support 510, and a first thermally conductive layer 52 A second thermally conductive layer 530 disposed on the first thermally conductive layer 530 and a plurality of first thermally conductive layers 530 disposed on the second thermally conductive layer 530. 1-2, a pair of P-type thermoelectric legs are provided on each electrode 540. and N-type thermoelectric legs are arranged, and a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs are arranged A structure in which the upper electrode and the upper substrate are sandwiched in a symmetrical manner with the lower electrode and the lower substrate can be formed. For example, a plurality of first electrodes are provided on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. A plurality of second electrodes (not shown) symmetrical to 540, a plurality of second electrodes symmetrical to the second thermal conductive layer 530, 4 thermally conductive layer (not shown), and a third thermally conductive layer (not shown) that is symmetrical to the first thermally conductive layer 520. A first thermally conductive layer 520, a second thermally conductive layer 530, and a plurality of first Electrode 540, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes (not shown a fourth thermally conductive layer (not shown) that is symmetrical to the second thermally conductive layer 530; A third thermally conductive layer (not shown), which is the counterpart of conductive layer 520, may be included in thermoelectric device 100.

[0069] For the sake of convenience, the following description will be given below with reference to a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs. A metal support 510, a first thermally conductive layer 520, a second thermally conductive layer 530 and a plurality of second thermally conductive layers 530 are disposed. The description will focus on one electrode 540, but this same structure can be used for multiple P-type thermoelectric legs and multiple It can be symmetrically arranged on the N-type thermoelectric leg. That is, the upper substrate side is formed with the same structure. It can be done.

[0070] The metal support 510 may be made of aluminum, an aluminum alloy, copper, a copper alloy, etc. The metal support 510 includes a first thermally conductive layer 520, a second thermally conductive layer 530, and a plurality of first electrodes 540. , multiple P-type thermoelectric legs and multiple N-type thermoelectric legs, etc., This is the area where the thermoelectric element 500 according to the embodiment is directly attached to the application. For this purpose, the width of the metal support 510 may be greater than the width of the first thermally conductive layer 520. , the thickness of the metal support 510 may be greater than the thickness of the first thermally conductive layer 520 .

[0071] The first thermally conductive layer 520 is disposed on the metal support 510 and is made of an epoxy resin and an inorganic filler. The first thermal conductive layer 520 is formed of a resin composition containing the above-mentioned. m, preferably 0.01 to 0.6 mm, and more preferably 0.01 to 0.55 mm. The thermal conductivity is 10 W / mK or more, preferably 20 W / mK or more, and more preferably 30 It can be W / mK or more.

[0072] For this purpose, the epoxy resin may include an epoxy compound and a hardener. The epoxy compound may be contained in an amount of 10 to 10 by volume of the curing agent. The oxy compounds are crystalline epoxy compounds, non-crystalline epoxy compounds and silicon epoxidized compounds. The crystalline epoxy compound may include at least one of mesogens (me Mesogens can contain liquid crystal structures. It is the basic unit of the crystalline structure and contains the rigid structure. Crystalline epoxy compounds are conventional non-crystalline epoxidized compounds that have two or more epoxy groups in the molecule. For example, glycidyl esters derived from bisphenol A or bisphenol F may be used. The hardener may be an amine hardener, a phenol hardener, an acid hardener, or a tertiary ether. Anhydride-based hardeners, polymercaptan-based hardeners, polyaminoamide-based hardeners, isocyanates At least one of a carboxylic acid-based curing agent and a blocked isocyanate-based curing agent may be included. Two or more types of hardeners may be mixed and used.

[0073] The inorganic filler is aluminum oxide and a boron nitride aggregate consisting of multiple plate-shaped boron nitride particles. The inorganic filler may further include aluminum nitride. The surface of the boron nitride aggregate is coated with a polymer having the following unit 1 or boron nitride is coated with At least a portion of the voids in the uranium aggregates is filled with a polymer having the following unit 1: obtain.

[0074] Unit 1 is as follows:

[0075] [Unit 1]

[0076] [ka]

[0077] Here, R 1 , R 2 , R 3 and R 4 One of them is H and the rest is C 1 ~C 3 Alki Lu, C 2 ~C 3 Alkenes and C 2 ~C 3 is selected from the group consisting of alkynes, R 5 can be a linear, branched, or cyclic divalent organic linker having 1 to 12 carbon atoms.

[0078] In one embodiment, R 1 , R 2 , R 3 and R 4 Of the remaining 1, except for H, one is C. 2 ~C 3 alkenes, one and one further of the remainder being C 1 ~C 3 Alki For example, the polymer according to the embodiment of the present invention may include the following unit 2: can be done.

[0079] [Unit 2]

[0080] [ka]

[0081] or the above R 1 , R 2 , R 3 and R 4 Of these, the rest is C, excluding H. 1 ~C 3 Alkyl, C 2 ~C 3 Alkenes and C 2 ~C 3Different alkynes are grouped together to form The selection may be made as follows.

[0082] In this way, the polymer formed by unit 1 or unit 2 is nitrided into plate-shaped boron nitride. coated onto the boron agglomerates and filling at least a portion of the voids within the boron nitride agglomerates; This minimizes the air space in the boron nitride aggregates, improving the thermal conductivity of the boron nitride aggregates. This increases the bonding strength between the plate-like boron nitride particles and prevents the boron nitride aggregates from breaking down. This can prevent the formation of a coating on the plate-shaped boron nitride aggregates. The formation of a coating layer makes it easier to form functional groups, and the coating layer of the boron nitride aggregates The formation of a functional group thereon can increase affinity with the resin.

[0083] At this time, the metal support 510 and the first thermal conductive layer 520 may be directly bonded to each other without a separate adhesive. For this purpose, the same resin composition as that forming the first thermally conductive layer 520 is used in an uncured state. The resin composition is applied to the metal support 510, and the first thermally conductive layer in a cured state is formed on the applied resin composition. When the metal support 510 and the first thermal conductive layer 520 are laminated and then pressed at high temperature, the metal support 510 and the first thermal conductive layer 520 are directly bonded to each other. It can be glued.

[0084] On the other hand, the second thermally conductive layer 530 is formed of a resin composition containing a silicone resin and an inorganic filler. The second thermally conductive layer 530 may be disposed between the first thermally conductive layer 520 and the plurality of first electrodes 540. , may serve to bond the first thermally conductive layer 520 and the plurality of first electrodes 540. For example, For example, the silicone resin contained in the resin composition forming the second thermal conductive layer 530 is PDMS (polymethylsulfone). ydimethylsiloxane), which is a resin composition forming the second thermally conductive layer 530. The inorganic filler contained in the resin composition may be aluminum oxide. In addition to its high tensile strength, high coefficient of thermal expansion and It has adhesive properties and flexibility even after curing. For example, such resins The resin composition may have a thermal conductivity of 1.8 W / mK or more, and a thermal conductivity of 125 ppm / °C or more. The thermal conductivity of the second thermally conductive layer 530 may be greater than that of the first thermally conductive layer 530. The thermal conductivity of the first thermal conductive layer 520 may be lower than that of the conductive layer 520. The heat conductive performance of the electrode 520 and the electrodes 540 can be stably bonded without being deteriorated. At this time, the thickness T4 of the second thermally conductive layer 530 is 0.001 to 1 times the thickness T3 of the first thermally conductive layer 520. The ratio may be preferably 0.01 to 0.5 times, and more preferably 0.05 to 0.2 times. When the thickness of the second thermal conductive layer 530 is formed in this range, the thermal conductivity of the first thermal conductive layer 520 is The adhesive strength between the first thermal conductive layer 520 and the first electrodes 540 is increased without impairing the conductive performance. can be maintained.

[0085] For this purpose, the resin composition constituting the second thermally conductive layer 530 is applied to the first thermally conductive layer 520 in an uncured state. A plurality of first electrodes 540 are laminated on the applied resin composition, and then pressurized at a high temperature. Then, the first electrodes 540 and the first thermally conductive layer 520 are bonded to each other through the second thermally conductive layer 530. As a result, at least a portion of the side surface 542 of the plurality of electrodes 540 may be covered with the second thermally conductive layer. For example, the thickness H of the side surface 542 of the plurality of electrodes 540 may be 0.1 to 1. 0.9 times, preferably 0.2 to 0.8 times, and more preferably 0.3 to 0.7 times the second heat transfer rate. A plurality of electrodes 540 embedded in the second thermally conductive layer 530. The thickness H1 of the side surface 542 is less than 0.1 times the thickness H of the side surfaces of the first electrodes 540. , the possibility that at least some of the plurality of first electrodes 540 may be detached from the second thermally conductive layer 530 The thickness of the side surface 542 of the first electrodes 540 embedded in the second thermally conductive layer 530 is When H1 exceeds 0.9 times the thickness H of the side surface 542 of the plurality of electrodes 540, The resin composition constituting the second thermal conductive layer 530 flows onto at least a portion of 540 to bond the electrode and P This can weaken the bond between the N-type thermoelectric legs and the bond between the electrodes and the N-type thermoelectric legs.

[0086] Meanwhile, the second thermally conductive layer 530 is formed on the upper surface 524 of the first thermally conductive layer 520 as well as on the upper surface 525 of the first thermally conductive layer 520. The side 522 of the first thermally conductive layer 520 may also be disposed to surround the side 522 of the first thermally conductive layer 520. A second thermally conductive layer 530 may also be disposed on the top surface 512 of the metal support 510. A top surface 524 of the first thermally conductive layer 520, a side surface 522 of the first thermally conductive layer 520, and When placed on the top surface 512 of the metal support 510 in contact with the side surface 522, the first thermally conductive layer 52 The bonding strength between the metal support 510 and the first thermal conductive layer 520 can be increased at the edge of the 0 This prevents the edge of the first thermally conductive layer 520 from peeling off from the metal support 510 due to temperature changes. It is possible.

[0087] In addition, the second thermal conductive layer 530 has a high thermal expansion coefficient and is flexible even after hardening. The first thermal conductive layer 510 and the first electrodes 540 are provided with a buffer function against thermal shock caused by temperature changes. can be protected.

[0088] In this manner, the second thermally conductive layer 530 is in contact with the top surface 524 of the first thermally conductive layer 520 as well as the first thermally conductive layer 522. The width W2 of the second thermally conductive layer 530 is set so as to surround the side surface 522 of the conductive layer 520. may be greater than the width W1 of the first thermally conductive layer 520. For example, the width W The width W2 of the first thermally conductive layer 520 may be 1.01 to 1.2 times the width W1 of the second thermally conductive layer 530. When the width W2 of the first thermally conductive layer 520 is greater than the width W1 of the first thermally conductive layer 520, the first thermally conductive layer 520 and the metal support The bonding strength between the bodies 510 is improved, and the thermal shock between the first thermal conductive layer 520 and the plurality of electrodes 540 is reduced. It can be done.

[0089] Meanwhile, as shown in FIG. 6, the second thermal conductive layer 530 is formed on the metal support 510. 510 may further extend in a direction parallel to the upper surface 512 of ... The thickness of the second thermally conductive layer 530 is 0.001 to 0.2 times, preferably 0.0 In this way, the second thermal conductive layer 530 is a metal layer on the metal support 510. Further extending in a direction parallel to the top surface 512 of the support 510, a second thermally conductive layer 530 and a metal support Since the contact area between the metal support 510 is increased, the edge of the first thermal conductive layer 520 is easily contacted with the metal support 510. This can prevent the problem of peeling off from the substrate.

[0090] Alternatively, as shown in FIG. 7, the second thermally conductive layer 530 may extend laterally from the side surface 522 of the first thermally conductive layer 520. The second thermally conductive layer 530 may be arranged in a spreading shape. That is, the thickness T4 of the second thermally conductive layer 530 may be greater than the thickness T4 of the first thermally conductive layer 530. The thickness of the first thermal conductive layer 520 is greatest on the side 522 of the first thermal conductive layer 520. In this way, when the width W4 of the second thermally conductive layer 530 is arranged wide, the second thermally conductive layer Since the contact area between the first thermal conductive layer 520 and the metal support 510 is increased, The problem of the support 510 peeling off can be solved.

[0091] Alternatively, as shown in FIG. 8, a groove 514 is formed in the metal support 510, and a second heat conductive The layer 530 may further be disposed within a groove 514 of the metal support 510. The groove 514 may include a first heat The conductive layer 520 is formed along the edge of the conductive layer 520 and has a thickness T3 of 0.001 to 2 times that of the first thermal conductive layer 520. The depth D may be preferably 0.01 to 1 times, and more preferably 0.1 to 1 times. In this manner, the groove 514 is formed in the metal support 510, and the second thermally conductive layer 530 is disposed in the groove 514. When more is placed, the contact area between the second thermally conductive layer 530 and the metal support 510 becomes larger. Therefore, the edge of the first thermally conductive layer 520 can be prevented from peeling off from the metal support 510. At this time, the groove 514 is formed in a continuous shape along the edge of the first thermal conductive layer 520 and is connected to the metal support 5. 10. Alternatively, the metal support 510 may be formed in the shape of a dashed line on the upper surface of the metal support 510.

[0092] Alternatively, as shown in FIG. 9, a second thermal conductive layer 522 may be disposed on the side 522 of the first thermal conductive layer 520. The width W5 of the conductive layer 530 may be greater than the width W6 of the groove 514 of the metal support 510. The width W6 of the second thermally conductive layer 530 disposed in the groove 514 is The width W5 of the second thermally conductive layer 530 may be narrower than the width W5 of the second thermally conductive layer 530 disposed on the second thermally conductive layer 530. When the width W5 of the second thermal conductive layer 530 is set wide, the contact area between the second thermal conductive layer 530 and the metal support 510 This widens the area, thereby solving the problem of the edge of the first thermally conductive layer 520 peeling off from the metal support 510. Although not shown in the figure, a thermally conductive layer 520 may be disposed on the side surface 522 of the first thermally conductive layer 520. The width W5 of the second thermally conductive layer 530 is wider than the width W6 of the groove 514 of the metal support 510. The metal support 510 may be disposed in contact with the upper surface 512 of the metal support 510 .

[0093] FIG. 10 is a cross-sectional view of a thermoelectric module according to another embodiment of the present invention. 12 is a perspective view of the body of FIG. 10. FIG.

[0094] Hereinafter, a thermoelectric module 1000 according to an embodiment of the present invention will be described with reference to FIGS. explain.

[0095] 10 to 12, a thermoelectric module 1000 includes a thermoelectric element 100, a first thermal conductive It may include a plate 200 , a second thermally conductive plate 300 and a seal 400 .

[0096] Here, the thermoelectric element 100 may be the thermoelectric element described with reference to FIGS. 1 to 9. At least one of the lower substrate and the lower electrode and the upper substrate and the upper electrode is shown in FIG. The first heat conducting plate 200 may have the structure of the embodiment described above. It may be the metal support 200 described above or the metal support 510 described in FIGS. 5 to 9 , and the second The same description as for the first thermally conductive plate 200 may be applied to the thermally conductive plate 300 .

[0097] According to an embodiment of the present invention, the first thermally conductive plate 200 and the second thermally conductive plate 300 are The first and second thermally conductive plates 200 and 200 face each other with the thermal element 100 disposed therebetween. Plate 300 may be made of a metal material with excellent thermal conductivity.

[0098] Here, the first thermally conductive plate 200 is disposed between the heat absorbing surface and the cooling side (not shown) of the thermoelectric element 100. The surface of the thermoelectric element 100 is placed between the surfaces of the thermoelectric element 100 to improve the heat transfer area when the thermoelectric element 100 absorbs heat through the heat absorption surface. At this time, the first heat conducting plate 200 is made of aluminum or the like, but copper and Needless to say, stainless steel or brass may also be used.

[0099] The first thermally conductive plate 200 is provided with a plurality of The heat dissipation fins 201 can reduce the temperature gradient, especially in the heat dissipation direction of the thermoelectric element 100. The distance between the second heat conducting plate 300 attached in the opposite direction and the cooling side (not shown) is artificially increased. By this, the relatively hot second heat conducting plate 300 is transferred to the cold cooling side (not shown). It is possible to block heat transfer to the outside (without being disturbed).

[0100] The second thermally conductive plate 300 is in close contact with the heat generating surface of the thermoelectric element 100 to transfer heat from the thermoelectric element 100. Usually, extrusion type heat sinks are used, but in some cases, skiving type heat sinks are used. Use of heat sinks, heat pipe embedded type heat sinks, fin bonding type heat sinks, etc. It is also possible to use

[0101] The second heat conducting plate 300 has a number of heat dissipating fins to increase the heat transfer area. 301, and includes a step 310 for placement of the seal 400 in the corner area. It is possible.

[0102] Here, the first thermally conductive plate 200 is a heat absorbing surface, and the second thermally conductive plate 300 is a heat radiating surface. This is because the direction of the current applied to the thermoelectric element determines the heat absorption surface and The heat dissipation surfaces may vary from one another.

[0103] The sealing unit 400 includes a body 410 and sealing members 421, 422, 431, 432, 433, It may contain 434.

[0104] The body 410 has a first height H1 and is generally made up of a lower surface 411, an upper surface 412, and a side surface. Of course, the lower surface 411 and the upper surface 412 may have a hexahedral shape. The cylindrical shape may be configured as follows:

[0105] The fuselage 410 is made of expanded polystyrene (EPS). ).

[0106] EPS is lightweight, has excellent moldability, and has excellent heat resistance and insulation properties. It is economical and has excellent waterproof and dustproof performance, so it is reliable. Can produce excellent side effects.

[0107] The lower surface 411 of the body 410 is recessed from the lower surface 411 to a second depth H2. 1 groove 413 may be included.

[0108] In addition, the upper surface 413 of the body 410 is recessed to a second depth H2 from the upper surface 413. The second groove 414 may be formed in the groove 412 .

[0109] The bottom surface of the first groove 413 and the bottom surface of the second groove 414 may be spaced apart by a third height H3.

[0110] Here, the first height H1 may be set to be 3 to 5 times higher than the second height H2. The height H3 may be set to be 1 to 3 times higher than the second height H2.

[0111] The first height H1 of the body 410 is larger than the second height H2 of the first groove 413 and the second groove 414. If it is less than three times, the third height H3, which is the distance between the first groove 413 and the second groove 414, is relatively small. Therefore, it is difficult to ensure the structural rigidity of the fuselage 410. When the second height H2 of the first groove 413 and the second groove 414 is 5 times larger than the second height H2 of the first groove 413 and the second groove 414, The path of moisture that may penetrate along the inner surfaces of the groove 413 and the second groove 414 is shortened. Therefore, it is difficult to ensure reliability in terms of dustproof and waterproof performance. Thermoelectric module 1 There is a problem with increasing the volume of 000.

[0112] The first groove 413 and the second groove 414 have a rectangular or circular shape that is closed at the periphery.

[0113] A hole is formed at the approximate center of the body 410 so as to penetrate the lower surface 411 and the upper surface 412. It may include 415.

[0114] The hole 415 forms a receiving space for receiving the thermoelectric element 100. The thermoelectric element 100 can be accommodated in the accommodation space.

[0115] Meanwhile, the receiving space may be formed to have a volume in the range of 1.1 to 5 times the volume of the thermoelectric element 100. More preferably, it can be realized in the range of 2 to 3 times.

[0116] When the storage space is 1.1 times or less the volume of the thermoelectric element 100, Since it is not possible to secure sufficient thermal fluid space, it is not possible to expect any improvement in thermal fluid performance. When the storage space is 5 times or more larger than the volume of the thermoelectric element 100, the thermal flow due to the expansion of the storage space No improvement in performance can be expected, and there is a problem of increasing the volume of the thermoelectric module 1000. be.

[0117] That is, the thermoelectric module 1000 according to the embodiment of the present invention has a lower part of the thermoelectric element 100. The thermal flow caused by the temperature difference between the substrate and the upper substrate is expanded to the side of the thermoelectric element 100. This makes it possible to ensure reliability in terms of thermal flow.

[0118] Here, the side of the thermoelectric element 100 abuts against the inner surface 416 of the hole 415 of the body 410. Since they are in contact with each other, the flow of the thermoelectric element 100 can be prevented.

[0119] That is, the shape and diameter of the hole 415 of the body 410 are determined according to the shape of the thermoelectric element 100. The design can be easily modified.

[0120] Also, on one side of the body 410, the lead wires 181 and 182 of the thermoelectric element 100 are externally connected. The liquid may include a through hole 417 for exhausting to the outside.

[0121] Meanwhile, the through hole 417 may have a fourth height H4 from the lower surface 411 of the body 410. In this case, the fourth height H 4 may be greater than the second height H 2 of the first groove 413 .

[0122] The sealing members 421, 422, 431, 432, 433, and 434 are the first sealing member 421, the second sealing member 422, the The second sealing member 422, the third sealing member 431, the fourth sealing member 432, the fifth sealing member 433 and and a sixth sealing member 434.

[0123] The first sealing member 421 is disposed so as to be inserted into the first groove 413 from the lower surface 411 of the body 410. 410 , sealing the inside of the body 410 against moisture penetration.

[0124] Here, the first sealing member 421 is introduced into the first groove 413 before hardening, and then is inserted into the first groove 413 and the first sealing member 421. It is preferable that the heat conductive plate 200 is made of waterproof silicone or the like to which it can be attached.

[0125] The second sealing member 422 is disposed so as to be inserted into the second groove 414 from the upper surface 412 of the body 410. 410 , sealing the inside of the body 410 against moisture penetration.

[0126] Here, the second sealing member 422 is introduced into the second groove 414 before hardening, and then is inserted into the second groove 414 and the first groove 414. It is preferable that the heat conductive plate 300 is made of waterproof silicone or the like to which it can be attached.

[0127] The third sealing member 431, the fourth sealing member 432, the fifth sealing member 433 and the sixth sealing member 4 Each of the 34 is made of waterproof tape, waterproof silicone, rubber, resin and other adhesives. The first and second thermally conductive plates 200 and 300 are bonded to the body 410. It is possible.

[0128] That is, the third sealing member 431, the fourth sealing member 432, the fifth sealing member 433 and the sixth sealing member 434 are The first heat conductive plate 200 and the second heat conductive plate 300 are connected to each other through the sealing member 434. The adhesion and sealing between the bodies 410 can be improved.

[0129] Meanwhile, the third sealing member 431 and the fourth sealing member 432 are disposed between the lower surface 411 of the body 410 and the first sealing member 432. The fifth sealing member 433 and the sixth sealing member 434 are disposed between the heat-conducting plates 200. It may be disposed between the top surface 412 of the body 410 and the second thermally conductive plate 300 .

[0130] The third sealing member 431 is disposed on the lower surface 411 of the body 410 between the first groove 413 and the hole 415. The axially extending portion of the cavity is disposed on the cavity surface and may have a rectangular or circular closed shape.

[0131] The fourth sealing member 432 is disposed on the lower surface 411 of the body 410 between the first groove 413 and the outer surface. , angular or circular, with a closed periphery.

[0132] The fifth sealing member 433 is disposed on the upper surface 412 of the body 410 between the second groove 414 and the hole 415. The axially extending portion of the cavity is disposed on the cavity surface and may have a rectangular or circular closed shape.

[0133] A sixth sealing member 434 is disposed on the upper surface 412 of the body 410 between the second groove 414 and the outer surface. , angular or circular, with a closed periphery.

[0134] FIG. 13 is a cross-sectional view of a thermoelectric module according to still another embodiment of the present invention, and FIG. 13 is a top view of a sealing portion of a thermoelectric module according to still another embodiment of the invention. FIG.

[0135] The thermoelectric module 2000 shown in FIGS. 13 and 14 is similar to that of the present invention shown in FIG. The configuration of the sealing part 600 is different from that of the thermoelectric module 1000 according to the above embodiment. Therefore, only the different configurations of the sealing portion 600 will be described in detail below, and the same configuration will not be repeated. Detailed explanations of the drawing numbers will be omitted.

[0136] The sealing unit 600 includes a body 610 and sealing members 421, 422, 431, 432, 433, It may contain 434.

[0137] The body 610 has a fastening hose passing through the lower surface 411 and the upper surface 412 between the first groove 413 and the outer surface. The device may include a rule 418.

[0138] In addition, the first heat conductive plate 200 and the second heat conductive plate 210 are connected to the fastening hole 418 at a position corresponding to the fastening hole 418. The conductive plate 300 may include fastening holes 210, 320 extending therethrough.

[0139] The fastening hole 418 of the body 610, the fastening hole 210 of the first thermal conductive plate 200, The second heat conducting plate 300 has a fastening hole 320 to which a first fastening member 710 such as a bolt is inserted. A second fastening member 720 such as a nut can be fastened to the opposite side of the insertion.

[0140] That is, the first thermal conductive plate is formed by fastening the first fastening member 710 and the second fastening member 720. The base 200, the body 610 and the second heat conducting plate 300 can be more firmly connected, Therefore, deformation of the substrate can be prevented.

[0141] Hereinafter, with reference to FIG. 15, an example in which a thermoelectric element according to an embodiment of the present invention is applied to a water purifier will be described. explain.

[0142] FIG. 15 is a diagram illustrating an example in which a thermoelectric device according to an embodiment of the present invention is applied to a water purifier.

[0143] The water purifier 1 to which the thermoelectric element according to the embodiment of the present invention is applied includes a raw water supply pipe 12a, a water purification tank 12b, and a water supply pipe 12c. Inlet pipe 12b, purified water tank 12, filter assembly 13, cooling fan 14, heat storage It includes a tank 15, a cold water supply pipe 15a, and a thermoelectric module 1000.

[0144] The raw water supply pipe 12a introduces water to be purified from a water source into the filter assembly 13. The purified water tank inlet pipe 12b is a supply pipe for purifying water through a filter assembly 13. The cold water supply pipe 15a is an inlet pipe that allows the cold water to flow into the purified water tank 12. The cold water cooled to a predetermined temperature by the thermoelectric module 1000 is finally supplied to the user. It is a supply pipe.

[0145] The purified water in the purified water tank 12 passes through a filter assembly 13, and the purified water in the purified water tank flows Water that flows in through the Immigration Bureau 12b is stored and purified water is temporarily supplied to the outside. The facility will be detained for a long period of time.

[0146] The filter assembly 13 includes a sedimentation filter 13a and a pre-carbon filter 13b. b, a membrane filter 13c, and a post-carbon filter 13d.

[0147] That is, the water flowing into the raw water supply pipe 12a passes through the filter assembly 13. Water can be purified from

[0148] The heat storage tank 15 is disposed between the purified water tank 12 and the thermoelectric module 1000. The cold air generated in the heat storage tank 15 is stored in the purified water tank 1000. 2 to cool the water contained in the purified water tank 120.

[0149] The heat storage tank 15 may be in surface contact with the purified water tank 12 so that the cool air can be transferred smoothly.

[0150] As described above, the thermoelectric module 1000 has a heat absorbing surface and a heat generating surface, and is made of a P-type semiconductor and Electron movement on the N-type semiconductor causes one side to cool and the other side to heat.

[0151] Here, one side may be the side of the purified water tank 12 and the other side may be the opposite side of the purified water tank 12 .

[0152] As described above, the thermoelectric module 1000 has excellent waterproof and dustproof properties. The flow performance is improved, and the purified water tank 12 can be cooled efficiently within the water purifier.

[0153] Hereinafter, with reference to FIG. 16, an example in which a thermoelectric element according to an embodiment of the present invention is applied to a refrigerator will be described. explain.

[0154] FIG. 16 is a diagram illustrating an example in which a thermoelectric device according to an embodiment of the present invention is applied to a refrigerator.

[0155] The refrigerator has a deep-temperature evaporation chamber cover 23, an evaporation chamber partition wall 24, and a main evaporator 25 in the deep-temperature evaporation chamber. , a cooling fan 26 and a thermoelectric module 1000.

[0156] The inside of the refrigerator is divided into a deep temperature storage chamber and a deep temperature evaporation chamber by a deep temperature evaporation chamber cover 23.

[0157] In detail, the internal space in front of the deep temperature evaporation chamber cover 23 is defined as the deep temperature storage chamber. The internal space behind the deep-temperature evaporation chamber cover 23 can be defined as the deep-temperature evaporation chamber.

[0158] An exhaust grill 23a and an intake grill 23b are formed on the front surface of the deep-temperature evaporation chamber cover 23. It can be done.

[0159] The evaporation chamber partition wall 24 is disposed at a position spaced forward from the rear wall of the inner cabinet. , which divides the space into one in which the deep greenhouse storage system is placed and one in which the main evaporator 25 is placed.

[0160] The cold air cooled by the main evaporator 25 is supplied to the freezer compartment and then passed through the main evaporator 26 again. Return to the side.

[0161] The thermoelectric module 1000 is housed in the deep temperature evaporation chamber, and the heat absorbing surface is attached to the drawer assembly of the deep temperature storage chamber. The thermoelectric module has a structure in which the heat generating surface faces the evaporator side and the cooling surface faces the chamber side. The heat absorption phenomenon that occurs in the drawer assembly is used to heat the food and drink stored in the drawer assembly. It can be used to quickly cool to ultra-low temperatures below -50℃.

[0162] As described above, the thermoelectric module 1000 has excellent waterproof and dustproof properties. Improved flow performance allows for efficient cooling of the drawer assembly within the refrigerator .

[0163] The thermoelectric element according to the embodiment of the present invention is used in power generation devices, cooling devices, heating devices, etc. Specifically, the thermoelectric element according to the embodiment of the present invention is mainly used in optical communication modules, sensors, medical devices, etc. Medical equipment, measuring equipment, aerospace industry, refrigerators, chillers, automotive ventilation sheets cup holders, washing machines, dryers, wine cellars, water purifiers, power supply devices for sensors, It can be applied to thermopiles, etc.

[0164] Here, as an example of the application of the thermoelectric element according to the embodiment of the present invention to medical equipment, PCR (P PCR machines are used to detect DNA This equipment amplifies DNA to determine its base sequence, and requires precise temperature control. This is a device that requires thermal cycling. For this purpose, a Peltier element is used. Thermoelectric elements on the board may be applied.

[0165] Another example of a medical device in which the thermoelectric element according to the embodiment of the present invention is applied is a photodetector. Here, the photodetector is an infrared / ultraviolet detector, a CCD (Charge Coupled Device) sensor, X-ray detector, TTRS (Thermoelectric Thermal Reference Source, etc. Photodetector cooling (co For the oling, a Peltier-based thermoelectric element can be applied. This prevents changes in wavelength, a decrease in output, and a decrease in resolution caused by an increase in internal temperature. can.

[0166] As another example of a thermoelectric element according to an embodiment of the present invention being applied to a medical device, an immunoassay is Immunoassay field, In vitro Diagnos tics field, temperature control and cooling systems (general temperatur e control and cooling systems), physical therapy field, liquid Chiller systems, blood / plasma temperature control areas, etc. This allows for precise temperature control is possible.

[0167] As another example of a thermoelectric element according to an embodiment of the present invention being applied to a medical device, an artificial heart is This can be used to power an artificial heart.

[0168] One example of an application of the thermoelectric element according to an embodiment of the present invention in the aerospace industry is a star tracking system. , Thermal imaging camera, Infrared / ultraviolet detector, CCD sensor, Hubble Space Telescope, TTRS, which helps maintain the temperature of the image sensor.

[0169] Other examples of applications of the thermoelectric element according to the embodiment of the present invention in the aerospace industry include cooling devices, Heaters, power generators, etc.

[0170] In addition, the thermoelectric element according to the embodiment of the present invention can be used in other industrial fields such as power generation, cooling and heating. May be applied for heat.

[0171] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will appreciate that The reader is free to make any and all modifications and variations of the present invention without departing from the spirit and scope of the present invention as set forth in the following claims. It will be understood that the present invention is susceptible to numerous modifications and variations.

Claims

1. A first metal substrate; a first resin layer disposed on the first metal substrate; a second resin layer disposed on an upper surface and a side surface of the first resin layer; a first electrode disposed on the second resin layer; a semiconductor structure disposed on the first electrode; and a second metal substrate disposed on the semiconductor structure; the second resin layer includes a first region disposed between the first electrode and the first resin layer, and a second region that is not the first region; The maximum thickness of the second region is greater than the maximum thickness of the first resin layer, A thermoelectric element, wherein the maximum height of the first electrode is greater than the maximum height of the second resin layer, based on the top surface of the first metal substrate.

2. The thermoelectric element of claim 1 , wherein a maximum thickness of the first metal substrate is greater than a maximum thickness of the second region.

3. the first resin layer is in direct contact with the first metal substrate; the second resin layer is in direct contact with the first resin layer; The thermoelectric element of claim 1 , wherein the second resin layer is in direct contact with the first electrode.

4. The thermoelectric element of claim 1 , wherein the first resin layer is not in contact with the first electrode.

5. The thermoelectric element of claim 1 , wherein a top surface of the first region is lower than a top surface of the second region.

6. The thermoelectric element of claim 5 , wherein the first electrode is disposed on a top surface of the first region.

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