SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To suppress distortion of a substrate caused by cleaning processing.SOLUTION: A processing unit 51 of a substrate processing device 1 performs physical cleaning processing on an upper face 91 of a substrate 9. A lower center supply unit 35 includes a lower center discharge port from which a fluid is discharged to a center of a lower face 92 of the substrate 9. A processing unit moving mechanism 52 moves the processing unit 51 between a first position opposed with a center of the upper face 91 of the substrate 9 and a second position located radially outside of the first position. In the substrate processing device 1, a flow rate control section 801 controls the lower center supply unit 35 during the cleaning processing. Thus, when the processing unit 51 is located at the first position, the fluid of a first flow rate is supplied from the lower center supply unit 35 to the center of the lower face 92 of the substrate 9. When the processing unit 51 is located at the second position, the fluid of a second flow rate is supplied from the lower center supply unit 35 to the center of the lower face 92 of the substrate 9. The first flow rate is greater than the second flow rate. Thus, distortion of the substrate 9 caused by the cleaning processing can be suppressed.SELECTED DRAWING: Figure 2

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