Heat exchange enhanced module shell

JP7672472B2Active Publication Date: 2025-05-07MOLEX INC
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Patent Information

Application Number
JP2023203532
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-12-06
Filing Date
2023-12-01
Publication Date
2025-05-07
Estimated Expiration
2043-12-01
Patent Text Reader

Abstract

To provide a heat exchange enhancement module shell that can be effectively transmitted by a heat sink in a fitting connector or a cage for a pluggable transceiver module.SOLUTION: A pluggable transceiver module 102 contains: an upper shell 112; and a lower shell 114. The upper shell contains a flat inner surface, and a concave-like area formed on the flat inner surface. The module 102 also contains: a PCB 120; a semiconductor chip 122 that is mounted onto the PCB 120; and a heat spreader that is fixed into the concave area between the upper shell 112 and the semiconductor chip 122. The heat spreader can use a heat pipe, a vapor chamber, or a related thermal expansion structure. The heat spreader helps a heat transmission from the semiconductor chip 122 over an expander area of the upper shell 112 of the module 102, and a heat can be effectively transmitted by the heat sink 170.SELECTED DRAWING: Figure 4
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Citation Information

Patent Citations

  • Case structure of onboard electronic equipment

    JP2004153034A

  • Circuit board, method for manufacturing the same, and semiconductor module using the same

    JP2008198706A

  • Removal detection device and communication module

    JP2016197299A

  • Pluggable module having cooling channel with heat transfer fins

    JP2019040852A

  • Electronic device

    JP2022063806A