Heat exchange enhanced module shell
JP7672472B2Active Publication Date: 2025-05-07MOLEX INC
7 Cites 0 Cited by
Patent Information
- Application Number
- JP2023203532
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-12-06
- Filing Date
- 2023-12-01
- Publication Date
- 2025-05-07
- Estimated Expiration
- 2043-12-01
Abstract
To provide a heat exchange enhancement module shell that can be effectively transmitted by a heat sink in a fitting connector or a cage for a pluggable transceiver module.SOLUTION: A pluggable transceiver module 102 contains: an upper shell 112; and a lower shell 114. The upper shell contains a flat inner surface, and a concave-like area formed on the flat inner surface. The module 102 also contains: a PCB 120; a semiconductor chip 122 that is mounted onto the PCB 120; and a heat spreader that is fixed into the concave area between the upper shell 112 and the semiconductor chip 122. The heat spreader can use a heat pipe, a vapor chamber, or a related thermal expansion structure. The heat spreader helps a heat transmission from the semiconductor chip 122 over an expander area of the upper shell 112 of the module 102, and a heat can be effectively transmitted by the heat sink 170.SELECTED DRAWING: Figure 4
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Case structure of onboard electronic equipment
JP2004153034A
Circuit board, method for manufacturing the same, and semiconductor module using the same
JP2008198706A
Removal detection device and communication module
JP2016197299A
Pluggable module having cooling channel with heat transfer fins
JP2019040852A
Electronic device
JP2022063806A