Light-emitting display device and manufacturing method thereof
By connecting the auxiliary electrode to the cathode within the active region and using a bank protection pattern to prevent outgassing, the light-emitting display device addresses issues of uneven brightness and reliability, achieving improved voltage uniformity and device reliability.
Patent Information
- Application Number
- JP2023203664
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-01-30
- Filing Date
- 2023-12-01
- Publication Date
- 2025-05-14
- Estimated Expiration
- 2043-12-01
AI Technical Summary
Existing light-emitting display devices face issues with uneven brightness due to resistance variations in the common electrode, and outgassing from exposed bank structures can damage the intermediate layer, reducing the reliability of the device.
The light-emitting display device incorporates a design where the auxiliary electrode is connected to the cathode within the active region, ensuring uniform voltage application, and features a bank protection pattern around the bank holes to prevent outgassing and damage to the intermediate layer.
This solution improves voltage uniformity across the display region, prevents luminance reduction, and enhances the reliability of the light-emitting display device by protecting the intermediate layer from outgassing.
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Abstract
Description
[Technical field]
[0001] The present invention relates to a display device, and includes a light emitting display device and a manufacturing method thereof that can prevent exposure of a bank structure around an auxiliary electrode to prevent emission of outgassing. [Background technology]
[0002] 2. Description of the Related Art As the information society develops, the demands on display devices for displaying images are increasing in various ways.
[0003] A light-emitting display device in which pixels are formed by light-emitting elements does not require a separate light source unit, and is advantageous in terms of slimness and flexibility, and also has the advantage of good color purity.
[0004] As an example, a light-emitting element includes two different electrodes and a light-emitting layer between them. When electrons generated at one of the electrodes and holes generated at the other electrode are injected into the light-emitting layer, the injected electrons and holes combine to generate excitons, and the generated excitons fall from an excited state to a ground state, thereby emitting light.
[0005] In a light emitting display device, one of two electrodes facing each other of a light emitting element provided in a pixel is provided in the form of a common electrode that is common to all pixels, and as the area becomes larger, the difference in the distance from the power supply unit causes a difference in resistance between different regions of the common electrode, which may cause uneven brightness. Also, as the thickness of the common electrode becomes thinner due to its transparency, the resistance of the common electrode becomes higher, which may cause a voltage drop, and thus the current of the light emitting element may fluctuate or decrease. Summary of the Invention [Problem to be solved by the invention]
[0006] The present invention can solve the above problems, and in particular, the present invention provides a light-emitting display device having a portion in an active area where an auxiliary electrode and a cathode are connected, which makes it possible to apply a uniform voltage to the cathode across the entire display area, thereby preventing uneven brightness.
[0007] In addition, the light emitting display device of the present invention has an auxiliary electrode that is partially overlapped with the bank and a bank protection pattern around the bank hole, thereby preventing damage to the intermediate layer due to outgassing of the exposed portion of the bank, thereby improving the reliability of the light emitting display device. [Means for solving the problem]
[0008] The light-emitting display device of the present invention may include a plurality of anodes spaced apart from each other on a substrate, an auxiliary electrode located between adjacent ones of the plurality of anodes, a bank having a bank hole exposing a light-emitting portion of the plurality of anodes and a portion of the auxiliary electrode, a bank protection pattern provided on a side surface of the bank surrounding the bank hole and on the bank around the bank hole, and a cathode connected to the auxiliary electrode within the light-emitting portion and the bank, and an intermediate layer provided on the bank, and the bank hole.
[0009] In another aspect of the present invention, a method for manufacturing a light-emitting display device includes a first step of forming a plurality of anodes spaced apart from each other on a substrate, a second step of forming auxiliary electrodes between adjacent anodes among the plurality of anodes, a third step of forming banks exposing light-emitting portions of the plurality of anodes, a fourth step of forming a first protective pattern on the banks, and a fifth step of forming a cathode and an intermediate layer overlapping the first protective pattern.
[0010] The light emitting display device of the present invention has the following effects.
[0011] First, the auxiliary electrode is provided in a portion overlapping with the bank, and a portion of the auxiliary electrode is exposed through a process of removing the structure on the auxiliary electrode before the cathode is formed, directly connecting the cathode and the auxiliary electrode. Therefore, by providing a portion where the cathode and auxiliary electrode are connected in the active area (display area), it is possible to improve the voltage uniformity of the cathode and prevent a decrease in brightness.
[0012] Secondly, in a bank hole formed to expose an auxiliary electrode, a bank protection pattern is formed on the side surface of the bank surrounding the bank hole and on the bank, thereby preventing outgassing due to exposure of the bank.
[0013] Third, the top and side surfaces of the bank before the intermediate layer is formed are covered by the bank protection pattern, preventing the subsequently formed intermediate layer from directly contacting the bank layer, preventing deterioration of the bank due to exposure, and reducing the contact area between the intermediate layer and the bank, thereby preventing damage to the intermediate layer due to bank outgassing.
[0014] Fourth, the bank protection pattern can be made of a transparent inorganic insulating film used in the display field, so a reliable light-emitting display device can be manufactured without adding additional materials. This has the advantages of being environment friendly, low power consumption, and process optimization, and has an ESG (Environment / Social / Governance) effect.
[0015] Fifth, when a bank hole is provided between light-emitting parts that emit different colors, the intermediate layer can be removed from the bank hole in the process of forming the bank hole, and the intermediate layer between adjacent light-emitting parts of different colors can be patterned, thereby preventing leakage current between adjacent light-emitting parts of different colors. [Brief description of the drawings]
[0016] [Figure 1] 1 is a block diagram illustrating a light emitting display device according to an embodiment of the present invention; [Diagram 2]1 is a cross-sectional view illustrating a light emitting display device according to an embodiment of the present invention. [Diagram 3] 1 is a plan view showing a light emitting display device according to a first embodiment of the present invention. [Figure 4] FIG. 4 is a plan view showing a light emitting display device according to a second embodiment of the present invention. [Figure 5A] 2 shows steps of a method for manufacturing a light-emitting display device according to the present invention. [Figure 5B] 2 shows steps of a method for manufacturing a light-emitting display device according to the present invention. [Figure 5C] 2 shows steps of a method for manufacturing a light-emitting display device according to the present invention. [Figure 5D] 2 shows steps of a method for manufacturing a light-emitting display device according to the present invention. [Figure 5E] 2 shows steps of a method for manufacturing a light-emitting display device according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. The same reference numbers throughout the specification refer to substantially the same components. In the following description, if it is determined that a specific description of a technology or configuration related to the present disclosure may unnecessarily obscure the gist of the present disclosure, the detailed description will be omitted. Note that the names of components used in the following description are selected in consideration of ease of specification writing and may differ from the part names of actual products.
[0018] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating various embodiments of the present disclosure are illustrative, and the present disclosure is not limited to the matters shown in the drawings. The same reference numbers refer to the same components throughout the present disclosure. In the description of the present disclosure, if it is determined that a specific description of the related known technology may unnecessarily obscure the gist of the present disclosure, the detailed description will be omitted. When "including," "having," "consisting," etc. are used in the present disclosure, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes the case where it includes the plural unless otherwise explicitly stated.
[0019] When interpreting the components included in various embodiments of the present disclosure, it is understood that a margin of error is included even if there is no explicit description to the contrary.
[0020] In describing various embodiments of the present disclosure, when describing a positional relationship between two parts, for example, using "on," "on top," "on bottom," "next to," etc., one or more other parts may be located between the two parts, unless "directly" or "directly" is used.
[0021] In describing various embodiments of the present disclosure, when describing a temporal relationship, for example, when a temporal precedence / subsequence relationship is described using "after," "following," "next to," "before," etc., cases that are not consecutive may also be included unless "immediately" or "directly" is used.
[0022] In describing various embodiments of the present disclosure, the terms "first", "second", and the like may be used to describe various components, but these terms are only used to distinguish between identical and similar components. Therefore, a component modified as "first" in the present disclosure may be the same as a component modified as "second" within the technical spirit of the present disclosure, unless otherwise specified.
[0023] The features of each of the various embodiments of the present disclosure may be partially or wholly combined or combined with one another, may be technically interlocked and driven in various ways, and each of the various embodiments may be implemented independently of one another or may be implemented together in conjunction with one another.
[0024] Hereinafter, a light-emitting display device and a manufacturing method thereof according to the present disclosure will be described with reference to the drawings.
[0025] FIG. 1 is a block diagram illustrating a light emitting display device according to an embodiment of the present invention.
[0026] As shown in FIG. 1, an organic light emitting display device 1000 according to an embodiment of the present invention may include a display panel 11, an image processor 12, a timing controller 13, a data driver 14, a scan driver 15, and a power supply 16.
[0027] The display panel 11 may display an image in response to a data signal DATA provided by a data driver 14 , a scan signal provided by a scan driver 15 , and power provided by a power supply 16 .
[0028] The display panel 11 may include sub-pixels SP arranged at each intersection region between a plurality of gate lines GL and a plurality of data lines DL. The structure of the sub-pixels SP may be variously changed depending on the type of the light emitting display device 1000.
[0029] For example, the subpixel SP may be formed in a top emission mode, a bottom emission mode, or a dual emission mode depending on the structure. The subpixel SP means a unit that emits its own color with or without a specific type of color filter. For example, the subpixel SP may include a red subpixel, a green subpixel, and a blue subpixel. Alternatively, the subpixel SP may include a red subpixel, a blue subpixel, a white subpixel, and a green subpixel, as an example. The subpixel SP may have one or more other emission areas depending on the emission characteristics. For example, a subpixel that emits a color different from the blue subpixel may have a different emission area.
[0030] One or more subpixels SP may form one unit pixel. For example, one unit pixel may include red, green, and blue subpixels, and the red, green, and blue subpixels may be arranged repeatedly. Alternatively, one unit pixel may include red, green, blue, and white subpixels, and the red, green, blue, and white subpixels may be arranged repeatedly, or the red, green, blue, and white subpixels may be arranged as a quad type. The color type, arrangement type, arrangement order, etc. of the subpixels in the embodiments according to the present disclosure may be configured in various forms depending on the light emitting characteristics, the life of the element, the specifications of the device, etc., but are not limited thereto.
[0031] The display panel 11 may be divided into a display area (AA: within the dotted line area) where the sub-pixels SP are arranged to display an image, and a non-display area NA around the display area AA. The scan driver 15 may be mounted in the non-display area NA of the display panel 11. The non-display area NA may also include a pad section PAD including pad electrodes PD.
[0032] Here, the display area AA is also called an active area, and the non-display area NA is also called an inactive area.
[0033] The video processor 12 may output a data enable signal DE together with a data signal DATA supplied from the outside. The video processor 12 may output one or more of a vertical sync signal, a horizontal sync signal, and a clock signal in addition to the data enable signal DE, but these signals are omitted from the drawings for convenience of explanation.
[0034] The timing controller 13 may receive a data signal DATA together with the driving signal from the image processor 12. The driving signal may include a data enable signal DE. Alternatively, the driving signal may include a vertical sync signal, a horizontal sync signal, and a clock signal. The timing controller 13 outputs a data timing control signal DDC for controlling the operation timing of the data driver 14 and a gate timing control signal GDC for controlling the operation timing of the scan driver 15 based on the driving signal.
[0035] The data driver 14 may sample and latch the data signal DATA provided from the timing controller 13 in response to a data timing control signal DDC provided from the timing controller 13, convert the data signal DATA into a gamma reference voltage, and output the voltage.
[0036] The data driver 14 may output a data signal DATA through the data line DL. The data driver 14 may be implemented in the form of an integrated circuit (IC). For example, the data driver 14 may be electrically connected to a pad electrode PD disposed in the non-display area NA of the display panel 11 via a flexible circuit film (not shown).
[0037] The scan driver 15 may output a scan signal in response to a gate timing control signal GDC provided from the timing controller 13. The scan driver 15 may output a scan signal through a gate line GL. The scan driver 15 may be implemented in the form of an integrated circuit (IC) or in the display panel 11 in a gate in panel (GIP) manner.
[0038] The power supply unit 16 may output a high potential voltage, a low potential voltage, etc. for driving the display panel 11. The power supply unit 16 may supply a high potential voltage to the display panel 11 via a first power supply line EVDD (a driving power supply line or a pixel power supply line) and may supply a low potential voltage to the display panel 11 via a second power supply line EVSS (an auxiliary power supply line or a common power supply line).
[0039] The display panel 11 is divided into a display area AA and a non-display area NA, and may include a plurality of sub-pixels SP defined by gate lines GL and data lines DL that are intersecting with each other and formed in a matrix in the display area AA.
[0040] The sub-pixels SP may include sub-pixels that emit at least two of red, green, blue, yellow, magenta, and cyan light. In addition, the sub-pixels SP may be formed with a specific type of color filter or may emit their own color without a color filter. However, the present invention is not necessarily limited thereto, and the sub-pixels SP may be configured in various forms in terms of color type, arrangement type, arrangement order, etc., depending on the light-emitting characteristics, element life, device specifications, etc.
[0041] Each of the sub-pixels SP may include a light-emitting portion from which light is emitted and a non-light-emitting portion surrounding the light-emitting portion.
[0042] The configuration of the light-emitting portion and the non-light-emitting portion of the display area will be described below with reference to the drawings.
[0043] FIG. 2 is a cross-sectional view showing a light emitting display device according to an embodiment of the present invention.
[0044] As shown in FIG. 2, the light emitting display device according to the first embodiment of the present invention includes a plurality of anodes 210 spaced apart from each other on a substrate 100, an auxiliary electrode 205 located between adjacent anodes among the plurality of anodes, a bank 150 having a bank hole LOP exposing the light emitting portion EM of the plurality of anodes and exposing a portion of the auxiliary electrode, a bank protection pattern PP provided on the bank side surrounding the bank hole LOP and on the bank 150 around the bank hole LOP, an intermediate layer 220 provided on the light emitting portion EM and the bank 150, and a cathode 230 connected to the auxiliary electrode 205 within the bank hole LOP.
[0045] The anode 210, the intermediate layer 220, and the cathode 230 laminated in each light emitting portion EM form a light emitting element ED.
[0046] The anode 210 is provided for each light emitting unit EM and connected to the thin film transistor TFT at the bottom, and may be divided and operated for each light emitting unit EM by receiving a driving signal. The cathode 230 is continuously formed over the light emitting unit EM. The cathode 230 of the light emitting display device of the present invention is connected to a power supply unit (16 in FIG. 1) in the non-display area NA, and may be connected to a common power line or an auxiliary power line provided in the non-display area NA to apply an electric signal, and may also be connected to an auxiliary electrode 205 provided in an area overlapping with the bank 150 in the display area AA to apply a common voltage or a low potential voltage. This can prevent the phenomenon that brightness unevenness occurs as the distance from the power supply unit in a large-area light emitting display device, and can adjust the brightness uniformly throughout the display area AA.
[0047] A non-overlapping portion between the bank 150 and the anode 210 is defined as a light emitting portion EM. The bank 150 has a bank hole LOP therein, exposing the auxiliary electrode 205, and the cathode 230 enters through the bank hole LOP and is connected to the auxiliary electrode 205. Here, the side surface BLS of the bank 150 surrounding the bank hole LOP and the top surface BTS of the bank 150 are not directly connected to the cathode 230, and a protective pattern PP is positioned thereon to prevent the influence of outgassing due to the exposure of the bank 150.
[0048] The banks 150 may be made of an organic insulating material and have a certain height. The banks 150 may have a height of about 1 μm to 5 μm and may be located between the light emitting portions EM to divide the regions according to the difference in the height of the banks 150.
[0049] The bank 150 may be made of at least one of organic materials such as polyimide, polyamide, and acrylate resin. In the light emitting display device of the present invention, the bank 150 is made of an organic material, and the auxiliary electrode 205 overlapping the bank 150 is exposed after the bank 150 and the intermediate layer OS are formed. When the auxiliary electrode 205 is exposed, a bank protection pattern PP may be further formed on the side and / or upper surface of the bank 150 that is exposed together, to prevent outgassing, which is the release of carbon-based components due to aging after the bank exposure, from affecting the intermediate layer OS.
[0050] The intermediate layer 220, which is located between the opposing anode 210 and cathode 230 of the light-emitting element ED, has a stack configuration including at least one light-emitting layer and at least one common layer. As an example, the stack forming the intermediate layer 220 may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. In another example, the intermediate layer 220 may include a plurality of stacks, and a charge generation layer may be included between the stacks. Each stack may include a hole transport layer, a light-emitting layer, and an electron transport layer.
[0051] The light emitting layer included in the intermediate layer 220 may include light emitting layers that emit different colors for each light emitting unit EM. Alternatively, as another example, the light emitting layer included in the intermediate layer 220 may include overlapping light emitting layers that emit different colors. When the intermediate layer 220 includes light emitting layers that emit different colors, the light emitting display device may further include a color filter on the exit side to express colors.
[0052] In the light-emitting display device of the present invention, the intermediate layer 220 is surrounded by the bank protection pattern PP in the area overlapping with the bank 150, and thus is not in direct contact with the bank 150. This prevents outgassing from the side of the bank exposed when forming the bank hole LOP in the bank 150 for connecting the auxiliary electrode 205 and the cathode 230 from affecting the intermediate layer 220.
[0053] Meanwhile, the bank protection pattern PP may include a first protection pattern 215 located on the top surface BTS of the bank 150, and a second protection pattern 225 formed across the bank side surface BLS surrounding the bank hole LOP and the top surface and side surface of the intermediate layer 220 on the bank.
[0054] The first protection pattern 215 and the second protection pattern 225 may overlap the top surface BTS of the bank 150 and be located under and over the intermediate layer 220 .
[0055] The bank protection pattern PP may include both the first protection pattern 215 and the second protection pattern 225, or may include only some of them. Even if only one of them is included, it is possible to protect the intermediate layer 220 and the cathode 230 from deformation of the bank 150 that occurs when the bank hole LOP is formed. Including the second protection pattern 225 provided at least on the side of the bank hole LOP in the bank protection pattern PP may be more effective in protecting the intermediate layer 220 from deformation of the bank 150.
[0056] The bank protection pattern PP is located on the top surface BTS and side surface BLS of the bank 150 to protect the intermediate layer 220 and the cathode 230, and may be made of an inorganic insulating material having a protective property against outgassing made of a carbon compound. For example, the bank protection pattern PP may be made of materials such as silicon nitride film (SiNx), silicon oxide film (SiOx), silicon oxynitride film (SiOxNy), and aluminum oxide film (Al2O3). The first protection pattern 215 and the second protection pattern 225 of the bank protection pattern PP may be made of the same or different materials from a group of inorganic insulating materials. In addition, the bank protection pattern PP is preferably made of an inorganic insulating material to prevent electrical influence at a contact portion with the cathode 230.
[0057] Meanwhile, in recent years, light emitting display devices have been applied to applications in extremely cold or hot outdoor environments, so the bank protection pattern PP may contain an ultraviolet ray shielding material to protect the inside of the light emitting display device against ultraviolet rays in outdoor environments. For example, the bank protection pattern PP may be an oxide film or a nitride film containing at least one of zinc, silicon, titanium, and tantalum. The bank protection pattern PP containing such an ultraviolet ray shielding component surrounds the inner intermediate layer 220 in the area overlapping with the bank 150, and may stabilize the intermediate layer 220 by preventing deformation of the bank 150 due to ultraviolet rays and preventing outgassing of the bank.
[0058] The first protection pattern 215 and the second protection pattern 225 formed in different processes may overlap with each other at a portion where the bank side surface BLS surrounding the bank hole LOP and the bank top surface BTS are in contact with each other.
[0059] Meanwhile, in the light emitting display device of the present invention, the auxiliary electrode 205 may be located in the same layer as the anode 210. Also, the auxiliary electrode 205 may be formed of the same material as the anode 210. Therefore, the auxiliary electrode 205 and the anode 210 can be formed in the same process, and there is no need to use an additional metal for the connection structure in the display area AA of the cathode 230, and no additional material or mask is required for the auxiliary electrode 205. Therefore, in the light emitting display device of the present invention, since the auxiliary electrode 205 is located in the non-emitting portion, there is no need to adjust the area occupied by the light emitting portion to include the auxiliary electrode 205, and the aperture ratio can be maintained and the brightness of the entire light emitting display device can be improved.
[0060] A capping layer may be further provided on the cathode 230 of the light emitting device ED to protect the light emitting device ED and to enhance the light output effect. Also, a sealing layer 300 may be further provided on the upper part of the light emitting device ED to protect the light emitting device ED from external air and moisture.
[0061] A thin film transistor (TFT) connected to the anode 210 will now be described.
[0062] The thin film transistor (TFT) may include a semiconductor layer 103, a gate electrode 104 overlapping with a channel of the semiconductor layer 103 via a gate insulating film 107, and a source electrode 105 and a drain electrode 106 respectively connected to both sides of the semiconductor layer 103. The drain electrode 106 of the thin film transistor TFT may be connected to the anode 210 of the light-emitting element ED via a first contact hole CT1 penetrating the planarization film 108 and the protective film 109.
[0063] In some cases, the source electrode 105 of a thin film transistor (TFT) may be connected to the anode 210 .
[0064] A light-shielding layer 101 may be further provided below the semiconductor layer 103 to prevent the semiconductor layer 103 from being affected by light incident on the substrate 100 from below the substrate 100 .
[0065] A buffer layer 102 is provided between the light-shielding layer 101 and the semiconductor layer 103 , and the buffer layer 102 may be provided over the entire area of the substrate 100 to cover the light-shielding layer 101 .
[0066] The semiconductor layer 103 may include at least one of an oxide semiconductor, amorphous silicon, and crystalline silicon.
[0067] The illustrated example of a thin film transistor (TFT) has a coplanar structure in which the gate electrode 104, source electrode 105, and drain electrode 106 are on the same plane, but the present invention is not limited thereto. For example, the thin film transistor may be a bottom gate in which the gate electrode is located at the bottom of the semiconductor layer, or a top gate in which the gate electrode is located at the top of the semiconductor layer. In addition, the gate electrode, source electrode, and drain electrode of the thin film transistor may be located on different planes, i.e., different layers.
[0068] In some cases, the semiconducting layer 103 may further include a conductive layer in the portion that contacts the source electrode 105 and the drain electrode 106 .
[0069] The planarization film 108 is provided for planarization, and may be made of at least one organic material such as photo acryl, polyimide, benzo cyclobutene resin, and acrylate resin.
[0070] An anode 210 and an auxiliary electrode 205 may be formed in contact with the flat upper surface of the planarizing film 108 .
[0071] The anode 210 (pixel electrode or first electrode) and the auxiliary electrode 205 may be formed of a metal, its alloy, or a combination of a metal and a metal oxide. For example, in the case of a top emission type, the anode 210 and the auxiliary electrode 205 may be formed of a multi-layer structure including a transparent conductive film and an opaque conductive film with high reflectivity. The transparent conductive film of the anode 210 and the auxiliary electrode 205 may be made of a material with a relatively large work function value such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the opaque conductive film may be made of a single layer or multiple layers of one of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), or tungsten (W), or an alloy thereof. For example, the anode 210 may be formed in a structure in which a transparent conductive film, an opaque conductive film, and a transparent conductive film are sequentially laminated, or may be formed in a structure in which a transparent conductive film and an opaque conductive film are sequentially laminated. In some cases, when the anode 210 is a multilayer film, the auxiliary electrode 205 may be formed of only a part of the multilayer film. The auxiliary electrode 205 is directly connected to the cathode 230, and the auxiliary electrode 205 may be composed of only an opaque conductive film with high conductivity or a reflective electrode.
[0072] The cathode 230 may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or may be made of silver (Ag), aluminum (Al), magnesium (Mg), calcium (Ca), ytterbium (Yb), or an alloy containing at least one of them, having a thickness thin enough to transmit light.
[0073] As shown in FIG. 2, the auxiliary electrode 205 may be connected to a common power line VSSL formed in the same layer as at least one electrode of the thin film transistor TFT via a second contact hole CT2 penetrating the planarization film 108 and the protective film 109.
[0074] The common power supply line VSSL may extend to the non-display area NA of the substrate 100 and be connected to a power supply unit, and may be supplied with a low potential voltage.
[0075] The entire structure from the substrate 100 to the planarization film 108 of the light-emitting element ED may be referred to as a thin film transistor array substrate 800 since it includes thin film transistors. Although Fig. 2 shows only a single thin film transistor TFT for each light-emitting unit ED, the light-emitting display device of the present invention is not limited to this, and may include a plurality of thin film transistors and at least one capacitor for each sub-pixel for driving the circuit. The thin film transistor array substrate 800 includes a plurality of thin film transistors and a capacitor provided for each sub-pixel.
[0076] The buffer layer 102, the gate insulating film 107, and the protective film 109 between the light-shielding layer 101 and the semiconductor layer 103 in the thin film transistor array substrate 800 may be formed of an inorganic insulating layer. Examples of the inorganic insulating layer may include a silicon oxide film, a silicon nitride film, a silicon oxynitride film, a metal oxide film, and the like.
[0077] The planarization film 108 is made of an organic insulating material, and may be made of at least one of organic materials such as photo acryl, polyimide, benzo cyclobutene resin, and acrylate resin.
[0078] The light emitting element ED may be provided on a thin film transistor array substrate 800 .
[0079] In the light-emitting display device of the present invention, the formation of the bank 150 for defining the light-emitting portion EM of the anode 210 and the formation of the bank hole LOP for exposing a part of the auxiliary electrode 205 overlapping with the bank 150 may be performed simultaneously or in different steps. A structure in which the formation of the bank 150 and the formation of the bank hole LOP are performed in different steps will be described later together with the method.
[0080] The first protection pattern 215 of the bank protection pattern PP is provided along the upper surface BTS of the bank before the formation of the bank hole LOP, and is in contact with the upper surface BTS of the bank. The second protection pattern 225 of the bank protection pattern PP is formed after the intermediate layer 220 is formed and the height of the bank 150 corresponding to the bank hole LOP is removed. The second protection pattern 225 is formed in contact with the side surface BLS of the bank 150 that surrounds the bank hole LOP together with the upper surface and side surface of the intermediate layer 220.
[0081] FIG. 3 is a plan view showing the light emitting display device according to the first embodiment of the present invention.
[0082] As shown in FIG. 3, the light emitting display device 1000 according to the first embodiment of the present invention includes first to third light emitting sections EM1, EM2, and EM3 that emit different colors, and may have a bank protection pattern PP between adjacent light emitting sections EM1 that emit the same color.
[0083] The light emitting units EM1, EM2, and EM3 may be light emitting units that emit, for example, blue, green, and red light. However, the present invention is not limited to this, and as long as the first to third light emitting units EM1, EM2, and EM3 can be combined to emit white light, a combination of light emitting units of other colors may also be used. As another example, the first to third light emitting units EM1, EM2, and EM3 may be cyan, magenta, and yellow light emitting units, respectively.
[0084] Meanwhile, the light-emitting units EM1, EM2, and EM3 may be the same size or different sizes. In the example shown in Fig. 3, the first light-emitting unit EM1 is the largest, and the second and third light-emitting units EM2 and EM3 are smaller than the first light-emitting unit EM1, and one first light-emitting unit EM1 is adjacent to the second and third light-emitting units EM2 and EM3. The first light-emitting unit EM1 may be a color light-emitting unit with a lower light-emitting efficiency in the same area, and may occupy a larger area in the light-emitting display device 1000 to compensate for the difference in relative efficiency between the first light-emitting unit EM1 and the second and third light-emitting units EM2 and EM3.
[0085] The first to third light emitting units EM1, EM2, and EM3 may be provided with first to third anodes 210a, 210b, and 210c, respectively. The first to third anodes 210a, 210b, and 210c extend from the entirety of each light emitting unit EM1, EM2, and EM3 and the very end of the light emitting unit to partially overlap with the bank 150 of the non-light emitting unit. In this case, the first to third anodes 210a, 210b, and 210c are separated from each other, connected to the lower thin film transistors (TFTs) described in FIG. 2, and driven independently.
[0086] 3, the light emitting display device 1000 according to the first embodiment of the present invention illustrates an example in which a connection portion CTA between the auxiliary electrode 205 and the cathode 230 is provided between light emitting portions EM1 having the same color. This is just one example, and the light emitting display device of the present invention is not limited to this, and may also be provided between light emitting portions having different colors. Furthermore, in addition to between the first light emitting portions EM1, there may also be a connection between the auxiliary electrode 205 and the cathode 230 between the second light emitting portions EM2 and / or between the third light emitting portion EM3.
[0087] The bank hole LOP exposes a portion of the auxiliary electrode 205, and a bank protection pattern PP is positioned on the side and top of the bank 150 around the bank hole LOP to prevent outgassing caused by the exposure of the bank from being transmitted to the intermediate layer 220 and the cathode 230 when the bank hole LOP is formed.
[0088] The ends of the bank protection pattern PP may contact the anodes 210:210a, 210b, 210c located at the edges of the light emitting portions EM1, EM2, EM3 in order to completely protect the bank 150 around the bank hole LOP, as shown in Figures 2 and 3.
[0089] Some of the adjacent first light-emitting units EM1 emitting light of the same color in FIG. 3 and the area on line I-I' passing between them may correspond to the area shown in FIG.
[0090] However, the light emitting display device of the present invention is not limited to this. Bank holes and bank protection patterns around the bank holes may also be formed between light emitting parts that emit light of other colors, as described below.
[0091] FIG. 4 is a plan view showing a light emitting display device according to a second embodiment of the present invention.
[0092] As shown in FIG. 4, the light-emitting display device 2000 according to the second embodiment of the present invention has a bank protection pattern PP on the top and side surfaces of the bank hole LOP and the peripheral bank 350 of the bank hole LOP between adjacent first and second light-emitting sections EM1 and EM2, and between the first and third light-emitting sections EM1 and EM3.
[0093] 2, since the intermediate layer 220 is removed from the bank hole LOP, the light emitting display device 2000 according to the second embodiment of the present invention has discontinuities in the intermediate layer 220 between the first light emitting unit EM1 and the second light emitting unit EM2 and between the first light emitting unit EM1 and the third light emitting unit EM3. Therefore, by providing the common layer, discontinuities in the intermediate layer 220 are generated, and the common layers between the adjacent first light emitting unit EM1 and the second light emitting unit EM2 and between the first light emitting unit EM1 and the third light emitting unit EM3 are differentiated from each other, thereby preventing leakage current caused by the common layer.
[0094] For example, in the case where the first light-emitting unit EM1 is a blue light-emitting unit, the second light-emitting unit EM2 is a green light-emitting unit, and the third light-emitting unit EM3 is a red light-emitting unit, when the first light-emitting unit EM1 has a high turn-on voltage and the second and third light-emitting units EM2 and EM3 have low turn-on voltages, the second and third light-emitting units EM2 and EM3 in the off state may emit weak light in the selective turn-on state of the first light-emitting unit EM1, which may cause color leakage. Such color leakage may be noticeable due to a common layer having a high mobility in the first to third light-emitting units EM1, EM2, and EM3. In the light-emitting display device 2000 according to the second embodiment of the present invention, the bank holes LOP of the bank 350 are positioned between the first light-emitting unit EM1 and the second light-emitting unit EM2, which emit different colors, and between the first light-emitting unit EM1 and the third light-emitting unit EM3, and when the bank holes LOP are formed, the intermediate layer 220 corresponding to the bank holes LOP is removed together with the removal of the bank 150, thereby eliminating the cause of the leakage current flowing horizontally. Therefore, the light emitting display device 2000 according to the second embodiment of the present invention not only solves the problem of uneven brightness in the display area AA caused by the connection between the auxiliary electrode 205 and the cathode 230, but also prevents side leakage current between adjacent light emitting portions.
[0095] The light emitting display device 2000 according to the second embodiment of the present invention may be capable of patterning an intermediate layer between adjacent color light emitting units, thereby preventing leakage current between the adjacent color light emitting units.
[0096] A method for producing a light-emitting display device according to the present invention will now be described.
[0097] 5A to 5E are cross-sectional views illustrating steps in a method for manufacturing a light-emitting display device according to the present invention.
[0098] First, a thin film transistor array substrate 800 including a thin film transistor TFT is formed on the substrate 100 described with reference to FIG.
[0099] The top surface on the thin film transistor array substrate 800 may be a planarization film (see 108 in FIG. 2).
[0100] As shown in Fig. 5A, a plurality of anodes 210 spaced apart from each other and an auxiliary electrode 205 between adjacent anodes of the plurality of anodes are formed on a thin film transistor array substrate 800. The anodes 210 and the auxiliary electrodes 205 may be formed by patterning an opaque conductive film having high reflectivity. Alternatively, when the anodes 210 and the auxiliary electrodes 205 are formed in a multi-layer structure, they may be formed in a multi-layer structure including a transparent conductive film and an opaque conductive film having high reflectivity. The transparent conductive film of the anode 210 and the auxiliary electrode 205 is made of a material having a relatively large work function value, such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the opaque conductive film may be made of a single layer or multiple layers of any one selected from the group consisting of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), or tungsten (W), or an alloy thereof. For example, the anode 210 may be formed in a structure in which a transparent conductive film, an opaque conductive film, and a transparent conductive film are sequentially laminated, or in a structure in which a transparent conductive film and an opaque conductive film are sequentially laminated.
[0101] In some cases, when the anode 210 is a multilayer film, the auxiliary electrode 205 may be formed of only a part of the multilayer film. The auxiliary electrode 205 is directly connected to the cathode 230, and the auxiliary electrode 205 may be composed of only an opaque conductive film with high conductivity or a reflective electrode.
[0102] Next, a bank film 150A is formed so as to cover the entire auxiliary electrode 205, so that its edge portion overlaps the very edge of the adjacent anode 210 and so that the light emitting portion EM of the anode 210 is exposed.
[0103] A mask 400 having a first opening OP1 exposing the bank film 150A and a light-shielding portion SH1 corresponding to the light-emitting portion of the anode 210 is placed on the thin film transistor array substrate 800, and a protective pattern material is deposited on the upper surface BTS of the bank film 150A to form a first protective pattern film 215A. In this case, the first protective pattern film 215A covers the surface of the bank film 150A and prevents the intermediate layer 220, which is formed later, from directly contacting the bank film 150A, thereby preventing the influence of outgassing caused by exposure of the bank film 150A during the selective removal process of the bank film 150A.
[0104] 5b, an intermediate material layer 220A is formed continuously on the light emitting portion EM and the non-light emitting portion NEM. The intermediate material layer 220A contacts the light emitting portion EM of the anode 210, and contacts the first protective pattern film 215A in the region overlapping with the bank film 150A.
[0105] The intermediate material layer 220A includes at least one stack, and the stack includes at least one light-emitting layer and at least one common layer. The common layer is formed by an open mask, and at least the common layer of the intermediate material layer 220A is provided not only in the light-emitting portion EM but also in the non-light-emitting portion NEM. The light-emitting layer included in the intermediate material layer 220A may also be provided in both the light-emitting portion EM and the non-light-emitting portion NEM in some cases.
[0106] 5c, the intermediate layer 220A, the first protection pattern film 215A, and the bank film 150A are removed to expose a portion of the auxiliary electrode 205, thereby forming the bank 150 having the bank hole LOP. This removal process may be performed by, for example, laser irradiation.
[0107] After forming the bank hole LOP in the bank 150, the side surface BLS of the bank surrounding the bank hole LOP may be exposed. The intermediate material layer is formed as an intermediate layer 220 having a discontinuity between adjacent light emitting portions by removing a portion corresponding to the bank hole LOP.
[0108] Next, as shown in FIG. 5D, a second mask 410 having a first light-shielding portion SH2 corresponding to the light-emitting portion EM, a second light-shielding portion SH3 corresponding to the bank hole LOP, and a second opening OP2 corresponding to the exposed bank 150 is placed on the thin film transistor array substrate 800, and then a protective pattern material is deposited through the second opening OP2 to form a second protective pattern 225.
[0109] Here, the second protection pattern 225 is formed on the upper surface of the intermediate layer 220 overlapping the bank 150, the side surface of the intermediate layer 220 surrounding the bank hole LOP, and the bank side surface BLS.
[0110] Next, a cathode 230 (a second electrode or a common electrode) is formed on the intermediate layer 220, similar to FIG. 5E.
[0111] The cathode 230 is formed using an open mask, and is located on the light emitting portion EM in contact with the intermediate layer 220, and is in direct contact with the auxiliary electrode 205 in the bank hole LOP.
[0112] In addition, the bank side surface BLS and the bank top surface BTS around the bank hole LOP are separated from the bank 150 by the second protective pattern 225 without directly contacting the bank 150, and even if the bank is deformed due to laser irradiation in the process of Figure 5C and outgassing occurs, the second protective pattern 225 blocks it and protects the intermediate layer 220 and the protective pattern 225.
[0113] The anode 210, the intermediate layer 22 and the cathode 230 stacked in the light emitting portion EM form a light emitting element ED.
[0114] A sealing layer 300 is provided on the light emitting element EM for protection.
[0115] The sealing layer 300 may be formed, for example, by alternating inorganic sealing films and organic sealing films.
[0116] The light emitting display device of the present invention includes an auxiliary electrode overlapping with the bank, and a process of removing the structure on the auxiliary electrode before forming the cathode exposes a portion of the auxiliary electrode, and the cathode and the auxiliary electrode are directly connected to each other. Therefore, by providing a portion where the cathode and the auxiliary electrode are connected in the active region (display region), it is possible to improve the voltage uniformity of the cathode and prevent a decrease in brightness.
[0117] In addition, in the light emitting display device of the present invention, a bank protection pattern may be formed on a side surface of the bank surrounding the bank hole and on the bank in the bank hole formed to expose the auxiliary electrode, thereby preventing an out gap caused by exposure of the bank.
[0118] In the light-emitting display device of the present invention, the upper and side surfaces of the bank before the intermediate layer is formed are covered with a bank protection pattern, preventing the intermediate layer to be formed thereafter from being directly connected to the bank layer, preventing deterioration of the bank due to exposure, and maintaining a non-contact state between the intermediate layer and the bank, thereby preventing damage to the intermediate layer due to bank out-gassing. This makes it possible to prevent the light-emitting portion of the sub-pixel from shrinking due to the influence of out-gassing, and improve the reliability of the light-emitting display device.
[0119] In the light emitting display device of the present invention, the bank protection pattern can be made of a transparent inorganic insulating film used in the display device field, and a reliable light emitting display device can be manufactured without adding additional materials, which has the advantages of being environmentally friendly, low power consumption, and process optimization, and has an ESG (Environment / Social / Governance) effect.
[0120] Furthermore, when the light-emitting display device of the present invention has a bank hole between light-emitting sections that emit different colors, the intermediate layer can be removed from the bank hole during the process of forming the bank hole, making it possible to pattern the intermediate layer between adjacent color-emitting sections, thereby preventing leakage current between adjacent color-emitting sections.
[0121] An light emitting display device according to one embodiment of the present invention may include a plurality of anodes spaced apart from each other on a substrate, auxiliary electrodes positioned between adjacent ones of the plurality of anodes, a bank having bank holes exposing light emitting portions of the plurality of anodes, a bank protection pattern provided on a side of the bank surrounding the bank hole and on the bank around the bank hole, and a cathode connected to the auxiliary electrode within the light emitting portion and the bank, and an intermediate layer provided on the bank, and the bank hole.
[0122] The bank protection pattern may include a first protection pattern in contact with the top surface of the bank around the bank hole, and a second protection pattern in contact with an intermediate layer on the bank and a side surface of the bank surrounding the bank hole.
[0123] The first and second protective patterns may meet each other at a portion where a side surface of a bank surrounding a bank hole and an upper surface of the bank contact each other.
[0124] The first and second protective patterns may overlap the upper surface of the bank and be located at the bottom and top of the intermediate layer.
[0125] The bank protection pattern may be an inorganic insulating film.
[0126] The bank protection pattern may include an ultraviolet light blocking component.
[0127] The edge of the intermediate layer on the auxiliary electrode may be disposed on the bank surrounding the bank hole.
[0128] The intermediate layer overlapping the bank may be surrounded by a bank protection pattern.
[0129] Multiple anodes and auxiliary electrodes may be disposed in the same layer.
[0130] In the portion where the cathode and the bank overlap each other, a bank protection pattern may be disposed between the cathode and the bank.
[0131] A manufacturing method of a light emitting display device according to one embodiment of the present invention may include a first step of forming a plurality of anodes spaced apart from each other on a substrate, a second step of forming an auxiliary electrode between adjacent ones of the plurality of anodes, a third step of forming a bank exposing light emitting portions of the plurality of anodes, a fourth step of forming a first protective pattern on the bank, and a fifth step of forming an intermediate layer and a cathode overlapping the first protective pattern.
[0132] The fifth step may include the steps of: after forming the intermediate layer, removing the intermediate layer, the first protective pattern, and the bank to expose a portion of the auxiliary electrode, thereby forming a bank hole; forming a second protective pattern on the intermediate layer overlapping with the side surfaces of the bank surrounding the bank hole and the side surfaces of the intermediate layer; and forming a cathode on the intermediate layer, connecting to the auxiliary electrode within the bank hole and overlapping with the second protective pattern on the bank.
[0133] On the other hand, the present invention described above is not limited to the above-mentioned embodiments and accompanying drawings, and it will be apparent to those skilled in the art to which the present invention pertains that various substitutions, modifications and changes are possible within the scope not departing from the technical idea of the present invention. [Explanation of symbols]
[0134] 100 boards 101 light shielding layer 102 Buffer Layer 103 Semiconductor layer 104 gate electrode 105 source electrode 106 Drain electrode 107 Gate insulating film 108 planarization film 109 Protective film 150 Banks 205 auxiliary electrode 210 Anode 215 First Protection Pattern 220 Middle Class 225 Second Protection Pattern 230 cathode PP protection pattern EM light emitting part LOP Bank Hall 300 Sealing Layers ED light emitting element 800 Thin Film Transistor Array Substrate 1000, 2000 Light emitting display device
Claims
1. a plurality of spaced anodes on a substrate; an auxiliary electrode disposed between adjacent anodes among the plurality of anodes; a bank exposing light emitting portions of the plurality of anodes, the bank having a bank hole exposing a portion of the auxiliary electrode; a bank protection pattern disposed on a bank side surface surrounding the bank hole and on the bank around the bank hole; an intermediate layer disposed on the light-emitting portion and the bank; and A cathode connected to the auxiliary electrode in the bank hole. Including, The bank protection pattern is a first protection pattern in contact with an upper surface of the bank around the bank hole; the intermediate layer on the bank and a second protection pattern in contact with a side surface of the bank surrounding the bank hole.
2. A plurality of anodes spaced apart from one another on a substrate; an auxiliary electrode disposed between adjacent anodes among the plurality of anodes; a bank exposing light emitting portions of the plurality of anodes, the bank having a bank hole exposing a portion of the auxiliary electrode; a bank protection pattern disposed on a bank side surface surrounding the bank hole and on the bank around the bank hole; an intermediate layer disposed on the light-emitting portion and the bank; and A cathode connected to the auxiliary electrode in the bank hole. Including, the intermediate layer overlapping the bank is surrounded by the bank protection pattern.
3. The light emitting display device of claim 1 , wherein the first protection pattern and the second protection pattern meet each other in a region where a side surface of the bank surrounding the bank hole meets an upper surface of the bank.
4. The light emitting display device of claim 1 , wherein the first and second protection patterns overlap an upper surface of the bank and are positioned below and above the intermediate layer.
5. The light-emitting display device according to claim 1 , wherein the bank protection pattern is an inorganic insulating film.
6. The light-emitting display device according to claim 1 , wherein the bank protection pattern comprises an ultraviolet ray blocking component.
7. The light-emitting display device according to claim 1 , wherein an edge of the intermediate layer on the auxiliary electrode is disposed on the bank surrounding the bank hole.
8. The light-emitting display device according to claim 1 , wherein the plurality of anodes and the auxiliary electrode are disposed in the same layer.
9. The light-emitting display device according to claim 1 , wherein the bank protection pattern is disposed between the cathode and the bank in a portion where the cathode and the bank overlap each other.
10. forming a plurality of spaced apart anodes on a substrate; forming auxiliary electrodes between adjacent anodes among the plurality of anodes; forming a bank exposing light emitting portions of the plurality of anodes; forming a first protection pattern over the bank; forming an intermediate layer overlapping the first protection pattern; removing the intermediate layer, the first protection pattern, and the bank to expose a portion of the auxiliary electrode, thereby forming a bank hole; forming a second protection pattern on a side surface of the bank surrounding the bank hole and a side surface of the intermediate layer, and on the intermediate layer overlapping the bank; and forming a cathode on the intermediate layer and the second protection pattern; The method for manufacturing a light-emitting display device includes the steps of:
11. A method for manufacturing a light-emitting display device as described in claim 10, wherein in forming the second protective pattern, the second protective pattern covers the intermediate layer in an area overlapping with the bank.
12. The forming of the cathode includes a step of connecting the cathode to the auxiliary electrode within the bank hole. The method for manufacturing a light-emitting display device according to claim 10 ,
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