Molding die, resin molding apparatus, and method for manufacturing resin molded product

Abstract

To provide a mold, a resin molding apparatus, and a method for manufacturing a resin molding capable of preventing resin leakage.SOLUTION: A mold 1000 used for compression molding has a first mold 200 and a second mold 100 disposed opposite to each other. The first mold 200 is provided with a mold main surface member 202 that constitutes a main surface that becomes a bottom surface or an upper surface of a mold cavity 204, and a mold side surface member 201 that constitutes a side surface of the mold cavity 204. The mold cavity 204 is formed by a space surrounded by the mold main surface member 202 and the mold side surface member 201. A resin material 20 can be accommodated in the mold cavity 204. The mold side surface member 201 is vertically movable relative to the mold main surface member 202. Elastic members 203a and 203b are disposed on an opposite side to a side facing the second mold 100 of the mold side surface member 201. The elastic members 203a and 203b are disposed so that a state in which a force is applied along an outer periphery of a planar shape of the mold cavity 204 can be partially varied.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a mold, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background Art

[0002] Compression molding is widely used as one of the resin molding methods. As one of its problems, Non-Patent Document 1 describes that the foaming resin material used in compression molding protrudes from the molded product and causes resin leakage.

Prior Art Documents

Patent Documents

[0003]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Non-Patent Document 1 describes that resin leakage occurs with a powdery resin material, but there is also a possibility that the same problem of resin leakage may occur with a liquid resin material that is liquid at room temperature. In the case of a liquid resin material, the viscosity of the heated liquid resin decreases, the resin foams, and resin leakage occurs by protruding from the gap of the mold. In compression molding using such a foaming resin material, there is a first problem that resin leakage may occur due to the foaming resin material protruding from the gap of the mold.

[0005] In addition, in order to impart fluidity to the resin material used for compression molding, it is known to mix particulate materials such as silica called fillers. In recent years, fillers with small particle sizes have been increasingly used. When performing compression molding using a resin material with small fillers, for example, when exhausting the gas in the cavity from the air vent groove of the mold, resin may leak out of the cavity. There is a second problem in that such resin leakage may occur in both particulate resin materials and liquid resins.

[0006] In addition, the resin material used for compression molding may be mixed with materials such as magnetic materials that reduce the fluidity of the resin. Due to such materials, the resin may not spread sufficiently in the cavity of the resin mold, and unfilled resin portions may occur. There is a third problem in that such unfilled resin may occur in both particulate resin materials and liquid resins.

[0007] For example, it is required to prevent problems such as resin leakage or unfilled resin typified by the above first to third problems and improve productivity.

[0008] Therefore, an object of the present invention is to provide a mold, a resin molding apparatus, and a method for manufacturing a resin molded product that can prevent resin leakage or unfilled resin.

Means for Solving the Problems

[0009] To achieve this object, the mold of the present invention is a mold used for compression molding, the mold has a first mold and a second mold arranged to face each other, the first mold includes a mold main surface member that constitutes the main surface that becomes the bottom surface or the upper surface of the mold cavity, and a mold side surface member that constitutes the side surface of the mold cavity, the mold cavity is formed by a space surrounded by the mold main surface member and the mold side surface member, the resin material can be accommodated in the mold cavity, The mold side surface member is vertically movable relative to the mold main surface member, An elastic member is disposed on the side of the mold side surface member opposite to the side facing the second mold, The elastic member is disposed so as to be able to partially vary the state of force applied along the outer periphery of the planar shape of the mold cavity.

[0010] The resin molding apparatus of the present invention has the mold of the present invention.

[0011] The method for manufacturing a resin molded product of the present invention is A method for manufacturing a resin molded product using the mold of the present invention, The method for manufacturing the resin molded product is A resin material supply step of supplying the resin material into the mold cavity, After the resin material supply step, a resin molding step of performing resin molding by compression molding using the mold, and The resin forming step includes a step of exhausting the inside of the mold cavity while partially varying the state of force applied along the outer periphery of the planar shape of the mold cavity.

Effect of the Invention

[0012] According to the present invention, it is possible to provide a mold, a resin molding apparatus, and a method for manufacturing a resin molded product that can prevent resin leakage or unfilled resin.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0014] Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

[0015] In the present invention, the "mold" is, for example, a metal mold, but is not limited thereto, and may be, for example, a ceramic mold or the like.

[0016] In the present invention, the resin molded article is not particularly limited. For example, it may be simply a resin molded article obtained by molding a resin, or a resin molded article obtained by resin-sealing electronic elements such as semiconductor chips, resistor elements, and capacitor elements by resin molding. In the present invention, the resin molded article may be, for example, an electronic component or the like. The electronic component is not particularly limited and is arbitrary. For example, it may be any electronic component obtained by resin-sealing any electronic element such as a semiconductor chip, a resistor element, and a capacitor element. The type, form, etc. of the electronic element are also not particularly limited. For example, it may be at least one of the various forms (including flip chips) described above. Further, the resin molded article may be one obtained by further resin-sealing an electronic component obtained by resin-sealing electronic elements such as semiconductor chips, resistor elements, and capacitor elements.

[0017] In the present invention, the resin material before molding and the resin after molding are not particularly limited. For example, they may be thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. Further, they may be composite materials partially containing thermosetting resins or thermoplastic resins. In the present invention, examples of the form of the resin material before molding include powdery or granular resins (including granular resins), liquid resins, sheet-like resins, tablet-like resins, and the like. Note that in the present invention, the liquid resin may be in a liquid state at normal temperature or may be a molten resin melted by heating to become a liquid state. Further, in the present invention, the resin material before molding may be, for example, a foamable resin material.

[0018] Also, in the present invention, the "chip" refers to the chip before resin-sealing. Specifically, for example, it includes chips such as ICs, LED chips, semiconductor chips, and semiconductor elements for power control. In the present invention, the chip before resin-sealing is referred to as "chip" for convenience in order to distinguish it from the electronic component after resin-sealing. However, the "chip" in the present invention is not particularly limited as long as it is a chip before resin-sealing and does not have to be in a chip shape.

[0019] In the present invention, a "flip chip" refers to an IC chip having bump-like protruding electrodes called bumps on the electrodes (bonding pads) on the surface of the IC chip, or such a chip form. This chip is connected to a wiring part such as a printed circuit board by facing it downward (face down). The flip chip is used, for example, as a chip for wireless bonding or as one of the connection methods.

[0020] In the present invention, the object to be resin-molded is not particularly limited, and for example, it may be a substrate. Further, in the present invention, for example, an electronic element (such as a semiconductor chip, a resistance element, a capacitor element, etc.) fixed to a substrate (object to be molded) may be resin-sealed (resin-molded) to produce a resin-molded product. In the present invention, the substrate (also referred to as an interposer) that is the object to be resin-molded is not particularly limited, and for example, it may be a lead frame, a wiring board, a wafer, a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, etc. The substrate may be, for example, a mounting substrate having chips fixed to one or both of its surfaces. The method of fixing the chips is not particularly limited, and examples include wire bonding, flip chip bonding, etc. In the present invention, for example, an electronic component in which the chips are resin-sealed may be manufactured by resin-sealing a substrate to which the chips are fixed. Further, the use of the substrate resin-sealed by the resin molding apparatus of the present invention is not particularly limited, and examples include a substrate for an LED, a high-frequency module substrate for a mobile communication terminal, a power control module substrate, an equipment control module substrate, etc.

[0021] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. Each figure is schematically drawn with appropriate omissions, exaggerations, etc. for the sake of convenience of explanation.

Embodiment

[0022] In this embodiment, an example of the mold, the resin molding apparatus, and the method for manufacturing a resin-molded product of the present invention will be described.

[0023] FIG. 1 shows a plan view (spring layout diagram) showing an example of the arrangement of the elastic members when the first type is rectangular. FIG. 1 shows the side member 201 and the main member 202 as viewed from the side where the elastic member 203 is arranged. The elastic members 203 have different heights as shown in FIG. 1, with the elastic member 203a being higher and the elastic member 203b being lower. In this way, the elastic members 203a and 203b are arranged so as to be able to partially vary the state of force application along the outer periphery of the planar shape of the cavity 204. The elastic members 203a and 203b can be arranged, for example, so that the state of force application varies partially according to the planar shape of the cavity 204. In FIG. 1 where the planar shape of the cavity 204 has a corner portion and a straight portion, the elastic member 203b is arranged at the corner portion and the elastic member 203a is arranged at the straight portion (the horizontal direction in FIG. 1). In particular, in FIG. 1 which is rectangular, at the portion along the longitudinal direction (the horizontal direction in FIG. 1) of the planar shape of the cavity 204, the elastic member 203b is arranged at its end portion and the elastic member 203a is arranged at the central portion.

[0024] The heights of the elastic members 203a and 203b may be adjusted, for example, by changing the initial deflection amounts of the elastic members 203a and 203b when attaching the elastic members 203a and 203b to the mold of the present embodiment, or by adjusting the heights of the elastic members 203a and 203b in a state where the elastic members 203a and 203b are not stretched or contracted. Further, the heights of the elastic members 203a and 203b may be adjusted by interposing spacers in at least one of the stretching and contracting directions of the elastic members 203a and 203b. Further, in order to partially vary the state of the applied force along the outer periphery of the planar shape of the cavity 204, instead of varying the heights of the elastic members 203a and 203b, for example, the spring diameters or spring constants of the elastic members 203a and 203b may be changed for adjustment. However, as will be described later, in order to equalize the forces applied along the outer periphery of the planar shape of the cavity 204 at the completion of mold clamping of the mold of the present embodiment (see FIG. 4), it is preferable to adjust the height by changing the initial deflection amounts of the elastic members 203a and 203b. Note that, regarding the height of the elastic member, in the present embodiment, an example in which the heights of two types of elastic members are different is used for explanation, but the heights of three or more types of elastic members may be different. Further, when adjusting by changing the spring diameter or spring constant instead of the height of the elastic member, the spring diameters or spring constants of three or more types of elastic members may be different. Here, the initial deflection amount of the elastic member can be adjusted by the amount of contraction of the elastic member when attaching the elastic member to the mold, and can also be expressed as the deflection amount of the elastic member in a state before starting the mold clamping operation for the resin molding process. For a specific example, when setting the initial deflection amount to two types, it can be set such as two types with contraction amounts of 1 mm and 2 mm, two types with contraction amounts of 1 mm and 3 mm, or two types with contraction amounts of 2 mm and 3 mm.

[0025] FIGS. 2 to 4 are process cross-sectional views showing an example of the mold of the present embodiment and a method for manufacturing a resin molded product using the same in a resin molding apparatus. Note that the cross-sectional views A-A and B-B shown in FIGS. 2 to 4 are the cross-sections A-A and B-B shown in the spring arrangement diagram of FIG. 1, respectively.

[0026] As shown in FIG. 2, the mold 1000 is disposed inside the outside air blocking member 4000. The outside air blocking member 4000 is for reducing the pressure inside the outside air blocking member 4000. In order to reduce the pressure inside the outside air blocking member 4000, the resin molding apparatus of this embodiment may further include, for example, an inside pressure reducing mechanism for the outside air blocking member (not shown). The inside pressure reducing mechanism for the outside air blocking member is, for example, a vacuum pump. The outside air blocking member 4000 has a fixed platen 401 and a movable platen 402. O-rings 403 having elastic force are provided between the fixed platen 401 and the movable platen 402, respectively. A through hole 404 penetrating the upper part of the fixed platen 401 is provided in the upper part of the fixed platen 401.

[0027] The mold 1000 has a first mold 200 and a second mold 100. The first mold 200 has a side member 201 and a main member 202. The side member 201 is disposed so as to surround the periphery of the main member 202. An air vent groove 205 is provided on the upper surface of the side member 201. A cavity 204 is formed by the space surrounded by the side member 201 and the main member 202. As shown in the figure, a foamable resin material (resin material) 20 can be accommodated in the cavity 204. Note that the foamable resin material 20 is a liquid resin in FIG. 2. However, in this embodiment, the form of the foamable resin material 20 before molding is not particularly limited, and for example, as described above, it may be a liquid resin, a granular resin (including a particulate resin), a sheet-like resin, a tablet-like resin, or the like.

[0028] The side member 201 and the main member 202 are disposed on the first mold base member 300. The main member 202 is directly fixed to the upper surface of the first mold base member 300. The side member 201 is attached to the upper surface of the first mold base member 300 via an elastic member 203a. The side member 201 can move up and down due to the expansion and contraction of the elastic member 203a. Further, an elastic member 203b is disposed on the first mold base member 300. A movable platen 402 is provided below the first mold base member 300. The first mold base member 300 can be moved up and down by the movable platen 402.

[0029] As shown in the figure, the second mold 100 can attach the substrate (object to be molded) 10 to its lower surface. The second mold 100 is provided on the fixed fixed platen 401 above it.

[0030] The method for manufacturing a resin molded product using the mold 1000 can be performed, for example, as follows. First, the foamable resin material 20 is supplied into the cavity 204. The method of supplying the foamable resin material 20 is not particularly limited. For example, the foamable resin material 20 may be conveyed to a predetermined position by a resin material conveying mechanism (not shown), and then the foamable resin material 20 may be supplied into the cavity 204. After supplying the foamable resin material 20, the first mold 200 and the second mold 100 are heated, and the foamable resin material 20 is heated by the heat. Before performing the resin material supply step, the first mold 200 and the second mold 100 may be heated in advance.

[0031] As shown in FIG. 2, with the heated foamable resin material 20 supplied into the cavity 204, the movable platen 402 is raised. Thereafter, the inside of the air-blocking member 4000 is depressurized by an air-blocking member internal depressurization mechanism (not shown). Here, as shown in FIG. 2(a), the elastic member 203a begins to bend when the release film 11 disposed on the side member 201 contacts the substrate 10. Note that the release film 11 contacts the substrate 10 at a timing such that the foamable resin material 20 does not protrude from the cavity 204 of the mold 1000. When the elastic member 203a begins to bend, the release film 11 is in a state of being partially crushed. As shown in FIG. 2(b), at this stage, since the side member 201 does not contact the elastic member 203b and no force is applied thereto, the elastic member 203b is not bent. If only the elastic member 203a is bent, even if the release film 11 (side member 201) and the substrate 10 are in contact, the cavity 204 can be exhausted through the air vent groove 205. That is, since the release film 11 is in contact with the substrate 10, even when the foamable resin material 20 foams due to depressurization, it is possible to prevent the foamable resin material 20 from leaking from the mold 1000. In addition, since the cavity 204 can be sufficiently exhausted while the release film 11 is in contact with the substrate 10, internal voids in the resin after molding can also be reduced. Note that before the foamable resin material 20 leaks from the mold 1000, the inside of the air-blocking member 4000 may be depressurized with the release film 11 disposed on the side member 201 not in contact with the substrate 10. If depressurization is performed with the release film 11 not in contact with the substrate 10, the cavity 204 can be exhausted more quickly than when the release film 11 is in contact with the substrate 10.

[0032] FIG. 2 shows a state in which the states of forces applied along the outer periphery of the planar shape of the cavity 204 are partially different by the elastic member 203a and the elastic member 203b. In addition, the content described with reference to FIG. 2 is an explanation of a process of exhausting the cavity 204 while partially varying the states of forces applied along the outer periphery of the planar shape of the cavity 204 in the resin forming process.

[0033] Here, an example of a method for adsorbing the release film 11 onto the mold surface of the first mold 200 is shown by the first-type plan view of FIG. 5. As a method for adsorbing the release film 11, for example, as shown in FIG. 5, from the gap 206 (not shown in FIGS. 2 to 4) between the side member 201 and the main member 202 or the suction holes (not shown) formed in the first mold, it can be adsorbed onto the mold surface of the first mold 200 by suction with a suction mechanism (not shown, such as a vacuum pump, etc.). In this way, the release film 11 is coated on the mold surface of the first mold 200, and it is possible to prevent the resin from entering the gap between the side member 201 and the main member 202 (resin leakage). Also, the releasability is improved.

[0034] As shown in FIG. 3, when the movable platen 402 is further raised from the state of FIG. 2, the elastic member 203b comes into contact with the side member 201, a force is applied to the elastic member 203b, and the elastic member 203b begins to bend. When the elastic member 203b begins to bend, the force with which the release film 11 presses the substrate 10 becomes stronger, so the amount of exhaust gas in the cavity 204 from the air vent groove 205 decreases. Therefore, the exhaust conditions are set so that sufficient exhaust is performed before the elastic member 203b begins to bend.

[0035] When the movable platen 402 is further raised from the state shown in FIG. 3, as shown in FIG. 4, the elastic member 203b bends sufficiently. At this stage, sufficient resin pressure is applied and the mold clamping is completed. Then, after the foaming resin material 20 is cured (solidified) to form a cured resin, the first mold 200 is lowered to open the mold, and the resin molded product in which the substrate 10 is sealed with the cured resin is taken out from the molding die 1000. In the above manner, resin molding can be performed to manufacture a resin molded product. Note that the method of curing the foaming resin material 20 is not particularly limited. For example, when the foaming resin material 20 is a thermosetting resin, it may be cured by heating. When the foaming resin material 20 is a thermoplastic resin, it may be cured by cooling or allowing it to cool. Also, in FIGS. 2 to 4, the foaming resin material 20 is used as the resin material. However, in the present invention, the resin material is not limited to only the foaming resin material. Further, in FIGS. 2 to 4, nothing is arranged on the surface of the substrate 10, but for example, chips or the like may be arranged on the surface of the substrate 10. Then, the chips or the like may be resin-sealed (resin-molded) in the resin molding process to manufacture an electronic component (resin molded product) in which the chips are resin-sealed.

[0036] In the first mold 200, the depth of the cavity 204 before mold clamping (when the elastic member 203a and the elastic member 203b are not contracted) is not particularly limited. For example, it may be 1 mm or more, 3 mm or more, 5 mm or more, or 10 mm or more, and for example, it may be 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, or 3 mm or less. The depth of the cavity 204 after mold clamping (the state shown in FIG. 4) is not particularly limited. For example, it may be 1 mm or more, 3 mm or more, 5 mm or more, 10 mm or more, or 15 mm or more, and for example, it may be 20 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 1 mm or less. The depth of the cavity 204 after this mold clamping is substantially equal to the resin thickness (package thickness) of the resin molded product after molding.

[0037] The shape of the first type 200 is not particularly limited. For example, as shown in FIG. 5, it may be rectangular. Also, as shown in FIG. 6, it may be square. Further, although not shown, for example, it may be circular.

[0038] In FIG. 5, the air vent groove 205 is provided on the side member 201 so as to surround the cavity 204 (main surface member 202). Here, the air vent grooves 205 provided along the longitudinal direction (the horizontal direction in FIG. 5) of the cavity 204 have different shapes between those located at the outermost ends in the longitudinal direction of the cavity 204 and those closest to the center position (air vent groove 205a, air vent groove 205b). In FIG. 5, the width in the longitudinal direction of the cavity 204 of the air vent groove 205a is wider than that of the air vent groove 205b in the longitudinal direction of the cavity 204, but it is not limited to this. For the air vent grooves 205a and 205b, for example, as described above, only the width (the horizontal direction in FIG. 7) may be changed (FIGS. 5 and 7(a)), only the depth (the vertical direction in FIG. 7) may be changed (FIG. 7(b)), or both the width and the depth may be changed (FIG. 7(c)). That is, the cross-sectional area of the air vent groove 205a may be wider than the cross-sectional area of the air vent groove 205b. By adjusting the cross-sectional area of the air vent groove, the exhaust volume of the cavity 204 can be easily adjusted. Also, the foaming resin material 20 supplied into the cavity 204 has fluidity. When the planar shape of the cavity 204 is rectangular, the resin is likely to be unfilled at the corner portions of the rectangle. This is presumably because, for example, the foaming resin material 20 flows from the inside to the outside of the cavity 204, and the resin does not sufficiently reach the corner portions. Therefore, if the cross-sectional area of the air vent groove 205a located at the outermost end in the longitudinal direction of the cavity 204 is made wider than the cross-sectional area of the air vent groove 205b closest to the center position, the resin can be sufficiently spread to the corner portions by exhaust (degassing) within the cavity 204.

[0039] The arrangement of the air vent groove 205 when the shape of the first mold 200 is square is shown in FIG. 6. Similar to FIG. 5, the air vent groove 205 is provided on the side member 201' so as to surround the cavity 204' (main surface member 202'). Also, the cross-sectional area of the air vent groove 205a is larger than that of the air vent groove 205b. Here, when the shape of the first mold 200 is square, the lengths of the four sides of the cavity 204' are the same. In this case, it is preferable that the air vent groove 205a is provided at a position close to the four corners (corner portions) of the cavity 204'.

[0040] When the shape of the first mold 200 is circular (not shown), for example, it is preferable that a plurality of air vent grooves are provided radially so as to surround the circular cavity. In this case, the number of air vent grooves can be appropriately selected according to the size of the cavity.

[0041] When the shape of the first mold 200 is the shape (rectangle) of FIG. 5, for example, the elastic members 203a and 203b can be arranged as shown in FIG. 1. As described above, it is difficult for the foaming resin material to spread sufficiently in the corner portions of the cavity. Therefore, for example, if the elastic member 203b is provided below the position where the air vent groove 205a is located, no force is applied to the air vent groove 205a compared to the air vent groove 205b at the exhaust stage of FIG. 2, so the exhaust efficiency from the air vent groove 205a is improved.

[0042] When the shape of the first mold 200 is the shape (square) of FIG. 6, for example, the elastic members 203a and 203b can be arranged as shown in FIG. 8(a). Similar to the case where the shape of the first mold 200 is rectangular, if the elastic member 203b is provided below the position where the air vent groove 205a is located, no force is applied to the air vent groove 205a compared to the air vent groove 205b at the exhaust stage of FIG. 2, so the exhaust efficiency from the air vent groove 205a is improved.

[0043] The arrangement of the elastic members 203a and 203b may be, for example, as shown in FIGS. 8(b) and 8(c), where the elastic members 203a and 203b are arranged alternately. In this case, for example, an air vent groove 205b may be provided above the elastic member 203a, and an air vent groove 205a may be provided above the elastic member 203b.

[0044] In the above description, an example using a foamable resin material as the resin material has been described. When a foamable resin material is used as the resin material, by applying the present invention, resin leakage caused by the overflow of the foamable resin material from the gap of the mold can be prevented.

[0045] Further, as the resin material, a resin material mixed with a filler having a relatively small particle size may be used. In this case, the timing at which the release film 11 described with reference to FIG. 2 contacts the substrate 10 may be set regardless of the timing of the overflow due to the foaming of the resin. Even when a resin material mixed with a filler having a relatively small particle size is used as the resin material, by applying the present invention, resin leakage can be prevented. As the filler, for example, silica powder particles can be used.

[0046] Further, as the resin material, a resin material mixed with a material that reduces fluidity may be used. In this case, the timing at which the release film 11 described with reference to FIG. 2 contacts the substrate 10 may be set regardless of the timing of the overflow due to the foaming of the resin. When a resin material mixed with a material that reduces fluidity is used as the resin material, even if the fluidity of the resin decreases, by applying the present invention, exhaust can be performed in a state where the release film 11 contacts the substrate 10, and the spread of the resin in the cavity 204 can be promoted to prevent the occurrence of an unfilled resin portion. As the material that reduces fluidity, for example, a magnetic material can be mentioned.

Example

[0047] In this example, an example of the overall configuration of the resin molding apparatus of the present invention and a method for manufacturing a resin molded product using the same will be described.

[0048] As shown in FIG. 9, the resin molding apparatus 1 includes a substrate supply and storage module A, a resin molding module B, and a resin material supply module C as respective components. Each component (each module A to C) is detachable and replaceable with respect to each component.

[0049] The substrate supply and storage module A includes a substrate supply unit 50, a substrate storage unit 51, transfer paths 52a and 52b, an inspection device 53, a substrate transfer mechanism 54, a substrate placement unit TM, a molded substrate placement unit WM, and a control unit COM. The substrate supply unit 50 supplies a substrate 10 which is an object to be resin-molded before molding. The transfer path 52a is used to transfer the substrate 10 supplied from the substrate supply unit 50 in the Y direction. The substrate placement unit TM is where the substrate 10 transferred by the transfer path 52a is placed.

[0050] The substrate transfer mechanism 54 receives the substrate 10 placed on the substrate placement unit TM from a moving mechanism (not shown) that can move in the Y direction, and moves in the X and Y directions within the substrate supply and storage module A and the resin molding module B to transfer the substrate 10 to the mold 1000 of the resin molding module B. Further, the substrate transfer mechanism 54 moves in the X and Y directions within the substrate supply and storage module A and the resin molding module B to receive the resin-molded substrate W (resin-molded product) resin-molded by the mold 1000 of the resin molding module B and transfer it to the substrate supply and storage module A.

[0051] The molded substrate placement unit WM is where the resin-molded substrate W moved from the substrate transfer mechanism 54 is placed by a moving mechanism (not shown) that can move in the Y direction. The transfer path 52b is used to transfer the resin-molded substrate W placed on the molded substrate placement unit WM in the Y direction.

[0052] The transfer paths 52a and 52b can be constituted by a pair of rails, for example, in which a groove portion having a C-shaped cross section is formed and the openings of the groove portions are arranged to face each other. In the case of this example, by arranging the end portion of the substrate 10 or the resin-molded substrate W so as to fit into the groove portion of the rail, the substrate 10 or the resin-molded substrate W can be slid in the longitudinal direction of the rail (corresponding to the Y direction in FIG. 9) along the rail.

[0053] The inspection device 53 inspects the appearance of the resin-molded substrate W that has been moved from the molded substrate placement portion WM and is being conveyed on the transfer path 52b. The substrate storage portion 51 stores the resin-molded substrate W conveyed from the transfer path 52b.

[0054] The control unit COM includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to control each component according to information processing. The control unit COM is configured to control at least the inspection device 53, and may be configured to control the entire resin molding apparatus 1.

[0055] The resin molding module B is a resin molding portion for molding resin on the substrate 10, and includes a molding die 1000 and an airtight member 4000. The resin molding module B manufactures a resin-molded substrate W (resin molded product) by a compression forming method using the foaming resin material 20 supplied by the resin material supply portion C.

[0056] As the molding die 1000 for compression molding, for example, a configuration including a second die 100 and a first die 200 arranged to face each other can be used, where the substrate 10 is supplied to the second die 100 and the foaming resin material 20 is supplied to the first die 200. In the case of this example, as the first die 200, a configuration including a main surface member 202 that constitutes the main surface that becomes the bottom surface or the upper surface of the cavity 204 and a side surface member 201 that constitutes the side surface of the mold cavity, and in which the main surface member 202 and the side surface member 201 are relatively slidable, can be used.

[0057] The resin material supply module C includes a moving table 60, a resin material storage portion 61 placed on the moving table 60, a resin material supply portion 62 that supplies the foaming resin material 20 to the resin material storage portion 61, and a resin material transfer mechanism 63 that transfers the resin material storage portion 61 and supplies the foaming resin material 20 to the mold 1000 of the resin molding module B. The moving table 60 is configured to move in the X direction and the Y direction within the resin material supply module C. The resin material transfer mechanism 63 moves in the X direction and the Y direction within the resin material supply module C and the resin molding module B. Then, the resin material transfer mechanism 63 transfers the resin material storage portion 61 containing the foaming resin material 20 to the mold 1000 and supplies the foaming resin material 20. As the resin material storage portion 61, as an example, a release film can be arranged so as to close the open lower surface of the frame-shaped member.

[0058] Furthermore, the present invention is not limited to the above-described embodiments, and within the scope not departing from the gist of the present invention, it can be arbitrarily and appropriately combined, changed, or selected and adopted as necessary.

[0059] Some or all of the above-described embodiments and examples can be described as follows in the appended claims, but are not limited thereto. (Appended Claim 1) A mold used for compression molding, The mold has a first mold and a second mold arranged to face each other, The first mold includes a mold main surface member that constitutes a main surface that becomes the bottom surface or the upper surface of the mold cavity, and a mold side surface member that constitutes the side surface of the mold cavity, The mold cavity is formed by a space surrounded by the mold main surface member and the mold side surface member, A resin material can be accommodated in the mold cavity, The mold side surface member is relatively movable up and down with respect to the mold main surface member, An elastic member is arranged on the side of the mold side surface member opposite to the side facing the second mold, The elastic member is a molding die arranged so as to be able to partially vary the state of force application along the outer periphery of the planar shape of the mold cavity. (Appendix 2) The molding die according to Appendix 1, wherein the elastic member includes two types of elastic members having different initial deflection amounts. (Appendix 3) The molding die according to Appendix 1 or 2, wherein the resin material accommodated in the cavity is a foaming resin material. (Appendix 4) The molding die according to any one of Appendices 1 to 3, wherein the elastic member is arranged so that the state of force application partially differs according to the planar shape of the mold cavity. (Appendix 5) The planar shape of the mold cavity has a corner portion and a straight portion, The molding die according to any one of Appendices 1 to 4, wherein the elastic member is arranged so that the force at the portion corresponding to the corner portion is weaker than the force at the portion corresponding to the straight portion. (Appendix 6) The planar shape of the mold cavity has different lengths in two directions orthogonal to each other, The molding die according to any one of Appendices 1 to 5, wherein the elastic member is arranged so that the force at the end portion is weaker than the force at the central portion in the portion along the longitudinal direction of the planar shape. (Appendix 7) The molding die according to any one of Appendices 1 to 6, wherein an air vent groove is formed in the mold side member. (Appendix 8) An air vent groove is formed in the mold side member, The molding die according to Appendix 6, wherein in the portion along the longitudinal direction, the cross-sectional area of the air vent groove at the most distal position is wider than the cross-sectional area of the air vent groove at the position closest to the center position. (Appendix 9) An air vent groove is formed in the mold side member, The molding die according to Appendix 6, wherein in the portion along the longitudinal direction, the width of the air vent groove in the longitudinal direction at the most distal position is wider than the width of the air vent groove in the longitudinal direction at the position closest to the center position. (Appendix 10) A resin molding apparatus having a molding die according to any one of Appendices 1 to 9. (Appendix 11) A method for manufacturing a resin molded product using a molding die according to any one of Appendices 1 to 9, wherein the method for manufacturing the resin molded product includes a resin material supply step of supplying the foaming resin material into the mold cavity, and a resin molding step of performing resin molding by compression molding using the molding die after the resin material supply step. The resin molding step includes a step of exhausting air in the mold cavity by partially varying the state of force application along the outer periphery of the planar shape of the mold cavity. A method for manufacturing a resin molded product.

Explanation of symbols

[0060] 1 Resin molding apparatus 10 Pre-sealing front substrate (substrate) 11 Release film 20 Foaming resin material (resin material) 50 Substrate supply unit 51 Substrate storage unit 52a, 52b Conveyor path 53 Inspection device 54 Substrate transfer mechanism 60 Moving table 61 Resin material storage unit 62 Resin material supply unit 63 Resin material transfer mechanism 100 Second mold 200 First mold 201, 201’, 201” Side members 202, 202’, 202” Main members 203a, 203b Elastic members 204, 204’ Cavities 205a, 205a’, 205a”, 205b Air vent grooves 206, 206’, 206” Clearances 300 First mold base member 401 Fixed platen 402 Movable platen 403 O-ring 404 Through-hole 1000 Molding die 4000 External air blocking member A Substrate supply and storage module B Resin molding module C Resin material supply module TM Substrate placement part WM Molding base placement part W Resin-molded substrate (resin molded product) COM Control unit

Claims

1. A mold used for compression molding, wherein the mold has a first mold and a second mold arranged to face each other, the first mold includes a mold main surface member that constitutes a main surface serving as the bottom or top surface of the mold cavity, and a mold side surface member that constitutes the side surface of the mold cavity, the mold cavity is formed by a space surrounded by the mold main surface member and the mold side surface member, a resin material can be accommodated in the mold cavity, the mold side surface member is relatively movable up and down with respect to the mold main surface member, an elastic member is disposed on a side of the mold side surface member opposite to the side facing the second mold, and the elastic member is disposed so as to be able to partially vary the state of force application along the outer periphery of the planar shape of the mold cavity. A mold.

2. The mold according to claim 1, wherein the elastic member includes two types of elastic members having different initial deflection amounts.

3. The mold according to claim 1, wherein the resin material accommodated in the cavity is a foaming resin material.

4. The mold according to claim 1, wherein the elastic member is disposed so that the state of force application is partially different according to the planar shape of the mold cavity.

5. the planar shape of the mold cavity has a corner portion and a straight portion, and the elastic member is disposed such that the force at a portion corresponding to the corner portion is weaker than the force at a portion corresponding to the straight portion. The mold according to claim 1.

6. the planar shape of the mold cavity has different lengths in two directions orthogonal to each other, and the elastic member is disposed such that the force at the end portion is weaker than the force at the central portion in a portion along the longitudinal direction of the planar shape. The mold according to claim 1.

7. The mold according to claim 1, wherein an air vent groove is formed in the mold side surface member.

8. an air vent groove is formed in the mold side surface member, and in a portion along the longitudinal direction, the cross-sectional area of the air vent groove at the most end position is wider than the cross-sectional area of the air vent groove at the position closest to the center position. The mold according to claim 6.

9. an air vent groove is formed in the mold side surface member, and in a portion along the longitudinal direction, the width of the air vent groove in the longitudinal direction at the most end position is wider than the width of the air vent groove in the longitudinal direction at the position closest to the center position. The mold according to claim 6.

10. A resin molding apparatus having the mold according to any one of claims 1 to 9.

11. A method for manufacturing a resin molded product using the molding die according to any one of claims 1 to 9, wherein the method for manufacturing the resin molded product is, a resin material supply step of supplying the resin material into the mold cavity, and a resin molding step of performing resin molding by compression molding using the molding die after the resin material supply step, wherein the resin forming step includes a step of exhausting the inside of the mold cavity while partially varying the state of force application along the outer periphery of the planar shape of the mold cavity, the method for manufacturing a resin molded product.

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