Epoxy resin composition, epoxy resin adhesive, and epoxy resin cured product

JP7692732B2Active Publication Date: 2025-06-16ASAHI KASEI KOGYO KABUSHIKI KAISHA
12 Cites -1 Cited by

Patent Information

Application Number
JP2021085162
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-05-20
Publication Date
2025-06-16
Estimated Expiration
2041-05-20

AI Technical Summary

Technical Problem

Existing two-component epoxy resin compositions face challenges in storage stability, handleability, and curability, particularly under low-temperature conditions, which affects the mechanical properties of the cured product.

Method used

A one-component epoxy resin composition is developed, comprising a first epoxy resin with high viscosity, a second epoxy resin with lower viscosity, and a specific curing agent. The composition is designed to have a gelation temperature of 170°C or lower and a thickening start temperature that is adjusted to ensure uniform curing under low-temperature conditions.

Benefits of technology

The proposed epoxy resin composition achieves excellent storage stability and exhibits superior mechanical properties, including high fracture strength and elongation under low-temperature curing conditions.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

To provide a one-component epoxy resin composition having excellent storage stability in which a cured product cured under low temperature conditions exhibits excellent mechanical properties.SOLUTION: There is provided an epoxy resin composition which comprises a first epoxy resin having a viscosity measured at 25°C of 6500 mPa s or more, a second epoxy resin having a viscosity of less than 6500 mPa s and a curing agent, wherein a gelation temperature (TB) at a temperature rising rate of 5°C / sec is 170°C or less, in a thickening start temperature (TA) at a temperature rising rate of 5°C / sec and the gelation temperature (TB) with respect to a thickening start temperature (TA0) and a gelation temperature (TB0) of a composition which comprises the first epoxy resin and the curing agent and does not comprise the second epoxy resin, TA-TA0 is 0°C or more and C=(TB-TB0) / (TA-TA0) is 0.5 or more.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Method for production of tape typed amorphous metals

    JP1977058018A

  • Electroconductive adhesive

    JP1999209716A

  • Epoxy resin composition and fiber-reinforced composite material using the same

    JP2011016985A

  • Member for display and method of manufacturing the same

    JP2011077251A

  • Liquid resin composition and finished article

    JP2014051621A