Light-emitting device and method for manufacturing the same

Abstract

To provide a light-emitting device which prevents light leakage and color phase irregularity due to sag to a light-emitting element side face and creeping to a wavelength conversion body side face of an adhesive resin, and can improve light extraction efficiency of the light-emitting device, and a method for manufacturing the same.SOLUTION: A method for manufacturing a light-emitting device includes: an element preparation step of preparing at least one light-emitting element 20 having an electrode pad BP formed on a support substrate 21 at a distance from the semiconductor layer; a wire bonding step of bonding at least one conductive wire BW onto the electrode pad BP of at least the one light-emitting element 20; a resin coating step including a first coating step of coating the semiconductor layer of at least the one light-emitting element 20 with a resin and forming a first resin part, and a second coating step of coating between the semiconductor layer and the electrode pad so as to fill the gap and forming a second resin part; and a wavelength conversion plate arrangement step of arranging a wavelength conversion plate 30 on the semiconductor layer so as to press the first resin part against the upper surface of the semiconductor layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emitting device including a light-emitting element, for example.

Background Art

[0002] A light-emitting device includes, for example, a substrate provided with terminals, wirings, etc., at least one light-emitting element mounted on the substrate, and a wavelength converter that converts the wavelength of light emitted from the light-emitting element. For example, Patent Document 1 discloses a light-emitting device having a light-emitting element and a wavelength conversion layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a light-emitting element and a wavelength converter are joined using, for example, a transparent adhesive resin, the application amount of the adhesive resin varies for each light-emitting element, and there may be a case where it is applied more than the desired application amount. As a result, the adhesive resin may drip on the side surface of the light-emitting element or creep up on the side surface of the wavelength converter.

[0005] For example, when the adhesive resin drips on the side surface of the light-emitting element, the adhesive resin functions as a light guide, and the light emitted from the light-emitting surface of the light-emitting element is absorbed by the support substrate of the light-emitting element such as silicon, resulting in a decrease in the light extraction efficiency of the light-emitting device.

[0006] In addition, for example, if a large amount of adhesive resin climbs up the side surface of the wavelength converter, color unevenness of the light obtained from the light-emitting device will occur. In particular, if the adhesive resin climbs up to the upper surface of the wavelength converter, the light-emitting element emits light from the light-emitting device directly through the climbing adhesive resin without passing through the wavelength converter to the light-emitting part of the light-emitting device, resulting in significant color unevenness due to light leakage.

[0007] Therefore, high precision is required for the coating amount of the adhesive resin that bonds the light-emitting element and the wavelength converter.

[0008] The present invention has been made in view of the above points, and aims to provide a light-emitting device and a method for manufacturing the same that can prevent light leakage and color unevenness caused by the dripping of the adhesive resin onto the side surface of the light-emitting element and the climbing of the adhesive resin onto the side surface of the wavelength converter, and improve the light extraction efficiency of the light-emitting device.

Means for Solving the Problems

[0009] The method for manufacturing a light-emitting device according to the present invention includes an element preparation step of preparing at least one light-emitting element having a support substrate, a semiconductor layer including a light-emitting layer formed on the support substrate, and an electrode pad formed on the support substrate with a gap from the semiconductor layer; a wire bonding step of bonding at least one conductive wire on the electrode pad of the at least one light-emitting element; a first coating step of applying a resin on the semiconductor layer of the at least one light-emitting element to form a first resin portion; and a second coating step of applying the resin so as to straddle the gap between the semiconductor layer and the electrode pad to form a second resin portion, including a resin coating step; and a wavelength conversion plate arrangement step of arranging a wavelength conversion plate on the semiconductor layer so as to press the first resin portion against the upper surface of the semiconductor layer.

[0010] Further, a method for manufacturing a light-emitting device according to the present invention includes: an element preparation step of preparing a support substrate and at least one light-emitting element having a semiconductor layer including a light-emitting layer formed on the support substrate and an electrode pad formed on the support substrate with a gap from the semiconductor layer; a wire bonding step of bonding at least one conductive wire on the electrode pad of the at least one light-emitting element; a resin coating step of applying a resin using a dispenser nozzle on the semiconductor layer of the at least one light-emitting element to form a first resin portion, and moving the dispenser nozzle in a direction along the upper surface of the light-emitting element toward the electrode pad to form a resin extension portion which is a resin portion reaching the electrode pad from the first resin portion across the gap; and a wavelength conversion plate arrangement step of arranging a wavelength conversion plate on the semiconductor layer so as to press the first resin portion against the upper surface of the semiconductor layer.

[0011] Further, a light-emitting device according to the present invention includes: a mounting substrate; a support substrate disposed on the mounting substrate; at least one light-emitting element having a semiconductor layer including a light-emitting layer formed on the support substrate and an electrode pad formed on the support substrate with a gap from the semiconductor layer; at least one conductive wire bonded on the electrode pad of the at least one light-emitting element; a resin portion including an outflow resin formed on the semiconductor layer of the at least one light-emitting element and extending from the semiconductor layer across the gap to the electrode pad; and a wavelength conversion plate disposed on the resin portion so as to cover the semiconductor layer from above the at least one light-emitting element.

Brief Description of the Drawings

[0012]

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Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described in detail. In the following description and the accompanying drawings, substantially the same or equivalent parts are denoted by the same reference numerals.

Example

[0014] FIG. 1 shows a schematic top view of the light-emitting device 10. Further, FIG. 2 shows a cross-sectional view of the light-emitting device 10 along the line A-A of FIG. 1.

[0015] The light-emitting device 10 has a housing 11 having a concave cavity formed on one surface. The light-emitting device 10 also has a submount 13 housed in the cavity of the housing 11 and a plurality of light-emitting elements 20 juxtaposed on the submount 13. The light-emitting device 10 also has a wavelength conversion plate 30 integrally formed via an adhesive resin 50 on each of the plurality of light-emitting elements 20. In FIG. 1, the covering member 15 is omitted in order to clarify the structure and positional relationship of each element in the housing 11.

[0016] The housing 11 is a substrate that functions as a housing of the light-emitting device 10 having a rectangular planar shape in a top view, and is made of a material having high thermal conductivity such as copper (Cu), for example. The housing 11 also has a cavity formed in a concave shape on the upper surface. Although not shown, an insulating film is formed on the outer peripheral portion including the upper surface, the inside of the cavity, and the bottom surface of the housing 11, and the surface of the housing 11 has a mode in which it is electrically insulated.

[0017] The body 11 has a first wiring T1 and a second wiring T2 made of metal and formed to be spaced apart from each other. The first wiring T1 and the second wiring T2 are formed inside the cavity of the body 11 and on the lower surface of the body 11. Each of the first wiring T1 and the second wiring T2 inside the cavity of the body 11 and on the lower surface of the body 11 is connected via a through electrode formed in a through hole of the body 11 (not shown). The first wiring T1 and the second wiring T2 formed inside the cavity of the body 11 and on the lower surface of the body 11 are, for example, electrode films in which copper / nickel / gold (Cu / Ni / Au) are laminated in order from the surface of the body 11 by plating. Further, the through electrode formed in the through hole of the body 11 is made of Cu formed by plating, for example. Note that the through electrodes of the first wiring T1 and the second wiring T2 are joined to the through holes of the body 11 with an insulating film interposed therebetween, and the first wiring T1 and the second wiring T2 are insulated from the body 11. The first wiring T1 and the second wiring T2 on the lower surface side of the body 11 function as external electrodes of the light-emitting device 10.

[0018] In this embodiment, a case where the body 11 is formed mainly of Cu will be described, but the main material of the body 11 is not limited to this. For example, the body 11 may be formed of a material such as ceramics such as alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), or silicon carbide (SiC) that has high thermal conductivity and insulation properties. In this case, it is not necessary to form the above-described insulating film on the surface of the body 11, and it becomes possible to directly form the first wiring T1 and the second wiring T2, which are metal electrodes, on the bottom surface of the cavity of the body 11 and on the lower surface of the body 11.

[0019] The submount 13 as a mounting substrate is disposed on the bottom surface of the cavity of the housing 11. The submount 13 is a substrate having a rectangular planar shape made of a material such as ceramics with high thermal conductivity, for example, aluminum nitride (AlN). The submount 13 is fixed to the bottom surface of the cavity of the housing 11 by, for example, a high thermal conductivity adhesive (not shown). Further, the submount 13 is disposed on the bottom surface of the cavity of the housing 11 so as to be spaced apart from the first wiring T1 and the second wiring T2. In other words, the light-emitting device 10 includes the submount 13 as a mounting substrate.

[0020] Further, a plurality of wirings PW made of metal for mounting and electrically connecting the light-emitting elements 20 are formed on the submount 13. The wiring PW is, for example, an electrode film in which Cu / Ni / Au are laminated in order from the surface of the submount by plating. In the present embodiment, a case where four light-emitting elements 20 are arranged in a row on the submount 13 will be described. The wiring PW has an element mounting region for mounting one light-emitting element 20 and a bonding pad region for connecting to another light-emitting element 20 mounted on an adjacent other wiring PW, and functions as a wiring electrode for electrically connecting the plurality of light-emitting elements 20.

[0021] Each of the light-emitting elements 20 is mounted on the element mounting region of the wiring PW of the submount 13. Each of the light-emitting elements 20 is a semiconductor light-emitting element having, for example, a light-emitting portion EM as a semiconductor layer laminated on a support substrate 21 mainly made of a conductive semiconductor such as silicon. The light-emitting portion EM has a structure in which, for example, a p-type semiconductor layer, a light-emitting layer, and an n-type semiconductor layer are laminated. Further, the upper surface of the n-type semiconductor layer is the upper surface of each of the light-emitting portions EM and functions as a light extraction surface in each light-emitting element. The p-type semiconductor layer, the light-emitting layer, and the n-type semiconductor layer are, for example, nitride semiconductors mainly made of gallium nitride (GaN) or the like, and are blue light-emitting diodes (LEDs) that emit blue light from a light-emitting layer having a multiple quantum well structure. Further, the lower surface of each of the light-emitting elements 20 is electrically connected to the n-type semiconductor via the support substrate 21, and the lower surface of each of the light-emitting elements 20 functions as a cathode electrode (not shown).

[0022] Further, each of the light-emitting elements 20 is joined so as to be arranged in a predetermined direction via a conductive element bonding layer (not shown in the figure) in the element mounting region of the wiring PW. That is, each of the wirings PW on which the light-emitting elements 20 are mounted is electrically connected to the cathode electrode of each of the light-emitting elements 20.

[0023] Also, each of the light-emitting elements 20 has an electrode pad BP formed so as to be separated from the light-emitting portion EM on the support substrate 21 with a gap therebetween. The electrode pad BP is electrically connected to the p-type semiconductor layer of each of the light-emitting portions EM and functions as the anode electrode of each of the light-emitting elements 20. In other words, the light-emitting device 10 includes at least one light-emitting element 20 having a support substrate 21 arranged on the submount 13, a light-emitting portion EM as a semiconductor layer including a light-emitting layer formed on the support substrate 21, and an electrode pad BP formed on the support substrate 21 with a gap from the light-emitting portion EM.

[0024] In this embodiment, the light-emitting portion EM and the electrode pad BP in each of the light-emitting elements 20 have a rectangular upper surface shape. Also, the gap between the light-emitting portion EM and the electrode pad BP has a shape in which a constant width continues for a predetermined length. In other words, the gaps of at least one light-emitting element 20 continue with a constant width for a predetermined length.

[0025] Also, on the submount 13, each of the light-emitting portions EM is arranged so as to be aligned in a row, and each of the electrode pads BP is arranged so as to be aligned in a row along the arrangement direction of the light-emitting portions EM.

[0026] The electrode pad BP is electrically connected to another adjacent wiring PW via at least one conductive bonding wire BW made of, for example, gold (Au). In other words, the light-emitting device 10 includes at least one conductive bonding wire BW bonded on the electrode pad BP of the light-emitting element 20. The bonding wire BW is configured in a so-called reverse bonding mode composed of a wire bump and a gold wire.

[0027] Further, for example, at least one bonding wire BW is bonded to a central region on the electrode pad BP. In this embodiment, the case where the bonding wire BW is bonded to two locations, i.e., the central region and another region of the electrode pad BP, will be described. In other words, one of the at least one bonding wire BW is formed in the central region in the direction of a predetermined length of the gap between the light emitting portion EM on the electrode pad BP and the electrode pad BP.

[0028] Note that, in this embodiment, the case where the bonding wire BW is reverse bonding will be described, but the mode of the bonding wire BW is not limited thereto, and a forward bonding mode in which a compression ball is formed on the electrode pad BP may also be used.

[0029] Also, the wiring PW at the left end in FIG. 1 is electrically connected to the first wiring T1 of the housing 11 via the bonding wire BW, and the wiring PW at the right end in the figure is electrically connected to the second wiring T2 of the housing 11 via the bonding wire BW. That is, in this embodiment, the four light emitting elements 20 are connected in series between the first wiring T1 and the second wiring T2 of the housing 11.

[0030] The wavelength conversion plate 30 is arranged to extend over the upper surfaces of each of the plurality of light emitting elements 20. Further, the wavelength conversion plate 30 is arranged to cover the light emitting portion EM of each of the plurality of light emitting elements 20. Further, the wavelength conversion plate 30 is fixed by an adhesive resin 50 formed on the upper surface of each of the plurality of light emitting elements 20. In other words, the light emitting device 10 includes a wavelength conversion plate 30 arranged to cover the light emitting portion EM from above at least one light emitting element 20 on the adhesive resin 50.

[0031] The wavelength conversion plate 30 performs wavelength conversion on the emitted light from each of the light emitting elements 20. The wavelength conversion plate 30 is, for example, yttrium aluminum garnet doped with cerium (Ce) (YAG:Ce, hereinafter referred to as Y3Al5O12 :It includes phosphor particles with cerium (Ce) as the main material, and a plate-shaped member including a binder of glass or ceramic such as alumina that transmits the emitted light of each light-emitting element 20 and the emitted light of the phosphor particles. In this embodiment, the wavelength conversion plate 30 performs wavelength conversion on a part of the blue light emitted by each of the plurality of light-emitting elements 20, and combines the light emitted by each of the plurality of light-emitting elements 20 and the light emitted by the wavelength conversion plate 30 to emit white light.

[0032] Note that YAG without cerium (Ce) doping can also be used as the binder (in this case, the wavelength conversion plate 30 may be a polycrystal or a single crystal). Further, the phosphor contained in the wavelength conversion plate 30 may be a phosphor such as Ce-doped terbium aluminum garnet (TAG:Ce, also denoted as Tb3Al5O 12 :Ce), Ce-doped gallium yttrium aluminum garnet (GYAG:Ce, also denoted as Y3(Al,Ga)5O 12 :Ce) or Ce-doped lutetium aluminum garnet (LuAG:Ce, also denoted as Lu3Al5O 12 :Ce), etc. Similarly, europium (Eu) and Ca-doped α-sialon (Si (12-m+n) Al (m+n) O n N (16-n) :Eu,Ca), Eu-doped β-sialon (Si (6-z) Al z O z N (8-z):Phosphors such as Eu-doped CASN (CaAlSiN3:Eu), Eu-doped SCASN ((Sr,Ca)AlSiN3:Eu), orthosilicate doped with Eu and manganese (Mn) ((Ba,Sr,Mg)2SiO4:Eu,Mn), or Mn-doped KFS (K2SiF6:Mn) may also be used. The above phosphors may be appropriately selected in terms of the addition amount or type according to the color of the light emitted by the light-emitting device 10. Further, the above phosphors may be used in combination of a plurality of types. Also, if substantially all the light emitted by each of the plurality of light-emitting elements 20 is wavelength-converted by the wavelength-conversion plate 30, the light emitted from the wavelength-conversion plate 30 exposed to the outside of the light-emitting device 10 can be converted into green light, yellow light, orange light, red light, infrared light, etc. corresponding to the emitted light of the wavelength-conversion plate 30.

[0033] Further, the wavelength-conversion plate 30 has a rectangular upper surface shape with the arrangement direction of the light-emitting elements 20 as the long side direction in a top view. In this embodiment, one of the main surfaces of the wavelength-conversion plate 30 is joined to the upper surface of the light-emitting element 20 via an adhesive resin 50 that transmits the light emitted by the light-emitting element 20. The other main surface faces so as to be exposed to the outside of the light-emitting device 10. That is, the one main surface of the wavelength-conversion plate 30 functions as a light-receiving surface that receives the light emitted by the light-emitting element 20 via the adhesive resin 50, and the other main surface functions as a light extraction surface of the light-emitting device 10.

[0034] As described above, the adhesive resin 50 is an adhesive formed on the upper surface of each of the plurality of light-emitting elements 20 to join each light-emitting portion EM of the light-emitting element 20 and the wavelength-conversion plate 30. The adhesive resin 50 is formed as a translucent silicone resin that transmits the emitted light of each of the light-emitting elements 20 by thermally curing a precursor paste of a silicone-based adhesive, for example.

[0035] The adhesive resin 50 is formed in a region where the upper surface of each of the plurality of light-emitting elements 20 and the wavelength-conversion plate 30 facing it overlap in a top view. That is, the adhesive resin 50 is formed on the light-emitting portion EM of each of the plurality of light-emitting elements 20.

[0036] Further, on the upper surface of each of the light-emitting elements 20, an outflow resin 51 is formed so as to protrude from the overlapping region and extend onto the upper surface of the electrode pad BP beyond the gap between the light-emitting portion EM and the electrode pad BP.

[0037] Note that the adhesive resin 50 and the outflow resin 51 are made of the same precursor paste. In the manufacturing process described later, the precursor pastes of the adhesive resin 50 and the outflow resin 51 flow out from the region where each of the light-emitting elements 20 and the wavelength conversion plate 30 overlap in a top view to the electrode pad BP, and the adhesive resin 50 and the outflow resin 51 are formed by heat-curing this. That is, the adhesive resin 50 and the outflow resin 51 function as a resin portion formed continuously. In other words, the light-emitting device 10 includes a resin portion composed of the adhesive resin 50 and the outflow resin 51 formed on the light-emitting portion EM of at least one light-emitting element 20 and extending across the gap from the light-emitting portion EM to the electrode pad BP. Further, the adhesive resin 50 and the outflow resin 51 as the resin portion are made of a paste mainly composed of a thermosetting silicone resin.

[0038] As shown in FIG. 2, the covering member 15 is filled in the cavity of the housing 11. The covering member 15 is a white resin that reflects the light emitted by each light-emitting element 20 and the light emitted from the wavelength conversion plate 30. The covering member 15 is, for example, a white resin made of a thermosetting resin material such as a silicone resin in which particles having light scattering properties such as titanium oxide (TiO2) are dispersed. Further, the covering member 15 is filled in the cavity of the housing 11 so that the upper surface, which is the light extraction surface of the wavelength conversion plate 30, is exposed.

[0039] FIG. 3 is an enlarged view of the light-emitting element 20 of the light-emitting device 10 according to Embodiment 1 of the present invention. Further, FIG. 4 is an enlarged cross-sectional view of the light-emitting element 20 taken along the line C-C of FIG. 3.

[0040] In a top view, an adhesive resin 50 that joins the upper surface of the support substrate 21 and the lower surface of the wavelength conversion plate 30 is formed at a joint portion that is an area where the support substrate 21 of the light-emitting element 20 and the wavelength conversion plate 30 overlap. Further, on the support substrate 21, an overflow resin 51 that is continuous with the adhesive resin 50 and extends beyond the gap between the joint portion and the light-emitting portion EM to the upper surface of the electrode pad BP is formed. Further, in the light-emitting element 20, a protective film CV is formed on a portion excluding the light-emitting portion EM and the electrode pad BP. Further, the protective film CV is formed so as to cover the side surface of the electrode pad BP and a part of the outer edge of the upper surface of the electrode pad BP. In other words, the protective film CV is formed on the upper surface of the gap. Further, the overflow resin 51 included in the resin portion extends from the light-emitting portion EM beyond the protective film CV to the electrode pad BP.

[0041] Further, on the upper surface of the electrode pad BP, a bonding wire BW is bonded to a central region of the electrode pad BP. Further, as shown in FIG. 4, the bonding wire BW is formed so as to be spaced apart from the wavelength conversion plate 30. When the bonding wire BW comes into contact with the wavelength conversion plate 30, there is a risk of breakage of the bonding wire BW, breakage of the electrode pad BP, the light-emitting portion EM on the support substrate 21, and the protective film CV, or displacement of the mounting position of the wavelength conversion plate 30. Therefore, it is preferable that the bonding wire BW and the wavelength conversion plate 30 be arranged so as to be spaced apart from each other.

[0042] During manufacturing, which will be described later, when applying the precursor paste of the adhesive resin 50 (hereinafter also referred to as potting), a first application is performed to form a joint portion of the upper surface of the support substrate 21 and the lower surface of the wavelength conversion plate 30 in the central region of the light-emitting portion EM. In addition to this, a second application is performed to apply the precursor paste so as to straddle the light-emitting portion EM and the electrode pad BP in the central region of the gap between the light-emitting portion EM and the electrode pad BP. Thereafter, when the wavelength conversion plate 30 is placed on the upper surface of the light-emitting portion EM, the precursor paste applied in the first application is pressed by the wavelength conversion plate 30 and spreads wet in the region of the joint portion.

[0043] At this time, among the precursor paste applied in the first application, the excess precursor paste flows out onto the upper surface of the electrode pad BP from the joint starting from the precursor paste applied in the second application. Further, the outflowing precursor paste spreads into the electrode pad BP by capillary action, particularly along the outer end portion of the electrode pad BP, specifically along the surface of the electrode pad BP and the side surface of the protective film CV on the side of the electrode pad BP. When the adhesive resin 50 that has spread into the electrode pad BP reaches the bonding wire BW, it is attracted and stored around the bonding wire BW by capillary action as shown in the C-C cross section. In other words, at least a part of at least one bonding wire BW is covered with the outflow resin 51 of the resin portion.

[0044] That is, when the precursor paste of the adhesive resin 50 wets and spreads at the joint between the light-emitting portion EM and the wavelength conversion plate 30, the excess precursor paste is attracted and stored inside the electrode pad BP and around the bonding wire BW inside the electrode pad BP. Thereby, it becomes possible to adjust the amount of the adhesive resin 50 for joining the light-emitting portion EM and the wavelength conversion plate 30 to an appropriate amount. Further, since the excess precursor paste is attracted and stored inside the electrode pad BP and around the bonding wire BW inside the electrode pad BP, it becomes possible to prevent the precursor paste from dripping onto the side surface of the light-emitting element 20 or from excessively creeping onto the side surface of the wavelength conversion plate 30.

[0045] By heat-curing the precursor paste in this state, an adhesive resin 50 formed at the joint between the upper surface of each of the plurality of light-emitting elements 20 and the wavelength conversion plate 30, and an outflow resin 51 that is continuous with the adhesive resin 50 and extends from the joint to the upper surface of the electrode pad BP of each of the plurality of light-emitting elements 20 are formed.

[0046] In addition, the precursor paste along the side of the lower surface of the wavelength conversion plate 30 forms an end side surface portion 52 having a concave cross-sectional shape at the end of the side of the lower surface of the wavelength conversion plate 30 to the end of the side of the light-emitting element 20 corresponding to the side of the lower surface of the wavelength conversion plate 30. The end side surface portion 52 is formed such that when the adhesive resin 50 spreads wetly at the joint between the light-emitting portion EM and the wavelength conversion plate 30, the excess adhesive resin 50 is sucked around the bonding wire BW in the electrode pad BP, thereby forming the concave end side surface portion 52.

[0047] In this way, the excess adhesive resin 50 when bonding the upper surface of each of the plurality of light-emitting elements 20 to the wavelength conversion plate 30 is formed as an outflow resin 51 on the upper surface of the electrode pad BP. Thereby, it is possible to prevent light leakage and color unevenness due to the dripping of the adhesive resin 50 onto the side surfaces of the light-emitting elements 20 and the creeping onto the side surfaces of the wavelength conversion plate 30.

[0048] Also, when the wavelength conversion plate 30 is placed, there may be a shortage of the precursor paste for the entire surface of the joint between the support substrate 21 and the wavelength conversion plate 30 to spread wetly, particularly at the four corners of the rectangular joint portion in a top view. At this time, due to the capillary action when spreading wetly at the four corners, the precursor paste stored around the bonding wire BW is supplied again to the joint portion to supplement the insufficient amount of the precursor paste. Thereby, the light-emitting device 10 can adjust an appropriate amount for the precursor paste to spread wetly over the entire surface of the joint between the light-emitting portion EM and the wavelength conversion plate 30. Also, by supplying the stored precursor paste again, it is possible to prevent the excessive creeping of the adhesive resin 50 from around the bonding wire BW to the side surface of the wavelength conversion plate 30.

[0049] That is, when the precursor paste spreads upon wetting at the joint, the bonding wire BW sucks (drains) excess precursor paste that may drip onto the side surface of the light-emitting element 20 at the shortest distance from the application position of the precursor paste through the precursor paste applied in the second application step. Further, when the precursor paste is insufficient for spreading to the four corners of the joint at the longest distance from the potting position during wetting, the precursor paste stored around the bonding wire BW is supplied (redrained) to the joint through the precursor paste applied in the second application step. That is, the outflow resin 51 before heat curing has an adhesive resin amount adjustment function of self-volume controlling the amount of the precursor paste at the joint.

[0050] FIG. 5 is an enlarged cross-sectional view of a BT portion showing a cavity between adjacent light-emitting elements 20 in the B-B cross-section of FIG. 1.

[0051] As described above, the adjustment function of the precursor paste prevents the occurrence of dripping of the adhesive resin 50 onto the side surface of the light-emitting element 20, particularly the support substrate 21. As shown in FIG. 5, the adhesive resin 50 has an inter-element side surface portion 54 that extends from the end of the light-emitting element 20 toward the wavelength conversion plate 30 between adjacent light-emitting elements 20, and an inverted bend portion 55 as a top surface portion that remains in a thin film shape on the lower surface of the wavelength conversion plate 30, and has a tunnel-shaped concave portion 53.

[0052] The inter-element side surface portion 54 is formed at an angle inclined toward the center between adjacent light-emitting elements 20 from the end of the light-emitting element 20 toward the wavelength conversion plate 30 due to the surface tension of the adhesive resin 50. Further, the inverted bend portion 55 is formed in a shape (cylindrical shape) having a convex cross-sectional shape on the lower surface side at the center between adjacent light-emitting elements 20.

[0053] When the precursor paste spreads during wetting when the wavelength conversion plate 30 being manufactured is placed, the precursor paste spreads over the light emitting element 20 as shown by the dashed line in the figure. Thereafter, the surplus precursor paste that has spread is sucked in the directions of the left and right light emitting elements 20 in the figure, so that the precursor paste remaining in the central portion between the light emitting elements 20 is formed in a shape like the reverse bend portion 55.

[0054] Also, the side surface portion 54 between the elements and the reverse bend portion 55 have a cross-sectional shape as shown in FIG. 5, thereby having a function of deflecting the emitted light LM radiated from the light emitting portion EM. In addition, in the present embodiment, the case where the cavity between the light emitting elements 20 shown in FIG. 5 is a gas such as air or nitrogen will be described.

[0055] For example, when the emitted light LM is radiated from the light emitting portion EM toward the side surface portion 54 between the elements and exits from the side surface portion 54 between the elements, since the refractive index of the adhesive resin 50 which is a transparent resin is larger than that of the gas, the emitted light from the side surface portion 54 between the elements is refracted in the direction of the wavelength conversion plate 30. Further, when the emitted light is incident on the reverse bend portion 55, since the reverse bend portion 55 has a cross-sectional shape convex on the lower surface, the reverse bend portion 55 functions as a convex lens. Therefore, the light incident on the reverse bend portion 55 is further refracted in the direction of the wavelength conversion plate 30. Thereby, the emitted light LM that does not directly go toward the wavelength conversion plate 30 from the light emitting portion EM can be guided to the light extraction surface of the wavelength conversion plate 30 above by the side surface portion 54 between the elements and the reverse bend portion 55 of the adhesive resin 50, and it becomes possible to improve the light extraction efficiency of the light emitting device 10.

[0056] Further, when the mounting height of each upper surface of the plurality of light-emitting elements 20 arranged on the submount 13, that is, the height from the upper surface of the submount 13 to the upper surface of each of the plurality of light-emitting elements 20 (hereinafter, may be simply referred to as the mounting height of the light-emitting element 20) is different, the amount of the adhesive resin 50 on the light-emitting element 20 is adjusted to an amount at which the surface tensions of the adhesive resin 50 applied on the plurality of light-emitting elements 20 and the wavelength conversion plate 30 are balanced by the adjusting function of the adhesive resin 50. That is, the precursor paste flowing out from the joint part self-volume-controls the amount of the precursor paste at each joint part according to the mounting height of each upper surface of the plurality of light-emitting elements 20. Thereby, the wavelength conversion plate 30 is placed horizontally with respect to the bottom surface of the housing 11.

[0057] Further, as shown in FIG. 5, the light-emitting elements 20 are diced so that the angle formed by the upper surface and the side surface is an acute angle at each side. Thereby, it becomes possible to more surely prevent the adhesive resin 50 from dripping from the upper surface end portion of the light-emitting element 20.

[0058] Next, with reference to FIGS. 6 and 7 to 21, the manufacturing procedure of the light-emitting device 10 according to Embodiment 1 of the present application will be described.

[0059] FIG. 6 is a diagram showing a manufacturing flow of the light-emitting device 10 according to Embodiment 1 of the present invention. FIGS. 7 to 11 and FIGS. 19 to 21 are top views of the light-emitting device 10 in each step of the manufacturing procedure shown in FIG. 6. FIGS. 12 to 18 are diagrams showing details of the application position and wet spreading of the precursor paste in the resin application step and the wavelength conversion plate bonding step.

[0060] First, as shown in FIG. 7, a submount 13 having a metal wiring PW formed thereon is prepared.

[0061] Next, as shown in FIG. 8, an adhesive is applied to the element placement region DP of the wiring PW, and after the light-emitting element 20 is placed, the light-emitting element 20 is bonded (step S11). In the present embodiment, the step of bonding the light-emitting element 20 onto the submount 13 in step S11 is described as the element preparation step. In other words, the method for manufacturing the light-emitting device 10 includes an element preparation step of preparing at least one light-emitting element 20 having a support substrate 21, a light-emitting portion EM including a light-emitting layer formed on the support substrate 21, and an electrode pad BP formed with a gap from the light-emitting portion EM on the support substrate 21.

[0062] Next, as shown in FIG. 9, a wire bonding step of bonding a bonding wire BW to the electrode pad BP and the wiring PW of the submount 13 is performed (step S12). In other words, the method for manufacturing the light-emitting device 10 includes a wire bonding step of bonding at least one conductive bonding wire BW onto the electrode pad BP of at least one light-emitting element 20.

[0063] In the bonding wire BW bonded to the electrode pad BP, at least one bonding wire BW is bonded to the central region of the electrode pad BP. In other words, in the wire bonding step, at least one bonding wire BW is formed in the central region in the direction of a predetermined length of the gap on the electrode pad BP. Also, in the present Example 1, the electrode pad BP of the light-emitting element 20 and the wiring PW of the submount 13 are electrically connected using the bonding wire BW so that the light-emitting elements 20 are connected in series.

[0064] Next, as shown in FIG. 10, a first coating step of potting a first paste portion 50A of the adhesive resin 50 as a first resin portion in the central region of the light-emitting portion EM is performed (step S13). In other words, in the first coating step, a precursor paste is applied to the central region of the light-emitting portion EM to form the first paste portion 50A.

[0065] Next, a second coating step is performed (step S14) in which a second paste portion 50B is potted as a second resin portion so as to straddle the light emitting portion EM and the electrode pad BP in a central region of the gap between the light emitting portion EM and the electrode pad BP. In other words, in the second coating step, the second paste portion 50B is formed in the central region in the direction of a predetermined length of the gap.

[0066] Note that steps S13 and S14 are resin coating steps that are continuously performed in the same apparatus. In other words, the method for manufacturing the light emitting device 10 includes a first coating step of coating a resin on the light emitting portion EM of at least one light emitting element 20 to form a first paste portion 50A as a first resin portion, and a second coating step of coating a resin so as to straddle a gap between the light emitting portion EM and the electrode pad BP to form a second paste portion 50B as a second resin portion. Note that steps S13 and S14 may be performed in either order.

[0067] Next, as shown in FIG. 11, a wavelength conversion plate disposing step is performed (step S15) in which the wavelength conversion plate 30 is placed so as to cover each of the light emitting portions EM of the light emitting element 20, pressed, and then heated and bonded. In other words, the method for manufacturing the light emitting device 10 includes a wavelength conversion plate disposing step of disposing the wavelength conversion plate 30 on the light emitting portion EM so as to press the first paste portion 50A against the upper surface of the light emitting portion EM.

[0068] Here, the potting positions of the first and second paste portions 50A and 50B in steps S13 and S14 will be described with reference to FIGS. 12 and 13.

[0069] FIG. 12 is an enlarged view of the upper surface of the support substrate 21 after steps S13 and S14 are performed. FIG. 13 is an enlarged cross-sectional view taken along line D-D in FIG. 12.

[0070] As described above, in the first resin coating step, the first paste portion 50A of the adhesive resin 50 is applied to the central region of the light emitting portion EM.

[0071] Also, as the second resin coating step, the second paste portion 50B is applied to the central region of the gap between the light emitting portion EM and the electrode pad BP. The first and second paste portions 50A and 50B are applied by a dispenser nozzle DN filled with the precursor paste.

[0072] The second paste portion 50B is applied onto the protective film CV formed on the gap between the light emitting portion EM and the electrode pad BP. Also, the second paste portion 50B is applied to the central region with respect to the longitudinal direction of the gap. That is, the second paste portion 50B is applied over a part of the longitudinal direction of the gap. In other words, in the second coating step, the second paste portion 50B is applied over a partial length of a predetermined length of the gap.

[0073] Also, the second paste portion 50B is applied so as to straddle the gap and extend over the upper surfaces of each of the light emitting portion EM and the electrode pad BP. At this time, the second paste portion 50B is applied so as to be close to the bonding wire BW on the electrode pad BP. In other words, in the second coating step, the second paste portion 50B is applied so that the second paste portion 50B is close to at least one bonding wire BW.

[0074] In the description of the first embodiment 1, the case where the second paste portion 50B is applied so as to be close to, that is, spaced apart from the bonding wire BW will be described. However, the second paste portion 50B and the bonding wire BW may be in contact with each other. In other words, in the second coating step, the second paste portion 50B is applied so that the second paste portion 50B is in contact with at least one bonding wire BW. In the second coating step, it is sufficient that the dispenser nozzle DN and the bonding wire BW do not come into contact and the second paste portion 50B is applied over the upper surfaces of each of the light emitting portion EM and the electrode pad BP.

[0075] Next, the spreading behavior of the first and second paste portions 50A and 50B and the outflow, storage, and supply behavior of each precursor paste in step S15 will be described with reference to FIGS. 14 to 18.

[0076] Figures 14, 15, and 17 are diagrams schematically showing the wet spreading of the first and second paste portions 50A and 50B when the wavelength conversion plate 30 in step S15 is placed on the upper surface of each light-emitting element 20. Further, FIG. 16 is an enlarged cross-sectional view taken along line E-E of FIG. 15. Further, FIG. 18 is an enlarged cross-sectional view taken along line F-F of FIG. 17.

[0077] As described above, the first paste portion 50A is potted in the central region of the light-emitting portion EM, and the second paste portion 50B is potted in the central region of the gap between the light-emitting portion EM and the electrode pad BP. Thereafter, the wavelength conversion plate 30 is placed so as to cover the upper surface of the light-emitting portion EM, and the wavelength conversion plate 30 presses from the upper surface.

[0078] At this time, in a top view, the first paste portion 50A spreads wet so as to be pushed out concentrically from the potting position as indicated by the broken-line arrow in the central portion of FIG. 14. Further, at least a part of the second paste portion 50B is also pressed by the wavelength conversion plate 30 and spreads wet in the bonding region where the support substrate 21 and the wavelength conversion plate 30 overlap.

[0079] Next, as shown in FIG. 15, when the first and second paste portions 50A and 50B spread and come into contact with each other, the respective precursor pastes become integrated. Hereinafter, the paste existing between the light emitting portion EM and the wavelength conversion plate 30 is referred to as a joint paste 50M, and the paste that is continuous with the joint paste 50M and flows out outward from between the light emitting portion EM and the wavelength conversion plate 30 toward the electrode pad BP is described as an outflow paste 51M. Further, the spreading of the joint paste 50M at the joint spreads concentrically further from the first application position, as indicated by the broken line arrow at the center in FIG. 15. Further, the joint paste 50M spread by pressing spreads to the four corners of the joint between the support substrate 21 and the wavelength conversion plate 30, and flows out onto the upper surface of the electrode pad BP from the application position of the second paste portion 50B, as indicated by the lower broken line arrow in FIG. 15. That is, the second paste portion 50B functions as a guiding portion that causes the excess of the first paste portion 50A at the joint to flow out to the electrode pad BP. As a result, each precursor paste becomes a joint paste 50M within the region of the joint and an outflow paste 51M that has flowed out from within the region of the joint.

[0080] Further, when the outflow paste 51M that has flowed out onto the upper surface of the electrode pad BP comes into contact with the bonding wire BW, it is attracted and stored around the bonding wire BW by surface tension. Further, the outflow paste 51M travels along the peripheral edge of the electrode pad BP due to capillary action, and when it comes into contact with another bonding wire BW, it is attracted and stored around the other bonding wire BW. At this time, as shown by the arrow in FIG. 16, the bonding wire BW sucks (drains) the joint paste 50M at the joint.

[0081] At this time, when the joint paste 50M has spread to the end of the support substrate 21, due to the surface tension of the joint paste 50M at the end of the support substrate 21, the joint paste 50M flows out to the electrode pad BP with priority over dripping from the end of the support substrate 21. Further, since the bonding wire BW sucks the joint paste 50M through the outflow paste 51M, it is possible to prevent the joint paste 50M from dripping on the side surface of the light emitting element 20.

[0082] Also, it is preferable that the pressing of the wavelength conversion plate 30 is not performed until the joint paste 50M spreads wetly over the entire surface of the joint portion between the light emitting element 20 and the wavelength conversion plate 30. Specifically, after the pressing of the wavelength conversion plate 30 starts, when the first and second paste portions 50A and 50B come into contact with each other and the wet spread of the joint paste 50M reaches any side of the upper surface of the support substrate 21, it is preferable to finish pressing the wavelength conversion plate 30. Thereby, it becomes possible to prevent the wavelength conversion plate 30 from contacting the light emitting portion EM and damaging the light emitting portion EM.

[0083] FIG. 17 is a diagram schematically showing the wet spread of the joint paste 50M and the outflow paste 51M after pressing the wavelength conversion plate 30. Further, FIG. 18 is an enlarged cross-sectional view of the light emitting element 20 along the line F-F of FIG. 17.

[0084] After the wavelength conversion plate 30 is released from pressing, the joint paste 50M spreads wetly over the entire surface of the joint portion between the light emitting element 20 and the wavelength conversion plate 30 as indicated by the broken-line arrow shown on the light emitting portion EM in FIG. 17 due to capillary action. At this time, the joint paste 50M may be insufficient to spread wetly over the entire surface of the joint portion between the light emitting element 20 and the wavelength conversion plate 30. In that case, the outflow paste 51M stored around the bonding wire BW during the pressing of the wavelength conversion plate 30 is supplied (re-drained) to the joint portion as indicated by the lower broken-line arrow in FIG. 17 and the solid-line arrow in FIG. 18, whereby the shortage can be compensated.

[0085] Also, as described above, the joint paste 50M prevents dripping onto the side surfaces of the light-emitting element 20. Therefore, the mounting position of the wavelength conversion plate 30 is self-aligned with the upper surface of the light-emitting element 20 by the surface tension of the joint paste 50M. Specifically, it is self-aligned to the position where the surface tension of the joint paste 50M extending along the side opposite to the side with the electrode pad BP of the support substrate 21 in FIG. 17 and the upper side of the wavelength conversion plate 30 is minimized. For example, the wavelength conversion plate 30 is self-aligned with the long side of the wavelength conversion plate 30 and the corresponding side surface of the support substrate 21, and the short side of the wavelength conversion plate 30 and the corresponding side surface of the support substrate 21.

[0086] Also, the wavelength conversion plate 30 is placed across each upper surface of the light-emitting element 20 and is automatically adjusted to a height where the surface tensions at each joint are balanced. That is, the joint paste 50M at the joint of each light-emitting element 20 is self-volume-controlled to an appropriate amount by the drain and re-drain of the outflow paste 51M that has flowed out.

[0087] By heating the submount 13 in this state to cure the joint paste 50M and the outflow paste 51M, an adhesive resin 50 in which the joint paste 50M is appropriately self-volume-controlled at each joint of the light-emitting element 20 and an outflow resin 51 in which the excess joint paste 50M has flowed out at each joint are formed.

[0088] Next, as shown in FIG. 19, the submount 13 to which the light-emitting element 20 and the wavelength conversion plate 30 are fixed is fixed to the bottom surface of the cavity of the housing 11 via an adhesive (not shown) (step S16).

[0089] Next, as shown in FIG. 20, the wiring PW formed at both ends of the submount 13 and the first wiring T1 and the second wiring T2 formed on the bottom surface of the cavity of the housing 11 are electrically connected using a bonding wire BW by a bonding device (step S17).

[0090] Thereafter, as shown in FIG. 21, a reflective coating member 15 is filled into the cavity of the housing 11 so as to expose the upper surface of the wavelength conversion plate 30, and the light emitting device 10 is manufactured (step S18).

[0091] According to the first embodiment, at the time of manufacturing the light emitting device 10, as the second coating step, a second paste portion 50B is applied as a guiding portion for causing an excess precursor paste to flow out into a gap region between the light emitting portion EM of each light emitting element 20 and the electrode pad BP. Thereby, the excess precursor paste at the joint between the light emitting element 20 and the wavelength conversion plate 30 flows out as an outflow paste 51M to the side of the electrode pad BP, and the bonding wire BW sucks them and stores them around itself. Further, when the joint paste 50M becomes insufficient at the joint, the precursor paste is supplied from the outflow paste 51M to the joint. By thus sucking or supplying the precursor paste from or to the joint, the amount of the precursor paste can be controlled to an appropriate amount at each joint of the light emitting element 20. Further, by controlling the amount of the precursor paste at the joint, it is possible to prevent the precursor paste from dripping onto the side surface of the light emitting element 20 and from excessively creeping onto the side surface of the wavelength conversion plate 30.

[0092] Also, the joint paste 50M at the joint is sucked, stored around the bonding wire BW via the outflow paste 51M or supplied to the joint via the outflow paste 51M. Thereby, between adjacent light emitting elements 20, the adhesive resin 50 forms an inter-element side surface portion 54 and an inverted bend portion 55 of the adhesive resin 50 that deflects the emitted light LM from the light emitting portion EM to the light extraction surface which is the upper surface of the wavelength conversion plate 30. Thereby, it becomes possible to improve the light extraction efficiency of the light emitting device 10.

[0093] Therefore, the present invention can provide a light emitting device 10 and a method for manufacturing the same that can improve the light extraction efficiency of the light emitting device 10 while preventing the adhesive resin 50 from dripping onto the side surface of the light emitting element 20 and from creeping onto the side surface of the wavelength conversion plate 30.

Example

[0094] In Example 1, the manufacturing method of the light-emitting device 10 was described for the case where the precursor paste of the adhesive resin 50 is applied twice, i.e., a first application step of applying the precursor paste to the central region of the light-emitting part EM and a second application step of applying it to the gap between the light-emitting part EM and the electrode pad BP. However, the method of applying the precursor paste is not limited to this.

[0095] FIG. 22 is a diagram showing the manufacturing flow of the light-emitting device 10 according to Example 2 of the present invention. In Example 2, the precursor paste of the adhesive resin 50 is not applied twice as in Example 1, but is performed in one step. That is, in Example 2, among the manufacturing flows shown in FIG. 6, it is different from Example 1 in that the two application steps of steps S13 and S14 are not performed, and only the one application step of step S23 is performed. That is, in Example 2, step S23 is treated as the resin application step. Note that each of steps S21 to S22 and steps S24 to S27 in the manufacturing flow in Example 2 is the same as each of steps S11 to S12 and steps S15 to S18 in the manufacturing flow in Example 1, so the description thereof is omitted.

[0096] FIGS. 23 and 24 show a top view and a cross-sectional view of the light-emitting device 10 in step S23 of the manufacturing procedure shown in FIG. 22. FIG. 24 is an enlarged cross-sectional view of the light-emitting element 20 along line G-G of FIG. 23.

[0097] In step S23, as shown in FIG. 23, after applying the third paste portion 50C as the first resin portion to the central region of the light-emitting part EM, it is applied so as to form a paste expansion portion 50D as a resin expansion portion (step S23).

[0098] In this step, as shown in FIG. 24, the dispenser nozzle DN filled with the precursor paste of the adhesive resin 50 discharges the precursor paste in the central region of the light-emitting part EM to apply the third paste part 50C. Then, the discharge of the precursor paste from the dispenser nozzle DN is stopped, and the dispenser nozzle DN is moved in the direction along the upper surface of the support substrate 21 toward the electrode pad BP side. Also, the dispenser nozzle DN is moved, for example, toward the center in the long-side direction of the gap between the light-emitting part EM and the electrode pad BP. That is, the dispenser nozzle DN is moved on the upper surface of the support substrate 21 along a straight line passing through the center point of the light-emitting part EM and the center point of the electrode pad BP. In other words, in the resin application step, resin is applied to the central region of the light-emitting part EM to form the third paste part 50C, and the dispenser nozzle DN is moved to form the resin expansion part in the central region in the direction of the predetermined length of the gap.

[0099] At this time, due to the viscosity of the precursor paste, the precursor paste is stretched between the dispenser nozzle DN and the third paste part 50C. Then, the stretched precursor paste separates from the dispenser nozzle DN and falls onto the upper surface of the light-emitting element 20, thereby forming the paste expansion part 50D. The paste expansion part 50D extends from the application position of the third paste part 50C over the gap between the light-emitting part EM and the electrode pad BP to the upper surface of the electrode pad BP. In other words, the method for manufacturing a light-emitting device includes a resin application step of applying resin using the dispenser nozzle DN onto the light-emitting part EM of at least one light-emitting element 20 to form the third paste part 50C, and moving the dispenser nozzle DN in the direction along the upper surface of the light-emitting element 20 toward the electrode pad BP to form the paste expansion part 50D, which is a resin part reaching the electrode pad BP beyond the gap from the third paste part 50C.

[0100] Further, the shape of the paste extension part 50D is determined by the moving position of the dispenser nozzle DN. Therefore, the dispenser nozzle DN may be appropriately set with a moving amount so that the paste extension part 50D extends up to the upper surface of the electrode pad BP. In addition, when applying the third paste part 50C and the paste extension part 50D, the paste extension part 50D and the bonding wire BW may be separated or in contact with each other. It is sufficient that the paste extension part 50D is applied so as to extend up to the upper surface of the electrode pad BP. In other words, in the resin application step, the resin is applied so that the paste extension part 50D is close to at least one bonding wire BW. Further, the resin is applied so that the paste extension part 50D is in contact with at least one bonding wire BW.

[0101] Thereafter, the light-emitting device 10 is manufactured by performing the steps of steps S24 to S27. In step S24, when the wavelength conversion plate 30 is placed and the third paste part 50C is pressed, the precursor paste flows out to the electrode pad BP. Further, the wetting and spreading behavior of the third paste part 50C and the paste extension part 50D is the same as that in FIGS. 15 to 18 of the first embodiment. Therefore, also in the second embodiment, the third paste part 50C and the paste extension part 50D become the joint part paste 50M of the joint part and the outflow paste 51M that has flowed out from the joint part when the wavelength conversion plate 30 is placed.

[0102] Also, similar to the first embodiment, when the outflow paste 51M comes into contact with the bonding wire BW, it is attracted and stored around the bonding wire BW, and drains the excess precursor paste of the joint part paste 50M of the joint part. Further, when the wetting and spreading of the joint part paste 50M over the entire surface of the joint part between the light-emitting element 20 and the wavelength conversion plate 30 is insufficient, the outflow paste 51M that has flowed out and stored around the bonding wire BW is supplied (re-drained) to the joint part to make up for the shortage. That is, also in the second embodiment, it is possible to self-volume control the joint part paste 50M of the joint part in each of the light-emitting elements 20 to an appropriate amount by draining and re-draining the outflow paste 51M that has flowed out.

[0103] Therefore, also in Example 2, it is possible to provide a light-emitting device 10 and a method for manufacturing the same that can improve the light extraction efficiency of the light-emitting device 10 while preventing the resin 50 from dripping onto the side surface of the light-emitting element 20 and climbing onto the side surface of the wavelength conversion plate 30.

[0104] In addition, in the present Examples 1 and 2, the case where at least one bonding wire BW among the bonding wires BW is bonded to the central region of the electrode pad BP has been described. However, the bonding position of the bonding wire BW is not limited to this.

[0105] FIGS. 25 and 26 show a method for manufacturing a light-emitting device 10 according to a modification of the present Examples 1 and 2.

[0106] In Examples 1 and 2, the bonding wire BW is bonded to the central region of the electrode pad BP, and the second paste portion 50B or the paste extension portion 50D is applied so as to be close to or in contact with the bonding wire BW bonded to the central region. In this modification, for example, the bonding wire BW is bonded to a position offset in the left-right direction from the central region of the electrode pad BP. That is, the bonding wires BW are bonded in a plurality along the long side direction of the electrode pad BP on the electrode pad BP. In other words, in the wire bonding process, a plurality of bonding wires BW are bonded side by side in the direction of a predetermined length of the gap on the electrode pad BP. Further, in the resin application process, the resin is applied so that the second paste portion 50B or the paste extension portion 50D is disposed between one bonding wire BW among the plurality of bonding wires BW and another bonding wire BW adjacent to the one wire.

[0107] When the wavelength conversion plate 30 is placed on the upper surfaces of these light-emitting elements 20, surplus precursor paste flows out onto the electrode pads from the second paste portion 50B or the paste extension portion 50D, in the same manner as in each of the above-described embodiments. The outflowing precursor paste spreads wetly on the electrode pads BP and is sucked (drained) and stored around the bonding wire BW by surface tension when it comes into contact with the bonding wire BW. Further, when the joint paste 50M is insufficient to spread wetly over the entire surface of the joint portion between the light-emitting element 20 and the wavelength conversion plate 30, the outflow paste 51M that has flowed out and been stored around the bonding wire BW is supplied (redrained) to the joint portion to compensate for the shortage.

[0108] That is, even when the bonding position of the bonding wire BW is offset in the left-right direction from the central region of the electrode pad BP and bonded as in this modified example, the precursor paste at the joint portion of each of the light-emitting elements 20 can be drained and redrained, and it becomes possible to self-volume control the precursor paste at the joint portion to an appropriate amount.

[0109] The bonding position of the bonding wire BW may be a position where the outflow paste 51M that has flowed out from the joint portion contacts and is sucked by the bonding wire BW earlier than the first paste portion 50A or the third paste portion 50C that spreads wetly over the joint portion hangs down from the upper surface of the support substrate 21 after the wavelength conversion plate 30 is placed.

[0110] In addition, in this embodiment, the light-emitting device 10 in which the wavelength conversion plate 30 integrally formed over the upper surfaces of the plurality of light-emitting elements 20 is fixed with the adhesive resin 50 has been described. However, the number of light-emitting elements 20 mounted on the light-emitting device 10 is not limited to a plurality.

[0111] Even when there is one light-emitting element 20 mounted on the light-emitting device 10, when the wavelength conversion plate 30 is placed on the light-emitting element 20, surplus precursor paste flows out from the outflow paste 51M during the wet spreading of the precursor paste, and is sucked and stored around the bonding wire BW. Also, when the precursor paste that spreads over the joint is insufficient, the outflow paste 51M stored around the bonding wire BW is supplied to the joint.

[0112] Therefore, even when there is one light-emitting element 20 mounted on the submount 13, draining of the outflow paste 51M from the joint and redraining to the joint can be realized in the same manner as in the embodiment. Also, self-volume control of the joint paste 50M at the joint and self-alignment of the mounting position of the wavelength conversion plate 30 can be realized in the same manner as in the embodiment.

[0113] Also, in the first and second embodiments, the light-emitting device 10 in which the wavelength conversion plate 30 integrally formed across a plurality of light-emitting elements 20 is fixed with the adhesive resin 50 has been described. However, the wavelength conversion plate 30 may be individually mounted on each of the light-emitting elements 20.

[0114] Even in this case, similar to the case where there is one light-emitting element 20 mounted on the light-emitting device 10 described above, draining of the outflow paste 51M from the joint and redraining to the joint on each light-emitting element 20 can be realized in the same manner as in the embodiment. Also, self-volume control of the joint paste 50M at the joint and self-alignment of the mounting position of the wavelength conversion plate 30 can be realized in the same manner as in the embodiment.

[0115] Further, when the wavelength conversion plates 30 are individually placed on each of the plurality of light-emitting elements 20, for example, a wavelength conversion plate 30 that is excited by the light emitted from the light-emitting element 20 to perform wavelength conversion to white and a wavelength conversion plate 30 that is excited by the light emitted from the light-emitting element 20 to perform wavelength conversion to orange may be alternately arranged. Thereby, the light-emitting device 10 can color-tune the light radiated from the light extraction surface of the light-emitting device 10. Further, a plurality of corresponding wirings T1, T2 may be provided on the housing 11 so that the plurality of light-emitting elements 20 can emit light independently, and each of the light-emitting elements 20 may be made to emit light individually.

[0116] In addition, in the first and second embodiments, the case where the light-emitting portion EM of the light-emitting element 20 is a blue LED mainly made of a nitride semiconductor has been described. However, the material of the light-emitting portion EM is not limited to this, and it can be applied to various LED and laser semiconductor light-emitting layers that emit light of other colors. Specifically, any light-emitting element 20 in which the light-emitting portion EM and the electrode pads BP are juxtaposed on the support substrate 21 may be used.

[0117] In addition, in the first and second embodiments, the light-emitting device 10 including the wavelength conversion plate 30 that is excited by the light emitted from the light-emitting element 20 to perform wavelength conversion of the emitted light has been described. However, the wavelength conversion plate 30 may be a projection plate that does not perform wavelength conversion of the light emitted from the light-emitting element 20.

[0118] In addition, in the present embodiment, the case where the cavity between the adjacent light-emitting elements 20 is a gas such as air or nitrogen has been described. However, the cavity between the adjacent light-emitting elements 20 may be filled with a covering member 15. For example, when the cavity between the light-emitting elements 20 is filled with a light-reflective covering member 15, the radiation light LM traveling from the light-emitting portion EM toward the side surface portion 54 between the elements is reflected, and the light (not shown) propagating in the wavelength conversion plate 30 in the downward or lateral direction is reflected by the reverse bend portion 55 and polarized toward the surface side of the wavelength conversion plate 30, so that the light extraction efficiency can be improved. In particular, the light extraction efficiency from the portion corresponding to the gap between the light-emitting elements 20 of the wavelength conversion plate 30 can be improved.

[0119] By filling the covering member 15, the covering member 15 reflects the light that is scattered inside the wavelength conversion plate 30 and radiated to the lower surface side of the light emitting device 10, making it possible to further improve the light extraction efficiency of the light emitting device 10.

Explanation of Signs

[0120] 10 Light emitting device 11 Housing 13 Submount 15 Covering member 20 Light emitting element 21 Support substrate 30 Wavelength conversion plate 50 Adhesive resin 51 Outflow resin 52 End side surface 53 Concave portion 54 Inter-element side surface 55 Reverse bend portion

Claims

1. A method for manufacturing a light-emitting device, comprising: An element bonding step of bonding at least one light-emitting element having a support substrate, a semiconductor layer including a light-emitting layer formed on the support substrate, and an electrode pad formed on the support substrate with a gap from the semiconductor layer on a mounting substrate; A wire bonding step of bonding at least one conductive wire on the electrode pad of the at least one light-emitting element; A resin coating step including a first coating step of applying a resin on the semiconductor layer of the at least one light-emitting element to form a first resin portion, and a second coating step of separately applying a resin so as to straddle the gap at a position away from the first resin portion between the semiconductor layer and the electrode pad to form a second resin portion; A wavelength conversion plate arrangement step of arranging a wavelength conversion plate so as to press the first resin portion against the upper surface of the semiconductor layer on the semiconductor layer, the method for manufacturing a light-emitting device being characterized by including the steps.

2. The gap has a constant width and is continuous for a predetermined length, and in the second coating step, the resin is applied over a partial length of the predetermined length of the gap. The method for manufacturing a light-emitting device according to claim 1, characterized in that.

3. In the second coating step, the resin is applied such that the second resin portion is close to the at least one wire. The method for manufacturing a light-emitting device according to claim 2, characterized in that.

4. In the second coating step, the resin is applied such that the second resin portion contacts the at least one wire. The method for manufacturing a light-emitting device according to claim 2, characterized in that.

5. In the first coating step, the resin is applied to a central region of the semiconductor layer to form the first resin portion, In the second coating step, the second resin portion is formed in a central region in the direction of the predetermined length of the gap, The method of manufacturing a light-emitting device according to any one of claims 2 to 4, characterized in that in the wire bonding step, at least one wire is formed in a central region in a direction of the predetermined length of the gap on the electrode pad.

6. In the wire bonding step, a plurality of wires are arranged side by side in a direction of the predetermined length of the gap on the electrode pad and bonded in a plurality of bonds. The method of manufacturing a light-emitting device according to claim 2 or 3, characterized in that in the second coating step, the resin is coated so that the second resin portion is disposed between one wire of the plurality of wires and another wire adjacent to the one wire.

7. A method of manufacturing a light-emitting device, An element bonding step of bonding at least one light-emitting element having a support substrate, a semiconductor layer including a light-emitting layer formed on the support substrate, and an electrode pad formed on the support substrate with a gap from the semiconductor layer on a mounting substrate; A wire bonding step of bonding at least one conductive wire on the electrode pad of the at least one light-emitting element; A resin coating step of applying a resin using a dispenser nozzle on the semiconductor layer of the at least one light-emitting element to form a first resin portion, and moving the dispenser nozzle in a direction along the upper surface of the light-emitting element toward the electrode pad to form a resin extension portion which is a resin portion reaching the electrode pad beyond the gap from the first resin portion; A wavelength conversion plate arranging step of arranging a wavelength conversion plate on the semiconductor layer so as to press the first resin portion against the upper surface of the semiconductor layer, the method of manufacturing a light-emitting device being characterized by including these steps.

8. The method of manufacturing a light-emitting device according to claim 7, characterized in that in the resin coating step, the resin is coated so that the resin extension portion is close to the at least one wire.

9. The method for manufacturing a light-emitting device according to claim 7, wherein in the resin coating step, the resin is coated so that the resin expansion portion contacts the at least one wire.

10. The gap is continuous with a constant width for a predetermined length, In the resin coating step, the resin is coated on the central region of the semiconductor layer to form the first resin portion, and the dispenser nozzle is moved to form the resin expansion portion in the central region in the direction of the predetermined length of the gap. The method for manufacturing a light-emitting device according to any one of claims 7 to 9, wherein in the wire bonding step, the at least one wire is formed in the central region in the direction of the predetermined length of the gap on the electrode pad.

11. The gap is continuous with a constant width for a predetermined length, In the wire bonding step, a plurality of wires are arranged side by side in the direction of the predetermined length of the gap on the electrode pad and bonded in a plurality. The method for manufacturing a light-emitting device according to claim 7 or 8, wherein in the resin coating step, the resin is coated so that the resin expansion portion is disposed between one wire among the plurality of wires and another wire adjacent to the one wire.

12. A mounting substrate, At least one light-emitting element having a support substrate disposed on the mounting substrate, a semiconductor layer including a light-emitting layer formed on the support substrate, and an electrode pad formed on the support substrate with a gap from the semiconductor layer. At least one conductive wire having one end bonded on the electrode pad of the at least one light-emitting element and the other end bonded on an electrode on the mounting substrate. A protective film having an opening that covers the upper surface of the support substrate in the gap and covers the side surface of the electrode pad to expose the upper surface of the electrode pad. A resin portion made of resin, which is formed on the semiconductor layer of the at least one light-emitting element and extends from the upper surface of the semiconductor layer through the protective film in the gap to the upper surface of the electrode pad exposed from the opening. A light-emitting device comprising: a wavelength conversion plate disposed above the at least one light-emitting element so as to cover the semiconductor layer from above the resin portion.

13. The gap of the at least one light-emitting element is continuous with a predetermined length with a constant width, according to the light-emitting device described in claim 12.

14. One of the at least one wire is formed in a central region in the direction of the predetermined length of the gap on the electrode pad, according to the light-emitting device described in claim 13.

15. At least a part of the at least one wire is covered by the resin portion, according to any one of claims 12 to 14 of the light-emitting device.

16. The at least one wire is spaced apart from the wavelength conversion plate, according to any one of claims 12 to 15 of the light-emitting device.

17. The resin portion is made of a paste mainly composed of a thermosetting silicone resin, according to any one of claims 12 to 16 of the light-emitting device.

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