Light-emitting device and method for manufacturing the same

Abstract

To provide a moderately low intensity light-emitting device and a manufacturing method thereof.SOLUTION: A light-emitting device includes a base 11 having a recess 11a, a light emitting element 12 arranged in the recess 11a, a sealing member 13 disposed in the recess 11a, covering the light emitting element 12, and having a concave surface 13a, and a light absorbing member 14 disposed above the recess 11a and fixed to the base 11, and a space 15 is provided between the surface of the sealing member 13 and the light absorbing member 14.SELECTED DRAWING: Figure 1C

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a method for manufacturing the same.

Background Art

[0002] In recent years, light-emitting devices have been used in various applications with increasing output power. However, depending on the application, a low-luminance light-emitting device is required, and thus a light-emitting element using light-shielding particles or the like has been proposed (Patent Document 1, etc.).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a light-emitting device having an appropriate low luminance and a method for manufacturing the same.

Means for Solving the Problems

[0005] A light-emitting device according to an embodiment of the present disclosure includes a substrate having a recess, a light-emitting element disposed in the recess, a sealing member disposed in the recess and covering the light-emitting element and having a concave surface on the surface, and a light absorption member disposed above the recess and fixed to the substrate, and has a space between the surface of the sealing member and the light absorption member. A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes a step of preparing an intermediate body including a substrate having a recess, a light-emitting element disposed in the recess, and a sealing member disposed in the recess and covering the light-emitting element and having a concave surface on the surface, and a step of disposing a light absorption member above the recess and fixing the light absorption member to the substrate so as to have a space between the surface of the sealing member and the light absorption member.

Effects of the Invention

[0006] According to an embodiment of the present invention, a light-emitting device with moderately low light intensity and a method for manufacturing the same can be provided.

Brief Description of the Drawings

[0007]

Figure 1A

Figure 1B

Figure 1C

Figure 2A

Figure 2B

Figure 2C

Figure 3

Figure 4A

Figure 4B

Figure 4C

Figure 5

Figure 6A

Figure 6B

Figure 6C

Figure 6D

Figure 6E

Figure 6F

Figure 6G

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments shown below are examples for embodying the technical idea of the present invention and do not limit the present invention thereto. Also, the sizes and positional relationships of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, the same names and reference numerals generally indicate the same or similar members, and duplicate explanations will be omitted as appropriate. In addition, an end view showing only a cross-section may be used as a cross-sectional view.

[0009] [Light-Emitting Device] As shown in FIGS. 1A to 1C, the light-emitting device 10 of the present embodiment includes a substrate 11 having a recess 11a, a light-emitting element 12 disposed in the recess 11a, a sealing member 13 disposed in the recess 11a to cover the light-emitting element 12 and having a concave surface 13a on its surface, and a light absorption member 14 disposed above the recess 11a and fixed to the substrate 11. The light-emitting device 10 has a space 15 between the surface of the sealing member 13 and the light absorption member 14. By having such a configuration, by utilizing the difference in refractive index between the sealing member, air, and the light absorption member, it is possible to make it difficult for the light emitted from the light-emitting element to be emitted from the light-emitting device and to block the light. As a result, a light-emitting device with appropriately low luminance can be obtained. In addition, due to the presence of the space, the sealing member and the light absorption member do not come into direct contact, so it is difficult to transfer the heat generated when the light-emitting element is lit via the sealing member to the light absorption member, and thus it is possible to reduce the thermal degradation of the light absorption member and provide a light-emitting device with stable quality. Furthermore, even if the expansion and contraction of the sealing member occur by repeatedly turning the light-emitting device on and off, since there is no problem of interfacial peeling between the sealing member and the light absorption member, it is possible to provide a highly reliable light-emitting device. Also, by providing a light absorption member on the surface of the light-emitting device, it is possible to cover the sealing member having normal tackiness and reduce the tackiness of the surface of the light-emitting device.

[0010] (Substrate 11) The substrate 11 functions as a housing for accommodating the light-emitting element 12. The substrate 11 has a recess 11a. The recess 11a has an opening in the upper surface 11b of the substrate 11 and has a bottom surface 11c and side surfaces. In the present embodiment, the outer edge of the upper surface 11b is substantially rectangular. In the present embodiment, the substrate 11 is formed by embedding a part of a pair of lead terminals 8 in an insulating material. The upper surface 11b of the substrate 11 is flat in the present embodiment, but may be provided with irregularities or may be provided with a groove or the like surrounding the opening. The insulating material is preferably a material through which light from the light-emitting element 12 and external light are hardly transmitted. In order to maintain the structure of the substrate 11, it preferably has a predetermined strength. The substrate 11 is formed of, for example, a thermosetting resin, a thermoplastic resin, ceramics, or the like. Specifically, resin materials such as epoxy resin, silicone resin, phenol resin, glass epoxy resin, BT resin, polyphthalamide (PPA) resin, and ceramic materials such as aluminum oxide and aluminum nitride can be mentioned. The substrate 11 is preferably formed of a material that reflects light from the light-emitting element on the side surface that defines the recess 11a. Thereby, the light from the light-emitting element can be dispersed, and it is possible to make the luminance appropriately low. In order to reflect or disperse light, for example, it is preferable to incorporate a light reflecting material into an insulating material. Examples of the light reflecting material include titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (for example, yttrium oxide, gadolinium oxide), etc. Among them, one or more selected from the group consisting of titanium dioxide, boron nitride, silicon dioxide and aluminum oxide are preferable. In particular, from the viewpoint of improving reflectivity, titanium dioxide is more preferable, and from the viewpoint of thermal conductivity, boron nitride is more preferable.

[0011] The lead terminal 8 functions as a terminal for electrically connecting the light emitting element 12 to wiring or the like outside the substrate 11. A part of the lead terminal 8 is exposed on the bottom surface 11c defining the recess 11a and the outer surface of the substrate 11, and the other part is embedded in the substrate 11. The lead terminal 8 can be formed of a material known in the art, and can be formed, for example, by a single layer or laminated structure of a metal such as aluminum, iron, nickel, copper or an alloy containing these. The lead terminal may have, for example, Ag, an Ag alloy, Au, an Au alloy, etc. coated on its surface.

[0012] (Light emitting element 12) The light emitting element 12 is a semiconductor light emitting element such as a semiconductor laser or a light emitting diode. The emission wavelength of the light emitting element 12 can be arbitrarily selected. For example, as blue and green light emitting elements, ZnSe, nitride semiconductors (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X + Y≦1) can be used. Also, as a red light emitting element, GaAs, AlInGaP, AlGaAs-based semiconductors, etc. can be used. Semiconductor light emitting elements made of other materials can also be used. The composition, emission color, size, number, etc. of the light emitting element to be used can be appropriately selected according to the purpose. It can be a light emitting element that outputs not only visible light but also ultraviolet rays or infrared rays. In this embodiment, the light-emitting element 12 is disposed on the lead terminal 8 exposed on the bottom surface 11c of the recess 11a. The pair of positive and negative electrodes of the light-emitting element 12 are electrically connected to the pair of lead terminals 8 exposed on the bottom surface 11c of the recess 11a. The electrical connection may utilize a conductive wire or may be a flip-chip mounting using a conductive bonding member.

[0013] (Sealing member 13) The sealing member 13 is disposed in the recess 11a and is a protective member for protecting the light-emitting element 12, optionally a conductive wire or a bonding member, etc. from moisture, external force, and dust. The sealing member 13 preferably fills part or all of the recess 11a, covers the light-emitting element 12, etc. in the recess 11a, and is not disposed on the upper surface 11b of the base 11. The sealing member 13 has a concave surface 13a on its surface. The concave surface 13a may be disposed over the entire surface of the sealing member 13 or only on a part thereof. The concave surface 13a preferably has a maximum depth at the upper part where the light-emitting element is disposed. The maximum depth of the recess of the concave surface (H in FIG. 1C), that is, the maximum distance between the concave surface 13a and the surface of the light-absorbing member 14 facing the light-emitting element can be appropriately adjusted according to the material constituting the sealing member 13, etc., and for example, 25% or less of the depth of the recess can be mentioned. In other words, the thickness of the sealing member 13 directly above the light-emitting element can be 300 μm or more and 400 μm or less. The concave surface 13a of the sealing member 13 may be a gently downwardly bulging curved surface as shown in FIG. 1C. As shown in FIG. 3, the concave surface 23a of the sealing member 23 may have a convex shape on the upper surface 11b side around the recess 11a and may have a curved surface that rapidly concaves toward the light-emitting element 12 inside. The vicinity of the center of the concave surface 13a may be flat, and the sealing member 13 may adopt a form in which it rapidly climbs along the side wall of the recess 11a.

[0014] The encapsulating member 13 preferably has light transmissivity in order to transmit the light emitted from the light-emitting element 12 and to prevent deterioration of the encapsulating member due to the light being absorbed by the encapsulating member and converted into heat. Here, the light transmissivity preferably transmits, for example, 60% or more of the light emitted from the light-emitting element, more preferably 70% or more or 80% or more. The encapsulating member 13 can be configured to include a thermosetting resin, a thermoplastic resin, or the like. Specifically, modified epoxy resin compositions such as epoxy resin compositions, silicone resin compositions, and silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; hybrid silicone resins; polyimide resin compositions, modified polyimide resin compositions; polyphthalamide (PPA); polycarbonate resins; polyphenylene sulfide (PPS); liquid crystal polymers (LCP); ABS resins; phenolic resins; acrylic resins; resins such as PBT resins can be mentioned. Among them, resins or hybrid resins containing one or more of silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, and acrylic resins are preferred, more preferably one or more selected from silicone resins and epoxy resins, and even more preferably a silicone resin.

[0015] In addition to the above-described resins, the encapsulating member 13 may contain a filler. Examples of the filler include a wavelength conversion member and / or a light diffusing material. Examples of the wavelength conversion member include phosphors and quantum dots. As the phosphor, a known phosphor is used. Examples of the phosphor include yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (for example, Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (for example, Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (for example, Ca8MgSi4O16 Chloride-based phosphors (e.g., (Si,Al)3(O,N)4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu), α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu), or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si,Al)F6:Mn), or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc., fluoride-based phosphors, phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2, or AgInSe2), etc. can be used. The phosphors may be used in combination of a plurality of types of phosphors. For example, phosphors having different emission colors can be used in a combination and / or blending ratio suitable for a desired color tone to adjust the color rendering property and / or color reproducibility. As the light diffusing material, any of fillers such as titanium oxide, barium titanate, aluminum oxide, silicon oxide, zirconium oxide, aerosil, glass, glass fiber, or wollastonite, aluminum nitride, etc., which are commonly used in the art, may be used. By using this, light is reflected in random directions, and unevenness in luminance, color unevenness, etc. of the light emitted from the light emitting device can be suppressed.

[0016] From the viewpoint of easily preventing the generation of voids, the material constituting the sealing member 13 preferably contains a resin having high fluidity and being cured by irradiation with heat or light. Such materials include, for example, those having fluidity at a viscosity of 0.5 Pa·s to 30 Pa·s. The sealing member 13 can be formed, for example, by injection molding, potting molding, resin printing method, transfer molding method, compression molding, etc.

[0017] (Light absorption member 14) The light absorption member 14 is disposed above the concave portion 11a of the base 11 and fixed to the upper surface 11b of the base 11. The light absorption member 14 is a member used to absorb the light emitted from the light emitting element to make the light emitting device have an appropriately low light intensity. For example, it is preferable that the light absorption member 14 absorbs 30% or more of the light emitted from the light emitting element. As long as such light absorption is realized, the light absorption member 14 may cover the entire surface of the sealing member 13 or only a part thereof, as shown in FIG. 1B for example. For example, when the light absorption member 14 covers the entire surface of the sealing member, it is preferable to appropriately select or set the material and / or thickness of the light absorption member 14 so that it can absorb 30% or more of the light emitted from the light emitting element. Alternatively, in addition to adjusting the material and / or thickness of the light absorption member 14, it is preferable to cover 50% to 90% of the surface of the sealing member. For this purpose, for example, as shown in FIGS. 2A and 4A, a plurality of holes 24a, 34a may be arranged in the light absorption members 14, 24. The holes 24a, 34a may be bottomed holes, but are preferably through holes. The size, shape, and number of the holes 24a, 34a are not particularly limited. The holes can have various shapes such as circular, elliptical, triangular, quadrangular and other polygonal shapes or combinations thereof. The size of one hole can be, for example, a size having an area of 1 / 100 to 1 / 2 of the light emitting surface (upper surface) of the light emitting element. Also, the size of the hole can be, for example, a diameter or width smaller than the thickness of the light absorption member.

[0018] By arranging such holes 24a, 34a, most of the primary light emitted from the light emitting element hits the side walls of the holes and is absorbed depending on the position, and the degree of light absorption can be increased. The holes 24a and 34a, in multiple cases, may all be arranged with the same shape, the same size and / or the same interval, or some or all of them may have different shapes, different sizes and / or different intervals. For example, as shown in FIG. 4A, the hole 34a may be arranged to be small or non-existent at the center of the sealing member directly above the light-emitting element and to become larger at its outer periphery or toward the outer periphery. When the light-emitting element is placed at the center, as shown in FIG. 4C, the light A emitted from the light-emitting element has an increasing tilt angle toward the outer peripheral direction of the concave surface 13a of the sealing member 13, so that it is difficult to be emitted from the hole 34a of the light absorption member 14. Therefore, by arranging large holes 34a at the outer peripheral portion of the light absorption member 14, the uniformity of the light luminance in the plane can be adjusted. The holes may be arranged with the same pitch in the plane or may be arranged unevenly with different pitches. The holes can be arranged, for example, in a matrix (FIG. 2A), in a concentric circle (concentric ellipse) shape (FIG. 4A), or randomly. Also, in a plan view, more holes may be arranged at the outer periphery of the sealing member, that is, rather than directly above the light-emitting element (FIG. 4A). For example, the arrangement of holes in a matrix can easily form the holes and can contribute to light distribution. When the light-emitting element is placed at the center and the holes are arranged in a concentric circle or the like or when many holes are arranged at the outer periphery, the portion with high light output directly above the light-emitting element can be covered with the light absorption member, and holes can be arranged at its outer periphery. Therefore, strong light does not directly pass through the light absorption member, and a uniform or substantially uniform light intensity can be given in the plane. Also, the holes can ensure air permeability. The random arrangement can reduce light emission variations.

[0019] The light absorption member 14 is configured by including a light-absorbing substance in a base material. Examples of the light-absorbing substance include black pigments such as carbon black and graphite. The black pigment is preferably in the form of grains or powder having an average particle size of 200 nm or more and 400 nm or less, for example. Examples of the base material include the above-described thermosetting resin and thermoplastic resin. Among them, a silicone resin is preferable. The light absorption member 14 is preferably made of a material in which carbon black is contained in a silicone resin, for example. By using such a material, light absorption can be effectively performed and light resistance can be ensured. In this case, the content of carbon black is 5% by weight or more and 25% by weight or less, preferably 8% by weight or more and 20% by weight or less, based on the total weight of the light absorption member. The light-absorbing substance is preferably uniformly or substantially uniformly dispersed in the base material. Thereby, absorption and / or emission of light can be easily controlled. In addition, color unevenness of the light-emitting device can be improved.

[0020] The light absorption member 14 is disposed above the concave portion 11a, that is, so as to cover the surface of the sealing member 13 having the concave surface 13a. By disposing the sealing member 13 and the light absorption member 14 separately, a space 15 can be formed between the surface of the sealing member 13 and the opposing surface of the light absorption member 14 with respect to the light emitting element 12. This space 15 is a closed space and may contain air (Fig. 1B), or may be a space 15 that is partially opened by the above-described holes and thereby comes into contact with air (Figs. 2A, 4A). In this way, by disposing the space 15, that is, an air layer, between the sealing member 13 and the light absorption member 14, a refractive index difference can be provided between the sealing member, the air layer, and the light absorption member. As a result, the light emitted from the light emitting element can be made less likely to be emitted above the light absorption member, and a light emitting device with an appropriate low light intensity can be obtained. Further, due to the arrangement of the space 15, the sealing member and the light absorption member are disposed separately, so that the heat generated by the light emitting element and accumulated in the sealing member can be made less likely to be transmitted to the light absorption member, and thus the thermal degradation of the light absorption member can be reduced. Furthermore, since the expansion or contraction of the sealing member due to heat can be alleviated by the air layer, expansion or contraction, thermal degradation, etc. of the light emitting device itself can be prevented. In addition, since the sealing member usually has tackiness, the sealing member and another light emitting device or the like may be adhered to each other by contact or the like. However, by covering the sealing member with the light absorption member, the tackiness of the sealing member can be reduced.

[0021] [Method for manufacturing a light emitting device] As shown in Fig. 5, the method for manufacturing the light emitting device of the present embodiment includes a step (S1) of preparing an intermediate body 9 including a substrate 11 having a concave portion 11a, a light emitting element 12 disposed in the concave portion 11a, and a sealing member 13 disposed in the concave portion 11a and covering the light emitting element 12 and having a concave surface 13a on the surface, and a step (S2) of disposing a light absorption member 14 above the concave portion 11a and fixing the light absorption member 14 to the substrate 11 so as to have a space 15 between the surface of the sealing member 13 and the light absorption member 14.

[0022] (Preparation of the intermediate body 9: S1) To prepare the intermediate 9, for example, as shown in FIGS. 5 and 6A to 6D, a substrate 11 having a recess 11a is prepared (S11), a light-emitting element 12 is disposed in the recess 11a of the substrate 11 (S12), an uncured sealing member 13m is filled (S13), and the uncured sealing member 13m is cured to form a sealing member 13 having a concave surface 13a on its surface (S14). Although it is preferable to include these steps, only some of them may be omitted.

[0023] (Preparation of Substrate 11: S11) First, as shown in FIG. 6A, a substrate 11 having an upper surface 11b and a recess 11a having an opening located on the upper surface 11b is prepared. The substrate 11 includes the lead terminals 8 as described above. When manufacturing a plurality of light-emitting devices simultaneously, a plurality of substrates 11 may be prepared. In this case, in order to improve the manufacturing efficiency such as mounting of the light-emitting element and filling of the sealing member, it is preferable to arrange a plurality of substrates 11 two-dimensionally at a predetermined pitch. For this purpose, a lead frame on which a plurality of substrates are arranged may be used. The substrate 11 may be formed, for example, by using a known method such as injection molding or transfer molding so as to cover the lead terminals 8, or a commercially available product or a developed product may be purchased.

[0024] (Arrangement of Light-Emitting Element 12: S12) As shown in FIG. 6B, the light-emitting element 12 is disposed on the bottom surface 11c of the recess 11a of the substrate 11. For this purpose, first, the light-emitting element 12 is prepared. The light-emitting element 12 is face-up bonded to the upper surface of one of the pair of lead terminals 8. Next, the pair of electrodes of the light-emitting element 12 and the pair of lead terminals 8 are respectively connected by conductive wires. Also, the light-emitting element may be flip-chip mounted across the pair of lead terminals.

[0025] (Filling of Sealing Member 13m: S13) As shown in FIG. 6C, the recess 11a of the substrate 11 is filled with an uncured sealing member containing, for example, a silicone resin. As the silicone resin, one that does not contain a wavelength conversion member may be used, or one in which a wavelength conversion member is added and dispersed may be used. The silicone resin is filled into the recess 11a of the substrate 11, for example, using a dispenser or the like so as not to cover the upper surface 11b. At this time, when there are the light-emitting element 12 and the conductive wire, it is preferable that the conductive wire is completely covered. Also, the silicone resin may bulge due to surface tension or the like.

[0026] (Curing of the sealing member 13m: S14) As shown in FIG. 6D, the substrate 11 filled with the uncured sealing member 13m is heated to cure the uncured sealing member 13m. For example, the substrate 11 can be heated by holding it in a thermostat having a heater, such as an oven, that can maintain a predetermined temperature. The heating is preferably, for example, at a temperature equal to or higher than the curing temperature of the sealing member. Specifically, 70°C to 200°C can be mentioned. The heating time is, for example, 0.5 hours to 4.0 hours or less. By heating, the sealing member 13 is disposed in the recess 11a of the substrate 11. This sealing member has a concave surface on its surface after curing.

[0027] (Fixing of the light absorption member 14: S2) Subsequently, in order to fix the light absorption member 14 to the substrate 11, for example, as shown in FIGS. 5 and 6E to 6G, the light absorption member 14 is prepared (S21), holes 24a are optionally formed in the light absorption member 14, and a process for fixing the light absorption member 14 to the upper surface 11b of the substrate 11 is performed on the upper surface 11b of the light absorption member 14 and / or the substrate 11 (S22), and it is preferable to include steps of disposing and fixing the light absorption member 14 to the substrate 11 (S23).

[0028] (Preparation of the light absorption member 14: S21) As shown in FIG. 6E, as the light absorption member 14, for example, a sheet-like member is prepared. In this case, the light absorption member 14 may be a flexible sheet-like light absorption member 14, but it is preferably one having a rigidity such that it does not completely follow the concave surface 13a of the sealing member 13 described above. That is, when the light absorption member 14 is placed on the upper surface 11b of the base 11 in order to dispose the light absorption member 14 above the concave portion, it is preferable that a space 15 can be formed in a state where the concave surface 13a and the opposing surface of the light absorption member 14 with respect to the light emitting element are separated without contact. Optionally, as shown in FIG. 6F, in the light absorption member 14, a hole 24a may be formed in a region corresponding directly above the sealing member 13. The hole 24a may be formed by a method known in the art such as laser processing, etching, punching, etc., or may be formed so as to dispose the hole simultaneously when forming the sheet-like light absorption member 14. As the light absorption member 14, for example, a sheet with holes may be used.

[0029] (Treatment of the upper surface 11b of the light absorption member 14 and / or the base 11: S22) It is preferable to perform a surface treatment on either or both of one surface of the light absorption member 14, that is, the surface that contacts the base 11, particularly the region that contacts the upper surface 11b of the base 11, and the upper surface 11b of the base 11. The surface treatment here means a modification treatment of the surface of the light absorption member 14 and / or the upper surface 11b of the base 11 in order to promote the adhesion between the two. Examples of the modification treatment include a treatment of irradiating with an ion beam or plasma. For the ion or plasma, an inert gas or nitrogen may be used. These treatments may be performed in a vacuum, but are preferably performed at atmospheric pressure. Specifically, plasma treatment is performed using an atmospheric plasma treatment apparatus. The atmospheric plasma treatment apparatus performs, for example, a plasma treatment at a frequency of 15 to 25 kHz, an output of 800 W to 1200 W, a plasma species of air, and a plasma irradiation time of 0.5 to 1 second. By performing such a treatment, the surface of the light absorption member 14 and / or the upper surface 11b of the base 11 can be activated, and strong adhesion can be promoted by the contact between the two.

[0030] (Arrangement of the light absorption member 14 on the base 11: S23) Subsequently, the light absorption member 14 is arranged above the concave portion 11a, that is, in contact with the upper surface 11b of the base 11. Thereby, the light absorption member 14 can be fixed to the base 11 so as to have a space 15 between the concave surface 13a of the sealing member 13 and the light absorption member 14 (S2). In order to adhere the two more firmly, it is preferable to press the light absorption member 14 against the upper surface 11b of the base 11. Note that the light absorption member 14 may be fixed to the base 11 using an adhesive, with S22 described above being performed or omitted. At this time, as shown in FIG. 6E, when the light absorption member 14 having no holes is used, as shown in FIG. 1C, a light emitting device 10 having a closed space 15 can be obtained between the light absorption member 14 and the concave surface 13a of the sealing member 13. Further, as shown in FIG. 6F, when the light absorption member 14 having holes 14a is used, as shown in FIG. 6G, a light emitting device 10A having a released space 15 can be obtained between the light absorption member 14 and the concave surface 13a of the sealing member 13. By such a manufacturing method, a light emitting device having a space 15 between the concave surface 13a of the sealing member 13 and the light absorption member 14 can be manufactured.

[0031] Examples As a light emitting device according to an example, a base having a predetermined concave portion was prepared (NHSW146A manufactured by Nichia Chemical Industries, Ltd.). A silicone resin was used as the sealing member, and a YAG phosphor was contained in the sealing member. A 50-μm light shielding film was prepared as the light absorption member disposed above the concave portion and fixed to the base. The light shielding film contains carbon. A space is provided between the surface of the sealing member and the light absorption member. On the other hand, the light emitting device according to the comparative example has the same configuration as the light emitting device according to the example, except that it does not have a light absorption member. The light emitting device of the example had a luminous intensity of 9.0 mcd (If = 5 mA). The light emitting device of the comparative example had a luminous intensity of 243.8 mcd (If = 5 mA). Therefore, the light emitting device of the example showed a luminous intensity reduction rate (%) of 96.3% with respect to the comparative example.

Description of Symbols

[0032] 9 Intermediate body 10, 10A Light-emitting device 11 Substrate 11a Recess 11b Upper surface 11c Bottom surface 16 Lead terminal 12 Light-emitting element 13, 23 Sealing member 13a, 23a Concave surface 13m Sealing member 14, 24 Light absorption member 14a, 24a, 34a Hole 15 Space

Claims

1. A substrate having a recess, A light-emitting element disposed in the recess, A sealing member disposed in the recess, covering the light-emitting element, and having a concave surface, An optical absorption member disposed above the recess and fixed to the substrate, comprising: There is a space between the surface of the sealing member and the optical absorption member, The light-emitting device, wherein the optical absorption member is a material in which carbon black is contained in a silicone resin.

2. The light-emitting device according to claim 1, wherein the content of the carbon black is 5% by weight or more and 25% by weight or less based on the total weight of the optical absorption member.

3. A substrate having a recess, A light-emitting element disposed in the recess, A sealing member disposed in the recess, covering the light-emitting element, and having a concave surface, An optical absorption member disposed above the recess and fixed to the substrate, comprising: There is a space between the surface of the sealing member and the optical absorption member, The light-emitting device, wherein the optical absorption member has a plurality of holes.

4. The light-emitting device according to claim 3, wherein the holes are arranged in a matrix, concentric circles, or randomly in a plan view.

5. The light-emitting device according to claim 3, wherein the holes are arranged more densely near the outer periphery than at the center of the sealing member in a plan view.

6. The light-emitting device according to any one of claims 3 to 5, wherein the holes have a larger diameter near the outer periphery than at the center.

7. The light-emitting device according to any one of claims 3 to 6, wherein the diameter of the holes is smaller than the thickness of the optical absorption member.

8. A substrate having a recess, A light-emitting element disposed in the recess, A sealing member disposed in the recess, covering the light-emitting element, and having a concave surface, An optical absorption member disposed above the recess and fixed to the substrate, comprising: There is a space between the surface of the sealing member and the optical absorption member, The light-emitting device, wherein the optical absorption member absorbs 30% or more of the light from the light-emitting element.

9. A substrate having a recess, A light-emitting element disposed in the recess, A sealing member disposed in the recess, covering the light-emitting element, and having a concave surface, An optical absorption member disposed above the recess and fixed to the substrate, comprising: There is a space between the surface of the sealing member and the optical absorption member, The light-emitting device, wherein the optical absorption member covers 50% or more and 90% or less of the surface of the sealing member.

10. A step of preparing an intermediate body including a substrate having a recess, a light-emitting element disposed in the recess, and a sealing member disposed in the recess, covering the light-emitting element, and having a concave surface; A step of disposing a light absorption member above the recess and fixing the light absorption member to the substrate so as to have a space between the surface of the sealing member and the light absorption member; A method of manufacturing a light-emitting device, comprising a step of performing plasma irradiation on the surface of the light absorption member facing the substrate at atmospheric pressure.

Images