Imaging element and imaging device

Abstract

To provide an imaging element.SOLUTION: An imaging element includes: a pixel unit in which first to fourth pixels are arranged along a column direction, the first pixel including a first photoelectric conversion unit and configured to output a first signal used for focus detection, the second pixel including a second photoelectric conversion unit and configured to output a second signal used for the focus detection, the third pixel including a third photoelectric conversion unit and configured to output a third signal used for image generation, the fourth pixel including a fourth photoelectric conversion unit and configured to output a fourth signal used for the image generation; a first signal line; a second signal line; a first readout unit configured to perform signal processing on a signal output to the first signal line; a second readout unit configured to perform signal processing on a signal output to the second signal line; and a vertical control unit configured to perform a first control to control the first pixel and the second pixel so that the first signal and the second signal are output to one of the first signal line and the second signal line, and a second control to control the third pixel and the fourth pixel so that the third signal and the fourth signal are output to the other signal line of the first signal line and the second signal line.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an imaging device and an imaging apparatus.

Background Art

[0002] An imaging device that reads out a focus detection signal and an image signal is known (for example, Patent Document 1). In such an imaging device, speeding up the signal readout is desired.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect of the invention, an image sensor includes a first photoelectric conversion unit that converts light transmitted through an optical system into electric charges, a first pixel that outputs a first signal used for focus detection of the optical system, a second photoelectric conversion unit that converts light transmitted through the optical system into electric charges, a second pixel that outputs a second signal used for focus detection of the optical system, a third photoelectric conversion unit that converts light transmitted through the optical system into electric charges, a third pixel that outputs a third signal used for image generation, a fourth photoelectric conversion unit that converts light transmitted through the optical system into electric charges, and a pixel unit in which the fourth pixel that outputs a fourth signal used for image generation is arranged along a column direction, a first signal line electrically connectable to the first pixel, the second pixel, the third pixel, and the fourth pixel, a second signal line electrically connectable to the first pixel, the second pixel, the third pixel, and the fourth pixel, a first readout unit that performs signal processing on the signal output to the first signal line among the first signal, the second signal, the third signal, and the fourth signal, a second readout unit that performs signal processing on the signal output to the second signal line among the first signal, the second signal, the third signal, and the fourth signal, a first control that controls the first pixel and the second pixel so that the first signal and the second signal are output to one of the first signal line and the second signal line, and a vertical control unit that performs a second control that controls the third pixel and the fourth pixel so that the third signal and the fourth signal are output to different signal lines among the first signal line and the second signal line. According to a second aspect of the invention, an imaging device includes the image sensor described in the first aspect.

Brief Description of the Drawings

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Embodiments for Carrying Out the Invention

[0006] (First Embodiment) FIG. 1 is a block diagram showing the configuration of an imaging device according to the first embodiment. In FIG. 1, a configuration example of a camera 1 which is an example of the imaging device according to the first embodiment is shown. The camera 1 includes an imaging optical system (imaging optical system) 2, an imaging device 3, a control unit 4, a memory 5, a display unit 6, and an operation unit 7. The imaging optical system 2 has a plurality of lenses including a focus adjustment lens (focus lens) and an aperture stop, and forms a subject image on the imaging device 3. Note that the imaging optical system 2 may be detachable from the camera 1.

[0007] The imaging device 3 is, for example, a CMOS image sensor. The imaging device 3 receives the light beam that has passed through the exit pupil of the imaging optical system 2 and images the subject image. A plurality of pixels having a photoelectric conversion unit are arranged in a two-dimensional manner (for example, in the row direction and the column direction) in the imaging device 3. The photoelectric conversion unit is constituted by, for example, a photodiode (PD). The imaging device 3 photoelectrically converts the received light to generate a signal, and outputs the generated signal to the control unit 4.

[0008] The imaging device 3 has imaging pixels and AF pixels (focus detection pixels). The imaging pixels output signals (imaging signals) used for image generation. The AF pixels output signals (focus detection signals) used for focus detection. As will be described later, the AF pixels are arranged by replacing a part of the imaging pixels and are dispersed and arranged over substantially the entire imaging surface of the imaging device 3. In the following description, when simply referred to as pixels, it refers to either one or both of the imaging pixels and the AF pixels.

[0009] The memory 5 is a recording medium such as a memory card, for example. Image data and the like are recorded in the memory 5. Writing data to the memory 5 and reading data from the memory 5 are performed by the control unit 4. The display unit 6 displays an image based on the image data, information related to shooting such as the shutter speed and aperture value, and a menu screen and the like. The operation unit 7 includes various setting switches such as a release button and a power switch, and outputs an operation signal corresponding to each operation to the control unit 4.

[0010] The control unit 4 is composed of a processor such as a CPU, FPGA, or ASIC, and a memory such as a ROM and a RAM, and controls each part of the camera 1 based on a control program. The control unit 4 has an image data generation unit 4a and a focus detection unit 4b. The image data generation unit 4a performs various image processes on the imaging signal output from the imaging device 3 to generate image data. The image processes include known image processes such as tone conversion processing, color interpolation processing, and edge enhancement processing.

[0011] The focus detection unit 4b performs focus detection processing necessary for autofocus (AF) of the imaging optical system 2 by a known phase difference detection method. Specifically, the focus detection unit 4b detects the in-focus position of the focus lens so that the image formed by the imaging optical system 2 is in focus on the imaging surface of the imaging device 3. The focus detection unit 4b detects the amount of image displacement between the first and second images based on a pair of focus detection signals output from the imaging device 3. The focus detection unit 4b calculates the amount of deviation (defocus amount) between the current position of the focus lens and the in-focus position based on the detected amount of image displacement. By driving the focus lens according to the defocus amount, focus adjustment is automatically performed.

[0012] The control unit 4 controls the imaging device 3 to perform a process of separately reading signals from the rows of pixels in which AF pixels are arranged (hereinafter referred to as AF pixel rows) and reading signals from the rows of pixels in which AF pixels are not arranged (hereinafter referred to as imaging pixel rows). Further, the control unit 4 also performs a process of sequentially selecting all pixel rows and reading signals of each pixel without separately performing signal reading of AF pixel rows and signal reading of imaging pixel rows.

[0013] For example, when the control unit 4 displays a through-image (live view image) of a subject on the display unit 6 or performs video shooting, it separately reads signals of each pixel in the AF pixel rows and reads signals of each pixel in the imaging pixel rows. Further, when the control unit 4 performs high-resolution still image shooting, it performs a process of sequentially selecting all pixel rows and reading signals of each pixel.

[0014] FIG. 2 is a diagram showing a configuration example of the imaging device 3 according to the first embodiment. The imaging device 3 includes a pixel unit (pixel region) 100, a vertical control unit 30, and a plurality of read units 40 (a first read unit 40a and a second read unit 40b) arranged above and below the pixel unit 100. In the pixel unit 100 of the imaging device 3, pixels are arranged two-dimensionally (in the row direction and the column direction). Note that the number and arrangement of pixels arranged in the pixel unit 100 are not limited to the illustrated example. For example, several million to several hundred million, or more pixels are provided in the pixel unit 100.

[0015] In the pixel unit 100, a plurality of imaging pixels 10 and AF pixels 13 (13a, 13b) are arranged. In FIG. 2, the pixel in the upper left corner is taken as the imaging pixel 10(1,1) in the first row and the first column, and the AF pixel in the lower right corner is taken as the AF pixel 13b(16,8) in the 16th row and the 8th column, and 128 pixels from the imaging pixel 10(1,1) to the AF pixel 13b(16,8) are shown. Note that the 128 pixels in the 8 pixels in the row direction × 16 pixels in the column direction shown in FIG. 2 represent a pixel group arranged in an arbitrary region of the imaging surface of the imaging device 3, and the names of the first column to the eighth column and the first row to the 16th row in FIG. 2 are also attached to the 128 pixels. Therefore, in the imaging device 3, pixels may exist not only on the right side of the pixels in the eighth column and below the pixels in the 16th row in FIG. 2, but also on the left side of the pixels in the first column and above the pixels in the first row.

[0016] Each of the imaging pixels 10 is provided with any one of three color filters (color filters) 41 having different spectral characteristics, for example, R (red), G (green), and B (blue). The R color filter 41 mainly transmits light in the red wavelength range, the G color filter 41 mainly transmits light in the green wavelength range, and the B color filter 41 mainly transmits light in the blue wavelength range. The pixels have different spectral characteristics depending on the arranged color filters 41. Thereby, the imaging pixels 10 include pixels having the spectral characteristics of red (R) (hereinafter referred to as R pixels), pixels having the spectral characteristics of green (G) (hereinafter referred to as G pixels), and pixels having the spectral characteristics of blue (B) (hereinafter referred to as B pixels). The R pixels, G pixels, and B pixels are arranged according to the Bayer array.

[0017] The first and second AF pixels 13a and 13b are arranged by replacing a part of the imaging pixels 10 of R, G, and B arranged in a Bayer array as described above. The first and second AF pixels 13a and 13b are provided with a color filter 41 and a light-shielding film 43. For example, a G color filter is arranged as the color filter 41 for the first and second AF pixels 13a and 13b. The positions of the light-shielding portions 43 of the first AF pixel 13a and the second AF pixel 13b are different. Thereby, the photoelectric conversion portion of the first AF pixel 13a receives the light beam that has passed through the first region of the first and second regions of the exit pupil of the imaging optical system 2. Also, the photoelectric conversion portion of the second AF pixel 13b receives the light beam that has passed through the second region of the first and second regions of the exit pupil of the photographing optical system 2.

[0018] As shown in FIG. 2, the imaging device 3 includes a first imaging pixel row 401 in which R pixels 10r and G pixels 10g are alternately arranged in the horizontal direction, that is, in the row direction, and a second imaging pixel row 402 in which G pixels 10g and B pixels 10b are alternately arranged in the row direction. The imaging device 3 also includes a first AF pixel row 403a in which G pixels 10g and the first AF pixel 13a are alternately arranged in the row direction, and a second AF pixel row 403b in which G pixels 10g and the second AF pixel 13b are alternately arranged in the row direction.

[0019] The vertical control unit 30 is controlled by the control unit 4 of the camera 1, supplies a control signal to each pixel, and controls the operation of each pixel. The first readout unit 40a and the second readout unit 40b each include an analog / digital conversion unit (AD conversion unit). The signal of the pixel of the pixel unit 100 selected by the vertical control unit 30 is output to the first vertical signal line VoutA or the second vertical signal line VoutB connected to the pixel. The signal of the pixel output to the first vertical signal line VoutA is converted into a digital signal by the first readout unit 40a and then output to the control unit 4. Also, the signal of the pixel output to the second vertical signal line VoutB is converted into a digital signal by the second readout unit 40b and then output to the control unit 4.

[0020] FIG. 3 is a diagram showing the configuration of pixels of the imaging device 3 according to the first embodiment. Each pixel (pixels 10a and 10b in FIG. 3) includes a photoelectric conversion unit 11 and a transfer unit 12. Pixel 10a has a photoelectric conversion unit 11a and a transfer unit 12a, and pixel 10b has a photoelectric conversion unit 11b and a transfer unit 12b. The photoelectric conversion unit 11 is a photodiode PD, which converts incident light into charges and accumulates the photoelectrically converted charges.

[0021] In addition, as shown by the dashed line 20, the imaging device 3 according to the present embodiment has a configuration in which two adjacent pixels share a floating diffusion (FD) 15, a reset unit 16, an amplification unit 17, a first selection unit 18, and a second selection unit 19.

[0022] The transfer unit 12a of pixel 10a is composed of a transistor M1 controlled by a signal TX1, and transfers the charges photoelectrically converted by the photoelectric conversion unit 11a to the FD 15. That is, the transfer unit 12a forms a charge transfer path between the photoelectric conversion unit 11a and the FD 15. The transfer unit 12b of pixel 10b is composed of a transistor M2 controlled by a signal TX2, and transfers the charges photoelectrically converted by the photoelectric conversion unit 11b to the FD 15. That is, the transfer unit 12b forms a charge transfer path between the photoelectric conversion unit 11b and the FD 15. The transistors M1 and M2 are transfer transistors, respectively. The capacitance C of the FD 15 accumulates (holds) the charges transferred to the FD 15 and converts them into a voltage divided by the capacitance value.

[0023] The amplification unit 17 amplifies and outputs a signal due to the charges accumulated in the capacitance C of the FD 15. The amplification unit 17 is composed of a transistor M5 whose drain (terminal) and gate (terminal) are connected to the power supply VDD and the FD 15, respectively. Also, the source (terminal) of the transistor M5 is connected to the first vertical signal line VoutA via the first selection unit 18 and to the second vertical signal line VoutB via the second selection unit 19. The amplification unit 17 functions as a part of a source follower circuit using current sources (current sources 25a and 25b in FIG. 4) described later as load current sources. The transistor M5 is an amplification transistor.

[0024] The reset unit 16 is composed of a transistor M4 controlled by a signal RST, resets the charge of the FD15, and resets the voltage of the FD15. The transistor M4 is a reset transistor.

[0025] The first selection unit 18 is composed of a transistor M6 controlled by a signal SELA, and electrically connects or disconnects the amplification unit 17 and the first vertical signal line VoutA. When the transistor M6 of the first selection unit 18 is in the on state, it outputs the signal from the amplification unit 17 to the first vertical signal line VoutA. The second selection unit 19 is composed of a transistor M7 controlled by a signal SELB, and electrically connects or disconnects the amplification unit 17 and the second vertical signal line VoutB. When the transistor M7 of the second selection unit 19 is in the on state, it outputs the signal from the amplification unit 17 to the second vertical signal line VoutB. The transistor M6 is a first selection transistor, and the transistor M7 is a second selection transistor.

[0026] As described above, the charge photoelectrically converted by the photoelectric conversion unit 11 is transferred to the FD15 by the transfer unit 12. Then, a signal (pixel signal) corresponding to the charge transferred to the FD15 is output to the first vertical signal line VoutA or the second vertical signal line VoutB. The pixel signal is an analog signal generated based on the charge photoelectrically converted by the photoelectric conversion unit 11. The pixel signal output from the imaging pixel 10 is output to the control unit 4 as an imaging signal after being subjected to signal processing by the reading unit 40.

[0027] Note that in the present embodiment, the circuit configurations of the first AF pixel 13a and the second AF pixel 13b are the same as the circuit configuration of the imaging pixel 10, respectively. The pixel signals output from the first AF pixel 13a and the second AF pixel 13b are output to the control unit 4 as a pair of focus detection signals after being subjected to signal processing by the reading unit 40.

[0028] FIG. 4 is a diagram showing a partial configuration of the imaging device 3 according to the first embodiment. In FIG. 4, a part of one pixel column among a plurality of pixel columns arranged in the column direction (vertical direction), which is the first direction, and the row direction (horizontal direction), which is the second direction intersecting the first direction, is shown. The configuration of other pixel columns is the same as that of the pixel column in FIG. 4. The imaging device 3 includes a vertical control unit 30 and a plurality of readout units 40 (a first readout unit 40a and a second readout unit 40b). Note that the vertical control unit 30 is provided commonly for a plurality of pixel columns.

[0029] In addition, the imaging device 3 is provided with a first vertical signal line VoutA and a second vertical signal line VoutB for a pixel column which is a column of a plurality of pixels arranged in the column direction. Further, a first current source 25a and a first readout unit 40a are provided for the first vertical signal line VoutA, and a second current source 25b and a second readout unit 40b are provided for the second vertical signal line VoutB. In the example shown in FIG. 4, for simplicity of explanation, only one pixel in the row direction × six pixels in the column direction are illustrated. In FIG. 4, among the plurality of pixels shown in FIG. 2, the G pixel 10g(1,2) in the first row and the second column, the B pixel 10b(2,2) in the second row and the second column, the G pixel 10g(3,2) in the third row and the second column, the B pixel 10b(4,2) in the fourth row and the second column, the G pixel 10g(5,2) in the fifth row and the second column, and the B pixel 10b(6,2) in the sixth row and the second column are illustrated.

[0030] The first current source 25a is connected to each pixel via the first vertical signal line VoutA, and the second current source 25b is connected to each pixel via the second vertical signal line VoutB. The first current source 25a and the second current source 25b generate a current for reading a signal from each pixel. The first current source 25a supplies the generated current to the first vertical signal line VoutA, the first selection unit 18, and the amplification unit 17 of each pixel. Similarly, the second current source 25b supplies the generated current to the second vertical signal line VoutB, the second selection unit 19, and the amplification unit 17 of each pixel.

[0031] The first readout unit 40a is configured to include an AD conversion unit, and converts an analog signal input from each pixel via the first vertical signal line VoutA into a digital signal. The second readout unit 40b is configured to include an AD conversion unit, and converts an analog signal input from each pixel via the second vertical signal line VoutB into a digital signal.

[0032] The vertical control unit 30 supplies the signal TX1, the signal TX2, the signal RST, the signal SELA, and the signal SELB to each pixel to control the operation of each pixel. Specifically, the vertical control unit 30 supplies a signal to the gate of each transistor of the pixel to put the transistor in an on state (connected state, conductive state, short-circuit state) or an off state (disconnected state, non-conductive state, open state, cut-off state).

[0033] When the control unit 4 instructs the readout of the signals of the pixels in the imaging pixel rows (the first imaging pixel row 401 and the second imaging pixel row 402 in FIG. 2), the vertical control unit 30 selects the imaging pixel rows in units of two rows and performs a process of reading out pixel signals (first readout control). When the control unit 4 instructs the readout of the signals of the pixels in the AF pixel rows (the first AF pixel row 403a and the second AF pixel row 403b in FIG. 2), the vertical control unit 30 selects the AF pixel rows two by two and performs a process of reading out pixel signals (second readout control). Further, when reading out signals from the AF pixel rows, the vertical control unit 30 can also perform a process of reading out pixel signals by selecting the AF pixel rows one by one (third readout control).

[0034] As described above, the vertical control unit 30 according to the present embodiment performs the first readout control, the second readout control, and the third readout control. The control unit 4 of the camera 1 can control the vertical control unit 30 to switch the method of reading out pixel signals. Hereinafter, the first readout control, the second readout control, and the third readout control will be described respectively.

[0035] First, the first read control will be described with reference to FIG. 4. In the first read control, the vertical control unit 30 selects every two imaging pixel rows of the imaging device 3 and sequentially reads signals from the pixels. Hereinafter, the case of reading pixel signals from the B pixel 10b(2,2), G pixel 10g(3,2), B pixel 10b(4,2), and G pixel 10g(5,2) will be taken as an example to describe the first read control.

[0036] The vertical control unit 30 turns on the second selection unit 19 of the B pixel 10b(2,2) which is the pixel in the second row, that is, the second selection unit 19 shared by the G pixel 10g(1,2) in the first row and the B pixel 10b(2,2) in the second row. Also, the vertical control unit 30 turns off the first selection unit 18 of the B pixel 10b(2,2), that is, the first selection unit 18 shared by the G pixel 10g(1,2) and the B pixel 10b(2,2). Further, the vertical control unit 30 turns on the first selection unit 18 of the G pixel 10g(3,2) which is the pixel in the third row, that is, the first selection unit 18 shared by the G pixel 10g(3,2) in the third row and the B pixel 10b(4,2) in the fourth row. Also, the vertical control unit 30 turns off the second selection unit 19 of the G pixel 10g(3,2), that is, the second selection unit 19 shared by the G pixel 10g(3,2) and the B pixel 10b(4,2). The vertical control unit 30 turns off the first selection unit 18 and the second selection unit 19 of the pixels in other rows different from the first row, second row, third row, and fourth row, respectively.

[0037] The pixel signal based on the charge generated by the photoelectric conversion unit 11b of the B pixel 10b(2,2) in the second row is output to the second vertical signal line VoutB through the second selection unit 19 of the B pixel 10b(2,2). Also, the pixel signal based on the charge generated by the photoelectric conversion unit 11a of the G pixel 10g(3,2) in the third row is output to the first vertical signal line VoutA through the first selection unit 18 of the G pixel 10g(3,2).

[0038] After the pixel signals are read from the pixels in the second and third rows, the vertical control unit 30 turns on the second selection unit 19 of the B pixel 10b(4,2) which is the pixel in the fourth row, and turns off the first selection unit 18 of the B pixel 10b(4,2). Also, the vertical control unit 30 turns on the first selection unit 18 of the G pixel 10g(5,2) which is the pixel in the fifth row, and turns off the second selection unit 19 of the G pixel 10g(5,2). The vertical control unit 30 turns off the first selection unit 18 and the second selection unit 19 of the pixels in other rows different from the third, fourth, fifth, and sixth rows, respectively.

[0039] The pixel signal of the B pixel 10b(4,2) in the fourth row is output to the second vertical signal line VoutB through the second selection unit 19 of the B pixel 10b(4,2). Also, the pixel signal of the G pixel 10g(5,2) in the fifth row is output to the first vertical signal line VoutA through the first selection unit 18 of the G pixel 10g(5,2). Similarly, in the imaging device 3, imaging pixel rows are selected two by two after the sixth row, and pixel signals are output.

[0040] Thus, in the case of the first read control, in the imaging device 3, imaging pixel rows are selected two by two, and pixel signals are output from the imaging pixels in one row to the first vertical signal line VoutA. At the same time, pixel signals are output from the imaging pixels in the other row to the second vertical signal line VoutB. The pixel signals sequentially output to the first vertical signal line VoutA are input to the first read unit 40a, and the pixel signals sequentially output to the second vertical signal line VoutB are input to the second read unit 40b. Therefore, the pixel signals output to the first vertical signal line VoutA and the pixel signals output to the second vertical signal line VoutB can be signal-processed simultaneously (in parallel). The pixel signals output from each imaging pixel 10 are converted into digital signals by the read unit 40 and then output to the control unit 4 as imaging signals.

[0041] In this embodiment, the pixel signals of a plurality of G pixels 10g in the same column (G pixel 10g(1,2), G pixel 10g(3,2), G pixel 10g(5,2) in FIG. 4) are output to the same first vertical signal line VoutA and input to the same first reading unit 40a. The AD conversion unit of the first reading unit 40a converts the input pixel signals of the respective G pixels 10g into digital signals. The pixel signals of each G pixel 10g are processed by the same AD conversion unit. Further, the pixel signals of a plurality of B pixels 10b in the same column (B pixel 10b(2,2), B pixel 10b(4,2), B pixel 10b(6,2) in FIG. 4) are output to the same second vertical signal line VoutB, input to the same second reading unit 40b, and processed. Thus, in this embodiment, the pixel signals of the imaging pixels 10 in which color filters 41 of the same color are arranged in the same column are input to the same reading unit 40 and processed.

[0042] In reading units provided at positions separated from each other, due to manufacturing variations or the like, there is a possibility that variations in characteristics occur for each reading unit. For example, the conversion gain (AD conversion gain) when converting a pixel signal, which is an analog signal, into a digital signal will be different for each reading unit. Therefore, when the pixel signals of the same-color pixels in the same column are input to different reading units, differences due to AD conversion gain deviation will occur in the pixel signals converted into digital signals.

[0043] On the other hand, in the image sensor 3 according to this embodiment, since the pixel signals of the same-color pixels in the same column are input to the same reading unit 40, it is possible to suppress differences in the pixel signals due to variations in characteristics for each reading unit 40. For example, it is possible to suppress differences in the pixel signals of each imaging pixel 10 due to AD conversion gain deviation. As a result, it is possible to prevent deterioration of the image quality of the image generated using the imaging signal.

[0044] FIG. 5 is a timing chart showing an example of the first readout control of the image sensor 3 according to the first embodiment. In the timing chart shown in FIG. 5, the horizontal axis indicates time, and shows the control signals input to each part of the image sensor 3 in FIG. 4 in the case of the first readout control. Also, in FIG. 5, a transistor to which a control signal of a high level (for example, a power supply potential) is input becomes an on state, and a transistor to which a control signal of a low level (for example, a ground potential) is input becomes an off state.

[0045] At time t1 shown in FIG. 5, signals RST<0> and RST<1> become high levels. When the signal RST<0> becomes a high level, the transistor M4 of the reset section 16 shared by the G pixel 10g(1,2) of the first row and the B pixel 10b(2,2) of the second row turns on. As a result, the charge of the capacitance C of the FD15 shared by the G pixel 10g(1,2) and the B pixel 10b(2,2) is reset, and the potential of the FD15 becomes the reset potential. Also, when the signal RST<1> becomes a high level, the transistor M4 of the reset section 16 shared by the G pixel 10g(3,2) of the third row and the B pixel 10b(4,2) of the fourth row turns on. As a result, the charge of the capacitance C of the FD15 shared by the G pixel 10g(3,2) and the B pixel 10b(4,2) is reset, and the potential of the FD15 becomes the reset potential.

[0046] Also, at time t1, signals SELB<0> and SELA<1> become high levels. When the signal SELB<0> becomes a high level, a signal based on the reset potential of the B pixel 10b(2,2) is output to the second vertical signal line VoutB by the amplifier section 17 and the second selection section 19 of the B pixel 10b(2,2). That is, a signal (reset signal) after resetting the charge of the FD15 of the B pixel 10b(2,2) is output to the second vertical signal line VoutB. Also, when the signal SELA<1> becomes a high level, the reset signal of the G pixel 10g(3,2) is output to the first vertical signal line VoutA by the amplifier section 17 and the first selection section 18 of the G pixel 10g(3,2).

[0047] In this way, a reset signal is simultaneously output from the G pixel 10g(3,2) in the third row and the B pixel 10b(2,2) in the second row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The reset signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals.

[0048] At time t2, the signal TX2<0> and the signal TX1<1> become high level. When the signal TX2<0> becomes high level, in the B pixel 10b(2,2), the transistor M2 of the transfer unit 12b is turned on, and the charge photoelectrically converted in the photoelectric conversion unit 11b is transferred to the FD15. Also, when the signal TX1<1> becomes high level, in the G pixel 10g(3,2), the transistor M1 of the transfer unit 12a is turned on, and the charge photoelectrically converted in the photoelectric conversion unit 11a is transferred to the FD15.

[0049] Also, at time t2, since the signal SELB<0> is high level, the pixel signal based on the charge generated in the photoelectric conversion unit 11b of the B pixel 10b(2,2) is output to the second vertical signal line VoutB by the amplifier unit 17 and the second selection unit 19. Also, since the signal SELA<1> is high level, the pixel signal of the G pixel 10g(3,2) is output to the first vertical signal line VoutA by the amplifier unit 17 and the first selection unit 18.

[0050] In this way, pixel signals are simultaneously output from the G pixel 10g(3,2) in the third row and the B pixel 10b(2,2) in the second row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals. The reset signal and the pixel signal converted into digital signals are input to a signal processing unit (not shown). After performing signal processing such as correlated double sampling for performing differential processing between the reset signal and the pixel signal, the signal processing unit outputs the processed pixel signal to the control unit 4.

[0051] At time t3, the signal RST<1> and the signal RST<2> become high level. When the signal RST<1> becomes high level, the transistor M4 of the reset unit 16 shared by the G pixel 10g(3,2) in the third row and the B pixel 10b(4,2) in the fourth row is turned on. Thereby, the charge of the capacitor C of the FD15 shared by the G pixel 10g(3,2) and the B pixel 10b(4,2) is reset. Also, when the signal RST<2> becomes high level, the transistor M4 of the reset unit 16 shared by the G pixel 10g(5,2) in the fifth row and the B pixel 10b(6,2) in the sixth row is turned on. Thereby, the charge of the capacitor C of the FD15 shared by the G pixel 10g(5,2) and the B pixel 10b(6,2) is reset.

[0052] Also, at time t3, the signal SELB<1> and the signal SELA<2> become high level. When the signal SELB<1> becomes high level, the reset signal of the B pixel 10b(4,2) is output to the second vertical signal line VoutB by the amplifier unit 17 and the second selection unit 19. When the signal SELA<2> becomes high level, the reset signal of the G pixel 10g(5,2) is output to the first vertical signal line VoutA by the amplifier unit 17 and the first selection unit 18.

[0053] In this way, a reset signal is simultaneously output from the G pixel 10g(5, 2) in the fifth row and the B pixel 10b(4, 2) in the fourth row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The reset signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals.

[0054] At time t4, the signal TX2<1> and the signal TX1<2> become high level. When the signal TX2<1> becomes high level, in the B pixel 10b(4, 2), the charge photoelectrically converted by the photoelectric conversion unit 11b is transferred to the FD15. Also, when the signal TX1<2> becomes high level, in the G pixel 10g(5, 2), the charge photoelectrically converted by the photoelectric conversion unit 11a is transferred to the FD15. Further, at time t4, since the signal SELB<1> is high level, the pixel signal of the B pixel 10b(4, 2) is output to the second vertical signal line VoutB by the amplifier unit 17 and the second selection unit 19. Also, since the signal SELA<2> is high level, the pixel signal of the G pixel 10g(5, 2) is output to the first vertical signal line VoutA by the amplifier unit 17 and the first selection unit 18.

[0055] In this way, pixel signals are simultaneously output from the G pixel 10g(5, 2) in the fifth row and the B pixel 10b(4, 2) in the fourth row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals. The reset signal and the pixel signal converted into digital signals are input to a signal processing unit (not shown). After performing signal processing such as correlated double sampling, the signal processing unit outputs the processed pixel signal to the control unit 4.

[0056] In the period after time t5, in the same manner as in the period from time t1 to time t5, two imaging pixel rows are selected at a time, and the reset signal is read out and the pixel signal is read out. Thus, in the first readout control shown in FIG. 5, two imaging pixel rows can be selected at a time, and pixel signals can be read out simultaneously in multiple rows.

[0057] Next, the second readout control will be described with reference to FIGS. 6 and 7. In the example shown in FIG. 6, for simplicity of explanation, among the plurality of pixels shown in FIG. 2, the G pixel 10g(7, 2) in the 7th row and 2nd column, the first AF pixel 13a(8, 2) in the 8th row and 2nd column, the G pixel 10g(15, 2) in the 15th row and 2nd column, and the second AF pixel 13b(16, 2) in the 16th row and 2nd column are illustrated. In the second readout control, the vertical control unit 30 sequentially selects every two AF pixel rows of the image sensor 3 and sequentially reads out signals from the pixels.

[0058] The vertical control unit 30 turns on the first selection unit 18 of the first AF pixel 13a(8, 2) in the 8th row which is an AF pixel row, and turns off the second selection unit 19 of the first AF pixel 13a(8, 2). Also, the vertical control unit 30 turns on the second selection unit 19 of the second AF pixel 13b(16, 2) in the 16th row which is an AF pixel row, and turns off the first selection unit 18 of the second AF pixel 13b(16, 2). The vertical control unit 30 turns off the first selection unit 18 and the second selection unit 19 of the pixels in rows other than the 7th row, 8th row, 15th row, and 16th row. Thereby, the pixel signal of the first AF pixel 13a(8, 2) in the 8th row is output to the first vertical signal line VoutA through the first selection unit 18 of the first AF pixel 13a(8, 2). Also, the pixel signal of the second AF pixel 13b(16, 2) in the 16th row is output to the second vertical signal line VoutB through the second selection unit 19 of the second AF pixel 13b(16, 2). Similarly, in the image sensor 3, for the AF pixel rows after the 17th row, two AF pixel rows are sequentially selected at a time, and pixel signals are output.

[0059] Thus, in the case of the second read control, in the imaging device 3, two AF pixel rows are selected at a time, and pixel signals are output from the AF pixels in one row to the first vertical signal line VoutA. At the same time, pixel signals are output from the AF pixels in the other row to the second vertical signal line VoutB. Therefore, signals can be read out from each AF pixel 13 arranged in the imaging device 3 at high speed. That is, the imaging device 3 can shorten the read time of the signals of the AF pixels 13. Thereby, the control unit 4 can shorten the time required for focus detection and focus adjustment.

[0060] Also, the pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are respectively input to the first read unit 40a and the second read unit 40b and converted into digital signals. Since the pixel signals of each AF pixel 13 are processed in parallel by the first and second read units 40a and 40b, AD conversion processing for the pixel signals of each AF pixel can be performed at high speed. The pixel signal of the first AF pixel 13a and the pixel signal of the second AF pixel 13b are respectively converted into digital signals by the read unit 40 and then output to the control unit 4 as a pair of focus detection signals.

[0061] FIG. 7 is a timing chart showing an example of the second read control of the imaging device 3 according to the first embodiment. In the timing chart shown in FIG. 7, the horizontal axis indicates time, and shows the control signals input to each part of the imaging device 3 in FIG. 6 in the case of the second read control.

[0062] At time t1 shown in FIG. 7, the signal RST<3> and the signal RST<4> become high level. When the signal RST<3> becomes high level, the charge of the capacitor C of FD15 is reset in the G pixel 10g(7,2) in the seventh row and the first AF pixel 13a(8,2) in the eighth row. Also, when the signal RST<4> becomes high level, the charge of the capacitor C of FD15 is reset in the G pixel 10g(15,2) in the fifteenth row and the second AF pixel 13b(16,2) in the sixteenth row.

[0063] Also, at time t1, signal SELA<3> and signal SELB<4> become high level. When signal SELA<3> becomes high level, the reset signal of the first AF pixel 13a(8,2) is output to the first vertical signal line VoutA by the amplifier section 17 and the first selection section 18. Also, when signal SELB<4> becomes high level, the reset signal of the second AF pixel 13b(16,2) is output to the second vertical signal line VoutB by the amplifier section 17 and the second selection section 19.

[0064] In this way, reset signals are simultaneously output from the first AF pixel 13a(8,2) in the 8th row and the second AF pixel 13b(16,2) in the 16th row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The reset signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout section 40a and the second readout section 40b, respectively, and are converted into digital signals.

[0065] At time t2, signals TX2<3> and TX2<4> become high level. When signal TX2<3> becomes high level, the charge photoelectrically converted by the photoelectric conversion section 11b in the first AF pixel 13a(8,2) in the 8th row is transferred to FD15. Also, when signal TX2<4> becomes high level, the charge photoelectrically converted by the photoelectric conversion section 11b in the second AF pixel 13b(16,2) in the 16th row is transferred to FD15. Also, at time t2, since signal SELA<3> is high level, the pixel signal of the first AF pixel 13a(8,2) is output to the first vertical signal line VoutA by the amplifier section 17 and the first selection section 18. Also, since signal SELB<4> is high level, the pixel signal of the second AF pixel 13b(16,2) is output to the second vertical signal line VoutB by the amplifier section 17 and the second selection section 19.

[0066] In this way, pixel signals are simultaneously output from the first AF pixel 13a(8,2) in the eighth row and the second AF pixel 13b(16,2) in the sixteenth row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals. The reset signal and the pixel signal converted into digital signals are input to a signal processing unit (not shown). After performing signal processing such as correlated double sampling for performing differential processing between the reset signal and the pixel signal, the signal processing unit outputs the processed pixel signal to the control unit 4.

[0067] Next, the third readout control will be described with reference to FIGS. 6 and 8. In the third readout control, the vertical control unit 30 sequentially selects the AF pixel rows of the imaging device 3 one by one, and sequentially reads signals from the pixels.

[0068] The vertical control unit 30 turns on the first selection unit 18 of the first AF pixel 13a(8,2) in the eighth row, which is an AF pixel row, and turns off the second selection unit 19 of the first AF pixel 13a(8,2). Further, the vertical control unit 30 turns off the first selection unit 18 and the second selection unit 19 of the pixels in rows other than the seventh row and the eighth row. Thereby, the pixel signal of the first AF pixel 13a(8,2) in the eighth row is output to the first vertical signal line VoutA via the first selection unit 18.

[0069] After reading the pixel signal from the pixel in the eighth row, the first selection unit 18 of the second AF pixel 13b(16,2) in the sixteenth row, which is an AF pixel row, is turned on, and the second selection unit 19 of the second AF pixel 13b(16,2) is turned off. Further, the vertical control unit 30 turns off the first selection unit 18 and the second selection unit 19 of the pixels in rows other than the fifteenth row and the sixteenth row. Thereby, the pixel signal of the second AF pixel 13b(16,2) in the sixteenth row is output to the first vertical signal line VoutA via the first selection unit 18.

[0070] Although an example in which the pixel signal of the AF pixel 13 is output to the first vertical signal line VoutA has been described, when the first selection unit 18 is in the off state and the second selection unit 19 is in the on state, the pixel signal can be output from the AF pixel 13 to the second vertical signal line VoutB.

[0071] As described above, in the case of the third read control, in the imaging device 3, the AF pixel rows are selected one by one, and the pixel signals are output from each pixel of the AF pixel row to the first vertical signal line VoutA (or the second vertical signal line VoutB). The pixel signals of the AF pixels in the same column are input to the AD conversion unit of the same read unit 40. Therefore, the difference caused by the AD conversion gain deviation can be suppressed in the pixel signals output from each AF pixel. As a result, a decrease in the accuracy of focus detection using the focus detection signal can be prevented.

[0072] FIG. 8 is a timing chart showing an example of the third read control of the imaging device 3 according to the first embodiment. In the timing chart shown in FIG. 8, the horizontal axis represents time, and shows the control signals input to each part of the imaging device 3 in FIG. 6 in the case of the third read control.

[0073] At time t1 shown in FIG. 8, when the signal RST<3> becomes high level, the charge of the capacitor C of the FD15 is reset in the G pixel 10g(7,2) of the seventh row and the first AF pixel 13a(8,2) of the eighth row. Also, at time t1, when the signal SELA<3> becomes high level, the reset signal of the first AF pixel 13a(8,2) is output to the first vertical signal line VoutA.

[0074] At time t2, when the signal TX2<3> becomes high level, the charge photoelectrically converted by the photoelectric conversion unit 11b is transferred to the FD15 in the first AF pixel 13a(8,2) of the eighth row. Also, at time t2, since the signal SELA<3> is high level, the pixel signal of the first AF pixel 13a(8,2) is output to the first vertical signal line VoutA.

[0075] At time t3, when the signal RST<4> becomes high level, the charge in the capacitance C of FD15 is reset in the G pixel 10g(15,2) on the 15th row and the second AF pixel 13b(16,2) on the 16th row. Also, at time t3, when the signal SELA<4> becomes high level, the reset signal of the second AF pixel 13b(16,2) is output to the first vertical signal line VoutA.

[0076] At time t4, when the signal TX2<4> becomes high level, the charge photoelectrically converted by the photoelectric conversion unit 11b is transferred to FD15 in the second AF pixel 13b(16,2) on the 16th row. Also, at time t4, since the signal SELA<4> is high level, the pixel signal of the second AF pixel 13b(16,2) is output to the first vertical signal line VoutA.

[0077] The reset signal and the pixel signal sequentially output to the first vertical signal line VoutA are converted into digital signals by the first reading unit 40a. The pixel signal converted into a digital signal is output to the control unit 4 after signal processing such as correlated double sampling is performed.

[0078] As described above, the imaging device 3 according to the present embodiment can perform the first reading control, the second reading control, and the third reading control. The imaging device 3 can improve the accuracy of the signal of the imaging pixel by performing the first reading control. Also, in the case of the second reading control, the imaging device 3 can improve the reading speed of the signal of the AF pixel, and in the case of the third reading control, the imaging device 3 can improve the accuracy of the signal of the AF pixel.

[0079] According to the above-described embodiment, the following operational effects can be obtained. (1) The imaging element 3 includes a first photoelectric conversion unit (photoelectric conversion unit 11) that photoelectrically converts light to generate charges, and a light shielding unit 43 that shields a part of the light incident on the first photoelectric conversion unit. The first pixel (AF pixel 13) and the second pixel (AF pixel 13) provided in the first direction, which output signals based on the charges generated by the first photoelectric conversion unit, and the third pixel (imaging pixel 10) and the fourth pixel (imaging pixel 10) provided in the first direction, which each have a second photoelectric conversion unit that photoelectrically converts light to generate charges and output signals based on the charges generated by the second photoelectric conversion unit. A first signal line (first vertical signal line VoutA) and a second signal line (second vertical signal line VoutB) provided in the first direction, a first control (second readout control) that outputs the signal of the first pixel to the first signal line and the signal of the second pixel to the second signal line, and a control unit (vertical control unit 30) that performs a second control (first readout control) to output the signals of the third pixel and the fourth pixel to the first signal line or the second signal line. In this embodiment, the vertical control unit 30 performs the first control (second readout control) and the second control (first readout control). By performing the second control, the vertical control unit 30 can improve the accuracy of the signals of the imaging pixels, and by performing the first control, it can improve the readout speed of the signals of the AF pixels.

[0080] (2) The control unit (vertical control unit 30) performs a third control (third readout control) to output the signals of the first pixel and the second pixel to the first signal line or the second signal line. In this embodiment, the vertical control unit 30 performs the third control (third readout control). By performing the third control, the vertical control unit 30 can improve the accuracy of the signals of the AF pixels.

[0081] The following modifications are also within the scope of the present invention, and it is also possible to combine one or more of the modification examples with the above-described embodiments.

[0082] (Modification Example 1) FIG. 9 is a diagram showing a partial configuration of the imaging device according to Modification 1, and FIG. 10 is a timing chart showing an example of the first readout control of the imaging device according to Modification 1. In the example shown in FIG. 9, for simplicity of explanation, only 1 pixel in the row direction × 4 pixels in the column direction are illustrated. In FIG. 9, among the plurality of pixels shown in FIG. 2, the G pixel 10g(1,2) in the first row and the second column, the B pixel 10b(2,2) in the second row and the second column, the G pixel 10g(3,2) in the third row and the second column, and the B pixel 10b(4,2) in the fourth row and the second column are illustrated. Hereinafter, the first readout control of the imaging device according to Modification 1 will be described with reference to FIGS. 9 and 10.

[0083] At time t1 shown in FIG. 10, the signal RST<0> and the signal RST<1> become high level. When the signal RST<0> becomes high level, the charge in the capacitance C of the FD15 shared by the G pixel 10g(1,2) and the B pixel 10b(2,2) is reset. Also, when the signal RST<1> becomes high level, the charge in the capacitance C of the FD15 shared by the G pixel 10g(3,2) and the B pixel 10b(4,2) is reset.

[0084] Also, at time t1, the signal SELA<0> and the signal SELB<1> become high level. When the signal SELA<0> becomes high level, the reset signal of the G pixel 10g(1,2) is output to the first vertical signal line VoutA by the amplifier section 17 and the first selection section 18 of the G pixel 10g(1,2). Also, when the signal SELB<1> becomes high level, the reset signal of the B pixel 10b(4,2) is output to the second vertical signal line VoutB by the amplifier section 17 and the second selection section 19 of the B pixel 10b(4,2).

[0085] In this way, reset signals are simultaneously output from the G pixel 10g(1,2) in the first row and the B pixel 10b(4,2) in the fourth row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The reset signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals.

[0086] At time t2, the signal TX1<0> and the signal TX2<1> become high level. When the signal TX1<0> becomes high level, in the G pixel 10g(1,2), the charge photoelectrically converted by the photoelectric conversion unit 11a is transferred to the FD15. Also, when the signal TX2<1> becomes high level, in the B pixel 10b(4,2), the charge photoelectrically converted by the photoelectric conversion unit 11b is transferred to the FD15. Also, at time t2, since the signal SELA<0> is high level, the pixel signal of the G pixel 10g(1,2) is output to the first vertical signal line VoutA. Also, since the signal SELB<1> is high level, the pixel signal of the B pixel 10b(4,2) is output to the second vertical signal line VoutB.

[0087] In this way, pixel signals are simultaneously output from the G pixel 10g(1,2) in the first row and the B pixel 10b(4,2) in the fourth row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals. The pixel signals converted into digital signals are output to the control unit 4 after signal processing such as correlated double sampling is performed.

[0088] At time t3, the signal RST<0> and the signal RST<1> become high level. When the signal RST<0> becomes high level, the charge in the capacitance C of the FD15 shared by the G pixel 10g(1,2) and the B pixel 10b(2,2) is reset. Also, when the signal RST<1> goes high, the charge in the capacitance C of FD15 shared by the G pixel 10g(3,2) and the B pixel 10b(4,2) is reset.

[0089] Also, at time t3, the signal SELB<0> and the signal SELA<1> go high. When the signal SELB<0> goes high, the reset signal of the B pixel 10b(2,2) is output to the second vertical signal line VoutB. Also, when the signal SELA<1> goes high, the reset signal of the G pixel 10g(3,2) is output to the first vertical signal line VoutA.

[0090] In this way, the reset signals are simultaneously output from the G pixel 10g(3,2) in the third row and the B pixel 10b(2,2) in the second row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The reset signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals.

[0091] At time t4, the signal TX2<0> and the signal TX1<1> go high. When the signal TX2<0> goes high, the charge photoelectrically converted by the photoelectric conversion unit 11b in the B pixel 10b(2,2) is transferred to FD15. Also, when the signal TX1<1> goes high, the charge photoelectrically converted by the photoelectric conversion unit 11a in the G pixel 10g(3,2) is transferred to FD15. Also, at time t4, since the signal SELB<0> is high, the pixel signal of the B pixel 10b(2,2) is output to the second vertical signal line VoutB. Also, since the signal SELA<1> is high, the pixel signal of the G pixel 10g(3,2) is output to the first vertical signal line VoutA.

[0092] In this way, pixel signals are simultaneously output from the G pixel 10g(3,2) in the third row and the B pixel 10b(2,2) in the second row to the first vertical signal line VoutA and the second vertical signal line VoutB, respectively. The pixel signals output to the first vertical signal line VoutA and the second vertical signal line VoutB are input to the first readout unit 40a and the second readout unit 40b, respectively, and are converted into digital signals. The pixel signals converted into digital signals are output to the control unit 4 after being subjected to signal processing such as correlated double sampling.

[0093] In the period after time t5, in the same manner as in the period from time t1 to time t5, two imaging pixel rows are selected at a time, and the reset signal is read out and the pixel signal is read out. Thus, also in the first readout control according to the first modification, two imaging pixel rows can be selected at a time and the pixel signals can be read out simultaneously in units of a plurality of rows, in the same manner as in the above-described embodiment. Further, the pixel signals of the same-color pixels within the same column can be read out to the same readout unit 40, and differences caused by variations in the characteristics of each readout unit 40 in the pixel signals can be suppressed.

[0094] (Second Modification) In the above-described first embodiment, an example in which two adjacent pixels share FD15 or the like has been described, but the pixel configuration is not limited to this. For example, each of a plurality of pixels provided in the imaging device 3 may have a configuration including FD15, a reset unit 16, an amplification unit 17, a first selection unit 18, and a second selection unit 19. Further, a configuration in which FD15 or the like is shared by three pixels or more pixels may be employed. For example, a configuration in which FD15 or the like is shared by four pixels may be employed.

[0095] FIG. 11 is a diagram showing a configuration example of an imaging device in the case where FD15 or the like is shared by four pixels. In FIG. 11, the pixel in the upper left corner is defined as the imaging pixel 10(1,1) in the first row and the first column, and the pixel in the lower right corner is defined as the imaging pixel 10(8,3) in the eighth row and the third column, and 24 pixels from the imaging pixel 10(1,1) to the imaging pixel 10(8,3) are shown.

[0096] In FIG. 11, the dotted line 20 schematically shows that four pixels share the FD15, the reset section 16, the amplification section 17, the first selection section 18, and the second selection section 19. Also, the AF pixel 13 shown in FIG. 11 is the above-described first AF pixel 13a or second AF pixel 13b. The AF pixel 13(2,2) shares the FD15 etc. with the AF pixel 13(4,2), and the AF pixel 13(6,2) shares the FD15 etc. with the AF pixel 13(8,2).

[0097] In the third read control, the vertical control section 30 according to this modification example sequentially selects, for example, the AF pixels 13(2,2), 13(4,2), 13(6,2), and 13(8,2) and reads out signals. Also, in the second read control, the vertical control section 30 selects the AF pixel 13(2,2) or the AF pixel 13(4,2) and outputs a pixel signal to the first vertical signal line VoutA (or the second vertical signal line VoutB). Simultaneously with this reading, the vertical control section 30 selects the AF pixel 13(6,2) or the AF pixel 13(8,2) and outputs a pixel signal to the second vertical signal line VoutB (or the first vertical signal line VoutA). Therefore, even when the FD15 etc. are shared among a plurality of AF pixels, signals can be read out from each AF pixel 13 at high speed.

[0098] (Modification Example 3) In the above-described embodiment, an example in which the vertical signal lines are arranged as the first vertical signal line VoutA and the second vertical signal line VoutB has been described, but the present invention is not limited thereto. For example, three or more vertical signal lines may be arranged. If the number of vertical signal lines increases, the pixel signals of the AF pixels 13 can be read out even faster.

[0099] (Modification Example 4) In the above-described embodiment, an example in which the G color filter 41 is arranged in the AF pixel 13 has been described, but the present invention is not limited thereto. For example, as the color filter 41 in the AF pixel 13, a W (white) color filter may be arranged, or a B color filter may be arranged.

[0100] (Modification Example 5) In the above-described embodiment, the case where a color filter of the primary color system (RGB) is used for the imaging device 3 has been described. However, a color filter of the complementary color system (CMY) may be used instead.

[0101] (Modification Example 6) In the above-described embodiment and modification example, an example in which a photodiode is used as the photoelectric conversion unit has been described. However, a photoelectric conversion film may be used as the photoelectric conversion unit.

[0102] (Modification Example 7) The imaging device 3 described in the above embodiment and modification example may be applied to cameras built into cameras, smartphones, tablets, PCs, in-vehicle cameras, cameras mounted on unmanned aerial vehicles (drones, radio control machines, etc.), and the like.

[0103] (Modification Example 8) The imaging device described in the above-described embodiment and modification example may be applied to a stacked sensor (stacked imaging device) configured by stacking a plurality of substrates (for example, a plurality of semiconductor substrates). For example, the pixel unit 100 may be disposed on the first layer substrate, the vertical control unit 30 and the readout unit 40 may be disposed on the second layer substrate, and the vertical signal line Vout may be disposed between the first layer substrate and the second layer substrate. The pixel unit 100 and the vertical control unit 30 may be disposed on the first layer substrate, and the readout unit 40 may be disposed on the second layer substrate. Further, the stacked sensor may have three or more layers.

[0104] In the above, various embodiments and modification examples have been described, but the present invention is not limited to these contents. Other aspects conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

[0105] The disclosure content of the following priority basis application is incorporated herein by reference. Japanese Patent Application No. 67700 / 2018 (filed on March 30, 2018)

Explanation of Reference Numerals

[0106] 3 imaging elements, 4 control units, 10 imaging pixels, 13a first AF pixel, 13b second AF pixel, 30 vertical control unit, 40a first readout unit, 40b second readout unit

Claims

1. A pixel unit having a first photoelectric conversion unit that converts light transmitted through an optical system into electric charges, a first pixel that outputs a first signal used for focus detection of the optical system, a second photoelectric conversion unit that converts light transmitted through the optical system into electric charges, a second pixel that outputs a second signal used for focus detection of the optical system, a third photoelectric conversion unit that converts light transmitted through the optical system into electric charges, a third pixel that outputs a third signal used for image generation, a fourth photoelectric conversion unit that converts light transmitted through the optical system into electric charges, and a fourth pixel that outputs a fourth signal used for image generation, wherein the first pixel, the second pixel, the third pixel, and the fourth pixel are arranged along a column direction. A first signal line electrically connectable to the first pixel, the second pixel, the third pixel, and the fourth pixel. A second signal line electrically connectable to the first pixel, the second pixel, the third pixel, and the fourth pixel. A first readout unit that performs signal processing on the signal output to the first signal line among the first signal, the second signal, the third signal, and the fourth signal. A second readout unit that performs signal processing on the signal output to the second signal line among the first signal, the second signal, the third signal, and the fourth signal. A first control that controls the first pixel and the second pixel so that the first signal and the second signal are output to one of the first signal line and the second signal line, and a second control that controls the third pixel and the fourth pixel so that the third signal and the fourth signal are output to a different signal line from the first signal line and the second signal line. A vertical control unit for performing the above operations. An imaging device comprising the above components.

2. In the imaging device according to Claim 1, The vertical control unit In the first control, controls the first pixel and the second pixel so that the first signal and the second signal are output to one of the first signal line and the second signal line in a first period. In the second control, controls the third pixel and the fourth pixel so that the third signal and the fourth signal are output to a different signal line from the first signal line and the second signal line in a second period shorter than the first period. An imaging device.

3. In the imaging device according to Claim 2, The vertical control unit In the first control, controls the first pixel and the second pixel so that the first signal and the second signal are output to one of the first signal line and the second signal line at different timings. In the second control, the imaging device controls the third pixel and the fourth pixel such that the third signal and the fourth signal are output at the same timing on different signal lines among the first signal line and the second signal line.

4. In the imaging device according to claim 2, the vertical control unit In the first control, the first pixel and the second pixel are controlled such that the first signal and the second signal are sequentially output on either one of the first signal line and the second signal line, In the second control, the imaging device controls the third pixel and the fourth pixel such that the third signal and the fourth signal are simultaneously output on different signal lines among the first signal line and the second signal line.

5. In the imaging device according to any one of claims 1 to 4, the first readout unit and the second readout unit are arranged farther apart than the distance between the first readout unit and the pixel unit.

6. In the imaging device according to claim 5, the pixel unit is arranged between the first readout unit and the second readout unit in the column direction.

7. In the imaging device according to any one of claims 1 to 6, the first readout unit has a first conversion unit that converts a signal output to the first signal line among the first signal, the second signal, the third signal, and the fourth signal into a digital signal, the second readout unit has a second conversion unit that converts a signal output to the second signal line among the first signal, the second signal, the third signal, and the fourth signal into a digital signal. Imaging device.

8. In the imaging device according to any one of claims 1 to 7, a first selection unit for electrically connecting the first pixel and the first signal line, a second selection unit for electrically connecting the first pixel and the second signal line, a third selection unit for electrically connecting the second pixel and the first signal line, a fourth selection unit for electrically connecting the second pixel and the second signal line, a fifth selection unit for electrically connecting the third pixel and the first signal line, a sixth selection unit for electrically connecting the third pixel and the second signal line, a seventh selection unit for electrically connecting the fourth pixel and the first signal line, an eighth selection unit for electrically connecting the fourth pixel and the second signal line are provided. The vertical control unit is an image sensor that controls the first selection unit, the second selection unit, the third selection unit, the fourth selection unit, the fifth selection unit, the sixth selection unit, the seventh selection unit, and the eighth selection unit so that the first control and the second control are performed.

9. In the image sensor according to any one of claims 1 to 8, The pixel unit has a fifth photoelectric conversion unit that converts the light transmitted through the optical system into electric charges, and a fifth pixel that outputs a fifth signal used for image generation; has a sixth photoelectric conversion unit that converts the light transmitted through the optical system into electric charges, and a sixth pixel that outputs a sixth signal used for image generation are arranged, The first pixel, the second pixel, the third pixel, the fourth pixel, the fifth pixel, and the sixth pixel are arranged along the column direction. Image sensor.

10. In the image sensor according to claim 9, The fifth pixel is arranged next to the first pixel, The sixth pixel is arranged next to the second pixel. Image sensor.

11. In the image sensor according to claim 10, a first floating diffusion to which the electric charges converted by the first photoelectric conversion unit and the electric charges converted by the fifth photoelectric conversion unit are transferred; a second floating diffusion to which the electric charges converted by the second photoelectric conversion unit and the electric charges converted by the sixth photoelectric conversion unit are transferred An image sensor comprising.

12. In the image sensor according to claim 11, The first photoelectric conversion unit and the fifth photoelectric conversion unit convert the light transmitted through a filter having different spectral characteristics into electric charges, The second photoelectric conversion unit and the sixth photoelectric conversion unit convert the light transmitted through a filter having different spectral characteristics into electric charges. Image sensor.

13. In the image sensor according to any one of claims 1 to 12, The first photoelectric conversion unit and the second photoelectric conversion unit convert the light transmitted through complementary color filters into electric charges. Image sensor.

14. In the image sensor according to any one of claims 1 to 13, The first pixel has a first light-shielding film that blocks the light transmitted through the optical system, The second pixel has a second light-shielding film that blocks the light transmitted through the optical system. Image sensor.

15. In the image sensor according to claim 14, The first light-shielding film is arranged so that the first photoelectric conversion unit converts the light passing through the first region of the exit pupil of the optical system into electric charges and does not convert the light passing through the second region of the exit pupil of the optical system into electric charges. The second light-shielding film is an imaging device arranged such that the second photoelectric conversion unit converts light passing through the second region of the exit pupil of the optical system into electric charges and does not convert light passing through the first region of the exit pupil of the optical system into electric charges.

16. In the imaging device according to any one of Claims 1 to 15, the pixel unit is arranged on a first semiconductor substrate, the first readout unit and the second readout unit are arranged on a second semiconductor substrate laminated together with the first semiconductor substrate, an imaging device.

17. In the imaging device according to Claim 16, the vertical control unit is arranged on the first semiconductor substrate, an imaging device.

18. In the imaging device according to Claim 17, the vertical control unit is arranged on the second semiconductor substrate, an imaging device.

19. An imaging device including the imaging device according to any one of Claims 1 to 18.

20. In the imaging device according to Claim 19, when the vertical control unit performs the first control, focus detection of the optical system is performed using the first signal and the second signal on which signal processing has been performed by either one of the first readout unit and the second readout unit, when the vertical control unit performs the second control, a control unit that generates image data using the first signal on which signal processing has been performed by one of the first readout unit and the second readout unit and the second signal by the other of the first readout unit and the second readout unit An imaging device comprising.

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