Package for housing optical components, optical device, and optical module

Abstract

To provide a package for accommodating an optical component that is easily joined to a lid body and can obtain high light blocking properties to block unnecessary light, an optical device, and an optical module.SOLUTION: A package for accommodating an optical component (10) comprises: a substrate (15) that has a recess (14); a lid body (12) that has a first surface (S1) and covers the recess with the first surface directed toward the recess; and a light blocking film (111) that is located on the first surface of the lid body. The light blocking film (111) has a first part (111a) that is thicker than a first thickness, and a second part (111b) that is thinner than the first thickness. In plan view, the first part (111a) is inside the recess (14).SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a package for housing optical components, an optical device, and an optical module.

Background Art

[0002] Patent Document 1 discloses an imaging device in which a light-shielding film is located at a joint portion between a housing and an optical filter.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a lid that has a light-shielding film positioned so as to surround the central portion covers the recess of the base, if a thick light-shielding film is located at the joint portion between the lid and the base, the process of joining the lid becomes complicated.

[0005] An object of the present disclosure is to provide a package for housing optical components, an optical device, and an optical module in which the lid can be easily joined and a high light-shielding property against unnecessary light can be obtained.

Means for Solving the Problems

[0006] The package for housing optical components according to the present disclosure includes: a base having a recess; a lid having a first surface and covering the recess with the first surface facing the recess side; a light-shielding film positioned on the first surface of the lid; and the light-shielding film has a first portion thicker than a first thickness and a second portion thinner than the first thickness, in a plan view, the first portion is located within the recess, In a plan view, the second part is located within the recess. and in a longitudinal section passing through a point on the inner peripheral side and a point on the outer peripheral side of the light-shielding film, the center in the width direction of the first portion is positioned more biased toward the inner peripheral side than the center in the width direction of the second portion It does.

[0007] The optical device according to the present disclosure is the above optical component housing package, the optical component housed in the recess, and comprises.

[0008] The optical module according to the present disclosure is the above optical device, the module substrate on which the optical device is mounted, and comprises.

Advantages of the Invention

[0009] According to the present disclosure, it is possible to provide an optical component housing package, an optical device, and an optical module in which the lid can be easily joined and high light shielding properties against unnecessary light can be obtained.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the vertical and horizontal ratios of each part are shown in a deformed manner.

[0012] (Embodiment 1) FIG. 1 is an exploded perspective view showing the package for housing an optical component and the optical device according to Embodiment 1. FIG. 2 is a vertical cross-sectional view in a state where the lid body and the base body are separated. FIG. 3 is a vertical cross-sectional view (A) and a plan view (B) showing the package for housing an optical component in a state where the lid body is joined.

[0013] The package 10 for housing an optical component according to the present embodiment includes a lid body 12 having a light-shielding film 111 and a base body 15 having a recess 14.

[0014] The optical device 200 according to the present embodiment includes the package 10 for housing an optical component and an optical component 201 housed in the package 10 for housing an optical component.

[0015] The recess 14 houses the optical component 201. The base body 15 may have a mounting portion 15b on the bottom surface of the recess 14 on which the optical component 201 is mounted. The base body 15 may have a seating surface 15a facing the lid body 12 around the recess 14.

[0016] The lid body 12 has translucency. The lid body 12 may be a transparent plate, or may be configured to exert an optical action such as a prism, a lens, an optical filter, or the like. The lid body 12 has a first surface S1 on the recess 14 side. The first surface S1 may be a flat surface. The first surface S1 includes a portion facing the seating surface 15a of the base body 15.

[0017] The light-shielding film 111 contains a resin adhesive and a light-shielding material. For example, by adding a light-shielding material such as carbon powder or a black pigment to the resin adhesive, the light-shielding property is enhanced and the reflectance is reduced. The resin adhesive preferably has an epoxy resin with a dense three-dimensional network structure as the main component from the viewpoints of moisture resistance or bonding strength. The resin adhesive is, for example, a bisphenol A type epoxy resin, a bisphenol A modified epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a special novolac type epoxy resin, a phenol derivative epoxy resin, a biphenol skeleton type epoxy resin, etc. These epoxy resins are composed of those added with a curing agent such as an imidazole-based, amine-based, phosphorus-based, hydrazine-based, imidazole adduct-based, amine adduct-based, cationic polymerization-based or dicyandiamide-based curing agent. Note that two or more types of epoxy resins may be mixed and used. The light-shielding film 111 may be formed on the first surface S1 of the lid body 12 by printing the material of the light-shielding film 111 before curing a plurality of times.

[0018] The light-shielding film 111 is located on the first surface S1 of the lid body 12. The light-shielding film 111 may be located on the lid body 12 so as to extend annularly along the edge of the opening end E1 (FIGS. 2 and 3(A)) of the recess 14 (FIG. 3(B)).

[0019] The lid body 12 and the seating surface 15a of the base body 15 may be joined via a joining resin 121.

[0020] The bonding resin 121 may or may not have light-shielding properties. The light-shielding property of the bonding resin 121 may be lower than that of the light-shielding film 111. The bonding resin 121 contains a resin adhesive, and preferably contains an epoxy resin having a dense three-dimensional network structure as a main component from the viewpoints of moisture resistance or bonding strength. The resin adhesive is, for example, an epoxy resin such as bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative epoxy resin, biphenol skeleton type epoxy resin, etc., and a curing agent such as an imidazole-based, amine-based, phosphorus-based, hydrazine-based, imidazole adduct-based, amine adduct-based, cationic polymerization-based or dicyandiamide-based is added to these epoxy resins. It should be noted that two or more kinds of epoxy resins may be mixed and used.

[0021] At the time of product shipment of the optical component housing package 10, the bonding resin 121 may not be cured or may not be attached to the lid 12. However, the arrangement relationship (bonding position and distance) between the lid 12 and the seat surface 15a when the bonding resin 121 is cured may be defined in advance in a specification or the like. In addition, the amount and surface shape of the bonding resin 121 when the bonding resin 121 is cured may be defined in a specification or the like. Hereinafter, the characteristics of the optical component housing package 10 in a state where the lid 12 is bonded to the base 15 may mean the characteristics when the bonding resin 121 is cured according to the above regulations. The same applies to other embodiments.

[0022] <Details of the light-shielding film> As shown in FIG. 2, the light-shielding film 111 may include a first portion 111a that is thicker than the first thickness T1 and a second portion 111b that is thinner than the first thickness T1. The first portion 111a has higher light-shielding properties than the second portion 111b by the amount that it is thicker than the second portion 111b. As shown in FIG. 3(B), the first portion 111a may extend annularly along the edge of the opening end E1 of the recess 14. The second portion 111b may also extend annularly along the edge of the opening end E1 of the recess 14. Hereinafter, when the light-shielding film 111 is regarded as an annular body, the outer peripheral side and the inner peripheral side thereof are respectively referred to as the outer peripheral side and the inner peripheral side of the light-shielding film 111.

[0023] As shown in FIG. 3(B), the first portion 111a may be located within the recess 14 in a plan view. According to this configuration, since the first portion 111a with high light-shielding properties is located within the recess 14, the light R1 (FIG. 3(A)) traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 can be blocked by the first portion 111a. Further, since the thick first portion 111a is located so as to be separated from the seating surface 15a, the joining process of the lid body 12 and the seating surface 15a can be facilitated. That is, the lid body 12 can be easily joined to the seating surface 15a with high parallelism.

[0024] As shown in FIG. 3(B), the second portion 111b may be located within the recess 14 in a plan view. Alternatively, in a plan view, the outer peripheral edge of the second portion 111b may be positioned so as to substantially overlap the edge of the opening end E1. According to this configuration, since the cured second portion 111b does not largely overlap the seating surface 15a, the joining process of the lid body 12 and the seating surface 15a can be made easier. That is, the lid body 12 can be more easily joined to the seating surface 15a with high parallelism.

[0025] In a state where the lid body 12 is joined, the lower surface u1 of the first portion 111a may be located below the opening end E1 of the recess 14. "Below" means the direction from the opening end E1 of the recess 14 toward the bottom of the recess 14. According to this configuration, the effect of blocking the light R1 (FIG. 3(A)) traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the first portion 111a can be enhanced.

[0026] The light-shielding film 111 may have a stepped portion D1 between the first portion 111a and the second portion 111b. With this configuration, a steep side surface h1 (FIG. 3(A)) of the first portion 111a can be obtained at the location of the stepped portion D1. Therefore, the effect of blocking the light R1 (FIG. 3(A)) that enters from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the side surface h1 can be enhanced. Further, the light R2 (FIG. 3(A)) reflected from the optical component 201 can be allowed to escape outward through the space opened by the stepped portion D1, and the incidence of unnecessary reflected light on the optical component 201 can be reduced.

[0027] The bonding resin 121 may be in contact with the light-shielding film 111. The bonding resin 121 may similarly be in contact with the light-shielding film 111 over the entire circumference along the edge of the opening end E1 of the recess 14. The bonding resin 121 may be in contact with at least the outer peripheral side of the light-shielding film 111. According to this configuration, since the outer peripheral side of the light-shielding film 111 is filled with the bonding resin 121, the leakage of reflected light from the outside of the light-shielding film 111 without being blocked by either the bonding resin 121 or the light-shielding film 111 is reduced.

[0028] The bonding resin 121 may be in contact with the light-shielding film 111 from the outer peripheral end of the light-shielding film 111 to the middle of the lower surface u1 of the first portion 111a. The lower surface u2 of the bonding resin 121 may be located below the lower surface u1 of the light-shielding film 111. According to this configuration, defects such as remaining coating of the bonding resin 121 can be reduced, and the leakage of reflected light from the outside of the light-shielding film 111 without being blocked by either the bonding resin 121 or the light-shielding film 111 is further reduced.

[0029] Note that the configuration in which the light-shielding film 111 has the stepped portion D1 and the configuration in which the lower surface u1 of the first portion 111a is located below the opening end E1 of the recess 14 may be configurations that appear in any longitudinal cross-section passing through the inner peripheral side point pi and the outer peripheral side point po of the light-shielding film 111, or may be configurations that appear except for the longitudinal cross-sections at some positions. The more locations where the above configurations appear in the longitudinal cross-section, the more locations where the effects of the above configurations can be obtained.

[0030] (Embodiment 2) FIG. 4 is a longitudinal sectional view (A) and a plan view (B) showing the package for housing an optical component according to Embodiment 2. The package 10A for housing an optical component according to Embodiment 2 mainly differs from that of Embodiment 1 in the shape of the light-shielding film 112, and the other components are the same as those of Embodiment 1.

[0031] The light-shielding film 112 may include a first portion 112a thicker than the first thickness T1 and a second portion 112b thinner than the first thickness T1. The first portion 112a has higher light-shielding properties than the second portion 112b by the amount that the first portion 112a is thicker than the second portion 112b. The first portion 112a may extend annularly along the edge of the opening end E1 of the recess 14. The second portion 112b may extend annularly along the edge of the opening end E1 of the recess 14.

[0032] As shown in FIG. 4(B), the first portion 112a may be located within the recess 14 in a plan view. According to this configuration, since the first portion 112a having high light-shielding properties is located within the recess 14, the light R1 (FIG. 4(A)) traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 can be blocked by the first portion 112a. Further, since the thick first portion 112a is located outside the seating surface 15a, the joining process between the lid body 12 and the seating surface 15a can be facilitated. That is, the lid body 12 can be easily joined to the seating surface 15a with high parallelism.

[0033] As shown in FIG. 4(B), the second portion 112b may be located within the recess 14 in a plan view. According to this configuration, since the cured second portion 112b is located outside the seating surface 15a, the joining process between the lid body 12 and the seating surface 15a can be made easier. That is, the lid body 12 can be more easily joined to the seating surface 15a with high parallelism.

[0034] In a state where the lid body 12 is joined, the lower surface u3 of the first portion 112a may be located below the opening end E1 of the recess 14 as shown in FIG. 4(A). According to this configuration, the action of blocking the light R1 (FIG. 4(A)) traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the first portion 112a can be enhanced.

[0035] The relationship between the bonding resin 121 and the light-shielding film 112 may be the same as that in Embodiment 1. With this configuration, a situation where reflected light leaks from outside the light-shielding film 112 without being blocked by either the bonding resin 121 or the light-shielding film 112 is reduced.

[0036] (Embodiments 3 to 5) FIG. 5 is a longitudinal sectional view showing optical component housing packages of Embodiment 3 (A), Embodiment 4 (B), and Embodiment 5 (C), respectively. The optical component housing packages 10B, 10C, and 10D of Embodiments 3 to 5 mainly differ from Embodiment 1 in the shape of the light-shielding films 113A to 113C, and other components are the same as those in Embodiment 1. The relationship between the concave portion 14 and the light-shielding films 113A to 113C in a plan view may also be the same as that in Embodiment 1.

[0037] The light-shielding films 113A to 113C of Embodiments 3 to 5 may include a first portion 113a that is thicker than the first thickness T1 and a second portion 113b that is thinner than the first thickness T1. The first portion 113a has higher light-shielding properties than the second portion 113b by virtue of being thicker than the second portion 113b. The first portion 113a may extend annularly along the edge of the opening end E1 of the concave portion 14. The second portion 113b may extend annularly along the edge of the opening end E1 of the concave portion 14.

[0038] The first portion 113a may be located within the concave portion 14 in a plan view. According to this configuration, since the first portion 113a with high light-shielding properties is located within the concave portion 14, the light R1 (FIGS. 5(A) to 5(C)) traveling from the edge of the opening end E1 of the concave portion 14 toward the center of the concave portion 14 can be blocked by the first portion 113a. Furthermore, since the thick first portion 113a is located away from the seating surface 15a, the bonding process between the lid body 12 and the seating surface 15a can be facilitated. That is, the lid body 12 can be easily bonded to the seating surface 15a with high parallelism.

[0039] The second part 113b may be located within the recess 14 in a plan view. According to this configuration, since the cured second part 113b is located outside the seating surface 15a, the joining process between the lid body 12 and the seating surface 15a can be made easier. That is, the lid body 12 can be more easily joined to the seating surface 15a with a high degree of parallelism.

[0040] In the state where the lid body 12 is joined, the lower surface u1 of the first part 113a may be located below the opening end E1 of the recess 14. According to this configuration, the action of blocking the light R1 (Figs. 5(A) to 5(C)) from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the first part 113a can be enhanced.

[0041] The light-shielding films 113A to 113C of Embodiments 3 to 5 may have a stepped portion D1 between the first part 113a and the second part 113b. With this configuration, a steep side surface h1 of the first part 113a can be obtained at the location of the stepped portion D1. Therefore, the action of blocking the light R1 (Fig. 3(A)) that enters from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the side surface h1 can be strengthened. Further, the light R2 (Fig. 3(A)) reflected from the optical component 201 can be allowed to escape outward through the space opened by the stepped portion D1, and the incidence of unnecessary light on the optical component 201 can be further reduced.

[0042] The relationship between the joining resin 121 and the light-shielding films 113A to 113C of Embodiments 3 to 5 may be the same as that of Embodiment 1. With this configuration, the situation where the reflected light leaks out from the outside of the light-shielding films 113A to 113C without being blocked by either the joining resin 121 or the light-shielding films 113A to 113C is reduced.

[0043] <Configuration of Embodiment 3> As shown in Fig. 5(A), in the light-shielding film 113A of Embodiment 3, the step T3 between the first part 113a and the second part 113b may be larger than the thickness T2 of the second part 113b. According to this configuration, the second part 113b can be made thinner. Therefore, the forming accuracy of the second part 113b close to the seat surface 15a is improved, and a situation where the second part 113b affects the bonding when the lid 12 is bonded to the seat surface 15a can be reduced. Therefore, the lid 12 can be more easily bonded to the seat surface 15a with a high degree of parallelism.

[0044] Furthermore, since the step T3 of the stepped portion D1 is larger than the thickness T2 of the second part 113b, the first part 113a can be made thicker. Therefore, it is possible to reduce the occurrence of pinholes remaining during the formation (printing) of the light-shielding film 113A, and the light-shielding property of the light-shielding film 113A can be improved. Furthermore, since the side surface h1 of the first part 113a becomes wider, the action of blocking the light R1 from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the first part 113a can be enhanced.

[0045] The relationship between the above step T3 and thickness T2 may be the same in the light-shielding films 113B and 113C of Embodiment 4 and Embodiment 5. Conversely, in the light-shielding films 113B and 113C of Embodiment 4 and Embodiment 5, the step T3 may be smaller than the thickness T2, or the step T3 and the thickness T2 may be the same.

[0046] <Configuration of Embodiment 4> As shown in Fig. 5(B), in the longitudinal section passing through the inner peripheral side point pi and the outer peripheral side point po of the light-shielding film 113B of Embodiment 4, the center c1 in the width direction of the first part 113a may be offset to the outer peripheral side from the center c2 in the width direction of the second part 113b. The width direction means the left-right direction (the direction along the first surface S1) in the longitudinal section. According to this configuration, since the outer peripheral side surface h1 of the first part 113a is located more on the outer peripheral side, the action of blocking the light R1 from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 by the first part 113a can be further enhanced.

[0047] <Configuration of Embodiment 5> As shown in FIG. 5(C), in the longitudinal section passing through the inner peripheral side point pi and the outer peripheral side point po of the light shielding film 113C in Embodiment 5, the center c11 in the width direction of the first portion 113a may be positioned more on the inner peripheral side than the center c12 in the width direction of the second portion 113b. According to this configuration, the action of allowing the light R2 reflected from the optical component 201 to escape outward through the space opened by the stepped portion D1 can be enhanced. Therefore, the incidence of unnecessary light on the optical component 201 can be further reduced.

[0048] (Embodiments 6 and 7) FIG. 6 is a longitudinal sectional view showing the optical component housing packages of Embodiment 6(A) and Embodiment 7(B). FIG. 7 is a longitudinal sectional view showing a modified example of the optical component housing packages of Embodiment 6(A) and Embodiment 7(B).

[0049] The optical component housing packages 10E and 10F of Embodiment 6 and Embodiment 7 may mainly differ from Embodiments 1 to 5 in the relationship between the light shielding film 114 and the bonding resin 121, and other components may be the same as those in Embodiments 1 to 5. That is, the shape of the light shielding film 114 in Embodiment 6 and Embodiment 7 may be the shape shown in FIG. 6(A), or may be the shape shown in Embodiments 1 to 5.

[0050] In Embodiment 6 and Embodiment 7, the lower surfaces u21 and u22 of the bonding resin 121 located on the outer peripheral side of the light shielding film 114 may be positioned above (higher than) the lower surface u1 of the light shielding film 114. According to this configuration, the possibility that the light R2 reflected from the optical component 201 is reflected by the bonding resin 121 and the reflected light enters the optical component 201 can be reduced.

[0051] Furthermore, as shown in Embodiment 7, the lower surface u22 of the bonding resin 121 located on the outer peripheral side of the light shielding film 114 may be inclined in a direction where it becomes higher toward the outer peripheral side. According to this configuration, the possibility that the light R2 reflected from the optical component 201 is reflected by the bonding resin 121 and the reflected light enters the optical component 201 can be further reduced.

[0052] The lower surfaces u21 and u22 of the bonding resin 121 may have convex curved surfaces as shown in FIGS. 7(A) and 7(B). According to this configuration, since the light R1 traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 and the light R2 reflected from the optical component 201 are dispersed when passing through or reflecting off the curved surfaces of the lower surfaces u21 and u22, the incidence of the light R1 and R2 on the optical component 201 can be further reduced. Furthermore, by applying an appropriate load during the bonding of the lid 12 and the seating surface 15a to the bonding resin 121, the bonding strength can be more reliably ensured.

[0053] (Embodiment 8) FIG. 8 is a longitudinal sectional view (A) and a plan view (B) showing the optical component housing package of Embodiment 8.

[0054] In the optical component housing package 10G of Embodiment 8, the light-shielding film 115 may include a first portion 115a thicker than the first thickness and a second portion 115b thinner than the first thickness. The light-shielding film 115 may have a stepped portion D1 between the first portion 115a and the second portion 115b. The step T3 between the first portion 115a and the second portion 115b may be larger than the thickness T2 of the second portion 115b.

[0055] The first portion 115a may extend annularly along the edge of the opening end E1 of the recess 14. The second portion 115b may extend annularly along the edge of the opening end E1 of the recess 14.

[0056] As shown in FIG. 8(B), the first portion 115a may be located within the recess 14 in a plan view. According to this configuration, since the highly light-shielding first portion 115a is located within the recess 14, the light R1 (FIG. 8(A)) traveling from the edge of the opening end E1 of the recess 14 toward the center of the recess 14 can be blocked by the first portion 115a. Furthermore, since the thick first portion 115a is located away from the seating surface 15a, the bonding process of the lid 12 and the seating surface 15a can be facilitated. That is, the lid 12 can be easily bonded to the seating surface 15a with high parallelism.

[0057] As shown in FIG. 8(B), the second portion 115b may be located outward of the concave portion 14 in a plan view. That is, the second portion 115b may overlap the seat surface 15a in a plan view. The second portion 115b may overlap the seat surface 15a over the entire circumferential direction of the light shielding film 115.

[0058] When the second portion 115b overlaps the seat surface 15a, the light R1 entering from the edge of the opening end E1 of the concave portion 14 can be more effectively blocked by the light shielding film 115. Further, since the first portion 115a having a large thickness exhibits a strong light shielding effect, the second portion 115b can be made thinner. And the thin second portion 115b can be formed with high precision. Therefore, even when the second portion 115b overlaps the seat surface 15a, the influence on the joining process between the lid body 12 and the seat surface 15a is small, and the lid body 12 can be easily joined to the seat surface 15a with high parallelism.

[0059] (Optical device and optical module) FIG. 9 is a diagram showing an optical device and an optical module according to an embodiment of the present disclosure.

[0060] The optical device 200 of the present embodiment includes an optical component housing package 10 and an optical component 201. The optical component housing package 10 may be replaced with the optical component housing packages 10A to 10G of Embodiments 2 to 8. The optical component 201 is mounted on the mounting portion 15b of the base 15 and housed in the concave portion 14. The optical component 201 is an imaging element, but may also be configured to include one or more of a light receiving element, a light emitting element, and an optical element that does not use electricity.

[0061] The base 15 may be a ceramic material such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. Wiring conductors are located on the surface and inside of the base 15, and power and signals may be transmitted between the optical component 201 and the outside of the base 15 through the wiring conductors.

[0062] The optical module 300 of this embodiment includes an optical device 200 and a module substrate 310 on which the optical device 200 is mounted. In addition to the optical device 200, other electronic devices, electronic components, electrical components, optical devices, optical components, etc. may be mounted on the module substrate 310. An electrode pad 311 is provided on the module substrate 310, and the optical device 200 may be joined to the electrode pad 311 via a joining material 312 such as solder.

[0063] According to the optical device 200 and the optical module 300 of this embodiment, an optical component housing package 10 is provided that can easily join the lid 12 with high accuracy and has high light shielding properties against unnecessary light. Therefore, the reliability of the optical device 200 and the optical module 300 is improved. Further, since the light shielding film 111 is located on the lid 12, the optical device 200 and the optical module 300 can be made thinner compared to the case where a light shielding configuration is provided in a separate layer.

[0064] The embodiments of the present disclosure have been described above. However, the optical component housing package, optical device, and optical module of the present disclosure are not limited to the above embodiments. Each configuration shown in Embodiments 2 to 8 may be a configuration that appears in a longitudinal section passing through the inner peripheral side point pi and the outer peripheral side point po of the light shielding films 111 to 115, or may be a configuration that appears except for the longitudinal sections at some positions. The more locations where the above configuration appears, the more locations where the effects of the above configuration can be obtained. In addition, details shown in the embodiments can be appropriately changed without departing from the spirit of the invention.

Description of Reference Numerals

[0065] 10, 10A to 10G Optical component housing package 12 Lid 14 Recess 15 Substrate 15a Seating surface 15b Mounting portion 111, 112, 113A to 113C, 114, 115 Light shielding film 111a to 113a, 115a First portion Second part of 111b to 113b, 115b Bonding resin 121 Optical device 200 Optical component 201 Optical module 300 Substrate for module 310 Centers in the width direction of c1, c2, c11, c12 Step part D1 Open end E1 Points on the inner peripheral side pi Points on the outer peripheral side po Light R1, R2 First surface S1 First thickness T1 Thickness T2 Step T3 Bottom surfaces u1, u2, u3, u21, u22

Claims

1. A substrate having a recess, A lid having a first surface and covering the recess with the first surface facing the recess side, A light-shielding film located on the first surface of the lid, Comprising, The light-shielding film has a first portion thicker than a first thickness and a second portion thinner than the first thickness, In a plan view, the first portion is located within the recess, In a plan view, the second portion is located within the recess, In a longitudinal cross-section passing through a point on the inner peripheral side and a point on the outer peripheral side of the light-shielding film, the center in the width direction of the first portion is offset more toward the inner peripheral side than the center in the width direction of the second portion, An optical component housing package.

2. With the direction from the opening end of the recess to the bottom of the recess being downward, The lower surface of the first portion is located below the opening end of the recess, The optical component housing package according to Claim 1.

3. The light-shielding film has a stepped portion between the second portion and the first portion, The optical component housing package according to Claim 1 or Claim 2.

4. The step between the first portion and the second portion is larger than the thickness of the second portion, The optical component housing package according to Claim 3.

5. Comprising a bonding resin for bonding the substrate and the lid, With the direction from the opening end of the recess to the bottom of the recess being downward, The lower surface of the bonding resin is located above the lower surface of the light-shielding film, The optical component housing package according to any one of Claims 1 to 4.

6. The lower surface of the bonding resin located on the outer peripheral side of the light-shielding film is inclined in a direction where it becomes higher toward the outer peripheral side, The optical component housing package according to Claim 5.

7. An optical component housing package according to any one of Claims 1 to 6, An optical component housed in the recess, An optical device comprising.

8. An optical device according to Claim 7, A module substrate on which the optical device is mounted, An optical module comprising.

Images