Polymer materials and conductive materials

Abstract

To provide a polymer material that has conductivity while having excellent mechanical properties and a conductive material containing the polymer material.SOLUTION: A polymer material contains a polymer compound H having at least one host group, and a conductive material. The host group is a monovalent group that is cyclodextrin or a cyclodextrin derivative from which one hydrogen atom or hydroxy group has been removed. The polymer material has conductivity while having excellent mechanical properties. In one embodiment of the polymer material, the polymer compound H further has at least one guest group, and the polymer compound H forms intermolecular host-guest interaction.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to polymer materials and conductive materials.

Background Art

[0002] In recent years, as the uses of polymer materials have become increasingly diversified, the creation of polymer materials having various functions has been demanded. For example, polymer materials having improved multiple physical properties in a so-called trade-off relationship, such as being hard but also having excellent stretchability, are expected to be applied in various fields.

[0003] In particular, electronic devices typified by the electronics field in recent years have spread with the rapid development of the IoT. From this perspective, it is easily expected that the need for conductive polymer materials having high strength and high durability will further increase in the future. Research on conductive polymer materials has been actively conducted. For example, Patent Document 1 proposes an ion conductive gel having self-healing performance.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional conductive materials, even if they reach the required level of conductivity, do not have sufficient mechanical properties such as flexibility and stretchability, leaving room for improvement. From this perspective, the creation of a conductive material that has conductivity and is also excellent in mechanical properties such as flexibility and stretchability has been strongly desired.

[0006] The present invention has been made in view of the above, and an object thereof is to provide a polymer compound and a polymer material having conductivity and excellent mechanical properties, and a conductive material containing the polymer material.

Means for Solving the Problems

[0007] As a result of intensive studies to achieve the above object, the present inventors have found that the above object can be achieved by introducing a specific functional group and a conductive material into a polymer compound, and have completed the present invention.

[0008] That is, the present invention includes, for example, the subjects described in the following items. Item 1 A polymer material containing a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative. Item 2 The polymer compound H further has at least one guest group, The polymer material according to Item 1, wherein the polymer compound H forms a host-guest interaction intermolecularly. Item 3 Further including a polymer compound G having at least one guest group, The polymer material according to Item 1, wherein at least one host group of the polymer compound H and at least one guest group of the polymer compound G form a host-guest interaction. Item 4 In the at least one host group of the polymer compound H, the main chain of another polymer compound H penetrates. The polymer material according to Item 1. Item 5 The polymer material according to Item 4, further including a chain polymer compound P other than the polymer compound H. Item 6 Further including a chain polymer compound P other than the polymer compound H, The polymer material according to item 1, wherein the main chain of the chain-like polymer compound P penetrates at least one of the host groups possessed by the polymer compound H. Item 7 The polymer material according to any one of items 1 to 6, wherein the conductive material contains a carbon material. Item 8 A conductive polymer material containing the polymer material according to any one of items 1 to 7.

Advantages of the Invention

[0009] The polymer compound according to the present invention is suitable as a raw material for producing a polymer material that has conductivity and excellent mechanical properties. Further, the polymer material according to the present invention has conductivity and excellent mechanical properties.

Brief Description of the Drawings

[0010]

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Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail. In this specification, expressions such as "containing" and "comprising" include the concepts of "containing", "comprising", "substantially consisting of", and "consisting only of".

[0012] The polymer material of the present invention contains a polymer compound H having at least one host group and a conductive material. The host group is a group in which one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative.

[0013] The form of the polymer material of the present invention is not particularly limited as long as it contains the polymer compound H and the conductive material. For example, the polymer materials of the present invention include the following polymer material A, polymer material B, polymer material C, and polymer material D.

[0014] Polymer material A contains the polymer compound H and the conductive material, and the polymer compound H further has at least one guest group, and the polymer compound H forms host-guest interactions intermolecularly.

[0015] Polymer material B contains the polymer compound H and the conductive material, and further contains a polymer compound G having at least one guest group, and at least one of the host groups of the polymer compound H and at least one of the guest groups of the polymer compound G form host-guest interactions.

[0016] Polymer material C contains the polymer compound H and the conductive material, and the main chain of another polymer compound H penetrates through at least one of the host groups of the polymer compound H.

[0017] The polymer material D contains the polymer compound H and the conductive material, and further contains a chain polymer compound P other than the polymer compound H. The main chain of the chain polymer compound P penetrates through at least one of the host groups of the polymer compound H.

[0018] In the polymer material, as long as the polymer compound H has at least one host group, its structure is not particularly limited. For example, in one embodiment of the present invention, the polymer compound H can have a host group-containing polymerizable monomer unit in its structure. In another embodiment of the present invention, the polymer compound H can have a third polymerizable monomer unit in addition to the host group-containing polymerizable monomer unit in its structure. Further, the polymer compound H contained in the polymer material B can have a guest group-containing polymerizable monomer unit in addition to the host group-containing polymerizable monomer unit and the third polymerizable monomer unit in its structure. Hereinafter, first, the host group-containing polymerizable monomer unit, the guest group-containing polymerizable monomer unit, and the third polymerizable monomer unit will be described in detail.

[0019] (Host group-containing polymerizable monomer unit) The host group-containing polymerizable monomer unit means a repeating structural unit formed when a host group-containing polymerizable monomer is polymerized. The host group-containing polymerizable monomer unit is a polymerizable monomer unit having at least one host group.

[0020] As described above, the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative. The host group is preferably a group obtained by removing one hydrogen atom or hydroxyl group from a cyclodextrin derivative. The host group is not limited to a monovalent group. For example, the host group may be a divalent group. Further, in the host group-containing polymerizable monomer unit, the host group can contain only one, or can contain two or more.

[0021] The cyclodextrin derivative preferably has a structure in which at least one of the hydroxyl groups of cyclodextrin has its hydrogen atom substituted with a hydrophobic group. That is, the cyclodextrin derivative refers to a molecule having a structure in which a cyclodextrin molecule is substituted with another organic group having hydrophobicity. However, the cyclodextrin derivative has at least one hydrogen atom or at least one hydroxyl group, and preferably has at least one hydroxyl group.

[0022] The hydrophobic group preferably has a structure substituted with at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group). Hereinafter, in this specification, the aforementioned "at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group)" may be referred to as "hydrocarbon group, etc." for convenience.

[0023] Here, although it is just a note for the sake of caution, the notation of cyclodextrin in this specification means at least one selected from the group consisting of α-cyclodextrin, β-cyclodextrin, and γ-cyclodextrin. Therefore, the cyclodextrin derivative is at least one selected from the group consisting of α-cyclodextrin derivative, β-cyclodextrin derivative, and γ-cyclodextrin derivative.

[0024] The host group is a monovalent or higher group from which one hydrogen atom or hydroxyl group has been removed from the cyclodextrin derivative. However, the hydrogen atom or hydroxyl group removed from the cyclodextrin derivative may be at any site of the cyclodextrin or the cyclodextrin derivative.

[0025] Here, when the total number of hydroxyl groups in one molecule of cyclodextrin is N, N = 18 for α-cyclodextrin, N = 21 for β-cyclodextrin, and N = 24 for γ-cyclodextrin.

[0026] If the host group is a monovalent group in which one "hydroxyl group" has been removed from a cyclodextrin derivative, the cyclodextrin derivative is formed by substituting the hydrogen atoms of up to N-1 hydroxyl groups per molecule of cyclodextrin with a hydrocarbon group or the like. On the other hand, if the host group is a monovalent group in which one "hydrogen atom" has been removed from a cyclodextrin derivative, the cyclodextrin derivative can have the hydrogen atoms of up to N hydroxyl groups per molecule of cyclodextrin substituted with a hydrocarbon group or the like.

[0027] Preferably, the host group has a structure in which the hydrogen atoms of 70% or more of the total number of hydroxyl groups present in one molecule of cyclodextrin are substituted with the hydrocarbon group or the like. More preferably, the hydrogen atoms of 80% or more of the total number of hydroxyl groups present in one molecule of cyclodextrin are substituted with the hydrocarbon group or the like, and particularly preferably, the hydrogen atoms of 90% or more of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.

[0028] Preferably, the host group has a structure in which the hydrogen atoms of 13 or more of the total number of hydroxyl groups present in one molecule of α-cyclodextrin are substituted with the hydrocarbon group or the like. More preferably, the hydrogen atoms of 15 or more of the total number of hydroxyl groups present in one molecule of α-cyclodextrin are substituted with the hydrocarbon group or the like, and particularly preferably, the hydrogen atoms of 17 hydroxyl groups of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.

[0029] Preferably, the host group has a structure in which the hydrogen atoms of 15 or more of the total number of hydroxyl groups present in one molecule of β-cyclodextrin are substituted with the hydrocarbon group or the like. More preferably, the hydrogen atoms of 17 or more of the total number of hydroxyl groups present in one molecule of β-cyclodextrin are substituted with the hydrocarbon group or the like, and particularly preferably, the hydrogen atoms of 19 or more of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.

[0030] It is preferable that the host group has a structure in which hydrogen atoms of 17 or more hydroxyl groups among all the hydroxyl groups present in one molecule of γ-cyclodextrin are substituted with the hydrocarbon group or the like. More preferably, hydrogen atoms of 19 or more hydroxyl groups among all the hydroxyl groups present in one molecule of γ-cyclodextrin are substituted with the hydrocarbon group or the like, and particularly preferably, hydrogen atoms of 21 or more hydroxyl groups among all the hydroxyl groups are substituted with the hydrocarbon group or the like.

[0031] In the cyclodextrin derivative, the type of the hydrocarbon group is not particularly limited. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group.

[0032] The number of carbon atoms of the hydrocarbon group is not particularly limited. For example, the number of carbon atoms of the hydrocarbon group is preferably 1 to 4.

[0033] Specific examples of the hydrocarbon group having 1 to 4 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a butyl group. When the hydrocarbon group is a propyl group and a butyl group, it may be either linear or branched.

[0034] In the cyclodextrin derivative, examples of the acyl group include an acetyl group, a propionyl group, and a formyl group. The acyl group is preferably an acetyl group in terms of easily forming a host-guest interaction or allowing other polymer chains to easily penetrate into the host group ring, and also in terms of easily obtaining a polymer material excellent in toughness and strength.

[0035] In the cyclodextrin derivative, -CONHR (R is a methyl group or an ethyl group) is a methylcarbamate group or an ethylcarbamate group. -CONHR is preferably an ethylcarbamate group in terms of easily forming a host-guest interaction or allowing other polymer chains to easily penetrate into the host group ring, and also in terms of easily obtaining a polymer material excellent in toughness and strength.

[0036] In the cyclodextrin derivative, the hydrocarbon group and the like are preferably an alkyl group or an acyl group having 1 to 4 carbon atoms, preferably a methyl group and an acyl group, more preferably a methyl group, an acetyl group, and a propionyl group, and particularly preferably a methyl group and an acetyl group.

[0037] The host group-containing polymerizable monomer unit is not particularly limited as long as it has the host group and is a compound having polymerizability. For example, known host group-containing polymerizable monomers can be widely exemplified. The host group-containing polymerizable monomer preferably has a functional group having radical polymerizability. Examples of the functional group having radical polymerizability include groups containing a carbon-carbon double bond. Specifically, an acryloyl group (CH2=CH(CO)-), a methacryloyl group (CH2=CCH3(CO)-), and other styryl groups, vinyl groups, allyl groups, etc. can be mentioned. These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.

[0038] Specific examples of the host group-containing polymerizable monomer include vinyl-based polymerizable monomers having the host group. For example, the host group-containing polymerizable monomer can include a compound represented by the following general formula (h1).

[0039]

Chemical formula

[0040] In formula (h1), Ra represents a hydrogen atom or a methyl group, R H represents the host group, R 1It represents a divalent group formed by removing one hydrogen atom from a monovalent group selected from the group consisting of a hydroxyl group, a thiol group, an alkoxy group which may have one or more substituents, a thioalkoxy group which may have one or more substituents, an alkyl group which may have one or more substituents, an amino group which may have one substituent, an amide group which may have one substituent, an aldehyde group, and a carboxyl group.

[0041] Alternatively, examples of the host group-containing polymerizable monomer include compounds represented by the following general formula (h2).

[0042]

Chemical formula

[0043] In formula (h2), Ra, R H and R 1 are respectively synonymous with Ra, R H and R 1 in formula (h1).

[0044] Furthermore, examples of the host group-containing polymerizable monomer include compounds represented by the following general formula (h3).

[0045]

Chemical formula

[0046] In formula (h3), Ra, R H and R 1 are respectively synonymous with Ra, R H and R 1 in formula (h1). n is an integer of 1 to 20, preferably 1 to 10, more preferably 1 to 5. Rb represents hydrogen or an alkyl group having 1 to 20 carbon atoms (preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms).

[0047] Note that the host group R in the host group-containing polymerizable monomers represented by formulas (h1), (h2), and (h3)H This is an example in the case of a monovalent group obtained by removing one hydroxyl group from a cyclodextrin derivative.

[0048] In addition, the host group-containing polymerizable monomer can be one kind alone of the compounds represented by formula (h1), formula (h2), and formula (h3), or can contain two or more kinds. In this case, Ra in formula (h1), formula (h2), and formula (h3) may be the same as or different from each other. Similarly, R in formula (h1), formula (h2), and formula (h3) H and R in formula (h1), formula (h2), and formula (h3) 1 may each be the same as or different from each other.

[0049] In formulas (h1) to (h3), the substituents are not particularly limited. For example, examples of the substituents include an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, a halogen atom, a carboxyl group, a carbonyl group, a sulfonyl group, a sulfone group, a cyano group, and the like.

[0050] In formulas (h1) to (h3), if R 1 is a divalent group formed by removing one hydrogen atom from an amino group which may have one substituent, the nitrogen atom of the amino group can be bonded to the carbon atom of the C=C double bond.

[0051] In formulas (h1) to (h3), if R 1 is a divalent group formed by removing one hydrogen atom from an amide group which may have one substituent, the carbon atom of the amide group can be bonded to the carbon atom of the C=C double bond.

[0052] In formulas (h1) to (h3), if R 1 is a divalent group formed by removing one hydrogen atom from an aldehyde group, the carbon atom of the aldehyde group can be bonded to the carbon atom of the C=C double bond.

[0053] In formulas (h1) to (h3), if R 1When it is a divalent group formed by removing one hydrogen atom from a carboxyl group, the carbon atom of the carboxyl group can be bonded to the carbon atom of the C=C double bond.

[0054] The host group-containing polymerizable monomer represented by the formulas (h1) to (h3) is, for example, a (meth)acrylate derivative (i.e., R 1 is -COO-), a (meth)acrylamide derivative (i.e., R 1 is -CONH- or -CONR-, and R has the same meaning as the above-mentioned substituent) is preferable. As R of the -CONR-, for example, an alkyl group having 1 to 20 carbon atoms is preferable, an alkyl group having 1 to 10 carbon atoms is more preferable, and an alkyl group having 1 to 6 carbon atoms is particularly preferable.

[0055] In the present specification, “(meth)acryl” means “acryl” or “methacryl”, “(meth)acrylate” means “acrylate” or “methacrylate”, and “(meth)allyl” means “allyl” or “methallyl”.

[0056] The production method of the host group-containing polymerizable monomer is not particularly limited, and for example, a known production method can be widely adopted.

[0057] (Guest group-containing polymerizable monomer unit) The guest group-containing polymerizable monomer unit means a repeating structural unit formed when the guest group-containing polymerizable monomer is polymerized. The guest group-containing polymerizable monomer unit is a polymerizable monomer unit having at least one guest group.

[0058] The guest group is not particularly limited as long as it can form a host-guest interaction with the host group, and in particular, as long as it can be included in the host group. The guest group is not limited to a monovalent group, and for example, the guest group may be a divalent group. Further, in the guest group-containing polymerizable monomer unit, the guest group can contain only one or two or more.

[0059] Examples of the guest group include linear or branched hydrocarbon groups having 3 to 30 carbon atoms, cycloalkyl groups, heteroaryl groups, and organometallic complexes, etc., and these may have one or more substituents. The substituents are the same as those described above, and examples thereof include halogen atoms (e.g., fluorine, chlorine, bromine, etc.), hydroxyl groups, carboxyl groups, ester groups, amide groups, and hydroxyl groups that may be protected, etc.

[0060] More specific examples of the guest group include linear or cyclic alkyl groups having 4 to 18 carbon atoms, and groups derived from polycyclic aromatic hydrocarbons. The linear alkyl group having 4 to 18 carbon atoms may be either linear or branched. The cyclic alkyl group may have a cage-like structure. Examples of the polycyclic aromatic hydrocarbon include π-conjugated compounds formed of at least two or more aromatic rings, and specifically, naphthalene, anthracene, tetracene, pentacene, benzopyrene, chrysene, pyrene, triphenylene, etc. can be mentioned.

[0061] The guest group may also be, for example, a monovalent group formed by removing one atom (e.g., a hydrogen atom) from a guest molecule exemplified by at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives; aromatic compounds and their alcohol derivatives; amine derivatives; ferrocene derivatives; azobenzene; naphthalene derivatives; anthracene derivatives; pyrene derivatives: perylene derivatives; clusters composed of carbon atoms such as fullerenes; and dansyl compounds.

[0062] Further specific examples of the guest group include t-butyl group, n-octyl group, n-dodecyl group, isobornyl group, adamantyl group, a group derived from pyrene, and groups to which the above-mentioned substituents are bonded.

[0063] The guest group-containing polymerizable monomer unit is not particularly limited as long as it is a compound having the guest group and polymerizability. For example, known guest group-containing polymerizable monomers can be widely exemplified. The guest group-containing polymerizable monomer preferably has a functional group having radical polymerizability. Examples of the functional group having radical polymerizability include groups containing a carbon-carbon double bond. Specifically, an acryloyl group (CH2=CH(CO)-), a methacryloyl group (CH2=CCH3(CO)-), and other styryl groups, vinyl groups, allyl groups, etc. can be mentioned. These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.

[0064] Specific examples of the guest group-containing polymerizable monomer include vinyl-based polymerizable monomers having the guest group. For example, the guest group-containing polymerizable monomer can include a compound represented by the following general formula (g1).

[0065] [Chemical formula]

[0066] In formula (g1), Ra represents a hydrogen atom or a methyl group, R G represents the guest group, and R 2 has the same meaning as R1 in formula (h1). Among the polymerizable monomers represented by formula (g1), (meth)acrylic acid esters or their derivatives (that is, R 2 is -COO-), (meth)acrylamides or their derivatives (that is, R 2 is -CONH- or -CONR-, and R has the same meaning as the above-mentioned substituent) are preferable. In this case, since the polymerization reaction proceeds easily, the production of polymer A becomes easy.

[0067] Specific examples of the guest group-containing polymerizable monomer include n-hexyl (meth)acrylate, n-octyl (meth)acrylate, n-dodecyl (meth)acrylate, adamantyl (meth)acrylate, hydroxyadamantyl (meth)acrylate, 1-(meth)acrylamidoadamantane, 2-ethyl-2-adamantyl (meth)acrylate, N-dodecyl (meth)acrylamide, t-butyl (meth)acrylate, 1-acrylamidoadamantane, N-(1-adamantyl)(meth)acrylamide, N-benzyl (meth)acrylamide, N-1-naphthylmethyl (meth)acrylamide, ethoxylated o-phenylphenol acrylate, phenoxypolyethylene glycol acrylate, isostearyl acrylate, nonylphenol EO adduct acrylate, isobornyl (meth)acrylate, (meth)acrylate having a pyrene moiety, (meth)acrylamide having a pyrene moiety, and the like.

[0068] The guest group-containing polymerizable monomer can be produced by a known method. Also, a commercially available product can be used as the guest group-containing polymerizable monomer.

[0069] (The third polymerizable monomer unit) The third polymerizable monomer unit means a repeating structural unit formed when the third polymerizable monomer is polymerized.

[0070] The third polymerizable monomer unit means a repeating structural unit formed when a polymerizable monomer copolymerizable with the host group-containing polymerizable monomer and the guest group-containing polymerizable monomer (hereinafter referred to as the "third polymerizable monomer") is polymerized. The third polymerizable monomer does not have the host group.

[0071] Examples of the third polymerizable monomer include various known vinyl-based polymerizable monomers. Specific examples of the third polymerizable monomer include compounds represented by the following general formula (a1).

[0072]

Chemical formula

[0073] In formula (a1), Ra is a hydrogen atom or a methyl group, and R 3 represents a halogen atom, a hydroxyl group, a thiol group, an amino group which may have one substituent or a salt thereof, a carboxyl group which may have one substituent or a salt thereof, an amide group which may have one or more substituents or a salt thereof, or a phenyl group which may have one or more substituents.

[0074] In formula (a1), R 3 When is a carboxyl group having one substituent, the hydrogen atom of the carboxyl group is a hydrocarbon group having 1 to 20 carbon atoms, a hydroxyalkyl group (for example, hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group), methoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), ethoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), etc., and a carboxyl group (that is, an ester) substituted thereby can be mentioned. The hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, preferably 1 to 10 carbon atoms, and particularly preferably 1 to 3 carbon atoms. The hydrocarbon group may be either linear or branched.

[0075] In formula (a1), R 3 When is an amide group having one or more substituents, that is, a secondary amide or a tertiary amide, an amide group in which one hydrogen atom or two hydrogen atoms of the primary amide are independently substituted with a hydrocarbon group having 1 to 20 carbon atoms or a hydroxyalkyl group (for example, hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group) can be mentioned. The hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, and preferably 2 to 10 carbon atoms. The hydrocarbon group may be either linear or branched.

[0076] Specific examples of the monomer represented by formula (a1) include (meth)acrylic acid, allylamine, maleic anhydride, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-octyl (meth)acrylate, (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, N-isopropyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, hydroxymethyl (meth)acrylate, 2-hydroxyethyl(meth)acrylamide, 2-hydroxyethyl (meth)acrylate, ethoxy-diethylene glycol (meth)acrylate, methoxy-triethylene glycol (meth)acrylate, methoxy-polyethylene glycol (meth)acrylate, styrene, and the like. These can be used alone or in combination of two or more.

[0077] Among the compounds represented by formula (a1), the third polymerizable monomer unit is preferably (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof. In this case, since the polymerization reaction easily proceeds, the production of the polymer becomes easy.

[0078] (Polymer compound H) In the polymer material of the present invention, the polymer compound H has the host group-containing polymerizable monomer unit as an essential constituent unit, and can also have the third polymerizable monomer unit as necessary. Further, in the polymer material A, the polymer compound H also includes the guest group-containing polymerizable monomer unit. Hereinafter, the host group-containing polymerizable monomer unit is abbreviated as "host unit", the guest group-containing polymerizable monomer unit is simply abbreviated as "guest unit", and the third polymerizable monomer unit is abbreviated as "third unit".

[0079] In terms of the fact that a polymer material is likely to have excellent mechanical properties and is likely to have excellent flexibility, it is preferable that the polymer compound H has both the host unit and the third unit. In all the constituent units of the polymer compound H, the content ratio of the host unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Further, in all the constituent units of the polymer compound H, the content ratio of the host unit is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less. In the present invention, the ratio (molar ratio) of each constituent unit in the polymer compound H can be regarded as being consistent with the molar ratio of each monomer used in the production of the polymer compound.

[0080] The mass average molecular weight (Mw) of the polymer compound H is not particularly limited either, and for example, it can be 10,000 to 2,000,000, preferably 20,000 to 1,000,000. The polymer compound H can be, for example, a random polymer. Also, the polymer compound H can be linear, and can have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.

[0081] As a further preferred embodiment of the polymer compound H, "polymer compound Ha", "polymer compound Hb", "polymer compound Hc", and "polymer compound Hd" described below can be mentioned.

[0082] The production method of the polymer compound H is not particularly limited, and known production methods can be widely adopted. For example, the polymer compound H can be produced by a polymerization reaction of a raw material containing the host group-containing polymerizable monomer and, if necessary, the guest group-containing polymerizable monomer unit and / or the third polymerizable monomer contained. The polymerization reaction is not particularly limited either. For example, in the case of a raw material containing a radically polymerizable monomer, known radical polymerization reactions can be widely applied.

[0083] (Conductive material) As long as the conductive material contained in the polymer material of the present invention exhibits conductivity, its type is not limited, and for example, known conductive materials can be widely cited. For example, as the conductive material, carbon materials, metal materials, etc. can be cited, and in addition, various organic materials and inorganic materials can be cited.

[0084] Among them, in terms of the fact that the polymer material is likely to have excellent mechanical properties while having excellent conductivity, it is preferable that the conductive material contains at least a carbon material.

[0085] Examples of the carbon material include carbon black, carbon fiber, carbon nanotube, carbon paper, graphene, amorphous carbon, graphite, etc. Examples of carbon black include ketjen black, acetylene black, furnace black, channel black, thermal lamp black, etc. Examples of graphene include graphene nanoplatelets. Examples of graphite include natural graphite, artificial graphite, expanded graphite, etc.

[0086] The shape, size, etc. of the carbon material are not particularly limited. For example, it can be in various shapes such as powdery, flaky, fibrous, rod-shaped, irregular (amorphous), etc.

[0087] The conductive material contained in the polymer material can be a single type, or can be two or more different types. Further, the conductive material can include a carbon material and other conductive materials such as metal materials, or the conductive material can be only a carbon material.

[0088] The conductive material can be manufactured by known manufacturing methods, or can be obtained from commercially available products, etc.

[0089] Hereinafter, the polymer material A, the polymer material B, the polymer material C, and the polymer material D will be described in detail.

[0090] (Polymer Material A) The polymer material A contains the polymer compound H and the conductive material, and the polymer compound H further has at least one guest group, and the polymer compound H forms a host-guest interaction intermolecularly. Hereinafter, the polymer compound H contained in the polymer material A is denoted as "polymer compound Ha".

[0091] The polymer compound Ha has the host unit, the guest unit, and the third unit in the molecule. The host group and the guest group are covalently bonded to the main chain or side chain of the polymer compound Ha.

[0092] In terms of the mechanical properties of the polymer material A being easily improved and excellent flexibility, the content ratio of the host unit in all the constituent units of the polymer compound Ha is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, the content ratio of the host unit in all the constituent units of the polymer compound Ha is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less.

[0093] In terms of the mechanical properties of the polymer material A being easily improved and excellent flexibility, the content ratio of the guest unit in all the constituent units of the polymer compound Ha is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, the content ratio of the guest unit in all the constituent units of the polymer compound Ha is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less.

[0094] In terms of the mechanical properties of the polymer material A being easily improved and excellent flexibility, in all the constituent units of the polymer compound Ha, the content ratio of the third unit is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 80 mol% or more, and particularly preferably 90 mol% or more. Further, in all the constituent units of the polymer compound Ha, the content ratio of the third unit is preferably 99.8 mol% or less, and more preferably 99 mol% or less.

[0095] The polymer compound Ha can contain other monomer units as long as the effects of the present invention are not inhibited, or the polymer compound Ha can also be formed only by the host unit, the guest unit and the third unit.

[0096] In the polymer compound Ha, the combination of the host group and the guest group is not particularly limited, and the above-mentioned host group and guest group can be arbitrarily combined. Among them, in terms of easily improving the mechanical properties of the polymer material A by the host-guest interaction between the polymer compounds Ha, when the host group is derived from α-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an octyl group and a dodecyl group. For the same reason, when the host group is derived from β-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an adamantyl group and an isobornyl group, and when the host group is derived from γ-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an octyl group, a dodecyl group, a cyclododecyl group, an adamantyl group, and a group derived from a polycyclic aromatic hydrocarbon. Examples of the polycyclic aromatic hydrocarbon here can include pyrene and the like. When the guest group is a group derived from a polycyclic aromatic hydrocarbon, in the polymer material A, the polymer compound Ha and the conductive material are more uniformly mixed, so that the conductivity and mechanical properties are easily improved. In particular, when the conductive material is a carbon material, the conductivity and mechanical properties are particularly easily improved.

[0097] In the polymer material A, since the polymer compound H is the polymer compound Ha, the polymer compounds can form host-guest interactions between molecules. That is, at least one guest group of another polymer compound Ha is included in at least one host group of the polymer compound Ha, whereby host-guest interactions between molecules can be formed.

[0098] Figure 1(a) schematically shows how the polymer compounds Ha form host-guest interactions. Due to such host-guest interactions between molecules, the conductive material present in the polymer material A is likely to be uniformly dispersed. As a result, excellent conductivity is exhibited, and at the same time, the mechanical properties of the polymer material A are improved, and it can have excellent flexibility while being tough.

[0099] Since the polymer material A can form host-guest interactions between molecules, it can also have self-healing properties. For example, even if the polymer material A is cut, etc., by re-bonding the cut surfaces, host-guest interactions are re-formed at the bonding surface, and as a result, re-bonding occurs and self-healing takes place.

[0100] In the polymer material A, the content ratios of the polymer compound Ha and the conductive material are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Ha can be 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Ha can be 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less, and particularly preferably 40% by mass or less. When the conductive material is Ketjen black, the content ratio of the conductive material with respect to the total mass of the polymer compound Ha can be 1% by mass or more, preferably 3% by mass or more, more preferably 5% by mass or more, still more preferably 6% by mass or more, and particularly preferably 7% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Ha can be 30% by mass or less, preferably 20% by mass or less, more preferably 15% by mass or less, still more preferably 12.5% by mass or less, and particularly preferably 10% by mass or less.

[0101] The polymer material A may contain other additives other than the polymer compound Ha and the conductive material, or alternatively, the polymer material A can be formed only of the polymer compound Ha and the conductive material.

[0102] The method for producing the polymer material A is not particularly limited, and for example, known methods can be widely adopted. For example, the polymer material A can be obtained by mixing the polymer compound Ha and the conductive material by known mixing means. As the mixing means, known mixers can be widely used, and examples thereof include mixers such as ball mills. The mixing can be carried out either dry or wet. In the case of wet mixing, for example, a method of mixing a solution of the polymer compound Ha and the conductive material can be mentioned. In the solution of the polymer compound Ha, the solvent is not particularly limited, and various organic solvents in which the polymer compound Ha is soluble can be used.

[0103] (Polymer Material B) Polymer Material B contains the polymer compound H and the conductive material, and further contains a polymer compound G having at least one guest group. In Polymer Material B, at least one host group of the polymer compound H and at least one guest group of the polymer compound G form a host-guest interaction. Hereinafter, the polymer compound H contained in Polymer Material B is denoted as "Polymer Compound Hb".

[0104] Polymer Compound Hb has the host unit and the third unit in the molecule and does not contain the guest unit. The host group is covalently bonded to the main chain or side chain of Polymer Compound Hb.

[0105] In terms of the mechanical properties of Polymer Material B being easily improved and being excellent in flexibility, the content ratio of the host unit in all the constituent units of Polymer Compound Hb is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, the content ratio of the host unit in all the constituent units of Polymer Compound Hb is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less.

[0106] In terms of the mechanical properties of Polymer Material B being easily improved and being excellent in flexibility, the content ratio of the third unit in all the constituent units of Polymer Compound Hb is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 80 mol% or more, and particularly preferably 90 mol% or more. Also, the content ratio of the third unit in all the constituent units of Polymer Compound Hb is preferably 99.9 mol% or less, more preferably 99 mol% or less.

[0107] The polymer compound Hb can contain other monomer units (excluding guest units) as long as the effects of the present invention are not inhibited, or the polymer compound Hb can also be formed only from the host unit and the third unit.

[0108] On the other hand, the polymer compound G has the guest unit and the third unit in the molecule and does not contain the host unit. The guest group is covalently bonded to the main chain or side chain of the polymer compound G.

[0109] In terms of the mechanical properties of the polymer material B being easily improved and excellent flexibility, in all the constituent units of the polymer compound G, the content ratio of the guest unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, in all the constituent units of the polymer compound G, the content ratio of the guest unit is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less.

[0110] In terms of the mechanical properties of the polymer material B being easily improved and excellent flexibility, in all the constituent units of the polymer compound G, the content ratio of the third unit is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 80 mol% or more, and particularly preferably 90 mol% or more. Also, in all the constituent units of the polymer compound G, the content ratio of the third unit is preferably 99.9 mol% or less, more preferably 99 mol% or less.

[0111] The polymer compound G can contain other monomer units (excluding host units) as long as the effects of the present invention are not inhibited, or the polymer compound G can also be formed only from the host unit and the third unit.

[0112] The weight average molecular weight (Mw) of the polymer compound G is not particularly limited, and can be, for example, from 10,000 to 2,000,000, preferably from 20,000 to 1,000,000. The polymer compound G can be, for example, a random polymer. Also, the polymer compound H can be linear, and can have a branched structure or a crosslinked structure as long as the effects of the present invention are not inhibited.

[0113] The method for producing the polymer compound G is not particularly limited, and known production methods can be widely adopted. For example, the polymer compound G can be produced by a polymerization reaction of a raw material containing the guest group-containing polymerizable monomer and the third polymerizable monomer. The polymerization reaction is also not particularly limited. For example, in the case of a raw material containing a radically polymerizable monomer, known radical polymerization reactions can be widely applied.

[0114] In the polymer compound Hb and the polymer compound G, the third units may be the same as each other, or some or all of them may be different.

[0115] The combination of the host group in the polymer compound Hb and the guest group in the polymer compound G is not particularly limited, and the above-mentioned host group and guest group can be arbitrarily combined. Among them, at least one of the host groups possessed by the polymer compound Hb and at least one of the guest groups possessed by the polymer compound G can easily improve the mechanical properties of the polymer material B due to host-guest interaction. When the host group is derived from α-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an octyl group and a dodecyl group. For the same reason, when the host group is derived from β-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an adamantyl group and an isobornyl group. When the host group is derived from γ-cyclodextrin or its derivative, the guest group is preferably at least one selected from the group consisting of an octyl group, a dodecyl group, a cyclododecyl group, an adamantyl group, and a group derived from a polycyclic aromatic hydrocarbon. Examples of the polycyclic aromatic hydrocarbon here include pyrene and the like. When the guest group is a group derived from a polycyclic aromatic hydrocarbon, in the polymer material B, the polymer compound Hb and the polymer compound G and the conductive material are more uniformly mixed, so that the conductivity and mechanical properties are easily improved. In particular, when the conductive material is a carbon material, the conductivity and mechanical properties are particularly easily improved.

[0116] In the polymer material B, since the polymer compound H is the polymer compound Hb and contains the polymer compound G, the two polymer compounds can form a host-guest interaction between molecules. That is, at least one guest group of the polymer compound G is included in at least one of the host groups of the polymer compound Hb, whereby a host-guest interaction between molecules can be formed.

[0117] FIG. 1(b) schematically shows how the polymer compound Hb and the polymer compound G form a host-guest interaction with each other. Due to such an intermolecular host-guest interaction, the conductive material present in the polymer material B is likely to be uniformly dispersed. As a result, excellent conductivity is exhibited, and at the same time, the mechanical properties of the polymer material B are improved, and it can have excellent flexibility while being tough.

[0118] Since the host-guest interaction between molecules is formed in the polymer material B, it can also have self-healing properties. For example, even if the polymer material B is cut or the like, by re-bonding the cut surfaces, the host-guest interaction is re-formed at the bonding surface, and as a result, re-bonding occurs and self-healing takes place.

[0119] In the polymer material B, the content ratios of the polymer compound Hb, the polymer compound G, and the conductive material are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material relative to the total mass of the polymer compound Hb and the polymer compound G can be 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material relative to the total mass of the polymer compound Hb and the polymer compound G can be 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less, and particularly preferably 40% by mass or less. When the conductive material is Ketjen black, the content ratio of the conductive material relative to the total mass of the polymer compound Hb and the polymer compound G can be 1% by mass or more, preferably 3% by mass or more, more preferably 5% by mass or more, still more preferably 6% by mass or more, and particularly preferably 7% by mass or more. In terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material relative to the total mass of the polymer compound Hb and the polymer compound G can be 30% by mass or less, preferably 20% by mass or less, more preferably 15% by mass or less, still more preferably 12.5% by mass or less, and particularly preferably 10% by mass or less.

[0120] In the polymer material B, the content ratios of the polymer compound Hb and the polymer compound G are not particularly limited. For example, in terms of being likely to have host-guest interaction and being likely to enhance conductivity and mechanical properties, the content ratio of the polymer compound Hb relative to the total mass of the polymer compound Hb and the polymer compound G is 30 to 80% by mass, preferably 40 to 60% by mass, and they may be equal in amount.

[0121] The polymer material B may contain other additives other than the polymer compound Hb, the polymer compound G, and the conductive material, or may be formed only of the polymer compound Hb, the polymer compound G, and the conductive material.

[0122] The method for manufacturing the polymer material B is not particularly limited. For example, known methods can be widely adopted. For example, the polymer material B can be obtained by mixing the polymer compound Hb, the polymer compound G, and the conductive material by known mixing means. As the mixing means, known mixers can be widely used, and examples thereof include mixers such as ball mills. The mixing can be carried out either dry or wet. In the case of wet mixing, for example, a method of mixing a solution containing the polymer compound Hb and the polymer compound G with the conductive material can be mentioned. The solvent of the solution is not particularly limited, and various organic solvents in which both the polymer compound Hb and the polymer compound G can be dissolved can be used.

[0123] (Polymer material C) The polymer material C contains the polymer compound H and the conductive material, and at least one of the host groups possessed by the polymer compound H has the main chain of another polymer compound H passing through it. Hereinafter, the polymer compound H contained in the polymer material C is denoted as "polymer compound Hc".

[0124] The polymer compound Hc has the host unit and the third unit in the molecule and does not contain the guest unit. The host group is covalently bonded to the main chain or side chain of the polymer compound Hc.

[0125] The third unit in the polymer compound Hc is sized so that it can penetrate through the ring of the host group possessed by the polymer compound Hc. Thereby, as described above, the main chain of another polymer compound Hc can penetrate through the host group ring of the polymer compound Hc, and more precisely, a segment composed of the third units in another polymer compound Hc penetrates through the host group ring.

[0126] As the type of the third polymerizable monomer for forming such a third unit, for example, it is preferably a polymer of (meth) acrylic acid, (meth) acrylic acid ester, (meth) acrylamide or its derivative, and more preferably methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, etc. In particular, when the host group is γ-cyclodextrin or its derivative, ethyl (meth) acrylate is preferred.

[0127] In terms of the mechanical properties of the polymer material C being easily improved and being excellent in flexibility, in all the constituent units of the polymer compound Hc, the content ratio of the host unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, in all the constituent units of the polymer compound Hc, the content ratio of the host unit is preferably 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less.

[0128] In terms of the mechanical properties of the polymer material C being easily improved and being excellent in flexibility, in all the constituent units of the polymer compound Hc, the content ratio of the third unit is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 80 mol% or more, and particularly preferably 90 mol% or more. Also, in all the constituent units of the polymer compound Hb, the content ratio of the third unit is preferably 99.9 mol% or less, more preferably 99 mol% or less.

[0129] The polymer compound Hc can contain other monomer units (excluding the guest unit) as long as the effects of the present invention are not inhibited, or the polymer compound Hc can also be formed only by the host unit and the third unit.

[0130] Preferably, the polymer material C further contains a chain polymer compound P in addition to the polymer compound Hc. This makes it easier to further improve the mechanical properties of the polymer material C.

[0131] The chain polymer compound P is, for example, a polymer compound having the third unit and no host group. Among them, the chain polymer compound P is preferably a polymer of (meth) acrylic acid, (meth) acrylic acid ester, (meth) acrylamide or a derivative thereof, and more preferably a polymer such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, or isopropyl (meth) acrylate.

[0132] The chain polymer compound P can contain other monomer units (excluding the host unit and the guest unit) as long as the effects of the present invention are not inhibited, or the chain polymer compound P can be formed only by the third unit.

[0133] The mass average molecular weight (Mw) of the chain polymer compound P is not particularly limited, and can be, for example, 10,000 to 2,000,000, preferably 20,000 to 1,000,000. The chain polymer compound P can have a structure such as a homopolymer or a random polymer, and can be linear, and can also have a branched structure or a crosslinked structure as long as the effects of the present invention are not inhibited.

[0134] The production method of the polymer compound P is not particularly limited, and known production methods can be widely adopted. For example, the chain polymer compound P can be produced by a polymerization reaction of a raw material containing the third polymerizable monomer. The polymerization reaction is not particularly limited either. For example, when the raw material contains a radically polymerizable monomer, known radical polymerization reactions can be widely applied.

[0135] In the polymer compound Hc and the chain polymer compound P, the third units may be the same as each other, or some or all of them may be different.

[0136] In the polymer material C, when the polymer compound H is the polymer compound Hc, a segment composed of a third unit of another polymer compound Hc penetrates through the host group ring of the polymer compound Hc.

[0137] Figure 1(c) schematically shows a state in which another polymer compound Hc penetrates through the host group of the polymer compound Hc. By having another polymer compound Hc penetrate through the host group of the polymer compound Hc, a crosslinked structure (mobile crosslinked structure) in which the polymer compound Hc has mobility is formed, and thereby, the mechanical properties of the polymer material C can be improved and it can have excellent flexibility while being tough. In addition, since the polymer compound Hc that has penetrated through the host group also has a host group, the host group serves as a so-called stopper and can prevent detachment.

[0138] The method for forming the mobile crosslinked structure of the polymer compound Hc is not particularly limited. For example, by producing the polymer compound Hc through a polymerization reaction, a mobile crosslinked structure can also be formed simultaneously. Specifically, in the polymerization reaction of the polymer compound Hc, as the growth reaction of the polymer compound Hc proceeds, at the same time, the growing polymer chain penetrates through the host group of another polymer chain, and a mobile crosslinked structure as shown in Figure 1(c) can be formed.

[0139] When the polymer material C contains the chain polymer compound P, for example, as shown in Figure 1(c), it is presumed that the chain polymer compound P exists in the mobile crosslinked structure of the polymer compound Hc, and thereby, the mechanical properties of the polymer material C can be further improved.

[0140] In the polymer material C, the content ratios of the polymer compound Hc, the chain polymer compound P, and the conductive material are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hc and the chain polymer compound P can be 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hc and the chain polymer compound P is 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less, and particularly preferably 40% by mass or less. When the conductive material is Ketjen black, the content ratio of the conductive material with respect to the total mass of the polymer compound Hc and the chain polymer compound P can be 1% by mass or more, preferably 3% by mass or more, more preferably 5% by mass or more, still more preferably 6% by mass or more, and particularly preferably 7% by mass or more. In terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hc and the chain polymer compound P is 20% by mass or less, more preferably 15% by mass or less, still more preferably 12.5% by mass or less, and particularly preferably 10% by mass or less.

[0141] When the polymer material C contains the chain polymer compound P, the content ratios of the polymer compound Hc and the chain polymer compound P are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the polymer compound Hc with respect to the total mass of the polymer compound Hc and the chain polymer compound P can be, for example, 10% by mass or more, preferably 20% by mass or more, more preferably 40% by mass or more, and still more preferably 50% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the polymer compound Hc with respect to the total mass of the polymer compound Hc and the chain polymer compound P can be 90% by mass or less, preferably 80% by mass or less, and more preferably 70% by mass or less.

[0142] The polymer material C may contain, in addition to the polymer compound Hc, the chain-like polymer compound P, and the conductive material, other additives, or alternatively, it can be formed only from the polymer compound Hc, the chain-like polymer compound P, and the conductive material.

[0143] The method for producing the polymer material C is not particularly limited, and for example, known methods can be widely adopted. For example, the polymer material C can be obtained by mixing the polymer compound Hc produced in advance so as to form a mobile cross-linked structure, the conductive material, and, if necessary, the chain-like polymer compound P, by known mixing means. As the mixing means, known mixers can be widely used, and examples include mixers such as ball mills. The mixing can be carried out either dry or wet. In the case of wet mixing, for example, a method of mixing a solution containing the polymer compound Hc produced so as to form a mobile cross-linked structure with the conductive material can be mentioned. The solvent of the solution is not particularly limited, and various organic solvents in which the polymer compound Hc can dissolve can be used.

[0144] (Polymer material D) The polymer material D contains the polymer compound H and the conductive material, and further contains a chain-like polymer compound P other than the polymer compound H. The main chain of the chain-like polymer compound P penetrates at least one of the host groups of the polymer compound H. Hereinafter, the polymer compound H contained in the polymer material D is denoted as "polymer compound Hd".

[0145] The polymer compound Hd has the host unit and the third unit in the molecule. The host group is covalently bonded to the main chain or side chain of the polymer compound Hd.

[0146] The third unit in the polymer compound Hd is sized such that it cannot penetrate through the ring of the host group of the polymer compound Hd, and in this respect, it is different from the polymer compound Hc in the previous polymer material C.

[0147] Preferably, the third unit is sized such that it cannot penetrate the ring of the host group and cannot form an inclusion complex. Examples of such a third unit include styrene, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, methoxyethyl (meth)acrylate, hexyl (meth)acrylate, 2-ethoxy-hexyl (meth)acrylate, dodecyl (meth)acrylate, and polyethylene glycol (meth)acrylate, with styrene being preferred.

[0148] In terms of the mechanical properties of the polymer material D being easily improved and its flexibility being excellent, in all the constituent units of the polymer compound Hd, the content ratio of the host unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, still more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. Also, in all the constituent units of the polymer compound Hc, the content ratio of the host unit is preferably 40 mol% or less, more preferably 30 mol% or less, still more preferably 20 mol% or less, and particularly preferably 10 mol% or less.

[0149] In terms of the mechanical properties of the polymer material C being easily improved and its flexibility being excellent, in all the constituent units of the polymer compound Hd, the content ratio of the third unit is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 80 mol% or more, and particularly preferably 90 mol% or more. Also, in all the constituent units of the polymer compound Hb, the content ratio of the third unit is preferably 99.9 mol% or less, more preferably 99 mol% or less.

[0150] The polymer compound Hd can contain other monomer units (excluding the guest unit) as long as the effects of the present invention are not inhibited, or the polymer compound Hc can also be formed only from the host unit and the third unit.

[0151] The chain polymer compound P contained in the polymer material D has the third unit and does not have a host group, and is a polymer compound that penetrates the host group of the polymer compound Hd. Such a chain polymer compound P is preferably a polymer of (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof, and more preferably a polymer such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, etc.

[0152] The chain polymer compound P can contain other monomer units (excluding the host unit and the guest unit) as long as the effects of the present invention are not inhibited, or the chain polymer compound P can also be formed only by the third unit.

[0153] The mass average molecular weight (Mw) of the chain polymer compound P is not particularly limited, and can be, for example, 10,000 to 2 million, preferably 20,000 to 1 million. The chain polymer compound P can have a structure such as a homopolymer or a random polymer, for example. Also, the chain polymer compound P can be linear, and can have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.

[0154] The production method of the polymer compound P is not particularly limited, and known production methods can be widely adopted. For example, the chain polymer compound P can be produced by a polymerization reaction of a raw material containing the third polymerizable monomer. The polymerization reaction is not particularly limited either. For example, when the raw material is a radical polymerizable monomer, known radical polymerization reactions can be widely applied.

[0155] In the polymer compound Hd and the chain polymer compound P, the third units are of different types from each other. That is, the third unit of the polymer compound Hd cannot penetrate the host group in the polymer compound Hd, whereas the third unit of the chain polymer compound P can penetrate the host group in the polymer compound Hd.

[0156] In the polymer material D, since the polymer compound H is the polymer compound Hd and includes a chain polymer compound P capable of penetrating the host group, a mobile crosslinked structure formed by the chain polymer compound P penetrating through the host group ring of the polymer compound Hd is included.

[0157] FIG. 1(d) schematically shows a state in which the other polymer compound Hc penetrates through the host group of the polymer compound Hd. By the chain polymer compound P penetrating through the host group of the polymer compound Hc, a mobile crosslinked structure is formed by the polymer compound Hd and the chain polymer compound P, whereby the mechanical properties of the polymer material D are improved and it can have excellent flexibility while being tough.

[0158] In the polymer material D, the content ratios of the polymer compound Hd, the chain polymer compound P, and the conductive material are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hd, the chain polymer compound P, and the conductive material can be 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Also, in terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hd and the conductive material can be 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less, and particularly preferably 40% by mass or less. When the conductive material is Ketjen black, the content ratio of the conductive material with respect to the total mass of the polymer compound Hd and the conductive material can be 1% by mass or more, preferably 3% by mass or more, more preferably 5% by mass or more, still more preferably 8% by mass or more, and particularly preferably 10% by mass or more. In terms of being likely to enhance conductivity and mechanical properties, the content ratio of the conductive material with respect to the total mass of the polymer compound Hd and the conductive material can be 50% by mass or less, preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less.

[0159] In the polymer material D, the content ratios of the polymer compound Hd and the chain-like polymer compound P are not particularly limited. For example, in terms of being likely to enhance conductivity and mechanical properties, it is preferable that the content ratio of the host unit in the polymer compound Hd is 0.01 mol% or more, more preferably 0.1 mol% or more, still more preferably 0.3 mol% or more, and particularly preferably 0.5 mol% or more, based on the total amount of the constitutional units of both the polymer compound Hd and the chain-like polymer compound P. Also, it is preferable that the content ratio of the host unit in the polymer compound Hd is 40 mol% or less, more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5 mol% or less, based on the total amount of the constitutional units of both the polymer compound Hd and the chain-like polymer compound P.

[0160] The polymer material D may contain other additives other than the polymer compound Hd, the chain-like polymer compound P, and the conductive material, or alternatively, it can be formed only from the polymer compound Hd, the chain-like polymer compound P, and the conductive material.

[0161] The polymer material D can be produced, for example, by the following method. First, in the presence of the previously produced polymer compound Hd, a polymerization reaction of a raw material (the third polymerizable monomer unit) for obtaining the chain-like polymer compound P is carried out. By this polymerization reaction, the growth reaction of the chain-like polymer compound P proceeds, and at the same time, the growing polymer chain can penetrate the host group. As a result, a mobile cross-linked structure composed of the polymer compound Hd and the chain-like polymer compound P is generated. The obtained mobile cross-linked structure and the conductive material can be mixed by known mixing means to obtain the polymer material D. As the mixing means, known mixers can be widely used, and for example, mixers such as ball mills can be mentioned. The mixing can be carried out either dry or wet. In the case of wet mixing, for example, a method of mixing a solution containing the mobile cross-linked structure composed of the polymer compound Hd and the chain-like polymer compound P with the conductive material can be mentioned.

[0162] (Polymer material) As described above, the polymer material of the present invention includes polymer material A, polymer material B, polymer material C, and polymer material D.

[0163] The form of the polymer material is not particularly limited. For example, it may be a molded body such as a film, sheet, plate, block, etc., or it may be in the form of particles, fibers, granules, pellets, etc.

[0164] When manufacturing a molded body of the polymer material, the manufacturing method is not particularly limited. For example, well-known molding methods can be widely adopted. Specifically, casting methods, press molding methods, extrusion molding methods, injection molding methods, etc. can be mentioned.

[0165] The polymer material of the present invention has conductivity while also having excellent mechanical properties. In particular, it is a flexible and tough material. Therefore, the polymer material of the present invention has excellent moldability and can be molded and processed into various shapes. In addition, the polymer materials of the present invention, particularly polymer materials A and B, are likely to exhibit a self-healing function, so they can be repaired even if damaged, and as a result, they are excellent in durability and can also contribute to the phenomenon of waste.

[0166] Since the polymer material of the present invention has conductivity, it is also suitable as a raw material for conductive polymer materials. Such conductive polymer materials include the polymer material of the present invention, so they have excellent conductivity while also having excellent mechanical properties, and thus can be suitably used for various applications that require conductivity. For example, conductive polymer materials can be applied to various fields such as conductive films, conductive coating agents, wiring, electronic devices, and precision machinery in addition to conductive films.

Examples

[0167] Hereinafter, the present invention will be described more specifically by way of examples, but the present invention is not limited to the aspects of these examples.

[0168] (Production Example 1) Acrylamide β-cyclodextrin was produced by a known method. Specifically, acrylamide β-cyclodextrin (hereinafter referred to as βCDAAm) was obtained by reacting 6-amino-β-cyclodextrin with acryloyl chloride in the presence of NaHCO3. 20 g of this βCDAAm was dissolved in 300 mL of pyridine, 170.133 g of acetic anhydride was added, and the mixture was stirred at 55 °C for 12 hours or more. Then, 50 mL of methanol was added for quenching, and the mixture was concentrated with an evaporator until the internal volume became 200 mL. The obtained concentrated solution was dropped into 2000 mL of water, and the precipitate was collected. The precipitate was dissolved in 200 mL of acetone, dropped into 2000 mL of water, and the generated precipitate was collected. This was dried under reduced pressure to isolate the target host group-containing polymerizable monomer. The obtained host group-containing polymerizable monomer was a compound represented by the following formula (h1-1) (hereinafter referred to as "PAcβCD").

[0169] [Chemical formula]

[0170] (Production Example 2) Weighed 5 g (3.9 mmol) of γ-cyclodextrin, 700 mg (6.9 mmol) of N-hydroxymethylacrylamide and 95 mg (0.6 mmol) of p-toluenesulfonic acid monohydrate into a 200 mL round-bottomed glass flask, added these to 25 mL of N,N-dimethylformamide to prepare a reaction solution. Heated the solution to 90 °C in an oil bath and obtained a reaction solution by heating and stirring for 1 hour. Then, allowed the reaction solution to cool and poured it into 45 mL of vigorously stirred acetone. After filtering off the resulting precipitate, washed it three times with 10 mL of acetone and dried it under reduced pressure at room temperature for one hour to obtain a reaction product. Dissolved the reaction product in 100 mL of distilled water, passed it through a column (apparent density 600 g / L) filled with porous polystyrene resin (Mitsubishi Chemical Diaion HP-20), and adsorbed it for 30 minutes. Then, removed the solution components, passed 50 mL of a 10% methanol (or acetonitrile) aqueous solution through the column three times to wash the polystyrene resin and remove unreacted γ-cyclodextrin. Subsequently, passed 500 mL of a 25% methanol aqueous solution through the column twice to elute the target product, acrylamidomethyl γ-cyclodextrin (denoted as γCDAAmMe). Removed the solvent under reduced pressure to obtain γCDAAmMe as a white powder.

[0171] Dissolved 20 g of this γCDAAmMe in 300 mL of pyridine, added 170.133 g of acetic anhydride, and stirred at 55 °C for 12 hours or more. Then, added 50 mL of methanol to quench, and concentrated it with an evaporator until the internal volume reached 200 mL. Added the resulting concentrated solution dropwise to 2000 mL of water and recovered the precipitate. Dissolved the precipitate in 200 mL of acetone, added it dropwise to 2000 mL of water, recovered the resulting precipitate, and dried it under reduced pressure to isolate the target host group-containing polymerizable monomer. The obtained host group-containing polymerizable monomer was a compound represented by the following formula (h1-2) (hereinafter denoted as "PAcγCD").

[0172] [Chemical formula]

[0173] (Example 1-1) According to the reaction scheme shown in FIG. 2, the polymer compound Ha was synthesized. Specifically, 1 mol% of PAcβCD obtained in Production Example 1, 1 mol% of acrylamide adamantyl which is a guest group-containing polymerizable monomer, and a polymerizable monomer mixture containing 98 mol% of ethyl acrylate were mixed with IRGACURE184 to prepare a raw material, and the raw material was irradiated with ultraviolet light (λ = 365 nm) to carry out a polymerization reaction, thereby obtaining the polymer compound Ha.

[0174] The obtained polymer compound Ha was a polymer compound having a host group-containing polymerizable monomer unit (1 mol%), a guest group-containing polymerizable monomer unit (1 mol%), and a copolymer unit (98 mol%) of a third polymerizable monomer. Next, 7.5 parts by mass of Ketjen black (Lion Specialty Chemicals "EC600JD") as a conductive material was blended with 100 parts by mass of the polymer compound Ha and mixed with a ball mill to obtain the polymer material A.

[0175] (Example 1-2) The polymer material A was obtained in the same manner as in Example 1-1 except that the blending amount of Ketjen black was changed to 10 parts by mass.

[0176] (Comparative Example 1-1) A polymer material was obtained in the same manner as in Example 1-1 except that the blending amount of Ketjen black was 0 part by mass, that is, Ketjen black was not used.

[0177] (Example 2-1) The polymer compound Hb was synthesized according to the reaction scheme shown in Fig. 3(a). Specifically, the polymer compound Hb was obtained by carrying out the polymerization reaction of a polymerizable monomer mixture containing 1 mol% of PAcγCD obtained in Production Example 2 and 99 mol% of ethyl acrylate in ethyl acetate in the presence of AIBN. On the other hand, the polymer compound G was synthesized according to the reaction scheme shown in Fig. 3(b). Specifically, the polymer compound G was obtained by carrying out the polymerization reaction of a polymerizable monomer mixture containing 1 mol% of acrylamide having a pyrene moiety and 99 mol% of ethyl acrylate in ethyl acetate in the presence of AIBN.

[0178] The obtained polymer compound Hb is a polymer compound having a host group-containing polymerizable monomer unit (1 mol%) and a copolymer unit of a third polymerizable monomer (99 mol%). Also, the polymer compound G was a polymer compound having a guest group-containing polymerizable monomer unit (1 mol%) and a copolymer unit of a third polymerizable monomer (99 mol%). Next, 5 parts by mass of Ketjen black (Lion Specialty Chemicals "EC600JD") as a conductive material was blended with 100 parts by mass of a mixture of the polymer compound Hb and the polymer compound G (polymer compound Hb: polymer compound G = 1:1), and the mixture was mixed with a ball mill to obtain a polymer material B.

[0179] (Example 2-2) A polymer material B was obtained in the same manner as in Example 2-1 except that the blending amount of Ketjen black was changed to 10 parts by mass.

[0180] (Example 2-3) A polymer material B was obtained in the same manner as in Example 2-1 except that the blending amount of Ketjen black was changed to 20 parts by mass.

[0181] (Example 2-4) A polymer material B was obtained in the same manner as in Example 2-1 except that the ratio of polymer compound Hb: polymer compound G was changed to 1:2.

[0182] (Example 2-5) A polymer material B was obtained in the same manner as in Example 2-2, except that the ratio of the polymer compound Hb to the polymer compound G was changed to 1:2.

[0183] (Example 2-6) A polymer material B was obtained in the same manner as in Example 2-3, except that the ratio of the polymer compound Hb to the polymer compound G was changed to 1:2.

[0184] (Example 2-7) A polymer material B was obtained in the same manner as in Example 2-1, except that 30 parts by mass of graphene nanoplatelets (GNP) was used instead of 5 parts by mass of Ketjen black.

[0185] (Example 3-1) According to the reaction scheme shown in Fig. 4(a), a polymer compound Hc was synthesized. Specifically, a polymerizable monomer mixture containing 1 mol% of PAcγCD obtained in Production Example 2 and 99 mol% of ethyl acrylate, and IRGACURE 184 were mixed to prepare a raw material, and the raw material was irradiated with ultraviolet light (λ = 365 nm) to carry out a polymerization reaction to obtain a polymer compound Hc. The obtained polymer compound Hc has a structure in which another polymer compound Hc penetrates through the ring of the host group of the polymer compound Hc (a mobile cross-linked structure). The obtained polymer compound Hc was a polymer compound having a host group-containing polymerizable monomer unit (1 mol%) and a copolymer unit of a third polymerizable monomer (99 mol%).

[0186] On the other hand, according to the reaction scheme shown in Fig. 4(b), a chain polymer compound P was synthesized. Specifically, ethyl acrylate and IRGACURE 184 were mixed to prepare a raw material, and the raw material was irradiated with ultraviolet light (λ = 365 nm) to carry out a polymerization reaction to obtain a chain polymer compound P.

[0187] Next, 2.5 parts by mass of Ketjen black (Lion Specialty Chemicals "EC600JD") as a conductive material was blended with 100 parts by mass (mass ratio 50:50) of a mixture of the polymer compound Hc and the chain polymer compound P, and the mixture was mixed by a ball mill to obtain a polymer material C.

[0188] (Example 3-2) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 5 parts by mass.

[0189] (Example 3-3) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 7.5 parts by mass.

[0190] (Example 3-4) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 10 parts by mass.

[0191] (Example 3-5) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 12.5 parts by mass.

[0192] (Example 3-6) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 15 parts by mass.

[0193] (Comparative Example 3-1) A polymer material C was obtained in the same manner as in Example 3-1, except that the amount of Ketjen black was changed to 0 parts by mass, that is, Ketjen black was not used.

[0194] (Comparative Example 3-2) A polymer material C was obtained in the same manner as in Comparative Example 3-1, except that the chain polymer compound P was not used.

[0195] (Example 4-1) The polymer compound Hd was synthesized according to the reaction scheme shown in Fig. 5(a). Specifically, 1 mol of PAcγCD obtained in Production Example 2 and a polymerizable monomer mixture containing 20 mol of styrene were subjected to a polymerization reaction in toluene in the presence of AIBN to obtain the polymer compound Hd. Next, according to the reaction scheme shown in Fig. 5(b), a mobile cross-linked structure formed by the polymer compound Hd and the chain polymer compound P was synthesized. Specifically, the polymer compound Hd, ethyl acrylate, and IRGACURE 184 were mixed to prepare a raw material, and the raw material was irradiated with ultraviolet light (λ = 365 nm) to carry out a polymerization reaction to obtain a mobile cross-linked structure. Such a mobile cross-linked structure has a structure in which polyethyl acrylate (chain polymer compound P) penetrates through the inside of the ring of the host group. The amount of the mobile cross-linked structure was adjusted so that the ratio of the host unit to all the constituent units of the polymer compound Hd and the chain polymer compound P was 1 mol%. Next, 5 parts by mass of Ketjen black (Lion Specialty Chemicals "EC600JD") as a conductive material was blended with 100 parts by mass of the mobile cross-linked structure and mixed by a ball mill to obtain a polymer material D.

[0196] (Example 4-2) A polymer material D was obtained in the same manner as in Example 4-1, except that the blending amount of Ketjen black was changed to 10 parts by mass.

[0197] (Example 4-3) A polymer material D was obtained in the same manner as in Example 4-1, except that the blending amount of Ketjen black was changed to 20 parts by mass.

[0198] (Comparative Example 4-1) A polymer material D was obtained in the same manner as in Example 4-1, except that the blending amount of Ketjen black was 0 part by mass, that is, Ketjen black was not used.

[0199] Figures 6(a) and (b) show the evaluation results of the mechanical properties of the polymer materials obtained in Example 1-1, Example 1-2, and Comparative Example 1-1. From the results in Figure 6, it was found that the polymer materials A obtained in Example 1-1 and 1-2 had improved ductility, fracture energy, and Young's modulus compared to the polymer material obtained in Comparative Example 1-1, and had excellent mechanical properties. Also, from Figure 6(c), it was found that the polymer materials A obtained in Example 1-1 and 1-2 had excellent mechanical properties compared to polyethyl acrylate containing 8% by mass of ketjen black (PEA(KB8%) in the figure).

[0200] In addition, when a conduction test was performed using the polymer materials A obtained in Example 1-1 and 1-2, it was found that both had conductivity. Furthermore, after cutting the polymer materials A obtained in Example 1-1 and 1-2, it was also confirmed that they could be re-bonded by adhering the cut surfaces to each other and that conduction was possible even after re-bonding. From the above, it was demonstrated that the polymer materials A obtained in Example 1-1 and 1-2 are materials that have excellent mechanical properties while having conductivity.

[0201] Table 1 shows the measurement results of the resistance values of the polymer materials B obtained in Example 2-1 to 2-6. As a result, it was found that all the polymer materials B had low resistance values and had conductivity.

[0202]

Table 1

[0203] Figure 7 shows the evaluation results of the mechanical properties of the polymer materials obtained in Example 3-1 to 3-6 and Comparative Example 3-1 to 3-2. As a result, it was found that the polymer materials C obtained in Example 3-1 to 3-6 were toughened more than the polymer materials obtained in Comparative Example 3-1 and 3-2.

[0204] Figure 8 shows the measurement results of the conductivity of the polymer materials obtained in Example 3-1 to 3-6. From the results in Figure 8, it was found that the polymer materials C obtained in Example 3-1 to 3-6 had conductivity.

[0205] From the above, it was demonstrated that the polymer material C obtained in Examples 3-1 to 3-6 is a material having excellent mechanical properties while having conductivity.

[0206] Figs. 9(a) and (b) show the evaluation results of the mechanical properties of the polymer materials obtained in Examples 4-1 to 4-3 and Comparative Example 4-1. From the results in Fig. 9, it was found that the polymer material D obtained in Examples 4-1 to 4-3 has improved ductility, fracture energy, and Young's modulus compared to the polymer material obtained in Comparative Example 4-1, and has excellent mechanical properties.

[0207] Fig. 10 shows the repeated tensile test results (Fig. 10(a)) and the resistance value measurement results (Fig. 10(b)) when the strain of the polymer material D obtained in Example 4-2 was increased up to 100% in increments of 10%. Specifically, the polymer material D was stretched to a predetermined size, left stationary for 15 seconds, and then the resistance value was measured. Thereafter, the polymer material D was returned to the state of 0% strain (initial state), and then stretched to the next predetermined strain, and the same measurement was sequentially repeated.

[0208] Table 2 shows the measurement results of the resistance values of the polymer material D obtained in Examples 4-1 to 4-3. As a result, it was found that Examples 4-2 to 4-3 have low resistance values and have conductivity. Note that Example 4-1 did not have conductivity.

[0209]

Table 2

[0210] (Method for evaluating mechanical properties) The mechanical properties of the polymer material were evaluated by observing the breaking point of the polymer material using a tensile test (stroke - test force curve) with "AUTOGRAPH" (model number: AGX - plus) manufactured by Shimadzu Corporation. Taking this breaking point as the end point, the maximum stress up to the end point was defined as the breaking stress of the polymer material. This tensile test was carried out in an up - type manner where the lower end of the film - shaped polymer material formed to a thickness of 200 - 400 μm was fixed and the upper end was operated at a tensile speed of 1 mm / min or 5 mm / min. Also, the strain rate was calculated as the value obtained by dividing the stroke at that time, that is, the maximum length when the polymer material was pulled, by the length of the polymer material before pulling. In the "stroke - test force curve" (stress - strain curve) test, a material showing a high value for one or both of the breaking stress and the breaking strain (also simply referred to as strain) can be judged to have excellent toughness and strength of the polymer material. In particular, a material showing high values for both the breaking stress and the strain can be judged to be a material with excellent fracture energy.

Claims

1. A polymer material excluding electrodes for lithium-ion secondary batteries and electrodes for all-solid-state batteries, comprising a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative, and the conductive material contains a carbon material.

2. The polymer material according to Claim 1, wherein the polymer compound H further has at least one guest group, and the polymer compound H forms host-guest interactions intermolecularly.

3. A polymer material comprising a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative, the conductive material contains a carbon material, the polymer material further comprises a polymer compound G having at least one guest group, and at least one host group of the polymer compound H and at least one guest group of the polymer compound G form host-guest interactions.

4. A polymer material comprising a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative, and the main chain of another polymer compound H penetrates through at least one host group of the polymer compound H.

5. A polymer material comprising a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative, the main chain of another polymer compound H penetrates through at least one host group of the polymer compound H, and the polymer material further comprises a chain-like polymer compound P other than the polymer compound H.

6. A polymer material comprising a polymer compound H having at least one host group and a conductive material, wherein the host group is a group obtained by removing one hydrogen atom or hydroxyl group from cyclodextrin or a cyclodextrin derivative, and the polymer material further comprises a chain-like polymer compound P other than the polymer compound H. ​ ​ ​ In the at least one host group of the polymer compound H, the main chain of the chain polymer compound P penetrates through, a polymer material.

7. The polymer material according to any one of claims 4 to 6, wherein the conductive material contains a carbon material.

8. A conductive polymer material containing the polymer material according to any one of claims 1 to 7.

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