Phenolic resin molded article and method for producing the same

Abstract

To provide a phenol resin molding having high heat insulation performance and excellent heat resistance (contraction suppression under high temperature and high humidity), and a method for producing the same.SOLUTION: A phenol resin molding has a surface having a surface void ratio of 3% or more and 20% or less, and a density of 300 kg / m3 or more and 1,100 kg / m3 or less. A method for producing a phenol resin molding includes a step of hot press molding phenol foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less, a bulk density of 5 kg / m3 or more and 150 kg / m3 or less.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a phenolic resin molded body and a method for producing the same.

Background Art

[0002] Phenolic resins are known as resins having excellent mechanical strength, heat resistance, solvent resistance, acid resistance, and further electrical properties, and are widely used as molding materials in the fields of electronics, automobiles, construction, and medicine. Novolak-type phenolic resins are mainly used as molding materials, but resol-type phenolic resins can also promote crosslinking (curing reaction) by heating or adding an acid to obtain a thermosetting resin molded body.

[0003] However, since resol-type phenolic resins have methylol groups which are crosslinking sites, in the cured bodies of resol-type phenolic resins by heating or adding an acid, depending on the molding conditions, they may shrink due to continuous reaction progress even after molding, so improvement in heat resistance (particularly reduction in shrinkage amount under high temperature and high humidity) is required. In addition, further improvement in heat insulation is strongly desired in the cured bodies of resol-type phenolic resins.

[0004] For example, Patent Document 1 discloses a curable composition in which a specific aromatic sulfonic acid is blended as a curing agent in a resol-type phenolic resin, and the acid elution amount and impact resistance are improved. However, the thermal conductivity of the curable composition obtained by this technique is high, shrinkage occurs under high temperature and high humidity conditions, and furthermore, weight reduction cannot be achieved, so it is not practical enough.

[0005] On the other hand, Patent Document 2 discloses a manufacturing method in which a sheet-shaped molding material dispersed and paper-made in a liquid with phenolic resin powder and reinforcing fibers as essential components is heated and pressed, and the sheet-shaped molding material obtained thereby is said to be lightweight and have sufficient strength.

[0006] Furthermore, in Patent Document 3, there has been an attempt to pulverize a thermosetting resin foam, mix it with a thermoplastic resin molding material, and granulate it.

[0007] However, the technologies of Patent Document 2 and Patent Document 3 both have a high density, insufficient thermal conductivity, and further shrinkage occurs under high-temperature and high-humidity conditions. Therefore, like the technology of Patent Document 1, they were insufficient in practical use.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0009] An object of the present invention is to provide a phenolic resin molded body having high heat insulation performance and excellent heat resistance (shrinkage suppression under high temperature and high humidity), and a method for manufacturing the same.

Means for Solving the Problems

[0010] That is, the present invention is as follows.

[0011] [1] A phenolic resin molded body having a surface with a surface porosity of 3% or more and 20% or less, and a density of 300 kg / m 3 or more and 1,100 kg / m 3 or less. [2] The phenolic resin molded body according to [1], which is a hot press molded article of phenolic foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less, and a bulk density of 5 kg / m 3 or more and 150 kg / m 3 or less. [3] The phenolic resin molded article according to [1] or [2], having a thermal conductivity at 30 ° C of 0.16 W / (m·K) or less. [4] The phenolic resin molded article according to any one of [1] to [3], having an average dimensional change rate after 48 hours at a temperature of 80 ° C and a humidity of 95% of 0% or more and 1.5% or less. [5] A method for producing a phenolic resin molded article, comprising a step of hot press molding a phenolic foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less and a bulk density of 5 kg / m 3 or more and 150 kg / m 3 or less. [6] The method for producing a phenolic resin molded article according to [5], wherein in the step of hot press molding, the phenolic foam powder is hot press molded at 170 ° C or more and 240 ° C or less and at 1,000 kPa or more and 5,000 kPa or less.

Advantages of the Invention

[0012] According to the present invention, it is possible to provide a phenolic resin molded article having high heat insulation performance and excellent heat resistance (shrinkage suppression under high temperature and high humidity), and a method for producing the same.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0014] The present invention has found a phenolic resin molded article having high heat insulation performance and excellent heat resistance (shrinkage suppression under high temperature and high humidity), and a method for producing the same.

[0015] Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as "the present embodiment") will be described in detail.

[0016] For the phenolic resin molded body of the present embodiment, its surface porosity, density, thermal conductivity, and average dimensional change rate are determined by the methods described in the examples. Unless otherwise specified, the thermal conductivity refers to the thermal conductivity at 30°C. Unless otherwise specified, the average dimensional change rate refers to the average dimensional change rate after 48 hours at a temperature of 80°C and a humidity of 95%. Also, the volume average particle diameter and bulk density of the phenolic foam powder are determined by the methods described in the examples.

[0017] For the phenolic resin molded body of the present embodiment, the "thickness" direction refers to the direction of the shortest side among the three sides of the length, width, and height of the phenolic resin molded body.

[0018] For the phenolic resin molded body of the present embodiment, those with a thickness of less than 30 mm are particularly referred to as "phenolic resin molded plates".

[0019] ·Phenolic resin molded body The phenolic resin molded body of the present embodiment is composed of a cured product of a phenolic resin. As the phenolic resin, a known phenolic resin can be appropriately selected and used. As the phenolic resin, a resol-type phenolic resin is preferable. For example, "ground phenolic foam powder" obtained by grinding phenolic foam can be used.

[0020] In addition to the cured product of the phenolic resin, the phenolic resin molded body may contain additives such as a binder (adhesive), a filler, a surfactant, urea, an acid, a non-woven fabric, and the like.

[0021] The phenolic resin molded body of the present embodiment has at least one surface having fine voids. More specifically, irregular voids or depressions exist in the smooth part of a specific surface of the phenolic resin molded body. The surface porosity of the phenolic resin molded body evaluates the state of these fine voids or depressions.

[0022] The phenolic resin molded body of this embodiment has a surface with a surface porosity of 3% or more and 20% or less. When the surface porosity is 20% or less, it has excellent heat resistance (shrinkage suppression under high temperature and high humidity), and mechanical strength can be ensured, so that damage can be avoided during handling of the molded body. On the other hand, when the surface porosity is 3% or more, it has lightness and exhibits high heat insulation performance. The surface porosity is preferably 5% or more and 15% or less.

[0023] The surface porosity can be adjusted, for example, by changing the volume average particle diameter, density, usage amount of phenolic foam powder, and hot press molding conditions (such as temperature, pressure, time) of the phenolic foam powder.

[0024] It is sufficient that at least one surface of the phenolic resin molded body of this embodiment has a surface porosity of 3% or more and 20% or less, and the surfaces other than the one surface may or may not have the same surface porosity. The phenolic resin molded body preferably has two opposing surfaces with a surface porosity of 3% or more and 20% or less, and more preferably, the opposing main planes, that is, the two widest opposing surfaces of the phenolic resin molded body, have a surface porosity of 3% or more and 20% or less.

[0025] The density of the phenolic resin molded body of this embodiment is 300 kg / m 3 or more and 1,100 kg / m 3 or less. When the density of the phenolic resin molded body is 300 kg / m 3 or more, mechanical strength such as impact resistance can be ensured, and damage during handling of the molded body can be avoided. On the other hand, when the density of the phenolic resin molded body exceeds 1,100 kg / m 3 , it does not have lightness, so it becomes difficult to handle. The density of the phenolic resin molded body is preferably 500 kg / m 3 or more and 1,000 kg / m 3 or less, more preferably 600 kg / m 3 or more and 900 kg / m 3It is as follows. Note that the density of the phenolic resin molded body can be adjusted to a desired value mainly by changing the density and usage amount of the phenolic foam powder used as a raw material, the above surface porosity, and further, the hot press molding conditions (temperature, pressure, time) of the phenolic foam powder.

[0026] The phenolic resin molded body in the present embodiment has a volume average particle size of 20 μm or more and 550 μm or less, and a bulk density of 5 kg / m 3 or more and 150 kg / m 3 or less, and is preferably a hot press molded product of phenolic foam powder.

[0027] The thermal conductivity of the phenolic resin molded body in the present embodiment at 30°C is preferably 0.16 W / (m·K) or less, more preferably 0.030 W / (m·K) or more and 0.14 W / (m·K) or less, still more preferably 0.030 W / (m·K) or more and 0.12 W / (m·K) or less, and particularly preferably 0.030 W / (m·K) or more and 0.10 W / (m·K) or less. The thermal conductivity of the phenolic resin molded body mainly depends on the performance of the phenolic resin. For example, it can be adjusted by the density and water content of the phenolic resin, the temperature and pressure during the production of the phenolic resin molded body, and further, the composition, volume average particle size, bulk density, etc. of the phenolic foam powder used as the raw material of the phenolic resin molded body.

[0028] The shrinkage suppression of the phenolic resin molded body of the present embodiment under high temperature and high humidity is evaluated by an index of the average dimensional change rate. The average dimensional change rate of the phenolic resin molded body is preferably 0% or more and 1.5% or less, more preferably 0% or more and 1.0% or less, still more preferably 0% or more and 0.8% or less, and most preferably 0% or more and 0.6% or less. When the average dimensional change rate is 1.5% or less, the shrinkage of the phenolic resin molded body can be suppressed even under high temperature and high humidity. The average dimensional change rate mainly depends on the properties of the phenolic foam powder as the raw material and the manufacturing method of the phenolic resin molded body. For example, it can be adjusted by the volume average particle diameter, bulk density of the phenolic foam powder, and the hot press molding conditions (temperature, pressure, time) of the phenolic foam powder, etc. When the average dimensional change rate is a positive value, it indicates that the phenolic resin molded body has expanded, and when it is a negative value, it indicates that the phenolic resin molded body has shrunk.

[0029] The shape of the phenolic resin molded body is not particularly limited and can be any shape. Examples of the shape of the phenolic resin molded body include a rectangular parallelepiped (for example, plate-like, etc.), a polyhedron other than a rectangular parallelepiped (for example, a regular polyhedron such as a regular tetrahedron, a regular octahedron, a regular dodecahedron, a regular icosahedron), a sphere, a pyramid, a cone, a toroidal body, a hollow cylinder, a solid cylinder (cylinder), an irregular shape, etc. In one embodiment, the phenolic resin molded body is a rectangular parallelepiped. In a preferred embodiment, the phenolic resin molded body is a phenolic resin molded plate with a thickness of less than 30 mm.

[0030] The thickness of the phenolic resin molded body is not particularly limited, but is preferably 0.5 mm or more and less than 30 mm, more preferably 1 mm or more and 20 mm or less, still more preferably 1 mm or more and 10 mm or less, particularly preferably 1 mm or more and 5 mm or less, and most preferably 1.5 mm or more and 5 mm or less. When it is 0.5 mm or more, it has excellent mechanical strength and is easy to handle. Also, when it is less than 30 mm, it is lightweight and easy to handle.

[0031] The use of the phenolic resin molded body is not particularly limited, and examples include its use as a coaster, a rug, and a member around a vehicle-mounted battery cell, etc., which require both heat insulation and heat resistance.

[0032] · Method for manufacturing a phenolic resin molded body The method for manufacturing a phenolic resin molded body of the present invention includes a step of hot press molding phenolic foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less and a bulk density of 5 kg / m 3 or more and 150 kg / m 3 or less.

[0033] The phenolic foam powder can be obtained, for example, by pulverizing and cutting phenolic foam. The phenolic foam is preferably one obtained by curing a resol-type phenolic resin by heating and / or an acid. Also, as the phenolic foam, commercially available products such as NeoMa (registered trademark) foam manufactured by Asahi Kasei Building Materials Corporation may be used.

[0034] The method for pulverizing the phenolic foam is not particularly limited, but it can be obtained by using a pulverizer such as a cutter mill, a hammer mill, a pin mill, a roller mill, a jet mill, a tumbling ball mill, a tumbling rod mill, a vibrating ball mill, or a vibrating rod mill. It is more preferable to consider the environment and utilize waste materials generated during cutting processing of the phenolic foam. In one embodiment, the phenolic foam powder is a phenolic foam pulverized powder obtained by pulverizing phenolic foam.

[0035] The phenolic foam powder has a volume average particle diameter of 20 μm or more and 550 μm or less, more preferably 20 μm or more and 350 μm or less, still more preferably 20 μm or more and 150 μm or less, and particularly preferably 20 μm or more and 100 μm or less. If the volume average particle diameter is less than 20 μm, an integrally molded body cannot be obtained.

[0036] The phenolic foam powder has a bulk density of 5 kg / m 3 or more and 150 kg / m 3 or less, more preferably 5 kg / m 3 or more and 100 kg / m 3 or less, and particularly preferably 5 kg / m 3 or more and 80 kg / m 3More preferably, it is 10 kg / m 3 or more and 50 kg / m 3 or less. Particularly preferably, it is 150 kg / m 3 or more. If the bulk density exceeds 150 kg / m 3 it is not possible to obtain an integrally molded molded body. In particular, when the bulk density of the phenolic foam powder is 150 kg / m

[0037] or less, the phenolic foam powder is likely to have three-dimensional angular protrusions (for example, a three-dimensional shape such as a wave-dissipating block), and the angular protrusions are intertwined with each other to produce a physical bonding effect, thereby enabling integral molding. 3 One kind of phenolic foam powder having a constant volume average particle size and bulk density may be used alone, or two or more kinds having different volume average particle sizes and / or bulk densities may be used in combination. When using two or more kinds in combination, as for the phenolic foam powder as a whole, the volume average particle size of the phenolic foam powder may be 20 μm or more and 550 μm or less, and the bulk density of the phenolic foam powder may be 5 kg / m 3 or more and 150 kg / m

[0038] As a hot press apparatus for hot press molding the phenolic foam powder, for example, an oil heating type, a heater type, a cold press type, etc. can be used. From the viewpoints of temperature control and productivity, it is preferable to use the oil heating type.

[0039] The temperature during hot press molding is, for example, 170°C or more and 240°C or less, preferably 180°C or more and 230°C or less, more preferably 180°C or more and 220°C or less, still more preferably 180°C or more and 210°C or less, and most preferably 180°C or more and 200°C or less. When it is 170°C or more, the porosity can be reduced, and a phenolic resin molded body excellent in handleability can be obtained. Also, when it is 240°C or less, a phenolic resin molded body with good appearance can be obtained without scorching the surface.

[0040] The pressure during hot press forming is, for example, 1,000 kPa or more and 5,000 kPa or less, preferably 1,000 kPa or more and 3,000 kPa or less, more preferably 1,500 kPa or more and 2,500 kPa or less. Being 1,000 kPa or more is preferable because it can reduce the porosity and obtain a phenolic resin molded body with excellent handleability. Also, being 5,000 kPa or less enables weight reduction because the density can be lowered.

[0041] In the method for manufacturing the phenolic resin molded body of the present invention, in the step of hot press forming, it is preferable to include hot press forming the phenolic foam powder at 170°C or more and 240°C or less, and at 1,000 kPa or more and 5,000 kPa or less.

Examples

[0042] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

[0043] The materials used in the examples are as follows. Phenolic foam: NeoMa (registered trademark) foam manufactured by Asahi Kasei Building Materials Corporation, dimensions: 80 mm × 910 mm × 45 mm, with surface materials on the upper and lower surfaces

[0044] ·Measurement of the volume average particle diameter of the phenolic foam powder The volume average particle diameter of the phenolic foam powder was measured using a laser diffraction light scattering type particle size distribution measuring device (Microtrac HRA; 9320-X100 manufactured by Nikkiso Co., Ltd.) after treating the phenolic foam powder in water uniformly with ultrasonic waves for 1 minute.

[0045] ·Measurement of the bulk density of the phenolic foam powder The bulk density of the phenolic foam powder was measured in accordance with JIS Z 2504, using the phenolic foam powder instead of the metal powder to measure the "loose bulk density".

[0046] (Example 1) ·Production of phenolic foam powder A plurality of phenolic foams with the upper and lower surface materials peeled off were prepared. The phenolic foam was pulverized using a cutter mill (manufactured by Horai Co., Ltd., PC3-3060LGS). A screen with a diameter of 8 mm was attached to the discharge port of the cutter mill, and phenolic foam powder with a diameter of less than 8 mm was discharged. The obtained phenolic foam powder was further sieved using a sieve with a mesh size of 500 μm. The phenolic foam powder collected under the sieve was designated as phenolic foam powder A. The volume average particle size of the obtained phenolic foam powder A was 81 μm. Also, the bulk density of phenolic foam powder A was 30 kg / m 3 was obtained.

[0047] · Preparation of phenolic resin molded body Using phenolic foam powder A, hot press molding was carried out at 200 °C and 3,000 kPa using an oil-heated hot press apparatus. Five minutes after the start of hot pressing, the product was taken out. The product was air-cooled for 5 minutes to obtain a phenolic resin molded body (phenolic resin molded plate) with a thickness of 2 mm in Example 1.

[0048] (Example 2) A phenolic resin molded body was produced in the same manner as in Example 1, except that a plurality of phenolic foams with the upper and lower surface materials peeled off and phenolic foams with surface materials were each prepared and pulverized so that the surface material content in the phenolic foam powder was 15% by weight.

[0049] (Example 3) A phenolic resin molded body was obtained in the same manner as in Example 1, except that the temperature during hot press molding was changed to 170 °C.

[0050] (Example 4) A phenolic resin molded body was obtained in the same manner as in Example 1, except that the temperature during hot press molding was changed to 240 °C.

[0051] (Example 5) A phenolic resin molded body was obtained in the same manner as in Example 1, except that the pressure during hot press molding was changed to 5,000 kPa.

[0052] (Example 6) A phenolic resin molded body was obtained in the same manner as in Example 1, except that the pressure during hot press molding was changed to 1,000 kPa.

[0053] (Comparative Example 1) An attempt was made to produce a phenolic resin molded body in the same manner as in Example 1, except that phenolic foam powder B with a volume average particle diameter of 30 μm and a bulk density of 152 kg / m 3 was used. However, the obtained product was not integrated and could not be handled as a molded product. Note that phenolic foam powder B was obtained by peeling the facing material and coarsely pulverizing a phenolic foam equivalent to that in Example 1 in a rolling ball mill (dry type, diameter 900 mm × 1,500 mm), removing the facing material with a sieve (sieve opening: 1.2 mm), and then performing consolidation pulverization using a vibration ball mill (dry type, inner diameter 150 mm, 1 cylinder 15.5 L × 2 cylinders), and removing the phenolic foam powder with a large particle diameter with a sieve (sieve opening: 0.5 mm).

[0054] (Comparative Example 2) An attempt was made to produce a phenolic resin molded body in the same manner as in Example 1, except that phenolic foam powder C with a volume average particle diameter of 19 μm and a bulk density of 59 kg / m 3 was used. However, the obtained product was not integrated and could not be handled as a molded product. Note that phenolic foam powder C was obtained by peeling the facing material and coarsely pulverizing a phenolic foam equivalent to that in Example 1 in a rolling ball mill (dry type, diameter 900 mm × 1,500 mm), removing the facing material with a sieve (sieve opening: 1.2 mm), and then treating it with a sieve (sieve opening: 0.063 m) to obtain the undersize powder.

[0055] (Comparative Example 3) A resol-type phenolic resin (corresponding to phenolic resin A-U in paragraph

[0064] of JP-A-2008-024868) was blended with xylene sulfonic acid as a curing agent to obtain a curable composition. The curable composition was poured into a mold and preformed in an oven at 70 °C for 20 minutes to obtain a preformed plate. Next, the mold was removed, and the preformed plate was sandwiched between punching metals from the upper and lower surfaces so that warping would not occur during oven molding. It was further heated in an oven at 70 °C for 24 hours to obtain a phenolic resin molded body with a thickness of 2 mm.

[0056] For each of the phenolic resin molded bodies obtained in Examples 1 to 6 and Comparative Example 3, the surface porosity, density, thermal conductivity, and average dimensional change rate were measured as described below. The results are shown in Table 1. Also, a scanning electron micrograph of the upper surface of the phenolic resin molded body produced in Example 1 is shown in FIG. 1. Further, a binarized photograph of the scanning electron micrograph of FIG. 1 is shown in FIG. 2.

[0057] ·Surface porosity Using a tabletop hand microtome THK manufactured by Kenis Co., the phenolic resin molded body was cut into 10 mm × 10 mm in the direction parallel to the thickness direction to obtain five samples having the upper and lower surfaces of the molded body. The surfaces of the five samples were metal-coated for 1 minute using a DII-29010SCTR Smart Coater manufactured by JEOL Ltd. Next, for each sample, using a tabletop scanning electron microscope JCM-7000 NeoScope manufactured by JEOL Ltd. and software "SEM Operation EZ", under the conditions of high vacuum mode, acceleration voltage 5 kV, signal: SED, observation magnification: 200 times, the surface of the sample was observed, and SEM image data was obtained in a region free of impurities. The SEM image was imported into image analysis software Image-J, and the brightness of the image was binarized by setting a threshold value so that the regions occupied by the phenolic foam powder and the composition of the resol-type phenolic resin and the curing agent were white and the void region was black. In the binarized image, the ratio of the black area per a certain field area (0.09 mm 2 ) was calculated. The average value of the ratios of the black areas of the five samples was taken as the surface porosity.

[0058] · Density Using a 200 mm - angled phenolic resin molded plate as a sample, in accordance with JIS K7222, the mass and the apparent volume were measured, the apparent density was calculated, and this apparent density was taken as the density.

[0059] · Thermal conductivity In accordance with ASTM E 1530 - 04, the thermal conductivity in the thickness direction of the phenolic resin molded body at 30 °C was measured by the following method. The phenolic resin molded body was cut into 25 mm × 25 mm pieces. The cut specimens were placed in an atmosphere of 23 ± 1 °C and 50 ± 2% humidity. Then, the change in the weight of the specimens over time was measured every 24 hours, and the state was confirmed and adjusted until the weight change after 24 hours was 0.2 mass% or less. The adjusted specimens were introduced into a thermal conductivity measuring device in an atmosphere of 23 ± 1 °C and 50 ± 2% humidity. In the thermal conductivity measurement, the thermal conductivity at 30 °C was measured using a measuring device (steady - state thermal conductivity measuring device "GH - 1" manufactured by ULVAC Technologies, Inc.) of the one - specimen·target configuration method under the conditions of a low - temperature plate of 18 °C and a high - temperature plate of 42 °C.

[0060] · Average dimensional change rate Two samples of a phenolic resin molded body approximately 100 mm × 100 mm were each left standing for 24 hours or more in an environment of 23 ± 2 °C and 50 ± 10% relative humidity. These two samples were taken out, and in an environment of 23 ± 2 °C and 50 ± 10% relative humidity, promptly, the dimensions at two locations each in the vertical and horizontal directions (a, b, c, and d) shown in Figure 3 were measured using a vernier caliper (manufactured by Mitutoyo Corporation), and the measured value L0 before heating and humidifying was obtained. In Figure 3, the upper figure is a schematic perspective view of the phenolic resin molded body 1, and the lower figure is a schematic plan view of the phenolic resin molded body 1. Next, the two samples were transferred into a constant - temperature and constant - humidity chamber SXN412 (manufactured by Kusumoto Chemical Co., Ltd.) at 80 °C and 95% relative humidity. Then, after 48 hours, the samples were taken out, and in an environment of 23 ± 2 °C and 50 ± 10% relative humidity, in the same manner as above, the dimensions at two locations each in the vertical and horizontal directions (a, b, c, and d) were measured using a vernier caliper, and the measured value L1 after heating and humidifying was obtained. From these measurement results, the dimensional change rate was calculated by the following formula. (L1―L0) / L0×100(%) ···(1) The average value of the dimensional change rates at a total of eight locations (a×2, b×2, c×2, and d×2) for two samples was defined as the average dimensional change rate. When the value of the average dimensional change rate is “+(plus)”, it indicates that the sample expanded after heating and humidification compared to before heating and humidification. When the value is “-(minus)”, it indicates that the sample shrank after heating and humidification compared to before heating and humidification.

[0061]

Table 1

[0062] From Table 1, it can be seen that Examples 1 to 6 have a high heat insulation property and excellent heat resistance (shrinkage suppression under high temperature and high humidity) in addition to moldability, compared with Comparative Examples 1 to 3.

Explanation of Signs

[0063] 1 Phenolic resin molded body

Industrial Applicability

[0064] According to the present invention, it becomes possible to provide a phenolic resin molded body having high heat insulation performance and excellent heat resistance (shrinkage suppression under high temperature and high humidity), and a method for manufacturing the same.

Claims

1. A phenolic resin molded article containing phenolic foam powder, having a surface with a surface porosity of 3% or more and 20% or less, and a density of 300 kg / m ３ or more and 1,100 kg / m ３ or less.

2. The phenolic resin molded article according to claim 1, having a thermal conductivity at 30°C of 0.16 W / (m·K) or less.

3. The phenolic resin molded article according to claim 1 or 2, having an average dimensional change rate after 48 hours at a temperature of 80°C and a humidity of 95% of 0% or more and 1.5% or less.

4. A method for manufacturing a phenolic resin molded body, comprising a step of thermally press-molding phenolic foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less and a bulk density of 5 kg / m ３ or more and 150 kg / m ３ or less.

5. The method for producing a phenolic resin molded article according to claim 4, including hot press molding the phenolic foam powder at 170°C or higher and 240°C or lower and at 1,000 kPa or higher and 5,000 kPa or lower in the step of hot press molding.

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