Polyamide resin composition for laser direct structuring, resin molded article, method for producing plated resin molded article, and method for producing portable electronic device parts having antennas

Abstract

To provide a polyamide resin composition for laser direct structuring which enables formation of a resin molding that has a high plating growth rate and is excellent in bending strength, and a resin molding, a method for manufacturing a plated resin molding, and a method for manufacturing components of a portable electronic device having an antenna.SOLUTION: A polyamide resin composition for laser direct structuring contains, with respect to 100 pts.mass of a polyamide resin, 1-30 pts.mass of a laser direct structuring additive, 0.1-10.0 pts.mass of an inorganic reducing phosphate and 10-150 pts.mass of an inorganic fiber.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a polyamide resin composition for laser direct structuring, a resin molded article, a method for manufacturing a resin molded article with plating, and a method for manufacturing a component of a portable electronic device having an antenna.

Background Art

[0002] In recent years, with the development of mobile phones including smartphones, various methods for manufacturing antennas inside mobile phones have been studied. In particular, there is a demand for a method for manufacturing an antenna that can be three-dimensionally designed for a mobile phone. As one of the technologies for forming such a three-dimensional antenna, laser direct structuring (hereinafter sometimes referred to as "LDS") technology has attracted attention. The LDS technology is a technology for forming plating, for example, by irradiating a surface of a resin molded article containing an LDS additive with a laser to activate it and applying a metal to the activated portion. The feature of this technology is that a metal structure such as an antenna can be directly manufactured on the surface of a resin molded article without using an adhesive or the like. Such LDS technology is disclosed in, for example, Patent Document 1. Specifically, Patent Document 1 discloses a thermoplastic resin composition containing (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point of 250°C or higher measured by differential scanning calorimetry (DSC) at a heating rate of 10°C / min, (B) 2 to 30 parts by weight of a laser direct structuring additive having a reflectance of 25% or more at a wavelength of 450 nm, (C) 30 to 150 parts by weight of titanium oxide, and (D) 5.5 parts by weight or more of a phosphorus-based flame retardant.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] As the use of LDS technology becomes more widespread, a faster plating growth rate is required. However, the inventors have conducted research and found that even if the plating growth rate is fast, bending strength may be poor. The present invention aims to solve these problems and to provide a polyamide resin composition for laser direct structuring, a resin molded article, a method for producing a plated resin molded article, and a method for producing a mobile electronic device component having an antenna, which are capable of producing a resin molded article having a fast plating growth rate and excellent bending strength. [Means for solving the problem]

[0005] As a result of investigations conducted by the present inventors in light of the above-mentioned problems, the above-mentioned problems were solved by blending a predetermined amount of an inorganic reducing phosphate with a polyamide resin. Specifically, the above-mentioned problems were solved by the following means. <1> A polyamide resin composition for laser direct structuring, comprising 1 to 30 parts by mass of a laser direct structuring additive, 0.1 to 10.0 parts by mass of an inorganic reducing phosphate, and 10 to 150 parts by mass of inorganic fibers relative to 100 parts by mass of polyamide resin. <2> The inorganic fibers include glass fibers. <1> 2. The polyamide resin composition for laser direct structuring according to claim 1. <3> The inorganic reducible phosphate comprises at least one of a phosphite and a hypophosphite. <1> or <2> 2. The polyamide resin composition for laser direct structuring according to claim 1. <4> The laser direct structuring additive comprises at least one of copper, antimony, tin, aluminum, and zinc; <1> ~ <3> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <5> The polyamide resin comprises a semi-aromatic polyamide resin. <1> ~ <4> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <6> At least one of the polyamide resins is composed of diamine-derived structural units and dicarboxylic acid-derived structural units, and 70 mol % or more of the diamine-derived structural units are derived from xylylenediamine, and 70 mol % or more of the dicarboxylic acid-derived structural units are derived from an α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms. <1> ~ <5> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <7> The inorganic phosphite is contained in an amount of 1.0 to 6.0 parts by mass relative to 100 parts by mass of the polyamide resin. <1> ~ <6> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <8> Further, talc is contained in an amount of 0.1 to 200 parts by mass per 100 parts by mass of the laser direct structuring additive. <1> ~ <7> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <9> The inorganic fibers are contained in an amount of 20 to 80 parts by mass relative to 100 parts by mass of the polyamide resin. <1> ~ <8> 1. The polyamide resin composition for laser direct structuring according to any one of the above. <10> <1> ~ <9> 1. A resin molded article molded from the polyamide resin composition for laser direct structuring according to any one of claims 1 to 9. <11> The resin molded product has a plating on the surface thereof. <10> The resin molded product according to claim 1. <12> The plating has antenna performance. <11> The resin molded product according to claim 1. <13> Parts for portable electronic devices, <10> ~ <12> 1. A resin molded product according to any one of the above. <14> <1> ~ <9> irradiating a surface of a resin molded article obtained by molding the polyamide resin composition for laser direct structuring described in any one of 1 to 3 with a laser, and then applying a metal to form a plating. <15> The plating is copper plating. <14> A method for producing the plated resin molded product according to claim 1. <16> <14> or <15> 10. A method for producing a mobile electronic device part having an antenna, comprising the method for producing a plated resin molded product according to claim 1. [Effects of the Invention]

[0006] The present invention makes it possible to provide a polyamide resin composition for laser direct structuring, a resin molded article, a method for producing a plated resin molded article, and a method for producing a mobile electronic device component having an antenna, which are capable of producing a resin molded article having a fast plating growth rate and excellent bending strength. [Brief explanation of the drawings]

[0007]

Figure 1

[0008] Hereinafter, an embodiment for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment. In this specification, the symbol "to" is used to mean that the numerical values before and after it are included as the lower limit and upper limit. In this specification, various physical properties and characteristic values are those at 23°C unless otherwise specified. In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved.

[0009] The polyamide resin composition for laser direct structuring of the present embodiment (hereinafter sometimes referred to as "the resin composition of the present embodiment") is characterized by containing 1 to 30 parts by mass of a laser direct structuring additive, 0.1 to 10.0 parts by mass of an inorganic reducing phosphate, and 10 to 150 parts by mass of inorganic fibers with respect to 100 parts by mass of the polyamide resin. By adopting such a configuration, a resin molded product with a high plating growth rate and excellent bending strength can be obtained. When the plating growth rate is high, the productivity tends to improve. Furthermore, a resin composition excellent in mechanical strengths such as flexural modulus and Charpy impact strength can be obtained. Also, a molded product excellent in plating peel strength can be obtained. The plating peel strength refers to the strength required when peeling the plating, and the higher it is, the more closely the resin molded product and the plating are adhered in terms of strength. This mechanism is presumably because the laser direct structuring additive is efficiently reduced and carbonization of the resin base material due to laser excess energy can be suppressed. Hereinafter, the resin composition of the present embodiment will be described.

[0010] <Polyamide resin> The resin composition of the present embodiment contains a polyamide resin. The type of the polyamide resin used in the present embodiment is not particularly defined, and known polyamide resins can be used. For example, as the polyamide resin, the descriptions in paragraphs 0011 to 0013 of JP-A-2011-132550 can be referred to. The polyamide resin used in this embodiment preferably contains a semi-aromatic polyamide resin. For example, it is preferable that 90% by mass or more of the polyamide resin contained in the resin composition of this embodiment is a semi-aromatic polyamide resin. Here, the semi-aromatic polyamide resin is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and 20 to 80 mol% of the total structural units of the structural unit derived from diamine and the structural unit derived from dicarboxylic acid are structural units containing an aromatic ring. By using such a semi-aromatic polyamide resin, the mechanical strength of the obtained resin molded product can be increased. Examples of the semi-aromatic polyamide resin include terephthalic acid-based polyamide resins (polyamide 6T, polyamide 9T, polyamide 10T), xylylenediamine-based polyamide resins described later, and the like.

[0011] At least one of the polyamide resins used in this embodiment is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and it is preferable that 70 mol% or more of the structural unit derived from diamine is derived from xylylenediamine, and 70 mol% or more of the structural unit derived from dicarboxylic acid is derived from an α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms. Hereinafter, such a polyamide resin may be referred to as a xylylenediamine-based polyamide resin. For the structural unit derived from diamine of the xylylenediamine-based polyamide resin, more preferably 75 mol% or more, still more preferably 80 mol% or more, even more preferably 85 mol% or more, even more preferably 90 mol% or more, and still even more preferably 95 mol% or more is derived from xylylenediamine. For the structural unit derived from dicarboxylic acid of the xylylenediamine-based polyamide resin, more preferably 75 mol% or more, still more preferably 80 mol% or more, even more preferably 90 mol% or more, and even more preferably 95 mol% or more is derived from an α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms.

[0012] Diamines other than metaxylylenediamine and paraxylylenediamine that can be used as raw diamine components for xylylenediamine-based polyamide resins include aliphatic diamines such as tetramethylenediamine, pentamethylenediamine, 2-methylpentanediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine; 1,3-bis( Examples of the diamine include alicyclic diamines such as bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, bis(aminomethyl)decalin, and bis(aminomethyl)tricyclodecane; and diamines having an aromatic ring such as bis(4-aminophenyl)ether, paraphenylenediamine, and bis(aminomethyl)naphthalene. These diamines can be used alone or in combination of two or more.

[0013] Examples of α,ω-linear aliphatic dicarboxylic acids having 4 to 20 carbon atoms that are suitable for use as the raw dicarboxylic acid component of xylylenediamine-based polyamide resins include succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, adipic acid, sebacic acid, undecanedioic acid, and dodecanedioic acid. These can be used alone or in combination of two or more. Of these, adipic acid or sebacic acid are more preferred, and adipic acid is even more preferred, as the melting point of the polyamide resin is within a range suitable for molding.

[0014] Examples of dicarboxylic acid components other than the above-mentioned α,ω-linear aliphatic dicarboxylic acids having 4 to 20 carbon atoms include phthalic acid compounds such as isophthalic acid, terephthalic acid, and orthophthalic acid, and isomers of naphthalenedicarboxylic acid such as 1,2-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and 2,7-naphthalenedicarboxylic acid, and these can be used alone or in combination of two or more.

[0015] In the xylylenediamine-based polyamide resin of this embodiment, 0 to 100 mol % of the diamine-derived structural units are derived from paraxylylenediamine, 100 to 0 mol % are derived from metaxylylenediamine, and 70 mol % or more (preferably 80 mol % or more, more preferably 90 mol % or more) of the dicarboxylic acid-derived structural units are derived from sebacic acid and / or adipic acid. A more preferred embodiment of the xylylenediamine-based polyamide resin is one in which 70 mol % or more (preferably 80 mol % or more, more preferably 90 mol % or more, and even more preferably 95 mol % or more) of the diamine-derived structural units are derived from paraxylylenediamine, and 70 mol % or more (preferably 80 mol % or more, and more preferably 90 mol % or more) of the dicarboxylic acid-derived structural units are derived from sebacic acid. Another preferred embodiment of the xylylenediamine-based polyamide resin is a polyamide resin in which 30 to 90 mol % (preferably 60 to 70 mol %) of the diamine-derived structural units are derived from metaxylylenediamine, 70 to 10 mol % (preferably 40 to 30 mol %) are derived from paraxylylenediamine, and 70 mol % or more (preferably 80 mol % or more, more preferably 90 mol % or more) of the dicarboxylic acid-derived structural units are derived from sebacic acid. As another more preferred embodiment of the xylylenediamine-based polyamide resin, 70 mol% or more (preferably 80 mol% or more, more preferably 90 mol% or more, still more preferably 95 mol% or more) of the structural units derived from diamine are derived from metaxylylenediamine, and 70 mol% or more (preferably 80 mol% or more, more preferably 90 mol% or more) of the structural units derived from dicarboxylic acid are derived from adipic acid.

[0016] Note that the structural units derived from diamine and the structural units derived from dicarboxylic acid are the main components, but it does not completely exclude other structural units. Needless to say, it may contain structural units derived from lactams such as ε-caprolactam and laurolactam, and aliphatic aminocarboxylic acids such as aminocaproic acid and aminoundecanoic acid. Here, the main component means that among the structural units constituting the xylylenediamine-based polyamide resin, the total number of the structural units derived from diamine and the structural units derived from dicarboxylic acid is the largest among all the structural units. In this embodiment, the total of the structural units derived from diamine and the structural units derived from dicarboxylic acid in the xylylenediamine-based polyamide resin preferably occupies 90% or more of all the structural units, and more preferably occupies 95% or more.

[0017] The melting point of the polyamide resin is preferably 150 to 350 °C, more preferably 180 to 330 °C, and still more preferably 200 to 300 °C. The melting point can be measured in accordance with differential scanning calorimetry according to JIS K7121 and K7122.

[0018] The polyamide resin preferably has a lower limit of number average molecular weight (Mn) of 6,000 or more, more preferably 8,000 or more, still more preferably 10,000 or more, even more preferably 15,000 or more, yet more preferably 20,000 or more, and even yet more preferably 22,000 or more. The upper limit of the above Mn is preferably 35,000 or less, more preferably 30,000 or less, still more preferably 28,000 or less, and even more preferably 26,000 or less. When it is in such a range, heat resistance, elastic modulus, dimensional stability, and moldability are better.

[0019] The content of the polyamide resin in the resin composition of this embodiment is preferably 40% by mass or more, more preferably 45% by mass or more, still more preferably 50% by mass or more, even more preferably 55% by mass or more, yet more preferably 60% by mass or more. By setting it to be not less than the lower limit value, the contact area between the resin molded product and the plating becomes larger, and the adhesion of the plating tends to be improved. Also, the content of the polyamide resin in the resin composition of this embodiment is preferably 90% by mass or less, more preferably 85% by mass or less, still more preferably 80% by mass or less, even more preferably 75% by mass or less, and yet more preferably 70% by mass or less. By setting it to be not more than the upper limit value, the mechanical strength of the resin molded product tends to be improved. The resin composition of this embodiment may contain only one kind of polyamide resin or may contain two or more kinds. When containing two or more kinds, the total amount preferably falls within the above range.

[0020] The resin composition of this embodiment may or may not contain a thermoplastic resin other than the polyamide resin. The content of the thermoplastic resin other than the polyamide resin in the resin composition of this embodiment is preferably 5% by mass or less of the resin composition of this embodiment, more preferably 3% by mass or less, and even more preferably 1% by mass or less. In particular, in the resin composition of this embodiment, it is preferable that the xylylenediamine-based polyamide resin occupies 90% by mass or more of the polyamide resin, and more preferably 95% by mass or more.

[0021] <Laser Direct Structuring (LDS) Additive> The resin composition of this embodiment contains 1 to 30 parts by mass of a laser direct structuring additive with respect to 100 parts by mass of the polyamide resin. By adopting such a configuration, a resin composition with excellent plating properties can be obtained. The LDS additive in this embodiment refers to a compound that, when 10 parts by mass of an additive considered to be an LDS additive is added to 100 parts by mass of the polyamide resin, irradiated with a YAG laser having a wavelength of 1064 nm at an output of 10 W, a frequency of 80 kHz, and a speed of 3 m / s, and then immersed in an electroless plating bath as a subsequent plating process, can selectively form plating only on the laser-irradiated portion. The LDS additive used in this embodiment may be a synthetic product or a commercially available product. Also, the commercially available product may be a substance sold for other uses as long as it meets the requirements of the LDS additive in this embodiment in addition to those commercially available as an LDS additive. The LDS additive may be used alone or in combination of two or more.

[0022] The first embodiment of the LDS additive used in this embodiment is a compound containing copper and chromium. As the LDS additive of the first embodiment, it is preferable to contain 10 to 30% by mass of copper. Also, it is preferable to contain 15 to 50% by mass of chromium. The LDS additive in the first embodiment is preferably an oxide containing copper and chromium.

[0023] As the form of containing copper and chromium, a spinel structure is preferable. The spinel structure is one of the representative crystal structure types found in complex oxides of the AB2O4 type compound (A and B are metal elements).

[0024] The LDS additive of the first embodiment may contain trace amounts of other metals in addition to copper and chromium. Examples of other metals include antimony, tin, lead, indium, iron, cobalt, nickel, zinc, cadmium, silver, bismuth, arsenic, manganese, magnesium, and calcium, with manganese being preferred. These metals may be present as oxides. A preferred example of the LDS additive of the first embodiment is an LDS additive in which the content of metal oxides other than copper chromium oxide is 10 mass % or less.

[0025] A second embodiment of the LDS additive used in this embodiment is an oxide containing tin and at least one of antimony and phosphorus, preferably an oxide containing antimony and tin.

[0026] The LDS additive of the second embodiment preferably has a tin content greater than the phosphorus and antimony contents, and more preferably the amount of tin relative to the total amount of tin, phosphorus, and antimony is 80 mass % or more.

[0027] In particular, as the LDS additive of the second embodiment, an oxide containing antimony and tin is preferable, an oxide in which the tin content is higher than the antimony content is more preferable, and an oxide in which the amount of tin relative to the total amount of tin and antimony is 80 mass% or more is even more preferable.

[0028] More specifically, examples of the LDS additive of the second embodiment include antimony-doped tin oxide, antimony oxide-doped tin oxide, phosphorus-doped tin oxide, and phosphorus oxide-doped tin oxide. Antimony-doped tin oxide and antimony oxide-doped tin oxide are preferred, and antimony oxide-doped tin oxide is more preferred. For example, in an LDS additive containing phosphorus and tin oxide, the phosphorus content is 1 to 20 mass%. In an LDS additive containing antimony and tin oxide, the antimony content is preferably 1 to 20 mass%. In an LDS additive containing phosphorus, antimony, and tin oxide, the phosphorus content is preferably 0.5 to 10 mass% and the antimony content is preferably 0.5 to 10 mass%.

[0029] A third embodiment of the LDS additive used in this embodiment contains at least two metals and has a resistivity of 5×10 3 It is preferable that the conductive oxide has a resistivity of 8×10 Ω·cm or less. 2 Ω·cm or less is preferable, and 7×10 2 Ω·cm or less is more preferable, and 5×10 2 It is more preferable that the resistivity is Ω·cm or less. There is no particular lower limit, but for example, 1×10 1 It may be Ω·cm or more, and even 1×10 2 It may be Ω·cm or more. The resistivity of the conductive oxide in this embodiment generally refers to powder resistivity, and is measured by placing 10 g of fine powder of the conductive oxide in a cylinder with an inner diameter of 25 mm and coated with Teflon (registered trademark) on the inside, and measuring 100 kgf / cm 2 The pressure can be increased to 20% (filling rate 20%) and measured using a Yokogawa Electric "3223" tester.

[0030] The LDS additive used in the third embodiment has a resistivity of 5×10 3There are no particular limitations as long as the oxide contains a conductive oxide with a resistivity of Ω·cm or less, but it is preferable that the oxide contains at least two metals, specifically, a metal from group n (n is an integer from 3 to 16) and a metal from group n+1 of the periodic table. n is more preferably an integer from 10 to 13, and even more preferably 12 or 13. In the LDS additive used in the third embodiment, when the total content of the metals in Group n (n is an integer from 3 to 16) and Group n+1 of the periodic table in the LDS additive is taken as 100 mol %, the content of one of the metals is preferably 15 mol % or less, more preferably 12 mol % or less, and even more preferably 10 mol % or less. There is no particular lower limit, but a content of 0.0001 mol % or more is preferred. By setting the content of two or more metals within these ranges, plating properties can be improved. In this embodiment, an n-group metal oxide doped with a Group n+1 metal is particularly preferred. Furthermore, the LDS additive used in the third embodiment preferably has 98 mass % or more of the metal components contained in the LDS additive composed of the metals of Group n and Group n+1 of the periodic table.

[0031] Examples of metals in the n-group of the periodic table include Group 3 (scandium, yttrium), Group 4 (titanium, zirconium, etc.), Group 5 (vanadium, niobium, etc.), Group 6 (chromium, molybdenum, etc.), Group 7 (manganese, etc.), Group 8 (iron, ruthenium, etc.), Group 9 (cobalt, rhodium, iridium, etc.), Group 10 (nickel, palladium, platinum), Group 11 (copper, silver, gold, etc.), Group 12 (zinc, cadmium, etc.), Group 13 (aluminum, gallium, indium, etc.), Group 14 (germanium, tin, etc.), Group 15 (arsenic, antimony, etc.), and Group 16 (selenium, tellurium, etc.). Among these, metals in Group 12 (n=12) are preferred, and zinc is more preferred.

[0032] Examples of the Group n+1 metals in the periodic table include Group 4 (such as titanium and zirconium), Group 5 (such as vanadium and niobium), Group 6 (such as chromium and molybdenum), Group 7 (such as manganese), Group 8 (such as iron and ruthenium), Group 9 (such as cobalt, rhodium, and iridium), Group 10 (nickel, palladium, platinum), Group 11 (copper, silver, gold, etc.), Group 12 (zinc, cadmium, etc.), Group 13 (aluminum, gallium, indium, etc.), Group 14 (germanium, tin, etc.), Group 15 (arsenic, antimony, etc.), and Group 16 (selenium, tellurium, etc.). Among them, Group 13 (n+1 = 13) metals are preferred, aluminum or gallium is more preferred, and aluminum is even more preferred.

[0033] The LDS additive used in the third embodiment may contain a metal other than the conductive metal oxide. Examples of the metal other than the conductive oxide include antimony, titanium, indium, iron, cobalt, nickel, cadmium, silver, bismuth, arsenic, manganese, chromium, magnesium, and calcium. These metals may exist as oxides. The content of each of these metals is preferably 0.01% by mass or less with respect to the LDS additive.

[0034] Among the above, in this embodiment, it is preferable that the LDS additive contains at least one of copper, antimony, tin, aluminum, and zinc, and more preferably contains copper. Therefore, the LDS additive of the first embodiment is more preferable.

[0035] The number average particle diameter of the LDS additive used in this embodiment is preferably 0.01 to 100 μm, more preferably 0.05 to 30 μm, and even more preferably 0.05 to 15 μm. By setting the number average particle diameter in such a range, the surface of the plating can be made more uniform.

[0036] In the resin composition of this embodiment, the content of the LDS additive is 1 part by mass or more, preferably 2 parts by mass or more, more preferably 3 parts by mass or more, still more preferably 5 parts by mass or more, even more preferably 6 parts by mass or more, and even more preferably 7 parts by mass or more, based on 100 parts by mass of the polyamide resin. Also, the content of the LDS additive in the resin composition of this embodiment is 30 parts by mass or less, preferably 25 parts by mass or less, more preferably 20 parts by mass or less, still more preferably 15 parts by mass or less, even more preferably 12 parts by mass or less, and even more preferably 10 parts by mass or less, based on 100 parts by mass of the polyamide resin. By setting the content of the LDS additive within the above range, the plating property of the obtained resin molded product can be made better. Further, as will be described later, by combining with talc, it becomes possible to form plating with a small content. The resin composition of this embodiment may contain only one type of LDS additive or two or more types of LDS additives. When two or more types are contained, it is preferable that the total amount is within the above range.

[0037] <Inorganic reducing phosphate> The resin composition of this embodiment contains 0.1 to 10.0 parts by mass of inorganic reducing phosphate based on 100 parts by mass of the polyamide resin. By adopting such a configuration, it becomes possible to increase the plating peeling rate while maintaining a high flexural modulus.

[0038] The inorganic reducing phosphate refers to a salt of inorganic phosphoric acid that reduces a metal oxide containing at least one kind of metal, and at least one of phosphite and hypophosphite is preferable, and a salt of phosphorous acid is more preferable. Examples of the metal constituting the salt include sodium, potassium, aluminum, iron, calcium, and magnesium, and sodium, aluminum, and calcium are preferable. Specific examples of inorganic reducing phosphates include iron phosphite, calcium phosphite, magnesium phosphite, aluminum phosphite, iron hypophosphite, calcium hypophosphite, magnesium hypophosphite, aluminum hypophosphite, sodium hypophosphite, potassium hypophosphite, etc., with aluminum phosphite, calcium hypophosphite, and sodium hypophosphite being preferred, and aluminum phosphite being more preferred. These inorganic reducing phosphates may also be hydrates.

[0039] The content of the inorganic reducing phosphate in the resin composition of this embodiment is 0.1 parts by mass or more, preferably 0.5 parts by mass or more, more preferably 0.8 parts by mass or more, even more preferably 1.0 parts by mass or more, even more preferably 1.2 parts by mass or more, and still more preferably 1.5 parts by mass or more, relative to 100 parts by mass of the polyamide resin. By making the content equal to or more than the lower limit, the reduction of the metal oxide, which is the laser direct structuring additive, tends to proceed more effectively, and plating properties are improved. Furthermore, the content of the inorganic reducing phosphate in the resin composition of this embodiment is 10.0 parts by mass or less, preferably 8.0 parts by mass or less, more preferably 6.0 parts by mass or less, even more preferably 4.0 parts by mass or less, even more preferably 3.0 parts by mass or less, and even more preferably 2.5 parts by mass or less, relative to 100 parts by mass of the polyamide resin. By keeping the content at or below the upper limit, deterioration of the physical properties of the resin molded product tends to be more effectively suppressed. The resin composition of the present embodiment may contain only one type of inorganic reducing phosphate, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0040] The content of the inorganic reducing phosphate in the resin composition of this embodiment is preferably 8 parts by mass or more, and more preferably 10 parts by mass or more, per 100 parts by mass of the LDS additive. By ensuring that the content is above the lower limit, the plating peel strength and plating growth rate tend to be further improved. Furthermore, the content of the inorganic reducing phosphate in the resin composition of this embodiment is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, even more preferably 60 parts by mass or less, and even more preferably 30 parts by mass or less, per 100 parts by mass of the LDS additive. By ensuring that the content is below the upper limit, the bending strength, plating peel strength, and plating growth rate tend to be further improved.

[0041] <Inorganic fibers> The resin composition of the present embodiment contains 10 to 150 parts by mass of inorganic fibers relative to 100 parts by mass of polyamide resin. With this composition, a resin molded article having excellent mechanical strength can be obtained.

[0042] Examples of inorganic fibers include carbon fibers and glass fibers, and glass fibers are preferred.

[0043] In this embodiment, the inorganic fiber refers to a fibrous inorganic material, and more specifically, it is preferably a chopped shape obtained by bundling 1,000 to 10,000 inorganic fibers and cutting them to a predetermined length. In this embodiment, the inorganic fibers preferably have a number-average fiber length of 0.5 to 10 mm, more preferably 1 to 5 mm. By using inorganic fibers with such a number-average fiber length, mechanical strength can be further improved. The number-average fiber length is calculated from the measured values obtained by randomly selecting inorganic fibers to be measured for fiber length from an image obtained by observation with an optical microscope and measuring the long sides of the fibers. The observation is performed at a magnification of 20x, and the number of fibers measured is 1,000 or more. This roughly corresponds to the cut length. The cross section of the inorganic fiber may be any shape, such as a circle, an ellipse, an oval, a rectangle, a rectangle with semicircles on both short sides, a cocoon shape, etc., but a circle is preferred. Here, the circle includes not only a circle in the mathematical sense but also what is normally called a circle in the technical field of this embodiment. The number-average fiber diameter of inorganic fibers is preferably 4.0 μm or more, more preferably 4.5 μm or more, and even more preferably 5.0 μm or more. The upper limit of the number-average fiber diameter of inorganic fibers is preferably 15.0 μm or less, more preferably 12.0 μm or less. By using inorganic fibers having a number-average fiber diameter in this range, resin molded articles with excellent plating properties can be obtained even after wet heat treatment. Furthermore, high plating properties can be maintained even when the resin molded article is stored for a long period of time or heat-treated for a long period of time. The number-average fiber diameter of inorganic fibers is calculated from the measured values obtained by randomly selecting glass fibers to be measured for fiber diameter from an image obtained by observation with an electron microscope and measuring the fiber diameter near the center. The observation is performed at a magnification of 1,000x, and the number of fibers measured is 1,000 or more. The number-average fiber diameter of glass fibers having a cross section other than a circle is the number-average fiber diameter when converted into a circle with the same area as the cross section.

[0044] Next, the glass fiber preferably used in this embodiment will be described. The glass fiber is a fiber obtained by melt spinning commonly supplied glass such as E-glass (electrical glass), C-glass (chemical glass), A-glass (alkaline glass), S-glass (high strength glass), D-glass, and alkali-resistant glass, but is not particularly limited as long as it can be made into glass fiber. In this embodiment, it is preferable to include E-glass.

[0045] The glass fiber used in this embodiment is preferably surface-treated with a surface treatment agent such as a silane coupling agent such as γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, etc. The adhesion amount of the surface treatment agent is preferably 0.01 to 1% by mass of the glass fiber. Further, if necessary, lubricants such as fatty acid amide compounds and silicone oils, antistatic agents such as quaternary ammonium salts, resins having film-forming ability such as epoxy resins and urethane resins, and mixtures of resins having film-forming ability with heat stabilizers, flame retardants, etc. can also be used for surface treatment.

[0046] The glass fiber is available as a commercial product. Examples of commercial products include T286H, T756H, T289H manufactured by Nippon Electric Glass Co., Ltd., DEFT2A manufactured by Owens Corning, HP3540 manufactured by PPG, and CSG3PA820 manufactured by Nitto Boseki Co., Ltd.

[0047] In the resin composition of this embodiment, the content of the inorganic fiber is 10 parts by mass or more, preferably 20 parts by mass or more, more preferably 30 parts by mass or more, further preferably 35 parts by mass or more, still more preferably 40 parts by mass or more, and even more preferably 45 parts by mass or more with respect to 100 parts by mass of the polyamide resin. By setting it to the above lower limit value or more, the mechanical strength of the resin molded product tends to be further improved. In the resin composition of this embodiment, the content of the inorganic fiber is 150 parts by mass or less, preferably 100 parts by mass or less, more preferably 80 parts by mass or less, further preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, and even more preferably 50 parts by mass or less with respect to 100 parts by mass of the polyamide resin. By setting it to the above upper limit value or less, the contact area between the resin molded product and the plating becomes larger, and the adhesion of the plating tends to be further improved. The resin composition of this embodiment may contain only one kind of inorganic fiber or two or more kinds of inorganic fibers. When two or more kinds are contained, the total amount is preferably within the above range.

[0048] <Talc> The resin composition of this embodiment may further contain talc. By including talc, dimensional stability and product appearance can be improved, and the plating growth rate can be increased. Furthermore, by including talc, the plating properties of the resin molded product can be improved even if the content of the LDS additive is reduced. The talc may be surface-treated with at least one compound selected from polyorganohydrogensiloxanes and organopolysiloxanes. In this case, the amount of the siloxane compound attached to the talc is preferably 0.1 to 5% by mass of the talc. The number-average particle size of talc is preferably 1 to 50 μm, and more preferably 2 to 25 μm. Talc is usually scaly, and the length of the longest part is taken as the average particle size. The number-average particle size of talc is calculated from the measured values obtained by randomly selecting talc particles to be measured for particle size from an image obtained by observation with an electron microscope, measuring the particle size of the sample, and then calculating the number of particles from the measured values. The observation magnification is 1,000x, and the number of particles measured is 1,000 or more.

[0049] When talc is blended in the resin composition of this embodiment, the content of talc is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.1 to 5 parts by mass, relative to 100 parts by mass of polyamide resin. Furthermore, the content of talc in the resin composition of this embodiment is preferably 0.1 to 200 parts by mass, more preferably 1 to 150 parts by mass, even more preferably 10 to 50 parts by mass, and even more preferably 10 to 30 parts by mass, relative to 100 parts by mass of the LDS additive. Furthermore, when the talc is surface-treated with a siloxane compound, the content of the talc surface-treated with the siloxane compound is preferably within the above range.

[0050] <Release agent> The resin composition of this embodiment may further contain a release agent. The release agent is mainly used to improve the productivity during the molding of the resin composition. Examples of the release agent include aliphatic carboxylic acid amide-based, aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, and the like.

[0051] Details of the release agent can be referred to the descriptions in paragraphs 0037 to 0042 of JP-A-2016-196563 and paragraphs 0048 to 0058 of JP-A-2016-078318, and these contents are incorporated herein.

[0052] When the release agent is blended, its content is preferably at least 0.001% by mass, more preferably at least 0.01% by mass, based on the resin composition, and preferably at most 2.0% by mass, more preferably at most 1.5% by mass. By setting the content within such a range, the mold release property can be improved and mold contamination can be effectively suppressed when performing mold molding such as injection molding. The release agent may be used alone or in combination of two or more. When two or more are used, the total amount is preferably within the above range.

[0053] <Other Additives> In addition to the above, the resin composition of this embodiment may contain other components. Examples of other components include light stabilizers, heat stabilizers, alkalis, elastomers, titanium oxide, antioxidants, hydrolysis resistance improvers, matting agents, ultraviolet absorbers, nucleating agents, plasticizers, dispersants, antistatic agents, anti-coloring agents, anti-gelling agents, colorants, and the like. Details of these can be referred to the descriptions in paragraphs 0130 to 0155 of Patent No. 4894982, and these contents are incorporated herein. The total amount of these components is preferably 20% by mass or less of the resin composition. These components may each be used alone or in combination of two or more.

[0054] <Method for Producing Resin Composition> As a method for producing the resin composition of the present embodiment, any method can be adopted. For example, a method can be mentioned in which a polyamide resin, inorganic fibers, an LDS additive, etc. are mixed using a mixing means such as a V-type blender to prepare a batch blend product, and then melt-kneaded with an extruder equipped with a vent and pelletized. Alternatively, as a two-stage kneading method, components other than inorganic fibers are sufficiently mixed in advance, melt-kneaded with an extruder equipped with a vent to produce pellets, and then the pellets and a reinforcing filler are mixed and melt-kneaded with an extruder equipped with a vent. Furthermore, a method can be mentioned in which components other than inorganic fibers are sufficiently mixed in advance using a V-type blender or the like, supplied from the first chute of a twin-screw extruder equipped with a vent, and the inorganic fibers are supplied from the second chute in the middle of the extruder for melt-kneading and pelletization.

[0055] Regarding the screw configuration in the kneading zone of the extruder, it is preferable to arrange an element that promotes kneading on the upstream side and an element with pressure boosting ability on the downstream side. Examples of the element that promotes kneading include a forward feeding kneading disk element, an orthogonal kneading disk element, a wide kneading disk element, and a forward feeding mixing screw element.

[0056] The heating temperature during melt-kneading can usually be appropriately selected from the range of 180 to 360°C. If the temperature is too high, decomposition gas is likely to be generated, which may cause extrusion defects such as strand breakage. Therefore, it is desirable to select a screw configuration considering shear heating, etc. In order to suppress decomposition during kneading and during molding in subsequent processes, it is desirable to use an antioxidant or a heat stabilizer.

[0057] <Resin molded product> The present embodiment also discloses a resin molded product formed from the resin composition of the present embodiment.

[0058] The resin composition of this embodiment preferably has a flexural strength of 170 MPa or more, more preferably 180 MPa or more, and even more preferably 190 MPa or more when molded to a thickness of 4 mm and compliant with ISO 178. The upper limit of the flexural strength is not particularly defined, but for example, 270 MPa or less, more preferably 260 MPa or less, and particularly preferably 250 MPa or less is practical. The resin composition of this embodiment preferably has a flexural modulus of elasticity of 8.0 GPa or more, more preferably 9.0 GPa or more, and even more preferably 9.5 GPa or more when molded to a thickness of 4 mm and compliant with ISO 178. The upper limit of the flexural modulus of elasticity is not particularly defined, but for example, 15 GPa or less, more preferably 14 GPa or less, and particularly preferably 13 GPa or less is practical.

[0059] The resin composition of this embodiment preferably has a notched Charpy impact strength of 2.5 kJ / m 2 or more when molded to a thickness of 4 mm and compliant with the ISO 179 standard. The upper limit of the notched Charpy impact strength is not particularly defined, but for example, 10 kJ / m 2 or less, more preferably 9 kJ / m 2 or less, and particularly preferably 7 kJ / m 2 or less is practical.

[0060] The resin composition of this embodiment preferably has a plating peel strength of 0.9 N / mm or more, more preferably 1.0 N / mm or more, and even more preferably 1.1 N / mm or more. The upper limit of the plating peel strength is, for example, 2.0 N / mm or less is practical.

[0061] The above flexural strength, flexural modulus of elasticity, notched Charpy impact strength, and plating peel strength are each measured according to the methods described in the examples below.

[0062] In this embodiment, the method for producing a resin molded product is not particularly limited, and any molding method commonly used for resin compositions can be used. Examples include injection molding, ultra-high speed injection molding, injection compression molding, two-color molding, gas-assisted or other hollow molding methods, molding using an insulated mold, molding using a rapidly heated mold, foam molding (including supercritical fluid), insert molding, IMC (in-mold coating) molding, extrusion molding, sheet molding, thermoforming, rotational molding, laminate molding, press molding, and blow molding. A molding method using a hot runner system can also be used.

[0063] The resin molded article obtained by molding the resin composition of this embodiment is preferably used as a plated resin molded article having a plated surface. The plating in the resin molded article of this embodiment is preferably an embodiment that retains antenna performance.

[0064] <Method of manufacturing plated resin molded products> Next, a method for producing a plated resin molded article will be disclosed, which includes irradiating a laser onto the surface of a resin molded article formed from the resin composition of this embodiment, and then applying a metal to form a plating. Figure 1 is a schematic diagram showing the process of forming a plating on the surface of a resin molded product 1 using laser direct structuring technology. In Figure 1, the resin molded product 1 is a flat substrate, but it does not necessarily have to be a flat substrate and may be a resin molded product with a partially or entirely curved surface. Furthermore, the obtained plated resin molded product is not limited to final products but also includes various parts.

[0065] Returning to FIG. 1, a resin molded article 1 is irradiated with a laser 2. The laser here is not particularly limited and can be appropriately selected from known lasers such as a YAG laser, an excimer laser, and electromagnetic rays, with a YAG laser being preferred. The wavelength of the laser is also not particularly limited. A preferred wavelength range is 200 nm to 1200 nm, and more preferably 800 to 1200 nm. When irradiated with a laser, only the portion 3 irradiated with the laser activates the resin molded product 1. In this activated state, the resin molded product 1 is applied to the plating solution 4. The plating solution 4 is not particularly defined, and known plating solutions can be widely adopted. As the metal component, a plating solution composed of one or more of copper, nickel, silver, gold, and palladium (especially electroless plating solution) is preferable, a plating solution composed of one or more of copper, nickel, silver, and gold (especially electroless plating solution) is more preferable, and a plating solution containing copper (especially electroless plating solution) is even more preferable. That is, in this embodiment, the plating preferably has a metal component composed of at least one of the above metals. The method of applying the resin molded product 1 to the plating solution 4 is not particularly defined either. For example, a method of putting it into a liquid containing the plating solution can be mentioned. In the resin molded product after applying the plating solution, plating 5 is formed only on the laser-irradiated portion. In the method of this embodiment, plating (circuit) having an interval with a width of 1 mm or less, more preferably 150 μm or less (the lower limit value is not particularly defined, for example, 30 μm or more) can be formed. In order to suppress corrosion and deterioration of the formed plating (circuit), for example, after electroless plating, it can be further protected with nickel and gold. Similarly, after electroless plating, electrolytic plating can be used to form the required film thickness in a short time. Moreover, the method for manufacturing the plated resin molded product is preferably used as a method for manufacturing parts of a portable electronic device having an antenna, including the method for manufacturing the plated resin molded product.

[0066] The resin molded product obtained from the resin composition of this embodiment can be used for various applications such as electronic components (especially parts of portable electronic devices) such as connectors, switches, relays, and conductive circuits.

[0067] In addition, within the scope not departing from the gist of this embodiment, the descriptions of JP-A-2011-219620, JP-A-2011-195820, JP-A-2011-178873, JP-A-2011-168705, and JP-A-2011-148267 can be referred to.

Example

[0068] The present invention will be described in more detail with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. When the measuring instruments and the like used in the examples are difficult to obtain due to obsolescence or the like, measurements can be made using other devices having equivalent performance.

[0069] <Raw materials> <<Polyamide resin>> PXD10: A polyamide resin composed of p-xylylenediamine and sebacic acid, synthesized according to the description in paragraph 0079 of JP-A-2019-073736. MP10: A polyamide resin composed of p-xylylenediamine, m-xylylenediamine and sebacic acid, synthesized according to the description in paragraph 0071 of JP-A-2018-119043. MP6: A polyamide resin composed of m-xylylenediamine and adipic acid, synthesized according to the description in paragraph 0072 of JP-A-2018-119043. <<LDS additive>> Black1G: Manufactured by Shephard, copper chromate oxide CP-5C: Manufactured by Keeling & Walker, antimony-doped tin oxide 23-KT: Manufactured by Hakusui Tech Co., Ltd., aluminum-doped zinc oxide

[0070] <<Inorganic reducing phosphate>> Aluminum phosphite: Manufactured by Taiheiyo Chemical Industry Co., Ltd., APA-100 Sodium hypophosphite monohydrate: Manufactured by Fujifilm Wako Pure Chemical Corporation Calcium hypophosphite: Manufactured by Fujifilm Wako Pure Chemical Corporation <<Inorganic fiber>> T756H: Glass fiber, manufactured by Nippon Electric Glass Co., Ltd., chopped strand, E glass, number average fiber diameter 10 μm T275H: Glass fiber, manufactured by Nippon Electric Glass Co., Ltd., chopped strand, E glass, number average fiber diameter 10 μm

[0071] <<Talc>> MW (Micron White) 5000S: Manufactured by Hayashi Kasei Co., Ltd., number average particle diameter 5 μm <<Release agent>> WH255: Manufactured by Kyoeisha Chemical Co., Ltd., fatty acid amide wax

[0072] Examples 1 to 9, Comparative Examples 1 to 4 <Compound> Weigh each component so as to have the composition shown in Table 1 or 2 described later. Blend the components excluding the glass fiber in a tumbler, and feed them from the bottom of a twin-screw extruder (manufactured by Toshiba Machine Co., Ltd., TEM26SS). After melting, feed the glass fiber by side feeding to produce pellets. The temperature setting of the twin-screw extruder was 300 °C. Each component in Tables 1 and 2 is shown by mass ratio.

[0073] <Flexural strength and flexural modulus> After drying the pellets obtained by the above manufacturing method at 120 °C for 4 hours, an ISO tensile test piece (4 mm thick) was injection molded using an injection molding machine (manufactured by Toshiba Machine Co., Ltd., "EC75SX") under the conditions of a cylinder temperature of 300 °C, a mold temperature of 130 °C, and a molding cycle of 50 seconds. In accordance with ISO 178, the flexural strength (unit: MPa) and flexural modulus (unit: GPa) were measured at a temperature of 23 °C.

[0074] <Charpy impact strength> After drying the pellets obtained by the above manufacturing method at 120 °C for 4 hours, an ISO tensile test piece (4 mm thick) was injection molded using an injection molding machine (manufactured by Toshiba Machine Co., Ltd., "EC75SX") under the conditions of a cylinder temperature of 300 °C, a mold temperature of 130 °C, and a molding cycle of 50 seconds. In accordance with the ISO 179 standard, the Charpy impact strength (with notch) was measured at a temperature of 23 °C. The unit is shown as kJ / m 2 as shown.

[0075] <Plating stripping strength> After drying the pellets obtained by the above manufacturing method at 120 °C for 4 hours, injection molding was carried out using an injection molding machine (manufactured by Toshiba Machine Co., Ltd., "EC75SX") under the conditions of a cylinder temperature of 300 °C, a mold temperature of 130 °C, and a molding cycle of 50 seconds to form a plate with a thickness of 60 mm × 60 mm × 2 mm. For the obtained plate, it was irradiated with a YAG laser having a wavelength of 1064 nm at an output of 10 W, a speed of 80 m / s, and a frequency of 3 μs. After degreasing the test piece with sulfuric acid, it was treated with THP alkaline acti and THP alkaline access manufactured by Kizai Co., Ltd., and copper plating was carried out with SEL copper manufactured by Kizai Co., Ltd. The integral average value was calculated from the detected load when the obtained copper plating pattern was peeled off by 10 mm at a speed of 20 mm / min by a 90-degree peel test. For the measurement, a load cell of 2 kN manufactured by Instron Corporation was used. The unit was shown in N / mm.

[0076] <Plating growth rate> After drying the pellets obtained by the above manufacturing method at 120 °C for 4 hours, injection molding was carried out using an injection molding machine (manufactured by Toshiba Machine Co., Ltd., "EC75SX") under the conditions of a cylinder temperature of 300 °C, a mold temperature of 130 °C, and a molding cycle of 50 seconds to form a plate with a thickness of 60 mm × 60 mm × 2 mm. For the obtained plate, it was irradiated with a YAG laser having a wavelength of 1064 nm at an output of 10 W, a speed of 80 m / s, and a frequency of 3 μs. After degreasing the test piece with sulfuric acid, it was treated with THP alkaline acti and THP alkaline access manufactured by Kizai Co., Ltd., and copper plating was carried out with SEL copper manufactured by Kizai Co., Ltd. The film thickness of the obtained copper plating pattern was measured using a fluorescence X-ray film thickness meter FT110 manufactured by Yamato Scientific Co., Ltd. The plating thickness was calculated from the average value of three arbitrary measurement points. The ratio of the film thickness of each example and comparative example was based on the film thickness of comparative example 1 being 1.0. It can be said that the thicker the film thickness, the faster the growth rate.

[0077] The above results are shown in Table 1 and Table 2 below.

Table 1

Table 2

[0078] As is clear from the above results, the resin molded product formed from the resin composition of the present invention had a high plating growth rate and excellent bending strength. Furthermore, it was also excellent in mechanical strengths such as flexural modulus and Charpy impact strength. Also, it was excellent in plating peel strength. On the other hand, when the inorganic phosphate was not blended (Comparative Examples 1 to 3), the plating growth rate was slow. Also, the plating peel strength was inferior. On the other hand, when the blending amount of the inorganic phosphate was large (Comparative Example 4), the bending strength was low. Furthermore, the plating peel strength was also low and it was easy to peel off.

Explanation of Signs

[0079] 1 Resin molded product 2 Laser 3 Portion irradiated with laser 4 Plating solution 5 Plating

Claims

1. Based on 100 parts by mass of the polyamide resin, it contains 1 to 30 parts by mass of a laser direct structuring additive, 0.1 to 10.0 parts by mass of an inorganic reducing phosphate (excluding those corresponding to the laser direct structuring additive), and 10 to 150 parts by mass of inorganic fibers. The laser direct structuring additive refers to a compound that, when 10 parts by mass of an additive considered to be a laser direct structuring additive is added to 100 parts by mass of the polyamide resin, irradiated with a YAG laser having a wavelength of 1064 nm at an output of 10 W, a frequency of 80 kHz, and a speed of 3 m / s, and then immersed in an electroless plating bath as a subsequent plating process, can selectively form plating only on the laser-irradiated part. It is a polyamide resin composition for laser direct structuring.

2. The polyamide resin composition for laser direct structuring according to Claim 1, wherein the inorganic fiber contains glass fiber.

3. The polyamide resin composition for laser direct structuring according to Claim 1 or 2, wherein the inorganic reducing phosphate contains at least one of phosphite and hypophosphite.

4. The polyamide resin composition for laser direct structuring according to any one of Claims 1 to 3, wherein the laser direct structuring additive contains at least one of copper, antimony, tin, aluminum, and zinc.

5. The polyamide resin composition for laser direct structuring according to any one of Claims 1 to 4, wherein the polyamide resin contains a semi-aromatic polyamide resin.

6. At least one of the polyamide resins is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid. 70 mol% or more of the structural unit derived from diamine is derived from xylylenediamine, and 70 mol% or more of the structural unit derived from dicarboxylic acid is derived from an α,ω-linear aliphatic dicarboxylic acid having 4 to 20 carbon atoms. It is a polyamide resin composition for laser direct structuring according to any one of Claims 1 to 5.

7. The polyamide resin composition for laser direct structuring according to any one of Claims 1 to 6, which contains 1.0 to 6.0 parts by mass of the inorganic phosphite based on 100 parts by mass of the polyamide resin.

8. Furthermore, the polyamide resin composition for laser direct structuring according to any one of claims 1 to 7, which contains 0.1 to 200 parts by mass of talc with respect to 100 parts by mass of the laser direct structuring additive.

9. The polyamide resin composition for laser direct structuring according to any one of claims 1 to 8, which contains 20 to 80 parts by mass of the inorganic fiber with respect to 100 parts by mass of the polyamide resin.

10. A resin molded product formed from the polyamide resin composition for laser direct structuring according to any one of claims 1 to 9.

11. The resin molded product according to claim 10, which has plating on the surface of the resin molded product.

12. The resin molded product according to claim 11, wherein the plating has performance as an antenna.

13. The resin molded product according to any one of claims 10 to 12, which is a component of a portable electronic device.

14. A method for manufacturing a plated resin molded product, which includes applying a metal after irradiating a laser to the surface of a resin molded product formed by molding the polyamide resin composition for laser direct structuring according to any one of claims 1 to 9 to form plating.

15. The method for manufacturing a plated resin molded product according to claim 14, wherein the plating is copper plating.

16. A method for manufacturing a component of a portable electronic device having an antenna, which includes the method for manufacturing a plated resin molded product according to claim 14 or 15.

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