Substrate processing machine

Abstract

Provided is a working machine for a substrate, the working machine comprising: a pair of conveyance lanes for conveying the substrate; and a bending device for bending a lead of a lead component, wherein the bending device is arranged between the pair of conveyance lanes and bends the lead of the lead component mounted to the substrate that is conveyed by the pair of conveyance lanes, and each conveyance lane of the pair of conveyance lanes is provided with a clamp device that clamps the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate pair working machine that conveys a substrate by a pair of conveying lanes.

Background Art

[0002] As described in the following patent documents, there is a substrate pair working machine that performs work on a substrate conveyed by a pair of conveying lanes.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a substrate pair working machine that performs work on a substrate conveyed by a pair of conveying lanes, a bending device for bending leads may be disposed between the pair of conveying lanes. In such a case, it is an object to clamp the substrate appropriately.

Means for Solving the Problems

[0005] To solve the above problems, this specification includes a pair of conveying lanes each including a conveyor belt that contacts the lower surface of a substrate and conveys the substrate, and a clamping device that operates an air cylinder provided therein to raise a lift member to lift and separate the substrate from the conveyor belt, and raises and clamps the substrate until a clamping member abuts against the upper surface of the separated substrate, and a bending device that is disposed between the pair of conveying lanes and bends the leads of lead components mounted on the substrate conveyed by the pair of conveying lanes. When the direction in which the pair of transfer lanes extend is defined as the X direction and the direction in which they face each other is defined as the Y direction, the air cylinder is disposed outside the substrate supported by the conveyor belt in the Y direction. The bending device is positioned at an arbitrary position between the pair of transport lanes by driving an electromagnetic motor provided in the unit moving device below the substrate clamped by the clamping device, and is capable of bending the leads of lead components inserted into the through-holes of the substrate to mount the lead components on the substrate. A substrate working machine is disclosed.

Advantages of the Invention

[0006] According to the present disclosure, a clamping device for clamping a substrate is disposed on each of the pair of transport lanes. Thereby, in a substrate working machine that performs work on a substrate transported by a pair of transport lanes, even when a bending device is disposed between the pair of transport lanes, the substrate can be appropriately clamped.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0008] Hereinafter, as embodiments for carrying out the present invention, embodiments of the present invention will be described in detail with reference to the drawings.

[0009] FIG. 1 shows a component mounter 10. The component mounter 10 is a device for performing component mounting work on a circuit base material 12. The component mounter 10 includes a device main body 20, a component mounting device 22, a mark camera 24, a parts camera 26, a component supply device 28, a bulk component supply device 30, a base material transfer and holding device 32, a cut and clinch unit (see FIG. 3) 34, and a unit moving device (see FIG. 3) 36. Note that examples of the circuit base material 12 include a circuit board and a three-dimensional structure base material, and examples of the circuit board include a printed wiring board and a printed circuit board.

[0010] The device main body 20 is composed of a frame 40 and a beam 42 mounted on the frame 40. In the following description, the width direction of the device main body 20 is referred to as the X direction, the front-rear direction of the device main body 20 is referred to as the Y direction, and the vertical direction is referred to as the Z direction.

[0011] The component mounting device 22 is disposed on the beam 42 and has two work heads 60, 62 and a work head moving device 64. As shown in FIG. 2, suction nozzles 66 are provided on the lower end surfaces of the work heads 60, 62, and components are sucked and held by the suction nozzles 66. The work head moving device 64 includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60, 62 are integrally moved to an arbitrary position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. Each work head 60, 62 is detachably mounted on sliders 74, 76, and the Z-direction moving device 72 moves the sliders 74, 76 individually in the vertical direction. That is, the work heads 60, 62 are individually moved in the vertical direction by the Z-direction moving device 72.

[0012] Further, as shown in FIG. 2, the mark camera 24 is attached to the slider 74 in a downward-facing state. As a result, the mark camera 24, together with the work head 60, can be moved in the X, Y, and Z directions to image any position on the frame 40. As shown in FIG. 1, the parts camera 26 is disposed in an upward-facing state between the component supply device 28 and the base material transfer and holding device 32 on the frame 40. Thereby, the parts camera 26 images the components held by the suction nozzles 66 of the work heads 60 and 62.

[0013] The component supply device 28 is detachably positioned and disposed at one end of the frame 40 in the front-rear direction. The component supply device 28 includes a tray-type component supply device 86 and a feeder-type component supply device 88. The tray-type component supply device 86 is a device that supplies components placed on a tray. The feeder-type component supply device 88 is a device that supplies components to the component mounting device 22 by a tape feeder, a stick feeder (not shown), etc.

[0014] The loose component supply device 30 is detachably positioned and disposed at the other end of the frame 40 in the front-rear direction. The loose component supply device 30 is a device that aligns a plurality of components scattered in a scattered state and supplies the components in the aligned state. That is, it is a device that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in the predetermined posture to the component mounting device 22.

[0015] Examples of the components supplied by the component supply device 28 and the loose component supply device 30 include electronic circuit components, components of a solar cell, components of a power module, etc. Further, the electronic circuit components include components with leads, components without leads, etc.

[0016] The base material conveying and holding device 32 is disposed at the center in the front-rear direction of the frame 40. As shown in FIG. 3, it has a pair of conveying lanes 100, 102, a shuttle device 104, and a pair of clamp devices 106, 108. The pair of conveying lanes 100, 102 are disposed opposite to each other in the Y direction while extending in the X direction. Since the pair of conveying lanes 100, 102 have substantially the same structure, the conveying lane 100 will be described as a representative.

[0017] The conveying lane 100 is composed of a pair of support legs 112, 114 and a bridging member 116. The pair of support legs 112, 114 are erected on the upper surface of the base 118 of the base material conveying and holding device 32 in a state of being separated in the X direction. And the bridging member 116 is bridged over the pair of support legs 112, 114 so as to extend in the X direction. On one end side in the X direction of the bridging member 116, the first conveyor belt 120 is wound so as to extend in the X direction, and on the other end side, the second conveyor belt 122 is wound so as to extend in the X direction. And the first conveyor belt 120 circulates clockwise in FIG. 3 by the drive of the electromagnetic motor 124, and the second conveyor belt 122 circulates in the same direction as the second conveyor belt 122 by the drive of the electromagnetic motor 126.

[0018] Thereby, the circuit board 12 supported by the first conveyor belt 120 of the pair of conveying lanes 100, 102 is carried into the component mounter 10, and the circuit board 12 supported by the second conveyor belt 122 of the pair of conveying lanes 100, 102 is carried out from the component mounter 10. For this reason, the side where the first conveyor belt 120 is disposed is described as the upstream side, and the side where the second conveyor belt 122 is disposed is described as the downstream side. Note that the pair of conveying lanes 100, 102, the first conveyor belt 120, and the second conveyor belt 122 are components constituting the component mounter 10. That is, the component mounter 10 includes a pair of conveying lanes 100, 102, the first conveyor belt 120, and the second conveyor belt 122.

[0019] Further, the first conveyor belt 120 and the second conveyor belt 122 are spaced apart in the X direction by a distance longer than the length dimension of the circuit board material 12, and a guide rail 130 is disposed between the first conveyor belt 120 and the second conveyor belt 122 so as to extend in the X direction. For this reason, the circuit board material 12 carried into the interior of the component mounter 10 by the first conveyor belt 120 is conveyed onto the guide rail 130. However, since the first conveyor belt 120 and the second conveyor belt 122 are spaced apart in the X direction by a distance longer than the length dimension of the circuit board material 12, the circuit board material 12 conveyed onto the guide rail 130 cannot be conveyed by either the first conveyor belt 120 or the second conveyor belt 122. For this reason, a shuttle device 104 is disposed in the conveyance lane 100.

[0020] As shown in FIG. 4, the shuttle device 104 includes a slide rail 132, a slider 134, a slide arm 136, and a slide pin 138. The slide rail 132 is disposed on the upper surface side of the bridging member 116 in a posture extending in the X direction on the bridging member 116. The slider 134 is slidably supported in the X direction by the slide rail 132, and the slider 134 slides controllably by driving of an electromagnetic motor (not shown).

[0021] Further, a slide arm 136 is disposed on the upper surface of the slider 134 so as to be swingable in the vertical direction, and swings controllably by the drive of an air cylinder (not shown). When the slide arm 136 swings downward, the slide arm 136 swings to a position where it pushes and conveys the circuit base material 12. When the slide arm 136 swings upward, the slide arm 136 swings to a retracted position so that the circuit base material 12 is conveyed in the conveyance lanes 100 and 102. Specifically, in a state where the slide arm 136 swings downward, it is generally horizontal, and by swinging upward, the tip of the slide arm 136 extends upward. And in a state where the slide arm 136 swings downward, the tip of the slide arm 136 extends inside the guide rail 130 from the viewpoint from above, that is, to the side of the circuit base material 12 supported by the guide rail 130. And a slide pin 138 is fixed to the tip of the slide arm 136 so as to extend downward. In a state where the slide arm 136 swings downward, the lower end of the slide pin 138 extends below the circuit base material 12 supported by the guide rail 130.

[0022] Therefore, the circuit board material 12 conveyed onto the guide rail 130 by the first conveyor belt 120 is conveyed to the second conveyor belt 122 by the slide pin 138 of the shuttle device 104. That is, when the circuit board material 12 is conveyed onto the guide rail 130 by the first conveyor belt 120, the slider 134 is located upstream of the guide rail 130, and the slide arm 136 is swinging upward. Then, when the circuit board material 12 is conveyed onto the guide rail 130 by the first conveyor belt 120, the slide arm 136 swings downward. Next, when the slider 134 slides toward the downstream side, the slide pin 138 abuts against the circuit board material 12 supported by the guide rail 130, and as the slider 134 slides further downstream, that is, toward the second conveyor belt 122, the circuit board material 12 is conveyed to the second conveyor belt 122. Then, the circuit board material 12 conveyed to the second conveyor belt 122 is carried out of the component mounter 10 by the second conveyor belt 122. That is, in the substrate conveying and holding device 32, the circuit board material 12 is carried into the component mounter 10 by the first conveyor belt 120 and conveyed onto the guide rail 130. Then, on the guide rail 130, the circuit board material 12 is conveyed toward the second conveyor belt 122 by the slide pin 138 of the shuttle device 104, and the circuit board material 12 conveyed to the second conveyor belt 122 is carried out of the component mounter 10 by the second conveyor belt 122.

[0023] Also, a pair of clamp devices 106, 108 are disposed on a pair of conveying lanes 100, 102. That is, the clamp device 106 is disposed on the conveying lane 100, and the clamp device 108 is disposed on the conveying lane 102. Since the pair of clamp devices 106, 108 have substantially the same structure, the clamp device 106 will be described as a representative.

[0024] As shown in FIGS. 4 and 5 which is a cross-sectional view taken along line AA of FIG. 4, the clamping device 106 has a clamping plate 150 and an air cylinder 152. The clamping plate 150 has an elongated plate shape, and the length dimension of the clamping plate 150 is slightly shorter than the length dimension of the guide rail 130. And the clamping plate 150 is disposed above the guide rail 130 so as to be slidable in the vertical direction while facing the guide rail 130. Further, the air cylinder 152 is disposed outside the guide rail 130, that is, on the side opposite to the circuit base material 12 supported by the guide rail 130, in a posture extending in the vertical direction, and the rod 154 of the air cylinder 152 extends upward. And the clamping plate 150 is connected to the rod 154 of the air cylinder 152 outside the guide rail 130.

[0025] With such a structure, when the air cylinder 152 contracts, the clamping plate 150 slides downward. At this time, as shown in FIG. 5, the clamping plate 150 abuts on the upper surface of the circuit base material 12 supported by the guide rail 130. Thereby, the circuit base material 12 supported by the guide rail 130 is clamped between the guide rail 130 and the clamping plate 150. And as the air cylinder 152 extends, the clamping plate 150 slides upward, so that it separates from the circuit base material 12 supported by the guide rail 130, and the clamping by the guide rail 130 and the clamping plate 150 is released.

[0026] That is, in the substrate transfer and holding device 32, when the circuit substrate 12 carried into the component mounter 10 by the first conveyor belt 120 is conveyed to the guide rail 130, the air cylinder 152 contracts, and the circuit substrate 12 is clamped by the clamp plate 150 and the guide rail 130. Then, operations are performed on the circuit substrate 12 clamped by the clamp plate 150 and the guide rail 130 by the work heads 60, 62, etc. That is, the position where the circuit substrate 12 is clamped by the guide rail 130 and the clamp plate 150 on the upper surface of the guide rail 130 is the working position for the circuit substrate 12. Subsequently, when the operations on the circuit substrate 12 are completed, the air cylinder 152 extends, and the clamping by the guide rail 130 and the clamp plate 150 is released. Then, by the operation of the shuttle device 104, after the circuit substrate 12 is conveyed from above the guide rail 130 to the second conveyor belt 122, it is conveyed downstream by the second conveyor belt 122 and thus carried out of the component mounter 10. In this way, in the substrate transfer and holding device 32, the loading of the circuit substrate 12 by the first conveyor belt 120, the clamping of the circuit substrate 12 at the working position by the clamping devices 106, 108, the conveyance from the working position to the second conveyor belt 122 by the shuttle device 104, and the unloading of the circuit substrate 12 by the second conveyor belt 122 are executed.

[0027] Also, as shown in FIG. 3, below the pair of transport lanes 100 and 102 of the substrate transport and holding device 32, between the pair of transport lanes 100 and 102, at the position where backup pins and backup plates for placing the circuit substrate 12 used when electronic circuit components are mounted on the circuit substrate 12 are arranged, a cut-and-clinch unit 34 and a unit moving device 36 are arranged. That is, from a viewpoint from above, between the pair of transport lanes 100 and 102, the cut-and-clinch unit 34 and the unit moving device 36 are arranged. The unit moving device 36 is fixed to the upper surface of the bottom plate 160 that constitutes the base 118 of the substrate transport and holding device 32. By the operation of the unit moving device 36, the cut-and-clinch unit 34 moves to an arbitrary position. Note that the cut-and-clinch unit 34 moves below the circuit substrate 12 transported by the substrate transport and holding device 32.

[0028] Specifically, as shown in FIG. 6, the cut-and-clinch unit 34 has a pair of slide bodies 170. The pair of slide bodies 170 are slidably supported so as to approach and separate by slide rails 172 arranged to extend linearly. Then, by driving an electromagnetic motor (not shown), the slide bodies 170 slide, and thus the distance between the pair of slide bodies 170 can be controllably changed.

[0029] Also, each of the pair of slide bodies 170 includes a fixed portion 176 and a movable portion 178. In the fixed portion 176, it is slidably held by the slide rail 172. Also, the movable portion 178 is slidably held in the X direction by the fixed portion 176. Then, by driving an air cylinder (refer to the air port in FIG. 6), the movable portion 178 moves linearly with respect to the fixed portion 176, and thus slides in a controllable manner so as to approach and separate.

[0030] Further, as shown in FIG. 7, the upper end portion of the fixed part 176 is tapered, and a first insertion hole 180 is formed so as to penetrate the upper end portion in the vertical direction. Also, the opening edge of the first insertion hole 180 on the upper end surface is a fixed blade 182. On the other hand, the upper end portion of the movable part 178 is also tapered, and a bent portion 184 bent in an L shape is formed at the upper end portion thereof. The bent portion 184 extends above the upper end surface of the fixed part 176. Further, the first insertion hole 180 opening on the upper end surface of the fixed part 176 is covered by the bent portion 184, but a second insertion hole 186 is formed in the bent portion 184 so as to face the first insertion hole 180. Note that the opening edge of the second insertion hole 186 on the lower end surface of the bent portion 184 is a movable blade 188.

[0031] Also, as shown in FIG. 8, the unit moving device 36 includes an X-direction moving device 190, a Y-direction moving device 192, a Z-direction moving device 194, and a rotation device 196. The X-direction moving device 190 includes a slide rail 200 and an X slider 202. The slide rail 200 is disposed so as to extend in the X direction, and the X slider 202 is slidably held on the slide rail 200. Then, the X slider 202 moves in the X direction by the drive of an electromagnetic motor (not shown).

[0032] The Y-direction moving device 192 includes a slide rail 206 and a Y slider 208. The slide rail 206 is disposed on the X slider 202 so as to extend in the Y direction, and the Y slider 208 is slidably held on the slide rail 206. Then, the Y slider 208 moves in the Y direction by the drive of an electromagnetic motor (not shown). The Z-direction moving device 194 includes a slide rail 210 and a Z slider 212. The slide rail 210 is disposed on the Y slider 208 so as to extend in the Z direction, and the Z slider 212 is slidably held on the slide rail 210. Then, the Z slider 212 moves in the Z direction by the drive of an electromagnetic motor (not shown).

[0033] In addition, the rotating device 196 generally has a disk-shaped rotating table 216. The rotating table 216 is supported by the Z slider 212 so as to be rotatable about its axis, and rotates by the drive of an electromagnetic motor (not shown). And, on the rotating table 216, the cut-and-clinch unit 34 is detachably placed in a state where it can be easily replaced. With such a structure, the cut-and-clinch unit 34 can move to an arbitrary position between the pair of transport lanes 100 and 102 by the X-direction moving device 190, the Y-direction moving device 192, and the Z-direction moving device 194, and can rotate to an arbitrary angle by the rotating device 196. That is, the cut-and-clinch unit 34 can be positioned at an arbitrary position between the pair of transport lanes 100 and 102 below the circuit base material 12 held by the clamp devices 106 and 108.

[0034] In the component mounter 10, the component mounting operation is performed on the circuit base material 12 clamped by the base material transport and holding device 32 according to the above-described configuration. The component mounter 10 can mount various components on the circuit base material 12. The case of mounting the lead component (see FIG. 7) 220 on the circuit base material 12 will be described below.

[0035] Specifically, the circuit base material 12 is transported by the first conveyor belt 120 of the base material transport and holding device 32 to the working position, that is, to the upper surface of the guide rail 130, and is fixedly held at that position by the guide rail 130 and the clamp plate 150 of the clamp devices 106 and 108. Next, the mark camera 24 moves above the circuit base material 12 and images the circuit base material 12. Thereby, information regarding the holding position etc. of the circuit base material 12 is obtained. Also, the component supply device 28 or the bulk component supply device 30 supplies the lead component 220 at a predetermined supply position. Then, either of the working heads 60 and 62 moves above the component supply position, and the component body portion (see FIG. 7) 222 of the lead component 220 is sucked and held by the suction nozzle 66.

[0036] Subsequently, the work heads 60 and 62 holding the lead component 220 move above the parts camera 26, and the lead component 220 held by the suction nozzle 66 is imaged by the parts camera 26. Thereby, information regarding the holding position of the component and the like is obtained. Subsequently, the work heads 60 and 62 holding the lead component 220 move above the circuit substrate 12 to correct the error in the holding position of the circuit substrate 12, the error in the holding position of the component, and the like. Then, the leads (see FIG. 7) 224 of the lead component 220 held by suction by the suction nozzle 66 are inserted into the through holes (see FIG. 7) 226 formed in the circuit substrate 12. At this time, the cut-and-clinch unit 34 is moving below the through hole 226.

[0037] Specifically, in the cut-and-clinch unit 34, the distance or pitch between the second insertion holes 186 of the movable portions 178 of the pair of slide bodies 170 is made the same as the distance or pitch between the two through holes 226 formed in the circuit substrate 12, and the distance between the pair of slide bodies 170 is changed. Then, by the operation of the X-direction moving device 190 and the Y-direction moving device 192, the cut-and-clinch unit 34 moves so that the coordinates of the second insertion holes 186 of the slide body 170 in the XY directions coincide with the coordinates of the through holes 226 of the circuit substrate 12 in the XY directions. Thereby, as the cut-and-clinch unit 34 moves along the XY directions, the second insertion holes 186 of the slide body 170 and the through holes 226 of the circuit substrate 12 overlap in the vertical direction.

[0038] Next, the cut-and-clinch unit 34 rises by the operation of the Z-direction moving device 194 so that the upper surface of the movable portion 178 contacts the lower surface of the circuit substrate 12 or is positioned slightly below the lower surface of the circuit substrate 12. Thus, by controlling the operations of the X-direction moving device 190, the Y-direction moving device 192, and the Z-direction moving device 194, the cut-and-clinch unit 34 is disposed below the through hole 226 of the circuit substrate 12 in a state where the second insertion holes 186 of the slide body 170 and the through holes 226 of the circuit substrate 12 overlap.

[0039] Then, as the work heads 60 and 62 descend due to the operation of the Z-direction moving device 72, the leads 224 of the lead component 220 adsorbed and held by the adsorption nozzle 66 are inserted into the through holes 226 of the circuit base material 12. At this time, as shown in FIG. 7, the tip of the lead 224 inserted into the through hole 226 is inserted into the first insertion hole 180 of the fixed portion 176 through the second insertion hole 186 of the movable portion 178 of the cut-and-clinch unit 34. Next, when the tip of the lead 224 is inserted into the first insertion hole 180 of the fixed portion 176, the movable portion 178 slides due to the operation of the electromagnetic motor.

[0040] Thereby, the lead 224 is cut by the fixed blade 182 of the first insertion hole 180 and the movable blade 188 of the second insertion hole 186 so as to have the same length. Then, the new tip of the lead 224 due to cutting bends as the movable portion 178 slides. Thereby, the lead component 220 is mounted on the circuit base material 12 in a state where the lead 224 is prevented from coming out of the through hole 226.

[0041] In this way, in the component mounter 10, the cut-and-clinch unit 34 moves to an arbitrary position below the clamped circuit base material 12, so that the leads of the lead components mounted on the circuit base material 12 are bent by the cut-and-clinch unit 34. On the other hand, in the conventional mounter, a clamping device for clamping the substrate was disposed between the pair of transfer lanes 100 and 102, but in the component mounter 10, the cut-and-clinch unit 34 is disposed between the pair of transfer lanes 100 and 102. For this reason, in the component mounter 10, the clamping devices 106 and 108 for clamping the circuit base material 12 are disposed on the pair of transfer lanes 100 and 102. Thereby, even in the component mounter 10 in which the cut-and-clinch unit 34 is disposed between the pair of transfer lanes 100 and 102, the mounting operation can be performed on the clamped circuit base material 12.

[0042] In addition, in the substrate transfer and holding device 32, a conveyor belt is not disposed at the working position where the circuit substrate 12 is clamped, and a guide rail 130 that supports the circuit substrate 12 from below is disposed. Therefore, as shown in FIG. 5, it is possible to secure a space where nothing is disposed below the guide rail 130, and the cut-and-clinch unit 34 can be moved to that space, that is, below the guide rail 130. Thereby, the lead component 220 can be attached to the edge of the circuit substrate 12 clamped at the working position, and the cut-and-clinch unit 34 can be moved below the lead component 220 to bend the lead 224 of the lead component 220. That is, it becomes possible to attach the lead component 220 to the edge of the circuit substrate 12 clamped at the working position. On the other hand, the conveyor belt occupies a relatively large space due to a mechanism for circulating the conveyor belt, a space for winding the conveyor belt, and the like. Therefore, when the conveyor belt is disposed at the working position, the conveyor belt occupies the space below the edge of the circuit substrate clamped at the working position, and the cut-and-clinch unit 34 cannot be moved to the edge of the circuit substrate 12 below that circuit substrate 12. That is, when the conveyor belt is disposed at the working position, the lead component 220 cannot be attached to the edge of the circuit substrate 12 clamped at the working position. Thus, in the substrate transfer and holding device 32, by not disposing the conveyor belt and disposing the guide rail 130 at the working position where the circuit substrate 12 is clamped, the attachment of the lead component 220 to the edge of the circuit substrate 12 clamped at the working position is ensured.

[0043] However, when the conveyor belt is not disposed at the working position where the circuit substrate 12 is clamped and the guide rail 130 is disposed, it is necessary to dispose the shuttle device 104 at that working position, that is, to convey the circuit substrate 12 on the guide rail 130. As shown in FIG. 3, this shuttle device 104 is disposed on the upper surface side of the transport lane 100. However, in order to ensure the upward slide of the clamp plate 150 of the clamping device 106, it is disposed in a state of extending outside the clamp plate, that is, on the opposite side of the circuit substrate clamped by the clamp plate, avoiding the upper part of the clamp plate. That is, the shuttle device 104 is disposed on the side opposite to the transport lane 102 of the transport lane 100, in other words, outside the transport lane 102. Therefore, even if an attempt is made to dispose the shuttle device 104 while increasing the distance between the transport lane 100 and the transport lane 102, the shuttle device 104 becomes an obstacle, and the distance between the transport lane 100 and the transport lane 102 cannot be increased, and there may be a case where a circuit substrate 12 of a large size cannot be transported.

[0044] In such a case, instead of the substrate transfer and holding device 32, it is possible to use the substrate transfer and holding device 230 shown in FIG. 9. The substrate transfer and holding device 230 has a pair of transfer lanes 240, 242 and a pair of clamping devices 246, 248. Similar to the pair of transfer lanes 100, 102 of the substrate transfer and holding device 32, the pair of transfer lanes 240, 242 are disposed opposite to each other in the Y direction in a state of extending in the X direction. Since the pair of transfer lanes 240, 242 have substantially the same structure, the transfer lane 240 will be described as a representative.

[0045] The transfer lane 240, similar to the transfer lane 100 of the substrate transfer and holding device 32, is composed of a pair of support legs 252, 254 and a cross-linking member 256. The pair of support legs 252, 254 are erected in a separated state in the X direction, and the cross-linking member 256 is bridged over them so as to extend in the X direction. A conveyor belt 260 is wound around the cross-linking member 256 so as to extend in the X direction from one end to the other end in the X direction. That is, the conveyor belt 260 is wound around the cross-linking member 256 so as to extend in the X direction over the entire area from the upstream end to the downstream end. And the conveyor belt 260 circulates clockwise in FIG. 9 by the drive of the electromagnetic motor 262.

[0046] Thereby, the circuit substrate 12 supported by the conveyor belts 260 of the pair of transfer lanes 240, 242 is carried into the component mounter 10, conveyed from the upstream side to the downstream side of the substrate transfer and holding device 230, and carried out from the component mounter 10. That is, in the substrate transfer and holding device 230, the loading of the circuit substrate 12 into the component mounter 10, the transfer of the circuit substrate 12 inside the substrate transfer and holding device 230, and the unloading of the circuit substrate 12 from the component mounter 10 are executed only by the conveyor belts 260 provided in the pair of transfer lanes 240, 242 without using the shuttle device 104.

[0047] Also, a pair of clamp devices 246, 248 are arranged on the pair of transfer lanes 240, 242. That is, the clamp device 246 is arranged on the transfer lane 240, and the clamp device 248 is arranged on the transfer lane 242. Since the pair of clamp devices 246, 248 have substantially the same structure, the clamp device 246 will be described as a representative.

[0048] As shown in FIG. 10 and FIG. 11 which is a cross-sectional view taken along line BB of FIG. 10, the clamping device 106 has a clamping bar 270, a lift member 272, and an air cylinder 274. The clamping bar 270 is rod-shaped, and the length dimension of the clamping bar 270 is set to be approximately the same as the length dimension of the cross-linking member 256. And the clamping bar 270 is disposed in a state facing the conveyor belt 260 above the conveyor belt 260 wound around the cross-linking member 256.

[0049] Also, the lift member 272 generally has an elongated plate shape, and the longitudinal edge portions are bent in an L shape. Note that the length dimension of the lift member 272 is set to be approximately half of the length dimension of the cross-linking member 256. And the lift member 272 is disposed in a posture extending in the X direction below the central portion of the conveyor belt 260 in the X direction, and is held slidably in the vertical direction by the cross-linking member 256. In the lift member 272 disposed below the conveyor belt 260, the bent edge portions of the lift member 272 extend upward on the inner side of the conveyor belt 260, that is, on the same side as the circuit base material 12 supported by the conveyor belt 260. Further, the air cylinder 274 is disposed in a posture extending in the vertical direction outside the conveyor belt 260, that is, on the side opposite to the circuit base material 12 supported by the conveyor belt 260, and the rod 276 of the air cylinder 274 extends downward. And the lift member 272 is connected to the rod 276 of the air cylinder 274 outside the conveyor belt 260.

[0050] Therefore, when the air cylinder 274 extends, the lift member 272 slides downward, and when the air cylinder 274 contracts, the lift member 272 slides upward. Further, in a state where the lift member 272 is sliding downward, the bent edge of the lift member 272 extending inside the conveyor belt 260 descends below the upper surface of the conveyor belt 260. On the other hand, in a state where the lift member 272 is sliding upward, the bent edge of the lift member 272 extending inside the conveyor belt 260 rises above the upper surface of the conveyor belt 260.

[0051] With such a structure, as the air cylinder 274 extends, the lift member 272 slides downward, so that the bent edge of the lift member 272 descends below the upper surface of the conveyor belt 260, enabling the conveyor belt 260 to convey the circuit base material 12. On the other hand, as the air cylinder 274 contracts, the lift member 272 slides upward, causing the bent edge of the lift member 272 to rise above the upper surface of the conveyor belt 260. For this reason, when there is a circuit base material 12 above the lift member 272, the circuit base material 12 is lifted by the lift member 272. At this time, as shown in FIG. 11, the clamp bar 270 abuts against the upper surface of the circuit base material 12 lifted by the lift member 272. Thereby, the circuit base material 12 lifted from the conveyor belt 260 is clamped and held by the lift member 272 and the clamp bar 270. Then, as the air cylinder 274 extends, the lift member 272 slides downward, releasing the clamping by the lift member 272 and the clamp bar 270, and the circuit base material 12 is placed again on the conveyor belt 260.

[0052] That is, in the substrate conveyance and holding device 230, the circuit substrate 12 is carried into the component mounter 10 by the conveyor belt 260. At this time, when the air cylinder 274 extends and the lift member 272 is in the lowered state, and the circuit substrate 12 is conveyed by the conveyor belt 260 above the lift member 272, the conveyor belt 260 stops. Then, the air cylinder 274 contracts and the lift member 272 rises, so that the circuit substrate 12 is clamped by the lift member 272 and the clamp bar 270. Thus, operations by the work heads 60, 62, etc. are performed on the circuit substrate 12 clamped by the lift member 272 and the clamp bar 270. That is, the position where the circuit substrate 12 is clamped by the lift member 272 and the clamp bar 270 above the lift member 272 is the work position for the circuit substrate 12. Subsequently, when the operations on the circuit substrate 12 are completed, the air cylinder 274 extends and the lift member 272 descends, so that the clamping by the lift member 272 and the clamp bar 270 is released, and the circuit substrate 12 is placed on the conveyor belt 260. Then, by the conveyor belt 260, the circuit substrate 12 is conveyed toward the downstream side from the work position and carried out of the component mounter 10.

[0053] In this way, in the substrate transfer and holding device 230, without using a shuttle device, only by the conveyor belt 260, the loading of the circuit substrate 12 into the component mounter 10, the transfer of the circuit substrate 12 inside the substrate transfer and holding device 230, and the unloading of the circuit substrate 12 from the component mounter 10 are executed. As a result, in the substrate transfer and holding device 230, it is possible to dispose the transfer lane 240 at a distance corresponding to the installation space of the shuttle device, separated from the transfer lane 242, and it becomes possible to transfer a circuit substrate of a large size. That is, by disposing the transfer lane 240 at the position where the shuttle device 104 was disposed, the distance between the transfer lane 240 and the transfer lane 242 can be lengthened. Thereby, it becomes possible to transfer a circuit substrate of a large size. Also, in the substrate transfer and holding device 230, although the cut-and-clinch unit 34 is disposed between the pair of transfer lanes 240 and 242, the pair of clamp devices 246 and 248 for clamping the circuit substrate 12 are disposed on the pair of transfer lanes 240 and 242. Thereby, also in the component mounter 10 in which the cut-and-clinch unit 34 is disposed between the pair of transfer lanes 240 and 242, the mounting operation of the electronic circuit components can be performed on the clamped circuit substrate 12.

[0054] Incidentally, the component mounter 10 is an example of a substrate processing machine. The circuit substrate 12 is an example of a substrate. The cut-and-clinch unit 34 is an example of a bending device. The transfer lanes 100 and 102 are examples of transfer lanes. The clamp devices 106 and 108 are examples of clamp devices. The first conveyor belt 120 and the second conveyor belt 122 are examples of conveyor belts. The clamp plate 150 is an example of a clamp member. The lead component 220 is an example of a lead component. The lead 224 is an example of a lead. The transfer lanes 240 and 242 are examples of transfer lanes. The clamp devices 246 and 248 are examples of clamp devices. The conveyor belt 260 is an example of a conveyor belt. The clamp bar 270 is an example of a clamp member. The lift member 272 is an example of a lift member.

[0055] Note that the present invention is not limited to the above embodiments, and can be implemented in various forms with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, the first conveyor belt 120 and the second conveyor belt 122 are arranged on the upstream side and the downstream side of the transport lanes 100 and 102, and the guide rail 130 is disposed therebetween. On the other hand, a conveyor belt may be arranged only on one of the upstream side and the downstream side of the transport lanes 100 and 102, and the guide rail 130 may be disposed on the other transport lanes 100 and 102. Further, a conveyor belt and the guide rail 130 are disposed on the transport lanes 100 and 102, and only the conveyor belt 260 is disposed on the transport lanes 240 and 242, but only the guide rail 130 may be disposed on the transport lanes. In this case, the circuit substrate 12 is transported along the guide rail 130 only by the shuttle device.

[0056] In the above embodiments, the upper and lower surfaces of the circuit substrate 12 are clamped by being sandwiched from the vertical direction, but the two edges of the circuit substrate 12 transported by the transport lane may be clamped by being sandwiched from the horizontal direction.

[0057] In the above embodiments, the lift member 272 is applied to the substrate transport and holding device 230, and the circuit substrate 12 placed on the conveyor belt 260 is lifted by the lift member 272. However, the lift member 272 may be applied to the substrate transport and holding device 32, and the circuit substrate 12 placed on the guide rail 130 may be lifted by the lift member 272. Then, the circuit substrate 12 may be clamped by the lift member 272 and the clamp plate 150.

[0058] In the above embodiments, the cut and clinch unit 34 that cuts and bends the lead 224 of the lead component 220 is adopted, but a device that bends the lead 224 without cutting it may be adopted. Even when such a device is adopted, since the device is disposed between a pair of transport lanes, it is possible to achieve the same effect as the above embodiments.

Explanation of Reference Numerals

[0059] 10: Component mounting machine (substrate working machine) 12: Circuit substrate (substrate) 34: Cut and clinch unit (bending device) 100: Conveyor lane 102: Conveyor lane 106: Clamping device 108: Clamping device 120: First conveyor belt 122: Second conveyor belt 150: Clamping plate (clamping member) 220: Lead component 224: Lead 240: Conveyor lane 242: Conveyor lane 246: Clamping device 248: Clamping device 260: Conveyor belt 270: Clamping bar 272: Lift member

Claims

1. A pair of transfer lanes each including a conveyor belt that contacts the lower surface of a substrate and transfers the substrate, and a clamping device that operates an air cylinder provided therein to raise a lift member, thereby lifting and separating the substrate from the conveyor belt, and raising and clamping the substrate until a clamp member abuts against the upper surface of the separated substrate. A bending device disposed between the pair of transfer lanes and configured to bend leads of lead components mounted on substrates transferred by the pair of transfer lanes. Comprising: When the direction in which the pair of transfer lanes extends is defined as the X direction and the direction in which they face each other is defined as the Y direction, the air cylinder is disposed outside the Y direction with respect to the substrate supported by the conveyor belt. The bending device is: A substrate-facing working machine that is moved and positioned at an arbitrary position between the pair of transfer lanes by driving an electromagnetic motor provided in a unit moving device below the substrate clamped by the clamping device, and is capable of bending the leads of lead components inserted into through-holes of the substrate and mounting the lead components on the substrate.

2. The bending device is: The substrate-facing working machine according to claim 1, which rotates at an arbitrary angle about a vertical axis by a rotating device.