Resin composition and structure

Abstract

To provide a resin composition that can improve color fastness.SOLUTION: A resin composition contains epoxy resin, an acid anhydride, and a latent crosslinker. The latent crosslinker contains an aminophenyl phosphine compound in which a trivalent P element has an N-P bond.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition and a structure. [Background technology]

[0002] Various developments have been made so far regarding epoxy resin compositions. For example, the technology described in Patent Document 1 is known as an example of this type of technology. Patent Document 1 describes the use of an imidazole-type latent curing agent such as 2-ethyl-4-methylimidazole in an epoxy resin composition (e.g., claims 1 and 5, paragraph 0043 of Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-256483 Summary of the Invention [Problem to be solved by the invention]

[0004] However, as a result of investigations by the present inventors, it has been found that the epoxy resin composition described in Patent Document 1 has room for improvement in terms of discoloration resistance. [Means for solving the problem]

[0005] As a result of intensive research conducted by the present inventors in light of the above circumstances, they found that the discoloration resistance of a resin composition containing an epoxy resin and an acid anhydride can be improved by using, as a latent crosslinking agent, an aminophosphine compound in which a trivalent P element has an N-P bond, and thus completed the present invention.

[0006] According to the present invention, Epoxy resin, an acid anhydride, a latent crosslinking agent; The latent crosslinking agent contains an aminophosphine compound in which a trivalent P element has an N-P bond. A resin composition is provided.

[0007] Further, according to the present invention, A structure is provided that includes a cured product of the above resin composition. [Effects of the Invention]

[0008] According to the present invention, there are provided a resin composition capable of improving discoloration resistance, and a structure using the same. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view showing an example of the configuration of an optical semiconductor device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by similar reference numerals, and descriptions thereof will be omitted where appropriate. Furthermore, the drawings are schematic diagrams and do not correspond to actual dimensional proportions.

[0011] The resin composition of this embodiment will be outlined below.

[0012] The resin composition of the present embodiment contains an epoxy resin, an acid anhydride, and a latent crosslinking agent, and the latent crosslinking agent contains an aminophosphine compound in which a trivalent P element has an N-P bond.

[0013] According to the findings of the present inventors, it has been found that an aminophosphine compound in which a trivalent P element has an N-P bond (hereinafter, sometimes simply referred to as an "aminophosphine compound") not only functions as a latent crosslinking agent in the polymerization reaction of an epoxy resin, but also can improve the discoloration resistance of a resin composition containing an epoxy resin and an acid anhydride.

[0014] Although the detailed mechanism is unclear, it is thought that in epoxy / acid anhydride resin compositions, the aminophosphine compound promotes the ring-opening of acid anhydride or epoxy groups, and the ring-opening compound promotes the propagation reaction, thereby accelerating the curing reaction. Furthermore, in epoxy / acid anhydride resin compositions, the aminophosphine compound reacts with the resin and is incorporated into the resin skeleton as a stable structure that is resistant to oxidation, which is thought to improve discoloration resistance.

[0015] According to this embodiment, by using an aminophosphine compound as a latent crosslinking agent, it is possible to improve discoloration resistance and curing acceleration properties of the resin composition.

[0016] In addition, in the resin composition of this embodiment, the resin composition is formed into a film having a thickness of 300 mmt, and the yellow index immediately after the film is formed as determined in accordance with JIS K 7373 is defined as YI0, and the yellow index after the film is heat-treated at 180°C for 4 hours is defined as YI 180 The resin composition is formed into a film having a thickness of 300 mmt, and the transmittance of the film at 400 nm immediately after the film is produced, as determined using a spectrophotometer, is defined as I0, and the transmittance of the film at 400 nm after heat treatment at 180°C for 4 hours is defined as I1. I 180 Let's say.

[0017] An example of the resin composition is |YI 180 -YI0| may be configured to be 20.0 or less. |YI 180 The upper limit of -YI0| is, for example, 20.0 or less, preferably 10.0 or less, more preferably 5.0 or less, and still more preferably 3.0 or less, which can improve the discoloration resistance of the cured product of the resin composition. |YI 180 The lower limit of -YI0| is not particularly limited, but may be 0 or greater.

[0018] An example of a resin composition is |I 180 - I0| may be configured to be 50% or less. |I 180 - I The upper limit of |0| is, for example, 50% or less, preferably 30% or less, and more preferably 15% or less, which can improve the transparency of the cured product of the resin composition. |I 180 - I The lower limit of 0| is not particularly limited, but 0 % It may be more than that.

[0019] Also, I 180 The lower limit is, for example, 50% or more, preferably 60% or more, and more preferably 70% or more. On the other hand, I 180 The upper limit of is not particularly limited, but may be 100% or less, or 99% or less.

[0020] The resin composition can be used, for example, as a component for optical semiconductor devices such as LED elements and LED displays, specifically as a transparent material for optical components and reflectors.

[0021] The resin composition of this embodiment will be described in detail below.

[0022] (epoxy resin) The resin composition is a thermosetting epoxy resin composition containing an epoxy resin. The epoxy resin is a compound having two or more epoxy groups in one molecule, and can be a monomer, oligomer, or polymer in general, with no particular limitation on its molecular weight or molecular structure. These may be used alone or in combination of two or more.

[0023] Examples of epoxy resins include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylenediisopridiene)bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisopridiene)bisphenol type epoxy resin), and bisphenol Z type epoxy resin (4,4'-cyclohexidienebisphenol type epoxy resin); phenol novolac type epoxy resin, cresol novolac type epoxy resin, trisphenol group methane type novolac type epoxy resin, and tetraphenol group ethane type novolac type epoxy resin. Examples of epoxy resins include novolac-type epoxy resins such as epoxy resins and novolac-type epoxy resins having a condensed ring aromatic hydrocarbon structure; biphenyl-type epoxy resins; aryl alkylene-type epoxy resins such as xylylene-type epoxy resins and biphenyl aralkyl-type epoxy resins; naphthalene-type epoxy resins such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene diol-type epoxy resins, difunctional to tetrafunctional epoxy-type naphthalene resins, binaphthyl-type epoxy resins, and naphthalene aralkyl-type epoxy resins; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; fluorene-type epoxy resins, and epoxy resins containing an isocyanuric acid skeleton. These may be used alone or in combination of two or more. Among these, the epoxy resin may include one or more selected from the group consisting of bisphenol A type epoxy resins, novolac type epoxy resins, biphenyl aralkyl type epoxy resins, and isocyanuric acid skeleton-containing epoxy resins, and preferably includes bisphenol A type epoxy resins.

[0024] The content of the epoxy resin can be appropriately selected depending on the application.

[0025] The resin composition may contain other thermosetting resins in addition to the epoxy resin, but does not necessarily have to contain other thermosetting resins. Other thermosetting resins include, for example, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, bismaleimide resins, acrylic resins, and phenol derivatives and their derivatives. These thermosetting resins can be any monomer, oligomer, or polymer having two or more reactive functional groups per molecule, and their molecular weights and molecular structures are not particularly limited. These resins may be used alone or in combination of two or more.

[0026] (hardening agent) The resin composition includes a curing agent for the epoxy resin. Such a curing agent includes at least an acid anhydride.

[0027] Examples of acid anhydride curing agents include alicyclic acid anhydrides such as phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, hexahydro-3-methylphthalic anhydride, hexahydro-4-methylphthalic anhydride, and methyltetrahydrophthalic anhydride, and aromatic acid anhydrides such as trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic acid, etc. These may be used alone or in combination of two or more. Among these, from the viewpoint of further improving discoloration resistance, it is preferable to use an acid anhydride having a cyclic structure in the molecule.

[0028] The curing agent may contain a curing agent other than the acid anhydride, if necessary, and known curing agents such as polyaddition type curing agents, catalyst type curing agents, and condensation type curing agents may be used as the other curing agents.

[0029] The content of the curing agent can be appropriately set depending on the content of the epoxy resin.

[0030] (latent crosslinking agent) Latent crosslinkers include aminophosphine compounds.

[0031] The aminophenylphosphine compound has, in its molecule, a trivalent P element, an N-P bond in which the N atom of the N-atom-containing group directly bonds to the trivalent P element, and a phenyl group. The trivalent P element may be bonded to the phenyl group directly or via a linking group. The N atom-containing group may be any reactive functional group that is reactive with the epoxy resin or the curing agent.

[0032] The aminophosphine compound may include a compound having a structure of the following general formula (I): These may be used alone or in combination of two or more.

[0033] (R a ) m -P-(NR b R c ) n ·General formula (I)

[0034] In the above general formula (I), R a , R b , and R c may be the same or different and are independently any of a hydrogen atom, a substituted or unsubstituted aliphatic group, a substituted or unsubstituted aromatic group, and a group containing a substituted or unsubstituted heterocycle; R a , R b , and R c Two or more of any of the above groups may be bonded to each other to form a ring, n is an integer of 1 to 3, each m is independently an integer of 0 to 2, and the sum of m and n is 3.

[0035] Examples of the aliphatic group include linear, branched, or cyclic, saturated or unsaturated aliphatic hydrocarbon groups having 1 to 20 carbon atoms. The aliphatic hydrocarbon group may contain a heteroatom such as a nitrogen atom or an oxygen atom within the group.

[0036] Examples of aromatic groups (aryl groups) include phenyl groups and naphthyl groups.

[0037] The substitution may be such that one or more of substituents such as an alkyl group, an alkoxy group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, or an aryl group are bonded to any atom in the group, or one or more of the atoms in the group may be replaced with a heteroatom such as a nitrogen atom or an oxygen atom.

[0038] R b and R c may each contain at least one of a ring, an unsaturated bond, a nitrogen atom, and an oxygen atom in the group, and may be bonded to each other to form a ring.

[0039] The ring may include one or more of an alicyclic ring, an aromatic ring, and a heterocyclic ring. When two or more rings are included, they may be bonded via a single bond or an alkyl group, or may be fused together to form a fused ring. The ring may be unsubstituted or substituted. Examples of the alicyclic ring include monocyclic rings such as cycloalkanes, and bicyclic rings such as decahydronaphthalene. Examples of the aromatic ring include a benzene ring, a naphthalene ring, and an anthracene ring. The heterocyclic ring may be saturated or unsaturated, and includes three-, four-, five-, and six-membered rings containing one or more heteroatoms such as nitrogen or oxygen atoms.

[0040] The aminophenylphosphine compound may contain one or more compounds of the general formula (I) where n is any one of 1 to 3, and preferably a compound where n is 2. By setting n to 2 or more, curability can be improved. By setting n to 2 or less, stability can be improved.

[0041] The aminophosphine compound is a compound represented by the general formula (I) in which m is 1 and R a is a phenyl group. This can improve the oxidation resistance of the latent crosslinker in the resin composition compared to when a compound without an N-P bond, such as 4-methylpiperidine, is used. At this time, R b and Rc The rings formed by bonding these two groups may be the same or different. From the viewpoint of curability, the ring preferably has two or more nitrogen atoms therein.

[0042] The aminophosphine compound may include a compound having a structure of the following general formula (II): These may be used alone or in combination of two or more.

[0043] [ka]

[0044] In the general formula (II), R1, R2, R3, and R4 may be the same or different and each independently represent a hydrogen atom, a substituted or unsubstituted aliphatic group, a substituted or unsubstituted aromatic group, or a group containing a substituted or unsubstituted heterocycle. Either R1 and R2, or R3 and R4, may be bonded to each other to form a ring. Examples of the aliphatic group, aromatic group, and ring in general formula (II) may be the same as those in general formula (I).

[0045] In addition, -NR1R2 and -NR3R4 in the general formula (II) may each be composed of the same or different functional groups, or may each constitute one functional group.

[0046] At least one of the functional groups R1, R2, R3, and R4 may or may not have a ring within the group. When a ring is present, at least one of R2 and R4 may have a group with the same structure as R1 and R3, or may have a different group, which may be a hydrogen atom or an alkyl group such as a methyl group. The ring contained in the group of R1, R2, R3, and R4 may be configured to include an N atom in the above general formula (II), or may be configured to bond to the N atom via an alkyl group such as a methyl group or an ethyl group.

[0047] The functional group may also have a ring formed by bonding two groups, R1 and R2, and two groups, R3 and R4, to each other.

[0048] An example of a functional group is shown below. In the examples, the bond of the N element in -NR1R2 and -NR3R4 is indicated by a wavy line.

[0049] [ka]

[0050] Among the above aminophosphine compounds, from the viewpoint of further improving discoloration resistance, it is preferable to use an aminophosphine compound having a structure in which all N atoms present in the molecule are directly bonded to P atoms, as in the functional groups exemplified above.

[0051] The lower limit of the content of the aminophosphine compound in the resin composition is, for example, 0.3 mol% or more, preferably 0.5 mol% or more, and more preferably 1.0 mol% or more, relative to 100 mol% of the acid anhydride content, which can improve the discoloration resistance of the resin composition. On the other hand, the lower limit of the content of the aminophosphine compound in the resin composition is, for example, 12 mol % or less, preferably 10 mol % or less, relative to 100 mol % of the acid anhydride content, which can suppress a decrease in heat resistance of the resin composition.

[0052] The resin composition may contain an organic base in addition to the aminophosphine compound, if necessary. As the organic base, an amine-based curing accelerator or a phosphorus-based curing accelerator may be used. Examples of organic bases that can be used include compounds having a heterocyclic structure containing a heteroatom such as a nitrogen atom or a phosphorus atom, compounds having a structure in which an aromatic group is bonded to a heteroatom, etc. These may be used alone or in combination of two or more.

[0053] Examples of organic bases include organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds. Examples of organic phosphines include primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; and tertiary phosphines such as trimethylphosphine, triethylphosphine, tributylphosphine and triphenylphosphine.

[0054] Examples of organic bases include imidazoles, heterocyclic amines such as pyridine, dimethylaminopyridine, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), and N,N-dimethyl-4-aminopyridine (DMAP); and other primary, secondary, and tertiary amines. Examples of imidazoles include 2-phenylimidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0055] Examples of organic bases include phosphorus / nitrogen-containing phosphazene derivatives.

[0056] The resin composition may contain a filler. As the filler, an inorganic filler or an organic filler is used. Examples of inorganic fillers include silica such as fused crushed silica, fused spherical silica, crystalline silica, secondary agglomerated silica, and finely divided silica; metal compounds such as alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, silicon carbide, aluminum hydroxide, magnesium hydroxide, and titanium white; talc; clay; mica; glass fiber; etc. These may be used alone or in combination of two or more.

[0057] (Other ingredients) The resin composition may contain, as needed, one or more of various additives such as a coupling agent, a fluidity imparting agent, a mold release agent, an ion scavenger, a curing accelerator other than an organic base, a stress reducing agent, a colorant, and a flame retardant.

[0058] Specific examples of coupling agents include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy silanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; styryl silanes such as p-styryltrimethoxysilane; methacryl silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; acryl silanes such as 3-acryloxypropyltrimethoxysilane; N-2-(aminoethyl)-3-amino Examples of suitable coupling agents include aminosilanes such as N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and phenylaminopropyltrimethoxysilane; isocyanurate silanes; alkyl silanes; ureidosilanes such as 3-ureidopropyltrialkoxysilane; mercaptosilanes such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate silanes such as 3-isocyanatopropyltriethoxysilane; titanium compounds; aluminum chelates; and aluminum / zirconium compounds. The coupling agent may be one or more of the above specific examples.

[0059] The fluidity imparting agent can suppress the reaction of non-latent curing accelerators such as phosphorus atom-containing curing accelerators during melt-kneading of the resin composition, thereby improving the productivity of the resin composition. Specific examples of the fluidity imparting agent include compounds in which hydroxyl groups are bonded to two or more adjacent carbon atoms constituting an aromatic ring, such as catechol, pyrogallol, gallic acid, gallic acid esters, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and derivatives thereof.

[0060] Specific examples of the release agent include natural waxes such as carnauba wax, synthetic waxes such as Montan acid ester wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and metal salts thereof, paraffin, carboxylic acid amides such as erucic acid amide, etc. One or more of the above specific examples can be blended as the release agent.

[0061] Specific examples of the ion scavenger include hydrotalcites such as hydrotalcite and hydrotalcite-like substances, and hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium. One or more of the above specific examples can be blended as the ion scavenger.

[0062] As the curing accelerator, for example, other curing accelerators than the above organic bases may be used.

[0063] Specific examples of the low stress agent include silicone compounds such as silicone oil and silicone rubber, polybutadiene compounds, and acrylonitrile-butadiene copolymer compounds such as acrylonitrile-carboxyl group-terminated butadiene copolymer compounds. One or more of the above specific examples can be blended as the low stress agent.

[0064] Specific examples of the colorant include carbon black, red iron oxide, titanium oxide, etc. One or more of the above specific examples of the colorant may be blended.

[0065] Specific examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate, phosphazene, carbon black, etc. One or more of the above specific examples can be blended as the flame retardant.

[0066] The resin composition of the present embodiment may be a liquid resin composition or a solid resin composition at 25°C. The solid resin composition may be in the form of, for example, granules, powder, tablets, or sheets.

[0067] A method for producing the resin composition of this embodiment will be described. The method for producing the resin composition includes a mixing step of mixing the above-mentioned raw material components.

[0068] In the mixing step, the mixing method is not limited, and a known method can be used depending on the components used. For example, a mixer or the like can be used as a mixing method. If necessary, after mixing, the components can be melt-kneaded using a kneading machine such as a roll, kneader, or extruder.

[0069] A structure using the resin composition of this embodiment will be described.

[0070] The structure of this embodiment includes a cured product of the above-described resin composition. As an example of the structure, an optical semiconductor device will be given with reference to FIG. FIG. 1 is a cross-sectional view showing an optical semiconductor device 100. As shown in FIG.

[0071] An example of an optical semiconductor device 100 includes an optical semiconductor element 5 mounted on a mounting portion 1, a wiring portion 2 electrically connected to the semiconductor element 5, a transparent sealing material 8 that seals the optical semiconductor element 5, and reflecting members 3A and 3B. The transparent sealing material 8 and / or the reflecting members 3A and 3B are made of a cured product of the above-mentioned resin composition.

[0072] The mounting portion 1 is, for example, a lead frame. An optical semiconductor element 5 may be adhered onto the mounting portion 1 via a die attach material 6, for example.

[0073] Examples of the optical semiconductor element 5 include light-emitting elements such as LEDs (Light Emitting Diodes), liquid crystal display elements, and semiconductor laser elements using compound semiconductors; and light-receiving elements such as photocouplers.

[0074] The wiring portion 2 may be configured to be electrically connected to the optical semiconductor element 5 through a bonding wire 7 made of a metal such as gold, silver, or copper.

[0075] Reflecting member 3A is formed so as to surround mounting portion 1 (optical semiconductor element 5), and may be formed so that the surface facing mounting portion 1 is inclined outward. Reflecting member 3B may be formed so as to fill the gap between mounting portion 1 and wiring portion 2. Reflecting member 3A and reflecting member 3B may be formed integrally.

[0076] The transparent sealing material 8 may contain a phosphor or a filler as needed, but is not limited to this.

[0077] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0078] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the descriptions of these examples.

[0079] The information on the raw material ingredients in Table 1 is shown below. (epoxy resin) Epoxy resin 1: Bisphenol A epoxy resin (liquid at 25°C) Epoxy resin 2: Biphenyl aralkyl epoxy resin (solid at 25°C) Epoxy resin 3: Novolac type epoxy resin (solid at 25°C) Epoxy resin 4: Isocyanuric acid skeleton-containing epoxy resin (triglycidyl isocyanurate, solid at 25°C) (hardening agent) Acid anhydride 1: Hexahydro-4-methylphthalic anhydride (liquid at 25°C)

[0080] (latent crosslinking agent)

[0081] Latent crosslinker 1: Aminophosphine compound (solid at 25°C) represented by the following chemical formula

[0082] [ka]

[0083] Latent crosslinker 2: Aminophosphine compound represented by the following chemical formula (liquid at 25°C)

[0084] [ka]

[0085] (organic base) Organic base 1: 2-ethyl-4-methylimidazole (2E4MZ)

[0086] <Preparation of Resin Composition> (Examples 1 to 13, Comparative Examples 1 to 3) When either the epoxy resin or the curing agent contained a liquid component, the blended raw material components were measured according to the blending ratio (by weight) in Table 1 and mixed using a planetary centrifugal mixer to obtain a liquid resin composition.

[0087] [Table 1]

[0088] The resulting resin compositions were evaluated based on the following evaluation items.

[0089] (DSC) Using a differential scanning calorimeter (Seiko Instruments DSC-6100), a DSC curve was measured for 10 mg of the resin composition in a nitrogen stream at a temperature rise rate of 5°C / min over a temperature range of 0°C to 250°C. The exothermic onset temperature (Onset) was determined from the obtained DSC curve.

[0090] (flow time) A reference resin composition was prepared using the same raw material components and component ratios as those of the resin compositions of Examples 1 and 4, except that it did not contain a latent crosslinking agent. The flow time (seconds) of the above resin composition and the reference resin composition at 120° C. was measured using a rheometer (cone-plate type viscometer (manufactured by Toa Kogyo Co., Ltd., serial number CV-1S)). The resin compositions of Examples 1 and 4 showed longer flow times than the corresponding reference resin compositions, confirming that aminophosphine compounds 1 and 2 function as latent crosslinking agents.

[0091] [0] The resin composition obtained in Example 1 was heat-treated in a mold at 120°C for 1 hour, then released from the mold and further heat-treated at 170°C for 1 hour to prepare a sample for evaluation. The resin compositions obtained in Examples 2 to 13 and Comparative Examples 1 to 3 were heat-treated in a mold at 120°C for 1 hour, then released from the mold and further heat-treated at 150°C for 1 hour to prepare evaluation samples. (Td5: 5% weight loss temperature) Using a thermogravimetric and differential thermal analyzer (Seiko Instruments, TG / DTA6200), the evaluation sample was heated from 30°C to 800°C at a heating rate of 10°C / min in a dry nitrogen stream, and the temperature (Td5) at which the sample loses 5% weight was calculated. The evaluation samples were dried at 100° C. for 1 hour immediately before the measurement.

[0092] (transmittance) The resin composition obtained above was placed in a PET film frame and subjected to pressure and heat treatment at 120°C for 30 minutes at 0.3 MPa. After demolding, it was further heat treated at 150°C for 1 hour to produce a freshly prepared film having a thickness of 300 μm. The optical absorption spectra in the wavelength range of 190 nm to 800 nm were measured using a spectrophotometer (Shimadzu UV-2400PC) for each of the following films: Film 1 immediately after production; Film 2, which was obtained by subjecting the immediately produced film to heat treatment at 180°C for 4 hours; and Film 3, which was obtained by subjecting the immediately produced film to heat treatment at 230°C for 30 minutes. The transmittance (%) at 400 nm and 500 nm was calculated.

[0093] (Yellow Index: YI) The resin composition obtained above was placed in a PET film frame and subjected to pressure and heat treatment at 120°C for 30 minutes at 0.3 MPa. After demolding, it was further heat treated at 150°C for 1 hour to produce a freshly prepared film having a thickness of 300 μm. The XYZ tristimulus values were measured using a spectrophotometer (Shimadzu UV-2400PC) for each of the following films: Film 1 immediately after production; Film 2, which was obtained by heating the immediately produced film at 180°C for 4 hours; and Film 3, which was obtained by heating the immediately produced film at 230°C for 30 minutes. In accordance with JIS K 7373, the measured XYZ tristimulus values were introduced into the calculation formula YI = 100 (1.2985X - 1.1335Z) / Y, which is used when using the XYZ color system with standard illuminant D65, to determine the YI (yellow index).

[0094] The resin compositions of Examples 1 to 13 showed a smaller change in YI between when heated at 230° C. for 30 minutes and immediately after preparation than those of Comparative Examples 1 to 3, and therefore showed improved discoloration resistance. Furthermore, the resin compositions of the examples can be suitably used for components constituting optical semiconductor devices because the variations in optical properties are suppressed even after reflow. [Explanation of symbols]

[0095] 1 Mounting section 2 Wiring section 3A, 3B Reflective material 5. Optical semiconductor elements 6 Die attach material 7 Bonding Wire 8 Transparent encapsulant 100 Optical semiconductor device

Claims

1. Epoxy resin, an acid anhydride, a latent crosslinking agent; the latent crosslinking agent contains an aminophosphine compound in which a trivalent P element has an N-P bond; The resin composition, wherein the aminophosphine compound comprises a compound having a structure of the following general formula (I): (R a ) m -P-(NR b R c ) n...General formula (I) (In the above general formula (I), R a is a phenyl group; R b and R c may be the same or different and each independently represent a hydrogen atom, a substituted or unsubstituted aliphatic group, a substituted or unsubstituted aromatic group, or a group containing a substituted or unsubstituted heterocycle; R b and R c may be bonded to each other to form a ring; R b and R c may contain a nitrogen element; n is 2; and m is 1.)

2. The resin composition according to claim 1, A resin composition, wherein the aminophosphine compound has a structure in which all N atoms present in the molecule are directly bonded to P atoms.

3. The resin composition according to claim 1 or 2, The resin composition was formed into a film having a thickness of 300 mm, and the yellow index of the film immediately after the film was formed was determined in accordance with JIS K 7373. ０ The film was heat-treated at 180° C. for 4 hours, and the yellow index was determined as YI １８０ Then, |YI １８０ -YI ０ A resin composition configured so that | is 20.0 or less.

4. The resin composition according to any one of claims 1 to 3, The resin composition was formed into a film having a thickness of 300 mmt, and the transmittance of the film at 400 nm immediately after the film was formed was measured as I ０ After heat treatment at 180° C. for 4 hours, the transmittance at 400 nm was I １８０ When this is the case, |I １８０ A resin composition configured so that −I 0| is 50% or less.

5. The resin composition according to any one of claims 1 to 4, The resin composition contains at least one acid anhydride selected from the group consisting of phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, hexahydro-3-methylphthalic anhydride, hexahydro-4-methylphthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic acid.

6. A structure comprising a cured product of the resin composition according to any one of claims 1 to 5.

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