Apparatus for performing plasma processing and method for performing plasma processing

JP7722211B2Active Publication Date: 2025-08-13TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2022018926
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-09
Publication Date
2025-08-13
Estimated Expiration
2042-02-09

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Abstract

To provide a technique of performing a plasma treatment by supplying a low-energy charged particle, neutral particle or radical to a substrate from the plasmatized treatment gas.SOLUTION: When performing a plasma treatment by supplying plasmatized treatment gas to a substrate on a placement table provided in a processing container, a plurality of plasma formation spaces which are cylindrical spaces formed between tubular wall surfaces arranged so as to be opposed to each other in a double tube shape and each have a plasma formation mechanism for plasmatizing the treatment gas are formed on the upper side of the placement table. A treatment gas supply unit supplies the treatment gas along the axial direction of the plasma formation spaces. A ring-shaped regulation member regulates the flow such that the flow direction of the treatment gas flowing out from each plasma formation space heads in the radial direction of the plasma formation space, and forms a throttling passage having a smaller area than the plasma formation space between a member constituting the one side of the tubular wall surface and itself.SELECTED DRAWING: Figure 3
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Citation Information

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