Semiconductor device and manufacturing method

JP7722487B2Active Publication Date: 2025-08-13FUJI ELECTRIC CO LTD
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Patent Information

Application Number
JP2024016677
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-09-02
Filing Date
2024-02-06
Publication Date
2025-08-13
Estimated Expiration
2039-10-11

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Abstract

To solve such a problem that it is preferable that a donor concentration and a range of a donor area generated by coupling of a crystal defect with hydrogen are highly accurately controlled.SOLUTION: A semiconductor device comprising a semiconductor substrate having an upper surface and a lower surface is provided, including: a first donor concentration peak of which the donor concentration distribution is provided in a first depth in a depth direction connecting the upper surface and the lower surface of the semiconductor substrate; a second donor concentration peak which is provided in second depth on the upper surface side from the first donor concentration peak, and of which the concentration is lower than the first donor concentration peak; a flatness region where the donor concentration distribution is actually flat between the first donor concentration peak and the second donor concentration peak of which, and a thickness in the depth direction is 10% or larger of the thickness of the semiconductor substrate; and a plurality of donor concentration peaks provided on the lower surface side from the first donor concentration peak.SELECTED DRAWING: Figure 7
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Citation Information

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