Semiconductor wafer manufacturing method

Abstract

To provide a method for manufacturing a semiconductor wafer that can efficiently process a semiconductor wafer with a small diameter and can be applied to a processor for a semiconductor wafer with a large diameter.SOLUTION: The method for manufacturing a semiconductor wafer includes an extraction step of extracting plural second semiconductor wafers W2 with a small diameter from a first semiconductor wafer W1 with a large diameter. In the extraction step, a first semiconductor wafer W1 is divided into a plurality of second semiconductor wafers W2 and a frame part 1 formed after the second semiconductor wafers W2 are extracted. The plurality of second semiconductor wafers W2 are arranged in hole parts 10 of the frame part 1, and a fixation tape 2 is attached to the frame part 1 and one of the front surface and the back surface of the second semiconductor wafers W2 in that state to integrate the frame part 1 and the semiconductor wafers W2 together.SELECTED DRAWING: Figure 1

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