Composition

Abstract

The present application relates to a composition and its use. The present application provides a composition that can be cured at room temperature and can form a heat dissipation material that exhibits an appropriate level of hardness, low adhesive strength, and excellent thermal conductivity. In addition, the present application can achieve the low adhesive strength without using a plasticizer, or with a minimized usage ratio even if a plasticizer is used. The present application also provides a product including the composition or a cured product thereof.

Description

[Technical Field]

[0001] The present application relates to compositions. [Background technology]

[0002] As the number of electrical or electronic devices that require heat management, such as batteries, increases, the importance of heat dissipation materials is increasing.

[0003] A typical conventionally known heat dissipation material is a material in which a thermally conductive filler is filled into a resin binder (for example, Patent Document 1). In the heat dissipating material as described above, silicone resin, polyolefin resin, acrylic resin, epoxy resin, or the like is usually used as the resin binder.

[0004] A heat dissipation material is basically required to have excellent thermal conductivity, and additional functions are required depending on the application. For example, depending on the application, a heat dissipation material is required to have high thermal conductivity as well as low adhesive strength to a specific adherend. For example, if a part in a product that comes into contact with the heat dissipation material needs to be replaced, or if the position of the heat dissipation material needs to be changed during processing, the heat dissipation material needs to exhibit low adhesive strength.

[0005] Among known heat dissipation materials, materials that exhibit low adhesive strength include those that use silicone resin as a resin binder. However, silicone resin is relatively expensive. Furthermore, silicone resin contains components that can cause contact failure when applied to electronic / electrical products, limiting its applications.

[0006] The polyurethane material used in Patent Document 1 can be used to form a heat dissipation material with high thermal conductivity and has various other advantages, but it is a material that exhibits high adhesive strength to most adherends, and it is not easy to realize low adhesive strength with materials such as acrylic resin and epoxy resin. One way to reduce the adhesive strength of materials that exhibit high adhesive strength is to add a plasticizer, but the plasticizers added to control adhesive strength have problems such as impairing the inherent advantages of the material itself and being leached out during use.

[0007] It is necessary for the heat dissipation material to have an appropriate level of hardness. For example, if the heat dissipation material is too hard, the material itself tends to become excessively brittle, making it difficult to apply when shock resistance, vibration resistance, durability, etc. are required.

[0008] When forming a heat-dissipating material using a curable composition, the composition is required to have room temperature curing properties depending on the application. This is because it is often difficult to apply the heat, electromagnetic waves, or moisture required for curing during the process of forming the heat-dissipating material in electrical or electronic devices that require heat management. However, it is difficult to obtain a material that can be cured at room temperature, has an appropriate level of hardness after curing, exhibits low adhesive strength to specific substrates (e.g., metal materials), and ensures high thermal conductivity. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Korean Patent Publication No. 2016-0105354 Summary of the Invention [Problem to be solved by the invention]

[0010] The present application aims to provide a composition. One object of the present application is to provide a composition that, when curable, can be cured at room temperature to form a heat dissipation material that exhibits an appropriate level of hardness, low adhesive strength, and excellent thermal conductivity. Another object of the present application is to achieve the low adhesive strength without using plasticizers or, if used, by minimizing their use ratio. Another object of the present application is to provide a product containing the composition or a cured product thereof. [Means for solving the problem]

[0011] In the present specification, when the measurement temperature affects the results of a physical property, the physical property is measured at room temperature unless otherwise specified. The term "room temperature" refers to a natural temperature without heating or cooling, and typically refers to a temperature within the range of about 10°C to 30°C, or a temperature of about 23°C or about 25°C. Unless otherwise specified in the present specification, the unit of temperature is °C.

[0012] In the present specification, when the measurement pressure affects the results of physical properties, the physical properties are measured at normal pressure unless otherwise specified. The term normal pressure refers to the natural pressure without pressure increase or decrease, and is usually within the range of approximately 700 mmHg to 800 mmHg.

[0013] The composition of the present application may be a heat-dissipating material or a composition capable of forming the heat-dissipating material. The composition of the present application being a heat dissipating material means that the composition itself exhibits the adhesion to aluminum, hardness, and thermal conductivity described below. Furthermore, the fact that the composition of the present application can form a heat dissipating material means that the composition forms a material (e.g., a cured body) that exhibits adhesion to aluminum, hardness, and thermal conductivity through a curing reaction or the like.

[0014] The composition of the present application may be a curable composition. When the composition of the present application is a curable composition, the composition may be a room temperature curable composition. A room temperature curable composition means a composition that can be cured when maintained at room temperature. When the composition of the present application is a curable composition, the composition may be a one-part composition or a two-part composition. The term one-part composition refers to a composition in which the components necessary for curing are mixed together and stored, and the term two-part composition refers to a composition in which at least some of the components necessary for curing are physically separated and stored.

[0015] The composition of the present application may be a polyurethane composition. The term polyurethane composition refers to a composition containing polyurethane or a component capable of forming polyurethane (e.g., a polyol compound, a monohydric alcohol, a thiol compound, and / or a polyisocyanate, as described below) as a major component. In the above, "containing as a major component" means that the content of the polyurethane or the component capable of forming polyurethane in the composition is 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or 95 wt%. The upper limit of the content of the polyurethane or the component capable of forming polyurethane in the composition may be 100 wt%. The content of the polyurethane or the component capable of forming polyurethane may be equal to or greater than any one of the lower limits listed above, equal to or less than any one of the upper limits listed above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits listed above. When the composition contains a filler and / or a solvent, the content of the polyurethane or the component capable of forming a polyurethane is the content in the composition excluding the filler and the solvent.

[0016] The composition of the present application may be a solventless composition. The term solventless composition refers to a composition in which the solvent content is 5% by weight or less, 4% by weight or less, 3% by weight or less, 2% by weight or less, 1% by weight or less, or 0.5% by weight or less. The solvent content in a solventless composition may be 0% by weight or more, or may be approximately 0% by weight. In other words, a solventless composition may be substantially free of solvent.

[0017] The composition of the present application can exhibit low adhesion to certain substrates or can form a cured product exhibiting low adhesion. For example, polyurethane is known as an adhesive material that exhibits excellent adhesion to various substrates. Therefore, a typical method for making a polyurethane composition exhibit low adhesion to a substrate is to incorporate a component that reduces adhesion, such as a plasticizer. While the addition of such a component can reduce the adhesive strength of the polyurethane material, it can also cause problems, such as reducing other physical properties that the polyurethane may have or leaching out of the material during use. However, the present application achieves the low adhesion without using or minimizing the amount of an adhesion-reducing component, such as a plasticizer. Therefore, the present application provides a material that maintains the advantages of the material while resolving the problem of high adhesion, which may not be required depending on the application.

[0018] For example, the upper limit of the adhesive strength of the composition or its cured product to aluminum is 1 N / mm 2 , 0.9N / mm 2 , 0.8N / mm 2 , 0.7N / mm 2 , 0.6N / mm 2 , 0.5N / mm 2 , 0.4N / mm 2 , 0.3N / mm 2 , 0.2N / mm 2 or 0.1N / mm 2 The adhesive strength may be the adhesive strength of the composition itself to aluminum, or, if the composition is curable, the adhesive strength of the cured composition to aluminum. The lower limit of the adhesive strength to aluminum is not particularly limited. For example, the lower limit of the adhesive strength may be 0 N / mm 2 , 0.01N / mm 2 , 0.02N / mm 2 , 0.03N / mm 2 , 0.04N / mm 2 , 0.05N / mm 2 , 0.06N / mm 2, 0.07N / mm 2 , 0.08N / mm 2 , 0.09N / mm 2 , 0.1N / mm 2 , 0.11N / mm 2 , 0.12N / mm 2 , 0.13N / mm 2 or 0.14N / mm 2 The adhesive strength may be about 0.05 N / mm. The adhesive strength may be less than or equal to any one of the upper limits mentioned above, greater than or equal to any one of the lower limits mentioned above, or greater than or equal to any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above. The adhesive strength to aluminum may be measured by the method described in the Examples of this specification. In one example, the composition has an adhesive strength to aluminum of 0 N / mm. 2 That is, the composition may be a composition that has substantially no measurable adhesive strength to aluminum.

[0019] The composition may also exhibit an appropriate hardness. The hardness may be the hardness of the composition itself, or, if the composition is curable, the hardness of the cured composition. The hardness of the composition can be adjusted so that the composition can be applied to heat-dissipating materials and provide products with excellent impact resistance, vibration resistance, and durability depending on the application. For example, the upper limit of the Shore OO hardness (Shore OO hardness) of the composition or its cured product may be about 90, 88, 86, 84, or 82, and the upper limit may be about 40, 45, 50, 55, 60, 65, 70, 75, 80, 82, or 84. The hardness may be less than or equal to any one of the upper limits, greater than or equal to any one of the lower limits, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits. The hardness may be measured using the method disclosed in the Examples below.

[0020] The composition can exhibit excellent thermal conductivity. For example, the lower limit of the thermal conductivity of the composition or a cured product thereof may be about 1.2 W / mK, 1.4 W / mK, 1.6 W / mK, 1.8 W / mK, 2.0 W / mK, 2.2 W / mK, 2.4 W / mK, 2.6 W / mK, or 2.8 W / mK, and the upper limit may be about 10 W / mK, 9 W / mK, 8 W / mK, 7 W / mK, 6 W / mK, 5 W / mK, 4 W / mK, or 3 W / mK. The thermal conductivity may be less than or equal to any one of the upper limits, greater than or equal to any one of the lower limits, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits. The thermal conductivity may be that of the composition itself or, if the composition is curable, that of the cured composition. Such thermal conductivity can be measured according to ASTM D5470 standard.

[0021] The composition can also exhibit appropriate flexibility. Adjusting the flexibility of the composition to a desired level can greatly expand the range of applications. For example, the radius of curvature of the composition can be adjusted. The radius of curvature may be the radius of curvature of the composition itself, or, if the composition is curable, the radius of curvature of the cured composition. The lower limit of the radius of curvature may be, for example, about 1, 2, 3, 4, 5, or 6, and the upper limit may be about 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, or 7. The radius of curvature may be less than or equal to any one of the upper limits listed above, greater than or equal to any one of the lower limits listed above, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits listed above. The radius of curvature of such a composition can be measured using the method disclosed in the Examples section below. The unit of the radius of curvature is mm.

[0022] The composition of the present application may be insulating. That is, the composition has insulating properties and / or can form a cured product having insulating properties. For example, the composition or its cured product may have a breakdown voltage of about 3 kV / mm or more, about 5 kV / mm or more, about 7 kV / mm or more, 10 kV / mm or more, 15 kV / mm or more, or 20 kV / mm or more, measured in accordance with ASTM D149. A higher breakdown voltage indicates better insulating properties. While there is no particular upper limit, taking into account the composition's composition, the breakdown voltage may be about 50 kV / mm or less, 45 kV / mm or less, 40 kV / mm or less, 35 kV / mm or less, or 30 kV / mm or less. The breakdown voltage can be controlled by adjusting the insulating properties of the composition, for example, by incorporating an insulating filler into the resin layer. Among fillers, ceramic fillers are generally known to be components that can ensure insulating properties.

[0023] The composition or its cured product may have flame retardancy. For example, the composition or its cured product may exhibit a V-0 rating in the UL 94 V Test (Vertical Burning Test). This ensures stability against fires and other accidents that may be a concern depending on the application of the composition.

[0024] The composition or its cured product may have a specific gravity of 5 or less. Other examples of the specific gravity include 4.5 or less, 4 or less, 3.5 or less, or 3 or less. A resin layer having a specific gravity within this range is advantageous for providing a lighter product. The lower limit of the specific gravity is not particularly limited. For example, the specific gravity may be about 1.5 or more, or about 2 or more. The components added to the resin layer can be adjusted so that the composition or its cured product has the above specific gravity. For example, when adding a filler, a filler that can ensure the desired properties (e.g., thermal conductivity) even at the lowest possible specific gravity, i.e., a filler with a low specific gravity itself, or a surface-treated filler, can be used.

[0025] The composition or its cured product may also have a 5% weight loss temperature of 400°C or higher in thermogravimetric analysis (TGA), and an 800°C residual of 70% by weight or higher. Such properties can further improve high-temperature stability. In other examples, the 800°C residual may be about 75% by weight or higher, about 80% by weight or higher, about 85% by weight or higher, or about 90% by weight or higher. In other examples, the 800°C residual may be about 99% by weight or lower. The thermogravimetric analysis (TGA) is performed at 60 cm 3 The temperature can be measured in the range of 25°C to 800°C at a heating rate of 20°C / min under a nitrogen (N2) atmosphere. The thermogravimetric analysis (TGA) results can also be achieved by adjusting the composition of the composition. For example, the 800°C residual capacity usually depends on the type and proportion of filler contained in the composition, and if an excessive amount of filler is included, the residual capacity increases.

[0026] The composition may contain a resin component. As used herein, the term "resin component" includes not only components known in the art as resins, but also components capable of forming a resin component through a curing reaction or the like. For example, polyurethane may be formed by the reaction of a polyol compound with a polyisocyanate, etc. However, the polyisocyanate itself is often not a resin component, and the polyol compound may not be a resin component either. Furthermore, the monohydric alcohols and thiol compounds mentioned herein, which will be described later, may not be resin components. However, since the polyol compounds, polyisocyanates, monohydric alcohols, and / or thiol compounds are intended to form polyurethane, which corresponds to a resin component, they may be considered resin components in this specification.

[0027] When the composition of the present application is a polyurethane composition, the resin component may include at least one selected from the group consisting of polyurethane, a polyol compound, a monohydric alcohol, a thiol compound, and a polyisocyanate. When the composition of the present application is a curable composition, the polyol compound, the monohydric alcohol, the thiol compound, or the polyisocyanate may be included as a resin component.

[0028] As used herein, the term "polyol compound" refers to a compound containing two or more hydroxy groups. Such polyol compounds may be monomolecular, oligomeric, or polymeric compounds. The number of hydroxy groups contained in a polyol compound is not particularly limited. In one example, the lower limit of the number of hydroxy groups contained in the polyol compound may be about 2 or 3, and the upper limit may be about 10, 9, 8, 7, 6, 5, 4, 3, or 2. The number of hydroxy groups may be less than or equal to any one of the upper limits described above, greater than or equal to any one of the lower limits described above, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits described above.

[0029] The above polyol compounds can be selected to ensure the desired physical properties. For example, the composition or the resin component of the present application may contain both a trifunctional or higher polyfunctional polyol compound and a difunctional polyol compound as the polyol compound. In the above, "trifunctional or higher" means that the polyol compound contains three or more hydroxy groups, and "difunctional" means that the polyol compound contains two hydroxy groups. The upper limit of the number of hydroxy groups contained in the trifunctional or higher polyfunctional polyol compound may be about 10, 9, 8, 7, 6, 5, 4, or 3. The number of hydroxy groups contained in the trifunctional or higher polyfunctional polyol compound is three or more, and may be equal to or less than any one of the above upper limits.

[0030] At least one of the trifunctional or higher polyfunctional polyol compound and the difunctional polyol compound may have a controlled number average molecular weight (Mn). For example, the lower limit of the number average molecular weight may be about 300 g / mol, 500 g / mol, 700 g / mol, 900 g / mol, 1100 g / mol, 1300 g / mol, 1500 g / mol, 1700 g / mol, or 1900 g / mol, and the upper limit may be about 3000 g / mol, 2800 g / mol, 2600 g / mol, 2400 g / mol, 2200 g / mol, 2000 g / mol, 1800 g / mol, 1600 g / mol, 1400 g / mol, or 1200 g / mol. The number average molecular weight may be less than or equal to any one of the upper limits described above, greater than or equal to any one of the lower limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. By using a polyol compound having such a number average molecular weight, the desired physical properties can be more efficiently ensured. In one example, the trifunctional or higher polyfunctional polyol compound and the bifunctional polyol compound may both have a number average molecular weight within the above range.

[0031] In one example, one of the trifunctional or higher polyfunctional polyol compound and the difunctional polyol compound may have a number average molecular weight of 1500 g / mol or more, and the other may be less than 1500 g / mol. The lower limit of the number average molecular weight of the trifunctional or higher polyfunctional polyol compound and the difunctional polyol compound having a higher number average molecular weight may be about 1500 g / mol, 1700 g / mol, or 1900 g / mol, and the upper limit may be about 3000 g / mol, 2800 g / mol, 2600 g / mol, 2400 g / mol, 2200 g / mol, or 2000 g / mol. The number average molecular weight may be less than or equal to any one of the above upper limits, greater than or equal to any one of the above lower limits, or greater than or equal to any one of the above lower limits and less than or equal to any one of the above upper limits. The upper limit of the number average molecular weight of the polyol compound having a smaller number average molecular weight among the trifunctional or higher polyfunctional polyol compounds and the difunctional polyol compounds may be about 1500 g / mol, 1400 g / mol, 1300 g / mol, 1200 g / mol, 1100 g / mol, or 1000 g / mol, and the lower limit may be about 500 g / mol, 700 g / mol, or 900 g / mol. The number average molecular weight may be equal to or less than any one of the upper limits mentioned above, equal to or greater than any one of the lower limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0032] Although not particularly limited, the tri- or higher functional polyol compound may have a number average molecular weight greater than that of the difunctional polyol compound. In one example, one of the tri- or higher functional polyol compound and the bifunctional polyol compound may be a so-called polyester polyol, and the other may be a polyether polyol.

[0033] Known polyester polyols can be used as the polyester polyol without any particular limitations. For example, the polyester polyol compound can be a polyol having an alkanediol unit, a polyol unit, and a dicarboxylic acid unit. Such a polyol can be a mixture of the alkanediol, the polyol, and the dicarboxylic acid, or a reaction product thereof. In this case, examples of the alkanediol include diol compounds having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms, such as 3-methyl-1,5-pentanediol, 1,9-nonanediol, and 1,6-hexanediol. Examples of the polyol include alkanes having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms, substituted with 3 to 10, 3 to 9, 3 to 8, 3 to 7, 3 to 6, 3 to 5, or 3 to 4 hydroxy groups, such as trimethylolpropane. Examples of the dicarboxylic acid include adipic acid, terephthalic acid, isophthalic acid, and sebacic acid, and suitable examples include adipic acid and sebacic acid.

[0034] These types of polyester polyol compounds are known under the trade names of, for example, Kuraray, P-510, P-1010, P-2010, P-3010, P-4010, P-5010, P-6010, F-510, F-1010, F-2010, F-3010, P-2011, P-520, P-2020, P-1012, P-2012, P-630, P-2030, P-2050, and N-2010.

[0035] In addition, known polyether polyols can be used as the polyether polyol without any particular limitations. For example, so-called polyalkylene glycols can be used as the polyether polyol compound. In the above, examples of alkylene include alkylenes having 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms.

[0036] As used herein, alkylene or alkylene group refers to a divalent substituent formed by the removal of two hydrogen atoms from an alkane, where the two hydrogen atoms may be removed one by one from other carbon atoms of the alkane, or the alkane may be removed from a single carbon atom.

[0037] In order to ensure appropriate physical properties, of the trifunctional or higher polyfunctional polyol compounds and the bifunctional polyol compounds, the polyester polyols can be used as the trifunctional or higher polyfunctional polyol compounds, and the polyether polyols can be used as the bifunctional polyol compounds.

[0038] When the composition or the resin component of the present application contains the tri- or higher functional polyol compound and the difunctional polyol compound, the lower limit of the content of the difunctional polyol compound relative to 100 parts by weight of the tri- or higher functional polyol compound may be about 5 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, or 90 parts by weight, and the upper limit may be about 200 parts by weight, 190 parts by weight, 180 parts by weight, 170 parts by weight, 160 parts by weight, 150 parts by weight, 140 parts by weight, 130 parts by weight, 120 parts by weight, 110 parts by weight, 100 parts by weight, or 90 parts by weight. The ratio may be equal to or less than any one of the upper limits mentioned above, equal to or greater than any one of the lower limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above. At such a ratio, the desired physical properties can be effectively ensured.

[0039] The resin component may further contain a monohydric alcohol or a thiol compound. The monohydric alcohol is a compound containing one hydroxyl group. By further using such a component, the desired physical properties can be more effectively achieved.

[0040] The monohydric alcohol or thiol compound may have a molecular weight (molar mass) within a predetermined range. For example, the lower limit of the molecular weight (molar mass) of the monohydric alcohol or thiol compound may be about 50 g / mol, 55 g / mol, 60 g / mol, 65 g / mol, 70 g / mol, 75 g / mol, 80 g / mol, 85 g / mol, 90 g / mol, 95 g / mol, 100 g / mol, 110 g / mol, 120 g / mol, 130 g / mol, 140 g / mol, or 150 g / mol. The upper limit may be about 500 g / mol, 480 g / mol, 460 g / mol, 440 g / mol, 420 g / mol, 400 g / mol, 380 g / mol, 360 g / mol, 340 g / mol, 320 g / mol, 300 g / mol, 280 g / mol, 260 g / mol, 240 g / mol, 220 g / mol, 200 g / mol, 180 g / mol, or 160 g / mol. The molecular weight (molar mass) of the monohydric alcohol or thiol compound may be equal to or less than any one of the upper limits mentioned above, equal to or greater than any one of the lower limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0041] There are no particular limitations on the type of monohydric alcohol or thiol compound that can be used. In the present application, any compound having one hydroxy group (monohydric alcohol) or one thiol group (thiol compound) can be used without any particular limitations. Non-limiting examples of applicable monohydric alcohols include 2-propylheptanol, ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, 2-ethylhexanol, nonanol, decanol, ethenol, protenol, butenol, acetylenol, propenol, butynol, phenol, methylphenol, pyridinol, and / or methylpyridinol. Examples of applicable thiol compounds include ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, 2-ethylhexanethiol, nonanethiol, decanethiol, 2-propylbutanethiol, ethenethiol, protenthiol, butenethiol, acetylenethiol, propenethiol, butinethiol, benzenethiol, methylbenzenethiol, pyridinethiol, and / or methylpyridinethiol, but are not limited thereto.

[0042] When included, the lower limit of the content of the monohydric alcohol or thiol compound relative to 100 parts by weight of the trifunctional or higher polyfunctional polyol compound may be about 1 part by weight, 3 parts by weight, 5 parts by weight, 7 parts by weight, 9 parts by weight, 11 parts by weight, 13 parts by weight, 15 parts by weight, 17 parts by weight, 19 parts by weight, 21 parts by weight, 23 parts by weight, 25 parts by weight, 27 parts by weight, or 29 parts by weight, and the upper limit may be about 100 parts by weight, 95 parts by weight, 90 parts by weight, 85 parts by weight, 80 parts by weight, 75 parts by weight, 70 parts by weight, 65 parts by weight, 60 parts by weight, 55 parts by weight, 50 parts by weight, 45 parts by weight, 40 parts by weight, 35 parts by weight, or 30 parts by weight. The ratio may be equal to or less than any one of the upper limits mentioned above, equal to or greater than any one of the lower limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above. At such a ratio, the desired physical properties can be more efficiently secured.

[0043] The composition may contain a polyisocyanate. This polyisocyanate can react with the polyol compound or the like to form a polyurethane. The term polyisocyanate refers to a compound having two or more isocyanate groups. The lower limit of the number of isocyanate groups in the polyisocyanate may be about 2 or 3, and the upper limit may be about 10, 9, 8, 7, 6, 5, 4, 3, or 2. The number of isocyanate groups may be less than or equal to any one of the upper limits listed above, greater than or equal to any one of the lower limits listed above, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits listed above.

[0044] The type of polyisocyanate is not particularly limited, but in order to ensure the desired physical properties, a non-aromatic polyisocyanate that does not contain an aromatic group can be used.

[0045] Examples of polyisocyanate compounds include aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, and tetramethylene diisocyanate; alicyclic polyisocyanates such as transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatomethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate; and carbodiimide-modified polyisocyanates and isocyanurate-modified polyisocyanates containing one or more of the above. Polyisocyanates may also be addition reaction products of the above diisocyanates with polyols (e.g., trimethylolpropane). Mixtures of two or more of the above listed compounds may also be used.

[0046] To ensure favorable physical properties, the polyisocyanate can be a trifunctional or higher polyfunctional polyisocyanate, i.e., a polyfunctional polyisocyanate having three or more isocyanate groups, or a bifunctional polyisocyanate (a compound having two isocyanate groups). The upper limit of the number of isocyanate groups contained in the trifunctional or higher polyfunctional polyisocyanate may be about 10, 9, 8, 7, 6, 5, 4, or 3. The number of isocyanate groups contained in the trifunctional or higher polyisocyanate is three or more, and may be equal to or less than any one of the upper limits mentioned above.

[0047] The proportion of the polyisocyanate to be used can be adjusted taking into consideration the number of hydroxyl groups and thiol groups present in the polyol compound, monohydric alcohol and / or thiol compound contained in the composition and the physical properties after curing. For example, the polyisocyanate may be contained in an appropriate ratio within the range of 10 parts by weight to 2000 parts by weight per 100 parts by weight of the polyol compound present in the composition.

[0048] When the polyisocyanate simultaneously contains the tri- or higher functional polyisocyanate and a difunctional polyisocyanate, the lower limit of the ratio of the difunctional polyisocyanate to 100 parts by weight of the tri- or higher functional polyisocyanate may be about 5 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, or 60 parts by weight, and the upper limit may be about 200 parts by weight, 190 parts by weight, 180 parts by weight, 170 parts by weight, 160 parts by weight, 150 parts by weight, 140 parts by weight, 130 parts by weight, 120 parts by weight, 110 parts by weight, 100 parts by weight, 90 parts by weight, 80 parts by weight, 70 parts by weight, or 60 parts by weight. The ratio may be equal to or less than any one of the upper limits mentioned above, equal to or greater than any one of the lower limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above. At such a ratio, the desired physical properties can be effectively ensured.

[0049] The composition may further comprise a filler component as a further component. The term filler component means a component consisting of a filler, i.e. a component containing only a filler. In one example, the filler component may contain two or more fillers having different average particle sizes. In another example, the filler component may contain three or more fillers having different average particle sizes, or may consist of three to six, three to five, three to four, or three fillers having different average particle sizes. That is, in one example, the filler component may contain only three to six, three to five, three to four, or three fillers having different average particle sizes.

[0050] In another example, the filler component may exhibit at least two peaks in a particle size distribution volume curve measured using laser diffraction. In one example, the filler component may exhibit three or more peaks, or three to six, three to five, three to four, or three peaks in a particle size distribution volume curve. For example, the range of filler components exhibiting three peaks does not include filler components exhibiting one, two, or four or more peaks.

[0051] The average particle size of the filler in the present application refers to the particle diameter at which the cumulative volume reaches 50% on the volume curve of the particle size distribution measured by laser diffraction, which is also called the median diameter. That is, in the present application, the particle size distribution is determined on a volume basis using the laser diffraction method, and the particle diameter at the point where the cumulative value reaches 50% on the cumulative curve with the total volume set to 100% is defined as the average particle size. In other examples, this average particle size is called the median particle size or D50 particle size.

[0052] Therefore, the two fillers having different average particle diameters may refer to fillers having different particle diameters at the point where the cumulative value reaches 50% on the volume curve of the particle size distribution. Usually, when two or more fillers having different average particle diameters are mixed to form a filler component, the volume curve of the particle size distribution measured by laser diffraction of the filler component shows peaks corresponding to the types of fillers mixed. Therefore, for example, when a filler component is formed by mixing three fillers having different average particle diameters, the volume curve of the particle size distribution of the filler component measured by laser diffraction shows three peaks.

[0053] The filler component of the composition of the present application may be a thermally conductive filler component. The term thermally conductive filler component refers to a filler component that functions to cause the composition or its cured product to exhibit the aforementioned thermal conductivity. In one example, the filler component may include at least a first filler having an average particle size of 60 μm to 200 μm, a second filler having an average particle size in the range of 10 μm to 30 μm, and a third filler having an average particle size of 5 μm or less.

[0054] The lower limit of the average particle size of the first filler may be about 62 μm, 64 μm, 66 μm, or about 68 μm, and the upper limit may be about 200 μm, 195 μm, 190 μm, 185 μm, 180 μm, 175 μm, 170 μm, 165 μm, 160 μm, 155 μm, 150 μm, 145 μm, 140 μm, 135 μm, 130 μm, 125 μm, about 120 μm, 115 μm, 110 μm, 105 μm, 100 μm, 95 μm, 90 μm, 85 μm, 80 μm, or about 75 μm. The average particle size of the first filler may be less than or equal to any one of the upper limits mentioned above, greater than or equal to or exceeding any one of the lower limits mentioned above, or greater than or equal to or exceeding any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0055] The lower limit of the average particle size of the second filler may be about 10 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, or 20 μm, and the upper limit may be about 29 μm, 28 μm, 27 μm, 26 μm, 25 μm, 24 μm, 23 μm, 22 μm, 21 μm, or about 20 μm. The average particle size of the second filler may be less than or equal to any one of the upper limits mentioned above, greater than or equal to or exceeding any one of the lower limits mentioned above, or within a range that is greater than or equal to or exceeding any one of the lower limits and less than or equal to any one of the upper limits mentioned above.

[0056] The lower limit of the third filler may be about 0.01 μm, 0.1 μm, about 0.5 μm, 1 μm, 1.5 μm, or 2 μm, and the upper limit may be about 5 μm, 4.5 μm, about 4 μm, 3.5 μm, 3 μm, 2.5 μm, or 2 μm. The average particle size of the third filler may be less than or equal to any one of the upper limits mentioned above, greater than or equal to any one of the lower limits mentioned above, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits mentioned above. In the filler component, the ratio (D1 / D3) of the average particle size (D1) of the first filler to the average particle size (D3) of the third filler can be in the range of 25-300.

[0057] In one example, when the filler component includes two or more fillers with different average particle diameters, the third filler may be the filler with the smallest average particle diameter among the fillers included in the filler component, and when the filler component includes two or more fillers with different average particle diameters, the first filler may be the filler with the largest average particle diameter among the fillers included in the filler component. In this state, the particle diameter ratio can be satisfied.

[0058] The lower limit of the ratio (D1 / D3) may be about 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 230, or 235, and the upper limit thereof may be about 300, 290, 280, 270, 260, 250, 240, 220, 200, 180, 160, 140, 120, 100, 95, 90, 85, 80, 75, 70, 65, or 60. The ratio may be less than or equal to any one of the upper limits mentioned above, greater than or equal to or greater than any one of the lower limits mentioned above, or greater than or equal to or greater than any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0059] The lower limit of the ratio (D1 / D2) of the average particle size (D1) of the first filler to the average particle size (D2) of the second filler in the filler component may be about 3, 3.1, 3.2, 3.3, 3.4, or 3.5, or about 20, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, or 4. The ratio may be less than or equal to any one of the upper limits mentioned above, greater than or equal to or exceeding any one of the lower limits mentioned above, or greater than or equal to or exceeding any one of the lower limits and less than or equal to any one of the upper limits mentioned above.

[0060] Examples of fillers include aluminum oxide (alumina: Al2O3), aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si3N4), silicon carbide (SiC), beryllium oxide (BeO), zinc oxide (ZnO), magnesium oxide (MgO), aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), Calcium hydroxide (Ca(OH) 2 ), hydromagnesite Ceramic fillers such as calcium carbonate (CaCO3) and / or boehmite can be used. Such fillers are advantageous in meeting the thermal conductivity requirements described above, and the application of ceramic fillers can also meet the insulation requirements described above.

[0061] The upper limits of the proportion of the filler component in the composition are 98% by weight, 97.5% by weight, 97% by weight, 96.5% by weight, 96% by weight, 95.5% by weight, 95% by weight, 94.5% by weight, 94% by weight, 93.5% by weight, 93% by weight, 92.5% by weight, 92% by weight, 91.5% by weight, 91% by weight, 90.5% by weight, 90.0% by weight, 89.5% by weight, and 89.0% by weight. , 88.5% or 88.0% by weight, and the lower limit may be about 70%, 71%, 72%, 73%, 74%, about 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87% or 88% by weight. The percentage may be less than or equal to any one of the upper limits mentioned above, greater than or equal to any one of the lower limits mentioned above, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits mentioned above.

[0062] The content of the filler component may be a proportion based on the total weight of the composition when the composition is a one-component composition, or may be a proportion based on the total weight of the base part and hardener part of the two-component composition when the composition is a two-component composition, or may be a proportion based on the total weight of the base part or hardener part alone.

[0063] When the composition is a two-component composition, the filler component to be applied to the final cured product is suitably divided into substantially equal amounts and introduced into the base and hardener parts, respectively. For example, in a two-component composition, the ratio (A / B) of the weight of the filler contained in the base part (A) to the weight of the filler contained in the hardener part (B) may be within the range of 0.5 to 2, within the range of 0.5 to 1.5, or within the range of 0.8 to 1.2. The filler component may contain various types of fillers, if necessary, in addition to the thermally conductive filler. For example, carbon fillers such as graphite, fumed silica, or clay may also be used.

[0064] The composition may contain other necessary ingredients in addition to the ingredients described above. In one example, the composition may further include a plasticizer. As mentioned above, in the present application, low adhesion to certain materials can be ensured without the use of a plasticizer, but a small amount of plasticizer can be applied if necessary.

[0065] The type of plasticizer that can be used is not particularly limited, and examples thereof include phthalate-based plasticizers such as dioctyl phthalate (DOP), dibutyl phthalate (DBP), butylbenzyl phthalate (BBP), diisononyl phthalate (DINP), and polyethyleneterephthalate (PET); adipate-based plasticizers such as dioctyl adipate (DOA) and diisononyl adipate (DINA); fatty acid-based plasticizers; phosphate-based plasticizers; and polyester-based plasticizers.

[0066] When a plasticizer is included, its proportion can be adjusted depending on the purpose. For example, when the plasticizer is included, the lower limit of the weight ratio of the plasticizer to 100 parts by weight of the polyol compound may be about 0.5 parts by weight, 1.5 parts by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 100 parts by weight, 150 parts by weight, 200 parts by weight, 250 parts by weight, or 300 parts by weight, and the upper limit may be about 500 parts by weight, The amount may be about 450 parts by weight, 400 parts by weight, 350 parts by weight, 300 parts by weight, 250 parts by weight, 200 parts by weight, 150 parts by weight, 100 parts by weight, 90 parts by weight, 80 parts by weight, 70 parts by weight, 60 parts by weight, 50 parts by weight, 40 parts by weight, 30 parts by weight, 20 parts by weight, 19 parts by weight, 18 parts by weight, 17 parts by weight, 16 parts by weight, 15 parts by weight, 14 parts by weight, 13 parts by weight, 12 parts by weight, 11 parts by weight, 10 parts by weight, 9 parts by weight, 8 parts by weight, 7 parts by weight, 6 parts by weight, 5 parts by weight, 4 parts by weight, 3 parts by weight, 2 parts by weight, or 1 part by weight. The amount may be less than or equal to any one of the upper limits, greater than or equal to any one of the lower limits, or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0067] The ratio may be changed depending on the overall composition and the intended use. In addition to the above components, the composition may contain further components as necessary. Examples of the further components include a catalyst that assists or accelerates the curing reaction, a viscosity adjuster (e.g., a thixotropic agent, a diluent, etc.) for adjusting the viscosity, for example, for increasing or decreasing the viscosity or adjusting the viscosity due to shear force, a dispersant, a surface treatment agent, or a coupling agent.

[0068] The composition may further include a flame retardant or a flame retardant auxiliary, etc. In this case, known flame retardants can be used without any particular limitation, and for example, a solid filler-type flame retardant or a liquid flame retardant can be applied.

[0069] Examples of flame retardants include organic flame retardants such as melamine cyanurate and inorganic flame retardants such as magnesium hydroxide. When a large amount of filler is added to the resin layer, a liquid flame retardant material (such as TEP, triethyl phosphate, or TCPP, tris(1,3-chloro-2-propyl)phosphate) may be used. A silane coupling agent, which can act as a flame retardant enhancer, may also be added.

[0070] As described above, the composition may be a one-component composition or a two-component composition. When the composition is a two-component composition, the aforementioned components of the composition may be contained in physically separate base and hardener parts. In one embodiment, the present application relates to a composition in which the composition is a two-part composition (two-part composition).

[0071] Such two-component compositions may include at least a base part and a hardener part, and the base and hardener parts may be physically separate from each other. When the physically separate base and hardener parts are mixed, a curing reaction begins, resulting in the formation of polyurethane. In the two-component composition, the base part may contain at least the polyol compound, and the curing agent part may contain at least the polyisocyanate.

[0072] When the composition contains the above-mentioned monohydric alcohol and / or thiol compound, this compound may be contained in, for example, the main component.

[0073] The filler component may be contained in either one of the base part and the hardener part, or in both the base part and the hardener part. When the filler component is contained in both the base part and the hardener part, the base part and the hardener part may contain the same amount of the filler component.

[0074] Other components such as catalysts, plasticizers, and flame retardants may be contained in the base and / or hardener parts as needed. In the two-component composition, the volume ratio (P / N) of the base part (P) to the hardener part (N) may be within the range of about 0.8 to 1.2.

[0075] Such two-component compositions or their cured products may also exhibit the aforementioned adhesive strength to aluminum, thermal conductivity, hardness, radius of curvature, insulating properties, flame retardancy, specific gravity, and / or 5% weight loss temperature in thermogravimetric analysis (TGA).

[0076] The present application also relates to a product comprising the composition or a cured product thereof. The composition or a cured product thereof of the present application can be usefully applied as a heat-dissipating material. Therefore, the product may include a heat-generating component. The term heat-generating component refers to a component that generates heat during use, and the type of heat-generating component is not particularly limited. Typical heat-generating components include various electrical / electronic products, including battery cells, battery modules, and battery packs.

[0077] The product of the present application may include, for example, the heat-generating component and the composition (or the two-component composition) or its cured form adjacent to the heat-generating component.

[0078] The specific method for constructing the product of the present application is not particularly limited, and when the composition or two-component composition of the present application or its cured form is applied to a heat dissipation material, the product can be constructed in various known ways. [Effects of the Invention]

[0079] The present application provides a composition that can be cured at room temperature to form a heat-dissipating material that exhibits appropriate levels of hardness, low adhesive strength, and excellent thermal conductivity. Furthermore, the present application can achieve the low adhesive strength without using plasticizers, or by using plasticizers in a minimal amount. The present application also provides a product including the composition or a cured product thereof. DETAILED DESCRIPTION OF THE INVENTION

[0080] The present application will be described in detail below based on examples, but the scope of the present application is not limited to the following examples. The cured products mentioned below were all formed by mixing the main component and curing agent components of the compositions of the Examples or Comparative Examples, which were prepared as two-component compositions, in a 1:1 volume ratio, and then maintaining the mixture at room temperature for approximately 24 hours.

[0081] 1. Thermal conductivity The thermal conductivity of the composition or its cured product was measured using the hot-disk method in accordance with ISO 22007-2. Specifically, a two-component mixture of the base and hardener parts of the examples or comparative examples, in a volume ratio of 1:1, was placed in a mold approximately 7 mm thick, and the thermal conductivity was measured in the through-plane direction using a hot-disk device. As specified in ISO 22007-2, the hot-disk device is a device that measures temperature changes (electrical resistance changes) when a sensor with a double-spiral nickel wire structure is heated, thereby determining thermal conductivity. Thermal conductivity was measured according to this standard.

[0082] 2. Measurement of adhesion strength to aluminum An uncured resin composition (a mixture of a base material and a curing agent) was coated onto the center of an aluminum substrate measuring 2 cm in width and 7 cm in length, covering an area of approximately 2 cm in width and 2 cm in length. An aluminum substrate measuring 2 cm in width and 7 cm in length was then attached onto the coating layer, and the resin composition was cured while maintaining this state. The two aluminum substrates were attached at a 90-degree angle to each other. The upper aluminum substrate was then fixed, and the lower aluminum substrate was pressed at a speed of 0.5 mm / min to measure the force required for the separation of the lower aluminum substrate. The maximum force measured during this process was divided by the area of the test specimen to determine the adhesive strength to aluminum (90-degree peel angle).

[0083] 3. Hardness measurement The hardness of the cured composition was measured according to ASTM D 2240 and JIS K 6253. The hardness was measured using an ASKER durometer hardness instrument by applying a load of 1 kg or more (approximately 1.5 kg) to the surface of a flat sample (resin layer) to measure the initial hardness, and then checking the stabilized reading after 15 seconds to evaluate the hardness.

[0084] 4. Measurement of the radius of curvature The curvature radius of the cured body was evaluated using cured bodies with width, length, and thickness of 1 cm, 10 cm, and 2 mm, respectively. The curvature radius was the smallest radius of the cylinder at which the cured body did not crack when attached to cylinders of various radii and bent in the vertical direction. Unless otherwise specified, the unit of curvature radius in this specification is mm.

[0085] 5. Measurement of Number Average Molecular Weight Number average molecular weight (Mn) was measured using GPC (gel permeation chromatography). Number average molecular weight (Mn)Put the sample to be analyzed into a 5 mL vial, dilute it with THF (tetrahydrofuran) solvent to a concentration of about 1 mg / mL, and then filter the calibration standard sample and the analysis sample through a syringe filter (pore size: 0.45 μm) for measurement. As the analysis program, use ChemStation of Agilent technologies, and compare the elution time of the sample with the calibration curve to Number average molecular weight (Mn) obtain

[0086] <GPC Measurement Conditions> Equipment: 1200 series of Agilent technologies Column: Use TL Mix.A&B of Agilent technologies Solvent: THF (tetrahydrofuran) Column temperature: 35 °C Sample concentration: 1 mg / mL, inject 200 μL Standard sample: Use polystyrene (MP: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)

[0087] Example 1. Manufacture of the main component parts The base resin was prepared by mixing trifunctional polyester polyol (Kuraray, F-2010) and difunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D) as polyol compounds, 2-propylheptanol (2PH) as monohydric alcohol, filler components, and a catalyst (dibutyltin dilaurate, DBTDL). The trifunctional polyester polyol (Kuraray, F-2010) has three hydroxyl groups, a number-average molecular weight of approximately 2000 g / mol, and is a compound containing 3-methyl-1,5-pentanediol units, trimethylolpropane units, and adipic acid units. The difunctional polyether polyol is polypropylene glycol with a number-average molecular weight of approximately 1000 g / mol. The mixing ratio of the components was 100:90:30:1869 by weight (F-2010:PPG-1000D:2-PH:filler component), and the catalyst was added in a catalytic amount. The filler component was produced by mixing a first alumina filler with an average particle size of approximately 70 μm, a second alumina filler with an average particle size of approximately 20 μm, and a third alumina filler with an average particle size of approximately 1 μm. The weight ratio during mixing was approximately 60:20:20 (first alumina filler:second alumina filler:third alumina filler).

[0088] Hardener part manufacturing The curing agent part was produced by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) and a difunctional polyisocyanate (Asahi Kasei, AE700-100) with a filler component. The mixing ratio was 100:60:3271 by weight (HD T LV2:AE700-100:filler component). The filler component used in the above was the same as that used in the base component.

[0089] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0090] Comparative Example 1 Manufacturing of base parts A base part was manufactured by mixing a bifunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D) as a polyol compound with a filler component and a catalyst. The mixing ratio of the components was 100:1010 by weight (PPG-1000D:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above were the same as those in Example 1.

[0091] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) and a difunctional polyisocyanate (Asahi Kasei, AE700-100) were mixed with a filler component to produce a curing agent part. The mixing ratio was 100:25:5631 by weight (HD T LV2:AE700-100:filler component). The filler component used in the above was the same as in Example 1.

[0092] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0093] Comparative Example 2 Manufacturing of base parts The base part was manufactured by mixing a bifunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D) as a polyol compound with a filler component and a catalyst. The mixing ratio of the components was 100:1010 by weight (PPG-1000D:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above were the same as those in Example 1.

[0094] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:4990 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0095] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0096] Comparative Example 3. Manufacturing of base parts The base part was manufactured by mixing a bifunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D) as a polyol compound with a filler component and a catalyst. The mixing ratio of the components was 100:1156 by weight (PPG-1000D:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above were the same as those in Example 1.

[0097] Hardener part manufacturing Trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with the filler component to produce the cured part. The mixing ratio was 100:4416 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0098] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0099] Comparative Example 4. Manufacturing of base parts The main component was manufactured by mixing the polyol compounds, trifunctional polyester polyol (Kuraray, F-2010) and difunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D), with the filler component and catalyst. The mixing ratio of the components was 100:233:3788 by weight (F-2010:PPG-1000D:filler component), and the catalyst was added in catalytic amounts. The filler component and catalyst used in the above were the same as those in Example 1.

[0100] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:4698 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0101] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0102] Comparative Example 5. Manufacturing of base parts The base part was manufactured by mixing the polyol compounds, trifunctional polyester polyol (Kuraray, F-2010) and difunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D), with the filler component and catalyst. The mixing ratio of the components was 100:150:2825 by weight (F-2010:PPG-1000D:filler component), and the catalyst was added in catalytic amounts. The filler component and catalyst used in the above were the same as those in Example 1.

[0103] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:4811 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0104] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0105] Comparative Example 6. Manufacturing of base parts The main component was manufactured by mixing the polyol compounds, trifunctional polyester polyol (Kuraray, F-2010) and bifunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D), with the filler component and catalyst. The mixing ratio of the components was 100:100:2252 by weight (F-2010:PPG-1000D:filler component), and the catalyst was added in catalytic amounts. The filler component and catalyst used in the above were the same as those in Example 1.

[0106] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:4912 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0107] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0108] Comparative Example 7. Manufacturing of base parts The base part was manufactured by mixing the polyol compounds, trifunctional polyester polyol (Kuraray, F-2010) and difunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D), with the filler component and catalyst. The mixing ratio of the components was 100:150:2793 by weight (F-2010:PPG-1000D:filler component), and the catalyst was added in catalytic amounts. The filler component and catalyst used in the above were the same as those in Example 1.

[0109] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:5091 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0110] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0111] Comparative Example 8. Manufacturing of base parts The main component was manufactured by mixing the polyol compounds, trifunctional polyester polyol (Kuraray, F-2010) and bifunctional polyether polyol (polypropylene glycol) (Kumho Petrochemical, PPG-1000D), with the filler component and catalyst. The mixing ratio of the components was 100:150:2759 by weight (F-2010:PPG-1000D:filler component), and the catalyst was added in catalytic amounts. The filler component and catalyst used in the above were the same as those in Example 1.

[0112] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:5344 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0113] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0114] Comparative Example 9. Manufacturing of base parts The base part was manufactured by mixing a trifunctional polyester polyol (Kuraray, F-2010) as a polyol compound with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst. The mixing ratio of the components was 100:11:1230 by weight (F-2010:2-PH:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above were the same as those in Example 1.

[0115] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:3562 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0116] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0117] Comparative Example 10. Manufacturing of base parts The base part was manufactured by mixing a trifunctional polyester polyol (Kuraray, F-2010) as a polyol compound with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst. The mixing ratio of the components was 100:25:1619 by weight (F-2010:2-PH:filler component:catalyst), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above example were the same as those in Example 1.

[0118] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:3111 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0119] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0120] Comparative Example 11. Manufacturing of base parts The base part was manufactured by mixing a trifunctional polyester polyol (Kuraray, F-2010) as a polyol compound with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst. The mixing ratio of the components was 100:67:2371 by weight (F-2010:2-PH:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above example were the same as those in Example 1.

[0121] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:2555 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0122] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature.

[0123] Comparative Example 12. Manufacturing of base parts The base part was manufactured by mixing a trifunctional polyester polyol (Kuraray, F-2010) as a polyol compound with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst. The mixing ratio of the components was 100:104:3046 by weight (F-2010:2-PH:filler component), and the catalyst was added in a catalytic amount. The filler component and catalyst used in the above example were the same as those in Example 1.

[0124] Hardener part manufacturing A trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) was mixed with a filler component to produce a curing agent part. The mixing ratio was 100:2357 by weight (HD T LV2:filler component). The filler component used in the above was the same as in Example 1.

[0125] Preparation of the composition The base part and the hardener part were prepared in a volume ratio of 1:1 to prepare the composition. The base part and the hardener part were mixed and hardened at room temperature. The results of physical property evaluation for the examples and comparative examples are shown in Table 1. In Table 1, bulk failure refers to the case where the cured composition breaks when peeling it from the aluminum to measure adhesive strength, making it impossible to measure adhesive strength at the interface between the aluminum and the cured composition, and the case where the radius of curvature cannot be measured refers to the case where the cured composition has too low hardness or does not have enough mechanical strength, causing it to break easily or become brittle, making it impossible to measure.

[0126] [Table 1]

Claims

1. A composition comprising a resin component and a filler component, the resin component contains a trifunctional or higher polyfunctional polyol compound and a bifunctional polyol compound, the resin component further contains a monohydric alcohol or a thiol compound, the resin component contains a polyisocyanate, and the polyisocyanate contains a trifunctional or higher polyfunctional polyisocyanate and a difunctional polyisocyanate; the resin component contains the bifunctional polyol compound in an amount of 60 parts by weight to 120 parts by weight per 100 parts by weight of the trifunctional or higher polyfunctional polyol compound; the resin component contains the monohydric alcohol or thiol compound in an amount of 15 to 45 parts by weight per 100 parts by weight of the trifunctional or higher polyfunctional polyol compound; The polyisocyanate contains the difunctional polyisocyanate in an amount of 40 to 80 parts by weight per 100 parts by weight of a trifunctional or higher polyfunctional polyisocyanate, The cured product of the composition has a hardness of 1 N / mm ２ A composition having an adhesion to aluminum of less than 90 Shore OO and a hardness of less than 90.

2. The composition of claim 1 , having a thermal conductivity of 1.2 W / mK or greater.

3. The composition according to claim 1, wherein at least one of the trifunctional or higher polyfunctional polyol compound and the difunctional polyol compound has a number average molecular weight in the range of 300 to 3000 g / mol.

4. The composition according to claim 1, wherein one of the trifunctional or higher polyfunctional polyol compound and the difunctional polyol compound has a number average molecular weight of 1500 g / mol or more, and the other has a number average molecular weight of less than 1500 g / mol.

5. The composition according to claim 1, wherein one of the tri- or higher functional polyol compound and the difunctional polyol compound is a polyester polyol, and the other is a polyether polyol.

6. The polyester polyol contains alkanediol units, polyol units, and dicarboxylic acid units, and the dicarboxylic acid units are adipic acid units or sebacic acid units; The composition of claim 5, wherein the polyol unit is an alkane substituted with 3 to 10 hydroxy groups.

7. 4. The composition of claim 1, wherein the filler is aluminum hydroxide, magnesium hydroxide, calcium hydroxide, hydromagnesite, magnesia, alumina, aluminum nitride, boron nitride, silicon nitride, silicon carbide, zinc oxide, or beryllium oxide.

8. a base part including a polyol component and a filler; a hardener part comprising a hardener component and a filler, The base component further contains a monohydric alcohol or a thiol compound, the polyol component includes a trifunctional or higher polyfunctional polyol compound and a difunctional polyol compound, the curing agent component includes a trifunctional or higher polyfunctional polyisocyanate and a difunctional polyisocyanate; the polyol component contains the bifunctional polyol compound in an amount of 60 to 120 parts by weight per 100 parts by weight of the trifunctional or higher polyfunctional polyol compound; the base component contains 15 to 45 parts by weight of the monohydric alcohol or thiol compound relative to 100 parts by weight of the trifunctional or higher polyfunctional polyol compound; the curing agent component contains the difunctional polyisocyanate in an amount of 40 to 80 parts by weight per 100 parts by weight of a trifunctional or higher polyfunctional polyisocyanate; The hardened product of the two-component composition has a hardness of 1 N / mm ２ A two-part composition having the following adhesion to aluminum and a Shore OO hardness of less than 90:

9. A product comprising a heat-generating component and the composition according to claim 1 or the two-component composition according to claim 8, or a cured product of said composition, located adjacent to said heat-generating component.

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