Resin composition and molded article

Abstract

To provide a resin composition that has excellent light resistance while maintaining high retention stability and moist-heat resistance, and a molding obtained from the resin composition.SOLUTION: A resin composition contains a resin component comprising a polycarbonate resin 55-90 mass% and a styrenic resin 45-10 mass% with a butadiene unit ratio of more than 0 mass% to 20 mass% or less. Relative to the resin component 100 pts.mass, the resin composition also contains an ultraviolet absorber 0.1-2.0 pts.mass and a hindered amine photostabilizer 0.1-2.0 pts.mass containing a polyolefin structure, with the mass ratio between the ultraviolet absorber and the photostabilizer (ultraviolet absorber / photostabilizer) of 3.5 or less.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition and a molded article. [Background technology]

[0002] BACKGROUND ART In order to improve the impact resistance and moldability of polycarbonate resins, it has been conventionally considered to blend ABS resins (acrylonitrile / butadiene / styrene copolymers) into polycarbonate resin compositions. However, as described in Patent Document 1, for example, ABS resin uses butadiene-based rubber, and therefore when blended with a polycarbonate resin composition, the light resistance of the polycarbonate resin composition deteriorates. Therefore, Patent Document 1 discloses a thermoplastic resin composition that does not use ABS resin and is characterized by blending 0.05 to 3 parts by weight of a predetermined hindered amine-based light stabilizer (C) with 100 parts by weight of a resin composition consisting of 30 to 90% by weight of polycarbonate resin (A) and 10 to 70% by weight of rubber-reinforced styrene-based resin (B) containing ethylene-propylene-based rubber and / or acrylic rubber as constituent components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-249398 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, the inventors have conducted research and found that even when a styrene-based resin containing butadiene units, such as ABS resin, is used in a polycarbonate resin, light resistance can be improved to some extent by reducing the proportion of butadiene units. However, it has been found that simply reducing the proportion of butadiene units does not provide sufficient light resistance. Furthermore, it has also been found that retention stability and moist heat resistance are impaired. In particular, with regard to moist heat resistance, a decrease in impact resistance after prolonged storage is a problem. The present invention aims to solve the above problems, and aims to provide a resin composition that maintains high retention stability and moist heat resistance and also has excellent light resistance, and a molded article obtained from the resin composition. [Means for solving the problem]

[0005] In light of the above-mentioned problems, the present inventors have conducted studies and have found that the above-mentioned problems can be solved by reducing the proportion of butadiene units in the styrene-based resin, blending an ultraviolet absorber with a hindered amine-based light stabilizer having a polyolefin structure, and further precisely adjusting the ratio between the ultraviolet absorber and the hindered amine-based light stabilizer having a polyolefin structure. Specifically, the above problems were solved by the following means. <1> A resin composition comprising 100 parts by mass of a resin component consisting of 55 to 90% by mass of a polycarbonate resin and 45 to 10% by mass of a styrene-based resin having a butadiene unit ratio of more than 0% by mass and not more than 20% by mass, and containing 0.1 to 2.0 parts by mass of an ultraviolet absorber and 0.1 to 2.0 parts by mass of a hindered amine-based light stabilizer containing a polyolefin structure, wherein the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is 3.5 or less. <2> The styrene-based resin contains acrylonitrile units, butadiene units, and styrene units. <1> The resin composition according to claim 1. <3> The ultraviolet absorber is a benzotriazole-based ultraviolet absorber. <1> or <2> The resin composition according to claim 1. <4> The light stabilizer has the following structure A: <1> ~ <3> The resin composition according to any one of the above. Structure A [ka] (In the above structure A, * indicates the bonding position with other moieties.) <5> the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is less than 1.0; <1> ~ <4> The resin composition according to any one of the above. <6> A resin composition comprising 100 parts by mass of a resin component consisting of 55 to 90% by mass of polycarbonate resin and 45 to 10% by mass of a bulk polymer containing acrylonitrile units, butadiene units, and styrene units, and containing 0.1 to 2.0 parts by mass of an ultraviolet absorber and 0.1 to 2.0 parts by mass of a hindered amine light stabilizer containing a polyolefin structure, wherein the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is 3.5 or less. <7> Further, a phenolic antioxidant is contained, and the mass ratio of the ultraviolet absorber to the phenolic antioxidant, ultraviolet absorber / phenolic antioxidant, is 3 to 25. <1> ~ <6> The resin composition according to any one of the above. <8> Further, a phosphorus-based heat stabilizer is contained, and the mass ratio of the phosphorus-based heat stabilizer to the phenol-based antioxidant, phosphorus-based heat stabilizer / phenol-based antioxidant, is 0.1 to 1.0. <7> The resin composition according to claim 1. <9> <1> ~ <8> A molded article formed from the resin composition according to any one of the above items. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a resin composition that maintains high retention stability and moist heat resistance while also exhibiting excellent light resistance, and a molded article obtained from the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, an embodiment for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment. In this specification, the symbol "to" is used to mean that the numerical values ​​before and after it are included as the lower limit and upper limit. In this specification, various physical properties and characteristic values ​​are those at 23°C unless otherwise specified. If the standards shown in this specification differ depending on the year and the measurement method, etc., they will be based on the standards as of January 1, 2021, unless otherwise stated.

[0008] The resin composition of this embodiment is characterized by containing 100 parts by mass of a resin component consisting of 55 to 90% by mass of polycarbonate resin and 45 to 10% by mass of a styrene-based resin having a butadiene unit ratio of more than 0% by mass and not more than 20% by mass, 0.1 to 2.0 parts by mass of an ultraviolet absorber, and 0.1 to 2.0 parts by mass of a hindered amine-based light stabilizer containing a polyolefin structure, with the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, being 3.5 or less. This configuration allows for a resin composition that maintains high retention stability and moist heat resistance while also exhibiting excellent light resistance. Furthermore, mechanical strength can also be increased.

[0009] As described above, styrene-based resins containing butadiene units have poor light resistance. In this embodiment, it is believed that light resistance can be improved by reducing the proportion of butadiene units in the styrene-based resin. Alternatively, it is presumed that by forming the styrene-based resin into a bulk polymer, impurities such as emulsifiers and salting-out agents that are present in emulsion polymers are eliminated, resulting in a molded product with superior light resistance. Here, when a hindered amine light stabilizer (HALS) is blended with a polycarbonate resin and a styrene-based resin containing butadiene units, light resistance is improved, but residence stability and moist heat resistance are deteriorated. In this embodiment, this problem is solved by using a hindered amine light stabilizer containing a polyolefin structure and adjusting the ratio with the ultraviolet absorber. This is presumably due to the following reasons: Namely, butadiene units inherently have low light resistance, and are prone to producing degradation products derived from butadiene units. In order to reduce the production of degradation products derived from butadiene units, it is conceivable to blend HALS into the resin composition. In this embodiment, by employing a HALS containing a polyolefin structure, it is presumed that the SP value (solubility parameter) is relatively low, making HALS more compatible with styrene-based resins. In other words, in this embodiment, it is presumed that HALS is more likely to be present in large amounts in the styrene-based resin region, thereby effectively suppressing the production of degradation products. Furthermore, it is presumed that ultraviolet absorbers have a relatively high SP value, and therefore are more compatible with the polycarbonate resin region. Furthermore, in this embodiment, it has been found that by setting the ratio of ultraviolet absorber / light stabilizer to 3.5 or less, the light resistance is remarkably excellent. Furthermore, in this embodiment, it is possible to effectively suppress a decrease in impact resistance of the molded product due to photodegradation. Furthermore, this embodiment can also provide excellent retention stability, which is particularly advantageous in that it can maintain high levels of the trade-off properties of moist heat resistance and retention stability.

[0010] The resin composition of this embodiment also preferably contains 100 parts by mass of a resin component consisting of 55 to 90% by mass of polycarbonate resin and 45 to 10% by mass of a bulk polymer containing acrylonitrile units, butadiene units, and styrene units, with 0.1 to 2.0 parts by mass of an ultraviolet absorber and 0.1 to 2.0 parts by mass of a hindered amine-based light stabilizer containing a polyolefin structure, and the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is 3.5 or less. The use of a bulk polymer tends to relatively reduce the proportion of butadiene units, thereby improving light resistance. Furthermore, unlike emulsion polymers, the decrease in light resistance due to impurities derived from emulsifiers and salting-out agents can be effectively suppressed. The resin composition of this embodiment will be described in detail below.

[0011] <Resin component> The resin composition of this embodiment contains a resin component consisting of 55 to 90 mass% of a polycarbonate resin and 45 to 10 mass% of a styrene-based resin having a butadiene unit ratio of more than 0 mass% and not more than 20 mass% (hereinafter, sometimes simply referred to as a "styrene-based resin"). In this embodiment, the polycarbonate resin and the styrene-based resin are referred to as "resin components." Resins other than the polycarbonate resin and the styrene-based resin are sometimes referred to as "other resin components." The proportion of polycarbonate resin in the resin component is preferably 60% by mass or more, more preferably 65% ​​by mass or more. By making it equal to or greater than the lower limit, heat resistance, rigidity, impact resistance, color, dimensional stability, light resistance, and flame retardancy tend to be further improved. Furthermore, the proportion of polycarbonate resin in the resin component is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less. By making it equal to or less than the upper limit, moldability and cold resistance tend to be further improved. The resin component may contain only one type of polycarbonate resin, or may contain two or more types. When two or more types are contained, it is preferable that the total amount is within the above range. Furthermore, the proportion of the styrene-based resin in the resin component is preferably 15% by mass or more, more preferably 20% by mass or more, and even more preferably 25% by mass or more. By making the proportion equal to or greater than the lower limit, the impact resistance and moldability of the resulting molded article tend to be further improved. The proportion of the styrene-based resin in the resin component is preferably 40% by mass or less, more preferably 35% by mass or less. By making the proportion equal to or less than the upper limit, the light resistance of the resulting molded article tends to be further improved. The resin component may contain only one type of styrene-based resin, or may contain two or more types. When two or more types are contained, the total amount preferably falls within the above range.

[0012] The resin composition of this embodiment may or may not contain other resin components besides the above resin components. When other resin components besides the above resin components are contained, examples include an impact resistance improver (e.g., a core-shell rubber component) and a chemical resistance improver (e.g., a crystalline resin). When the resin composition of this embodiment contains other resin components, the other resin components are preferably contained in an amount of 5 to 15% by mass (preferably 5 to 10% by mass) of the resin composition, separate from the above resin components. Furthermore, the resin composition of this embodiment may be configured to be substantially free of other resin components. "Substantially free" means, for example, that the proportion of other resin components in the resin composition is less than 5% by mass, preferably 3% by mass or less, and more preferably 1% by mass or less.

[0013] Next, the polycarbonate resin used in this embodiment will be described. The polycarbonate resin is not particularly limited as long as it contains an -[OR-OC(=O)]- unit (where R is a hydrocarbon group, specifically an aliphatic group, an aromatic group, or one containing both an aliphatic group and an aromatic group, and further one having a linear or branched structure) containing a carbonate bond in the molecular main chain. In this embodiment, the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton. The use of such a polycarbonate resin achieves better heat resistance and toughness. In this embodiment, the polycarbonate resin having a bisphenol skeleton preferably contains 90 mol % or more of all structural units of structural units having a bisphenol skeleton, and more preferably contains 90 mol % or more of all structural units of structural units derived from bisphenol A.

[0014] The viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By setting it to the above lower limit or more, the durability of the obtained molded article tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, and even more preferably 25,000 or less. By setting it to the above upper limit or less, the molding processability of the molded article tends to be further improved. The viscosity average molecular weight (Mv) was calculated by using methylene chloride as a solvent and an Ubbelohde viscometer to determine the intrinsic viscosity [η] (unit: dL / g) at a temperature of 25°C, and then using the Schnell viscosity formula, i.e., η = 1.23 × 10 -4 ×Mv 0.83 , means the value calculated from When two or more types of polycarbonate resins are used, the viscosity average molecular weight is the viscosity average molecular weight of the mixture.

[0015] The melt volume rate (MVR) of the polycarbonate resin used in this embodiment at 250°C and a load of 2.16 kg is 10 cm 3 / 10 min or more is preferable, and 3 / 10 min or less is preferable, and 65 cm 3 / 10 min or less is more preferable, and 50 cm 3 / 10 min or less is more preferable, and 40 cm 3 / 10 min or less is more preferable, and 30 cm 3 / 10 min or less is more preferable, and 20 cm 3 It is even more preferable that the time is 10 min or less. MVR is measured as described in the Examples below. When two or more polycarbonate resins are used, the MVR is the mixture.

[0016] In addition to the above, for details of the polycarbonate resin, please refer to paragraphs 0013 to 0041 of Japanese Patent Application Laid-Open No. 2021-084942, the contents of which are incorporated herein by reference.

[0017] Next, the styrene-based resin (styrene-based resin) used in this embodiment, which has a proportion of butadiene units of more than 0% by mass and not more than 20% by mass, will be described. In this embodiment, by blending the styrene-based resin, impact resistance can be imparted to a molded article formed from a polycarbonate resin. In this embodiment, the styrene-based resin refers to a resin containing a styrene unit and a butadiene unit, and may also contain other structural units. In the styrene-based resin of the present embodiment, the proportion of butadiene units is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 7% by mass or more, still more preferably 10% by mass or more, and may be 12% by mass or more, or even 15% by mass or more. By making the proportion equal to or greater than the lower limit, the impact resistance of the obtained molded article tends to be improved. Furthermore, the proportion of butadiene units may be 19% by mass or less. By making the proportion equal to or less than the upper limit, the light resistance tends to be further improved. The styrene-based resin is preferably a so-called ABS resin containing acrylonitrile units, butadiene units, and styrene units.

[0018] Monomers constituting the styrene unit include styrene and its derivatives, such as styrene, α-methylstyrene, o-methylstyrene, p-methylstyrene, vinylxylene, ethylstyrene, dimethylstyrene, p-tert-butylstyrene, vinylnaphthalene, methoxystyrene, monobromostyrene, dibromostyrene, fluorostyrene, and tribromostyrene, with styrene being particularly preferred. The proportion of styrene units in the styrene resin is preferably in the range of 40 to 80% by mass, more preferably 45% by mass or more, even more preferably 50% by mass or more, particularly preferably 55% by mass or more, and more preferably 75% by mass or less, even more preferably 70% by mass or less, particularly preferably 65% ​​by mass or less. The styrene-based resin may contain only one type of styrene unit, or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0019] The proportion of acrylonitrile units in the styrene-based resin is preferably in the range of 10 to 30% by mass, more preferably 12% by mass or more, even more preferably 14% by mass or more, particularly preferably 15% by mass or more, and more preferably 28% by mass or less, even more preferably 26% by mass or less, particularly preferably 25% by mass or less.

[0020] The styrene-based resin may or may not contain structural units other than acrylonitrile units, butadiene units, and styrene units. Examples of structural units other than acrylonitrile units, butadiene units, and styrene units include maleimide-based monomers such as maleimide, N-methylmaleimide, N-cyclohexylmaleimide, and N-phenylmaleimide, acrylamide-based monomers such as acrylamide and N-methylacrylamide, unsaturated acid anhydrides such as maleic anhydride and itaconic anhydride, unsaturated acids such as acrylic acid and methacrylic acid, glycidyl acrylate, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and methoxypolyethylene glycol methacrylate.

[0021] In this embodiment, the styrene-based resin preferably has acrylonitrile units, butadiene units, and styrene units in total accounting for 90% by mass or more of all structural units excluding terminal groups, more preferably 95% by mass or more, and even more preferably 98% by mass or more.

[0022] The proportion of the resin components (total of polycarbonate resin and styrene-based resin) in the resin composition of this embodiment is preferably 90 mass% or more of the resin composition, more preferably 95 mass% or more, and even more preferably 97 mass% or more. The upper limit of the proportion of the resin components in the resin composition of this embodiment is the value at which the total of the resin components, UV absorber, and hindered amine-based light stabilizer having a polyolefin structure is 100 mass%.

[0023] <UV absorber> The resin composition of this embodiment contains 0.1 to 2.0 parts by mass of an ultraviolet absorber per 100 parts by mass of the resin component. By including an ultraviolet absorber, a molded article with excellent light resistance can be obtained. Examples of the ultraviolet absorber include a benzotriazole-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzoate-based ultraviolet absorber, a hindered amine-based ultraviolet absorber, and a triazine-based ultraviolet absorber, and it is preferable to include a benzotriazole-based ultraviolet absorber. Benzotriazole-based ultraviolet absorbers include 2-(2-hydroxy-5-t-octylphenyl)-2H-benzotriazole, 2-(3-t-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole, 2-[5-chloro(2H)-benzotriazol-2-yl]-4-methyl-6-(t-butyl)phenol, 2,4-di-tert-butyl-6-(5-chlorobenzotriazol-2-yl)phenol, (2-[5-chloro(2H)-benzotriazol-2-yl]-4,6-di(tert-pentyl)phenol), 3-[3-tert-butyl-5-(5 2-(2H-benzotriazol-2-yl)-4,6-bis-(1-methyl-1-phenylethyl)phenol, 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-t-octylphenol], 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol, 2-(2H-benzotriazol-2-yl)-p-cresol, 2-[(2H)-benzotriazol-2-yl]-4,6-bis-(1-methyl-1-phenylethyl)phenol, 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-t-octylphenol], and the like are preferred.

[0024] In this embodiment, an ultraviolet absorber represented by the following formula (UV) is preferred. Formula (UV) [ka] (In formula (UV), R 1 is an alkyl group having 4 to 20 carbon atoms, and R 2 is a hydrogen atom or an organic group.

[0025] R 1 R may be a linear, branched, or cyclic alkyl group, but is preferably a branched alkyl group. 1 The number of carbon atoms constituting R is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more, and is preferably 15 or less, and more preferably 10 or less. 1is preferably a t-octyl group. R 2 is a hydrogen atom or an organic group, more preferably a hydrogen atom or an organic group containing a benzotriazole ring, and even more preferably an organic group containing a benzotriazole ring. The organic group containing a benzotriazole ring is more preferably an organic group containing an octylphenylbenzotriazole ring, and even more preferably a group containing a structure represented by the following formula (UV-1): Formula (UV-1) [ka] (In formula (UV-1), R 1 is an alkyl group having 4 to 20 carbon atoms. L is a single bond or a divalent linking group, and * indicates the bonding position to formula (UV). In formula (UV-1), R 1 is R in formula (UV) 1 The definition and preferred range of L are the same as above. L is preferably a single bond or an alkylene group having 1 to 10 carbon atoms, and more preferably a single bond or a methylene group.

[0026] In addition to the above, the ultraviolet absorber used in this embodiment can be one described in paragraph 0051 of JP 2021-041614 A and paragraph 0053 of JP 2020-158596 A, the contents of which are incorporated herein by reference.

[0027] The content of the UV absorber in the resin composition of this embodiment is 0.1 parts by mass or more, and preferably 0.2 parts by mass or more, per 100 parts by mass of the resin component. By ensuring that the content is above the lower limit, the light resistance of the resulting molded article tends to be further improved. Furthermore, the content of the UV absorber is 2.0 parts by mass or less, preferably 1.6 parts by mass or less, more preferably 1.3 parts by mass or less, even more preferably 1.0 part by mass or less, even more preferably 0.7 parts by mass or less, and even more preferably 0.5 parts by mass or less, per 100 parts by mass of the resin component. By ensuring that the content is below the upper limit, the light resistance of the resulting molded article tends to be further improved without reducing the initial hue, mechanical properties, and heat resistance. The resin composition of the present embodiment may contain only one type of ultraviolet absorber, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0028] <Hindered amine light stabilizer containing polyolefin structure> The resin composition of this embodiment contains 0.1 to 2.0 parts by mass of a hindered amine-based light stabilizer containing a polyolefin structure per 100 parts by mass of the resin component. It has been found that blending a hindered phenol-based light stabilizer into a resin composition containing a polycarbonate resin and a styrene-based resin improves light resistance, but may result in poor residence stability and moist heat resistance. This embodiment overcomes this issue by using a hindered amine-based light stabilizer containing a polyolefin structure. This is presumably because hindered amine-based light stabilizers containing a polyolefin structure have a relatively low solubility parameter (SP value), and therefore tend to be more compatible with styrene-based resins (e.g., ABS resins), which also have a relatively low SP value. Therefore, it is presumed that the hindered amine-based light stabilizer acts effectively on the styrene-based resin, effectively suppressing the generation of degradation products.

[0029] The hindered amine light stabilizer used in this embodiment may be any of the following NH type, N-Me type, and N-OR type. [ka] Here, R is an organic group. x is an alkyl group having 1 to 5 carbon atoms, preferably a methyl group, and m is an integer of 0 to 4, preferably 0 or 1. Also, * is the bonding position to another moiety.

[0030] The hindered amine light stabilizer used in this embodiment preferably has the following structure A: Structure A [ka] (In the above structure A, * indicates the bonding position with other moieties.)

[0031] The hindered amine light stabilizer containing a polyolefin structure used in this embodiment has a polyolefin structure. Examples of the polyolefin structure include polyethylene, polypropylene, and polyethylene / polypropylene, with polyethylene being preferred. The number of carbon atoms constituting the polyolefin structure is preferably 10 or more, more preferably 13 or more, and is preferably 50 or less, more preferably 30 or less. By adjusting the number of carbon atoms to within these ranges, the effects of the present invention tend to be more effectively exhibited.

[0032] The hindered amine light stabilizer containing a polyolefin structure used in this embodiment is preferably one represented by the formula (HALS). Formula (HALS) [ka] (In formula (HALS), X represents a single bond or a linking group, Y and Z each represent a group representing a main chain structure, W represents a polyolefin structure, and p is an integer of 1 or more.) X is preferably an organic group having a formula weight of 40-300, and more preferably an organic group having a formula weight of 40-200. Y is [ka] Preferably, Y is a group represented by 1 and Y 2 is preferably a hydrogen atom or an organic group, and more preferably a hydrogen atom. 1 and Y 2 and X are more preferably bonded to form a cyclic structure. In this embodiment, X and Y preferably have the following structures: * is the binding site to structure A. [ka]

[0033] Examples of W include polyethylene, polypropylene, and polyethylene / polypropylene, with polyethylene being preferred. The number of carbon atoms constituting the polyolefin structure is preferably 10 or more, more preferably 13 or more, and is preferably 50 or less, more preferably 30 or less. Z is -CHZ 1 -CHZ 2 - is preferably a group represented by Z 1 and Z 2 is a hydrogen atom, a single bond, or an organic group, and Z 1 and Z 2 At least one of Z is a single bond or an organic group. 1 is more preferably a hydrogen atom, and Z 2 is preferably a single bond, that is, the carbon atom and W are directly bonded. p is an integer of 1 to 20, preferably an integer of 5 to 10, and more preferably an integer of 6 to 9.

[0034] The molecular weight of the hindered amine light stabilizer containing a polyolefin structure used in this embodiment is preferably 1,000 or more, more preferably 3,000 or more. By setting the molecular weight at or above the lower limit, the heat resistance (during extrusion, molding, and light resistance tests) of the hindered amine light stabilizer containing a polyolefin structure itself and the effect of suppressing gas generation during molding tend to be further improved. Furthermore, the upper limit of the molecular weight is preferably 10,000 or less, more preferably 5,000 or less. By setting the molecular weight at or below the upper limit, compatibility with the resin component tends to be further improved.

[0035] The hindered amine light stabilizer containing a polyolefin structure used in this embodiment is preferably neutral (for example, a pKa of 6.0 to 8.0, preferably a pKa of 6.5 to 7.5). By using a hindered amine light stabilizer containing a neutral polyolefin structure, interaction with acidic substances can be reduced, and the transparency of the resulting molded article can be maintained at a high level.

[0036] The content of the hindered amine light stabilizer having a polyolefin structure in the resin composition of this embodiment is 0.1 parts by mass or more, preferably 0.2 parts by mass or more, more preferably 0.4 parts by mass or more, and may be 0.7 parts by mass or more, relative to 100 parts by mass of the resin component. By setting the content at or above the lower limit, the light resistance of the resulting molded article tends to be further improved. The content of the hindered amine light stabilizer having a polyolefin structure is 2.0 parts by mass or less, preferably 1.7 parts by mass or less, more preferably 1.3 parts by mass or less, even more preferably 1.0 part by mass or less, even more preferably 0.8 parts by mass or less, and even more preferably 0.7 parts by mass or less, relative to 100 parts by mass of the resin component. By setting the content at or below the upper limit, light resistance can be further improved, and a balance between the trade-off performance of moist heat resistance and residence heat stability tends to be maintained at a higher level. The resin composition of the present embodiment may contain only one type of hindered amine light stabilizer having a polyolefin structure, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0037] In the resin composition of this embodiment, the mass ratio of the ultraviolet absorber to the hindered amine light stabilizer having a polyolefin structure, i.e., ultraviolet absorber / hindered amine light stabilizer having a polyolefin structure, is preferably 3.5 or less, more preferably 2.5 or less, more preferably 1.5 or less, even more preferably less than 1.0, even more preferably 0.8 or less, and even more preferably 0.6 or less. By setting the mass ratio below the upper limit, initial hue, mechanical properties, and heat resistance tend to be maintained at a higher level. The ultraviolet absorber / hindered amine light stabilizer having a polyolefin structure is preferably 0.1 or more, more preferably 0.3 or more, and even more preferably 0.4 or more. By setting the mass ratio above the lower limit, light resistance tends to be further improved while maintaining high trade-off performance.

[0038] The resin composition of this embodiment may or may not contain a hindered amine light stabilizer that does not contain a polyolefin structure. The content of the hindered amine light stabilizer that does not contain a polyolefin structure in the resin composition of this embodiment is preferably 0 to 10 mass %, more preferably 0 to 5 mass %, even more preferably 0 to 3 mass %, and even more preferably 0 to 1 mass %, of the content of the hindered amine light stabilizer that does contain a polyolefin structure.

[0039] <Other ingredients> The resin composition of the present embodiment may contain other components as needed, as long as the desired physical properties are not significantly impaired. Examples of the other components include various resin additives. Examples of resin additives include stabilizers (thermal stabilizers, antioxidants, etc.), release agents, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant assistants, antifogging agents, antiblocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc. One type of resin additive may be contained, or two or more types may be contained in any combination and ratio. For information on antistatic agents, please refer to the descriptions in paragraphs 0063 to 0067 of JP 2016-216534 A, the contents of which are incorporated herein by reference. For flame retardants, refer to paragraphs 0068 to 0075 of JP 2016-216534 A, the contents of which are incorporated herein by reference.

[0040] The stabilizer includes a heat stabilizer and an antioxidant. Examples of stabilizers include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, phosphorus-based heat stabilizers and / or phenol-based antioxidants are preferred in this embodiment.

[0041] <<Phosphorus-based heat stabilizer>> The resin composition of the present embodiment preferably contains a phosphorus-based heat stabilizer. Any known phosphorus-based heat stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds being particularly preferred.

[0042] Examples of organic phosphite compounds include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl / dinonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite. Specific examples of such organic phosphite compounds include "ADK STAB (registered trademark; the same applies hereinafter) 1178," "ADK STAB 2112," and "ADK STAB HP-10" manufactured by ADEKA CORPORATION, "JP-351," "JP-360," and "JP-3CP" manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies hereinafter) 168" manufactured by BASF.

[0043] The content of the phosphorus-based heat stabilizer in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, per 100 parts by mass of the resin component. By setting the content of the phosphorus-based heat stabilizer within this range, the effect of adding the heat stabilizer can be more effectively exhibited. The resin composition of the present embodiment may contain only one type of phosphorus-based heat stabilizer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0044] <<Phenol-based antioxidants>> The resin composition of the present embodiment preferably contains a phenol-based antioxidant, and a hindered phenol-based antioxidant is preferably used. Specific examples of hindered phenol antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(octyl methylthiomethyl)-o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like.

[0045] Among these, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol antioxidants include "Irganox (registered trademark; the same applies hereinafter) 1010" and "Irganox 1076" manufactured by BASF, and "ADK STAB AO-50" and "ADK STAB AO-60" manufactured by ADEKA.

[0046] The content of the phenolic antioxidant (preferably a hindered phenolic antioxidant) in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, per 100 parts by mass of the resin component. By setting the content of the phenolic antioxidant within this range, the effect of adding the phenolic antioxidant can be more effectively exerted. The resin composition of the present embodiment may contain only one type of antioxidant, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0047] In addition, in the resin composition of this embodiment, the mass ratio of the phosphorus-based heat stabilizer to the phenol-based antioxidant, i.e., phosphorus-based heat stabilizer / phenol-based antioxidant, is preferably 0.1 to 1.0, and more preferably 0.3 to 0.8. By adjusting the mass ratio to within this range, light degradation of the resulting molded article can be more effectively suppressed. In particular, the phenol-based antioxidant can neutralize peroxides derived from the phosphorus-based heat stabilizer.

[0048] In this embodiment, the mass ratio of the ultraviolet absorber to the phenolic antioxidant, ultraviolet absorber / phenolic antioxidant, is preferably 3 to 25, and more preferably 3 to 10. By adjusting the mass ratio to within this range, light degradation of the resulting molded article can be more effectively suppressed. The phenolic antioxidant assists the function of the hindered amine light stabilizer containing a polyolefin structure, and adjusting this mass ratio as described above allows this function to be exerted more effectively.

[0049] <<Release Agent>> The resin composition of the present embodiment may contain a release agent. Examples of the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred, and salts of aliphatic carboxylic acids are more preferred. For details about the release agent, please refer to paragraphs 0055 to 0061 of JP 2018-095706 A, the contents of which are incorporated herein by reference. When the resin composition of the present embodiment contains a release agent, the content thereof in the resin composition is preferably 0.05 to 3 mass %, more preferably 0.1 to 0.8 mass %, and even more preferably 0.2 to 0.6 mass %. The resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0050] <<Coloring agent>> The resin composition of this embodiment may contain a coloring agent (dye and / or pigment). Examples of coloring agents that may be used in this embodiment include inorganic pigments such as titanium oxide and carbon black, organic dyes, and organic pigments.

[0051] Examples of inorganic pigments include sulfide pigments such as carbon black, cadmium red, and cadmium yellow; silicate pigments such as ultramarine; oxide pigments such as zinc white, red iron oxide, chromium oxide, iron black, titanium yellow, zinc-iron brown, titanium-cobalt green, cobalt green, cobalt blue, copper-chromium black, and copper-iron black; chromate pigments such as yellow lead and molybdate orange; and ferrocyanide pigments such as iron blue. Examples of organic pigments and organic dyes include phthalocyanine dyes or pigments such as copper phthalocyanine blue and copper phthalocyanine green; azo dyes or pigments such as nickel azo yellow; condensed polycyclic dyes or pigments such as thioindigo, perinone, perylene, quinacridone, dioxazine, isoindolinone, and quinophthalone; and anthraquinone, heterocyclic, and methyl dyes or pigments.

[0052] The content of the coloring agent in the resin composition used in this embodiment is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, per 100 parts by mass of the polycarbonate resin, and is preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, and even more preferably 2.0 parts by mass or less, per 100 parts by mass of the polycarbonate resin. The resin composition may contain only one coloring agent, or may contain two or more coloring agents. When two or more coloring agents are contained, the total amount is preferably in the above range.

[0053] <Physical properties of resin composition> The melt volume rate (MVR) of the resin composition of this embodiment at 250°C and a load of 2.16 kg is 9.4 cm 3 / 10 minutes or more is preferable, and 20.0 cm 3 / 10 minutes or less is preferable, 17.0 cm 3 More preferably, the MVR is 10 minutes or less. The MVR is measured as described in the Examples below.

[0054] The resin composition of this embodiment preferably has excellent retention stability. Specifically, the melt volume rate (MVR) of the resin composition of this embodiment, after 20 minutes of residence at 250°C and a load of 2.16 kg, preferably increases by less than 2.0%, preferably 1.9% or less, more preferably 1.5% or less, and even more preferably less than 1.4%, compared to when the resin composition is not residence. Ideally, the lower limit of this value is 0%, but practically, 0.1% or more is sufficient. Such residence stability can be achieved, for example, by using a styrene-based resin or bulk polymer with a butadiene unit ratio of more than 0% by mass and not more than 20% by mass as the styrene-based resin. Molecular decomposition of the resin component increases the MVR, but in this embodiment, molecular decomposition can be suppressed, thereby improving residence stability.

[0055] The resin composition of this embodiment desirably has excellent light resistance. For example, the resin composition of this embodiment is molded into a grained plate (60 mm × 60 mm × 2 mm thick), and the cumulative irradiation dose is 150 MJ / m 2 When light irradiation is performed so that the color difference ΔE before and after irradiation is preferably less than 4.0, more preferably less than 3.0, and even more preferably less than 2.0. Furthermore, the resin composition of this embodiment was molded into a grained plate (60 mm × 60 mm × 2 mm thick), and the cumulative irradiation dose was 90 MJ / m 2 When light irradiation is performed so that the color difference ΔE before and after irradiation is preferably less than 1.1, and more preferably less than 0.9. Such high light resistance can be achieved, for example, by compounding a hindered amine-based light stabilizer containing a polyolefin structure.

[0056] The resin composition of this embodiment preferably has excellent moist heat resistance. In particular, in this embodiment, hydrolysis of the resin components, particularly the polycarbonate resin, is effectively suppressed, and high impact resistance can be maintained even after a moist heat resistance test. In particular, when the resin composition of this embodiment is molded into an ISO dumbbell test piece (4 mm thick) and left to stand for 125 hours in a humid and hot environment at 80°C and a relative humidity of 95%, the retention of the notched Charpy impact strength according to ISO 179 ((Charpy impact strength after exposure to humid and hot environment / initial Charpy impact strength) × 100) is preferably 70% or more, more preferably 74% or more, and even more preferably 80% or more. The upper limit of the retention is ideally 100%, but practically 99% or less. Furthermore, when the resin composition of this embodiment is molded into an ISO dumbbell test piece (4 mm thick) and left to stand for 250 hours in a humid and hot environment at 80°C and a relative humidity of 95%, the retention of the notched Charpy impact strength according to ISO 179 ((Charpy impact strength after exposure to the humid and hot environment / initial Charpy impact strength) × 100) is preferably 25% or more, more preferably 30% or more, and even more preferably 50% or more. The upper limit of the retention is ideally 100%, but practically 99% or less.

[0057] <Method of manufacturing resin composition> The method for producing the resin composition of this embodiment is not limited, and a wide variety of known methods for producing resin compositions can be used, including a method in which the polycarbonate resin, styrene resin, UV absorber, hindered amine light stabilizer containing a polyolefin structure, and other components added as needed are premixed using a mixer such as a tumbler or Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, roll, Brabender, single-screw kneading extruder, twin-screw kneading extruder, or kneader. The melt-kneading temperature is not particularly limited, but is usually in the range of 240 to 320°C.

[0058] <Molded products> The molded article of this embodiment is formed from the resin composition of this embodiment. The above-mentioned resin composition (e.g., pellets) is molded into a molded article by various molding methods. That is, the molded article of this embodiment is molded from the resin composition of this embodiment. The shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article. Examples of the shape include film-like, rod-like, cylindrical, ring-like, circular, elliptical, polygonal, irregular-shaped, hollow, frame-like, box-like, panel-like, and button-like shapes.

[0059] The method for forming the molded article is not particularly limited, and conventionally known molding methods can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, blow molding, gas-assisted blow molding, blow molding, extrusion blow molding, IMC (in-mold coating) molding, rotational molding, multilayer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding. The resin composition of this embodiment is particularly suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding. However, it goes without saying that the resin composition of this embodiment is not limited to molded articles obtained by these methods.

[0060] The molded article of this embodiment is a molded article containing a polycarbonate resin and an ABS resin, and can be widely used in applications where high light resistance, moisture resistance, and retention stability are required. Specifically, it is preferably used in electrical and electronic equipment / components, office automation equipment / components, information terminal equipment / components, machine parts, home appliances, vehicle parts (automobile interior and exterior), building materials, various containers, leisure goods and miscellaneous goods, lighting equipment, etc. [Example]

[0061] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0062] 1. Raw materials [Table 1]

[0063] The MVR of polycarbonate resin was measured by placing the sample pellets to be measured in the cylinder of a melt indexer and heating them for 4 minutes at 250°C under a load of 2.16 kg in accordance with the ISO-1133 standard.

[0064] [Table 2]

[0065] D1: Univul 5050H The structure is shown below. In the following, p 1 is 6 to 9. [ka] D2: Tinuvin PA144 The structure is shown below. [ka] D3: Tinuvin 765 The structure is shown below. [ka] D4: Univul 4050FF The structure is shown below. [ka] D5: Tinuvin XT-855 An ultraviolet absorber having the following structure, where R is an organic group. [ka]

[0066] 2. Examples 1 to 10, Comparative Examples 1 to 9 <Compound> The components described in Tables 1 and 2 were mixed in the amounts (all in parts by mass) described in Tables 3 to 6 below for 20 minutes using a tumbler mixer, and then supplied to a twin-screw extruder TEX30α manufactured by Nippon Steel & Sumitomo Metal Corporation equipped with 1 vent. Kneading was carried out under the conditions of a screw rotation speed of 250 rpm, a discharge rate of 40 kg / hour, and a barrel temperature of 260°C. The molten resin composition extruded in a strand shape was rapidly cooled in a water tank and pelletized using a pelletizer to obtain pellets of the resin composition.

[0067] <MVR(1) and Retained MVR(2)> The pellets of the sample to be measured were placed in the cylinder of a melt indexer, and in accordance with the ISO-1133 standard, the MVR value (MVR(1)) after heating for 4 minutes and the MVR value of the same sample after heating for 20 minutes (retained MVR(2)) were measured under the conditions of 250°C and a load of 2.16 kg. Also, the increase value of the retained MVR(2) with respect to the above MVR(1) (retained MVR(2) - MVR(1)) was calculated. Furthermore, the increase rate (%) from the above MVR(1) was calculated according to the following formula. Increase rate (%) = [(retained MVR(2) - MVR(1)) / MVR(1)] × 100

[0068] <Presence or absence of white smoke> In the measurement of the above MVR, evaluation was carried out by comparing the presence or absence of the generation of white smoke gas (VOC) before and after the 20-minute retention heating. Five experts made the judgment, and it was decided by a majority vote. A: Presence of white smoke generation B: Absence of white smoke generation

[0069] <Tensile strength and tensile strain> After drying the pellets obtained above at 120°C for 5 hours, using an injection molding machine NEX140III manufactured by Nissei Plastic Industrial Co., Ltd., injection molding was carried out at a cylinder temperature of 260°C, using an ISO standard multi-purpose test piece (ISO 3167 typeA) mold, and a mold temperature of 80°C to mold an ISO standard multi-purpose test piece (ISO 3167 typeA). Using the obtained ISO test specimens (4 mm thick), the tensile strength (unit: MPa) and tensile strain (unit: %) were measured in accordance with ISO Standards 527-1 and ISO 527-2.

[0070] <Charpy impact strength> The pellets obtained above were dried at 120°C for 5 hours and then injection molded into ISO standard multipurpose test specimens (ISO 3167 type A) using an injection molding machine NEX140III manufactured by Nissei Plastic Industrial Co., Ltd. at a cylinder temperature of 260°C and a mold temperature of 80°C using an ISO standard multipurpose test specimen (ISO 3167 type A). The ISO standard multipurpose test piece (ISO 3167 type A) obtained by the above method was notched using a notching machine (Toyo Seiki's "Notching Tool A-4 type") with a single-tooth V-cutter (45°, R = 0.25 mm), a notch rotation speed of 300 rpm, and three notch cuts. At the same time, an 80 mm piece was cut out from the center using a slicer. The Charpy impact strength of the obtained notched Charpy test specimen was measured in accordance with ISO 179 (unit: kJ / m 2 ). The measurement was carried out at a measurement temperature of 23°C using a Charpy impact tester DG-CB manufactured by Toyo Seiki.

[0071] <Jet blackness (L*)> The pellets obtained above were dried at 120°C for 5 hours and then injection molded using an injection molding machine EC50SXII manufactured by Shibaura Machine Co., Ltd. at a cylinder temperature of 260°C and a stepped mold with thicknesses of 1 mm, 2 mm, and 3 mm at a mold temperature of 80°C to form a three-stage plate (60 mm x 100 mm) with thicknesses of 1 mm, 2 mm, and 3 mm. Using a spectrophotometer SE6000 manufactured by Nippon Denshoku Industries Co., Ltd., measurements were taken at the center of a 2 mm thick plate obtained above using the reflection method, C light source, and a 2° field of view.

[0072] <Light resistance> The three-stage plate with thicknesses of 1 mm / 2 mm / 3 mm obtained by the above method was subjected to a lightfastness treatment under the following conditions using a xenon weatherometer, and the hue before and after the lightfastness treatment was measured and the color difference ΔE was compared. Light resistance test conditions Equipment used: Atlas Ci4000 Filter / Inner: Type S Filter / Outer: Soda lime Black panel temperature: 89℃ Irradiance: 65-70W / m 2 (300-400nm) Cumulative irradiation dose: 150MJ / m 2 No rain Humidity: 50% Hue was measured using a spectrophotometer SE6000 manufactured by Nippon Denshoku Industries Co., Ltd., set to the reflection method, C light source, and 2° field of view, at the center of a 2 mm thickness of the plate obtained by the method described above, and evaluated according to the following criteria.

[0073] The color difference (ΔE) was evaluated according to the following criteria. <<150MJ / m 2 >> A: Less than 2.0 B: 2.0 or more and less than 3.0 C: 3.0 or more and less than 4.0 D:4.0 or higher <<90MJ / m 2 >> A: Less than 0.9 B: 0.9 or more and less than 1.1 C:1.1 or higher

[0074] <Moisture and heat resistance> The notched Charpy test specimens were subjected to 125 and 250 hours of moist heat treatment at a temperature of 80°C and a relative humidity of 95%, and the Charpy impact strength was measured (unit: kJ / m 2 Charpy impact strength was measured in accordance with ISO 179. The measurement was carried out at a measurement temperature of 23°C using a Charpy impact tester DG-CB manufactured by Toyo Seiki. The wet heat resistance was evaluated by comparing the Charpy impact values ​​before and after the wet heat treatment. Specifically, the retention rate of the initial Charpy impact strength was calculated according to the following formula. Retention rate (%) = (Charpy impact strength after exposure to a humid and hot environment / initial Charpy impact strength) x 100

[0075] [Table 3]

[0076] [Table 4]

[0077] [Table 5]

[0078] [Table 6]

[0079] In the above Tables 3 to 6, NA means "not rated," because the light resistance was extremely poor. As is clear from the above results, the resin composition of the present embodiment maintained high retention stability and moist heat resistance, and also had excellent light resistance. Furthermore, it also had high mechanical strength.

Claims

1. For 100 parts by mass of a resin component consisting of 55 to 90% by mass of a polycarbonate resin and 45 to 10% by mass of a styrene-based resin having a butadiene unit ratio of 15% by mass or more and 20% by mass or less, 0.1 to 2.0 parts by mass of an ultraviolet absorber; 0.1 to 2.0 parts by mass of a hindered amine light stabilizer containing a polyolefin structure, A resin composition in which the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is less than 1.

0.

2. The resin composition according to claim 1 , wherein the styrene-based resin contains acrylonitrile units, butadiene units, and styrene units.

3. The resin composition according to claim 1 or 2, wherein the ultraviolet absorber is a benzotriazole-based ultraviolet absorber.

4. The resin composition according to any one of claims 1 to 3, wherein the light stabilizer has the following structure A: Structure A 【Chemical 1】 (In the above structure A, * indicates the bonding position with other moieties.)

5. For 100 parts by mass of a resin component consisting of 55 to 90% by mass of a polycarbonate resin and 45 to 10% by mass of a bulk polymer containing acrylonitrile units, butadiene units, and styrene units, the proportion of butadiene units being 15% by mass or more and 20% by mass or less, 0.1 to 2.0 parts by mass of an ultraviolet absorber; 0.1 to 2.0 parts by mass of a hindered amine light stabilizer containing a polyolefin structure, A resin composition in which the mass ratio of the ultraviolet absorber to the light stabilizer, ultraviolet absorber / light stabilizer, is less than 1.

0.

6. A molded article formed from the resin composition according to any one of claims 1 to 5.

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