Substrate processing method and substrate processing apparatus

JP7748979B2Active Publication Date: 2025-10-03SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
JP2023018163
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-08-12
Filing Date
2023-02-09
Publication Date
2025-10-03
Estimated Expiration
2043-02-09
Patent Text Reader

Abstract

To provide a method of processing a substrate.SOLUTION: A substrate processing method includes measuring the temperature of multiple heaters installed on a heating plate that heats a substrate, and sets the target temperature of a first heater among the heaters at a first time point lower than the target temperature of the first heater at a second time point later than the first time point when heating the substrate by adjusting the heater output on the basis of the difference between the measured temperature of each of the heaters and the pre-modeled target temperature of the heater.SELECTED DRAWING: Figure 7
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