Substrate processing method and substrate processing apparatus
JP7748979B2Active Publication Date: 2025-10-03SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information
- Application Number
- JP2023018163
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-08-12
- Filing Date
- 2023-02-09
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2043-02-09
Abstract
To provide a method of processing a substrate.SOLUTION: A substrate processing method includes measuring the temperature of multiple heaters installed on a heating plate that heats a substrate, and sets the target temperature of a first heater among the heaters at a first time point lower than the target temperature of the first heater at a second time point later than the first time point when heating the substrate by adjusting the heater output on the basis of the difference between the measured temperature of each of the heaters and the pre-modeled target temperature of the heater.SELECTED DRAWING: Figure 7
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