Films and laminates

A film with a matrix and high-modulus particles, incorporating a region with a high loss tangent compound, addresses brittleness in high-frequency communication devices by enhancing stress distribution and reducing peeling.

JP7750692B2Active Publication Date: 2025-10-07FUJIFILM CORP
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
JP2021140221
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-08-30
Publication Date
2025-10-07
Estimated Expiration
2041-08-30

AI Technical Summary

Technical Problem

Conventional films and laminates face issues with brittleness, particularly in high-frequency communication devices where insulating materials need lower relative permittivity and dielectric loss tangent.

Method used

A film comprising a matrix material and particles with a higher elastic modulus, featuring a region A with a compound having a loss tangent of 0.1 or more, which enhances stress distribution and reduces brittleness.

Benefits of technology

The film exhibits improved brittleness and stress resistance, suitable for high-frequency applications by suppressing peeling and stress concentration at the interface between the matrix and particles.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007750692000001
    Figure 0007750692000001
Patent Text Reader

Abstract

To provide a film with improved brittleness and a laminate including the film.SOLUTION: A film comprises a matrix material, and particles having a higher elastic modulus at 25°C than that of the matrix material. There is a region A at least partially existing between the matrix material and the particles. The region A comprises a compound having a loss tangent at 25°C of 0.1 or more. There is also provided a laminate including the polymer film.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Resin composition, laminated product, wiring board and method for producing wiring board

    JP2007269965A

  • Polylactic acid-based biaxially stretched film

    JP2014094520A

  • Surface-treated and plate-like powder for cosmetic compositions and solid powdery cosmetic composition blended therewith

    JP2016128497A

  • Thermoplastic resin composition and molding

    JP2020105415A

  • Powder dispersion liquid, manufacturing method of laminate, laminate and manufacturing method of printed circuit board

    JP2020180245A